74HC4852
Dual 4-channel analog multiplexer/demultiplexer with
injection-current effect control
Rev. 02 — 30 May 2007
Product data sheet
1. General description
The 74HC4852 is a high-speed Si-gate CMOS device and is specified in compliance with
JEDEC standard no. 7A.
The 74HC4852 is a dual 4-channel analog multiplexer or demultiplexer with common
select inputs (S0 and S1). Both multiplexers have a common active LOW enable input (E),
four independent inputs/outputs (pins nY0 to nY3) and a common input/output (pin nZ).
The device features injection-current effect control, which has excellent value in
automotive applications where voltages in excess of the supply voltage are common.
With E LOW, two of the eight switches are selected (low impedance ON-state) by S0 and
S1. With E HIGH, all switches are in the high-impedance OFF-state, independent of S0
and S1.
The injection-current effect control allows signals at disabled analog input channels to
exceed the supply voltage without affecting the signal of the enabled analog channel. This
eliminates the need for external diode/resistor networks typically used to keep the analog
channel signals within the supply-voltage range.
2. Features
n Injection-current cross coupling < 1 mV/mA
n Wide supply voltage range from 2.0 V to 6.0 V
n ESD protection:
u HBM JESD22-A114E Class 2 exceeds 2000 V
u MM JESD22-A115-A exceeds 200 V
u CDM JESD22-C101C exceeds 1000 V
n Latch-up performance exceeds 100 mA per JESD 78 Class II
n Low ON-state resistance:
u 400 Ω (typical) at VCC = 2.0 V
u 215 Ω (typical) at VCC = 3.0 V
u 120 Ω (typical) at VCC = 3.3 V
u 76 Ω (typical) at VCC = 4.5 V
u 59 Ω (typical) at VCC = 6.0 V
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
3. Applications
n
n
n
n
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
Automotive application
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC4852D
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
74HC4852PW
−40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
74HC4852BQ
−40 °C to +125 °C
DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
SOT763-1
5. Functional diagram
10
9
13
1Z
10
S0
6
1Y0
12
1Y1
14
1Y2
15
0
4×
1
G4
MUX/DMUX
0
3
9
6
S1
E
2Z
1Y3
11
2Y0
1
2Y1
5
2Y2
2
2Y3
4
0
3
1
2
3
0
13
1
2
3
3
Fig 1. Logic symbol
001aag093
5
2
4
12
14
15
11
001aag094
Fig 2. IEC logic symbol
74HC4852_2
Product data sheet
1
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
2 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
VCC
16
S0
10
1-OF-4
DECODER
S1
E
9
6
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
12
INJECTION
CURRENT
CONTROL
14
INJECTION
CURRENT
CONTROL
15
INJECTION
CURRENT
CONTROL
11
INJECTION
CURRENT
CONTROL
1
INJECTION
CURRENT
CONTROL
5
INJECTION
CURRENT
CONTROL
2
INJECTION
CURRENT
CONTROL
4
INJECTION
CURRENT
CONTROL
3
1Z
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
2Z
GND
8
001aag095
Fig 3. Functional diagram
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
3 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
6. Pinning information
6.1 Pinning
1
terminal 1
index area
74HC4852
16 VCC
2Y0
74HC4852
2Y2
2
15 1Y2
3
14 1Y1
2Y0
1
16 VCC
2Z
2Y2
2
15 1Y2
2Y3
4
13 1Z
2Z
3
14 1Y1
2Y1
5
12 1Y0
2Y3
4
13 1Z
E
6
2Y1
5
12 1Y0
n.c.
7
E
6
11 1Y3
n.c.
7
10 S0
GND
8
8
9
S1
S1
11 1Y3
10 S0
GND
9
GND(1)
001aag097
Transparent top view
001aag096
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 4. Pin configuration SO16 and TSSOP16
Fig 5. Pin configuration DHVQFN16
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
2Y0
1
independent input/output
2Y2
2
independent input/output
2Z
3
common input/output
2Y3
4
independent input/output
2Y1
5
independent input/output
E
6
enable input (active LOW)
n.c.
7
not connected
GND
8
ground (0 V)
S1
9
select input
S0
10
select input
1Y3
11
independent input/output
1Y0
12
independent input/output
1Z
13
common input/output
1Y1
14
independent input/output
1Y2
15
independent input/output
VCC
16
positive supply voltage
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
4 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
7. Functional description
Table 3.
Function table[1]
Input
Channel ON
E
S1
S0
L
L
L
nY0 to nZ
L
L
H
nY1 to nZ
L
H
L
nY2 to nZ
L
H
H
nY3 to nZ
H
X
X
-
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Min
Max
Unit
VCC
supply voltage
Conditions
−0.5
+7.0
V
VI
input voltage
−0.5
VCC + 0.5
V
VSW
switch voltage
enable and disable mode
−0.5
VCC + 0.5
V
IIK
input clamping current
VI < 0 V or VI > VCC
-
±20
mA
ISK
switch clamping current
VI < 0 V or VI > VCC
-
±20
mA
ISW
switch current
VSW = 0 V to VCC
-
±25
mA
ICC
supply current
-
50
mA
IGND
ground current
−50
-
mA
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
-
500
mW
[1]
Tamb = −40 °C to +125 °C
[1]
For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.
For TSSOP16 package: Ptot derates linearly with 5.5 mW/K above 60 °C.
For DHVQFN16 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
5 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VCC
Conditions
Min
Typ
Max
Unit
supply voltage
2.0
-
6.0
V
VI
input voltage
0
-
VCC
V
VSW
switch voltage
0
-
VCC
V
Tamb
ambient temperature
−40
-
+125
°C
∆t/∆V
input transition rise and fall rate
VCC = 2.0 V
-
6.0
1000
ns/V
VCC = 3.0 V
-
6.0
800
ns/V
VCC = 3.3 V
-
6.0
800
ns/V
VCC = 4.5 V
-
6.0
500
ns/V
VCC = 6.0 V
-
6.0
400
ns/V
Min
Typ
Max
Unit
VCC = 2.0 V; ISW = 2 mA
-
400
650
Ω
VCC = 3.0 V; ISW ≤ 2 mA
-
215
330
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
120
270
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
76
210
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
59
195
Ω
10. Static characteristics
Table 6.
RON resistance
For test circuit see Figure 8.
Symbol
Parameter
Conditions
Tamb = 25 °C
RON(peak)
∆RON
ON resistance (peak)
ON resistance mismatch between
channels
VI = VCC to GND; E = VIL
VI = 0.5 × VCC; E = VIL
VCC = 2.0 V; ISW = 2 mA
-
4
10
Ω
VCC = 3.0 V; ISW ≤ 2 mA
-
2
8
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
2
8
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
2
8
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
3
9
Ω
VCC = 2.0 V; ISW = 2 mA
-
-
670
Ω
Tamb = −40 °C to +85 °C
RON(peak)
ON resistance (peak)
VI = VCC to GND; E = VIL
VCC = 3.0 V; ISW ≤ 2 mA
-
-
360
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
-
305
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
-
240
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
-
220
Ω
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
6 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
Table 6.
RON resistance …continued
For test circuit see Figure 8.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
∆RON
ON resistance mismatch between
channels
VI = 0.5 × VCC; E = VIL
VCC = 2.0 V; ISW = 2 mA
-
-
15
Ω
VCC = 3.0 V; ISW ≤ 2 mA
-
-
12
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
-
12
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
-
12
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
-
13
Ω
VCC = 2.0 V; ISW = 2 mA
-
-
700
Ω
VCC = 3.0 V; ISW ≤ 2 mA
-
-
380
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
-
345
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
-
270
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
-
250
Ω
Tamb = −40 °C to +125 °C
RON(peak)
∆RON
ON resistance (peak)
VI = VCC to GND; E = VIL
VI = 0.5 × VCC; E = VIL
ON resistance mismatch between
channels
VCC = 2.0 V; ISW = 2 mA
-
-
20
Ω
VCC = 3.0 V; ISW ≤ 2 mA
-
-
16
Ω
VCC = 3.3 V; ISW ≤ 2 mA
-
-
16
Ω
VCC = 4.5 V; ISW ≤ 2 mA
-
-
16
Ω
VCC = 6.0 V; ISW ≤ 2 mA
-
-
18
Ω
Min
Typ[1] Max
Unit
VCC = 3.3 V
-
0.05
1
mV
VCC = 5.0 V
-
0.03
1
mV
VCC = 3.3 V
-
0.55
5
mV
VCC = 5.0 V
-
0.27
5
mV
VCC = 3.3 V
-
0.04
2
mV
VCC = 5.0 V
-
0.03
2
mV
VCC = 3.3 V
-
0.56
20
mV
VCC = 5.0 V
-
0.48
20
mV
Table 7.
Injection current coupling
For test circuit see Figure 9.
Symbol
Parameter
Conditions
Tamb = −40 °C to +125 °C
∆VO
output voltage
variation
|ISW| ≤ 1 mA; RS ≤ 3.9 kΩ
[2][3]
|ISW| ≤ 10 mA; RS ≤ 3.9 kΩ
|ISW| ≤ 1 mA; RS ≤ 20 kΩ
|ISW| ≤ 10 mA; RS ≤ 20 kΩ
[1]
Typical values are measured at Tamb = 25 °C.
[2]
∆VO here is the maximum variation of output voltage of an enabled analog channel when current is injected into any disabled channel.
[3]
ISW = total current injected into all disabled channels.
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
7 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
Table 8.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V
1.5
-
-
V
VCC = 3.0 V
2.1
-
-
V
VCC = 3.3 V
2.3
-
-
V
VCC = 4.5 V
3.15
-
-
V
VCC = 6.0 V
4.2
-
-
V
Tamb = 25 °C
VIH
VIL
II
HIGH-level input voltage
LOW-level input voltage
input leakage current
control inputs
control inputs
VCC = 2.0 V
-
-
0.5
V
VCC = 3.0 V
-
-
0.9
V
VCC = 3.3 V
-
-
1.0
V
VCC = 4.5 V
-
-
1.35
V
VCC = 6.0 V
-
-
1.8
V
-
-
±0.1
µA
nYn; per channel
-
-
±0.1
µA
nZ; all channels
-
-
±0.2
µA
-
-
±0.1
µA
control inputs; VI = GND or VCC
VCC = 6.0 V
IS(OFF)
OFF-state leakage current
E = VIH; VI = GND or VCC;
VO = VCC or GND; VCC = 6.0 V;
see Figure 6
IS(ON)
ON-state leakage current
E = VIL; VI = GND or VCC;
VO = VCC or GND; VCC = 6.0 V;
see Figure 7
ICC
supply current
VI = GND or VCC
-
-
2.0
µA
CI
input capacitance
S0, S1 and E
-
2
10
pF
Csw
switch capacitance
nZ; OFF-state
-
9
40
pF
nYn; OFF-state
-
3
15
pF
VCC = 2.0 V
1.5
-
-
V
VCC = 3.0 V
2.1
-
-
V
VCC = 3.3 V
2.3
-
-
V
VCC = 4.5 V
3.15
-
-
V
VCC = 6.0 V
4.2
-
-
V
VCC = 6.0 V
Tamb = −40 °C to +85 °C
VIH
VIL
HIGH-level input voltage
LOW-level input voltage
control inputs
control inputs
VCC = 2.0 V
-
-
0.5
V
VCC = 3.0 V
-
-
0.9
V
VCC = 3.3 V
-
-
1.0
V
VCC = 4.5 V
-
-
1.35
V
VCC = 6.0 V
-
-
1.8
V
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
8 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
Table 8.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
II
control inputs; VI = GND or VCC
input leakage current
VCC = 6.0 V
IS(OFF)
OFF-state leakage current
Min
Typ
Max
Unit
-
-
±0.1
µA
-
-
±0.5
µA
E = VIH; VI = GND or VCC;
VO = VCC or GND; VCC = 6.0 V;
see Figure 6
nYn; per channel
nZ; all channels
IS(ON)
ON-state leakage current
E = VIL; VI = GND or VCC;
VO = VCC or GND; VCC = 6.0 V;
see Figure 7
ICC
supply current
VI = GND or VCC
VCC = 6.0 V
-
-
±2.0
µA
-
-
±2.0
µA
-
-
5
µA
CI
input capacitance
S0, S1 and E
-
-
10
pF
Csw
switch capacitance
nZ; OFF-state
-
-
40
pF
nYn; OFF-state
-
-
15
pF
VCC = 2.0 V
1.5
-
-
V
VCC = 3.0 V
2.1
-
-
V
VCC = 3.3 V
2.3
-
-
V
VCC = 4.5 V
3.15
-
-
V
VCC = 6.0 V
4.2
-
-
V
VCC = 2.0 V
-
-
0.5
V
VCC = 3.0 V
-
-
0.9
V
VCC = 3.3 V
-
-
1.0
V
VCC = 4.5 V
-
-
1.35
V
VCC = 6.0 V
-
-
1.8
V
-
-
±1.0
µA
-
-
±2.0
µA
Tamb = −40 °C to +125 °C
VIH
VIL
II
HIGH-level input voltage
LOW-level input voltage
input leakage current
control inputs
control inputs
control inputs; VI = GND or VCC
VCC = 6.0 V
IS(OFF)
OFF-state leakage current
E = VIH; VI = GND or VCC;
VO = VCC or GND; VCC = 6.0 V;
see Figure 6
nYn; per channel
nZ; all channels
IS(ON)
ON-state leakage current
E = VIL; VI = GND or VCC;
VO = VCC or GND; VCC = 6.0 V;
see Figure 7
ICC
supply current
VI = GND or VCC
VCC = 6.0 V
74HC4852_2
Product data sheet
-
-
±10.0
µA
-
-
±10.0
µA
-
-
20.0
µA
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
9 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
Table 8.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
CI
input capacitance
S0, S1 and E
-
-
10
pF
Csw
switch capacitance
nZ; OFF-state
-
-
40
pF
nYn; OFF-state
-
-
15
pF
VCC
IS
A
selected channel(1)
nYn
VI
nZ
n.c.
VCC
E
VIH
A
E
VIL
IS
IS
nYn
nZ
nYn
A
any disabled channel
GND
VI
VO
VO
GND
001aag098
001aag099
(1) Channel is selected by S0 and S1.
Fig 6. Test circuit for measuring OFF-state leakage
current
Fig 7. Test circuit for measuring ON-state leakage
current
VCC
nYn
VI(1)
any disabled channel
ISW
nZ
VSW
V
VCC
E
VIL
VIL
E
VI(2)
nYn
selected channel(1)
nYn
VI
nZ
RS
GND
ISW
GND
V
VI
001aag101
001aag100
RON = VSW / ISW.
VO
(1) Channel is selected by S0 and S1.
VI(1) < GND or VI(1) > VCC.
GND < VI(2) < VCC.
Fig 8. Test circuit for measuring ON resistance
Fig 9. Test circuit for injection current coupling
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
10 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
11. Dynamic characteristics
Table 9.
Dynamic characteristics
GND = 0 V; CL = 50 pF; RL = 10 kΩ unless specified otherwise; for test circuit see Figure 12.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
2.2
9.3
33
2.2
34
2.2
35
ns
7.7
16.8
38
6.3
40
6.3
42
ns
10.5
20.5
47.5
8.5
52.5
8.5
57.5
ns
39.5
75.4
100
39.3
105
39
115
ns
2.2
4.9
16.5
1.9
18
1.9
19.5
ns
4.9
8.8
20
3.9
21.5
3.9
23
ns
6.2
10.6
45
5.2
50
5.2
55
ns
35.2
69.5
90
35.5
100
35
110
ns
2.0
4.4
15.0
1.6
16.5
1.6
18.5
ns
4.4
7.9
17.5
3.4
19
3.4
22
ns
5.6
9.4
42.5
4.6
47.5
4.6
52.5
ns
34.6
68.1
85
34.6
95
34.5
105
ns
1.6
3.2
11.6
1.1
12.5
1.1
13.5
ns
3.2
5.8
14
2.3
15
2.3
17
ns
4.2
6.9
40
3
45
3
50
ns
28.5
63
80
28.2
90
28
100
ns
VCC = 2.0 V
tpd
propagation delay see Figure 10
[1]
nZ, nYn to nYn, nZ
Sn to nZ, nYn
ten
enable time
see Figure 11
[2]
E to nZ, nYn
tdis
disable time
see Figure 11
[3]
E to nZ, nYn
VCC = 3.0 V
tpd
propagation delay see Figure 10
[1]
nZ, nYn to nYn, nZ
Sn to nZ, nYn
ten
enable time
see Figure 11
[2]
E to nZ, nYn
tdis
disable time
see Figure 11
[3]
E to nZ, nYn
VCC = 3.3 V
tpd
propagation delay see Figure 10
[1]
nZ, nYn to nYn, nZ
Sn to nZ, nYn
ten
enable time
see Figure 11
[2]
E to nZ, nYn
tdis
disable time
see Figure 11
[3]
E to nZ, nYn
VCC = 4.5 V
tpd
propagation delay see Figure 10
[1]
nZ, nYn to nYn, nZ
Sn to nZ, nYn
ten
enable time
see Figure 11
[2]
E to nZ, nYn
tdis
disable time
see Figure 11
E to nZ, nYn
[3]
74HC4852_2
Product data sheet
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Rev. 02 — 30 May 2007
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74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
Table 9.
Dynamic characteristics …continued
GND = 0 V; CL = 50 pF; RL = 10 kΩ unless specified otherwise; for test circuit see Figure 12.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
1.5
2.5
10.2
0.9
11
0.9
12
ns
2.4
4.8
12.6
1.6
14.5
1.6
16.5
ns
3.2
5.6
39
2.2
40
2.2
40
ns
14.4
57.9
78
13.5
80
13.0
80
ns
VCC = 3.3 V
-
42
-
-
-
-
-
pF
VCC = 5.0 V
-
47
-
-
-
-
-
pF
VCC = 6.0 V
[1]
propagation delay see Figure 10
tpd
nZ, nYn to nYn, nZ
Sn to nZ, nYn
ten
enable time
tdis
disable time
[2]
see Figure 11
E to nZ, nYn
[3]
see Figure 11
E to nZ, nYn
Power dissipation capacitance
power dissipation
capacitance
CPD
[4]
per channel
[1]
tpd is the same as tPLH and tPHL.
[2]
ten is the same as tPZH and tPZL.
[3]
tdis is the same as tPLZ and tPHZ.
[4]
CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + ∑{(CL + Csw) × VCC2 × fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑{(CL + Csw) × VCC2 × fo} = sum of outputs;
CL = output load capacitance in pF;
Csw = switch capacitance in pF;
VCC = supply voltage in V.
12. Waveforms
VI
nZ, nYn or Sn
input
VM
VM
GND
tPLH
tPHL
VOH
nYn or nZ
input
VM
VM
VOL
001aag102
Measurement points are given in Table 10.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 10. Input (nZ, nYn or Sn) to output (nYn, nZ) propagation delays
74HC4852_2
Product data sheet
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Rev. 02 — 30 May 2007
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74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
VI
VM
E input
VM
0V
tPLZ
tPZL
VCC
nZ or nYn
output
VM
VX
VOL
tPHZ
VOH
tPZH
VY
nZ or nYn
output
VM
GND
switch ON
switch OFF
switch ON
001aag103
Test data is given in Table 10.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 11. Enable and disable times
Table 10.
Measurement points
Supply voltage
Input
Output
VCC
VM
VI
VM
VX
VY
2.0 V to 6.0 V
0.5 × VCC
GND to VCC
0.5 × VCC
VOL + 0.1 × (VCC − VOL)
0.9 × VOH
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
13 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
VI
tW
90 %
90 %
negative
pulse
VM
0V
VI
tTHL(tf)
tTLH(tr)
tTLH(tr)
tTHL(tf)
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
10 %
tW
001aac221
a. Input pulse definition
switch
VCC
VCC
open
RL
PULSE
GENERATOR
VI
VO
DUT
CL
RT
GND
001aaf883
Definitions for test circuit:
RL = load resistance.
CL = load capacitance including jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
b. Load circuitry
Test data is given in Table 11.
Fig 12. Load circuitry for switching times
Table 11.
Test data
Test
Input
tr, tf
Switch
VI
tPZH, tPHZ
6 ns
VCC
GND
tPZL, tPLZ
6 ns
GND
VCC
tPHL, tPLH
6 ns
pulse
open
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
14 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 13. Package outline SOT109-1 (SO16)
74HC4852_2
Product data sheet
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Rev. 02 — 30 May 2007
15 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 14. Package outline SOT403-1 (TSSOP16)
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
16 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT763-1
16 terminals; body 2.5 x 3.5 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
7
y
y1 C
v M C A B
w M C
b
L
1
8
Eh
e
16
9
15
10
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.6
3.4
2.15
1.85
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT763-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 15. Package outline SOT763-1 (DHVQFN16)
74HC4852_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
17 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
14. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
15. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
74HC4852_2
20070530
Product data sheet
Modifications:
74HC4852_1
•
Supersedes
74HC4852_1
Typo corrected (“one of the eight switches” to “two of the eight switches”) in Section 1 “General
description”.
20070323
Product data sheet
74HC4852_2
Product data sheet
Change notice
-
-
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 30 May 2007
18 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
74HC4852_2
Product data sheet
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Rev. 02 — 30 May 2007
19 of 20
74HC4852
NXP Semiconductors
4-channel analog MUX/DEMUX with injection-current effect control
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 30 May 2007
Document identifier: 74HC4852_2