MB39C601, TRIAC Dimmable LED Driver IC for LED Lighting Datasheet.pdf

MB39C601
TRIAC Dimmable LED Driver IC for
LED Lighting
MB39C601 is a flyback type switching regulator contorller IC. The LED current is regulated by controlling the switching on-time or
controlling the switching frequency, depending on the LED load.
It is most suitable for the general lighting applications, for example stocks of commercial and residential light bulbs and so on.
Features
 High power factor in single conversion
 High efficiency at the light load, at Low Power Mode (LPM) Burst Operation in switching frequency control
 Frequency setting depend on the FB pin current
: 30 kHz to 130 kHz
 Control of the current of Primary Winding without the external sense resistor
 TRIAC Dimmable LED lighting
 Helps to achieve high efficiency and low EMI by detecting transformer zero energy
 Built-in under voltage lock out function
 Built-in over load protection function
 Built-in output over voltage protection function
 Built-in over temperature protection function
 LED load
:25W (Max)
 Input voltage range VDD
: 9V to 20V
 Input voltage range for LED lighting applications
: AC110VRMS, AC230VRMS
 Package
: SOP-8 (3.9mm × 5.05mm × 1.75mm [Max])
Applications
 LED lighting
 TRIAC dimmable LED lighting etc.
Cypress Semiconductor Corporation
Document Number: 002-08393 Rev.*A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 25, 2016
MB39C601
Contents
1.
2.
3.
4.
5.
6.
7.
8.
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
9.
9.1
9.2
9.3
9.4
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
Pin Assignment ............................................................................................................................................................ 3
Pin Descriptions........................................................................................................................................................... 3
Block Diagram (On-time control application) ............................................................................................................ 4
Absolute Maximum Ratings ........................................................................................................................................ 5
Recommended Operating Conditions ........................................................................................................................ 6
Electrical Characteristics ............................................................................................................................................ 7
Typical Characteristics .............................................................................................................................................. 10
Function Explanation ................................................................................................................................................ 12
LED Current Control Function ..................................................................................................................................... 12
Cascode Switching ...................................................................................................................................................... 12
Natural PFC (Power Factor Correction) Function ........................................................................................................ 12
Power-Up Sequencing................................................................................................................................................. 13
Power Down Sequencing ............................................................................................................................................ 14
OTM Part ..................................................................................................................................................................... 15
PCL Part ...................................................................................................................................................................... 16
FB Part ........................................................................................................................................................................ 17
TZE Part ...................................................................................................................................................................... 19
Various Protection Circuits ....................................................................................................................................... 21
Under Voltage Lockout Protection (UVLO) .................................................................................................................. 21
Over Voltage Proteciton (OVP) ................................................................................................................................... 21
Over Load Protection (OL) .......................................................................................................................................... 21
Over Temperature Protection (OTP) ........................................................................................................................... 21
Various Function Tables ........................................................................................................................................... 22
I/O Pin Equivalent Circuit Diagram ........................................................................................................................... 23
Example Application Circuit ..................................................................................................................................... 25
Usage Precaution....................................................................................................................................................... 29
Ordering Information ................................................................................................................................................. 30
RoHS Compliance Information of Lead (Pb) Free Version ..................................................................................... 30
Marking Format (Lead Free Version) ........................................................................................................................ 30
Labeling Sample (Lead Free Version) ...................................................................................................................... 31
MB39C601PNF Recommended Conditions of Moisture Sensitivity Level ............................................................ 32
Package Dimensions ................................................................................................................................................. 34
Major Changes ........................................................................................................................................................... 35
Document History ...................................................................................................................................................... 36
Document Number: 002-08393 Rev.*A
Page 2 of 37
MB39C601
1. Pin Assignment
(TOP VIEW)
FB
1
8
VDD
TZE
2
7
GND
PCL
3
6
DRN
OTM
4
5
VCG
(FPT-8P-M02)
2. Pin Descriptions
Pin No.
Pin Name
I/O
1
FB
I
Switching frequency setting pin.
2
TZE
I
Transformer auxiliary winding zero energy detecting pin.
3
PCL
I
Pin for controlling peak current of transformer primary winding.
4
OTM
I
On-time setting pin.
5
VCG
-
External MOSFET gate bias pin.
6
DRN
O
External MOSFET source connection pin.
7
GND
-
Ground pin.
8
VDD
-
Power supply pin.
Document Number: 002-08393 Rev.*A
Description
Page 3 of 37
VIN
AC
Document Number: 002-08393 Rev.*A
CVDD
1
CBULK
1
1
1
OTM
1
TZE
FB
VDD
4
2
1
8
IFB
13V
IOTM
OV
Fault
3V
1V
VGATE
On-Time Modulation
and Fault Response
Control
5V
20mV
Shutdown
and Restart
Latch or
Retry
Zero Energy
Detect
Feedback
Processing
Modulators
1.5μA<IFB<210µA
Low Power Mode
210µA<IFB
Over Load
IFB<1.5µA
IFB
10V/8V
UVLO
10V/6V
Fault Latch
Reset
D
IFB
Thermal
Shutdown
Q
Q
1/tSW
Fault Latch
Reset
UVLO
VVCG
Shunt
VVDD
Switch
2V
14V
Current
Sense
VGATE
Discharge
Freq. Modulator
Enable
PWM
Fault
Enable
PWM
IFB
Fault Timing
and Control
VVCG
LDO
IFB
IFB
MB39C601
IP
Current
Modulator
Driver
HS
Drive
3
7
6
5
PCL
GND
DRN
VCG
1
1
DBIAS
D1
1
CVCG
Rst
1
2
1
2
Co
2
2
Rs
Vs
MB39C601
3. Block Diagram (On-time control application)
Page 4 of 37
MB39C601
4. Absolute Maximum Ratings
Rating
Parameter
Power supply voltage
Input voltage
Input current
Output current
Power dissipation
Storage temperature
Symbol
Condition
Min
Max
Unit
VVDD
VDD pin
-0.3
+25.0
V
VDRN
DRN pin
-
+20.0
V
VVCG
VCG pin
-0.3
+16.0
V
VTZE
TZE pin
-0.3
+6.0
V
VOTM
OTM pin
-0.3
+6.0
V
VPCL
PCL pin
-0.3
+6.0
V
VFB
FB pin
-0.3
+2.0
V
IVCG
VCG pin
-
10
mA
IOTM
OTM pin
-1
0
mA
IPCL
PCL pin
-1
0
mA
IFB
FB pin
0
1
mA
IDRN
DRN pin
-
800
mA
IDRN
DRN pin,
Pulsed 400ns, 2% duty cycle
-1.5
+6.0
A
PD
Ta ≤ +25°C
-
800*
mW
-55
+125
°C
TSTG
*:The value when using two layers PCB.
Reference: θja (wind speed 0m/s): 125°C/W
WARNING:
Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage,
current or temperature) in excess of absolute maximum ratings.
Do not exceed any of these ratings.
Document Number: 002-08393 Rev.*A
Page 5 of 37
MB39C601
5. Recommended Operating Conditions
Parameter
Symbol
Condition
Min
Value
Typ
Max
Unit
VDD pin input voltage
VDD
VDD pin
9
-
20
V
VCG pin input voltage
VCG
VCG pin (from low-impedance
source)
9
-
13
V
VCG pin input current
IVCG
VCG pin (from high-impedance
source)
10
-
2000
µA
OTM pin
Shutdown/retry mode
10
-
100
kΩ
OTM pin
Latch-off mode
150
-
750
kΩ
24.3
-
200.0
kΩ
OTM pin ground resistance
ROTM
PCL pin ground resistance
RPCL
PCL pin
TZE pin connection
resistance
RTZE1
TZE pin
Auxiliary winding connection resistor
50
-
200
kΩ
VCG pin grounded capacity
CVCG
VCG pin
33
-
200
nF
VDD pin bypass capacity
CBP
Ceramic capacitor value to set
between VDD and GND pin
0.1
-
1.0
µF
Operating ambient
temperature
Ta
-
-40
+25
+85
°C
WARNING:
The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of
the device's electrical characteristics are warranted when the device is operated under these conditions.
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and could result
in device failure.
No warranty is made with respect to any use, operating conditions or combinations not represented on this data
sheet. If you are considering application under any conditions other than listed herein, please contact sales
representatives beforehand.
Document Number: 002-08393 Rev.*A
Page 6 of 37
MB39C601
6. Electrical Characteristics
(Ta = +25°C, VVDD = 12V)
Parameter
Condition
5
Value
Unit
Typ
Max
VVDD=14V, IVCG=2.0mA
13
14
15
V
5
VVDD=12V, IVCG=26µA,
IFB=350µA
15
16
17
V
ΔVCG
5
VCG(DISABLED)VCG(OPERATING)
1.75
2.00
2.15
V
VCG Shunt input
current
IVCG(SREG)
5
VVCG=VCG(DISABLED)100mV, VVDD=12V
-
12
26
µA
VCG Shunt Load
Regulation
ΔVCG(SREG)
5
26µA<IVCG ≤ 5mA, IFB=350µA
-
125
200
mV
VCG LDO
regulation voltage
VCG(LREG)
5
VVDD=20V, IVCG=-2mA
-
13
-
V
-
VDD-VCG,
VVDD=11V, IVCG=-2mA
-
2.0
2.8
V
VCG voltage
(Operating)
(OPERATING)
VCG voltage
(Disable)
(DISABLED)
VCG LDO
Dropout voltage
VCG
VCG
VCG
(LREG, DO)
UVLO Turn-on
threshold voltage
VDD(ON)
8
-
9.7
10.2
10.7
V
UVLO Turn-off
threshold voltage
VDD(OFF)
8
-
7.55
8.00
8.50
V
UVLO hysteresis
ΔVDD(UVLO)
8
VDD(ON) - VDD(OFF)
1.9
2.2
2.5
V
6,8
VVCG=12V, VVDD=7V,
IDRN=50mA
-
4*
10*
Ω
8
-
5.6
6.0
6.4
V
VDD switch onresistance
Fault Latch Reset
VDD voltage
RDS, ON (VDD)
VDD
(FAULT RESET)
Minimum
switching period
tSW(HF)
6
FM mode IFB=5µA
7.215
7.760
8.305
µs
Maximum
switching period
tSW(LF)
6
IFB=IFB, CNR3 -20µA
31.5
35.0
38.5
µs
6
IFB=5µA, IPCL=100μA
-
3*
-
A
6
IFB=5µA, IPCL=30μA
-
1*
-
A
IDRN (peak, absmin)
6
RPCL =OPEN
-
0.45*
-
A
tBLANK (ILIM)
6
IFB=5µA, RPCL=100kΩ,
1.2A pull-up on DRN
-
400*
-
Ns
3
IFB=5µA
2.94
3.00
3.06
V
3
IFB=230µA
0.95
1.00
1.05
V
DRN peak current
Minimum peak
current for RPCL
open
ILIM blanking time
MODULATION
Pin
No.
Min
VCG voltage
difference
VDD and
VCG SUPPLY
Symbol
IDRN(peak)
PCL voltage
VPCL
IFB range for
FM mode
IFB, CNR1
1
tS=tS(LF), IDRN=IDRN(peak, max)
145
165
195
µA
IFB range for
AM mode
IFB,CNR2IFB,CNR1
1
tS=tS(LF) , IDRN(peak) variation
range= IDRN(peak, max) to
IDRN(peak, min)
35
45
65
µA
IFB range for LPM
IFB,CNR3IFB,CNR2
1
-
50
70
90
µA
IFB hysteresis for
LPM
IFB, LPM-HYST
1
-
10
25
40
µA
VFB
1
IFB=10µA
0.34
0.70
0.84
V
FB voltage
Document Number: 002-08393 Rev.*A
Page 7 of 37
MB39C601
Min
Value
Typ
Max
IDRN=4.0A
-
200*
400*
mΩ
6,7
VDRN=12V
-
1.5
20.0
µA
RDS(on)(HSDRV)
5,6
High-side
Driver current=50mA
-
6*
11*
Ω
IDIS
6,7
VDD=OPEN, DRN=12V,
Fault latch set
2.38
3.40
4.42
mA
VTZE(TH)
2
-
5*
20*
50*
mV
TZE clamp
voltage
VTZE(CLAMP)
2
ITZE= -10µA
-200
-160
-100
mV
Start timer
operation
threshold voltage
VTZE(START)
2
-
0.10
0.15
0.20
V
Driver turn-on
Delay time
tDRY(TZE)
6
150Ω pull-up 12V on DRN
-
150
-
Ns
Wait time for zero
energy detection
tWAIT(TZE)
6
-
2.0
2.4
2.8
µs
Start timer period
tST
6
VTZE=0V
150
240
300
µs
VTZE(OVP)
2
-
4.85
5.00
5.15
V
tBLANK, OVP
6
-
0.6
1.0
1.7
Symbol
Pin
No.
Condition
RDS(on)(DRN)
6,7
IDRN(OFF)
High-side driver
on-resistance
DRN discharge
current
Parameter
Driver onresistance
DRIVER
Driver off leakage
current
TZE zero energy
threshold voltage
TRANSFORMER
ZERO ENERGY
DETECTION
OVP threshold
voltage
OVERVOLTAGE
FAULT
OVP blanking time
MAXIMUM ON
TIME
OTP
µs
µA
Input bias current
ITZE(bias)
2
VTZE=5V
-0.1
0
+0.1
Over Load
detection current
IFB(OL)
1
-
0*
1.5*
3.0*
µA
Over Load delay
time
tOL
6
IFB=0A
200
250
300
Ms
tRETRY
6
ROTM=76kΩ
-
750
-
Ms
Over Load
detection
boundary
resistance
ROTM(TH)
4
-
100
120
150
kΩ
Shutdown
Threshold voltage
VOTM(Vth)
4
0.7
1.0
1.3
V
Shutdown OTM
current
IOTM, PU
4
VOTM = VOTM(vth)
-600
-450
-300
µA
6
ROTM=383kΩ
3.74
4.17
4.60
µs
OVERLOAD FAULT Retry time after
Over Load
SHUTDOWN
THRESHOLD
Unit
OTM=
ON-Time
tOTM
6
ROTM=76kΩ
3.4
3.8
4.2
µs
OTM voltage
VOTM
4
-
2.7
3.0
3.3
V
Protection
temperature
TSD
-
Tj, temperature rising
-
+150*
-
°C
Protection
temperature
hysteresis
TSD_HYS
-
Tj, temperature falling,
degrees below TSD
-
25*
-
°C
Document Number: 002-08393 Rev.*A
Page 8 of 37
MB39C601
Parameter
Symbol
IVDD
Power supply
current
POWER SUPPLY
CURRENT
(STATIC)
IVDD
(OPERATING)
Pin
No.
Condition
8
Value
Unit
Min
Typ
Max
VVDD=20V, VTZE=1V
1.36
1.80
2.34
mA
8
VVDD=20V
-
3.0*
3.7*
mA
Power supply
current for LPM
IVDD(LPM)
8
IFB=350µA
-
550
900
µA
Power supply
current for UVLO
IVDD(UVLO)
8
VVDD= VDD(ON) - 100mV
-
285
500
µA
*: Standard design value
Document Number: 002-08393 Rev.*A
Page 9 of 37
MB39C601
7. Typical Characteristics
Power supply current vs. Ta
4.0
3.8
3.8
3.6
3.6
3.4
3.4
IDD+ICG [mA]
IDD [mA]
Power supply current vs. VDD
4.0
3.2
3.0
2.8
3.2
3.0
2.8
2.6
2.6
2.4
2.4
VDD; decreasing from 20V
VCG=OPEN
IFB=5µA
2.2
2.0
2.0
8
10
12
14
16
VDD=12V
VCG=12V
IFB=5µA
2.2
18
20
-40 -30 -20 -10
0
+10 +20 +30 +40 +50 +60 +70 +80
-35 -25 -15
-5
+5 +15 +25 +35 +45 +55 +65 +75 +85
Ta [°C]
VDD [V]
Switching frequency vs. IFB
DRN peak current vs. IFB
160
3.5
140
3.0
120
Ta=+25°C
Ta=+85°C
2.5
IDRN(peak) [A]
100
fSW [kHz]
Ta=-25°C
80
60
Ta=-40°C
40
Ta=+25°C
Ta=+85°C
2.0
1.5
1.0
0.5
20
0
0.0
0
50
100
150
200
250
300
0
50
100
IFB [µA]
150
200
250
300
IFB [uA]
DRN peak current vs. IPCL
ON time vs. ROTM
3.5
6
3.0
5
2.5
tOTM [us]
IDRN(peak) [A]
4
2.0
1.5
Shutdown/
Retry
(1)
3
Latch-off
(2)
2
1.0
0.5
Ta=-40°C
Ta=+25°C
Ta=+85°C
1
n=30
0
0.0
0
20
40
60
IPCL [µA]
Document Number: 002-08393 Rev.*A
80
100
0
100
200
300
400
500
600
ROTM [kΩ]
Page 10 of 37
MB39C601
Driver ON resistance vs. Ta
High-side Driver ON resistance vs. Ta
12
400
11
350
10
9
RDS(on)(HSDRN) [W]
RDS(on)(DRN) [mΩ]
300
250
200
150
8
7
6
5
4
3
100
2
50
1
0
0
-40 -30 -20 -10 0 +10 +20 +30 +40 +50 +60 +70 +80
-35 -25 -15 -5 +5 +15 +25 +35 +45 +55 +65 +75 +85
-40 -30 -20 -10
0 +10 +20 +30 +40 +50 +60 +70 +80
-35 -25 -15 -5
+5 +15 +25 +35 +45 +55 +65 +75 +85
Ta [°C]
Ta [°C]
Power dissipation vs.Ta
1000
900
Power dissipation [mW]
800
700
600
500
400
300
200
100
0
-50 -40 -30 -20 -10
0 +10 +20 +30 +40 +50 +60 +70 +80 +90 +100
Ta[°C]
Document Number: 002-08393 Rev.*A
Page 11 of 37
MB39C601
8. Function Explanation
8.1
LED Current Control Function
MB39C601 is a flyback type switching regulator controller. The LED current is regulated by controlling the switching on-time or
controlling the switching frequency depending on the LED load.
The LED current is converted into detecting voltage (Vs) by sense resistor (Rs) connected in series with LED. Vs is compared by
an external error amplifier (Err AMP).When Vs falls below a reference voltage, Err AMP output rises and the current that flows into
the Opto-Coupler is decreased.
The OTM pin current is controlled via the Opto-Coupler in the on-time control block. In on-time control, it controls on-time at OTM
pin current. So, on-time increases when the current of the OTM pin decreases. And the average current supplied to LED is
regulated, because on-time is regulated at the constant switching frequency.
The FB pin current is controlled via the Opto-Coupler in the switching frequency control block. In switching frequency control, it
controls switching frequency at FB pin current. So, switching frequency becomes high when the current of the FB pin decreases.
And the average current supplied to LED is regulated, because switching frequency is regulated at the constant on-time.
8.2
Cascode Switching
The switch in Primary Winding is a cascode connection.The gate of external MOSFET is connected with the VCG pin, and the
source is connected with the drain of internal Driver MOSFET.
When the swich is on-state, internal Driver MOSFET is turned on, HS Driver MOSFET is turned off, and the source voltage of
external MOSFET goes down to GND. For this period the DC bias is supplied to the gate of external MOSFET from the VCG pin.
Therefore external MOSFET is turned on.
When the switch is off-state, internal Driver MOSFET is turned off, HS Driver MOSFET is turned on, and the source voltage of
external MOSFET goes up to VCG voltage. For this period the DC bias is supplied to the gate of external MOSFET from VCG pin.
Therefore external MOSFET is turned off.
Moreover, the current flowing into internal Driver MOSFET is equal to the current of Primary Winding. Therefore, the peak current
into Primary Winding can be detected without the sense resistor.
8.3
Natural PFC (Power Factor Correction) Function
In the AC voltage input, when the input current waveform is brought close to the sine-wave, and the phase difference is brought
close to Zero, Power Factor is improved.
In the flyback method operating in discontinuous conduction mode, when the input capacitance is set small, the input current
almost becomes equal with peak current of Primary Winding.
t
V
I PEAK = BULK × ON
LMP
=
VBULK
LMP
tON
VBULK
: Supply voltage of Primary Winding
LMP
: Inductance of Primary Winding
tON
: On-time
In on-time control, if loop response of Error Amp. is set to lower than the AC frequency (below 1/10 of the AC frequency), on-time
can be constant. Therefore, input current is proportional to input voltage, so Power Factor is regulated.
Document Number: 002-08393 Rev.*A
Page 12 of 37
MB39C601
8.4
Power-Up Sequencing
When the voltage is input to VBULK, the electric charge is charged to capacitance of the VCG pin (CVCG) through starting resistor
(Rst). So, the voltage of the VCG pin rises. The voltage of the DRN pin rises by source follower when the voltage of the VCG pin
reaches the threshold voltage of the external HVMOSFET.
The DRN pin is connected with the VDD pin through the internal VDD Switch, and VDD capacitor (CVDD) is charged from the DRN
pin. When the voltage at the VDD pin reaches the threshold voltage of UVLO, the VDD Switch is turned off, and the internal Bias
circuit operates, and the switching is started.
After the switching begins, the voltage at the VDD pin is supplied from Auxiliary Winding through the external diode (DBIAS). The
voltage of an Auxiliary Winding is decided by rolling number ratio of Auxiliary Winding and Secondary Winding, and the voltage of
Secondary Winding. Therefore, the voltage at the VDD pin is not supplied, until the voltage of Auxiliary Winding rises more than the
voltage at the VDD pin. In this period, it is necessary to set the capacitor of the VDD pin to prevent the voltage of the VDD pin from
falling below the threshold voltage of UVLO.
The external Schottky diode (D1) is required between the DRN pin and VDD pin. This diode is used to prevent the current that
flows through the body diode of the VDD Switch.
Current Passing When Starting
VBULK
Rst
Primary
Winding
Ist
HV-MOSFET
CVCG
D1
VDD Start-up Current
CVDD
DBIAS
VDD Operating and LPM Current
VDD
Auxiliary
Winding
VCG
8
5
VDD
Switch
HS
Drive
VCG
Shunt
UVLO
10V/8V
Enable
PWM
14V
DRN
6
2V
Fault
Driver
PWM
Control
Document Number: 002-08393 Rev.*A
7
GND
Page 13 of 37
MB39C601
Power-Up Sequencing
UVLO threshold
UVLO threshold
8.5
Power Down Sequencing
When AC power is removed from the AC line, the current does not flow to Secondary Winding even if HV MOSFET is switching.
The LED current is supplied from the output capacitance and decreases gradually. Similarly, the voltage at the VDD pin decreases
because the current does not flow into Auxiliary Winding. The switching stops and MB39C601 becomes shutdown when the
voltage at the VDD pin falls below the threshold voltage of UVLO.
Power Down Sequencing
UVLO threshold 8V
Document Number: 002-08393 Rev.*A
Page 14 of 37
MB39C601
8.6
OTM Part
It is set on-time by connecting resistor (ROTM) with the OTM pin. As shown in following figure, the on-time can be controlled by
connecting the collector of the Opto-Coupler through resistor from OTM.
OTM pin Control
The following figure shows how the on-time is programmed over the range of between 1.5μs and 5.0μs for either range of
programming resistors. The resistor range determines the controller response to a sustained overload fault (to either latch-off or to
shutdown/retry). See the item of the overload protection about details of "latch-off" and "shutdown/retry". On-time is related to the
programmed resistor based on the following equations.
(1) ROTM = tOTM × (2 × 1010 [
Ω
s
(2) ROTM = tOTM × (0.918 × 1011 [
])
Ω
s
])
On-time Setting Range
Moreover, it can be shutted down by making the voltage of the OTM pin below "VOTM (Vth) (typ 1V)".
Document Number: 002-08393 Rev.*A
Page 15 of 37
MB39C601
8.7
PCL Part
It is set the peak current of Primary Winding by connecting resistor with the PCL pin.
The maximum peak current of Primary Side is set by connecting resistor (RPCL) between the PCL pin and GND.
IDRN(pk) = (
100kV
)
RPCL
An about 400ns blanking time of the beginning of switching cycle is masking the spike noise. As a result, it prevents the sense of
current from malfunctioning (See the figure below.).
Peak Current Control with PCL pin
DRN
6
IDRN
From
High-Voltage
MOSFET Source
Driver
VGATE
Current
Sense
t BLANKCL
GND
7
From
Optocoupler
Emitter
I FB
FB
IFB
1
Current Modulator
I DRNPK
3
1
IFB, µA
I PCL
165 210
VPCL, V
3
1
IFB, µA
165 210
PCL
3
RPCL
Document Number: 002-08393 Rev.*A
Page 16 of 37
MB39C601
8.8
FB Part
The switching frequency is controlled by setting the current of the FB pin. In on-time control, the switching frequency is set by
pulling up the FB pin to VDD. Moreover, as shown in following figure, it is possible to control the switching frequency by connecting
the emitter of the Opto-Coupler from the FB pin through resistor. Resistor (RFB) is connected to bleed off the dark current of OptoCoupler.
FB pin Control
IFB
RFB
Filter
IFB
FB
1
CFB
Filter
RFB
Feedback
Processing
Modulators
1.5µA<IFB<210µA
Low Power Mode
210µA<IFB
Over Load
IFB<1.5µA
MB39C601 becomes the following three modes by FB current (I FB).
1. Frequency Modulation Mode (FM)
The peak current of HV-MOSFET is set to the maximum, and the LED current is regulated by adjusting the switching frequency
with IFB.The range of the switching frequency is from 30 kHz to 130 kHz. Maximum peak current IDRN (peak, max) of HVMOSFET is set by the resistance of the PCL pin.
2. Amplitude Modulation Mode (AM)
The LED current is regulated by adjusting the peak current of HV-MOSFET with IFB.The switching frequency is about 30 kHz.
And the range of HV-MOSFET of the peak current is from 33% to 100% of the maximum. Maximum peak current IDRN (peak,
max) of HV-MOSFET is set by the resistance of the PCL pin.
3. Low Power Mode (LPM)
MB39C601 becomes two states of LPM-ON and LPM-OFF at a light load. In the LPM-ON mode, it is operated at 30 kHz
switching frequency. And the current is supplied to LED. At this time, the feedback current from the Opto-Coupler increases, and
it changes to the LPM-OFF mode. In the LPM-OFF mode, it is not operated. And the current is supplied to LED from Co. When
the feedback current from the Opto-Coupler decreases, it changes to the LPM-ON mode. LED is lit by the power saving
repeating these two states.
Three modes of the FM, AM, and LPM change depending on the load of LED. At the light load, three modes change from FM to
AM to LPM.
Document Number: 002-08393 Rev.*A
Page 17 of 37
MB39C601
Switching Frequency and Peak Current Control Operation Based On FB pin
Document Number: 002-08393 Rev.*A
Page 18 of 37
MB39C601
8.9
TZE Part
MB39C601 requires all of the following three conditions in order to start the next switching cycle.
1. The time since the last turn-on edge must be equal to or longer than the switching time set by I FB.
2. The time since the last turn-on edge must be longer than the minimum switching period set by MB39C601 (nominally 7.5µs
which equals 133 kHz).
3. Immediately after zero energy detection at the TZE pin. Or, the time since the last zero energy detection must be longer than
tWAIT, (TZE) (2.4μs or less).
Starting switching cycle diagram
The TZE pin is connected with Auxiliary Winding of the transformer through the resistance division, and detects zero energy as
shown "TZE pin Connection".
A delay, 50ns to 200ns, can be added with CTZE to adjust the turn-on of the primary switch with the resonant bottom of Primarty
Winding waveform.
Switching Waveform at detecting zero Energy
Document Number: 002-08393 Rev.*A
Page 19 of 37
MB39C601
TZE pin Connection
NP
NS
NB
1
RTZE1
Zero Energy
Detect
TZE
2
RTZE2
CTZE
20mV
OV
Fault
Fault Timing
and Control
5V
Document Number: 002-08393 Rev.*A
Page 20 of 37
MB39C601
9. Various Protection Circuits
9.1
Under Voltage Lockout Protection (UVLO)
The under voltage lockout protection (UVLO) protects IC from malfunction and protects the system from destruction/deterioration
during the transient state and momentary drop due to start up for the power supply pin voltage (VDD). The voltage decrease of the
VDD pin is detected with comparator, and output HS DRIVER is turned off and output DRIVER is turned off, and the switching is
stopped.The system returns if the VDD pin becomes more than the threshold voltage of the UVLO circuit.
9.2
Over Voltage Proteciton (OVP)
When LED is in the state of open and the output voltage rises too much, the voltage of Auxiliary Winding and the voltage of the
TZE pin rise. The over voltage is detected by sampling this voltage of the TZE pin. When TZE pin voltage rises more than the
threshold voltage of OVP, the over voltage is detected. Output HS DRIVER is turned off, and output DRIVER is turned off, and the
switching is stopped. (latch-off)
If the VDD pin becomes below the voltage of Fault Latch Reset, OVP is released.
9.3
Over Load Protection (OL)
When the cathode or the anode of LED is short to GND and it becomes an overloaded status at switching frequency control, the
current does not flow into Rs and there is no current feedback to IFB. The current of the FB pin detects the overload with 1.5µA or
less. OL state is decided to latch-off or shutdown/retry by ROTM.
Shutdown/retry
…
MB39C601 becomes two states of switching on for 250ms and switching off for 750ms. These
states are repeated. If it is not OL status, it returns.
Latch-off
…
The switching is continued for 250ms. If it does not return from OL states for this period, output HS
DRIVER is turned off, and output DRIVER is turned off, and the switching is stopped. If it returns
from OL states after this time and the switching is still stopped (latch-off) and the VDD pin
becomes below the voltage of Fault Latch Reset, Latch is released.
Over Load Protection Sequencing
9.4
Over Temperature Protection (OTP)
The over temperature protection (OTP) is a function to protect IC from the thermal destruction.When the junction temperature
reaches +150°C,output HS DRIVER is turn off, and output DRIVER is turned off, and the switching is stopped.It returns again when
the junction temperature falls to +125°C (automatic recovery).
Document Number: 002-08393 Rev.*A
Page 21 of 37
MB39C601
10. Various Function Tables
VDD SW
Discharge
SW
Detection
Condition at
Protected
Operation
OFF
OFF
-
-
DRN
Function
LS_DRV
HS_DRV
Normal Operation
Under Voltage Lockout
Protection (UVLO)
OTM
Shutdown
Over Voltage Protection
(OVP)
Shutdown/
Retry
Over Load Mode
Protection
(OL)
Latch-Off
Mode
Stopped state of Low
Power Mode
Over Temperature
Protection (OTP)
Return
Condition
Remarks
-
OFF
OFF
ON
OFF
VDD < 8.0V
VDD > 10.2V
Standby
OFF
OFF
ON
OFF
OTM = GND
OTM > 1V
Standby
OFF
OFF
ON
ON
TZE > 5V
VDD < 6V
→
VDD > 10.2V
Latch-off
OFF
OFF
IFB < 1.5µA
32.6k < ROTM <
100kΩ
IFB > 1.5µA
Shutdown
Retry OL
Timer
(250ms)
Shutdown
Retry Fault
(750ms)
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
IFB < 1.5µA
150k < ROTM <
459kΩ
VDD < 6V
→
VDD > 10.2V
OFF
OFF
ON
OFF
IFB > 280µA
IFB < 255µA
-
OFF
OFF
ON
OFF
Tj > +150°C
Tj < +125°C
-
Document Number: 002-08393 Rev.*A
Latch-off
Page 22 of 37
MB39C601
11. I/O Pin Equivalent Circuit Diagram
Pin No.
Pin
Name
1
FB
2
TZE
3
PCL
Document Number: 002-08393 Rev.*A
Equivalent Circuit Diagram
Page 23 of 37
MB39C601
Pin No.
4
Pin
Name
Equivalent Circuit Diagram
OTM
5
VCG
6
DRN
Document Number: 002-08393 Rev.*A
Page 24 of 37
MB39C601
12. Example Application Circuit
Document Number: 002-08393 Rev.*A
Page 25 of 37
MB39C601
Part list
Vac 90V to 145V 50Hz/60Hz (Typ110V) Iout 390mA
No.
Component
Description
1
U1
IC PWM CTRLR CASCODE 8-SOIC
MB39C601
2
U2
OPTO ISOLATOR TRANSISTOR OUTPUT
PS2561L-1-A
3
U3, U4, U5
IC OPAMP GP R-R 1MHZ SGL SOT23-5
LMV321IDBVR
TI
4
VR1
SUR ABSORBER 7MM 430V 1250A ZNR
ERZ-V07D431
Panasonic
5
BR1
IC RECT BRIDGE 0.5A 600V 4SOIC
MB6S
6
T1*
TRANSFORMER FLYBACK EE20/10/6
430µH RATIO Np/Ns=2.91/1 Np/Na=5.33/1
750811148
7
F1
FUSE PICO FAST 2.5A 250V AXIAL
026302.5WRT1L
8
L1
IND COMMON MODE CHOKE 40MH
750311650
Wurth
9
L2
JUMPER (RES 0.0Ω 1206)
RK73Z2B
KOA
10
Q1
MOSFET N-CH 650V 7.3A TO-220FP
SPA07N60C3
11
Q2
TRANSISTOR NPN 100V 1A SOT-89
FCX493TA
12
Q6
TRANSISTOR NPN GP 40V SOT23
MMBT3904-TP
13
C1*
CAP .47UF/400VDC METAL POLY
ECQ-E4474KF
14
C2
CAP CER 15000PF 250V X7R 1206
GRM31BR72E153KW01L
muRata
15
C3
CAP CER 10000PF 50V X7R 0603
GRM188R71H103KA01D
muRata
16
C4
CAP CER .1UF 25V X7R 10% 0603
GRM188R71E104KA01D
17
C5
CAP 100UF 25V ELECT RADIAL 2.5MM
EEU-FC1E101S
18
C6,C7
CAP CER 2.2UF 100V X7R 1210
GRM32ER72A225KA35
muRata
19
C8
CAP 560UF 50V ELECT HE RADIAL
UPW1H561MHD
Nichicon
20
C9
CAP .056UF/630VDC METAL POLY
ECQ-E10223KF
Panasonic
21
C10, C15, C17,
C18, C19
CAP CER 10000PF 50V X7R 0603
GRM188R71H103KA01D
muRata
22
C11
CAP CER 2.2NF X1/Y1 RADIAL
DE1E3KX222MA4BL01
muRata
23
C12
CAP CER 220PF 630VDC U2J 1206
GRM31A7U2J221JW31D
muRata
24
C13
CAP CER 0.33UF 16V X7R 0603
GRM188R71C334KA01
muRata
25
C14
CAP CER 1UF 16V X7R 0805
GRM21BR71C105KA01#
muRata
26
C16
CAP CER .1UF 25V 0805
GRM21BR71E104KA01#
muRata
27
C21
CAP .022UF/305VAC X2 METAL POLYPRO
B32921C3223M
Epcos
28
D1
DIODE ULTRA FAST 800V 1A SMA
RS1K-13-F
Diodes
29
D3
DIODE ULTRA FAST 200V SOT-23
MMBD1404
Fairchild
30
D4
DIODE ZENER 18V 225MW SOT-23
BZX84C18LT1
On Semi
31
D5
DIODE GPP FAST 1A 600V DO-41
UF4005
Fairchild
32
D6
DIODE GPP FAST 1A 600V SMA
RS1J
Fairchild
33
D8
SHUNT REGULATOR 5.0V SOT-23
LM4040C50IDBZT
34
D9
DIODE, SWITCHING 70V SC-70
BAW56WT1
35
R1, R2, R31
RES 560kΩ 1/4W 1% 0805 SMD
RK73H2ATTD5603F
36
R3, R6, R15
RES 100kΩ 1/10W 1% 0603 SMD
ERJ-3EKF1003V
37
R4
RES 75.0kΩ 1/4W 5% 1206 SMD
RK73B2BTTD753J
38
R5
RES 510Ω METAL FILM 2W 5%
ERG-2SJ511A
Panasonic
39
R7
RES 464kΩ 1/10W 1% 0603 SMD
ERJ-3EKF4643V
Panasonic
40
R8
RES 4.42kΩ 1/10W 1% 0603 SMD
ERJ-3EKF4421V
Panasonic
Document Number: 002-08393 Rev.*A
Part No.
Vendor
Cypress
CEL
Fairchild
Wurth
Littelfuse
Infineon
Diodes
Micro
Commercial
Panasonic
muRata
Panasonic
TI
On Semi
KOA
Panasonic
KOA
Page 26 of 37
MB39C601
No.
Component
Description
Part No.
Vendor
41
R9
RES 39.2Ω 1/8W 5% 0805 SMD
RK73B2ATTD390J
42
R10
RES 1.0kΩ METAL FILM 2W 5%
ERG-2SJ102A
43
R11
RES 110kΩ 1/8W 5% 0805 SMD
RK73B2ATTD114J
44
R12
RES 33.2kΩ 1/10W 1% 0603 SMD
ERJ-3EKF3322V
Panasonic
45
R13
RES 40.2kΩ 1/10W 1% 0603 SMD
ERJ-3EKF4022V
Panasonic
46
R14
RES 634kΩ1/10W 1% 0603 SMD
ERJ-3EKF6343V
Panasonic
47
R16
RES 5.1Ω 1/10W 1% 0603 SMD
RK73H1JTTD5R10F
48
R17
RES 3.00Ω 1/8W 1% 0805 SMD
RK73H2ATTD3R00F
49
R18
RES 10.0kΩ 1/10W 1% 0603 SMD
ERJ-3EKF1002V
Panasonic
KOA
Panasonic
KOA
KOA
KOA
50
R19
RES .33Ω 1/4W 1% 1206 SMD
ERJ-8RQFR33V
Panasonic
`51
R20
RES 301kΩ 1/10W 1% 0603 SMD
ERJ-3EKF3013V
Panasonic
52
R21
RES 71.5kΩ 1/10W 1% 0603 SMD
ERJ-3EKF7152V
Panasonic
53
R22
RES 200kΩ 1/10W 1% 0603 SMD
ERJ-3EKF2003V
Panasonic
54
R24, R35
RES 3.01kΩ 1/10W 1% 0603 SMD
ERJ-3EKF3011V
Panasonic
55
R25, R33
RES 1.00MΩ 1/10W 1% 0603 SMD
ERJ-3EKF1004V
Panasonic
56
R26
RES 2.00kΩ 1/10W 1% 0603 SMD
ERJ-3EKF2001V
Panasonic
57
R27
RES 511kΩ 1/10W 1% 0603 SMD
ERJ-3EKF5113V
Panasonic
58
R23, R28
RES 20.0kΩ 1/10W 1% 0603 SMD
ERJ-3EKF2002V
Panasonic
59
R29
RES 12.7kΩ 1/8W 1% 0805 SMD
RK73H2ATTD1272F
60
R30
RES 604kΩ 1/10W 1% 0603 SMD
ERJ-3EKF6043V
Panasonic
61
R32
RES 17.4kΩ 1/10W 1% 0603 SMD
ERJ-3EKF1742V
Panasonic
62
R40
RES 16.5kΩ 1/10W 1% 0603 SMD
ERJ-3EKF1652V
Panasonic
63
R41
64
R42
65
R43
RES 0.0Ω 1/20W 5% 0603 SMD
RK73Z1J
66
R44
RES 1.0kΩ 1/10W 1% 0603 SMD
ERJ-3EKF1001V
KOA
KOA
Panasonic
*: Vac 180V to 265V 50Hz/60Hz (Typ 230V) Iout 390mA
Wurth
: Adolf Wurth GmbH & Co. KG
Infineon
: Infineon Technologies AG
CEL
: California Eastern Laboratories, Inc
Fairchild
: Fairchild Semiconductor International, lnc.
Diodes
: Diodes, Inc
On Semi
: ON Semiconductor
Panasonic
: Panasonic Corporation
muRata
: Murata Manufacturing Co., Ltd.
Epcos
: EPCOS AG
KOA
: KOA Corporation
TI
: Texas Instruments Incorporated
Micro Commercial
: Micro Commercial Components Corp.
Nichicon
: NICHICON CORPORATION
Littelfuse
: Littelfuse, Inc.
Document Number: 002-08393 Rev.*A
Page 27 of 37
MB39C601
No.
Component
Description
6
C1
CAP .22UF/400VDC METAL POLY
13
T1
TRANSFORMER FLYBACK EE20/10/6
1.2mH RATIO Np/Ns=4.42/1 Np/Na=8.15/1
Part No.
Vendor
ECQ-E4224KF
Panasonic
750811145
Wurth
Panasonic: Panasonic Corporation
Wurth
: Adolf Wurth GmbH & Co. KG
Document Number: 002-08393 Rev.*A
Page 28 of 37
MB39C601
13. Usage Precaution
1. Do not configure the IC over the maximum ratings.
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to normally operate within the recommended usage conditions. Usage outside of these conditions can
have an adverse effect on the reliability of the LSI.
2. Use the device within the recommended operating conditions.
The recommended values guarantee the normal LSI operation under the recommended operating conditions.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the
conditions stated for each item.
3. Printed circuit board ground lines should be set up with consideration for common impedance.
4. Take appropriate measures against static electricity.
• Containers for semiconductor materials should have anti-static protection or be made of conductive material.
• After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
• Work platforms, tools, and instruments should be properly grounded.
• Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial between body and ground.
5. Do not apply negative voltages.
The use of negative voltages below - 0.3 V may make the parasitic transistor activated to the LSI, and can cause malfunctions.
Document Number: 002-08393 Rev.*A
Page 29 of 37
MB39C601
14. Ordering Information
Part number
Package
MB39C601PNF
8-pin plastic SOP
(FPT-8P-M02)
Remarks
15. RoHS Compliance Information of Lead (Pb) Free Version
The LSI products of Cypress with “E1” are compliant with RoHS Directive, and has observed the standard of lead, cadmium,
mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). A product whose part
number has trailing characters “E1” is RoHS compliant.
16. Marking Format (Lead Free Version)
C601
E1 XXXX
XXX
INDEX
Document Number: 002-08393 Rev.*A
Lead-free version
Page 30 of 37
MB39C601
17. Labeling Sample (Lead Free Version)
Lead-free mark
JEITA logo
JEDEC logo
The part number of a lead-free product has
the trailing characters "E1".
Document Number: 002-08393 Rev.*A
"ASSEMBLED IN CHINA" is printed on the label
of a product assembled in China.
Page 31 of 37
MB39C601
18. MB39C601PNF Recommended Conditions of Moisture Sensitivity Level
[Cypress Recommended Mounting Conditions]
Recommended Reflow Condition
Item
Condition
Mounting Method
IR (infrared reflow), warm air reflow
Mounting times
2 times
Before opening
Please use it within two years after manufacture.
From opening to the 2nd reflow
Less than 8 days
When the storage period after
opening was exceeded
Please process within 8 days
after baking (125°C ±3°C, 24H+ 2H/─0H) .
Baking can be performed up to two times.
Storage period
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
[Mounting Conditions]
1. Reflow Profile
260°C
255°C
Main heating
170 °C
to
190 °C
(b)
RT
(a)
"H" rank : 260°C Max
(a) Temperature Increase gradient
(b) Preliminary heating
(c) Temperature Increase gradient
(d) Peak temperature
(d') Main Heating
(e) Cooling
(c)
(d)
(e)
(d')
: Average 1°C/s to 4°C /s
: Temperature 170°C to 190°C, 60 s to 180 s
: Average 1°C /s to 4°C /s
: Temperature 260°C Max; 255°C or more, 10 s or less
: Temperature 230°C or more, 40 s or less
or
Temperature 225°C or more, 60 s or less
or
Temperature 220°C or more, 80 s or less
: Natural cooling or forced cooling
Note: Temperature : the top of the package bod
2. JEDEC Condition: Moisture Sensitivity Level 3 (IPC/JEDEC J-STD-020D)
Document Number: 002-08393 Rev.*A
Page 32 of 37
MB39C601
3. Recommended manual soldering (partial heating method)
Item
Condition
Before opening
Within two years after manufacture
Between opening and mounting
Within two years after manufacture
(No need to control moisture during the storage period
because of the partial heating method.)
Storage period
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
Mounting conditions
Temperature at the tip of a soldering iron: 400°C Max
Time: Five seconds or below per pin*
*: Make sure that the tip of a soldering iron does not come in contact with the package body.
4. Recommended dip soldering
Item
Mounting times
Condition
1 time
Before opening
Please use it within two years after manufacture.
From opening and mounting
Less than 14 days
When the storage period after
opening was exceeded
Please process within 14 days
after baking (125°C ±3°C, 24H+ 2H/─0H) .
Baking can be performed up to two times.
Storage period
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
Mounting condition
Temperature at soldering tub: 260°C Max
Time: Five seconds or below
Document Number: 002-08393 Rev.*A
Page 33 of 37
MB39C601
19. Package Dimensions
Document Number: 002-08393 Rev.*A
Page 34 of 37
MB39C601
20. Major Changes
Spansion Publication Number: MB39C601_DS405-00008
Page
Revision 0.1 [August, 2012]
Revision 1.0 [December, 2012]
Revision 2.0 [July, 2013]
Revision 2.1 [January 31, 2014]
-
Section
Change Results
-
Initial release
-
Company name and layout design change
NOTE: Please see “Document History” about later revised information.
Document Number: 002-08393 Rev.*A
Page 35 of 37
MB39C601
Document History
Document Title: MB39C601 TRIAC Dimmable LED Driver IC for LED Lighting
Document Number: 002-08393
Revision
ECN
Orig. of
Change
Submission
Date
**
−
TAOA
01/31/2014
Migrated to Cypress and assigned document number 002-08393.
No change to document contents or format.
*A
5218699
TAOA
04/19/2016
Updated to Cypress format.
Document Number: 002-08393 Rev.*A
Description of Change
Page 36 of 37
MB39C601
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the
office closest to you, visit us at Cypress Locations.
®
Products
®
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®
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Touch Sensing
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cypress.com/arm
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
cypress.com/automotive
Cypress Developer Community
cypress.com/clocks
Forums | Projects | Videos | Blogs | Training | Components
cypress.com/interface
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© Cypress Semiconductor Corporation, 2012-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Cypress LLC (“Cypress”). This document,
including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other
countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights,
trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of
the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software
provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in
binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress’s
patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use,
reproduction, modification, translation, or compilation of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes.
It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress
products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support
devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the
failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform
can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress i s not liable, in whole or in part, and you shall and hereby do release
Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims,
costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Cypress, the Cypress logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United
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Document Number: 002-08393 Rev.*A
April 25, 2016
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