INFINEON V23833-G6005-A111

Fiber Optics
V23833-G2005-A101
V23833-G6005-A101
V23833-G6005-A111
XPAK
850 nm Module
10 Gigabit Pluggable Transceiver
Compatible with XPAK MSA Rev. 2.3
Preliminary Data Sheet
Features
Standards
• Compatible with IEEE Std 802.3ae™-2002
• Compatible with Fibre Channel 10GFC Draft 3.5
• Compatible with XPAK MSA Rev. 2.3
Optical
File: 2101
• IEEE Ethernet: Serial 850 nm 10GBASE-SR
• T11 Fibre Channel: Serial 850 nm 1200-M5-SN-I;
1200-M5E-SN-I; 1200-M6-SN-I
• 10 Gigabit Fibre Channel: 10.51875 Gbit/s
(V23833-G2005-A101)
• 10 Gigabit Ethernet: 10.3125 Gbit/s
(V23833-G6005-A1x1)
• Transmission distance
– up to 82 m1) (50 µm MMF)
– up to 300 m1) (on special MMF)
• Vertical Cavity Surface Emitting Laser at 850 nm
(VCSEL)
• LC connector, multimode fiber
• Full duplex transmission mode
• Eye safety class 1M (IEC 60825-1:A2)
1)
File: 2117
Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation.
Part Number
Standard
Connector
Laser Class
V23833-G2005-A101 Fibre Channel Bail
LC
1M
V23833-G6005-A101 Ethernet
Bail
LC
1M
V23833-G6005-A111 Ethernet
None
LC
1M
Preliminary Product Information
De-Latch
Mechanism
1
2004-05-13
V23833-Gx005-A1x1
Applications
• DOM
– Loss Of Signal from receiver
– Supply voltage monitor (+3.3 V, Adaptable Power Supply)
– Transmit power
– Module temperature
– Received power
– Transmit bias current monitor
Mechanical
• Mezzanine profile: 2.68" L x 1.42" W x 0.38" H (68.07 mm x 35.99 mm x 9.8 mm)
• Mezzanine module height for PCI card applications mid-board mounting
• Separated signal/chassis ground (a common signal/chassis ground module version is
available upon request)
• Belly-to-belly applications
• De-latch mechanism with low extraction force (V23833-Gxxxx-Ax0x only)
• Built-in heat sink
Electrical
•
•
•
•
Hot pluggable
Power supply: +5.0 V, +3.3 V, Adaptable Power Supply (APS: +1.8 V)
Total power consumption: 3.4 W typical
XAUI electrical interface
– 3.125 Gbit/s Ethernet (V23833-G60xx-xxxx)
– 3.1875 Gbit/s Fibre Channel (V23833-G20xx-xxxx)
• Management and control via MDIO 2-wire bus
• 70-pin connector
Applications
•
•
•
•
•
•
•
•
•
•
10 Gbit/s Ethernet and Fibre Channel transmission systems for Short Range (SR)
Integration on PCI card
Mid-board mounting
Belly-to-belly for high density applications
Enterprise and campus network applications
Storage applications
Backplane and switch applications
Core and edge routers
Aggregation point for lower date rate
XPAK evaluation kit V23833-G9909-Z001 available upon request
Preliminary Product Information
2
2004-05-13
V23833-Gx005-A1x1
Pin Configuration
Pin Configuration
Toward Bezel
70
GND
69
GND
68
RESERVED
67
RESERVED
66
GND
65
TX LANE3–
64
TX LANE3+
63
GND
62
TX LANE2–
61
TX LANE2+
60
GND
59
TX LANE1–
58
TX LANE1+
57
GND
56
TX LANE0–
55
TX LANE0+
54
GND
53
GND
52
GND
51
RX LANE3–
50
RX LANE3+
49
GND
48
RX LANE2–
47
RX LANE2+
46
GND
45
RX LANE1–
44
RX LANE1+
43
GND
42
RX LANE0–
41
RX LANE0+
40
GND
39
RESERVED
38
RESERVED
37
GND
36
GND
Top of Transceiver PCB
1
GND
2
GND
3
GND
4
5.0 V
5
3.3 V
6
3.3 V
7
APS
8
APS
9
LASI
10
RESET
11
VEND SPECIFIC
12
TX ON/OFF
13
RESERVED
14
MOD DETECT
15
VEND SPECIFIC
16
VEND SPECIFIC
17
MDIO
18
MDC
19
PRTAD4
20
PRTAD3
21
PRTAD2
22
PRTAD1
23
PRTAD0
24
VEND SPECIFIC
25
APS SET
26
RESERVED
27
APS SENSE
28
APS
29
APS
30
3.3 V
31
3.3 V
32
5.0 V
33
GND
34
GND
35
GND
Bottom of Transceiver PCB
(as viewed through top)
File: 2301
Figure 1
XPAK Transceiver Electrical Pad Layout
Preliminary Product Information
3
2004-05-13
V23833-Gx005-A1x1
Pin Configuration
Connector Pin Assignments
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
Signal Name
GND
GND
GND
+5.0 V DC Power
+3.3 V DC Power
+3.3 V DC Power
APS
APS
LASI
RESET
Vendor Specific
TX ON/OFF
Reserved
MOD DETECT
Vendor Specific
Vendor Specific
MDIO
MDC
PRTAD4
PRTAD3
PRTAD2
PRTAD1
PRTAD0
Vendor Specific
APS SET
Reserved
APS SENSE
APS
APS
+3.3 V DC Power
+3.3 V DC Power
+5.0 V DC Power
GND
GND
GND
Preliminary Product Information
Pin No.
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
4
Signal Name
GND
GND
Reserved
Reserved
GND
TX LANE3–
TX LANE3+
GND
TX LANE2–
TX LANE2+
GND
TX LANE1–
TX LANE1+
GND
TX LANE0–
TX LANE0+
GND
GND
GND
RX LANE3–
RX LANE3+
GND
RX LANE2–
RX LANE2+
GND
RX LANE1–
RX LANE1+
GND
RX LANE0–
RX LANE0+
GND
Reserved
Reserved
GND
GND
2004-05-13
V23833-Gx005-A1x1
Pin Configuration
Pin Description
Signal Name Level
I/O
Pin No.
Management and Monitoring Ports
MDIO
Open Drain I/O
17
MDC
LASI
1.2 V
CMOS
1.2 V
CMOS
1.2 V
CMOS
1.2 V
CMOS
1.2 V
CMOS
1.2 V
CMOS
Open Drain
RESET
Open Drain
PRTAD4
PRTAD3
PRTAD2
PRTAD1
PRTAD0
Vendor
Specific
TX ON/OFF
I
18
Management Data I/O. Requires
external 10 - 22 kΩ pull-up to 1.8 V
on host.
Management Data Clock Input
I
19
Port Address Input bit 4
I
20
Port Address Input bit 3
I
21
Port Address Input bit 2
I
22
Port Address Input bit 1
I
23
Port Address Input bit 0
O
9
I
10
Link Alarm Status Interrupt Output.
Open Drain Compatible Output with
10 - 20 kΩ pull-up on host.
Logic high = Normal Operation
Logic low = Status Flag Triggered
Reset Input.
Open Drain Compatible Input with
10 kΩ pull-up to APS internal to
transceiver.
Logic high = Normal Operation
Logic low = RESET
Note: 1.8 V is APS
Vendor Specific Pins. Leave
unconnected when not used.
TX ON/OFF Input.
Open Drain Compatible Input with
10 kΩ pull-up to APS internal to
transceiver.
Logic high = Transmitter On
Logic low = Transmitter Off
Note: 1.8 V is APS
Pulled low inside transceiver
through a 1 kΩ resistor to Ground
11,15,16,24
Open Drain
MOD
DETECT
Preliminary Product Information
Description
I
12
O
14
5
2004-05-13
V23833-Gx005-A1x1
Pin Configuration
Pin Description (cont’d)
Signal Name Level
Transmit Functions
Reserved
Reserved
TX LANE 3– AC-coupled,
TX LANE 3+ Internally
TX LANE 2– biased
TX LANE 2+ differential
TX LANE 1– XAUI
TX LANE 1+
TX LANE 0–
TX LANE 0+
Receive Functions
Reserved
Reserved
RX LANE 0+ AC-coupled,
RX LANE 0– Internally
RX LANE 1+ biased
RX LANE 1– differential
RX LANE 2+ XAUI
RX LANE 2–
RX LANE 3+
RX LANE 3–
Preliminary Product Information
I/O
Pin No.
Description
I
I
I
I
I
I
I
I
I
I
68
67
65
64
62
61
59
58
56
55
Reserved For Future Use
Reserved For Future Use
Module XAUI Input Lane 3–
Module XAUI Input Lane 3+
Module XAUI Input Lane 2–
Module XAUI Input Lane 2+
Module XAUI Input Lane 1–
Module XAUI Input Lane 1+
Module XAUI Input Lane 0–
Module XAUI Input Lane 0+
O
O
O
O
O
O
O
O
O
O
38
39
41
42
44
45
47
48
50
51
Reserved For Future Use
Reserved For Future Use
Module XAUI Output Lane 0+
Module XAUI Output Lane 0–
Module XAUI Output Lane 1+
Module XAUI Output Lane 1–
Module XAUI Output Lane 2+
Module XAUI Output Lane 2–
Module XAUI Output Lane 3+
Module XAUI Output Lane 3–
6
2004-05-13
V23833-Gx005-A1x1
Pin Configuration
Pin Description (cont’d)
Signal Name Level
DC Power
GND
0 V DC
I/O
Pin No.
Description
I
Ground connection for signal
ground on the module
APS
+1.8 V
APS SENSE +1.8 V
I
O
1,2,3,33,34,
35,36,37,40,
43,46,49,52,
53,54,57,60,
63,66,69,70
7,8,28,29
27
APS SET
GND
I
25
3.3 V
+3.3 V DC
I
5,6,30,31
5.0 V
+5.0 V DC
I
4,32
Reserved
Reserved
Preliminary Product Information
26
13
7
Input from Adaptive Power Supply
APS Sense Output. Connected to
the APS input inside transceiver.
Feedback input from APS.
Connected to GND through a
zero Ω resistor inside the
transceiver.
DC Power Input, +3.3 V DC,
Nominal
DC Power Input, +5.0 V DC,
Nominal
Reserved for APD. Do not connect.
Reserved. Do not connect.
2004-05-13
V23833-Gx005-A1x1
Description
Description
System Block Diagram (10 Gbit/s Ethernet)
Vcc
Hot Swap Control
MDIO
Management
Data Interface
10GbE
MAC
+
RS
8B/10B
XGXS
Data Management
MDC
8B/10B
XGXS
XAUI
4x
4x 3.125 Gbit/s
3.125 Gbit/s
SerDes
4x 3.125 Gbit/s
SerDes
BIST
64B/66B
Encoder/
Decoder
10 Gbit/s
SerDes
&
CDR
+CMU
Laser
Laser
Driver
VCSEL
Laser
10 Gbit/s Optical
(Multimode
Fiber)
LA
PIN
TIA
70-pin Edge
Connector
File: 2303
Figure 2
Optical Interface Standard Specifications
•
•
•
•
•
IEEE Std 802.3ae™-2002 clause 52, 10GBASE-SR
Fibre Channel 10GFC Draft 3.5, 1200-M5-SN-I
Fibre Channel 10GFC Draft 3.5, 1200-M5E-SN-I
Fibre Channel 10GFC Draft 3.5, 1200-M6-SN-I
XPAK MSA 2.3
Standard
Fiber Type
Minimum Modal Bandwidth Operating Range1)
at 850 nm (MHz*km)
(meters)
IEEE
62.5 µm MMF
160
2 to 26
50 µm MMF
400
2 to 66
62.5 µm MMF
200
0.5 to 33
50 µm MMF
500
0.5 to 82
50 µm MMF
2000
0.5 to 300
Fibre Channel
1)
Longer reaches possible depending upon link implementation.
Preliminary Product Information
8
2004-05-13
V23833-Gx005-A1x1
Description
Electrical Interface Standard Specifications
• IEEE Std 802.3ae™-2002 clause 45 & 47
• XPAK MSA 2.3
Environment: Thermal Management Recommendations
Operating air inlet temperature:
Operating Airflow:
Operating Humidity:
0°C - 50°C
3 m/s maximum defined per XPAK MSA
0% - 95% RH non-condensing
Module can withstand and operate with case temperature of 75°C for up to 96 hrs/yr.
Transceiver requires airflow across cooling fins. Maximum airflow required per XPAK
MSA is 3 m/s. Actual airflow required to provide adequate cooling for module is 1 m/s
with a maximum air inlet temperature of 50°C. A maximum case temperature of 70°C
must be observed.
Fibers and Connectors
The transceiver has LC receptacles for both Tx and Rx. The transceiver is designed for
multimode LC cables, 0° polished endface (PC).
70-pin Connector
The module interface connector is a 70-pin, printed circuit board edge connection with a
0.5 mm pitch. The appropriate mating connector for the customer PCB is a 70-pin SMT,
dual row, right angled, edge connector, 0.5 mm pitch (TycoAmp part number 1367337-1,
Molex part number 74441-0003 or equivalent).
Cage Requirement
The cage assembly required to mount the XPAK module is defined by the MSA. There
are two cage designs for the module, tall and mezzanine profile. For correct operation
and EMI design the correct cage size must be selected for the appropriate module.
Alternatively a flangeless cage design is specified where there is limited size. A sufficient
EMI gasket that connects from the cage to the face plate must be fitted. The mechanical
design must ensure that no air gaps exist between the cage and the face plate while the
module is plugged in.
Recommended XPAK rail assembly, Molex part number 74732-0200.
Preliminary Product Information
9
2004-05-13
V23833-Gx005-A1x1
Description
DOM Parameters
Parameter
Values
min.
typ.
Unit
max.
Transceiver Temperature Monitor
Accuracy1)
±5
°C
Transmit Bias Current Monitor Accuracy2)
±10
%
Transmit Power Monitor Accuracy3)
±3
dB
Receive Power Monitor Accuracy3)
±3
dB
1)
2)
3)
0 to 70°C case temperature.
0 to 12.5 mA.
0 to 6.5 mW.
Regulatory Compliance
Feature
Standard
Comments
ESD:
Electrostatic Discharge
to the Electrical Pins
(HBM)
EIA/JESD22-A114-B
(MIL-STD 883D
Method 3015.7)
Class 1a (> 500 V)
Immunity:
Against Electrostatic
Discharge (ESD) to the
Module Receptacle
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV to the front end / faceplate /
receptacle cause no damage to
module (under recommended
conditions).
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
With a field strength of 10 V/m,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
module performance between the
specification limits.
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR
Part 15, Class B
EN 55022 Class B
CISPR 22
Noise frequency range:
30 MHz to 40 GHz
Radiated emission does not exceed
specified limits when measured
inside a shielding enclosure with
MSA conform cutout.
Preliminary Product Information
10
2004-05-13
V23833-Gx005-A1x1
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min.
max.
–20
85
°C
0
65
°C
0
80
°C
0
6
V
0
4
V
0
2
V
Supply Voltage APS
TAs
TAo
TCo
V5
V3
Vaps
Static Discharge Voltage, All Pins
STd
500
V
Average Receive Optical Power
RxP max
0
dBm
Storage Ambient Temperature1)
Operating Ambient Temperature1)
Operating Case Temperature1)
Supply Voltage +5.0 V
Supply Voltage +3.3 V
1)
Non condensing.
Exceeding any one of these values may permanently destroy the device.
Recommended Operating Conditions
Parameter
Symbol
Values
min.
Operating Case Temperature1)
TC
Transceiver Total Power
Consumption
P
Supply Voltage +5.0 V
VCC5
ICC5
VCC3
ICC3
VCC aps
ICC aps
Supply Current +5.0 V
Supply Voltage +3.3 V
Supply Current +3.3 V
Supply Voltage APS
Supply Current APS
1)
typ.
0
4.75
Unit
max.
70
°C
3.4
3.8
W
5.0
5.25
V
50
3.14
3.3
mA
3.47
550
1.746
1.8
700
V
mA
1.854
V
mA
Worst case thermal location, see Figure 12.
See also Environment: Thermal Management Recommendations.
Preliminary Product Information
11
2004-05-13
V23833-Gx005-A1x1
Technical Data
Optical Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
min.
typ.
Unit
max.
Transmitter
–2.8
Average Launch Power
PO-OMA
PO-Avg
–3
–2
–1
dBm
Center Wavelength Range1)
λC-Tx
840
850
860
nm
RMS Spectral Width1)
σI
0.4
0.45
nm
Extinction Ratio
ER
Relative Intensity Noise12OMA
RIN
Launch Power in OMA1)
Eye Mask Definition
3
dBm
5.5
dB
–128
dB/Hz
According to IEEE and Fibre Channel
Transmitter and Dispersion
Penalty
TDP
3.9
dB
Encircled Flux
EF
Optical Return Loss Tolerance
ORLT
12
dB
Average Launch Power of OFF
Transmitter
PO-OFF
–30
dBm
–7.5
dBm
–11.1
dBm
–1
dBm
at 19 µm ≥ 86%, at 4.5 µm ≤ 30%
Receiver
Stressed Receiver Sensitivity in PIN-S
OMA
Signal Detect Hysteresis
PIN
PIN-max
PSDL
PSD
PSD
Receiver Reflectance
REFRx
Center Wavelength Range
λC-Rx
Electrical 3 dB Upper Cut-off
Frequency
3dBCO
Sensitivity in OMA2)
Average Receive Power
Signal Detect Deassert Level
Signal Detect Assert Level
1)
2)
–30
1
840
dBm
–20
–13
dBm
2
4
dB
–12
dB
860
nm
12.3
GHz
Conforms to IEEE triple trade off between center wavelength, RMS spectral width and minimum OMA.
Receiver sensitivity, which is defined for an ideal input signal is informative only.
Preliminary Product Information
12
2004-05-13
V23833-Gx005-A1x1
Technical Data
Electrical DC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
min.
typ.
Unit
max.
1.2 V CMOS (1.8 V CMOS Compatible1)) I/O DC Characteristics
(PRTAD; LASI; RESET; TX_ONOFF)
External Pull-up Resistor for
Open Drain
Rpullup
10
Output High Voltage2)
Voh
Vol
Vih
Vil
Ipd
1
Differential Input Amplitude
(pk-pk)4)
Differential Output Amplitude
(pk-pk)4)
Output Low Voltage2)
Input High Voltage
Input Low Voltage
Input Pull-down Current3)
22
kΩ
V
0.15
V
1.854
V
0.36
V
20
120
µA
Vin_xaui
200
2500
mV
Vout_xaui
800
1600
mV
VOL
IOL
VIH
VIL
VPU
CIN
CLOAD
RLOAD
–0.3
0.2
V
4
mA
0.84
1.854
V
–0.3
0.36
V
1.854
V
10
pF
470
pF
0.84
XAUI I/O DC Characteristics
(TXLANE[0..3]; RXLANE[0..3])
MDIO I/O DC Characteristics
(MDIO; MDC)
Output Low Voltage5)
Output Low Current
Input High Voltage
Input Low Voltage
Pull-up Supply Voltage
Input Capacitance
Load Capacitance
External Pull-up Resistance
1)
2)
3)
4)
5)
1.746
1.8
200
Ω
For 1.8 V CMOS Voh = 1.65 V min., Vol = 0.15 V max., Vih = 1.17 V min., Vil = 0.63 V max.
Rpull-up = 10 kΩ to 1.8 V.
Vin = 1.8 V.
AC coupled.
IOL = 100 µA.
Preliminary Product Information
13
2004-05-13
V23833-Gx005-A1x1
Technical Data
Electrical AC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
min.
XAUI Input AC Characteristics
(TXLANE[0..3])
Baud Rate
RXAUIIN
Fibre Channel
Ethernet
Gbit/s
RTOLXAUI
–100
Differential Input Impedance
ZINXAUI
80
Differential Return Loss1)
|S11|
10
100
100
ppm
120
Ω
dB
tSKEWIN
2)
max.
3.1875
3.125
Baud Rate Tolerance
Input Differential Skew
typ.
Unit
75
ps
3)
Jitter Amplitude Tolerance
JXAUITOL
XAUI Output AC Characteristics
(RXLANE[0..3])
Baud Rate
RXAUIOUT
Fibre Channel
Ethernet
Gbit/s
3.1875
3.125
Baud Rate Variation
RXAUIVAR
–100
100
ppm
Rise and Fall Times
20% - 80%
tr, tf
40
100
ps
Output Differential Skew
tSKEWOUT
ZOUTXAUI
15
ps
80
120
Ω
|S22|
10
Output Differential Impedance
1)
Differential Output Return Loss
Total Jitter
4)
TJXAUI
100
dB
0.35
UI
4)
Deterministic Jitter
DJXAUI
0.17
UI
Power-On Reset AC Characteristics
Power-On Reset and
According to XENPAK MSA Issue 3.0 Draft 4.0,
TX_ONOFF Characteristics
2002-9-9
Preliminary Product Information
14
2004-05-13
V23833-Gx005-A1x1
Technical Data
Electrical AC Characteristics (cont’d)
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C)
Parameter
Symbol
Values
min.
MDIO I/O AC Characteristics
(MDIO; MDC)
MDIO Data Hold Time
tHOLD
MDIO Data Setup Time
tSU
Delay from MDC Rising Edge to tDELAY
typ.
Unit
max.
10
ns
10
ns
300
ns
2.5
MHz
MDIO Data Change
MDC Clock Rate
1)
2)
3)
4)
fMAX
100 MHz to 2.5 GHz.
At crossing point.
Per IEEE Std 802.3ea.
At near-end. No pre-equalization. 1 UI = 320 ps.
Mechanical Characteristics
Parameter
Symbol
Values
min.
typ.
Unit
max.
Module Retention Force
(latch strength)
FRET
200
N
Module Insertion Force
FIN
40
N
Module Extraction Force
(with kick-out)
FEXT-K
16
N
Module Extraction Force
(without kick-out)
FEXT
25
N
0-80 UNF Screw Torque1)
τ0-80 UNF
1)
10
cNm
Two 0-80 UNF screws are used to secure the XPAK module (no bail de-latch version V23833-Gxxxx-Ax1x) in
the cage. The XPAK module is supplied with the screws assembled, and removal is required prior to insertion
into the cage.
Preliminary Product Information
15
2004-05-13
V23833-Gx005-A1x1
Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1M product. It complies with IEC
60825-1 and FDA 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser
Notice 50, dated July 26, 2001.
INVISIBLE LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
CLASS 1M LASER PRODUCT
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Attention: All adjustments have been made at the factory prior to shipment of the
devices. No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result
in voided product warranty.
Note: Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Data
Wavelength
850 nm
Accessible Emission Limit
(as defined by IEC: 7 mm aperture at 100 mm distance)
749 µW
Beam divergence (full angle)
22°
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1M Laser Product
File: 2412
Figure 3
Required Labels
Laser
Emission
Tx
Top view
Rx
File: 2308
Figure 4
Laser Emission
Preliminary Product Information
16
2004-05-13
V23833-Gx005-A1x1
Application Notes
Application Notes
NVRAM Register Contents
Address
Group
XENPAK MSA 3.0
Definition
Value
Dec
Hex
32775 8007
Dec Hex
Header XENPAK MSA version supported 30
1E
Comment
Rev. 3.0
32776 8008
32777 8009
NVR size in bytes
1
0
1
0
256
32778 800A
32779 800B
Number of bytes used
0
181
0
B5
181
32780 800C
32781 800D
Basic field address
Customer field address
11
119
B
77
B
77
32782 800E
32783 800F
Vendor field address
Extended vendor field address
167
0
A7
0
A7
0
Reserved
0
0
0
0
0
0
Transceived type
Connector
4
2
4
2
XPAK
LC
Encoding
Bit rate
1
40
1
28
NRZ
10313
Protocol
73
1
49
1
10GBE
1
0
1
0
SR
not used
32794 801A
32795 801B
0
0
0
0
not used
not used
32796 801C
32797 801D
0
0
0
0
not used
not used
32798 801E
32799 801F
0
0
0
0
not used
not used
32800 8020
32801 8021
0
0
0
0
not used
not used
0
30
0
1E
0.3 km
32784 8010
32785 8011
32786 8012
32787 8013
32788 8014
32789 8015
32790 8016
32791 8017
32792 8018
32793 8019
32802 8022
32803 8023
Basic
Standards compliance codes
Range
Preliminary Product Information
17
2004-05-13
V23833-Gx005-A1x1
Application Notes
NVRAM Register Contents (cont’d)
Address
Dec
Hex
32804 8024
Group
XENPAK MSA 3.0
Definition
Value
Comment
Fiber type
Dec Hex
1
1
MM
Wavelength channel 0
0
1
0
1
850 nm
76
8
4C
8
0
0
0
0
not used
not used
0
0
0
0
not used
not used
0
0
0
0
not used
not used
0
0
0
0
not used
not used
0
1
0
1
not used
00-0A-CB
32819 8033
32820 8034
67
76
43
4C
32821 8035
32822 8036
32
3
20
3
32823 8037
32824 8038
34
96
22
60
32825 8039
32826 803A
0
73
0
49
I
32827 803B
32828 803C
78
70
4E
46
N
F
32829 803D
32830 803E
73
78
49
4E
I
N
32831 803F
32832 8040
69
79
45
4F
E
O
32833 8041
78
4E
N
32805 8025
32806 8026
Basic
32807 8027
32808 8028
32809 8029
32810 802A
32811 802B
32812 802C
Wavelength channel 1
Wavelength channel 2
32813 802D
32814 802E
32815 802F
32816 8030
32817 8031
32818 8032
Wavelength channel 3
Package OUI
Vendor OUI
Vendor name
Preliminary Product Information
18
00-13-19
2004-05-13
V23833-Gx005-A1x1
Application Notes
NVRAM Register Contents (cont’d)
Address
Dec
Hex
32834 8042
Group
Basic
XENPAK MSA 3.0
Definition
Vendor name
Value
Comment
Dec Hex
32
20
32835 8043
32836 8044
70
79
46
4F
F
O
32837 8045
32838 8046
32
71
20
47
G
32839 8047
32840 8048
109
98
6D
62
m
b
32841 8049
32842 804A
72
86
48
56
H
V
32843 804B
32844 804C
50
51
32
33
2
3
32845 804D
32846 804E
32847 804F
32848 8050
56
51
38
33
8
3
51
45
33
2D
3
-
32849 8051
32850 8052
32851 8053
32852 8054
71
47
G
1)
1)
1)
48
48
30
30
0
0
32853 8055
32854 8056
32855 8057
32856 8058
53
65
35
41
5
A
49
31
1
2)
2)
2)
32857 8059
32858 805A
32859 805B
49
66
31
42
1
B
50
32
2
Vendor part number
Vendor revision
Preliminary Product Information
19
2004-05-13
V23833-Gx005-A1x1
Application Notes
NVRAM Register Contents (cont’d)
Address
Group
Dec
Hex
32860 805C Basic
32861 805D
32862 805E
XENPAK MSA 3.0
Definition
Vendor serial number
Value
Comment
Dec Hex
80
50
80
80
50
50
32863 805F
32864 8060
32865 8061
32866 8062
80
80
50
50
80
80
50
50
32867 8063
32868 8064
80
80
50
50
32869 8065
32870 8066
80
80
50
50
32871 8067
32872 8068
80
80
50
50
32873 8069
32874 806A
80
80
50
50
32875 806B
32876 806C
80
50
5 V stressed environment
reference
3.3 V stressed environment
reference
1
1
50 mA
1
1
550 mA
APS stressed environment
reference
2
2
750 mA
Year code
32877 806D
32878 806E
32879 806F
32880 8070
Month code
32881 8071
32882 8072
Day code
32883 8073
32884 8074
Lot code
32885 8075
32886 8076
32887 8077
32888 8078
Preliminary Product Information
20
2004-05-13
V23833-Gx005-A1x1
Application Notes
NVRAM Register Contents (cont’d)
Address
Dec
Hex
32889 8079
Group
XENPAK MSA 3.0
Definition
Value
Comment
Nominal APS voltage
Dec Hex
20
14
+1.8 V
32890 807A
32891 807B
DOM capability
Optional capability
193
0
C1
0
default
none
32892 807C
32893 807D
reserved
Basic checksum
0
0
32894
to
32941
32942
to
33030
Customer area
1)
2)
807E
to
80AD
80AE
to
8106
Basic
Vendor specific
V23833-G2005-A101: Dec = 50, Hex = 32, Comment = 2
V23833-G6005-A101: Dec = 54, Hex = 36, Comment = 6
V23833-G6005-A111: Dec = 54, Hex = 36, Comment = 6
V23833-G2005-A101: Dec = 48, Hex = 30, Comment = 0
V23833-G6005-A101: Dec = 48, Hex = 30, Comment = 0
V23833-G6005-A111: Dec = 49, Hex = 31, Comment = 1
Preliminary Product Information
21
2004-05-13
V23833-Gx005-A1x1
Application Notes
PCB Cage Footprints
Dimensions in mm [inches]
Figure 5
File: 2203
Standard Mounting
Dimensions in mm [inches]
Figure 6
File: 2204
Belly-to-Belly Mounting
Preliminary Product Information
22
2004-05-13
V23833-Gx005-A1x1
Application Notes
Host Board Layouts
29.6
14.8
10x ∅2±0.08 [.079±.003]
⊕ ∅0.15 [.006] G H J
13.8 13.4
59.69 [2.35]
55.88 [2.2]
44.45 [1.75]
38.1 [1.5]
25.4 [1]
12.7 [.5]
6.35 [.25]
3.94 [.155]
J
4.24
[.167]
9.14 [.36] 1) 2)
38.1
[1.5]
2±0.05 (70x)
0.5±0.03 (70x)
H
35.51
[1.398]
40.23
[1.584]
6.6±0.38 [.26±.015] 1) 2)
7.39±0.38 [.291±.015] 3)
31.75 [1.25]
13.4 13.8
4.1
4.1
∅1.55±0.05
19.05 [.75]
47.8 [1.882]
44.07 [1.735]
62.36 [2.455]
55.88 [2.2]
65.66 [2.585]
PAD DETAIL
SEE BELOW
41.91
[1.65]
35.51
[1.398]
1) Tall profile
2) Low profile
3) Flangeless
0.8 (34x)
PAD SPACING
PAD DETAIL
1.02 [.04] 1) 2)
0.51 [.02] 3)
41.91
[1.65]
25.3±0.12 [.996±.005] 1)
12.85±0.12 [.506±.005] 2)
10.31±0.12 [.406±.005] 3)
11.76 [.463] 1)
6.4 [.252] 2)
6.43 [.253] 3)
G
⊕ ∅0.25 [.01] G H J
39.12±0.12 [1.54±.005] 1) 2)
36.5±0.12 [1.437±.005] 3)
Dimensions in mm [inches]
Figure 7
File: 2504
Host PCB, Board Connector Layout and Bezel Opening
Preliminary Product Information
23
2004-05-13
V23833-Gx005-A1x1
Application Notes
1
GND
2
GND
3
GND
69
RESERVED
68
RESERVED
67
GND
66
TX LANE3−
65
TX LANE3+
64
GND
63
TX LANE2−
62
TX LANE2+
61
5.0 V
5
3.3 V
6
3.3 V
7
APS
8
APS
9
LASI
10
RESET
11
VEND SPECIFIC
12
GND
60
TX LANE1−
59
TX LANE1+
58
GND
57
TX LANE0−
56
TX LANE0+
55
GND
54
GND
53
GND
52
TX ON/OFF
13
RESERVED
14
MOD DETECT
15
VEND SPECIFIC
16
VEND SPECIFIC
17
MDIO
18
MDC
19
PRTAD4
20
PRTAD3
21
RX LANE3−
51
RX LANE3+
50
GND
49
RX LANE2−
48
RX LANE2+
47
GND
46
RX LANE1−
45
RX LANE1+
44
GND
43
PRTAD2
22
PRTAD1
23
PRTAD0
24
VEND SPECIFIC
25
APS SET
26
RESERVED
27
APS SENSE
28
APS
29
APS
30
RX LANE0−
42
RX LANE0+
41
GND
40
RESERVED
39
RESERVED
38
GND
37
GND
36
3.3 V
31
3.3 V
32
5.0 V
33
GND
34
GND
35
GND
Lower Row
Figure 8
70
GND
4
Toward Bezel
GND
Upper Row
File: 2505
Host Board Pad Layout
Preliminary Product Information
24
2004-05-13
V23833-Gx005-A1x1
Package Outlines
Package Outlines
Mezzanine profile version
shown with LC Receptacle
Dimensions in mm
Figure 9
File: 2201
XPAK with Bail De-Latch Mechanism
a)
a) For 0-80 UNF Screw assembly
see Mechanical Characteristics
Dimensions in mm [inches]
Figure 10
File: 2210
XPAK with No De-Latch Mechanism
Preliminary Product Information
25
2004-05-13
V23833-Gx005-A1x1
Package Outlines
17.45
Laser class
8.5
2.6
Description
Part number
33.5
Country of origin
Optional marking
(MS/ES)
Dimensions in mm
Figure 11
year of production
week of production
serial number
month of production
File: 2401
Label Description
Dimensions in mm
Figure 12
YYYY:
WW:
nnnnnnnn:
MMMMM:
File: 2205
XPAK Temperature Reference Point
Preliminary Product Information
26
2004-05-13
V23833-G2005-A101, V23833-G6005-A101, V23833-G6005-A111
Revision History:
2004-05-13
Previous Version:
2004-02-23
Page
DS3
Subjects (major changes since last revision)
V23833-G6005-A111 added
1, 2
Optical Features changed
2
Electrical Features changed
9
Environment: Thermal Management Recommendations changed
9
Fibers and Connectors changed
9
Cage Requirement changed
11
Table “Recommended Operating Conditions” changed
14
Table “Electrical AC Characteristics” changed
15
Table “Mechanical Characteristics” added
16
Eye Safety changed
Table “Laser Data” added
Figure 3 Required Labels added
Figure 4 Laser Emission added
17
NVRAM Register Contents added
25
Figure 10 XPAK with No De-Latch Mechanism added
Edition 2004-05-13
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.