V6206671 VID

REVISIONS
LTR
DESCRIPTION
A
Under Table I, make changes to Linearity error
and Zero code error tests limits for device types
03 and 04 only. Add one note under figure 1 for
both case outlines X and Y. Update document
paragraphs to current requirements. - ro
DATE
APPROVED
14-10-20
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
TOM HESS
06-09-14
TITLE
MICROCIRCUIT, DIGITAL-LINEAR, 16-BIT, LOW
POWER, VOLTAGE OUTPUT, DIGITAL-TOANALOG CONVERTERS, MONOLITHIC SILICON
APPROVED BY
RAYMOND MONNIN
SIZE
A
REV
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
CODE IDENT. NO.
DWG NO.
V62/06671
16236
A
PAGE
1
OF
19
5962-V001-15
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance 16 bit, low power, voltage output, digital to
analog converter microcircuit, with an operating temperature range of -55C to +125C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/06671
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Transport media,
quantity
Device type
Generic
01
DAC8830-REP
Tape and reel, 2500
02
DAC8830-EP
Tube, 75
03
DAC8831-REP
Tape and reel, 2500
04
DAC8831-EP
Tube, 50
Circuit function
16 bit, low power, voltage output,
digital to analog converter
16 bit, low power, voltage output,
digital to analog converter
16 bit, low power, voltage output,
digital to analog converter
16 bit, low power, voltage output,
digital to analog converter
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
Y
8
14
JEDEC PUB 95
Package style
MS-012-AA
MS-012-AB
Plastic small outline
Plastic small outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
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Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
A
CODE IDENT NO.
16236
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PAGE
2
1.3 Absolute maximum ratings.
1/
VDD to AGND ............................................................................................................. -0.3 V to 7 V
Digital input voltage to DGND .................................................................................... -0.3 V to VDD + 0.3 V
VOUT to AGND ........................................................................................................... -0.3 V to VDD + 0.3 V
AGND, AGNDF, AGNDS to DGND ............................................................................ -0.3 V to +0.3 V
Storage temperature range (TSTG) ............................................................................. -65C to +150C
Junction temperature range (TJ) ................................................................................ +150C
Power dissipation (PD) :
X package ...............................................................................................................
Y package ...............................................................................................................
Thermal resistance, junction to ambient (JA):
X package ...............................................................................................................
Y package ...............................................................................................................
Lead temperature, soldering :
Vapor phase (60 seconds) .....................................................................................
Infrared (15 seconds) .............................................................................................
167.2 mW
239.2 mW
149.5C/W
104.5C/W
215C
220C
1.4 Recommended operating conditions. 2/
Operating free-air temperature range (TA) ................................................................. -55C to +125C
1/
2/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
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2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Copies of these documents are available online at http:/www.jedec.org or from JEDEC – Solid State Technology Association,
3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107).
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3.
3.5.4 Timing waveforms. The timing waveforms shall be as shown in figure 4.
DEFENSE SUPPLY CENTER, COLUMBUS
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TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Static performance
Resolution
Linearity error
Differential linearity
error
All grades
Gain error
-55C to +125C
All
16
bits
25C
All
1
-55C to +125C
01, 02
1.5
03, 04
0.4
-55C to +125C
All
1
LSB
25C
All
5
LSB
7
-55C to +125C
Gain drift
Zero code error
Zero code drift
LSB
-55C to +125C
All
0.1 typical
25C
All
1
-55C to +125C
01, 02
2
03, 04
3
-55C to +125C
All
0.05 typical
-55C to +125C
All
0
VREF
03, 04
-VREF
VREF
ppm /
C
LSB
ppm /
C
Output characteristics
Voltage output 3/
Unipolar operation
Bipolar operation
Output impedance
V
-55C to +125C
All
6.25 typical
k
Settling time
tS
To 1/2 LSB of FS, CL = 10 pF
-55C to +125C
All
1 typical
s
Slew rate 4/
SR
CL = 10 pF
-55C to +125C
All
25 typical
V/s
1 LSB change around major carry
-55C to +125C
All
8 typical
nV-s
-55C to +125C
All
0.2 typical
nV-s
25C
01, 02
10 typical
nV /
03, 04
18 typical
Hz
Digital to analog glitch
Digital feedthrough 5/
Output noise
Power supply rejection
PSR
VDD varies 10%
All
-55C to +125C
1
LSB
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Output characteristics - continued.
Bipolar resistor
matching
-55C to +125C
RFB / RINV
03, 04
1 typical
Ratio error
Bipolar zero error
25C
03, 04
0.01
%
5
LSB
7
-55C to +125C
Bipolar zero drift
/
0.2 typical
-55C to +125C
03, 04
-55C to +125C
All
1.25
-55C to +125C
All
9
03, 04
7.5
ppm /
C
Reference input
Reference input 6/
voltage range
Reference input 7/
impedance
Unipolar operation
Bipolar operation
Reference -3 dB
bandwidth
BW
Reference feedthrough
Signal to noise ratio
k
Code = FFFFh
-55C to +125C
All
1.3 typical
MHz
Code = 0000h,
VREF = 1 VPP at 100 kHz
-55C to +125C
All
1 typical
mV
-55C to +125C
All
92 typical
dB
-55C to +125C
All
75 typical
pF
SNR
Reference input
capacitance
V
VDD
Code = 0000h
Code = FFFFh
120 typical
Digital inputs
Input low voltage
VIL
All
-55C to +125C
VDD = 2.7 V
0.6
0.8
VDD = 5 V
Input high voltage
VIH
V
All
-55C to +125C
VDD = 2.7 V
2.1
V
2.4
VDD = 5 V
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Digital inputs - continued.
Input current
IIN
-55C to +125C
All
1
A
Input capacitance
CIN
-55C to +125C
All
10
pF
-55C to +125C
All
-55C to +125C
All
-55C to +125C
All
Hysteresis voltage
0.4 typical
V
Power supply
Supply voltage
VDD
Supply current
IDD
VDD = 3 V
2.7
V
20
A
20
VDD = 5 V
Power
5.5
All
-55C to +125C
VDD = 3 V
60
W
100
VDD = 5 V
Temperature range
Specified performance
All
-55C to +125C
-55
+125
C
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Unless otherwise specified, VDD = 3 V or VDD = 5 V, VREF = 2.5 V.
3/
The device type 01 output is unipolar ( 0 V to VREF ). The device type 02 output is bipolar ( VREF ) when it connects to an
external buffer ( see the bipolar output operation section under manufacturer’s datasheet ).
4/
Slew rate is measure from 10% to 90% of transition when the output changes from 0 to full scale.
5/
Digital feedthrough is defined as the impulse injected into the analog output from the digital input. It is measured when the
DAC output does not change, CS is held high, while SCLK and DIN signals are toggled.
6/
Specified by design, Vref production tested only at 2.5 V.
7/
Reference input resistance is code dependent, minimum at 8555h.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 8/ 9/
VDD = 5 V
Temperature,
TA
Device
type
Limits
Min
Timing characteristic
Unit
Max
See figure 4.
SCLK period
tsck
-55C to +125C
All
20
ns
SCLK high or low time
twsck
-55C to +125C
All
10
ns
Delay from SCLK high
tDelay
-55C to +125C
All
18
ns
CS enable lead time
tLead
-55C to +125C
All
12
ns
CS enable lag time
tLag
-55C to +125C
All
15
ns
Delay from CS high
to SCLK high
tDSCLK
-55C to +125C
All
15
ns
CS high between
active period
ttd
-55C to +125C
All
30
ns
Data setup time (input)
tsu
-55C to +125C
All
10
ns
Data hold time (input)
tho
-55C to +125C
All
0
ns
LDAC width
tWLDAC
-55C to +125C
All
30
ns
Delay from CS high
tDLDAC
-55C to +125C
All
30
ns
-55C to +125C
All
10
s
to CS low
to LDAC low
VDD high to CS low
(power up delay)
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 8/ 9/
VDD = 3 V
Temperature,
TA
Device
type
Limits
Min
Timing characteristic
Unit
Max
See figure 4.
SCLK period
tsck
-55C to +125C
All
20
ns
SCLK high or low time
twsck
-55C to +125C
All
10
ns
Delay from SCLK high
tDelay
-55C to +125C
All
18
ns
CS enable lead time
tLead
-55C to +125C
All
15
ns
CS enable lag time
tLag
-55C to +125C
All
15
ns
Delay from CS high
to SCLK high
tDSCLK
-55C to +125C
All
15
ns
CS high between
active period
ttd
-55C to +125C
All
30
ns
Data setup time (input)
tsu
-55C to +125C
All
10
ns
Data hold time (input)
tho
-55C to +125C
All
0
ns
LDAC width
tWLDAC
-55C to +125C
All
30
ns
Delay from CS high
tDLDAC
-55C to +125C
All
30
ns
-55C to +125C
All
10
s
to CS low
to LDAC low
VDD high to CS low
(power up delay)
8/
Specified by design. Not production tested.
9/
Sample tested during the initial release and after any redesign or process that may affect this parameter.
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Case X
FIGURE 1. Case outlines.
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Case X - continued
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
---
0.069
---
1.75
A1
0.004
0.010
0.10
0.25
b
0.012
0.020
0.31
0.51
c
0.007
0.010
0.17
0.25
D
0.189
0.197
4.80
5.00
E
0.150
0.157
3.80
4.00
E1
0.228
0.244
5.80
6.20
e
L
n
0.050 BSC
0.016
1.27 BSC
0.050
0.40
8
1.27
8
NOTES:
1. Controlling dimensions are inch, millimeter dimensions are given for reference only.
2. For dimension D, body length does not include mold flash, protrusion, or gate burrs. Mold flash, protrusion,
or gate burrs shall not exceed 0.006 inch (0.15 mm) per end.
3. For dimension E, body width does not include interlead flash. Interlead flash shall not exceed 0.017 inch (0.43 mm)
per side.
4. Falls with JEDEC MS-012-AA.
FIGURE 1. Case outlines – Continued.
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Case Y
FIGURE 1. Case outlines – Continued.
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Case Y - continued
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
---
.069
---
1.75
A1
.004
.010
0.10
0.25
b
.012
.020
0.31
0.51
c
.007
.010
0.17
0.25
D
.337
.344
8.55
8.75
e
.050 BSC
1.27 BSC
E
.150
.157
3.80
4.00
E1
.228
.244
5.80
6.20
L
.016
.050
0.40
1.27
n
14 leads
14 leads
NOTES:
1. Controlling dimensions are inch, millimeter dimensions are given for reference only.
2. For dimension D, body length does not include mold flash, protrusion, or gate burrs. Mold flash, protrusion,
or gate burrs shall not exceed 0.006 inch (0.15 mm) per end.
3. For dimension E, body width does not include interlead flash. Interlead flash shall not exceed 0.017 inch (0.43 mm)
per side.
4. Falls with JEDEC MO-012-AB.
FIGURE 1. Case outlines - Continued.
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Device types
01, 02
03, 04
Case outlines
X
Y
Terminal number
Terminal symbol
1
VOUT
RFB
2
AGND
VOUT
3
VREF
AGNDF
4
CS
AGNDS
5
SCLK
VREF-S
6
SDI
VREF-F
7
DGND
CS
8
VDD
SCLK
9
---
NC
10
---
SDI
11
---
LDAC
12
---
DGND
13
---
INV
14
---
VDD
FIGURE 2. Terminal connections.
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Device types 01, 02
Terminal
symbol
Description
VOUT
Analog output of DAC.
AGND
Analog ground.
VREF
Voltage reference input.
Chip select input (active low).
CS
SCLK
SDI
DGND
VDD
Data is not clocked into SDI unless CS is low.
Serial clock input.
Serial data input. Data is latched into input register on the rising edge of
SCLK.
Digital ground.
Analog power supply, 3 V to 5 V.
Device types 03, 04
Terminal
symbol
Description
RFB
Feedback resistor. Connect to the output of external operational
amplifier in bipolar mode.
VOUT
Analog output of DAC.
AGNDF
Analog ground (Force).
AGNDS
Analog ground (Sense).
VREF-S
Voltage reference input (Sense). Connect to external voltage reference.
VREF-F
Voltage reference input (Force). Connect to external voltage reference.
CS
Chip select input (active low). Data is not clocked into SDI unless CS is
low.
SCLK
Serial clock input.
NC
No internal connection.
SDI
Serial data input. Data is latched into input register on the rising edge of
SCLK.
LDAC
Load DAC control input. Active low. When LDAC is low, the DAC latch
is simultaneously updated with the content of the input register.
DGND
Digital ground.
INV
Junction point of internal scaling resistors. Connect to external
operational amplifier’s inverting input in bipolar mode.
VDD
Analog power supply, 3 V to 5 V.
FIGURE 2. Terminal connections – Continued.
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FIGURE 3. Logic diagrams.
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FIGURE 4. Timing waveforms.
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FIGURE 4. Timing waveforms – Continued.
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4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Package
marking
Transport media,
quantity
Vendor part number
V62/06671-01XE
01295
8830M
Tape and reel,
2500
DAC8830MCDREP
V62/06671-02XE
01295
8830M
Tube, 75
DAC8830MCDEP
V62/06671-03YE
01295
8831M
Tape and reel,
2500
DAC8831MCDREP
V62/06671-04YE
01295
8831M
Tube, 50
DAC8831MCDEP
1/ The vendor item drawing establishes an administrative control number for identifying the item on the
engineering documentation.
CAGE code
01295
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Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/06671
PAGE
19