MB39C601 TRIAC Dimmable LED Driver IC for LED Lighting MB39C601 is a flyback type switching regulator contorller IC. The LED current is regulated by controlling the switching on-time or controlling the switching frequency, depending on the LED load. It is most suitable for the general lighting applications, for example stocks of commercial and residential light bulbs and so on. Features High power factor in single conversion High efficiency at the light load, at Low Power Mode (LPM) Burst Operation in switching frequency control Frequency setting depend on the FB pin current : 30 kHz to 130 kHz Control of the current of Primary Winding without the external sense resistor TRIAC Dimmable LED lighting Helps to achieve high efficiency and low EMI by detecting transformer zero energy Built-in under voltage lock out function Built-in over load protection function Built-in output over voltage protection function Built-in over temperature protection function LED load :25W (Max) Input voltage range VDD : 9V to 20V Input voltage range for LED lighting applications : AC110VRMS, AC230VRMS Package : SOP-8 (3.9mm × 5.05mm × 1.75mm [Max]) Applications LED lighting TRIAC dimmable LED lighting etc. Cypress Semiconductor Corporation Document Number: 002-08393 Rev.*A • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised April 25, 2016 MB39C601 Contents 1. 2. 3. 4. 5. 6. 7. 8. 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9. 9.1 9.2 9.3 9.4 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. Pin Assignment ............................................................................................................................................................ 3 Pin Descriptions........................................................................................................................................................... 3 Block Diagram (On-time control application) ............................................................................................................ 4 Absolute Maximum Ratings ........................................................................................................................................ 5 Recommended Operating Conditions ........................................................................................................................ 6 Electrical Characteristics ............................................................................................................................................ 7 Typical Characteristics .............................................................................................................................................. 10 Function Explanation ................................................................................................................................................ 12 LED Current Control Function ..................................................................................................................................... 12 Cascode Switching ...................................................................................................................................................... 12 Natural PFC (Power Factor Correction) Function ........................................................................................................ 12 Power-Up Sequencing................................................................................................................................................. 13 Power Down Sequencing ............................................................................................................................................ 14 OTM Part ..................................................................................................................................................................... 15 PCL Part ...................................................................................................................................................................... 16 FB Part ........................................................................................................................................................................ 17 TZE Part ...................................................................................................................................................................... 19 Various Protection Circuits ....................................................................................................................................... 21 Under Voltage Lockout Protection (UVLO) .................................................................................................................. 21 Over Voltage Proteciton (OVP) ................................................................................................................................... 21 Over Load Protection (OL) .......................................................................................................................................... 21 Over Temperature Protection (OTP) ........................................................................................................................... 21 Various Function Tables ........................................................................................................................................... 22 I/O Pin Equivalent Circuit Diagram ........................................................................................................................... 23 Example Application Circuit ..................................................................................................................................... 25 Usage Precaution....................................................................................................................................................... 29 Ordering Information ................................................................................................................................................. 30 RoHS Compliance Information of Lead (Pb) Free Version ..................................................................................... 30 Marking Format (Lead Free Version) ........................................................................................................................ 30 Labeling Sample (Lead Free Version) ...................................................................................................................... 31 MB39C601PNF Recommended Conditions of Moisture Sensitivity Level ............................................................ 32 Package Dimensions ................................................................................................................................................. 34 Major Changes ........................................................................................................................................................... 35 Document History ...................................................................................................................................................... 36 Document Number: 002-08393 Rev.*A Page 2 of 37 MB39C601 1. Pin Assignment (TOP VIEW) FB 1 8 VDD TZE 2 7 GND PCL 3 6 DRN OTM 4 5 VCG (FPT-8P-M02) 2. Pin Descriptions Pin No. Pin Name I/O 1 FB I Switching frequency setting pin. 2 TZE I Transformer auxiliary winding zero energy detecting pin. 3 PCL I Pin for controlling peak current of transformer primary winding. 4 OTM I On-time setting pin. 5 VCG - External MOSFET gate bias pin. 6 DRN O External MOSFET source connection pin. 7 GND - Ground pin. 8 VDD - Power supply pin. Document Number: 002-08393 Rev.*A Description Page 3 of 37 VIN AC Document Number: 002-08393 Rev.*A CVDD 1 CBULK 1 1 1 OTM 1 TZE FB VDD 4 2 1 8 IFB 13V IOTM OV Fault 3V 1V VGATE On-Time Modulation and Fault Response Control 5V 20mV Shutdown and Restart Latch or Retry Zero Energy Detect Feedback Processing Modulators 1.5μA<IFB<210µA Low Power Mode 210µA<IFB Over Load IFB<1.5µA IFB 10V/8V UVLO 10V/6V Fault Latch Reset D IFB Thermal Shutdown Q Q 1/tSW Fault Latch Reset UVLO VVCG Shunt VVDD Switch 2V 14V Current Sense VGATE Discharge Freq. Modulator Enable PWM Fault Enable PWM IFB Fault Timing and Control VVCG LDO IFB IFB MB39C601 IP Current Modulator Driver HS Drive 3 7 6 5 PCL GND DRN VCG 1 1 DBIAS D1 1 CVCG Rst 1 2 1 2 Co 2 2 Rs Vs MB39C601 3. Block Diagram (On-time control application) Page 4 of 37 MB39C601 4. Absolute Maximum Ratings Rating Parameter Power supply voltage Input voltage Input current Output current Power dissipation Storage temperature Symbol Condition Min Max Unit VVDD VDD pin -0.3 +25.0 V VDRN DRN pin - +20.0 V VVCG VCG pin -0.3 +16.0 V VTZE TZE pin -0.3 +6.0 V VOTM OTM pin -0.3 +6.0 V VPCL PCL pin -0.3 +6.0 V VFB FB pin -0.3 +2.0 V IVCG VCG pin - 10 mA IOTM OTM pin -1 0 mA IPCL PCL pin -1 0 mA IFB FB pin 0 1 mA IDRN DRN pin - 800 mA IDRN DRN pin, Pulsed 400ns, 2% duty cycle -1.5 +6.0 A PD Ta ≤ +25°C - 800* mW -55 +125 °C TSTG *:The value when using two layers PCB. Reference: θja (wind speed 0m/s): 125°C/W WARNING: Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. Document Number: 002-08393 Rev.*A Page 5 of 37 MB39C601 5. Recommended Operating Conditions Parameter Symbol Condition Min Value Typ Max Unit VDD pin input voltage VDD VDD pin 9 - 20 V VCG pin input voltage VCG VCG pin (from low-impedance source) 9 - 13 V VCG pin input current IVCG VCG pin (from high-impedance source) 10 - 2000 µA OTM pin Shutdown/retry mode 10 - 100 kΩ OTM pin Latch-off mode 150 - 750 kΩ 24.3 - 200.0 kΩ OTM pin ground resistance ROTM PCL pin ground resistance RPCL PCL pin TZE pin connection resistance RTZE1 TZE pin Auxiliary winding connection resistor 50 - 200 kΩ VCG pin grounded capacity CVCG VCG pin 33 - 200 nF VDD pin bypass capacity CBP Ceramic capacitor value to set between VDD and GND pin 0.1 - 1.0 µF Operating ambient temperature Ta - -40 +25 +85 °C WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. Any use of semiconductor devices will be under their recommended operating condition. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. Document Number: 002-08393 Rev.*A Page 6 of 37 MB39C601 6. Electrical Characteristics (Ta = +25°C, VVDD = 12V) Parameter Condition 5 Value Unit Typ Max VVDD=14V, IVCG=2.0mA 13 14 15 V 5 VVDD=12V, IVCG=26µA, IFB=350µA 15 16 17 V ΔVCG 5 VCG(DISABLED)VCG(OPERATING) 1.75 2.00 2.15 V VCG Shunt input current IVCG(SREG) 5 VVCG=VCG(DISABLED)100mV, VVDD=12V - 12 26 µA VCG Shunt Load Regulation ΔVCG(SREG) 5 26µA<IVCG ≤ 5mA, IFB=350µA - 125 200 mV VCG LDO regulation voltage VCG(LREG) 5 VVDD=20V, IVCG=-2mA - 13 - V - VDD-VCG, VVDD=11V, IVCG=-2mA - 2.0 2.8 V VCG voltage (Operating) (OPERATING) VCG voltage (Disable) (DISABLED) VCG LDO Dropout voltage VCG VCG VCG (LREG, DO) UVLO Turn-on threshold voltage VDD(ON) 8 - 9.7 10.2 10.7 V UVLO Turn-off threshold voltage VDD(OFF) 8 - 7.55 8.00 8.50 V UVLO hysteresis ΔVDD(UVLO) 8 VDD(ON) - VDD(OFF) 1.9 2.2 2.5 V 6,8 VVCG=12V, VVDD=7V, IDRN=50mA - 4* 10* Ω 8 - 5.6 6.0 6.4 V VDD switch onresistance Fault Latch Reset VDD voltage RDS, ON (VDD) VDD (FAULT RESET) Minimum switching period tSW(HF) 6 FM mode IFB=5µA 7.215 7.760 8.305 µs Maximum switching period tSW(LF) 6 IFB=IFB, CNR3 -20µA 31.5 35.0 38.5 µs 6 IFB=5µA, IPCL=100μA - 3* - A 6 IFB=5µA, IPCL=30μA - 1* - A IDRN (peak, absmin) 6 RPCL =OPEN - 0.45* - A tBLANK (ILIM) 6 IFB=5µA, RPCL=100kΩ, 1.2A pull-up on DRN - 400* - Ns 3 IFB=5µA 2.94 3.00 3.06 V 3 IFB=230µA 0.95 1.00 1.05 V DRN peak current Minimum peak current for RPCL open ILIM blanking time MODULATION Pin No. Min VCG voltage difference VDD and VCG SUPPLY Symbol IDRN(peak) PCL voltage VPCL IFB range for FM mode IFB, CNR1 1 tS=tS(LF), IDRN=IDRN(peak, max) 145 165 195 µA IFB range for AM mode IFB,CNR2IFB,CNR1 1 tS=tS(LF) , IDRN(peak) variation range= IDRN(peak, max) to IDRN(peak, min) 35 45 65 µA IFB range for LPM IFB,CNR3IFB,CNR2 1 - 50 70 90 µA IFB hysteresis for LPM IFB, LPM-HYST 1 - 10 25 40 µA VFB 1 IFB=10µA 0.34 0.70 0.84 V FB voltage Document Number: 002-08393 Rev.*A Page 7 of 37 MB39C601 Min Value Typ Max IDRN=4.0A - 200* 400* mΩ 6,7 VDRN=12V - 1.5 20.0 µA RDS(on)(HSDRV) 5,6 High-side Driver current=50mA - 6* 11* Ω IDIS 6,7 VDD=OPEN, DRN=12V, Fault latch set 2.38 3.40 4.42 mA VTZE(TH) 2 - 5* 20* 50* mV TZE clamp voltage VTZE(CLAMP) 2 ITZE= -10µA -200 -160 -100 mV Start timer operation threshold voltage VTZE(START) 2 - 0.10 0.15 0.20 V Driver turn-on Delay time tDRY(TZE) 6 150Ω pull-up 12V on DRN - 150 - Ns Wait time for zero energy detection tWAIT(TZE) 6 - 2.0 2.4 2.8 µs Start timer period tST 6 VTZE=0V 150 240 300 µs VTZE(OVP) 2 - 4.85 5.00 5.15 V tBLANK, OVP 6 - 0.6 1.0 1.7 Symbol Pin No. Condition RDS(on)(DRN) 6,7 IDRN(OFF) High-side driver on-resistance DRN discharge current Parameter Driver onresistance DRIVER Driver off leakage current TZE zero energy threshold voltage TRANSFORMER ZERO ENERGY DETECTION OVP threshold voltage OVERVOLTAGE FAULT OVP blanking time MAXIMUM ON TIME OTP µs µA Input bias current ITZE(bias) 2 VTZE=5V -0.1 0 +0.1 Over Load detection current IFB(OL) 1 - 0* 1.5* 3.0* µA Over Load delay time tOL 6 IFB=0A 200 250 300 Ms tRETRY 6 ROTM=76kΩ - 750 - Ms Over Load detection boundary resistance ROTM(TH) 4 - 100 120 150 kΩ Shutdown Threshold voltage VOTM(Vth) 4 0.7 1.0 1.3 V Shutdown OTM current IOTM, PU 4 VOTM = VOTM(vth) -600 -450 -300 µA 6 ROTM=383kΩ 3.74 4.17 4.60 µs OVERLOAD FAULT Retry time after Over Load SHUTDOWN THRESHOLD Unit OTM= ON-Time tOTM 6 ROTM=76kΩ 3.4 3.8 4.2 µs OTM voltage VOTM 4 - 2.7 3.0 3.3 V Protection temperature TSD - Tj, temperature rising - +150* - °C Protection temperature hysteresis TSD_HYS - Tj, temperature falling, degrees below TSD - 25* - °C Document Number: 002-08393 Rev.*A Page 8 of 37 MB39C601 Parameter Symbol IVDD Power supply current POWER SUPPLY CURRENT (STATIC) IVDD (OPERATING) Pin No. Condition 8 Value Unit Min Typ Max VVDD=20V, VTZE=1V 1.36 1.80 2.34 mA 8 VVDD=20V - 3.0* 3.7* mA Power supply current for LPM IVDD(LPM) 8 IFB=350µA - 550 900 µA Power supply current for UVLO IVDD(UVLO) 8 VVDD= VDD(ON) - 100mV - 285 500 µA *: Standard design value Document Number: 002-08393 Rev.*A Page 9 of 37 MB39C601 7. Typical Characteristics Power supply current vs. Ta 4.0 3.8 3.8 3.6 3.6 3.4 3.4 IDD+ICG [mA] IDD [mA] Power supply current vs. VDD 4.0 3.2 3.0 2.8 3.2 3.0 2.8 2.6 2.6 2.4 2.4 VDD; decreasing from 20V VCG=OPEN IFB=5µA 2.2 2.0 2.0 8 10 12 14 16 VDD=12V VCG=12V IFB=5µA 2.2 18 20 -40 -30 -20 -10 0 +10 +20 +30 +40 +50 +60 +70 +80 -35 -25 -15 -5 +5 +15 +25 +35 +45 +55 +65 +75 +85 Ta [°C] VDD [V] Switching frequency vs. IFB DRN peak current vs. IFB 160 3.5 140 3.0 120 Ta=+25°C Ta=+85°C 2.5 IDRN(peak) [A] 100 fSW [kHz] Ta=-25°C 80 60 Ta=-40°C 40 Ta=+25°C Ta=+85°C 2.0 1.5 1.0 0.5 20 0 0.0 0 50 100 150 200 250 300 0 50 100 IFB [µA] 150 200 250 300 IFB [uA] DRN peak current vs. IPCL ON time vs. ROTM 3.5 6 3.0 5 2.5 tOTM [us] IDRN(peak) [A] 4 2.0 1.5 Shutdown/ Retry (1) 3 Latch-off (2) 2 1.0 0.5 Ta=-40°C Ta=+25°C Ta=+85°C 1 n=30 0 0.0 0 20 40 60 IPCL [µA] Document Number: 002-08393 Rev.*A 80 100 0 100 200 300 400 500 600 ROTM [kΩ] Page 10 of 37 MB39C601 Driver ON resistance vs. Ta High-side Driver ON resistance vs. Ta 12 400 11 350 10 9 RDS(on)(HSDRN) [W] RDS(on)(DRN) [mΩ] 300 250 200 150 8 7 6 5 4 3 100 2 50 1 0 0 -40 -30 -20 -10 0 +10 +20 +30 +40 +50 +60 +70 +80 -35 -25 -15 -5 +5 +15 +25 +35 +45 +55 +65 +75 +85 -40 -30 -20 -10 0 +10 +20 +30 +40 +50 +60 +70 +80 -35 -25 -15 -5 +5 +15 +25 +35 +45 +55 +65 +75 +85 Ta [°C] Ta [°C] Power dissipation vs.Ta 1000 900 Power dissipation [mW] 800 700 600 500 400 300 200 100 0 -50 -40 -30 -20 -10 0 +10 +20 +30 +40 +50 +60 +70 +80 +90 +100 Ta[°C] Document Number: 002-08393 Rev.*A Page 11 of 37 MB39C601 8. Function Explanation 8.1 LED Current Control Function MB39C601 is a flyback type switching regulator controller. The LED current is regulated by controlling the switching on-time or controlling the switching frequency depending on the LED load. The LED current is converted into detecting voltage (Vs) by sense resistor (Rs) connected in series with LED. Vs is compared by an external error amplifier (Err AMP).When Vs falls below a reference voltage, Err AMP output rises and the current that flows into the Opto-Coupler is decreased. The OTM pin current is controlled via the Opto-Coupler in the on-time control block. In on-time control, it controls on-time at OTM pin current. So, on-time increases when the current of the OTM pin decreases. And the average current supplied to LED is regulated, because on-time is regulated at the constant switching frequency. The FB pin current is controlled via the Opto-Coupler in the switching frequency control block. In switching frequency control, it controls switching frequency at FB pin current. So, switching frequency becomes high when the current of the FB pin decreases. And the average current supplied to LED is regulated, because switching frequency is regulated at the constant on-time. 8.2 Cascode Switching The switch in Primary Winding is a cascode connection.The gate of external MOSFET is connected with the VCG pin, and the source is connected with the drain of internal Driver MOSFET. When the swich is on-state, internal Driver MOSFET is turned on, HS Driver MOSFET is turned off, and the source voltage of external MOSFET goes down to GND. For this period the DC bias is supplied to the gate of external MOSFET from the VCG pin. Therefore external MOSFET is turned on. When the switch is off-state, internal Driver MOSFET is turned off, HS Driver MOSFET is turned on, and the source voltage of external MOSFET goes up to VCG voltage. For this period the DC bias is supplied to the gate of external MOSFET from VCG pin. Therefore external MOSFET is turned off. Moreover, the current flowing into internal Driver MOSFET is equal to the current of Primary Winding. Therefore, the peak current into Primary Winding can be detected without the sense resistor. 8.3 Natural PFC (Power Factor Correction) Function In the AC voltage input, when the input current waveform is brought close to the sine-wave, and the phase difference is brought close to Zero, Power Factor is improved. In the flyback method operating in discontinuous conduction mode, when the input capacitance is set small, the input current almost becomes equal with peak current of Primary Winding. t V I PEAK = BULK × ON LMP = VBULK LMP tON VBULK : Supply voltage of Primary Winding LMP : Inductance of Primary Winding tON : On-time In on-time control, if loop response of Error Amp. is set to lower than the AC frequency (below 1/10 of the AC frequency), on-time can be constant. Therefore, input current is proportional to input voltage, so Power Factor is regulated. Document Number: 002-08393 Rev.*A Page 12 of 37 MB39C601 8.4 Power-Up Sequencing When the voltage is input to VBULK, the electric charge is charged to capacitance of the VCG pin (CVCG) through starting resistor (Rst). So, the voltage of the VCG pin rises. The voltage of the DRN pin rises by source follower when the voltage of the VCG pin reaches the threshold voltage of the external HVMOSFET. The DRN pin is connected with the VDD pin through the internal VDD Switch, and VDD capacitor (CVDD) is charged from the DRN pin. When the voltage at the VDD pin reaches the threshold voltage of UVLO, the VDD Switch is turned off, and the internal Bias circuit operates, and the switching is started. After the switching begins, the voltage at the VDD pin is supplied from Auxiliary Winding through the external diode (DBIAS). The voltage of an Auxiliary Winding is decided by rolling number ratio of Auxiliary Winding and Secondary Winding, and the voltage of Secondary Winding. Therefore, the voltage at the VDD pin is not supplied, until the voltage of Auxiliary Winding rises more than the voltage at the VDD pin. In this period, it is necessary to set the capacitor of the VDD pin to prevent the voltage of the VDD pin from falling below the threshold voltage of UVLO. The external Schottky diode (D1) is required between the DRN pin and VDD pin. This diode is used to prevent the current that flows through the body diode of the VDD Switch. Current Passing When Starting VBULK Rst Primary Winding Ist HV-MOSFET CVCG D1 VDD Start-up Current CVDD DBIAS VDD Operating and LPM Current VDD Auxiliary Winding VCG 8 5 VDD Switch HS Drive VCG Shunt UVLO 10V/8V Enable PWM 14V DRN 6 2V Fault Driver PWM Control Document Number: 002-08393 Rev.*A 7 GND Page 13 of 37 MB39C601 Power-Up Sequencing UVLO threshold UVLO threshold 8.5 Power Down Sequencing When AC power is removed from the AC line, the current does not flow to Secondary Winding even if HV MOSFET is switching. The LED current is supplied from the output capacitance and decreases gradually. Similarly, the voltage at the VDD pin decreases because the current does not flow into Auxiliary Winding. The switching stops and MB39C601 becomes shutdown when the voltage at the VDD pin falls below the threshold voltage of UVLO. Power Down Sequencing UVLO threshold 8V Document Number: 002-08393 Rev.*A Page 14 of 37 MB39C601 8.6 OTM Part It is set on-time by connecting resistor (ROTM) with the OTM pin. As shown in following figure, the on-time can be controlled by connecting the collector of the Opto-Coupler through resistor from OTM. OTM pin Control The following figure shows how the on-time is programmed over the range of between 1.5μs and 5.0μs for either range of programming resistors. The resistor range determines the controller response to a sustained overload fault (to either latch-off or to shutdown/retry). See the item of the overload protection about details of "latch-off" and "shutdown/retry". On-time is related to the programmed resistor based on the following equations. (1) ROTM = tOTM × (2 × 1010 [ Ω s (2) ROTM = tOTM × (0.918 × 1011 [ ]) Ω s ]) On-time Setting Range Moreover, it can be shutted down by making the voltage of the OTM pin below "VOTM (Vth) (typ 1V)". Document Number: 002-08393 Rev.*A Page 15 of 37 MB39C601 8.7 PCL Part It is set the peak current of Primary Winding by connecting resistor with the PCL pin. The maximum peak current of Primary Side is set by connecting resistor (RPCL) between the PCL pin and GND. IDRN(pk) = ( 100kV ) RPCL An about 400ns blanking time of the beginning of switching cycle is masking the spike noise. As a result, it prevents the sense of current from malfunctioning (See the figure below.). Peak Current Control with PCL pin DRN 6 IDRN From High-Voltage MOSFET Source Driver VGATE Current Sense t BLANKCL GND 7 From Optocoupler Emitter I FB FB IFB 1 Current Modulator I DRNPK 3 1 IFB, µA I PCL 165 210 VPCL, V 3 1 IFB, µA 165 210 PCL 3 RPCL Document Number: 002-08393 Rev.*A Page 16 of 37 MB39C601 8.8 FB Part The switching frequency is controlled by setting the current of the FB pin. In on-time control, the switching frequency is set by pulling up the FB pin to VDD. Moreover, as shown in following figure, it is possible to control the switching frequency by connecting the emitter of the Opto-Coupler from the FB pin through resistor. Resistor (RFB) is connected to bleed off the dark current of OptoCoupler. FB pin Control IFB RFB Filter IFB FB 1 CFB Filter RFB Feedback Processing Modulators 1.5µA<IFB<210µA Low Power Mode 210µA<IFB Over Load IFB<1.5µA MB39C601 becomes the following three modes by FB current (I FB). 1. Frequency Modulation Mode (FM) The peak current of HV-MOSFET is set to the maximum, and the LED current is regulated by adjusting the switching frequency with IFB.The range of the switching frequency is from 30 kHz to 130 kHz. Maximum peak current IDRN (peak, max) of HVMOSFET is set by the resistance of the PCL pin. 2. Amplitude Modulation Mode (AM) The LED current is regulated by adjusting the peak current of HV-MOSFET with IFB.The switching frequency is about 30 kHz. And the range of HV-MOSFET of the peak current is from 33% to 100% of the maximum. Maximum peak current IDRN (peak, max) of HV-MOSFET is set by the resistance of the PCL pin. 3. Low Power Mode (LPM) MB39C601 becomes two states of LPM-ON and LPM-OFF at a light load. In the LPM-ON mode, it is operated at 30 kHz switching frequency. And the current is supplied to LED. At this time, the feedback current from the Opto-Coupler increases, and it changes to the LPM-OFF mode. In the LPM-OFF mode, it is not operated. And the current is supplied to LED from Co. When the feedback current from the Opto-Coupler decreases, it changes to the LPM-ON mode. LED is lit by the power saving repeating these two states. Three modes of the FM, AM, and LPM change depending on the load of LED. At the light load, three modes change from FM to AM to LPM. Document Number: 002-08393 Rev.*A Page 17 of 37 MB39C601 Switching Frequency and Peak Current Control Operation Based On FB pin Document Number: 002-08393 Rev.*A Page 18 of 37 MB39C601 8.9 TZE Part MB39C601 requires all of the following three conditions in order to start the next switching cycle. 1. The time since the last turn-on edge must be equal to or longer than the switching time set by I FB. 2. The time since the last turn-on edge must be longer than the minimum switching period set by MB39C601 (nominally 7.5µs which equals 133 kHz). 3. Immediately after zero energy detection at the TZE pin. Or, the time since the last zero energy detection must be longer than tWAIT, (TZE) (2.4μs or less). Starting switching cycle diagram The TZE pin is connected with Auxiliary Winding of the transformer through the resistance division, and detects zero energy as shown "TZE pin Connection". A delay, 50ns to 200ns, can be added with CTZE to adjust the turn-on of the primary switch with the resonant bottom of Primarty Winding waveform. Switching Waveform at detecting zero Energy Document Number: 002-08393 Rev.*A Page 19 of 37 MB39C601 TZE pin Connection NP NS NB 1 RTZE1 Zero Energy Detect TZE 2 RTZE2 CTZE 20mV OV Fault Fault Timing and Control 5V Document Number: 002-08393 Rev.*A Page 20 of 37 MB39C601 9. Various Protection Circuits 9.1 Under Voltage Lockout Protection (UVLO) The under voltage lockout protection (UVLO) protects IC from malfunction and protects the system from destruction/deterioration during the transient state and momentary drop due to start up for the power supply pin voltage (VDD). The voltage decrease of the VDD pin is detected with comparator, and output HS DRIVER is turned off and output DRIVER is turned off, and the switching is stopped.The system returns if the VDD pin becomes more than the threshold voltage of the UVLO circuit. 9.2 Over Voltage Proteciton (OVP) When LED is in the state of open and the output voltage rises too much, the voltage of Auxiliary Winding and the voltage of the TZE pin rise. The over voltage is detected by sampling this voltage of the TZE pin. When TZE pin voltage rises more than the threshold voltage of OVP, the over voltage is detected. Output HS DRIVER is turned off, and output DRIVER is turned off, and the switching is stopped. (latch-off) If the VDD pin becomes below the voltage of Fault Latch Reset, OVP is released. 9.3 Over Load Protection (OL) When the cathode or the anode of LED is short to GND and it becomes an overloaded status at switching frequency control, the current does not flow into Rs and there is no current feedback to IFB. The current of the FB pin detects the overload with 1.5µA or less. OL state is decided to latch-off or shutdown/retry by ROTM. Shutdown/retry … MB39C601 becomes two states of switching on for 250ms and switching off for 750ms. These states are repeated. If it is not OL status, it returns. Latch-off … The switching is continued for 250ms. If it does not return from OL states for this period, output HS DRIVER is turned off, and output DRIVER is turned off, and the switching is stopped. If it returns from OL states after this time and the switching is still stopped (latch-off) and the VDD pin becomes below the voltage of Fault Latch Reset, Latch is released. Over Load Protection Sequencing 9.4 Over Temperature Protection (OTP) The over temperature protection (OTP) is a function to protect IC from the thermal destruction.When the junction temperature reaches +150°C,output HS DRIVER is turn off, and output DRIVER is turned off, and the switching is stopped.It returns again when the junction temperature falls to +125°C (automatic recovery). Document Number: 002-08393 Rev.*A Page 21 of 37 MB39C601 10. Various Function Tables VDD SW Discharge SW Detection Condition at Protected Operation OFF OFF - - DRN Function LS_DRV HS_DRV Normal Operation Under Voltage Lockout Protection (UVLO) OTM Shutdown Over Voltage Protection (OVP) Shutdown/ Retry Over Load Mode Protection (OL) Latch-Off Mode Stopped state of Low Power Mode Over Temperature Protection (OTP) Return Condition Remarks - OFF OFF ON OFF VDD < 8.0V VDD > 10.2V Standby OFF OFF ON OFF OTM = GND OTM > 1V Standby OFF OFF ON ON TZE > 5V VDD < 6V → VDD > 10.2V Latch-off OFF OFF IFB < 1.5µA 32.6k < ROTM < 100kΩ IFB > 1.5µA Shutdown Retry OL Timer (250ms) Shutdown Retry Fault (750ms) OFF OFF ON OFF OFF OFF ON ON IFB < 1.5µA 150k < ROTM < 459kΩ VDD < 6V → VDD > 10.2V OFF OFF ON OFF IFB > 280µA IFB < 255µA - OFF OFF ON OFF Tj > +150°C Tj < +125°C - Document Number: 002-08393 Rev.*A Latch-off Page 22 of 37 MB39C601 11. I/O Pin Equivalent Circuit Diagram Pin No. Pin Name 1 FB 2 TZE 3 PCL Document Number: 002-08393 Rev.*A Equivalent Circuit Diagram Page 23 of 37 MB39C601 Pin No. 4 Pin Name Equivalent Circuit Diagram OTM 5 VCG 6 DRN Document Number: 002-08393 Rev.*A Page 24 of 37 MB39C601 12. Example Application Circuit Document Number: 002-08393 Rev.*A Page 25 of 37 MB39C601 Part list Vac 90V to 145V 50Hz/60Hz (Typ110V) Iout 390mA No. Component Description 1 U1 IC PWM CTRLR CASCODE 8-SOIC MB39C601 2 U2 OPTO ISOLATOR TRANSISTOR OUTPUT PS2561L-1-A 3 U3, U4, U5 IC OPAMP GP R-R 1MHZ SGL SOT23-5 LMV321IDBVR TI 4 VR1 SUR ABSORBER 7MM 430V 1250A ZNR ERZ-V07D431 Panasonic 5 BR1 IC RECT BRIDGE 0.5A 600V 4SOIC MB6S 6 T1* TRANSFORMER FLYBACK EE20/10/6 430µH RATIO Np/Ns=2.91/1 Np/Na=5.33/1 750811148 7 F1 FUSE PICO FAST 2.5A 250V AXIAL 026302.5WRT1L 8 L1 IND COMMON MODE CHOKE 40MH 750311650 Wurth 9 L2 JUMPER (RES 0.0Ω 1206) RK73Z2B KOA 10 Q1 MOSFET N-CH 650V 7.3A TO-220FP SPA07N60C3 11 Q2 TRANSISTOR NPN 100V 1A SOT-89 FCX493TA 12 Q6 TRANSISTOR NPN GP 40V SOT23 MMBT3904-TP 13 C1* CAP .47UF/400VDC METAL POLY ECQ-E4474KF 14 C2 CAP CER 15000PF 250V X7R 1206 GRM31BR72E153KW01L muRata 15 C3 CAP CER 10000PF 50V X7R 0603 GRM188R71H103KA01D muRata 16 C4 CAP CER .1UF 25V X7R 10% 0603 GRM188R71E104KA01D 17 C5 CAP 100UF 25V ELECT RADIAL 2.5MM EEU-FC1E101S 18 C6,C7 CAP CER 2.2UF 100V X7R 1210 GRM32ER72A225KA35 muRata 19 C8 CAP 560UF 50V ELECT HE RADIAL UPW1H561MHD Nichicon 20 C9 CAP .056UF/630VDC METAL POLY ECQ-E10223KF Panasonic 21 C10, C15, C17, C18, C19 CAP CER 10000PF 50V X7R 0603 GRM188R71H103KA01D muRata 22 C11 CAP CER 2.2NF X1/Y1 RADIAL DE1E3KX222MA4BL01 muRata 23 C12 CAP CER 220PF 630VDC U2J 1206 GRM31A7U2J221JW31D muRata 24 C13 CAP CER 0.33UF 16V X7R 0603 GRM188R71C334KA01 muRata 25 C14 CAP CER 1UF 16V X7R 0805 GRM21BR71C105KA01# muRata 26 C16 CAP CER .1UF 25V 0805 GRM21BR71E104KA01# muRata 27 C21 CAP .022UF/305VAC X2 METAL POLYPRO B32921C3223M Epcos 28 D1 DIODE ULTRA FAST 800V 1A SMA RS1K-13-F Diodes 29 D3 DIODE ULTRA FAST 200V SOT-23 MMBD1404 Fairchild 30 D4 DIODE ZENER 18V 225MW SOT-23 BZX84C18LT1 On Semi 31 D5 DIODE GPP FAST 1A 600V DO-41 UF4005 Fairchild 32 D6 DIODE GPP FAST 1A 600V SMA RS1J Fairchild 33 D8 SHUNT REGULATOR 5.0V SOT-23 LM4040C50IDBZT 34 D9 DIODE, SWITCHING 70V SC-70 BAW56WT1 35 R1, R2, R31 RES 560kΩ 1/4W 1% 0805 SMD RK73H2ATTD5603F 36 R3, R6, R15 RES 100kΩ 1/10W 1% 0603 SMD ERJ-3EKF1003V 37 R4 RES 75.0kΩ 1/4W 5% 1206 SMD RK73B2BTTD753J 38 R5 RES 510Ω METAL FILM 2W 5% ERG-2SJ511A Panasonic 39 R7 RES 464kΩ 1/10W 1% 0603 SMD ERJ-3EKF4643V Panasonic 40 R8 RES 4.42kΩ 1/10W 1% 0603 SMD ERJ-3EKF4421V Panasonic Document Number: 002-08393 Rev.*A Part No. Vendor Cypress CEL Fairchild Wurth Littelfuse Infineon Diodes Micro Commercial Panasonic muRata Panasonic TI On Semi KOA Panasonic KOA Page 26 of 37 MB39C601 No. Component Description Part No. Vendor 41 R9 RES 39.2Ω 1/8W 5% 0805 SMD RK73B2ATTD390J 42 R10 RES 1.0kΩ METAL FILM 2W 5% ERG-2SJ102A 43 R11 RES 110kΩ 1/8W 5% 0805 SMD RK73B2ATTD114J 44 R12 RES 33.2kΩ 1/10W 1% 0603 SMD ERJ-3EKF3322V Panasonic 45 R13 RES 40.2kΩ 1/10W 1% 0603 SMD ERJ-3EKF4022V Panasonic 46 R14 RES 634kΩ1/10W 1% 0603 SMD ERJ-3EKF6343V Panasonic 47 R16 RES 5.1Ω 1/10W 1% 0603 SMD RK73H1JTTD5R10F 48 R17 RES 3.00Ω 1/8W 1% 0805 SMD RK73H2ATTD3R00F 49 R18 RES 10.0kΩ 1/10W 1% 0603 SMD ERJ-3EKF1002V Panasonic KOA Panasonic KOA KOA KOA 50 R19 RES .33Ω 1/4W 1% 1206 SMD ERJ-8RQFR33V Panasonic `51 R20 RES 301kΩ 1/10W 1% 0603 SMD ERJ-3EKF3013V Panasonic 52 R21 RES 71.5kΩ 1/10W 1% 0603 SMD ERJ-3EKF7152V Panasonic 53 R22 RES 200kΩ 1/10W 1% 0603 SMD ERJ-3EKF2003V Panasonic 54 R24, R35 RES 3.01kΩ 1/10W 1% 0603 SMD ERJ-3EKF3011V Panasonic 55 R25, R33 RES 1.00MΩ 1/10W 1% 0603 SMD ERJ-3EKF1004V Panasonic 56 R26 RES 2.00kΩ 1/10W 1% 0603 SMD ERJ-3EKF2001V Panasonic 57 R27 RES 511kΩ 1/10W 1% 0603 SMD ERJ-3EKF5113V Panasonic 58 R23, R28 RES 20.0kΩ 1/10W 1% 0603 SMD ERJ-3EKF2002V Panasonic 59 R29 RES 12.7kΩ 1/8W 1% 0805 SMD RK73H2ATTD1272F 60 R30 RES 604kΩ 1/10W 1% 0603 SMD ERJ-3EKF6043V Panasonic 61 R32 RES 17.4kΩ 1/10W 1% 0603 SMD ERJ-3EKF1742V Panasonic 62 R40 RES 16.5kΩ 1/10W 1% 0603 SMD ERJ-3EKF1652V Panasonic 63 R41 64 R42 65 R43 RES 0.0Ω 1/20W 5% 0603 SMD RK73Z1J 66 R44 RES 1.0kΩ 1/10W 1% 0603 SMD ERJ-3EKF1001V KOA KOA Panasonic *: Vac 180V to 265V 50Hz/60Hz (Typ 230V) Iout 390mA Wurth : Adolf Wurth GmbH & Co. KG Infineon : Infineon Technologies AG CEL : California Eastern Laboratories, Inc Fairchild : Fairchild Semiconductor International, lnc. Diodes : Diodes, Inc On Semi : ON Semiconductor Panasonic : Panasonic Corporation muRata : Murata Manufacturing Co., Ltd. Epcos : EPCOS AG KOA : KOA Corporation TI : Texas Instruments Incorporated Micro Commercial : Micro Commercial Components Corp. Nichicon : NICHICON CORPORATION Littelfuse : Littelfuse, Inc. Document Number: 002-08393 Rev.*A Page 27 of 37 MB39C601 No. Component Description 6 C1 CAP .22UF/400VDC METAL POLY 13 T1 TRANSFORMER FLYBACK EE20/10/6 1.2mH RATIO Np/Ns=4.42/1 Np/Na=8.15/1 Part No. Vendor ECQ-E4224KF Panasonic 750811145 Wurth Panasonic: Panasonic Corporation Wurth : Adolf Wurth GmbH & Co. KG Document Number: 002-08393 Rev.*A Page 28 of 37 MB39C601 13. Usage Precaution 1. Do not configure the IC over the maximum ratings. If the IC is used over the maximum ratings, the LSI may be permanently damaged. It is preferable for the device to normally operate within the recommended usage conditions. Usage outside of these conditions can have an adverse effect on the reliability of the LSI. 2. Use the device within the recommended operating conditions. The recommended values guarantee the normal LSI operation under the recommended operating conditions. The electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the conditions stated for each item. 3. Printed circuit board ground lines should be set up with consideration for common impedance. 4. Take appropriate measures against static electricity. • Containers for semiconductor materials should have anti-static protection or be made of conductive material. • After mounting, printed circuit boards should be stored and shipped in conductive bags or containers. • Work platforms, tools, and instruments should be properly grounded. • Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial between body and ground. 5. Do not apply negative voltages. The use of negative voltages below - 0.3 V may make the parasitic transistor activated to the LSI, and can cause malfunctions. Document Number: 002-08393 Rev.*A Page 29 of 37 MB39C601 14. Ordering Information Part number Package MB39C601PNF 8-pin plastic SOP (FPT-8P-M02) Remarks 15. RoHS Compliance Information of Lead (Pb) Free Version The LSI products of Cypress with “E1” are compliant with RoHS Directive, and has observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). A product whose part number has trailing characters “E1” is RoHS compliant. 16. Marking Format (Lead Free Version) C601 E1 XXXX XXX INDEX Document Number: 002-08393 Rev.*A Lead-free version Page 30 of 37 MB39C601 17. Labeling Sample (Lead Free Version) Lead-free mark JEITA logo JEDEC logo The part number of a lead-free product has the trailing characters "E1". Document Number: 002-08393 Rev.*A "ASSEMBLED IN CHINA" is printed on the label of a product assembled in China. Page 31 of 37 MB39C601 18. MB39C601PNF Recommended Conditions of Moisture Sensitivity Level [Cypress Recommended Mounting Conditions] Recommended Reflow Condition Item Condition Mounting Method IR (infrared reflow), warm air reflow Mounting times 2 times Before opening Please use it within two years after manufacture. From opening to the 2nd reflow Less than 8 days When the storage period after opening was exceeded Please process within 8 days after baking (125°C ±3°C, 24H+ 2H/─0H) . Baking can be performed up to two times. Storage period Storage conditions 5°C to 30°C, 70% RH or less (the lowest possible humidity) [Mounting Conditions] 1. Reflow Profile 260°C 255°C Main heating 170 °C to 190 °C (b) RT (a) "H" rank : 260°C Max (a) Temperature Increase gradient (b) Preliminary heating (c) Temperature Increase gradient (d) Peak temperature (d') Main Heating (e) Cooling (c) (d) (e) (d') : Average 1°C/s to 4°C /s : Temperature 170°C to 190°C, 60 s to 180 s : Average 1°C /s to 4°C /s : Temperature 260°C Max; 255°C or more, 10 s or less : Temperature 230°C or more, 40 s or less or Temperature 225°C or more, 60 s or less or Temperature 220°C or more, 80 s or less : Natural cooling or forced cooling Note: Temperature : the top of the package bod 2. JEDEC Condition: Moisture Sensitivity Level 3 (IPC/JEDEC J-STD-020D) Document Number: 002-08393 Rev.*A Page 32 of 37 MB39C601 3. Recommended manual soldering (partial heating method) Item Condition Before opening Within two years after manufacture Between opening and mounting Within two years after manufacture (No need to control moisture during the storage period because of the partial heating method.) Storage period Storage conditions 5°C to 30°C, 70% RH or less (the lowest possible humidity) Mounting conditions Temperature at the tip of a soldering iron: 400°C Max Time: Five seconds or below per pin* *: Make sure that the tip of a soldering iron does not come in contact with the package body. 4. Recommended dip soldering Item Mounting times Condition 1 time Before opening Please use it within two years after manufacture. From opening and mounting Less than 14 days When the storage period after opening was exceeded Please process within 14 days after baking (125°C ±3°C, 24H+ 2H/─0H) . Baking can be performed up to two times. Storage period Storage conditions 5°C to 30°C, 70% RH or less (the lowest possible humidity) Mounting condition Temperature at soldering tub: 260°C Max Time: Five seconds or below Document Number: 002-08393 Rev.*A Page 33 of 37 MB39C601 19. Package Dimensions Document Number: 002-08393 Rev.*A Page 34 of 37 MB39C601 20. Major Changes Spansion Publication Number: MB39C601_DS405-00008 Page Revision 0.1 [August, 2012] Revision 1.0 [December, 2012] Revision 2.0 [July, 2013] Revision 2.1 [January 31, 2014] - Section Change Results - Initial release - Company name and layout design change NOTE: Please see “Document History” about later revised information. Document Number: 002-08393 Rev.*A Page 35 of 37 MB39C601 Document History Document Title: MB39C601 TRIAC Dimmable LED Driver IC for LED Lighting Document Number: 002-08393 Revision ECN Orig. of Change Submission Date ** − TAOA 01/31/2014 Migrated to Cypress and assigned document number 002-08393. No change to document contents or format. *A 5218699 TAOA 04/19/2016 Updated to Cypress format. Document Number: 002-08393 Rev.*A Description of Change Page 36 of 37 MB39C601 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. ® Products ® PSoC Solutions ® ARM Cortex Microcontrollers Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/arm PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP cypress.com/automotive Cypress Developer Community cypress.com/clocks Forums | Projects | Videos | Blogs | Training | Components cypress.com/interface Technical Support cypress.com/powerpsoc cypress.com/support cypress.com/memory cypress.com/psoc cypress.com/touch cypress.com/usb cypress.com/wireless ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries. © Cypress Semiconductor Corporation, 2012-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Cypress LLC (“Cypress”). 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Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress i s not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Cypress, the Cypress logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-08393 Rev.*A April 25, 2016 Page 37 of 37