User's Guide SNVA078A – May 2004 – Revised May 2013 AN-1305 LM5030 Evaluation Board The AN-1305 is an evaluation board the demonstrates a fully featured push-pull converter utilizing the LM5030 100V push-pull current mode PWM controller 1 Introduction The LM5030EVAL evaluation board provides the design engineer with a fully functional push-pull power converter using the LM5030 PWM controller. The performance of the board is: • Input range: 36V to 75V • Output voltage: 3.3V • Output current: 0 to 10A • Measured efficiency: 82% (at 48V in, 10A Load Current) • Board size: 2.4 × 2.4 × 0.5 inches • Load regulation: ±1.0% (1 - 10A) • Line regulation: ±0.15% (36 - 75V) • Shutdown input • Synchronizing input The printed circuit board consists of 2 layers of 2 ounce copper on FR4 material, with a total thickness of 0.062 inches. The board is designed for continuous operation at rated load. 2 Theory of Operation Referring to Figure 10, the LM5030 controller (U1) alternately drives two N channel MOSFETs, which feed the two halves of the power transformer’s primary (T1). The transformer’s secondary is rectified, and filtered with an LC filter (L2, C3-5), to provide the output voltage. The feedback path starts with the LM3411 precision regulator driver (U3) which senses the output voltage, compares it to its internal reference, and drives an optocoupler (U2) based on the error voltage. The optocoupler provides isolation in the feedback path, and its open collector output drives the COMP pin on the LM5030, which controls the pulse width to the MOSFETs. The lower the voltage at the COMP pin, the smaller the MOSFET duty cycle. Current in the main transformer’s primary is monitored at the LM5030’s CS pin via a current sense transformer (T2). The voltage at the CS pin is used for current mode PWM control and current limit protection. The output inductor (L2) not only smoothes the output voltage waveform, but also generates an auxiliary voltage (by means of its secondary winding) to power the Vcc pin on the LM5030. This feature reduces power dissipation within the IC, thereby increasing reliability. A Synchronizing input pad (SYNC) is provided on the board to synchronize the circuit’s operating frequency to an external source. A Shutdown input pad (SD) permits shutting down the circuit’s operation from an external switch to ground. All trademarks are the property of their respective owners. SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1305 LM5030 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 1 Board Layout and Probing 3 www.ti.com Board Layout and Probing Figure 1 shows the placement of the significant components which may be probed in evaluating the circuit’s operation. The following should be kept in mind when using scope or meter probes: 1. The board has two circuit grounds - one associated with the input power, and one associated with the output power. The grounds are capacitively coupled (C6), but are DC isolated. 2. The main current carrying components (L1, T1, T2, Q1, Q2, D1 and L2) will be hot to the touch at maximum load current. USE CAUTION. If operating at maximum load current for extended periods, the use of a fan to provide forced air flow is recommended. 3. Use care when probing the primary side at maximum input voltage. 75 volts is enough to produce shocks and sparks. 4. At maximum load current (10A), the wire size, and length, used to connect the board’s output to the load becomes important. Ensure there is not a significant voltage drop in the wires. Note that two connectors are provided at the output - one for the +3.3V output (J2 Out), and one for the Ground connection (J3 IGND). It is advisable to make good use of this feature to ensure a low loss connection. 5. The input voltage conector is J1. 4 5 L2 6 D1 C6 3 2 OUT C3 U3 T1 1 C4 J2 T2 C5 Q1 U2 L1 IGND GND IN J1 U1 SYN C S D J3 Q2 Figure 1. Evaluation Board 2 AN-1305 LM5030 Evaluation Board SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Board Connections/Start-Up www.ti.com 4 Board Connections/Start-Up The input connection to the board from a power supply is made to connector J1. The power supply must be capable of supplying not only the current during normal operation, but also the inrush current during start-up. For example, if the load current is set to be 1.0A, the inrush current will be approximately 250 mA peak. If the load is set to 10A, the inrush current will be approximately 1.7A peak. Once the circuit is on and operating normally, the current draw from the power supply is a function of both the load current, and the input voltage, as shown in Figure 2. The load is connected to the J2 and J3 connectors. Two connectors are provided to accommodate adequately sized wires. With a load current of 10A, the load connections should use a minimum of 16 gauge wire, preferably larger. Before start-up, a voltmeter should be connected to the input terminals, and one to the output terminals. The input current should be monitored with either an ammeter, or a current probe. Upon turning on the power supply, these three meters should be immediately checked to ensure their readings are nominal. 1.2 INPUT CURRENT (A) 1.0 VIN = 36V 0.8 VIN = 75V 0.6 0.4 0.2 0.0 0 5 10 LOAD CURRENT (A) Figure 2. Input Current vs Load Current and VIN SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1305 LM5030 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 3 Performance 5 www.ti.com Performance Once the circuit is powered up and operating normally, the output voltage will be regulated to +3.3V, with the accuracy determined by the accuracy of the LM3411 regulator driver. As the load current is varied from 1.0 to 10A, the output is regulated to within +/-30 mV (+/- 1.0%). For a given load current, the output will be regulated to within 5 mV as the input voltage is varied over its range (36 - 75V). The power conversion efficiency is shown in Figure 3. 100 VIN = 36V 90 80 EFFICIENCY (%) VIN = 75V 70 60 50 40 30 20 0 2 4 6 8 10 LOAD CURRENT (A) Figure 3. Efficiency vs Load Current and VIN 6 Waveforms If the circuit is to be probed, Figure 4 shows some of the significant waveforms for various input/output combinations. Remember that there are two circuit grounds, and the scope probe grounds must be connected appropriately. In the table of Figure 4, t1 and t2 are in microseconds, while Fs is in kHz. Fs is the frequency of the internal oscillator, which is twice the switching frequency of each MOSFET. All the voltages are in volts with respect to circuit ground. L2 Output is the regulated output at J2, and typically has less than 10mV of ripple. The spikes at the rising edges of V4, V5, V7, and V9 are due to the leakage inductance in T1. The voltage rating of the MOSFETs (Q1, Q2) is determined by the amplitude of these spikes (V4). Their current rating is determined by the input current shown in Figure 2, plus a ripple component of approximately 10% in this design. 4 AN-1305 LM5030 Evaluation Board SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated VCC www.ti.com V1 Q2 Gate 0V t1 t2 V1 Q1 Gate 0V V4 V3 V2 Q2 Drain tR = 150 ns 0V V5 V6 T1 (Pin 4) 0V V8 V7 V9 V10 D1 Output 0V L2 Output 3.3V 100 mVp-p VIN IOUT t1 t2 Fs V1 V2 V3 V4 V5 V6 V7 V8 V9 V10 36V 1.0A 2.2µS 5.3µS 266.7 10.5V 36V 48V 10A 1.9µS 5.5µS 270.3 11.5V 48V 72V 90V 10V 6V -10V -6V 10V 6V 96V 130V 18V 8V -18V -8V 13V 75V 1.0A 1.2µS 6.2µS 270.3 10.5V 75V 8V 150V 200V 20V 13V -20V -13V 20V 13V Figure 4. Representative Waveforms 7 VCC While the LM5030 internally generates a voltage at VCC (7.7V), the internal regulator is used mainly during the start-up sequence. Once the load current begins flowing through L2, which is both an inductor for the output filter and a transformer, a voltage is generated at L2’s secondary which powers the VCC pin. Once the externally applied voltage exceeds the internal value (7.7V), the internal regulator shuts off, thereby reducing internal power dissipation in the LM5030. L2 is constructed such that the voltage supplied to VCC ranges from approximately 10.6V to approximately 11.3V, depending on the load current. See Figure 5. SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1305 LM5030 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 5 Current Sense www.ti.com 11.3 11.2 11.1 VCC (V) 11.0 10.9 10.8 10.7 10.6 10.5 0.0 2.0 4.0 6.0 8.0 10.0 LOAD CURRENT (A) Figure 5. VCC Voltage vs Load Current 8 Current Sense Monitoring the input current provides a good indication of the circuit’s operation. If an overload condition should exist at the output (a partial overload or a short circuit), the input current would rise above the nominal value shown in Figure 2. Transformer T2, in conjunction with D3, R9, R12 and C10, provides a voltage to pin 8 on the LM5030 (CS) which is representative of the input current flowing through its primary. The average voltage seen at pin 8 is plotted in Figure 6. If the voltage at the first current sense comparator exceeds 0.5V, the LM5030 disables its outputs, and the circuit enters a cycle-by-cycle current limit mode. If the second level threshold (0.625V) is exceeded due to a severe overload and transformer saturation, the LM5030 will disable its outputs and initiate a softstart sequence. However, the very short propagation delay of the cycle-by-cycle current limiter (CS1), the design of the CS filter (R9, R12, and C10), and the conservative design of the output inductor (L2), may prevent the second level current threshold from being realized on this evaluation board. AVERAGE VOLTAGE @ CS (V) 0.25 0.20 0.15 0.10 0.05 0.00 0.0 0.2 0.4 0.6 0.8 1.0 INPUT CURRENT (A) Figure 6. Average Voltage at the CS pin vs Input Current 6 AN-1305 LM5030 Evaluation Board SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Shutdown www.ti.com 9 Shutdown The Shutdown pad (SD) on the board connects to the SoftStart pin on the LM5030 (pin 10), and permits on/off control of the converter by an external switch. SD should be pulled below 0.45V, with an open collector or open drain device, to shut down the LM5030 outputs and the VCC regulator. If the voltage at the SD pad is between 1.0 and 1.5V, a partial-on condition results, which could be disruptive to the system. Therefore, the voltage at the SD pad should transition quickly between its open circuit voltage (4.9V) and ground. 10 External Sync Although the LM5030 includes an internal oscillator, its operating frequency can be synchronized to an external signal if desired. The external source frequency must be higher than the internal frequency set with the RT resistor (262kHz with RT = 20K). The sync input pulse width must be between 15 and 150 ns, and have an amplitude of 1.5 - 3.0V at the Sync pad on the board. The pulses are coupled to the LM5030 through a 100pF capacitor (C16) as specified in the data sheet. 11 Bill Of Materials Table 1. Bill Of Materials Item Part Number Description Value C1 C0805C472K5RAC Capacitor, Ceramic, KEMET 4700pF, 50V C2 C0805C103K5RAC Capacitor, Ceramic, KEMET 0.01µF, 50V C3 C4532X7S0G686M Capacitor, Ceramic, TDK 68µF, 4V T520D337M006AS4350 Capacitor, Tantalum, KEMET 330µF, 6.3V C6 C4532X7R3A103K Capacitor, Ceramic, TDK 0.01µF, 1000V C7 C3216X7R2A104K Capacitor, Ceramic, TDK 0.1µF, 100V C8, 9 C4532X7R2A105M Capacitor, Ceramic, TDK 1µF, 100V C10 C0805C102K1RAC Capacitor, Ceramic, KEMET 1000pF, 100V C11 C1206C223K5RAC Capacitor, Ceramic, KEMET 0.022µF, 50V C12 C3216X7R1E105M Capacitor, Ceramic, TDK 1µF, 25V C13, 14 C3216COG2J221J Capacitor, Ceramic, TDK 220pF, 630V C4, 5 C15 C1206C104K5RAC Capacitor, Ceramic, KEMET 0.1µF, 50V C16, 17 C0805C101J1GAC Capacitor, Ceramic, KEMET 100pF, 100V C18 C3216X7R1H334K Capacitor, Ceramic, TDK 0.33µF, 50V D1 MBRB3030CTL Diode, Schottky, ON Semi. 30V, 15A D2 - 5 CMPD2838-NSA Diode, Signal, Central Semi. 75V, 200mA L1 (1) MSS6132-103 Input Choke, Coilcraft 10µH, 1.3A L2 (1) A9785-B Output Choke, Coilcraft 7µH, 15A R1 CRCW12061R00F Resistor, 1206 SMD 1.0 R2 CRCW12064990F Resistor, 1206 SMD 499 CRCW2512101J Resistor, 2512 SMD 100, 1Ω R3, 4 (1) R5 CRCW12064022F Resistor, 1206 SMD 40.2K R6, 7, 13 CRCW120610R0F Resistor, 1206 SMD 10 R8 CRCW12061002F Resistor, 1206 SMD 10K R9 CRCW120623R7F Resistor, 1206 SMD 23.7 R10 CRCW12062002F Resistor, 1206 SMD 20K R11 CRCW120649R9F Resistor, 1206 SMD 49.9 R12 CRCW12063010F Resistor, 1206 SMD 301 R14 CRCW12061001F Resistor, 1206 SMD 1.0K T1 (1) A9784-B Power Transformer, Coilcraft 33Ω, 10A Data sheets for L1, L2, and T1 are available from Coilcraft at http://www.coi1craft.com/prod_pwr.cfm. SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1305 LM5030 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 7 PCB Layout Diagrams www.ti.com Table 1. Bill Of Materials (continued) Item Part Number Description Value T2 (2) P8208T Current Transformer, Pulse Eng. 100:1, 10A (3) U1 (2) (3) 12 LM5030 PWM Regulator, Texas Instruments U2 MOCD207M Opto-Coupler, Fairchild U3 LM3411 Reference Regulator, Texas Instruments 3.3V Q1, 2 SUD19N20-90 FET, N Channel, Vishay 200V, 19A J1-3 651-1727010 Dual Terminals, Mouser 3 per Assy. Data sheet for T2 is available from Pulse Engineering at http://www.pulseeng.com/default.cfm. LM5030 100V Push-Pull Current Mode PWM Controller (SNVS215) PCB Layout Diagrams Figure 7. Bottom Layer (viewed from top) 8 AN-1305 LM5030 Evaluation Board SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated PCB Layout Diagrams www.ti.com Figure 8. Top Silk Screen Figure 9. Top Layer SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1305 LM5030 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 9 Board Schematic 13 www.ti.com Board Schematic Figure 10. Board Schematic 10 AN-1305 LM5030 Evaluation Board SNVA078A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated