LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 LMZ14201 1A SIMPLE SWITCHER® Power Module with 42V Maximum Input Voltage Check for Samples: LMZ14201 FEATURES 1 • • • 2 • • • • • • • Integrated Shielded Inductor Simple PCB Layout Flexible Startup Sequencing Using External Soft-start and Precision Enable Protection Against Inrush Currents and Faults such as Input UVLO and Output Short Circuit – 40°C to 125°C Junction Temperature Range Single Exposed Pad and Standard Pinout for Easy Mounting and Manufacturing Fast Transient Response for Powering FPGAs and ASICs Low Output Voltage Ripple Pin-to-pin Compatible Family: – LMZ14203/2/1 (42V Max 3A, 2A, 1A) – LMZ12003/2/1 (20V Max 3A, 2A, 1A) Fully Enabled for Webench® Power Designer APPLICATIONS • • • • Point of Load Conversions from 12V and 24V Input Rail Time Critical Projects Space Constrained / High Thermal Requirement Applications Negative Output Voltage Applications (See AN-2027) SNVA425 DESCRIPTION The LMZ14201 SIMPLE SWITCHER power module is an easy-to-use step-down DC-DC solution capable of driving up to 1A load with exceptional power conversion efficiency, line and load regulation, and output accuracy. The LMZ14201 is available in an innovative package that enhances thermal performance and allows for hand or machine soldering. The LMZ14201 can accept an input voltage rail between 6V and 42V and deliver an adjustable and highly accurate output voltage as low as 0.8V. The LMZ14201 only requires three external resistors and four external capacitors to complete the power solution. The LMZ14201 is a reliable and robust design with the following protection features: thermal shutdown, input under-voltage lockout, output overvoltage protection, short-circuit protection, output current limit, and allows startup into a pre-biased output. A single resistor adjusts the switching frequency up to 1 MHz. ELECTRICAL SPECIFICATIONS • • • • • 6W Maximum Total Output Power Up to 1A Output Current Input Voltage Range 6V to 42V Output Voltage Range 0.8V to 6V Efficiency up to 90% PERFORMANCE BENEFITS • • • Figure 1. Easy To Use 7 Pin Package PFM 7 Pin Package 10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in) θJA = 20°C/W, θJC = 1.9°C/W RoHS Compliant • Operates at High Ambient Temperature with no Thermal Derating High Efficiency Reduces System Heat Generation Low Radiated Emissions (EMI) Complies with EN55022 Class B Standard Low External Component Count 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com System Performance Efficiency VIN = 24V VOUT = 5.0V 100 95 EFFICIENCY (%) 90 85 80 75 70 65 60 55 50 0 0.4 0.2 0.6 0.8 1 OUTPUT CURRENT (A) Thermal Derating Curve VIN = 24V, VOUT = 5.0V, 1.2 OUTPUT CURRENT (A) 1 0.8 0.6 0.4 0.2 0 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) Radiated Emissions (EN 55022 Class B) from Evaluation Board RADIATED EMISSIONS (dBµV/m) 80.0 70.0 60.0 50.0 EN 55022 CLASS B LIMIT 40.0 30.0 20.0 10.0 0.0 0 200 400 600 800 1000 FREQUENCY (MHz) 2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Simplified Application Schematic VOUT FB SS EN VIN GND VIN RON LMZ14201 VOUT RFBT 5V 3.3V 2.5V 1.8V 1.5V 1.2V 0.8V 5.62k 3.32k 2.26k 1.87k 1.00k 4.22k 0 RFBB 1.07k 1.07k 1.07k 1.50k 1.13k 8.45k 39.2k RON VIN Range 100k 61.9k 47.5k 32.4k 28.0k 22.6k 24.9k 7.5...42V 6...42V 6...30V 6...25V 6...21V 6...19V 6...18V VOUT @ 1A CFF RON 0.022 PF RFBT See Table Enable See Table CIN CSS RFBB 10 PF 0.022 PF See Table 100 PF Connection Diagram Exposed Pad Connect to GND 7 6 5 4 3 2 1 VOUT FB SS GND EN RON VIN Figure 2. Top View 7-Lead PFM Pin Descriptions Pin Name Description 1 VIN Supply input — Nominal operating range is 6V to 42V . A small amount of internal capacitance is contained within the package assembly. Additional external input capacitance is required between this pin and exposed pad. 2 RON On Time Resistor — An external resistor from VIN to this pin sets the on-time of the application. Typical values range from 25k to 124k ohms. 3 EN 4 GND 5 SS Soft-Start — An internal 8 µA current source charges an external capacitor to produce the soft-start function. This node is discharged at 200 µA during disable, over-current, thermal shutdown and internal UVLO conditions. 6 FB Feedback — Internally connected to the regulation, over-voltage, and short-circuit comparators. The regulation reference point is 0.8V at this input pin. Connected the feedback resistor divider between the output and ground to set the output voltage. 7 VOUT EP EP Enable — Input to the precision enable comparator. Rising threshold is 1.18V nominal; 90 mV hysteresis nominal. Maximum recommended input level is 6.5V. Ground — Reference point for all stated voltages. Must be externally connected to EP. Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad. Exposed Pad — Internally connected to pin 4. Used to dissipate heat from the package during operation. Must be electrically connected to pin 4 external to the package. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 3 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Absolute Maximum Ratings www.ti.com (1) (2) VIN, RON to GND -0.3V to 43.5V EN, FB, SS to GND -0.3V to 7V Junction Temperature 150°C Storage Temperature Range -65°C to 150°C ESD Susceptibility (3) ± 2 kV For soldering specifications: see product folder at www.ti.com and SNOA549 (1) (2) (3) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114. Operating Ratings (1) VIN 6V to 42V EN 0V to 6.5V −40°C to 125°C Operation Junction Temperature (1) 4 Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 24V, Vout = 3.3V Symbol Parameter Conditions Min Typ Max 1.10 1.18 1.25 (1) (2) (1) Units SYSTEM PARAMETERS Enable Control (3) VEN VEN-HYS EN threshold trip point VEN rising EN threshold hysteresis VEN falling SS source current VSS = 0V V 90 mV Soft-Start ISS ISS-DIS 5 SS discharge current 8 11 µA -200 µA Current Limit ICL Current limit threshold d.c. average 1.4 1.95 3.0 A ON/OFF Timer tON-MIN tOFF ON timer minimum pulse width 150 ns OFF timer pulse width 260 ns Regulation and Over-Voltage Comparator VFB VFB-OV In-regulation feedback voltage VSS >+ 0.8V TJ = -40°C to 125°C IO = 1A .777 0.798 0.818 V VSS >+ 0.8V TJ = 25°C IO = 10 mA 0.786 0.802 0.818 V Feedback over-voltage protection threshold 0.92 V IFB Feedback input bias current 5 nA IQ Non Switching Input Current VFB= 0.86V 1 mA ISD Shut Down Quiescent Current VEN= 0V 25 μA Thermal Shutdown Rising 165 °C Thermal shutdown hysteresis Falling 15 °C Junction to Ambient (4) 4 layer JEDEC Printed Circuit Board, 100 vias, No air flow 19.3 °C/W 2 layer JEDEC Printed Circuit Board, No air flow 21.5 °C/W No air flow 1.9 °C/W Thermal Characteristics TSD TSD-HYST θJA θJC Junction to Case PERFORMANCE PARAMETERS ΔVO (2) (3) (4) 8 mV PP Line Regulation VIN = 12V to 42V, IO= 1A .01 % ΔVO/IOUT Load Regulation VIN = 24V 1.5 mV/A Efficiency VIN = 24V VO = 3.3V IO = 1A 92 % η (1) Output Voltage Ripple ΔVO/ΔVIN Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are at 25°C and represent the most likely parametric norm. EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test. θJA measured on a 1.705” x 3.0” four layer board, with one ounce copper, thirty five 12 mil thermal vias, no air flow, and 1W power dissipation. Refer to PCB layout diagrams Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 5 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 6V Input @ 25°C 95 3.3 2.5 1.8 1.5 1.2 0.8 85 80 75 70 65 1.8 1.5 0.2 1.2 0.8 0.15 0.1 60 25°C 0.05 55 50 3.3 2.5 0.25 DISSIPATION (W) EFFICIENCY (%) 90 Dissipation 6V Input @ 25°C 0.3 100 25°C 0 0 0.2 0.4 0.6 0.8 0 1 0.2 OUTPUT CURRENT (A) Figure 3. Efficiency 12V Input @ 25°C 85 80 75 6.0 5.0 0.375 DISSIPATION (W) 90 EFFICIENCY (%) 1 0.8 Dissipation 12V Input @ 25°C 0.45 6.0 5.0 3.3 2.5 1.8 1.5 1.2 0.8 95 70 65 3.3 2.5 0.3 1.8 1.5 0.225 1.2 0.8 0.15 25°C 60 0.075 55 25°C 0 0.2 0.4 0.6 0.8 0 1 0 0.2 OUTPUT CURRENT (A) 0.4 0.6 0.8 1 OUTPUT CURRENT (A) Figure 5. Figure 6. Efficiency 24V Input @ 25°C Dissipation 24V Input @ 25°C 100 0.7 95 0.6 85 80 DISSIPATION (W) 6.0 5.0 3.3 2.5 1.8 90 EFFICIENCY (%) 0.6 Figure 4. 100 50 0.4 OUTPUT CURRENT (A) 75 70 65 6.0 5.0 3.3 2.5 0.5 0.4 1.8 0.3 0.2 60 0.1 55 50 25°C 0 0.2 0.4 0.6 0.8 1 OUTPUT CURRENT (A) 0 0.2 0.4 0.6 0.8 1 OUTPUT CURRENT (A) Figure 7. 6 25°C 0 Figure 8. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 36V Input @ 25°C Dissipation 36V Input @ 25°C 1.2 100 95 1.0 6.0 5.0 85 DISSIPATION (W) EFFICIENCY (%) 90 80 3.3 75 70 65 60 0.6 3.3 0.4 0.2 55 50 6.0 5.0 0.8 25°C 25°C 0 0 0.2 0.4 0.6 0.8 0.2 0 1 0.4 0.6 0.8 1 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 9. Figure 10. Efficiency 42V Input @ 25°C Dissipation 42V Input @ 25°C 1.2 100 95 1.0 85 DISSIPATION (W) EFFICIENCY (%) 90 6.0 5.0 80 75 3.3 70 65 60 5.0 0.8 3.3 0.6 0.4 0.2 55 50 6.0 25°C 25°C 0 0.2 0.4 0.6 0.8 0 1 0 0.2 OUTPUT CURRENT (A) 0.4 0.6 1 0.8 OUTPUT CURRENT (A) Figure 11. Figure 12. Efficiency 6V Input @ 85°C Dissipation 6V Input @ 85°C 0.45 100 95 85 80 DISSIPATION (W) EFFICIENCY (%) 0.375 3.3 2.5 1.8 1.5 1.2 90 75 70 65 0.3 0.225 1.2 0.15 85°C 60 0.075 55 50 3.3 2.5 1.8 1.5 85°C 0 0.2 0.4 0.6 0.8 1 OUTPUT CURRENT (A) 0 0 0.2 0.4 0.6 0.8 1 OUTPUT CURRENT (A) Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 7 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 8V Input 85°C 95 5.0 3.3 2.5 1.8 1.5 1.2 85 80 75 70 65 0.3 0.225 1.2 0.15 85°C 60 0.075 55 50 5.0 3.3 2.5 1.8 1.5 0.375 DISSIPATION (W) EFFICIENCY (%) 90 Dissipation 8V Input 85°C 0.45 100 85°C 0 0 0.2 0.4 0.6 0.8 1 0 0.2 OUTPUT CURRENT (A) Figure 15. 100 Efficiency 12V Input@ 85°C 1 0.8 Dissipation 12V Input @ 85°C 0.6 6.0 5.0 3.3 2.5 1.8 1.5 1.2 85 80 0.5 DISSIPATION (W) 90 EFFICIENCY (%) 0.6 Figure 16. 95 75 70 65 60 6.0 5.0 3.3 2.5 0.4 0.3 1.8 1.5 0.2 1.2 0.1 55 50 0.4 OUTPUT CURRENT (A) 85°C 0 0.2 0.4 0.6 0.8 85°C 0 1 0 0.2 OUTPUT CURRENT (A) 0.4 0.6 0.8 1 OUTPUT CURRENT (A) Figure 17. Figure 18. Efficiency 24V Input @ 85°C Dissipation 24V Input @ 85°C 100 1.2 95 80 6.0 5.0 3.3 2.5 75 1.8 85 1.0 DISSIPATION (W) EFFICIENCY (%) 90 70 65 60 8 6.0 5.0 0.6 0.4 3.3 2.5 0.2 1.8 55 50 0.8 85°C 85°C 0 0 0.2 0.4 0.6 0.8 1 0 0.2 0.4 0.6 0.8 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 19. Figure 20. Submit Documentation Feedback 1 Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 36V Input @ 85°C 100 Dissipation 36V Input @ 85°C 1.2 95 80 6.0 5.0 75 3.3 DISSIPATION (W) EFFICIENCY (%) 85 70 65 60 0.8 0.6 3.3 0.4 0.2 55 50 6.0 5.0 1.0 90 85°C 0 0.4 0.2 0.6 0.8 85°C 0 1 0.2 0 OUTPUT CURRENT (A) 0.4 0.6 Figure 21. Figure 22. Efficiency 42V Input @ 85°C Dissipation 42V Input @ 85°C 1.2 100 6.0 95 1.0 85 DISSIPATION (W) EFFICIENCY (%) 90 6.0 5.0 80 75 3.3 70 65 60 5.0 0.8 3.3 0.6 0.4 0.2 55 50 1 0.8 OUTPUT CURRENT (A) 85°C 0 0 0.4 0.2 0.6 0.8 1 85°C 0 0.2 0.4 0.6 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 23. Figure 24. Line and Load Regulation @ 25°C 1 0.8 Line and Load Regulation @ 85°C 3.34 3.36 3.32 3.34 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 24 42 3.30 6 3.28 24 8 20 12 3.26 36 42 3.32 36 8 12 20 3.28 25°C 85°C 3.24 0 6 3.30 0.2 0.4 0.6 0.8 1.0 OUTPUT CURRENT (A) 3.26 0 0.2 0.4 0.6 0.8 1.0 OUTPUT CURRENT (A) Figure 25. Figure 26. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 9 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Output Ripple 24VIN 3.3VO 1A, BW = 200 MHz Transient Response 24VIN 3.3VO 0.5A to 1A Step 0.5 A/Div 20 mV/Div Figure 27. Figure 28. Thermal Derating VOUT = 3.3V 1.2 Current Limit 1.8VOUT@ 25°C 2.4 1 2.3 0.8 CURRENT (A) OUTPUT CURRENT (A) 200 Ps/Div 6VIN 0.6 12VIN 0.4 ÆJA = 19°C/W 24VIN VOUT = 3.3V 36VIN 0.2 2.2 SHORT CIRCUIT 2.1 2.0 ONSET 1.9 0 50 70 60 80 90 25°C 1.8 100 110 120 0 5 10 15 20 25 AMBIENT TEMPERATURE (C) INPUT VOLTAGE (V) Figure 29. Figure 30. Current Limit 3.3VOUT@ 25°C 2.4 Current Limit 3.3VOUT@ 85°C 2.5 2.3 2.4 SHORT CIRCUIT 2.2 CURRENT (A) CURRENT (A) SHORT CIRCUIT 2.1 ONSET 2.0 2.3 2.2 2.1 ONSET 1.9 2.0 25°C 1.8 10 20 30 40 50 INPUT VOLTAGE (V) 0 10 20 30 40 50 INPUT VOLTAGE (V) Figure 31. 10 85°C 1.9 0 Figure 32. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 APPLICATION BLOCK DIAGRAM Vin VIN 1 Linear reg CIN Cvcc 5 SS Css CBST 3 EN RON 2 VOUT 7 RON Timer CFF 6 10 PH VO Co FB RFBT RFBB 0.47 PF Regulator IC Internal Passives GND 4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 11 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com COT CONTROL CIRCUIT OVERVIEW Constant On Time control is based on a comparator and an on-time one shot, with the output voltage feedback compared with an internal 0.8V reference. If the feedback voltage is below the reference, the main MOSFET is turned on for a fixed on-time determined by a programming resistor RON. RON is connected to VIN such that ontime is reduced with increasing input supply voltage. Following this on-time, the main MOSFET remains off for a minimum of 260 ns. If the voltage on the feedback pin falls below the reference level again the on-time cycle is repeated. Regulation is achieved in this manner. Design Steps for the LMZ14201 Application The LMZ14201 is fully supported by Webench® and offers the following: Component selection, electrical and thermal simulations as well as the build-it board for a reduction in design time. The following list of steps can be used to manually design the LMZ14201 application. • • • • • • • • Select minimum operating VIN with enable divider resistors Program VO with divider resistor selection Program turn-on time with soft-start capacitor selection Select CO Select CIN Set operating frequency with RON Determine module dissipation Layout PCB for required thermal performance ENABLE DIVIDER, RENT AND RENB SELECTION The enable input provides a precise 1.18V band-gap rising threshold to allow direct logic drive or connection to a voltage divider from a higher enable voltage such as VIN. The enable input also incorporates 90 mV (typ) of hysteresis resulting in a falling threshold of 1.09V. The maximum recommended voltage into the EN pin is 6.5V. For applications where the midpoint of the enable divider exceeds 6.5V, a small zener can be added to limit this voltage. The function of this resistive divider is to allow the designer to choose an input voltage below which the circuit will be disabled. This implements the feature of programmable under voltage lockout. This is often used in battery powered systems to prevent deep discharge of the system battery. It is also useful in system designs for sequencing of output rails or to prevent early turn-on of the supply as the main input voltage rail rises at powerup. Applying the enable divider to the main input rail is often done in the case of higher input voltage systems such as 24V AC/DC systems where a lower boundary of operation should be established. In the case of sequencing supplies, the divider is connected to a rail that becomes active earlier in the power-up cycle than the LMZ14201 output rail. The two resistors should be chosen based on the following ratio: RENT / RENB = (VIN UVLO/ 1.18V) – 1 (1) The LMZ14201 demonstration and evaluation boards use 11.8kΩ for RENB and 68.1kΩ for RENT resulting in a rising UVLO of 8V. This divider presents 6.25V to the EN input when the divider input is raised to 42V. The EN pin is internally pulled up to VIN and can be left floating for always-on operation. OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VO and ground. The midpoint of the divider is connected to the FB input. The voltage at FB is compared to a 0.8V internal reference. In normal operation an on-time cycle is initiated when the voltage on the FB pin falls below 0.8V. The main MOSFET ontime cycle causes the output voltage to rise and the voltage at the FB to exceed 0.8V. As long as the voltage at FB is above 0.8V, on-time cycles will not occur. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VO = 0.8V * (1 + RFBT / RFBB) (2) Rearranging terms; the ratio of the feedback resistors for a desired output voltage is: RFBT / RFBB = (VO / 0.8V) - 1 (3) These resistors should be chosen from values in the range of 1.0 kohm to 10.0 kohm. 12 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 For VO = 0.8V the FB pin can be connected to the output directly so long as an output preload resistor remains that draws more than 20uA. Converter operation requires this minimum load to create a small inductor ripple current and maintain proper regulation when no load is present. A feed-forward capacitor is placed in parallel with RFBT to improve load step transient response. Its value is usually determined experimentally by load stepping between DCM and CCM conduction modes and adjusting for best transient response and minimum output ripple. A table of values for RFBT , RFBB , CFF and RON is included in the applications schematic. SOFT-START CAPACITOR SELECTION Programmable soft-start permits the regulator to slowly ramp to its steady state operating point after being enabled, thereby reducing current inrush from the input supply and slowing the output voltage rise-time to prevent overshoot. Upon turn-on, after all UVLO conditions have been passed, an internal 8uA current source begins charging the external soft-start capacitor. The soft-start time duration to reach steady state operation is given by the formula: tSS = VREF * CSS / Iss = 0.8V * CSS / 8uA (4) This equation can be rearranged as follows: CSS = tSS * 8 μA / 0.8V (5) Use of a 0.022μF results in 2.2 msec soft-start interval which is recommended as a minimum value. As the soft-start input exceeds 0.8V the output of the power stage will be in regulation. The soft-start capacitor continues charging until it reaches approximately 3.8V on the SS pin. Voltage levels between 0.8V and 3.8V have no effect on other circuit operation. Note that the following conditions will reset the soft-start capacitor by discharging the SS input to ground with an internal 200 μA current sink. • • • • The enable input being “pulled low” Thermal shutdown condition Over-current fault Internal Vcc UVLO (Approximately 4V input to VIN) CO SELECTION None of the required CO output capacitance is contained within the module. At a minimum, the output capacitor must meet the worst case minimum ripple current rating of 0.5 * ILR P-P, as calculated in Equation 19 below. Beyond that, additional capacitance will reduce output ripple so long as the ESR is low enough to permit it. A minimum value of 10 μF is generally required. Experimentation will be required if attempting to operate with a minimum value. Ceramic capacitors or other low ESR types are recommended. See AN-2024 for more detail. Equation 6 provides a good first pass approximation of CO for load transient requirements: CO≥ISTEP*VFB*L*VIN/ (4*VO*(VIN—VO)*VOUT-TRAN) (6) Solving: CO≥ 1A*0.8V*10μH*24V / (4*3.3V*( 24V — 3.3V)*33mV) ≥ 21.3μF (7) The LMZ14201 demonstration and evaluation boards are populated with a 100 uF 6.3V X5R output capacitor. Locations for other output capacitors are provided. CIN SELECTION The LMZ14201 module contains an internal 0.47 µF input ceramic capacitor. Additional input capacitance is required external to the module to handle the input ripple current of the application. This input capacitance should be located in very close proximity to the module. Input capacitor selection is generally directed to satisfy the input ripple current requirements rather than by capacitance value. Worst case input ripple current rating is dictated by Equation 8: I(CIN(RMS)) ≊ 1 /2 * IO * √ (D / 1-D) (8) where D ≊ VO / VIN (As a point of reference, the worst case ripple current will occur when the module is presented with full load current and when VIN = 2 * VO). Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 13 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com Recommended minimum input capacitance is 10uF X7R ceramic with a voltage rating at least 25% higher than the maximum applied input voltage for the application. It is also recommended that attention be paid to the voltage and temperature deratings of the capacitor selected. It should be noted that ripple current rating of ceramic capacitors may be missing from the capacitor data sheet and you may have to contact the capacitor manufacturer for this rating. If the system design requires a certain minimum value of input ripple voltage ΔVIN be maintained then Equation 9 may be used. CIN ≥ IO * D * (1–D) / fSW-CCM * ΔVIN (9) If ΔVIN is 1% of VIN for a 24V input to 3.3V output application this equals 240 mV and fSW = 400 kHz. CIN≥ 1A * 3.3V/24V * (1– 3.3V/24V) / (400000 * 0.240 V) ≥ 0.9μF Additional bulk capacitance with higher ESR may be required to damp any resonant effects of the input capacitance and parasitic inductance of the incoming supply lines. RON RESISTOR SELECTION Many designs will begin with a desired switching frequency in mind. For that purpose Equation 10 can be used. fSW(CCM) ≊ VO / (1.3 * 10-10 * RON) (10) This can be rearranged as RON ≊ VO / (1.3 * 10 -10 * fSW(CCM)) (11) The selection of RON and fSW(CCM) must be confined by limitations in the on-time and off-time for the COT Control Circuit Overview section. The on-time of the LMZ14201 timer is determined by the resistor RON and the input voltage VIN. It is calculated as follows: tON = (1.3 * 10-10 * RON) / VIN (12) The inverse relationship of tON and VIN gives a nearly constant switching frequency as VIN is varied. RON should be selected such that the on-time at maximum VIN is greater than 150 ns. The on-timer has a limiter to ensure a minimum of 150 ns for tON. This limits the maximum operating frequency, which is governed by Equation 13: fSW(MAX) = VO / (VIN(MAX) * 150 nsec) (13) This equation can be used to select RON if a certain operating frequency is desired so long as the minimum ontime of 150 ns is observed. The limit for RON can be calculated as follows: RON ≥ VIN(MAX) * 150 nsec / (1.3 * 10 -10) (14) If RON calculated in Equation 11 is less than the minimum value determined in Equation 14 a lower frequency should be selected. Alternatively, VIN(MAX) can also be limited in order to keep the frequency unchanged. Additionally note, the minimum off-time of 260 ns limits the maximum duty ratio. Larger RON (lower FSW) should be selected in any application requiring large duty ratio. Discontinuous Conduction and Continuous Conduction Modes At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the critical conduction point, it will operate in continuous conduction mode (CCM). When operating in DCM the switching cycle begins at zero amps inductor current; increases up to a peak value, and then recedes back to zero before the end of the off-time. Note that during the period of time that inductor current is zero, all load current is supplied by the output capacitor. The next on-time period starts when the voltage on the at the FB pin falls below the internal reference. The switching frequency is lower in DCM and varies more with load current as compared to CCM. Conversion efficiency in DCM is maintained since conduction and switching losses are reduced with the smaller load and lower switching frequency. Operating frequency in DCM can be calculated as follows: fSW(DCM)≊VO*(VIN-1)*10μH*1.18*1020*IO/(VIN–VO)*RON2 (15) In CCM, current flows through the inductor through the entire switching cycle and never falls to zero during the off-time. The switching frequency remains relatively constant with load current and line voltage variations. The CCM operating frequency can be calculated using Equation 7 above. 14 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Following is a comparison pair of waveforms of the showing both CCM (upper) and DCM operating modes. Figure 33. CCM and DCM Operating Modes VIN = 12V, VO = 3.3V, IO = 1 A / 0.25 A 500 mA/Div 2.00 Ps/Div The approximate formula for determining the DCM/CCM boundary is as follows: IDCB≊VO*(VIN–VO)/(2*10 μH*fSW(CCM)*VIN) (16) Following is a typical waveform showing the boundary condition. Figure 34. Transition Mode Operation VIN = 24V, VO = 3.3V, IO = 0.29 A 500 mA/Div 2.00 Ps/Div The inductor internal to the module is 10 μH. This value was chosen as a good balance between low and high input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple current (ILR). ILR can be calculated with: ILR P-P=VO*(VIN- VO)/(10µH*fSW*VIN) (17) Where VIN is the maximum input voltage and fSW is determined from Equation 10. If the output current IO is determined by assuming that IO = IL, the higher and lower peak of ILR can be determined. Be aware that the lower peak of ILR must be positive if CCM operation is required. POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS For the design case of VIN = 24V, VO = 3.3V, IO = 1A, TAMB(MAX) = 85°C , and TJUNCTION = 125°C, the device must see a thermal resistance from case to ambient of less than: θCA< (TJ-MAX — TAMB(MAX)) / PIC-LOSS - θJC (18) Given the typical thermal resistance from junction to case to be 1.9 °C/W. Use the 85°C power dissipation curves in the Typical Performance Characteristics section to estimate the PIC-LOSS for the application being designed. In this application it is 0.52W. θCA = (125 — 85) / 0.52W — 1.9 = 75 To reach θCA = 75, the PCB is required to dissipate heat effectively. With no airflow and no external heat, a good estimate of the required board area covered by 1 oz. copper on both the top and bottom metal layers is: Board Area_cm2 = 500°C x cm2/W / θJC (19) Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 15 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com As a result, approximately 6 square cm of 1 oz copper on top and bottom layers is required for the PCB design. Additional area will decrease die temperature proportionately. The PCB copper heat sink must be connected to the exposed pad. Approximately thirty six, 10mils (254 μm) thermal vias spaced 59mils (1.5 mm) apart must connect the top copper to the bottom copper. For an example of a high thermal performance PCB layout of approximately 31 square cm area. Refer to the Evaluation Board application note AN-2024 SNVA422. For more information on thermal design see AN-2020 SNVA419 and AN-2026 SNVA424. PC BOARD LAYOUT GUIDELINES PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DC-DC converter and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage drop in the traces. These can send erroneous signals to the DC-DC converter resulting in poor regulation or instability. Good layout can be implemented by following a few simple design rules. VIN LMZ14201 VIN VO VOUT High di/dt Cin1 CO1 GND Loop 2 Loop 1 1. Minimize area of switched current loops. From an EMI reduction standpoint, it is imperative to minimize the high di/dt paths during PC board layout. The high current loops that do not overlap have high di/dt content that will cause observable high frequency noise on the output pin if the input capacitor (Cin1) is placed at a distance away from the LMZ14201. Therefore place CIN1 as close as possible to the LMZ14201 VIN and GND exposed pad. This will minimize the high di/dt area and reduce radiated EMI. Additionally, grounding for both the input and output capacitor should consist of a localized top side plane that connects to the GND exposed pad (EP). 2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components should be routed to the GND pin of the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Provide the single point ground connection from pin 4 to EP. 3. Minimize trace length to the FB pin. Both feedback resistors, RFBT and RFBB, and the feed forward capacitor CFF, should be located close to the FB pin. Since the FB node is high impedance, maintain the copper area as small as possible. The trace are from RFBT, RFBB, and CFF should be routed away from the body of the LMZ14201 to minimize noise. 4. Make input and output bus connections as wide as possible. This reduces any voltage drops on the input or output of the converter and maximizes efficiency. To optimize voltage accuracy at the load, ensure that a separate feedback voltage sense trace is made to the load. Doing so will correct for voltage drops and provide optimum output accuracy. 5. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If the PCB has a plurality of copper layers, these thermal vias can also be employed to make connection to inner layer heat-spreading ground planes. For best results use a 6 x 6 via array with minimum via diameter of 10mils (254 μm) thermal vias spaced 59mils (1.5 mm). Ensure enough copper area is used for heat-sinking to keep the junction temperature below 125°C. 16 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Additional Features OUTPUT OVER-VOLTAGE COMPARATOR The voltage at FB is compared to a 0.92V internal reference. If FB rises above 0.92V the on-time is immediately terminated. This condition is known as over-voltage protection (OVP). It can occur if the input voltage is increased very suddenly or if the output load is decreased very suddenly. Once OVP is activated, the top MOSFET on-times will be inhibited until the condition clears. Additionally, the synchronous MOSFET will remain on until inductor current falls to zero. CURRENT LIMIT Current limit detection is carried out during the off-time by monitoring the current in the synchronous MOSFET. Referring to the Functional Block Diagram, when the top MOSFET is turned off, the inductor current flows through the load, the PGND pin and the internal synchronous MOSFET. If this current exceeds 2.0 (typical) the current limit comparator disables the start of the next on-time period. The next switching cycle will occur only if the FB input is less than 0.8V and the inductor current has decreased below 2.0A. Inductor current is monitored during the period of time the synchronous MOSFET is conducting. So long as inductor current exceeds 2.0A, further on-time intervals for the top MOSFET will not occur. Switching frequency is lower during current limit due to the longer off-time. It should also be noted that current limit is dependent on both duty cycle and temperature as illustrated in the graphs in the Typical Performance Characteristics section. THERMAL PROTECTION The junction temperature of the LMZ14201 should not be allowed to exceed its maximum ratings. Thermal protection is implemented by an internal Thermal Shutdown circuit which activates at 165 °C (typ) causing the device to enter a low power standby state. In this state the main MOSFET remains off causing VO to fall, and additionally the CSS capacitor is discharged to ground. Thermal protection helps prevent catastrophic failures for accidental device overheating. When the junction temperature falls back below 145 °C (typ Hyst = 20 °C) the SS pin is released, VO rises smoothly, and normal operation resumes. Applications requiring maximum output current especially those at high input voltage may require application derating at elevated temperatures. ZERO COIL CURRENT DETECTION The current of the lower (synchronous) MOSFET is monitored by a zero coil current detection circuit which inhibits the synchronous MOSFET when its current reaches zero until the next on-time. This circuit enables the DCM operating mode, which improves efficiency at light loads. PRE-BIASED STARTUP The LMZ14201 will properly start up into a pre-biased output. This startup situation is common in multiple rail logic applications where current paths may exist between different power rails during the startup sequence. The following scope capture shows proper behavior during this event. Figure 35. Pre-Biased Startup OUTPUT VOLTAGE 2V PRE-BIAS OUTPUT CURRENT ENABLE 3.3V OUTPUT 1.0 V/Div 0.5 A/Div 2.0 V/Div 1 ms/Div Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 17 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com Evaluation Board Schematic Diagram and BOM U1 EP VIN Enable VOUT 3.3VO @ 1A 7 FB SS 6 GND 5 VIN EN 4 3 2 1 RON LMZ14201TZ-ADJ 6.0V to 42V RENT CFF 68.1k 0.022 PF RON RFBT 61.9k RENB 11.8k 18 CIN2 D1 OPT 10 PF 3.32k CIN1 CSS 1 PF 0.022 PF RFBB 1.07k CO1 CO2 1 PF 100 PF Ref Des Description Case Size Manufacturer Manufacturer P/N U1 SIMPLE SWITCHER ® PFM-7 Texas Instruments LMZ14201TZ-ADJ Cin1 1 µF, 50V, X7R 1206 Taiyo Yuden UMK316B7105KL-T Cin2 10 µF, 50V, X7R 1210 Taiyo Yuden UMK325BJ106MM-T CO1 1 µF, 50V, X7R 1206 Taiyo Yuden UMK316B7105KL-T CO2 100 µF, 6.3V, X7R 1210 Taiyo Yuden JMK325BJ107MM-T RFBT 3.32 kΩ 0603 Vishay Dale CRCW06033K32FKEA RFBB 1.07 kΩ 0603 Vishay Dale CRCW06031K07FKEA RON 61.9 kΩ 0603 Vishay Dale CRCW060361k9FKEA RENT 68.1 kΩ 0603 Vishay Dale CRCW060368k1FKEA RENB 11.8 kΩ 0603 Vishay Dale CRCW060311k8FKEA CFF 22 nF, ±10%, X7R, 16V 0603 TDK C1608X7R1H223K CSS 22 nF, ±10%, X7R, 16V 0603 TDK C1608X7R1H223K D1 5.1V SOD-23 — Optional Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 LMZ14201 www.ti.com SNVS649E – JANUARY 2010 – REVISED MARCH 2013 Figure 36. Top View and Bottom View of Evaluation PCB Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 19 LMZ14201 SNVS649E – JANUARY 2010 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision D (March 2013) to Revision E • 20 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 19 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LMZ14201 PACKAGE OPTION ADDENDUM www.ti.com 3-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LMZ14201TZ-ADJ/NOPB ACTIVE PFM NDW 7 250 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 85 LMZ14201 TZ-ADJ LMZ14201TZE-ADJ/NOPB ACTIVE PFM NDW 7 45 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 85 LMZ14201 TZ-ADJ LMZ14201TZX-ADJ/NOPB ACTIVE PFM NDW 7 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 85 LMZ14201 TZ-ADJ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 3-Jun-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMZ14201TZ-ADJ/NOPB LMZ14201TZX-ADJ/NOP B Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant PFM NDW 7 250 330.0 24.4 10.6 14.22 5.0 16.0 24.0 Q2 PFM NDW 7 500 330.0 24.4 10.6 14.22 5.0 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ14201TZ-ADJ/NOPB PFM NDW 7 250 367.0 367.0 45.0 LMZ14201TZX-ADJ/NOPB PFM NDW 7 500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA NDW0007A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA07A (Rev D) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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