INTEGRATED CIRCUITS DATA SHEET TDA6106Q Video output amplifier Product specification File under Integrated Circuits, IC02 1997 Mar 03 Philips Semiconductors Product specification Video output amplifier TDA6106Q FEATURES GENERAL DESCRIPTION • No external heatsink required The TDA6106Q is a monolithic video output amplifier with a 6 MHz bandwidth and is contained in a 9-lead plastic DIL-bent-SIL medium power package. The device uses high-voltage DMOS technology and is intended to drive the cathode of a CRT. To obtain maximum performance, the amplifier should be used with black current control. • Black current measurement output for Automatic Black current Stabilization (ABS) • Internal 2.5 V reference circuit • Internal protection against positive appearing CRT flashover discharges • Single supply voltage of 200 V • Simple application with a variety of colour decoders • Controlled switch-off behaviour. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA6106Q DESCRIPTION DBS9MPF VERSION plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1 BLOCK DIAGRAM handbook, full pagewidth feedback output supply voltage 6 n.c. n.c. n.c. 9 1 2 7 MIRROR 1 in MIRROR 2 out Vbias out 1× in 8 1× TDA6106Q CURRENT SOURCE 5 inverting input 3 − DIFFERENTIAL + STAGE out out out out MIRROR 3 black current measurement output in gnd 4 ground (substrate) Fig.1 Block diagram. 1997 Mar 03 cathode output 2 MBG343 Philips Semiconductors Product specification Video output amplifier TDA6106Q PINNING SYMBOL PIN DESCRIPTION n.c. 1 not connected n.c. 2 not connected Vin 3 inverting input voltage GND 4 ground, substrate Iom 5 black current measurement output VDD 6 n.c. handbook, halfpage n.c. 1 n.c. 2 Vin 3 GND 4 supply voltage Iom 5 7 not connected VDD 6 Voc 8 cathode output voltage n.c. 7 Vof 9 feedback output voltage Voc 8 Vof 9 TDA6106Q MBG342 Fig.2 Pin configuration. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages with respect to pin 4 (ground) unless otherwise specified; currents specified as in Fig.1. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage 0 250 V Vin inverting input voltage 0 8 V Vom black current measurement output voltage 0 6 V Voc cathode DC output voltage 0 VDD V Vof feedback output voltage 0 VDD V Ioc(l) low non-repetitive peak cathode output current flashover discharge = 100 µC; note 1 0 5 A Ioc(h) high non-repetitive peak cathode output current flashover discharge = 100 nC; note 2 0 10 A Pmax maximum power dissipation 0 tbf W Tstg storage temperature −55 +150 °C Tj junction temperature −20 +150 °C Vesd electrostatic discharge note 3 −2000 +2000 V note 4 −300 +300 V Notes 1. The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance flash) of 5 A maximum with a charge content of 100 µC. 2. The cathode output is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 10 A maximum with a charge content of 100 nC. 3. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor. 4. Machine model: equivalent to discharging a 200 pF capacitor through a 0 Ω resistor. 1997 Mar 03 3 Philips Semiconductors Product specification Video output amplifier TDA6106Q HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ). QUALITY SPECIFICATION Quality specification “SNW-FQ-611 part E” is applicable, except for ESD Human body model see Chapter “Limiting values”, and can be found in the “Quality reference handbook” (ordering number 9397 750 00192). THERMAL CHARACTERISTICS PARAMETER(1) SYMBOL VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air 56 K/W Rth j-c thermal resistance from junction to case 12 K/W Note 1. External heatsink not required. CHARACTERISTICS Operating range: Tamb = −20 to +65 °C; VDD = 180 to 210 V (see note 1), Vom = 1.4 to 6 V. Test conditions: Tamb = 25 °C; VDD = 200 V; Vom = 4 V; CL = 10 pF (CL consists of parasitic and cathode capacitance); measured in test circuit of Fig.5; unless otherwise specified. SYMBOL PARAMETER CONDITIONS IDD quiescent voltage supply current VocDC = 100 V Ibias input bias current (pin 3) Vint Iom(os) offset current of black current measurement output ∆VTint MIN. TYP. MAX. UNIT 2.8 3.0 3.3 mA VocDC = 100 V 0 − 20 µA internal reference voltage input stage VocDC = 100 V − 2.5 − V Ioc = 0 µA; Vin = 1.5 to +3.5 V; Vom = 1.4 to 6 V −10 0 +10 µA temperature drift of internal reference voltage input stage VocDC = 100 V − 0.5 − mV/K ∆I om -----------∆I oc linearity of current transfer Ioc = −10 µA to 3 mA; Vin = 1.5 to +3.5 V; Vom = 1.4 to 6 V 0.9 1.0 1.1 Iof(max) maximum peak output current (pin 9) Voc = 20 V to VDD −30 V − 25 − Voc(min) minimum output voltage (pin 8) Vin = 3.5 V − 7 12 V Voc(max) maximum output voltage (pin 8) Vin = 1.5 V VDD − 14 VDD − 10 − V GB gain bandwidth product of open-loop gain Vos/Vi, dm f = 500 kHz; VocDC = 100 V − 0.52 − GHz BWS small signal bandwidth VocAC = 60 V (p-p); VocDC = 100 V 5 6 − MHz BWL large signal bandwidth VocAC = 100 V (p-p); VocDC = 100 V 4.7 5.7 − MHz 1997 Mar 03 4 mA Philips Semiconductors Product specification Video output amplifier SYMBOL PARAMETER TDA6106Q CONDITIONS MIN. TYP. MAX. UNIT tpd cathode output propagation delay time 50% input to 50% output Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 38 49 60 ns tr cathode output rise time 10% output to 90% output Voc = 50 to 150 V square wave; f < 1 MHz; tfin = 40 ns; see Fig.4 62 74 87 ns tf cathode output fall time 90% output to Voc = 150 to 50 V square 10% output wave; f < 1 MHz; trin = 40 ns; see Fig.4 62 74 87 ns ts settling time 50% input to (99% < output < 101%) Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 − − 350 ns SR slew rate between 50 and 150 V Vin = 2 V (p-p) square wave; f < 1 MHz; trin = tfin = 40 ns − 1200 − V/µs OV cathode output voltage overshoot Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 − 1 − % PSRR power supply rejection ratio f < 50 kHz; note 2 − 60 − dB Notes 1. The rating of supply voltage is 250 V, but because of flash the maximum operating range for supply voltage is 210 V. 2. PSSR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. 1997 Mar 03 5 Philips Semiconductors Product specification Video output amplifier TDA6106Q x Vi 0 t x ts overshoot (in %) Voc 151 150 140 149 100 60 50 t tr MGA974 t pd Fig.3 Output voltage (pin 8 rising edge) as a function of AC input signal. 1997 Mar 03 6 Philips Semiconductors Product specification Video output amplifier TDA6106Q x Vi 0 t x ts 150 140 Voc 100 overshoot (in %) 51 60 50 49 t tf MGA975 t pd Fig.4 Output voltage (pin 8 falling edge) as a function of AC input signal. Flashover protection VDD to GND must be decoupled: The TDA6106Q incorporates a protection diode against CRT flashover discharges that clamp the cathode output voltage to a maximum of VDD + Vdiode. To limit the diode current, an external 1.5 kΩ carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor-value, the CRT has to be connected to the main PCB). This addition produces an increase in the rise and fall times of approximately 7.5 ns and a decrease in the overshoot of approximately 1.3%. 1. With a capacitor larger than 20 nF with good HF behaviour (e.g. foil). This capacitor must be placed as close as possible to pins 6 and 4, but definitely within 5 mm. 1997 Mar 03 2. With a capacitor larger than10 µF on the picture tube base print (shared by three output stages). Switch-off behaviour The output pins of the TDA6106Q are still under the control of the input pin for a supply voltage down to approximately 30 V. 7 Philips Semiconductors Product specification Video output amplifier TDA6106Q TEST AND APPLICATION INFORMATION Cpar handbook, full pagewidth Rfb C1 Vin R10 100 kΩ 22 nF R9 C2 866 Ω 200 V C6 100 nF 22 µF Cn 560 pF 6 R1 50 Ω 3 0.98 mA 9 TDA6106Q 8 4 C8 5 C7 A 3.2 pF Vom 4V 6.8 pF R3 20 MΩ probe C9 136 pF R2 1 MΩ GND MBG344 Cpar = 150 fF. Fig.5 Test circuit with feedback factor 1⁄116. Dissipation The dynamic dissipation equals: With respect to dissipation, distinction must be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). P dyn = V DD × ( C L + C fb + C int ) × f × V o ( p – p ) × b Where: CL = load capacitance. The static dissipation of the TDA6106Q is due to supply currents and load currents in the feedback network and CRT. P stat Cfb = feedback capacitance. Cint = internal load capacitance (≈ 4 pF). f = input frequency. V of = V DD × I DD + V oc × I oc – V of × -------- R fb Vo(p-p) = output voltage (peak-to-peak value). b = non-blanking duty-cycle. Where: The IC must be mounted on the picture tube base print to minimize the load capacitance (CL). Rfb = value of feedback resistor. Ioc = DC value of cathode current. 1997 Mar 03 8 Philips Semiconductors Product specification Video output amplifier TDA6106Q INTERNAL PIN CONFIGURATION handbook, full pagewidth GND VDD 4 6 from input circuit TDA6106Q esd esd esd Vin 9 Vbias from reference circuit Vof from input circuit 3 esd flash prot. Iom esd from pin 9 5 flash prot. 8 from pin 9 6.8 V esd from reference circuit to BCS-circuit output MBG345 Fig.6 Internal pin configuration. 1997 Mar 03 9 Voc Philips Semiconductors Product specification Video output amplifier TDA6106Q PACKAGE OUTLINE DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1 D D1 A2 q P P1 Q A3 q2 q1 A seating plane A4 E pin 1 index c L 1 9 e2 b e Z b2 0 θ w M b1 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mm 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20 L P P1 3.9 3.4 2.75 2.50 3.4 3.2 Q q 1.75 15.1 1.55 14.9 q1 q2 w Z (1) max. θ 4.4 4.2 5.9 5.7 0.25 1.0 65o 55o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT111-1 1997 Mar 03 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification Video output amplifier TDA6106Q The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/01/pp12 Date of release: 1997 Mar 03 Document order number: 9397 750 01869