+9 4) 1 BGA3031 DOCSIS 3.0 upstream amplifier Rev. 1 — 15 August 2013 Product data sheet 1. General description The BGA3031 is an upstream amplifier meeting the Data Over Cable Service Interface Specifications (DOCSIS 3.0). It is designed for cable modem, CATV set top box and VoIP modem applications. The device operates from 5 MHz to 85 MHz. The BGA3031 provides 58 dB gain control range in 1 dB increments with high incremental accuracy. Its maximum gain setting delivers 34 dB voltage gain and a superior linear performance. It supports high output levels up to 67 dBmV while minimizing distortion and output noise levels. The BGA3031 operates at 5 V supply. The gain is controlled via a 3-wire serial interface. The current consumption can be reduced in 4 steps via the serial interface. This enables the user to optimize between DC power efficiency and linearity. In addition the current is automatically reduced at lower gain settings while preserving the linearity performance. In disable mode the device draws typical 6 mA while it still can be programmed to new gain and current settings. The BGA3031 is housed in 20 pins 5 mm 5 mm leadless HVQFN package. 2. Features and benefits 58 dB gain control range in 1 dB steps using a 3-wire serial interface 5 MHz to 85 MHz frequency operating range 0.2 dB incremental gain step accuracy Maximum voltage gain 34 dB Excellent IMD3 of 70 dBc at 64 dBmV output power Excellent second harmonic level of 80 dBc at 64 dBmV output power Excellent third harmonic level of 67 dBc at 64 dBmV output power Excellent noise figure of 3.5 dB at maximum gain 5 V single supply operation Excellent ESD protection at all pins Unconditionally stable Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 3. Applications DOCSIS 3.0 cable modems VoIP modems Set-top boxes BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 4. Quick reference data Table 1. Quick reference data Typical values at VCC = 5 V; current setting = 3; Tcase = 25 C; Zi = 200 : Zo = 75 , unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - ICC supply current transmit-enable mode; TX_EN = HIGH Gv voltage gain gain code = 111111 NF noise figure 2H transmit-disable mode; TX_EN = LOW 325 - mA - 6.0 - mA - 34 - dB transmit-enable mode; gain code = 111111 - 3.5 - dB second harmonic level Pi = 30 dBmV; PL = 64 dBmV into 75 differential impedance - 80 - dBc 3H third harmonic level Pi = 30 dBmV; PL = 64 dBmV into 75 differential impedance - 67 - dBc IMD3 third-order intermodulation distortion Pi = 27 dBmV per tone; PL = 61 dBmV per tone into 75 differential impedance - 70 - dBc PL(1dB) output power at 1 dB gain compression signal - 74 dBmV [1] Voltage gain does not include loss due to input and output transformers. [2] Pi = 30 dBmV. [1][2] - 5. Ordering information Table 2. Ordering information Type number Package BGA3031 HVQFN20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 5 0.85 mm Name BGA3031 Product data sheet Description All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 Version SOT662-1 © NXP B.V. 2013. All rights reserved. 2 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 6. Functional diagram QF QF QF 9&& QF *1' QF ,1B3 287B3 ȍ ,1B1 QF ȍ $77 QF 287B1 6(5,$/ ,17(5)$&( Fig 1. &/. '$7$ WHUPLQDO LQGH[DUHD QF *1' &6 QF 7;B(1 9&& DDD Functional diagram 7. Pinning information QF 9&& QF QF 7.1 Pinning *1' QF ,1B3 287B3 %*$ ,1B1 QF QF 287B1 9&& 7;B(1 &6 '$7$ QF &/. *1' DDD Fig 2. BGA3031 Product data sheet Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 3 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 7.2 Pin description Table 3. Pin description Symbol Pin Description GND 1 ground IN_P 2 amplifier input + IN_N 3 amplifier input – n.c. 4 not connected GND 5 ground CLK 6 clock DATA 7 data CS 8 chip select TX_EN 9 transmit enable VCC 10 supply voltage for serial interface n.c. 11 not connected OUT_N 12 amplifier output – n.c. 13 not connected OUT_P 14 amplifier output + n.c. 15 not connected n.c. 16 not connected VCC 17 supply voltage for Variable Gain Amplifier (VGA) n.c. 18 not connected n.c. 19 not connected n.c. 20 not connected Paddle ground 8. Functional description 8.1 Logic programming The programming word is set through a shift register via the data, clock and chip select lines. The data is entered in order with the Most Significant Bit (MSB) first and the Least Significant Bit (LSB) last. The chip select line must be LOW for the duration of the data entry, then set HIGH to latch the shift register. The rising edge of the clock pulse shifts each data value into the register. Table 4. BGA3031 Product data sheet Programming register Data bit 11 Function Register address 10 9 Initialize 0 0 0 Set gain 0 0 0 8 7 6 5 4 3 2 1 0 Current setting [1] attenuation (gain) setting [2] 1 0 0 0 0 0 0 0 0 0 C[1] C[0] G[5] G[4] G[3] G[2] G[1] G[0] [1] For current bit settings see Table 6. [2] For gain bit settings see Table 5. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 4 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier '$7$ ' ' 06% &/. &6 WG!V 7;B(1 5)RXW DDD Fig 3. Serial Data Input Timing 8.2 Register settings 8.2.1 Register address Only addresses 0000 and 0001 are used. Using any other addresses will not affect the VGA. 8.2.2 Gain/attenuator setting The gain shall be controlled via the 3-wire bus. Data bits D0 through D5 set the gain/attenuator level, with 111111 being the min attenuation setting, and 000101 being the max attenuation setting. A new gain/attenuator setting can be loaded while the VGA is on (transmit-enable), but shall not take effect until transmit-enable transitions from LOW to HIGH. Table 5. Gain settings Gain setting G[5:0] Typical gain binary notation decimal notation (dB) 000000 to 000101 0 to 5 24 [1] [1] 23 000110 6 111110 [1] 62 [1] 33 [1] [1] 34 111111 [1] 63 With every increment of the gain setting between 000110 (6) and 111111 (63) the typical gain will increase accordingly. 8.2.3 Output stage current setting The current (of the output stage) shall be controlled via the 3-wire bus. Data bits D6 and D7 set the current. Setting 11 will set the maximum current for maximum linearity. The current can be lowered for improved efficiency at lower output power levels, or lower linearity requirements. Setting 00 will set the minimum current. A new current setting can be loaded while the VGA is on (transmit-enable), but shall not take effect until transmit-enable transitions from LOW to HIGH. BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 5 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier Table 6. Supply current settings At gain setting 63. Current setting C[1:0] Typical supply current binary notation decimal notation (mA) 00 0 215 01 1 260 10 2 290 11 3 325 The current is automatically reduced at lower gain settings while preserving the linearity performance. Table 7. Supply current versus gain setting Gain setting G[5:0] Typical current (mA) binary notation decimal Current setting C[1:0] notation 00 (decimal = 0) Current setting C[1:0] Current setting C[1:0] Current setting C[1:0] 01 (decimal = 1) 10 (decimal = 2) 11 (decimal =3) 111111 63 215 260 290 325 110111 55 215 260 290 325 110110 54 165 190 200 215 110001 49 165 190 200 215 110000 48 135 150 160 160 101000 40 135 150 160 160 100111 39 120 125 125 125 000101 5 120 125 125 125 8.3 Tx enable / Tx disable The amplifier can be disabled or enabled by making TX_EN (pin 9) LOW or HIGH. A LOW to HIGH Tx enable transition will activate new programed settings. If no new settings are programmed the last programmed setting will be re-activated. 9. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Absolute Maximum Ratings are given as Limiting Values of stress conditions during operation, that must not be exceeded under the worst probable conditions. Symbol Parameter VCC supply voltage VI input voltage BGA3031 Product data sheet Conditions Min Max Unit - 6.0 V on pin IN_P 0.5 +6.0 V on pin IN_N 0.5 +6.0 V on pin CLK [1] 0.5 +6.0 V on pin DATA [1] 0.5 +6.0 V on pin CS [1] 0.5 +6.0 V on pin TX_EN [1] 0.5 +6.0 V on pin OUT_N 0.5 +6.0 V on pin OUT_P 0.5 +6.0 V All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 6 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier Table 8. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Absolute Maximum Ratings are given as Limiting Values of stress conditions during operation, that must not be exceeded under the worst probable conditions. Symbol Parameter Pi(max) Tstg Min Max Unit maximum input power - 40 dBmV storage temperature 65 +150 C Tj junction temperature - 150 C VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E - 4000 V Charged Device Model (CDM); According JEDEC standard 22-C101B - 2000 V [1] Conditions All digital pins may not exceed VCC as the internal ESD circuit can be damaged. To prevent this it is recommended that control pins are limited to a maximum of 5 mA. 10. Thermal characteristics Table 9. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-bop) thermal resistance from junction to bottom of package in free air [1] 14 K/W Rth(j-a) thermal resistance from junction to ambient in free air [2] 35 K/W [1] Simulated using final element method model resembling the device mounted on the application board. See Section 13. [2] Device mounted on application board. 11. Static characteristics Table 10. Characteristics Typical values at VCC = 5 V; current setting = 3; Tcase = 25 C; Zi = 200 : Zo = 75 , unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICC supply current transmit-enable mode; TX_EN = HIGH - 325 - mA transmit-disable mode; TX_EN = LOW VIH HIGH-level input voltage [1] VIL LOW-level input voltage [1] P power dissipation [1] Voltage on the control pins. BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 - 6.0 - mA 2.0 - VCC + 0.6 V 0 - 0.8 V - 1.625 W © NXP B.V. 2013. All rights reserved. 7 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 12. Dynamic characteristics Table 11. Characteristics Typical values at VCC = 5 V; current setting = 3; Zi = 200 : Zo = 75 , Tcase = 25 C, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit gain code = 111111 [1][2] - 34 - gain code = 000000 [1][2] - 24 - dB f = 5 MHz to 42 MHz [2] - 0.4 - dB f = 5 MHz to 85 MHz [2] - 0.6 - dB gain step [2] - 1.0 - dB EG(dif) differential gain error [2] - 0.2 - dB Ri(dif) differential input resistance - 200 - Ro(dif) differential output resistance - 75 - frange frequency range 5 - 85 MHz Pn noise power transmit-disable mode; TX_EN = LOW; any bandwidth = 160 kHz from f = 5 MHz to 85 MHz - 69 - dBmV isol isolation transmit-disable mode; TX_EN = LOW; f = 85 MHz - 90 - dB NF noise figure transmit mode; gain code = 111111 - 3.5 - dB transmit mode; gain code = 101110 - 6.5 - dB - 1.8 - s 55 dBmV output power - 80 - mV(p-p) 49 dBmV output power - 50 - mV(p-p) 43 dBmV output power - 25 - mV(p-p) 37 dBmV output power - 5 - mV(p-p) 31 dBmV output power - 5 - mV(p-p) voltage gain Gv Gflat Gstep gain flatness tsw(G) gain switch time transmit-disable/transmit-enable transient duration Vos overshoot voltage transmit-disable/transmit-enable transient step size dB 2H second harmonic level Pi = 30 dBmV; PL = 64 dBmV into 75 differential impedance - 80 - dBc 3H third harmonic level Pi = 30 dBmV; PL = 64 dBmV into 75 differential impedance - 67 - dBc IMD3 third-order intermodulation distortion Pi = 27 dBmV per tone; PL = 61 dBmV per tone into 75 differential impedance - 70 - dBc PL(1dB) output power at 1 dB gain compression CW signal - 74 - dBmV [1] Voltage gain does not include loss due to input and output transformers. [2] Pi = 30 dBmV. BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 8 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 13. Application information 13.1 External components Matching the balanced output of the chip to a single-ended 75 load is accomplished using a 1 : 1 ratio transformer. In addition to the balanced to single-ended conversion. For measurements in a 50 system R7 and R8 are added for impedance transformation from 75 to 50 . R7 and R8 are not required in the final application. The transformer also cancels even mode distortion products and common mode signals, such as the voltage transients that occur while enabling and disabling the amplifiers. External capacitors are needed for the functionality of the circuit, the pins are internal nodes in the output amplifier. 9&& & 9 *1' 5 9&& 9&& ; 5 9&& 5 5 & & 5 QF *1' 5 7 ,1B3 & 5)B,1 ȍ QF 9&& QF QF 9&& QF 287B3 7 ; ,1B1 QF & ; 5 ȍ QF *1' &/. '$7$ &6 7;B(1 9&& 287B1 5)B287 ȍ 5 QF & 9&& ; DDD Fig 4. External components BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 9 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier Table 12. List of components For application diagram, see Figure 4. Component Description Value Size Supplier: Part No. C1, C2, C3, C4 capacitor 10 nF SMD 0603 C5 capacitor 100 nF SMD 0603 C6 capacitor 10 F SMD 1206 R1, R6 resistor 0 SMD 0603 R2, R3 resistor 0 SMD 0805 R4, R5 resistor 4.7 SMD 0603 R7 resistor 43.3 SMD 0603 R8 resistor 86.6 SMD 0603 T1 input balun - - TOKO: #617DB-1714 T2 output balun - - M/A-COM: MABA-009572-CF18A0 X1 2-pin header - - X2, X3 SMA connector - - X4 10-pin header - - FCI: Minitek 13.2 Graphs DDD *Y G% DDD *Y G% JDLQVHWWLQJ VCC = 5 V; current setting = 3; Tcase = 25 C; Pi = 30 dBmV. I0+] VCC = 5 V; current setting = 3; Tcase = 25 C; Pi = 30 dBmV. (1) f = 5 MHz (1) gain setting = 5 (2) f = 42 MHz (2) gain setting = 20 (3) f = 85 MHz (3) gain setting = 36 (4) gain setting = 50 (5) gain setting = 63 Fig 5. Voltage gain as a function of gain setting; typical values BGA3031 Product data sheet Fig 6. Voltage gain as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 10 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier DDD (*GLI G% DDD Į+ G%F JDLQVHWWLQJ VCC = 5 V; current setting = 3; Tcase = 25 C; Pi = 30 dBmV. I0+] VCC = 5 V; Pi = 30 dBmV; PL = 64 dBmV; current setting = 3; gain setting = 63. (1) Tcase = 10 C (1) f = 5 MHz (2) f = 42 MHz (2) Tcase = +25 C (3) f = 85 MHz (3) Tcase = +85 C Fig 7. Differential gain error as a function of gain setting; typical values Fig 8. Second harmonic level as a function of frequency; typical values DDD Į+ G%F DDD ,0' G%F I0+] VCC = 5 V; Pi = 30 dBmV; PL = 64 dBmV; current setting = 3; gain setting = 63. (1) Tcase = 10 C (2) Tcase = +25 C (3) Tcase = +85 C Third harmonic level as a function of frequency; typical values Product data sheet I0+] (1) Tcase = 10 C (3) Tcase = +85 C BGA3031 VCC = 5 V; Pi = 27 dBmV per tone; PL = 61 dBmV per tone; current setting = 3; gain setting = 63. (2) Tcase = +25 C Fig 9. Fig 10. Third order intermodulation distortion as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 11 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier DDD ,0' G%F DDD 3/G% G%P9 I0+] I0+] VCC = 5 V; current setting = 3; Tcase = 25 C; Pi = 30 dBmV. VCC = 5 V; Pi = 30 dBmV per tone; PL = 64 dBmV per tone; current setting = 3; gain setting = 63. (1) Tcase = 10 C (1) gain setting = 39 (2) Tcase = +25 C (2) gain setting = 48 (3) Tcase = +85 C (3) gain setting = 54 (4) gain setting = 63 Fig 11. Third order intermodulation distortion as a function of frequency; typical values Fig 12. Output power at 1 dB gain compression as a function of frequency; typical values DDD 3/ G%P9 DDD 1) G% 3LG%P9 Tcase = 25 C; VCC = 5 V; f = 85 MHz; gain setting = 63. JDLQVHWWLQJ Tcase = 25 C; VCC = 5 V; current setting = 3. (1) current setting = 0 (1) f = 5 MHz (2) current setting = 1 (2) f = 42 MHz (3) current setting = 2 (3) f = 85 MHz (4) current setting = 3 Fig 13. Output power as a function of input power; typical values BGA3031 Product data sheet Fig 14. Noise figure as a function of gain setting; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 12 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier DDD DDD ,&& $ 1) G% JDLQVHWWLQJ JDLQVHWWLQJ Tcase = 25 C; VCC = 5 V. f = 45 MHz; VCC = 5 V; current setting = 3. (1) Tcase = 10 C (1) current setting = 0 (2) Tcase = +25 C (2) current setting = 1 (3) Tcase = +85 C (3) current setting = 2 (4) current setting = 3 Fig 15. Noise figure as a function of gain setting; typical values Fig 16. Supply current as a function of gain setting; typical values DDD ,&& $ DDD 5/LQ G% 7FDVH& Tcase = 25 C; VCC = 5 V; current setting = 3. I0+] Tcase = 25 C; VCC = 5 V; current setting = 3. (1) gain setting = 20 (1) gain setting = 5 (2) gain setting = 44 (2) gain setting = 36 (3) gain setting = 52 (3) gain setting = 63 (4) gain setting = 60 Fig 17. Supply current as a function of case temperature; typical values BGA3031 Product data sheet Fig 18. Input return loss as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 13 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier DDD 5/RXW G% I0+] Tcase = 25 C; VCC = 5 V; current setting = 3. (1) gain setting = 5 (2) gain setting = 63 (3) amplifier disabled (TX_EN LOW) Fig 19. Output return loss as a function of frequency; typical values BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 14 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 14. Package outline HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm A B D SOT662-1 terminal 1 index area A A1 E c detail X C e1 e b 6 y y1 C v M C A B w M C 10 L 11 5 e e2 Eh 1 15 terminal 1 index area 20 16 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.38 0.23 0.2 5.1 4.9 3.25 2.95 5.1 4.9 3.25 2.95 0.65 2.6 2.6 0.75 0.50 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT662-1 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22 Fig 20. Package outline SOT662-1 (HVQFN20) BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 15 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 15. Handling information 15.1 Moisture sensitivity Table 13. Moisture sensitivity level Test methodology Class JESD-22-A113 1 16. Abbreviations Table 14. Abbreviations Acronym Description CATV Community Antenna TeleVision CW Continuous Wave ESD ElectroStatic Discharge HVQFN Heatsink Very thin Quad Flat pack No leads SMA SubMiniature version A SMD Surface-Mounted Device Tx Transmission VoIP Voice over Internet Protocol 17. Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA3031 v.1 20130815 Product data sheet - - BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 16 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGA3031 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 17 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGA3031 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 August 2013 © NXP B.V. 2013. All rights reserved. 18 of 19 BGA3031 NXP Semiconductors DOCSIS 3.0 upstream amplifier 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.2.3 8.3 9 10 11 12 13 13.1 13.2 14 15 15.1 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Logic programming . . . . . . . . . . . . . . . . . . . . . . 4 Register settings . . . . . . . . . . . . . . . . . . . . . . . . 5 Register address . . . . . . . . . . . . . . . . . . . . . . . 5 Gain/attenuator setting . . . . . . . . . . . . . . . . . . . 5 Output stage current setting . . . . . . . . . . . . . . . 5 Tx enable / Tx disable . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 9 External components . . . . . . . . . . . . . . . . . . . . 9 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Handling information. . . . . . . . . . . . . . . . . . . . 16 Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 August 2013 Document identifier: BGA3031