INTEGRATED CIRCUITS DATA SHEET TDA8442 I2C-bus interface for colour decoders Product specification File under Integrated Circuits, IC01 March 1991 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 GENERAL DESCRIPTION The TDA8442 provides control of four analogue functions and has one high-current and two switching outputs. Control of the IC is performed via the two-line, bidirectional I2C-bus. Features PACKAGE OUTLINE • Four analogue control outputs 16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 23. • One high-current output port (npn open emitter) • Two switching output ports (npn collector with internal pull-up resistor) • I2C-bus slave receiver • Power-down reset. QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX UNIT VP 10.8 12.0 13.2 V Supply current no outputs loaded IP 8 13 18 mA Total power dissipation no outputs loaded Ptot − − 1 W Tamb −20 − + 70 °C Supply voltage (pin 9) Operating ambient temperature range Fig.1 Block diagram. March 1991 2 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 PINNING PIN SYMBOL DESCRIPTION 1 DAC1 analogue output 1 2 DAC2 analogue output 2 3 DAC3 analogue output 3 4 SDA serial data line; I2C-bus 5 SCL serial clock line; I2C-bus 6 P2 Port 2 npn collector output with internal pull-up resistor 7 n.c. not connected 8 GND supply return (ground) 9 VP positive supply voltage 10 n.c. not connected 11 P1 Port 1 open npn emitter output 12 P2N inverted P2 output 13 n.c. not connected 14 n.c. not connected 15 n.c. not connected 16 DAC0 analogue output 0 Fig.2 Pinning diagram FUNCTIONAL DESCRIPTION Control Analogue control is facilitated by four 6-bit digital-to-analogue converters (DAC0 to DAC3). The values of the output voltages from the DACs are set via the I2C-bus. The high-current output port (P1) is suitable for switching between internal and external RGB signals. It is an open npn emitter output capable of sourcing 14 mA (min.). The two output ports (P2 and P2N) can be used for NTSC/PAL switching. These are npn collector outputs with internal pull-up resistors of 10 kΩ (typ.). Both outputs are capable of sinking up to 2 mA with a voltage drop of less than 400 mV. If one output is switched on (LOW), the other output is switched off, and vice versa. Reset The power-down-reset mode occurs whenever the positive supply voltage falls below 8.5 V (typ.) and resets all registers to a defined state. March 1991 3 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 OPERATION Write The TDA8442 is controlled via the I2C-bus (specifications for the I2C-bus will be supplied on request). Programming of the TDA8442 is performed using the format shown in Fig.3. Fig.3 TDA8442 programming format. Acknowledge (A) is generated by the TDA8442 only when a valid address is received and the device is not in the power-down-reset mode (VP > 8.5 V (typ.)). Control Control is implemented by the instruction bytes POD (port output data) and DACX (digital-to-analogue converter control) together with the corresponding data/control bytes (see Fig.4). Fig.4 Control porgramming. POD bit P1 If a logic 1 is programmed, the P1 output is switched on. If a logic 0 is programmed or after a power-down-reset, the P1 output is switched off (high-impedance state). POD bit P2/P2N If a logic 1 is programmed, the P2 output is switched off and the P2N output is switched on (LOW). If a logic 0 is programmed or after a power-down-reset, the P2 output is switched on (LOW) and the P2N output is switched off. DAX bits AX5 to AX0 The digital-to-analogue converter selected corresponds to the decimal equivalent of the two bits X1 and X0. The output voltage of the selected DAC is programmed using bits AX5 to AX0, the lowest value being with all data AX5 to AX0 at logic 0 or when power-down-reset has been activated. March 1991 4 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER SYMBOL MIN. MAX. UNIT VP −0.3 +13.2 V pin 4 VSDA −0.3 +13.2 V pin 5 VSCL −0.3 +13.2 V pin 6 VP2 −0.3 VP; note 1 V pin 11 VP1 −0.3 VP; note 1 V pin 12 VP2N −0.3 VP; note 1 V pin 1 to 3 and pin 16 Supply voltage range (pin 9) Input/output voltage ranges VDAX −0.3 VP; note 1 V Total power dissipation Ptot − 1 W Operating ambient temperature range Tamb −20 +70 °C Storage temperature range Tstg −55 +150 °C Note 1. Pin voltage may exceed VP if the current in that pin is limited to 10 mA. CHARACTERISTICS VP = 12 V; Tamb = +25 °C; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supplies Supply voltage (pin 9) Supply current (pin 9) VP 10.8 12.0 13.2 V no outputs loaded IP 8 13 18 mA note 1 VIH 3.0 − VP − 1 V VIL −0.3 − 1.5 V I2C-bus inputs SDA (pin 4); SCL (pin 5) Input voltage HIGH Input voltage LOW Input current HIGH note 1 IIH − − 10 µA Input current LOW note 1 IIL − − 10 µA VOL − − 0.4 V IOL 3 5 − mA I2C-bus output SDA (pin 4) open collector Output voltage LOW IOL = 3.0 mA Maximum output sink current March 1991 5 Philips Semiconductors Product specification I2C-bus interface for colour decoders PARAMETER TDA8442 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Ports P2 and P2N (pins 6 and 12) npn collector output with pull-up resistor to VP Internal pull-up resistor to VP RO 5 10 15 kΩ VOL − − 0.4 V Maximum output sink current IOL 2 5 − mA Leakage current output switched off − Ileak − − 25 µA Output voltage switched on (LOW) IOL = 2 mA Port P1 (pin 11) open npn emitter output Output current switched on VO = 0 to 5 V Leakage current switched off VO = 0 to VP Digital-to-analogue outputs IO 14 − − mA ± Ileak − − 100 µA note 2 DAC0 (pin 16) Maximum output voltage unloaded; note 3 VO max 3.0 − 4.25 V Minimum output voltage unloaded; note 3 VO min 0.15 − 1.0 V Positive value of smalles step IO = 2 mA (1 lsb); note 3 VO lsb 16 − 72 mV Deviation from linearity IO = 2 mA ∆V − − 45 mV Output impedance IO = −2 to +2 mA ZO − − 30 Ω Maximum output source current −IOH 2 − 6 mA Maximum output sink current IOL 2 8 − mA DAC1 (pin 1) Maximum output voltage unloaded; note 3 VO max 4.0 − 5.0 V Minimum output voltage unloaded; note 3 VO min 1.0 − 1.7 V Positive value of smallest step IO = 2 mA (1 lsb); note 3 VO lsb 18 − 86 mV Deviation from linearity IO = 2 mA ∆V − − 50 mV Output impedance IO = −2 to +2 mA ZO − − 30 Ω Maximum output source current −IOH 2 − 6 mA Maximum output sink current IOL 2 8 − mA March 1991 6 Philips Semiconductors Product specification I2C-bus interface for colour decoders PARAMETER TDA8442 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT DAC2 (pin 2) Maximum output voltage unloaded; note 3 VO max 4.0 − 5.0 V Minimum output voltage unloaded; note 3 VO min 1.0 − 1.7 V Positive value of smallest step IO = 2 mA (1 lsb); note 3 VO lsb 18 − 86 mV Deviation from linearity IO = 2 mA ∆V − − 50 mV Output impedance IO = −2 to +2 mA ZO − − 30 Ω Maximum output source current −IOH 2 − 6 mA Maximum output sink current IOL 2 8 − mA DAC3 (pin 3) Maximum output voltage unloaded; note 3 VO max 10.0 − 11.2 V Minimum output voltage unloaded; note 3 VO min 0.1 − 1.0 V Positive value of smallest step IO = 2 mA (1 lsb); note 3 VO lsb 70 − 250 mV Deviation from linearity IO = 2 mA ∆V − − 150 mV Output impedance IO = −2 to +2 mA ZO − − 30 Ω Maximum output source current −IOH 2 − 6 mA Maximum output sink current IOL 2 8 − mA VPD 6 − 10 V 5 − − µs Power-down reset Maximum value of VP at which power-down reset is active Rise time of VP during power-on VP rising from 0 V to VPD tr Notes to the Characteristics 1. If VP < 1 V, the input current is limited to 10 µA at input voltages up to 13.2 V. 2. Pure capacitive load should be avoided because of possible oscillations. 3. Values are proportional to VP. March 1991 7 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 I2C-BUS TIMING Bus loading conditions: 4kΩ pull-up resistor to +5 V; 200 pF capacitor to GND. All values are referred to VIH = 3 V and VIL = 1.5 V. PARAMETER SYMBOL MIN. TYP. MAX. UNIT Bus free before start tBUF 4.0 − − µs Start condition set-up time tSU; STA 4.0 − − µs Start condition hold time tHD; STA 4.0 − − µs LOW period SCL, SDA tLOW 4.0 − − µs HIGH period SCL tHIGH 4.0 − − µs Rise time SCL, SDA tr − − 1.0 µs Fall time SCL, SDA tf − − 0.30 µs Data set-up time (write) tSU; DAT 1 − − µs Data hold time (write) tHD; DAT 1 − − µs Acknowledge (from TDA8442) set-up time tSU; ACK − − 3.5 µs Acknowledge (from TDA8442) hold time tHD; ACK 0 − − µs Stop condition set-up time tSU; STO 4.0 − − µs Reference levels are 10 and 90%. Fig.5 I2C-bus timing; TDA8442. March 1991 8 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE March 1991 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 9 Philips Semiconductors Product specification I2C-bus interface for colour decoders TDA8442 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. March 1991 10