INTEGRATED CIRCUITS DATA SHEET 74AHC1G06; 74AHCT1G06 Inverter with open-drain output Product specification File under Integrated Circuits, IC06 2000 May 01 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output FEATURES DESCRIPTION • High noise immunity The 74AHC1G/AHCT1G06 is a high-speed Si-gate CMOS device. • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V The 74AHC1G/AHCT1G06 provides the inverting buffer. The output of the 74AHC1G/AHCT1G06 devices is an open drain and can be connected to other open-drain outputs to implement active-LOW, wired-OR or active-HIGH wired-AND functions. For digital operation this device must have a pull-up resistor to establish a logic HIGH-level. • Low power dissipation • SOT353 package • Output capability standard (open drain). QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT AHC1G AHCT1G tPZL propagation delay inA to outY CL = 15 pF; VCC = 5 V 2.7 3.0 ns tPLZ propagation delay inA to outY CL = 15 pF; VCC = 5 V 3.0 3.2 ns CI input capacitance CPD power dissipation capacitance 1.5 CL = 50 pF; f = 1 MHz; 3 notes 1 and 2 1.5 pF 4.5 pF Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUT OUTPUT inA outY L Z H L Note 1. H = HIGH voltage level; L = LOW voltage level; Z = high impedance OFF-state. 2000 May 01 2 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output ORDERING AND PACKAGE INFORMATION PACKAGES TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE MARKING −40 to +125 °C 5 SC-88A plastic SOT353 AR 5 SC-88A plastic SOT353 CR 74AHC1G06GW 74AHCT1G06GW PINNING PIN SYMBOL DESCRIPTION 1 n.c. not connected 2 inA data input 3 GND ground (0 V) 4 outY data output 5 VCC DC supply voltage handbook, halfpage n.c. 1 inA 2 GND 3 5 VCC handbook, halfpage 2 06 4 inA outY 4 outY MNA584 MNA583 Fig.1 Pin configuration. 2000 May 01 Fig.2 Logic symbol. 3 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output outY handbook, halfpage handbook, halfpage inA 2 4 outY inA MNA585 GND Fig.3 IEC logic symbol. MNA586 Fig.4 Logic diagram. RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL PARAMETER 74AHCT CONDITIONS UNIT MIN. TYP. MAX. MIN. TYP. MAX. VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V VI input voltage 0 − 5.5 0 − 5.5 V VO output voltage active mode 0 − VCC 0 − VCC V high-impedance mode 0 − 6.0 0 − 6.0 V −40 +25 +85 −40 +25 +85 °C Tamb operating ambient temperature see DC and AC characteristics per device −40 +25 +125 −40 +25 +125 °C tr, tf (∆t/∆f) input rise and fall time ratios (except for Schmitt-trigger inputs) VCC = 3.3 ±0.3 V − − 100 − − − ns/V VCC = 5 ±0.5 V − − 20 − − 20 ns/V 2000 May 01 4 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC supply voltage −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK DC input diode current − −20 mA IOK DC output clamping diode VO < −0.5 V; note 1 current VI < −0.5 V; note 1 − ±20 mA VO output voltage active mode; note 1 −0.5 VCC + 0.5 V high-impedance mode; note 1 −0.5 7.0 V IO DC output sink current VO > −0.5 V − ±25 mA ICC DC VCC or GND current − ±75 mA Tstg storage temperature −65 +150 °C PD power dissipation per package − 200 mW for temperature range: −40 to +125 °C; note 2 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 °C the value of PD derates linearly with 2.5 mW/K. 2000 May 01 5 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output DC CHARACTERISTICS 74AHC1G family Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (°C) TEST CONDITIONS SYMBOL OTHER VIH VIL VOL VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 1.5 − − 1.5 − 1.5 − V 3.0 2.1 − − 2.1 − 2.1 − V 5.5 3.85 − − 3.85 − 3.85 − V 2.0 − − 0.5 − 0.5 − 0.5 V 3.0 − − 0.9 − 0.9 − 0.9 V 5.5 − − 1.65 − 1.65 − 1.65 V 2.0 − 0 0.1 − 0.1 − 0.1 V 3.0 − 0 0.1 − 0.1 − 0.1 V 4.5 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 4 mA 3.0 − − 0.36 − 0.44 − 0.55 V VI = VIH or VIL; IO = 8 mA 4.5 − − 0.36 − 0.44 − 0.55 V − 1.0 − 2.0 µA ±2.5 − ±10.0 µA HIGH-level input voltage LOW-level input voltage LOW-level output voltage −40 to +85 25 PARAMETER VI = VIH or VIL; IO = 50 µA II input leakage current VI = VCC or GND 5.5 − − 0.1 IOZ 3-state output OFF-state current 5.5 VI = VIH or VIL; VO = VCC or GND − − ±0.25 − ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 1.0 − 10 − 20 µA CI input capacitance − − 1.5 10 − 10 − 10 pF 2000 May 01 6 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output 74AHCT1G family Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 OTHER VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VIH HIGH-level input voltage 4.5 to 5.5 2.0 − − 2.0 − 2.0 − V VIL LOW-level input voltage 4.5 to 5.5 − − 0.8 − 0.8 − 0.8 V VOL LOW-level output voltage VI = VIH or VIL; IO = 50 µA 4.5 − 0 0.1 − 0.1 − 0.1 V VI = VIH or VIL; IO = 8 mA 4.5 − − 0.36 − 0.44 − 0.55 V − 1.0 − 2.0 µA ±2.5 − ±10.0 µA II input leakage current VI = VCC or GND 5.5 − − 0.1 IOZ 3-state output OFF-state current VI = VIH or VIL; 5.5 VO = VCC or GND − − ±0.25 − ICC quiescent supply current VI = VCC or GND; 5.5 IO = 0 − − 1.0 − 10 − 20 µA ∆ICC additional quiescent supply current per input pin VI = 3.4 V; other inputs at VCC or GND; IO = 0 4.5 to 5.5 − − 1.35 − 1.5 − 1.5 mA CI input capacitance − 1.5 10 − 10 − 10 pF 2000 May 01 − 7 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output AC CHARACTERISTICS Type 74AHC1G06 GND = 0 V; tr = tf ≤ 3.0 ns. TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 WAVEFORMS CL MIN. TYP. MAX. MIN. MAX. −40 to +125 MIN. UNIT MAX. VCC = 3.0 to 3.6 V; note 1 tPZL tPLZ tPZL tPLZ propagation delay inA to outY see Figs 5 and 6 15 pF − 3.7 7.0 1.0 7.7 1.0 8.1 ns − 4.8 6.4 1.0 6.9 1.0 7.4 ns propagation delay inA to outY see Figs 5 and 6 50 pF − 5.2 10.0 1.0 11.0 1.0 11.5 ns − 6.9 10.0 1.0 10.5 1.0 11.0 ns propagation delay inA to outY see Figs 5 and 6 15 pF − 2.7 4.9 1.0 5.3 1.0 5.6 ns − 3.0 4.1 1.0 4.6 1.0 5.1 ns propagation delay inA to outY see Figs 5 and 6 50 pF − 3.8 7.0 1.0 7.5 1.0 8.0 ns − 4.3 6.5 1.0 7.0 1.0 7.5 ns VCC = 4.5 to 5.5 V; note 2 tPZL tPLZ tPZL tPLZ Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. Type 74AHCT1G06 GND = 0 V; tr = tf ≤ 3.0 ns. Tamb (°C) TEST CONDITIONS SYMBOL −40 to +85 25 PARAMETER WAVEFORMS CL MIN. −40 to +125 TYP. MAX. MIN. MAX. MIN. MAX. UNIT VCC = 4.5 to 5.5 V; note 1 tPZL tPLZ tPZL tPLZ propagation delay inA to outY see Figs 5 and 6 15 pF − 3.0 5.3 1.0 6.0 1.0 6.3 ns − 3.2 4.6 1.0 5.1 1.0 5.6 ns propagation delay inA to outY see Figs 5 and 6 50 pF − 4.2 7.5 1.0 8.5 1.0 9.0 ns − 4.5 7.0 1.0 7.5 1.0 8.0 ns Note 1. Typical values at VCC = 5.0 V. 2000 May 01 8 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output AC WAVEFORMS VI handbook, full pagewidth VM(1) inA input GND t PZL t PLZ VCC outY output VM(2) VOL + 0.3 V VOL MNA587 FAMILY VI INPUT REQUIREMENTS VM(1) INPUT VM(2) OUTPUT AHC1G GND to VCC 50% VCC 50% VCC AHCT1G GND to 3.0 V 1.5 V 50% VCC Fig.5 The input inA to output outY propagation delays. S1 handbook, full pagewidth VCC PULSE GENERATOR VI RL = 1000 Ω VO VCC open GND D.U.T. CL RT MNA232 TEST S1 tPLH/tPHL open tPLZ/tPZL VCC tPHZ/tPZH GND Definitions for test circuit: CL = Load capacitance including jig and probe capacitance (see Chapter “AC characteristics”). RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.6 Load circuitry for switching times. 2000 May 01 9 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT353 D E B y X A HE 5 v M A 4 Q A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E (2) e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 2000 May 01 REFERENCES IEC JEDEC EIAJ SC-88A 10 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2000 May 01 11 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 May 01 12 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2000 May 01 13 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output NOTES 2000 May 01 14 Philips Semiconductors Product specification 74AHC1G06; 74AHCT1G06 Inverter with open-drain output NOTES 2000 May 01 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613507/01/pp16 Date of release: 2000 May 01 Document order number: 9397 750 07039