Fiber Optics V23833-G2104-A001 V23833-G6104-A001 V23833-G6104-A011 XPAK 1310 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3 Preliminary Data Sheet Features Standards • Compatible with IEEE Std 802.3ae™-2002 • Compatible with Fibre Channel 10GFC Draft 3.5 • Compatible with XPAK MSA Rev. 2.3 Optical File: 2104 • IEEE Ethernet: Serial 1310 nm 10GBASE-LR • T11 Fibre Channel: Serial 1310 nm 1200-SM-LL-L • 10 Gigabit Fibre Channel: 10.51875 Gbit/s (V23833-G2104-A001) • 10 Gigabit Ethernet: 10.3125 Gbit/s (V23833-G6104-A0x1) • Transmission distance up to 10 km1) • Uncooled directly modulated Distributed Feedback (DFB) laser at 1310 nm • SC connector, single mode fiber • Full duplex transmission mode • Eye safety class 1 (IEC 60825-1:A2) 1) File: 2118 Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation. Part Number Standard Connector Laser Class V23833-G2104-A001 Fibre Channel Bail SC 1 V23833-G6104-A001 Ethernet Bail SC 1 V23833-G6104-A011 Ethernet None SC 1 Preliminary Product Information De-Latch Mechanism 1 2004-05-13 V23833-Gx104-A0x1 Applications • DOM – Loss Of Signal from receiver – Laser safety alarm (with reset function) – Supply voltage monitor (+3.3 V, Adaptable Power Supply) – Transmit power – Module temperature – Received power – Transmit bias current monitor Mechanical • Mezzanine profile: 2.68" L x 1.42" W x 0.38" H (68.07 mm x 35.99 mm x 9.8 mm) • Mezzanine module height for PCI card applications and mid-board mounting • Separated signal/chassis ground (a common signal/chassis ground module version is available upon request) • Belly-to-belly applications • De-latch mechanism with low extraction force (V23833-Gxxxx-Ax0x only) • Built-in heat sink Electrical • • • • Hot pluggable Power supply: +5.0 V, +3.3 V, Adaptable Power Supply (APS: +1.8 V) Total power consumption: 3.3 W typical XAUI electrical interface – 3.125 Gbit/s Ethernet (V23833-G61xx-xxxx) – 3.1875 Gbit/s Fibre Channel (V23833-G21xx-xxxx) • Management and control via MDIO 2-wire bus • 70-pin connector Applications • • • • • • • • • • 10 Gbit/s Ethernet and Fibre Channel transmission systems for Long Range (LR) Integration on PCI card Mid-board mounting Belly-to-belly for high density applications Enterprise and campus network applications Storage applications Backplane and switch applications Core and edge routers Aggregation point for lower date rate XPAK evaluation kit V23833-G9909-Z001 available upon request Preliminary Product Information 2 2004-05-13 V23833-Gx104-A0x1 Pin Configuration Pin Configuration Toward Bezel 70 GND 69 GND 68 RESERVED 67 RESERVED 66 GND 65 TX LANE3– 64 TX LANE3+ 63 GND 62 TX LANE2– 61 TX LANE2+ 60 GND 59 TX LANE1– 58 TX LANE1+ 57 GND 56 TX LANE0– 55 TX LANE0+ 54 GND 53 GND 52 GND 51 RX LANE3– 50 RX LANE3+ 49 GND 48 RX LANE2– 47 RX LANE2+ 46 GND 45 RX LANE1– 44 RX LANE1+ 43 GND 42 RX LANE0– 41 RX LANE0+ 40 GND 39 RESERVED 38 RESERVED 37 GND 36 GND Top of Transceiver PCB 1 GND 2 GND 3 GND 4 5.0 V 5 3.3 V 6 3.3 V 7 APS 8 APS 9 LASI 10 RESET 11 VEND SPECIFIC 12 TX ON/OFF 13 RESERVED 14 MOD DETECT 15 VEND SPECIFIC 16 VEND SPECIFIC 17 MDIO 18 MDC 19 PRTAD4 20 PRTAD3 21 PRTAD2 22 PRTAD1 23 PRTAD0 24 VEND SPECIFIC 25 APS SET 26 RESERVED 27 APS SENSE 28 APS 29 APS 30 3.3 V 31 3.3 V 32 5.0 V 33 GND 34 GND 35 GND Bottom of Transceiver PCB (as viewed through top) File: 2301 Figure 1 XPAK Transceiver Electrical Pad Layout Preliminary Product Information 3 2004-05-13 V23833-Gx104-A0x1 Pin Configuration Connector Pin Assignments Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Signal Name GND GND GND +5.0 V DC Power +3.3 V DC Power +3.3 V DC Power APS APS LASI RESET Vendor Specific TX ON/OFF Reserved MOD DETECT Vendor Specific Vendor Specific MDIO MDC PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 Vendor Specific APS SET Reserved APS SENSE APS APS +3.3 V DC Power +3.3 V DC Power +5.0 V DC Power GND GND GND Preliminary Product Information Pin No. 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 4 Signal Name GND GND Reserved Reserved GND TX LANE3– TX LANE3+ GND TX LANE2– TX LANE2+ GND TX LANE1– TX LANE1+ GND TX LANE0– TX LANE0+ GND GND GND RX LANE3– RX LANE3+ GND RX LANE2– RX LANE2+ GND RX LANE1– RX LANE1+ GND RX LANE0– RX LANE0+ GND Reserved Reserved GND GND 2004-05-13 V23833-Gx104-A0x1 Pin Configuration Pin Description Signal Name Level I/O Pin No. Management and Monitoring Ports MDIO Open Drain I/O 17 MDC LASI 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS Open Drain RESET Open Drain PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 Vendor Specific TX ON/OFF I 18 Management Data I/O. Requires external 10 - 22 kΩ pull-up to 1.8 V on host. Management Data Clock Input I 19 Port Address Input bit 4 I 20 Port Address Input bit 3 I 21 Port Address Input bit 2 I 22 Port Address Input bit 1 I 23 Port Address Input bit 0 O 9 I 10 Link Alarm Status Interrupt Output. Open Drain Compatible Output with 10 - 20 kΩ pull-up on host. Logic high = Normal Operation Logic low = Status Flag Triggered Reset Input. Open Drain Compatible Input with 10 kΩ pull-up to APS internal to transceiver. Logic high = Normal Operation Logic low = RESET Note: 1.8 V is APS Vendor Specific Pins. Leave unconnected when not used. TX ON/OFF Input. Open Drain Compatible Input with 10 kΩ pull-up to APS internal to transceiver. Logic high = Transmitter On Logic low = Transmitter Off Note: 1.8 V is APS Pulled low inside transceiver through a 1 kΩ resistor to Ground 11,15,16,24 Open Drain MOD DETECT Preliminary Product Information Description I 12 O 14 5 2004-05-13 V23833-Gx104-A0x1 Pin Configuration Pin Description (cont’d) Signal Name Level Transmit Functions Reserved Reserved TX LANE 3– AC-coupled, TX LANE 3+ Internally TX LANE 2– biased TX LANE 2+ differential TX LANE 1– XAUI TX LANE 1+ TX LANE 0– TX LANE 0+ Receive Functions Reserved Reserved RX LANE 0+ AC-coupled, RX LANE 0– Internally RX LANE 1+ biased RX LANE 1– differential RX LANE 2+ XAUI RX LANE 2– RX LANE 3+ RX LANE 3– Preliminary Product Information I/O Pin No. Description I I I I I I I I I I 68 67 65 64 62 61 59 58 56 55 Reserved For Future Use Reserved For Future Use Module XAUI Input Lane 3– Module XAUI Input Lane 3+ Module XAUI Input Lane 2– Module XAUI Input Lane 2+ Module XAUI Input Lane 1– Module XAUI Input Lane 1+ Module XAUI Input Lane 0– Module XAUI Input Lane 0+ O O O O O O O O O O 38 39 41 42 44 45 47 48 50 51 Reserved For Future Use Reserved For Future Use Module XAUI Output Lane 0+ Module XAUI Output Lane 0– Module XAUI Output Lane 1+ Module XAUI Output Lane 1– Module XAUI Output Lane 2+ Module XAUI Output Lane 2– Module XAUI Output Lane 3+ Module XAUI Output Lane 3– 6 2004-05-13 V23833-Gx104-A0x1 Pin Configuration Pin Description (cont’d) Signal Name Level DC Power GND 0 V DC I/O Pin No. Description I Ground connection for signal ground on the module APS +1.8 V APS SENSE +1.8 V I O 1,2,3,33,34, 35,36,37,40, 43,46,49,52, 53,54,57,60, 63,66,69,70 7,8,28,29 27 APS SET GND I 25 3.3 V +3.3 V DC I 5,6,30,31 5.0 V +5.0 V DC I 4,32 Reserved Reserved Preliminary Product Information 26 13 7 Input from Adaptive Power Supply APS Sense Output. Connected to the APS input inside transceiver. Feedback input from APS. Connected to GND through a zero Ω resistor inside the transceiver. DC Power Input, +3.3 V DC, Nominal DC Power Input, +5.0 V DC, Nominal Reserved for APD. Do not connect. Reserved. Do not connect. 2004-05-13 V23833-Gx104-A0x1 Description Description System Block Diagram (10 Gbit/s Ethernet) Vcc Hot Swap Control MDIO Management Data Interface 10GbE MAC + RS 8B/10B XGXS Data Management MDC 8B/10B XGXS XAUI 4x 4x 3.125 Gbit/s 3.125 Gbit/s SerDes 4x 3.125 Gbit/s SerDes BIST 64B/66B Encoder/ Decoder 10 Gbit/s SerDes & CDR +CMU Laser Laser Driver DFB Laser 10 Gbit/s Optical (Single Mode Fiber) LA PIN TIA 70-pin Edge Connector File: 2302 Figure 2 Optical Interface Standard Specifications • IEEE Std 802.3ae™-2002 clause 52, 10GBASE-LR • Fibre Channel 10GFC Draft 3.5, 1200-SM-LL-L • XPAK MSA 2.3 Fiber Type Differential Group Delay Maximum (ps) Operating Range (meters)1) B1.1 SMF 10 2 to 10,000 B1.3 SMF 10 2 to 10,000 1) Operating range as defined by IEEE and Fibre Channel standards. Longer reach possible depending upon link implementation. Preliminary Product Information 8 2004-05-13 V23833-Gx104-A0x1 Description Electrical Interface Standard Specifications • IEEE Std 802.3ae™-2002 clause 45 & 47 • XPAK MSA 2.3 Environment: Thermal Management Recommendations Operating air inlet temperature: Operating Airflow: Operating Humidity: 0°C - 50°C 3 m/s maximum defined per XPAK MSA 0% - 95% RH non-condensing Module can withstand and operate with case temperature of 75°C for up to 96 hrs/yr. Transceiver requires airflow across cooling fins. Maximum airflow required per XPAK MSA is 3 m/s. Actual airflow required to provide adequate cooling for module is 1 m/s with a maximum air inlet temperature of 50°C. A maximum case temperature of 70°C must be observed. Fibers and Connectors The transceiver has SC receptacles for both Tx and Rx. The transceiver is designed for single mode SC cables, 0° polished endface (PC). 70-pin Connector The module interface connector is a 70-pin, printed circuit board edge connection with a 0.5 mm pitch. The appropriate mating connector for the customer PCB is a 70-pin SMT, dual row, right angled, edge connector, 0.5 mm pitch (TycoAmp part number 1367337-1, Molex part number 74441-0003 or equivalent). Cage Requirement The cage assembly required to mount the XPAK module is defined by the MSA. There are two cage designs for the module, tall and mezzanine profile. For correct operation and EMI design the correct cage size must be selected for the appropriate module. Alternatively a flangeless cage design is specified where there is limited size. A sufficient EMI gasket that connects from the cage to the face plate must be fitted. The mechanical design must ensure that no air gaps exist between the cage and the face plate while the module is plugged in. Recommended XPAK rail assembly, Molex part number 74732-0200. Preliminary Product Information 9 2004-05-13 V23833-Gx104-A0x1 Description DOM Parameters Parameter Values min. typ. Unit max. Transceiver Temperature Monitor Accuracy1) ±5 °C Transmit Bias Current Monitor Accuracy2) ±10 % Transmit Power Monitor Accuracy3) ±3 dB Receive Power Monitor Accuracy3) ±3 dB 1) 2) 3) 0 to 70°C case temperature. 0 to 12.5 mA. 0 to 6.5 mW. Regulatory Compliance Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins (HBM) EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) Class 1a (> 500 V) Immunity: Against Electrostatic Discharge (ESD) to the Module Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 10 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on module performance between the specification limits. Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Noise frequency range: 30 MHz to 40 GHz Radiated emission does not exceed specified limits when measured inside a shielding enclosure with MSA conform cutout. Preliminary Product Information 10 2004-05-13 V23833-Gx104-A0x1 Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values Unit min. max. –20 85 °C 0 65 °C 0 80 °C 0 6 V 0 4 V 0 2 V Supply Voltage APS TAs TAo TCo V5 V3 Vaps Static Discharge Voltage, All Pins STd 500 V Average Receive Optical Power RxP max 1.5 dBm Storage Ambient Temperature1) Operating Ambient Temperature1) Operating Case Temperature1) Supply Voltage +5.0 V Supply Voltage +3.3 V 1) Non condensing. Exceeding any one of these values may permanently destroy the device. Recommended Operating Conditions Parameter Symbol Values min. Operating Case Temperature1) TC Transceiver Total Power Consumption P Supply Voltage +5.0 V VCC5 ICC5 VCC3 ICC3 VCC aps ICC aps Supply Current +5.0 V Supply Voltage +3.3 V Supply Current +3.3 V Supply Voltage APS Supply Current APS 1) typ. 0 4.75 Unit max. 70 °C 3.3 3.5 W 5.0 5.25 V 50 3.14 3.3 mA 3.47 550 1.746 1.8 700 V mA 1.854 V mA Worst case thermal location, see Figure 12. See also Environment: Thermal Management Recommendations. Preliminary Product Information 11 2004-05-13 V23833-Gx104-A0x1 Technical Data Optical Characteristics (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C) Parameter Symbol Values min. typ. Unit max. Transmitter Launch Power in OMA minus TDP PO-OMA –6.2 Average Launch Power PO-Avg –8.2 –1 0.5 dBm Center Wavelength Range λC-Tx 1290 1310 1330 nm Spectral Width (–20 dB) σI 0.5 0.6 nm Side Mode Suppression Ratio SMSR 30 Extinction Ratio ER 3.5 Relative Intensity Noise12OMA RIN Optical Modulation Amplitude (OMA) OMA Transmitter and Dispersion Penalty TDP 3.2 dB Average Launch Power of OFF Transmitter PO-OFF –30 dBm Optical Return Loss Tolerance ORLT 12 dB Transmitter Reflectance REFTx –12 dB Eye Mask Definition dBm dB 5 dB –128 dB/Hz –5.2 dBm According to IEEE and Fibre Channel Receiver Loss Of Signal Hysteresis PIN-S PIN PIN-max PLOSa PLOSh Receiver Reflectance REFRx Center Wavelength Range λC-Rx Electrical 3 dB Upper Cut-off Frequency 3dBCO Stressed Receiver Sensitivity Sensitivity in OMA1) Average Receive Power Loss Of Signal Assert Level 1) 1 –10.3 dBm –12.6 dBm 0.5 dBm –17 –13 dBm 2 4 dB –12 dB 1355 nm 12.3 GHz 1260 Receiver sensitivity, which is defined for an ideal input signal is informative only. Preliminary Product Information 12 2004-05-13 V23833-Gx104-A0x1 Technical Data Electrical DC Characteristics (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C) Parameter Symbol Values min. typ. Unit max. 1.2 V CMOS (1.8 V CMOS Compatible1)) I/O DC Characteristics (PRTAD; LASI; RESET; TX_ONOFF) External Pull-up Resistor for Open Drain Rpullup 10 Output High Voltage2) Voh Vol Vih Vil Ipd 1 Differential Input Amplitude (pk-pk)4) Differential Output Amplitude (pk-pk)4) Output Low Voltage 2) Input High Voltage Input Low Voltage Input Pull-down Current3) 22 kΩ V 0.15 V 1.854 V 0.36 V 20 120 µA Vin_xaui 200 2500 mV Vout_xaui 800 1600 mV VOL IOL VIH VIL VPU CIN CLOAD RLOAD –0.3 0.2 V 4 mA 0.84 1.854 V –0.3 0.36 V 1.854 V 10 pF 470 pF 0.84 XAUI I/O DC Characteristics (TXLANE[0..3]; RXLANE[0..3]) MDIO I/O DC Characteristics (MDIO; MDC) Output Low Voltage5) Output Low Current Input High Voltage Input Low Voltage Pull-up Supply Voltage Input Capacitance Load Capacitance External Pull-up Resistance 1) 2) 3) 4) 5) 1.746 1.8 200 Ω For 1.8 V CMOS Voh = 1.65 V min., Vol = 0.15 V max., Vih = 1.17 V min., Vil = 0.63 V max. Rpull-up = 10 kΩ to 1.8 V. Vin = 1.8 V. AC coupled. IOL = 100 µA. Preliminary Product Information 13 2004-05-13 V23833-Gx104-A0x1 Technical Data Electrical AC CharacteristicsCharacteristics (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C) Parameter Symbol Values min. XAUI Input AC Characteristics (TXLANE[0..3]) Baud Rate RXAUIIN Fibre Channel Ethernet Baud Rate Tolerance 3.1875 3.125 –100 ZINXAUI 80 Differential Return Loss |S11| 10 Input Differential Skew2) tSKEWIN 1) max. Gbit/s RTOLXAUI Differential Input Impedance typ. Unit 100 100 ppm 120 Ω dB 75 Jitter Amplitude Tolerance3) JXAUITOL XAUI Output AC Characteristics (RXLANE[0..3]) Baud Rate RXAUIOUT Fibre Channel Ethernet ps Gbit/s 3.1875 3.125 Baud Rate Variation RXAUIVAR –100 100 ppm Rise and Fall Times 20% - 80% tr, tf 40 100 ps Output Differential Skew tSKEWOUT ZOUTXAUI 15 ps 80 120 Ω Differential Output Return Loss |S22| 10 Total Jitter4) TJXAUI Output Differential Impedance 1) 100 dB 0.35 UI Deterministic Jitter4) DJXAUI 0.17 UI Power-On Reset AC Characteristics Power-On Reset and According to XENPAK MSA Issue 3.0 Draft 4.0, TX_ONOFF Characteristics 2002-9-9 Preliminary Product Information 14 2004-05-13 V23833-Gx104-A0x1 Technical Data Electrical AC CharacteristicsCharacteristics (cont’d) (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0°C to 70°C) Parameter Symbol Values min. MDIO I/O AC Characteristics (MDIO; MDC) MDIO Data Hold Time tHOLD MDIO Data Setup Time tSU Delay from MDC Rising Edge to tDELAY typ. Unit max. 10 ns 10 ns 300 ns 2.5 MHz MDIO Data Change MDC Clock Rate 1) 2) 3) 4) fMAX 100 MHz to 2.5 GHz. At crossing point. Per IEEE Std 802.3ea. At near-end. No pre-equalization. 1 UI = 320 ps. Mechanical Characteristics Parameter Symbol Values min. typ. Unit max. Module Retention Force (latch strength) FRET 200 N Module Insertion Force FIN 40 N Module Extraction Force (with kick-out) FEXT-K 16 N Module Extraction Force (without kick-out) FEXT 25 N 0-80 UNF Screw Torque1) τ0-80 UNF 1) 10 cNm Two 0-80 UNF screws are used to secure the XPAK module (no bail de-latch version V23833-Gxxxx-Ax1x) in the cage. The XPAK module is supplied with the screws assembled, and removal is required prior to insertion into the cage. Preliminary Product Information 15 2004-05-13 V23833-Gx104-A0x1 Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice 50, dated July 26, 2001. CLASS 1 LASER PRODUCT To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength 1310 nm Accessible Emission Limit (as defined by IEC: 7 mm aperture at 14 mm distance) 15.6 mW Beam divergence (full angle) 11° FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 2411 Figure 3 Required Labels Laser Emission Tx Top view Rx File: 2308 Figure 4 Laser Emission Preliminary Product Information 16 2004-05-13 V23833-Gx104-A0x1 Application Notes Application Notes NVRAM Register Contents Address Group XENPAK MSA 3.0 Definition Value Dec Hex 32775 8007 Dec Hex Header XENPAK MSA version supported 30 1E Comment Rev. 3.0 32776 8008 32777 8009 NVR size in bytes 1 0 1 0 256 32778 800A 32779 800B Number of bytes used 0 181 0 B5 181 32780 800C 32781 800D Basic field address Customer field address 11 119 B 77 B 77 32782 800E 32783 800F Vendor field address Extended vendor field address 167 0 A7 0 A7 0 Reserved 0 0 0 0 0 0 Transceived type Connector 4 1 4 1 XPAK SC Encoding Bit rate 1 40 1 28 NRZ 10313 Protocol 73 1 49 1 10GBE 2 0 2 0 LR not used 32794 801A 32795 801B 0 0 0 0 not used not used 32796 801C 32797 801D 0 0 0 0 not used not used 32798 801E 32799 801F 0 0 0 0 not used not used 32800 8020 32801 8021 0 0 0 0 not used not used 3 232 3 E8 10 km 32784 8010 32785 8011 32786 8012 32787 8013 32788 8014 32789 8015 32790 8016 32791 8017 32792 8018 32793 8019 32802 8022 32803 8023 Basic Standards compliance codes Range Preliminary Product Information 17 2004-05-13 V23833-Gx104-A0x1 Application Notes NVRAM Register Contents (cont’d) Address Dec Hex 32804 8024 Group XENPAK MSA 3.0 Definition Value Comment Fiber type Dec Hex 32 20 SM Wavelength channel 0 0 1 0 1 1310 nm 255 184 FF B8 0 0 0 0 not used not used 0 0 0 0 not used not used 0 0 0 0 not used not used 0 0 0 0 not used not used 0 1 0 1 not used 00-0A-CB 32819 8033 32820 8034 67 76 43 4C 32821 8035 32822 8036 32 3 20 3 32823 8037 32824 8038 34 96 22 60 32825 8039 32826 803A 0 73 0 49 I 32827 803B 32828 803C 78 70 4E 46 N F 32829 803D 32830 803E 73 78 49 4E I N 32831 803F 32832 8040 69 79 45 4F E O 32833 8041 78 4E N 32805 8025 32806 8026 Basic 32807 8027 32808 8028 32809 8029 32810 802A 32811 802B 32812 802C Wavelength channel 1 Wavelength channel 2 32813 802D 32814 802E 32815 802F 32816 8030 32817 8031 32818 8032 Wavelength channel 3 Package OUI Vendor OUI Vendor name Preliminary Product Information 18 00-13-19 2004-05-13 V23833-Gx104-A0x1 Application Notes NVRAM Register Contents (cont’d) Address Dec Hex 32834 8042 Group Basic XENPAK MSA 3.0 Definition Vendor name Value Comment Dec Hex 32 20 32835 8043 32836 8044 70 79 46 4F F O 32837 8045 32838 8046 32 71 20 47 G 32839 8047 32840 8048 109 98 6D 62 m b 32841 8049 32842 804A 72 86 48 56 H V 32843 804B 32844 804C 50 51 32 33 2 3 32845 804D 32846 804E 32847 804F 32848 8050 56 51 38 33 8 3 51 45 33 2D 3 - 32849 8051 32850 8052 32851 8053 32852 8054 71 47 G 1) 1) 1) 48 48 31 30 1 0 32853 8055 32854 8056 32855 8057 32856 8058 53 65 34 41 4 A 48 30 0 2) 2) 2) 32857 8059 32858 805A 32859 805B 49 66 31 42 1 B 50 32 2 Vendor part number Vendor revision Preliminary Product Information 19 2004-05-13 V23833-Gx104-A0x1 Application Notes NVRAM Register Contents (cont’d) Address Group Dec Hex 32860 805C Basic 32861 805D 32862 805E XENPAK MSA 3.0 Definition Vendor serial number Value Comment Dec Hex 80 50 80 80 50 50 32863 805F 32864 8060 32865 8061 32866 8062 80 80 50 50 80 80 50 50 32867 8063 32868 8064 80 80 50 50 32869 8065 32870 8066 80 80 50 50 32871 8067 32872 8068 80 80 50 50 32873 8069 32874 806A 80 80 50 50 32875 806B 32876 806C 80 50 5 V stressed environment reference 3.3 V stressed environment reference 1 1 250 mA 1 1 500 mA APS stressed environment reference 2 2 750 mA Year code 32877 806D 32878 806E 32879 806F 32880 8070 Month code 32881 8071 32882 8072 Day code 32883 8073 32884 8074 Lot code 32885 8075 32886 8076 32887 8077 32888 8078 Preliminary Product Information 20 2004-05-13 V23833-Gx104-A0x1 Application Notes NVRAM Register Contents (cont’d) Address Dec Hex 32889 8079 Group XENPAK MSA 3.0 Definition Value Comment Nominal APS voltage Dec Hex 20 14 +1.8 V 32890 807A 32891 807B DOM capability Optional capability 195 0 C3 0 not default none 32892 807C 32893 807D reserved Basic checksum 0 0 32894 to 32941 32942 to 33030 Customer area 1) 2) 807E to 80AD 80AE to 8106 Basic Vendor specific V23833-G2104-A001: Dec = 50, Hex = 32, Comment = 2 V23833-G6104-A001: Dec = 54, Hex = 36, Comment = 6 V23833-G6104-A011: Dec = 54, Hex = 36, Comment = 6 V23833-G2104-A001: Dec = 48, Hex = 30, Comment = 0 V23833-G6104-A001: Dec = 48, Hex = 30, Comment = 0 V23833-G6104-A011: Dec = 49, Hex = 31, Comment = 1 Preliminary Product Information 21 2004-05-13 V23833-Gx104-A0x1 Application Notes PCB Cage Footprints Dimensions in mm [inches] Figure 5 File: 2203 Standard Mounting Dimensions in mm [inches] Figure 6 File: 2204 Belly-to-Belly Mounting Preliminary Product Information 22 2004-05-13 V23833-Gx104-A0x1 Application Notes Host Board Layouts 29.6 14.8 10x ∅2±0.08 [.079±.003] ⊕ ∅0.15 [.006] G H J 13.8 13.4 59.69 [2.35] 55.88 [2.2] 44.45 [1.75] 38.1 [1.5] 25.4 [1] 12.7 [.5] 6.35 [.25] 3.94 [.155] J 4.24 [.167] 9.14 [.36] 1) 2) 38.1 [1.5] 2±0.05 (70x) 0.5±0.03 (70x) H 35.51 [1.398] 40.23 [1.584] 6.6±0.38 [.26±.015] 1) 2) 7.39±0.38 [.291±.015] 3) 31.75 [1.25] 13.4 13.8 4.1 4.1 ∅1.55±0.05 19.05 [.75] 47.8 [1.882] 44.07 [1.735] 62.36 [2.455] 55.88 [2.2] 65.66 [2.585] PAD DETAIL SEE BELOW 41.91 [1.65] 35.51 [1.398] 1) Tall profile 2) Low profile 3) Flangeless 0.8 (34x) PAD SPACING PAD DETAIL 1.02 [.04] 1) 2) 0.51 [.02] 3) 41.91 [1.65] 25.3±0.12 [.996±.005] 1) 12.85±0.12 [.506±.005] 2) 10.31±0.12 [.406±.005] 3) 11.76 [.463] 1) 6.4 [.252] 2) 6.43 [.253] 3) G ⊕ ∅0.25 [.01] G H J 39.12±0.12 [1.54±.005] 1) 2) 36.5±0.12 [1.437±.005] 3) Dimensions in mm [inches] Figure 7 File: 2504 Host PCB, Board Connector Layout and Bezel Opening Preliminary Product Information 23 2004-05-13 V23833-Gx104-A0x1 Application Notes 1 GND 2 GND 3 GND 69 RESERVED 68 RESERVED 67 GND 66 TX LANE3− 65 TX LANE3+ 64 GND 63 TX LANE2− 62 TX LANE2+ 61 5.0 V 5 3.3 V 6 3.3 V 7 APS 8 APS 9 LASI 10 RESET 11 VEND SPECIFIC 12 GND 60 TX LANE1− 59 TX LANE1+ 58 GND 57 TX LANE0− 56 TX LANE0+ 55 GND 54 GND 53 GND 52 TX ON/OFF 13 RESERVED 14 MOD DETECT 15 VEND SPECIFIC 16 VEND SPECIFIC 17 MDIO 18 MDC 19 PRTAD4 20 PRTAD3 21 RX LANE3− 51 RX LANE3+ 50 GND 49 RX LANE2− 48 RX LANE2+ 47 GND 46 RX LANE1− 45 RX LANE1+ 44 GND 43 PRTAD2 22 PRTAD1 23 PRTAD0 24 VEND SPECIFIC 25 APS SET 26 RESERVED 27 APS SENSE 28 APS 29 APS 30 RX LANE0− 42 RX LANE0+ 41 GND 40 RESERVED 39 RESERVED 38 GND 37 GND 36 3.3 V 31 3.3 V 32 5.0 V 33 GND 34 GND 35 GND Lower Row Figure 8 70 GND 4 Toward Bezel GND Upper Row File: 2505 Host Board Pad Layout Preliminary Product Information 24 2004-05-13 V23833-Gx104-A0x1 Package Outlines Package Outlines Dimensions in mm Figure 9 File: 2202 XPAK with Bail De-Latch Mechanism Preliminary Product Information 25 2004-05-13 V23833-Gx104-A0x1 Package Outlines a) a) For 0-80 UNF Screw assembly see Mechanical Characteristics Dimensions in mm [inches] Figure 10 File: 2212 XPAK with No De-Latch Mechanism Preliminary Product Information 26 2004-05-13 V23833-Gx104-A0x1 Package Outlines 17.45 Laser class 8.5 2.6 Description Part number 33.5 Country of origin Optional marking (MS/ES) Dimensions in mm Figure 11 year of production week of production serial number month of production File: 2401 Label Description Dimensions in mm Figure 12 YYYY: WW: nnnnnnnn: MMMMM: File: 2211 XPAK Temperature Reference Point Preliminary Product Information 27 2004-05-13 V23833-G2104-A001, V23833-G6104-A001, V23833-G6104-A011 Revision History: 2004-05-13 Previous Version: 2004-02-24 Page DS2 Subjects (major changes since last revision) V23833-G6104-A011 added 1 Optical Features changed 2 Electrical Features changed 9 Environment: Thermal Management Recommendations changed 9 Fibers and Connectors changed 9 Cage Requirement changed 14 Table “Electrical AC CharacteristicsCharacteristics” changed 15 Table “Mechanical Characteristics” added 16 Table “Laser Data” added Figure 3 Required Labels added Figure 4 Laser Emission added 17 NVRAM Register Contents added 26 Figure 10 XPAK with No De-Latch Mechanism added 27 Figure 12 XPAK Temperature Reference Point changed Edition 2004-05-13 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2004. 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