PHILIPS TDA8442

INTEGRATED CIRCUITS
DATA SHEET
TDA8442
I2C-bus interface for colour
decoders
Product specification
File under Integrated Circuits, IC01
March 1991
Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
GENERAL DESCRIPTION
The TDA8442 provides control of four analogue functions
and has one high-current and two switching outputs.
Control of the IC is performed via the two-line, bidirectional
I2C-bus.
Features
PACKAGE OUTLINE
• Four analogue control outputs
16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 23.
• One high-current output port (npn open emitter)
• Two switching output ports (npn collector with internal
pull-up resistor)
• I2C-bus slave receiver
• Power-down reset.
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX
UNIT
VP
10.8
12.0
13.2
V
Supply current
no outputs loaded
IP
8
13
18
mA
Total power dissipation
no outputs loaded
Ptot
−
−
1
W
Tamb
−20
−
+ 70
°C
Supply voltage (pin 9)
Operating ambient
temperature range
Fig.1 Block diagram.
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
PINNING
PIN
SYMBOL
DESCRIPTION
1
DAC1
analogue output 1
2
DAC2
analogue output 2
3
DAC3
analogue output 3
4
SDA
serial data line; I2C-bus
5
SCL
serial clock line; I2C-bus
6
P2
Port 2 npn collector output
with internal pull-up
resistor
7
n.c.
not connected
8
GND
supply return (ground)
9
VP
positive supply voltage
10
n.c.
not connected
11
P1
Port 1 open npn emitter
output
12
P2N
inverted P2 output
13
n.c.
not connected
14
n.c.
not connected
15
n.c.
not connected
16
DAC0
analogue output 0
Fig.2 Pinning diagram
FUNCTIONAL DESCRIPTION
Control
Analogue control is facilitated by four 6-bit digital-to-analogue converters (DAC0 to DAC3).
The values of the output voltages from the DACs are set via the I2C-bus.
The high-current output port (P1) is suitable for switching between internal and external RGB signals.
It is an open npn emitter output capable of sourcing 14 mA (min.).
The two output ports (P2 and P2N) can be used for NTSC/PAL switching. These are npn collector outputs with internal
pull-up resistors of 10 kΩ (typ.). Both outputs are capable of sinking up to 2 mA with a voltage drop of less than 400 mV.
If one output is switched on (LOW), the other output is switched off, and vice versa.
Reset
The power-down-reset mode occurs whenever the positive supply voltage falls below 8.5 V (typ.) and resets all registers
to a defined state.
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
OPERATION
Write
The TDA8442 is controlled via the I2C-bus (specifications for the I2C-bus will be supplied on request).
Programming of the TDA8442 is performed using the format shown in Fig.3.
Fig.3 TDA8442 programming format.
Acknowledge (A) is generated by the TDA8442 only when a valid address is received and the device is not in the
power-down-reset mode (VP > 8.5 V (typ.)).
Control
Control is implemented by the instruction bytes POD (port output data) and DACX (digital-to-analogue converter control)
together with the corresponding data/control bytes (see Fig.4).
Fig.4 Control porgramming.
POD bit P1
If a logic 1 is programmed, the P1 output is switched on. If a logic 0 is programmed or after a power-down-reset, the P1
output is switched off (high-impedance state).
POD bit P2/P2N
If a logic 1 is programmed, the P2 output is switched off and the P2N output is switched on (LOW). If a logic 0 is
programmed or after a power-down-reset, the P2 output is switched on (LOW) and the P2N output is switched off.
DAX bits AX5 to AX0
The digital-to-analogue converter selected corresponds to the decimal equivalent of the two bits X1 and X0. The output
voltage of the selected DAC is programmed using bits AX5 to AX0, the lowest value being with all data AX5 to AX0 at
logic 0 or when power-down-reset has been activated.
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
VP
−0.3
+13.2
V
pin 4
VSDA
−0.3
+13.2
V
pin 5
VSCL
−0.3
+13.2
V
pin 6
VP2
−0.3
VP; note 1
V
pin 11
VP1
−0.3
VP; note 1
V
pin 12
VP2N
−0.3
VP; note 1
V
pin 1 to 3 and pin 16
Supply voltage range (pin 9)
Input/output voltage ranges
VDAX
−0.3
VP; note 1
V
Total power dissipation
Ptot
−
1
W
Operating ambient temperature range
Tamb
−20
+70
°C
Storage temperature range
Tstg
−55
+150
°C
Note
1. Pin voltage may exceed VP if the current in that pin is limited to 10 mA.
CHARACTERISTICS
VP = 12 V; Tamb = +25 °C; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supplies
Supply voltage (pin 9)
Supply current (pin 9)
VP
10.8
12.0
13.2
V
no outputs loaded
IP
8
13
18
mA
note 1
VIH
3.0
−
VP − 1
V
VIL
−0.3
−
1.5
V
I2C-bus inputs
SDA (pin 4); SCL (pin 5)
Input voltage HIGH
Input voltage LOW
Input current HIGH
note 1
IIH
−
−
10
µA
Input current LOW
note 1
IIL
−
−
10
µA
VOL
−
−
0.4
V
IOL
3
5
−
mA
I2C-bus output
SDA (pin 4)
open collector
Output voltage LOW
IOL = 3.0 mA
Maximum output sink current
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
PARAMETER
TDA8442
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Ports P2 and P2N
(pins 6 and 12)
npn collector output with
pull-up resistor to VP
Internal pull-up resistor to VP
RO
5
10
15
kΩ
VOL
−
−
0.4
V
Maximum output sink current
IOL
2
5
−
mA
Leakage current output
switched off
− Ileak
−
−
25
µA
Output voltage switched
on (LOW)
IOL = 2 mA
Port P1 (pin 11)
open npn emitter output
Output current switched on
VO = 0 to 5 V
Leakage current switched off VO = 0 to VP
Digital-to-analogue
outputs
IO
14
−
−
mA
± Ileak
−
−
100
µA
note 2
DAC0 (pin 16)
Maximum output voltage
unloaded; note 3
VO max
3.0
−
4.25
V
Minimum output voltage
unloaded; note 3
VO min
0.15
−
1.0
V
Positive value of smalles
step
IO = 2 mA (1 lsb); note 3
VO lsb
16
−
72
mV
Deviation from linearity
IO = 2 mA
∆V
−
−
45
mV
Output impedance
IO = −2 to +2 mA
ZO
−
−
30
Ω
Maximum output source
current
−IOH
2
−
6
mA
Maximum output sink current
IOL
2
8
−
mA
DAC1 (pin 1)
Maximum output voltage
unloaded; note 3
VO max
4.0
−
5.0
V
Minimum output voltage
unloaded; note 3
VO min
1.0
−
1.7
V
Positive value of smallest
step
IO = 2 mA (1 lsb); note 3
VO lsb
18
−
86
mV
Deviation from linearity
IO = 2 mA
∆V
−
−
50
mV
Output impedance
IO = −2 to +2 mA
ZO
−
−
30
Ω
Maximum output source
current
−IOH
2
−
6
mA
Maximum output sink current
IOL
2
8
−
mA
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
PARAMETER
TDA8442
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
DAC2 (pin 2)
Maximum output voltage
unloaded; note 3
VO max
4.0
−
5.0
V
Minimum output voltage
unloaded; note 3
VO min
1.0
−
1.7
V
Positive value of smallest
step
IO = 2 mA (1 lsb); note 3
VO lsb
18
−
86
mV
Deviation from linearity
IO = 2 mA
∆V
−
−
50
mV
Output impedance
IO = −2 to +2 mA
ZO
−
−
30
Ω
Maximum output source
current
−IOH
2
−
6
mA
Maximum output sink current
IOL
2
8
−
mA
DAC3 (pin 3)
Maximum output voltage
unloaded; note 3
VO max
10.0
−
11.2
V
Minimum output voltage
unloaded; note 3
VO min
0.1
−
1.0
V
Positive value of smallest
step
IO = 2 mA (1 lsb); note 3
VO lsb
70
−
250
mV
Deviation from linearity
IO = 2 mA
∆V
−
−
150
mV
Output impedance
IO = −2 to +2 mA
ZO
−
−
30
Ω
Maximum output source
current
−IOH
2
−
6
mA
Maximum output sink current
IOL
2
8
−
mA
VPD
6
−
10
V
5
−
−
µs
Power-down reset
Maximum value of VP at
which power-down reset is
active
Rise time of VP during
power-on
VP rising from 0 V to VPD tr
Notes to the Characteristics
1. If VP < 1 V, the input current is limited to 10 µA at input voltages up to 13.2 V.
2. Pure capacitive load should be avoided because of possible oscillations.
3. Values are proportional to VP.
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
I2C-BUS TIMING
Bus loading conditions: 4kΩ pull-up resistor to +5 V; 200 pF capacitor to GND.
All values are referred to VIH = 3 V and VIL = 1.5 V.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Bus free before start
tBUF
4.0
−
−
µs
Start condition set-up time
tSU; STA
4.0
−
−
µs
Start condition hold time
tHD; STA
4.0
−
−
µs
LOW period SCL, SDA
tLOW
4.0
−
−
µs
HIGH period SCL
tHIGH
4.0
−
−
µs
Rise time SCL, SDA
tr
−
−
1.0
µs
Fall time SCL, SDA
tf
−
−
0.30
µs
Data set-up time (write)
tSU; DAT
1
−
−
µs
Data hold time (write)
tHD; DAT
1
−
−
µs
Acknowledge (from TDA8442) set-up time tSU; ACK
−
−
3.5
µs
Acknowledge (from TDA8442) hold time
tHD; ACK
0
−
−
µs
Stop condition set-up time
tSU; STO
4.0
−
−
µs
Reference levels are 10 and 90%.
Fig.5 I2C-bus timing; TDA8442.
March 1991
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Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
March 1991
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
9
Philips Semiconductors
Product specification
I2C-bus interface for colour decoders
TDA8442
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
March 1991
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