Philips Semiconductors Product specification Triacs logic level GENERAL DESCRIPTION Glass passivated, sensitive gate triacs in a plastic envelope suitable for surface mounting, intended for use in general purpose bidirectional switching and phase control applications. These devices are intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. PINNING - SOT223 PIN BT134W series D QUICK REFERENCE DATA SYMBOL PARAMETER MAX. MAX. UNIT VDRM IT(RMS) ITSM BT134WRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current 500D 500 1 10 PIN CONFIGURATION DESCRIPTION 1 main terminal 1 2 main terminal 2 3 gate 600D 600 1 10 SYMBOL 4 T2 tab main terminal 2 V A A 2 1 T1 G 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VDRM Repetitive peak off-state voltages IT(RMS) ITSM RMS on-state current Non-repetitive peak on-state current I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature CONDITIONS MIN. - full sine wave; Tsp ≤ 108 ˚C full sine wave; Tj = 25 ˚C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs T2+ G+ T2+ GT2- GT2- G+ over any 20 ms period MAX. -500 5001 UNIT -600 6001 V - 1 A - 10 11 0.5 A A A2s -40 - 50 50 50 10 2 5 5 0.5 150 125 A/µs A/µs A/µs A/µs A V W W ˚C ˚C 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 3 A/µs. August 1997 1 Rev 1.200 Philips Semiconductors Product specification Triacs logic level BT134W series D THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient Rth j-a MIN. TYP. MAX. UNIT full or half cycle - - 15 K/W pcb mounted; minimum footprint pcb mounted; pad area as in fig:14 - 156 70 - K/W K/W MIN. TYP. MAX. UNIT T2+ G+ T2+ GT2- GT2- G+ - 2.0 2.5 2.5 5.0 5 5 5 10 mA mA mA mA T2+ G+ T2+ GT2- GT2- G+ VD = 12 V; IGT = 0.1 A IT = 2 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); Tj = 125 ˚C 0.25 - 1.6 4.5 1.2 2.2 1.2 1.2 0.7 0.4 0.1 10 15 10 15 10 1.5 1.5 0.5 mA mA mA mA mA V V V mA MIN. TYP. MAX. UNIT - 5 - V/µs - 2 - µs STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS IGT Gate trigger current VD = 12 V; IT = 0.1 A IL Latching current IH VT VGT Holding current On-state voltage Gate trigger voltage ID Off-state leakage current VD = 12 V; IGT = 0.1 A DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS dVD/dt Critical rate of change of off-state voltage Gate controlled turn-on time VDM = 67% VDRM(max); Tj = 125 ˚C; exponential waveform; RGK = 1 kΩ ITM = 1.5 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs tgt August 1997 2 Rev 1.200 Philips Semiconductors Product specification Triacs logic level BT134W series D BT134W Ptot / W 1.4 Tsp(max) / C 1.2 104 107 1.2 1 110 120 0.8 90 0.8 113 60 0.6 0.6 116 30 0.4 119 0.2 122 0 0 0.2 0.4 0.6 0.8 IT(RMS) / A 0.4 0.2 125 1.2 1 0 -50 Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle. 1000 2 50 Tsp / C 100 150 IT(RMS) / A BT134W I TSM IT T 100 0 Fig.4. Maximum permissible rms current IT(RMS) , versus solder point temperature Tsp. BT134W ITSM / A 108 C 1 = 180 1 BT134W IT(RMS) / A time 1.5 Tj initial = 25 C max dI T /dt limit 1 T2- G+ quadrant 10 0.5 1 10us 100us 1ms T/s 10ms 0 0.01 100ms Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 20ms. 12 ITSM / A 10 8 1.6 ITSM T Tj initial = 25 C max 4 0.8 2 0.6 10 100 Number of cycles at 50Hz VGT(Tj) VGT(25 C) 0.4 -50 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. August 1997 10 BT136 1.2 1 1 1 1.4 time 6 0 surge duration / s Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tsp ≤ 108˚C. BT134W IT 0.1 0 50 Tj / C 100 150 Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj. 3 Rev 1.200 Philips Semiconductors Product specification Triacs logic level 3 BT134W series D IGT(Tj) IGT(25 C) 2 BT136D Tj = 125 C Tj = 25 C T2+ G+ T2+ GT2- GT2- G+ 2.5 BT134W IT / A 1.5 Vo = 1.0 V Rs = 0.21 Ohms 2 typ 1 1.5 max 1 0.5 0.5 0 0 -50 0 50 Tj / C 100 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 IL(Tj) IL(25 C) 0 0.5 1 VT / V 1.5 2 Fig.10. Typical and maximum on-state characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 bidirectional 1 1.5 P D 1 tp 0.1 0.5 t 0 -50 0 50 Tj / C 100 0.01 10us 150 IH(Tj) IH(25C) 1ms 10ms 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp, versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj. 3 0.1ms 1000 TRIAC dVD/dt (V/us) 2.5 100 2 1.5 10 1 0.5 0 -50 0 50 Tj / C 100 1 150 50 100 150 Tj / C Fig.12. Typical, critical rate of rise of off-state voltage, dVD/dt versus junction temperature Tj. Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj. August 1997 0 4 Rev 1.200 Philips Semiconductors Product specification Triacs logic level BT134W series D MOUNTING INSTRUCTIONS Dimensions in mm. 3.8 min 1.5 min 2.3 1.5 min 6.3 (3x) 1.5 min 4.6 Fig.13. soldering pattern for surface mounting SOT223. PRINTED CIRCUIT BOARD Dimensions in mm. 36 18 60 4.5 4.6 9 10 7 15 50 Fig.14. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick). August 1997 5 Rev 1.200 Philips Semiconductors Product specification Triacs logic level BT134W series D MECHANICAL DATA Dimensions in mm 6.7 6.3 Net Mass: 0.11 g B 3.1 2.9 0.32 0.24 0.2 4 A A 0.10 0.02 16 max M 7.3 6.7 3.7 3.3 13 2 1 10 max 1.8 max 1.05 0.80 2.3 0.60 0.85 4.6 3 0.1 M B (4x) Fig.15. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". August 1997 6 Rev 1.200 Philips Semiconductors Product specification Triacs logic level BT134W series D DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1997 7 Rev 1.200