UHF Transmitter OL2300

AN11065
UHF Transmitter OL2300
Rev. 1 — 18 July 2011
Application note
Document information
Info
Content
Keywords
OL2300, transmitter, UHF
Abstract
Provides application related information for the UHF transmitter OL2300. It
focuses on schematic and layout recommendations for an application
board and methods for enhancing the quality of the RF output signal.
AN11065
NXP Semiconductors
UHF Transmitter OL2300
Revision history
Rev
Date
Description
1
20110718
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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UHF Transmitter OL2300
1. Introduction
This application note provides application related information for the UHF transmitter
OL2300. It focuses on schematic and layout recommendations for an application board
and methods for enhancing the quality of the RF output signal.
A note about the CKOUT signal is given in Section 6 on page 12.
Power measurements which are dependent on the output impedance are provided in
Section 7 on page 19.
2. Board design
2.1 Schematic
The highly integrated design of the OL2300 requires only a few external components to
build an RF transmitter. Figure 1 shows the OL2300 in a typical application.
C3
VDD
47 nF
C1
C2
220 nF
100 pF
GND
VDD
IC
5
CKOUT
15
EN
2
SCK
1
SDIO
16
to microcontroller
XTAL1
R1
1 MΩ
R2
1 MΩ
R3
1 MΩ
XTAL2
X1
VREG
6
OL2300
GND
VDD(PA)
C9
12
TEST1/SDO
14
TEST2
13
10
4
3
9
8
GND
VDDA
7
GND
L2
RF-ANTENNA
(1)
C4
VDD
GND
VSSA
L1
PAOUT
C7
VSS(PA)
C6
11
VSS
C8
C5
GND
GND
GND
GND
GND
GND
019aac601
(1) Exposed die pad.
Fig 1.
Typical application schematic
The components used in this schematic are described in detail in Table 1. All parts marked
with an asterisk are relevant to UHF performance and should be selected carefully.
Special attention should be given to Self-Resonant Frequency (SRF) and quality factor Q.
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Table 1.
Typical application component descriptions
Component
Description
R1, R2, R3
Pull resistors are required to avoid floating voltage levels at input ports
EN, SCK, and SDIO. Undefined input ports leads to increased current
consumption. External resistors must be applied if the connected SPI
controller does not have internal ones.
X1, C4, C5
These three components form the external crystal resonator. The values
of C4 and C5 should be chosen according to the load capacitance of the
crystal. Both capacitors must have identical values.
C2[1], C3
C3 is used as a filter capacitor for the output of the on-chip voltage
regulator. The value must be at least 47 nF. In addition, capacitor C2 with
a value of 100 pF is inserted to inhibit output frequency feedback into the
regulated voltage.
C1
The main supply filter capacitor value of C1 must be at least twice the
value of C3.
L2[1], C9[1]
Choke inductance L2 provides the DC supply to the power amplifier. L2
and C9 decouple the RF signal from the DC supply VDD.
Value of L2 should be as high as possible, but in reality SRF and the
quality factor limits the usable values of the coil. For an output frequency
of 315 MHz it is recommended to select a value of 100 nH or 120 nH. The
corresponding values are 82 nH for 434 MHz and 68 nH for 868 MHz.
The inductor must be able to deliver up to 30 mA. For C9 a value of about
100 pF should be considered.
L1[1], C6[1], C7[1], C8[1]
Together with the RF-antenna, these elements form a low-pass Pi
network that transforms the impedance of the antenna to the power
amplifier input impedance. Capacitor C7 and C8 are connected in series,
since the network output impedance is very sensitive to the capacitance
provided by these components.
L1 enables adjustment of antenna inductance and therefore the network
quality factor.
Capacitor C6 mainly sets the input impedance reactance. The OL2300
internal tuning capacitor is in parallel with C6.
Test1/SDO, Test2
Both port lines are outputs. Pin Test1/SDO can be configured by register
settings as SPI data output.
If not used, both pins must be left unconnected.
[1]
Relevant to UHF performance, its value must be selected carefully.
2.2 Layout
An example of a two-layer PCB layout is shown in Figure 2.
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UHF Transmitter OL2300
019aac602
Blue: bottom layer; Red: top layer; Green: vias.
Fig 2.
Two-layer PCB layout; HVQFN package
Table 2 gives guidelines for designing an appropriate layout.
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UHF Transmitter OL2300
Table 2.
Application PCB layout guidelines
Item
Guideline
Ground plane
A ground plane below the active RF-part and the
crystal resonator is recommended for correct
RF-power transmission and high frequency
stability. In the given design, the ground plane is
only discontinued by the connection VREG to
VDDP.
There must not be a ground plane below the
antenna loop.
Antenna matching components
Antenna matching components must be placed
with the shortest distance to the power amplifier
output pin. Capacitor C6 is able to filter most
harmonics. Therefore, C6 must be placed very
close to PAOUT and VSSPA.
L1 and L2 must be placed perpendicular to each
other to avoid magnetic coupling.
C7 and C8 must be placed close to each other.
There must be a direct connection from C8 and
C6 to VSSPA.
Distance between the different components
must be kept small. Also valid for VSSPA (GND)
connection of C6, C8, and C9. Long ground
connection lines on top must be shortened by
placing vias to the bottom ground layer. This
improves filtering and reduces spurious
emissions.
L2 and C9
The choke should be applied directly to PAOUT.
C9 must be grounded by a via.
Pad below the HVQFN package
The middle pad of the OL2300 HVQFN package
must be connected to ground to improve output
signal behavior. The via at pin 11 (VSS) can
alternatively be placed directly in the middle of
the pad below the package.
C2
C2 must be placed directly at VDDA and VSSA,
to suppress the RF signal at the RF module
supply.
Crystal resonator
The crystal and load capacitors must be placed
close to XTAL1 and XTAL2 to minimize the
influence of PCB parasitics.
3. Phase noise
The OL2300 uses a fractional-N based PLL to synthesize the output frequency.
Such a PLL consists of a programmable frequency divider stage. The frequency divider of
the OL2300 is controlled by a 3-bit value which is used to divide the VCO-frequency by
any integer value between 64 and 71. A non-integer (fractional) division of the
VCO-frequency is feasible since the frequency divider control value changes with time.
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For this reason the control value consists of a fixed part and a time-dependent value
provided by a 2-bit-sigma delta-modulator as shown in the OL2300 data sheet. The fixed
part is given by the 3 MSBits of frequency control register FC, the frequency control value
of the PLL. The 2-bit time-dependent value is defined by the remaining 15 LSBits of FC.
The sigma-delta-modulator converts the 15-bit input to a time-dependent 2-bit output so
that the mean value of the output signal equals the input.
The phase noise of the output frequency is slightly worse compared to an integer PLL due
to the time-variant frequency divider. The FC value needs to be set carefully, as the
variation in phase and amplitude of the output frequency of the OL2300 depends on this
value.
3.1 Frequency modulation
The period of the time-dependent frequency divider control value provided by the
sigma-delta-modulator depends on its input value. A short period leads to an increased
phase noise at offset frequencies higher than 100 kHz. The modulator outputs a short
period, in particular, if the input value FC is a multiple of the exponential function with base
2:
FC = N  2p
The phase noise of the output frequency increases with the exponent p.
10
7
FC=N.2
12
FC=N.2
14
FC=N.2
0
Φn
(dBm)
-10
-20
-30
-40
-50
-60
-70
Fig 3.
0
2
4
6
8
10
fcarrier (MHz)
12
14
16
18
019aac603
Phase noise as a function of carrier frequency
Figure 3 shows the output spectrum measured with different settings of FC. Factor N is an
odd number of types:
N = 2  k + 1 for k  0
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The spectrum has been measured in peak detection mode with a span of twice the
reference frequency starting at the carrier.
Phase noise below an offset frequency of 100 kHz is constant and independent of the FC
settings. For offsets greater than 100 kHz, the phase noise becomes an important
parameter for applications with high data rates or FSK applications with a high modulation
index. In such cases it is recommended to omit frequency control values (FC) in the range
of 50 around:
FC = N  29 for 0  N  320
3.2 Amplitude modulation
Fractional-N based spurious emission appears in addition to reference spurs and
harmonic emissions in the output spectrum of the transmitter. The distance (fD) to the
carrier frequency depends on the reference frequency and the input value of the
sigma-delta-modulator, the 15 least significant bits of FC. Furthermore there is a
dependency on the 3rd MSB of FC that doubles the distance as given in Equation 1 and
Equation 2.
FC  14:0  + 0.5
f D = f REF  ------------------------------------16
2
(1)
for: 214 < FC[15:0]  3  214
FC  14:0  + 0.5
f D = f REF  ------------------------------------15
2
(2)
for the remaining values.
The amplitude of the emission increases as the distance to the carrier decreases.
Figure 4 shows the output spectrum, measured with FC set to 103304d = 19388h
(Equation 1 applies and FC[14:0] = 5000d = 1388h).
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Ref
10 dBm
* Att
20 dB
* RBW 3 kHz
VBW 10 kHz
1 SWT 2.8 s
10
Delta 2 [T1 ]
-42.69
680.000000000
Delta 3 [T1 ]
-45.63
9.200000000
0
1 PK *
AVG
Marker 1 [T1 ]
10.67 dBm
313.000420000 MHz
-10
dB
kHz
A
dB
MHz
-20
2
-30
3
-40
SWP
10 of
10
-50
-60
-70
-80
-90
Center 313.00042 MHz
2.5 MHz/
Span 25 MHz
019aac604
Marker 2 = fractional spurious.
Marker 3 = reference spurious emission.
Fig 4.
Output spectrum FC set to 103304d = 19388h
To limit the amplitude of the fractional spurious emission to about 40 dBc it is
recommended to avoid the following FC settings.
A range of 8000 should be avoided around:
FC = (2N + 1)  215 for 0  N  2
and a range of 2000 should be avoided around:
FC = 2N  215 for 0  N  2.
3.3 Inappropriate FC settings
Figure 5 shows the FC values that should be avoided according to the formulae above.
• The black marked values belong to the AM fractional spurs and should be avoided for
all applications
• The blue values belong to the FM phase noise and should be avoided for applications
using either a high data rate or a high FSK modulation index. Only the phase noise
above an offset frequency of 100 kHz is affected by FM phase noise.
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101
1∙212
0
2∙212
3∙212
4∙212
16001
1∙215
0
Fig 5.
2∙215
FC
4001
3∙215
4∙215
5∙215
019aac605
FC values to be avoided
The upper part of the diagram magnifies the first section of the available data range to
make the blue marked values more visible. The lower diagram is scaled to the usable data
range of FC.
For ASK, the FC value is constant and depends on the settings of the frequency control
register FCxL, FCxH, and FCA. For FSK and Soft-FSK, the actual value of FC is time
variable, according to the content of registers FCON and MRCON.
The given inappropriate settings of FC should be avoided according to the application
requirements.
4. Reset conditions
Table 3 shows the reset condition of the special function register set. The device is reset
and put in Power-down mode if pin EN is kept LOW for at least 216 reference clock cycles
or bit PD is set in register TXCON.
Table 3.
Special function registers reset conditions
Name
Description
Address
Bit[1]
7
6
5
4
3
2
1
0
FC1H
frequency configuration 1, high byte
00h
X
X
X
X
X
X
X
X
FC1L
frequency configuration 1, low byte
01h
X
X
X
X
X
X
X
X
FC2H
frequency configuration 2, high byte
02h
X
X
X
X
X
X
X
X
FC2L
frequency configuration 2, low byte
03h
X
X
X
X
X
X
X
X
FC3H
frequency configuration 3, high byte
04h
X
X
X
X
X
X
X
X
FC3L
frequency configuration 3, low byte
05h
X
X
X
X
X
X
X
X
FC4H
frequency configuration 4, high byte
06h
X
X
X
X
X
X
X
X
FC4L
frequency configuration 4, low byte
07h
X
X
X
X
X
X
X
X
FCA
MSB for all frequency configurations
08h
X
X
X
X
X
X
X
X
FCON
FSK modulation control
09h
X
X
X
X
X
X
X
X
ACON0
ASK modulation control 0
0Ah
X
X
X
X
X
X
X
X
ACON1
ASK modulation control 1
0Bh
X
X
X
X
X
X
X
X
ACON2
ASK modulation control 2
0Ch
X
0
X
X
X
X
X
X
MRCON
modulation ramp control
0Dh
X
X
X
X
X
X
X
X
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Table 3.
Special function registers reset conditions …continued
Name
Description
Address
Bit[1]
7
6
5
4
3
2
1
0
X
X
X
X
X
0
TXCON
transmitter control
0Eh
0
0[2]
BDSEL
baud rate selection
0Fh
X
X
X
X
X
X
X
X
0[2]
1[2]
1[2]
0[2]
0[2]
SCSEL
scaler selection
10h
1[2]
X
X
X
X
11h
X
X
X
X
X
X
X
X
TEST1
test1
12h
0
0
0
0
0
0
0
0
TEST2
test2
13h
0
0
0
0
0
0
0
0
[1]
X = no reset condition, content stays unchanged during power-down.
[2]
Only reset if SDIO = 0 otherwise X.
5. RF power trimming
Some applications require a very low spread of output power, independent of supply
voltage and temperature.
It is mandatory for such applications to set bit CASC in register ACON2. A further
reduction of the power dependency is achievable by adapting ACON according to
changes in temperature and supply voltage. For this reason both parameters need be
sensed. An adaptation of the output power leads to reduced current consumption over the
lifetime of the system. Only the minimum required power is transmitted at any time.
The lifetime of battery-supplied systems can be increased if the ACON value is reduced at
low temperatures. Typically, a battery’s internal resistance increases over its lifetime. At
low temperatures, the output voltage can reduce dramatically when the transmitter draws
a high current from the battery. The OL2300 shows a negative dependency of the output
power versus temperature. If the power is reduced to the minimum required value, the
supply current is reduced too and thus the voltage drop over the battery. Hence the supply
voltage is higher compared to unregulated use.
The ACON value can be used to trim the output power in the end-of-line test. If the value
of ACON = 12 is used as standard for nominal power, a deviation of 3 enables the actual
output power in the range of 2 dB to be adapted for a final precision of 1 dB. Figure 6
shows the output power as a function of ACON for different power modes.
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10
8
Pout
6
(dBm)
4
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Trimming Range
1
2
3
4
ACON
019aac606
Pout = f (ACON, PAM).
VDD = 2.7 V, CASC = 1, load impedance = 180 .
(1) PAM 3.
(2) PAM 2.
(3) PAM 1.
(4) PAM 0.
Fig 6.
Output power as a function of ACON
The colored areas in Figure 6 are addressable by ACON values 9d to 15d.
Due to a logarithmic dependency of the output power versus ACON setting, the best
accuracy can be achieved for high ACON values. If lower output power is needed, the
power mode should be reduced instead of reducing the ACON value.
6. XO Supply options
The OL2300 operationally supports the crystal oscillator with the regulated supply voltage
VREG. In this mode the oscillator frequency shows virtually no dependency of the supply
voltage. The regulated supply mode is activated if bit ENXR in register TXCON is set and
the device is in the transmit state. It is possible to set bit ENXR during device initialization,
but there will be no effect until the power amplifier is enabled by a transmit command. The
oscillator supply automatically returns to unregulated mode if the transmit state is left.
The regulated supply voltage on pin VREG is either derived from an internal reference
(fixed mode) or by the VCO supply voltage (adaptive mode). In the second case the actual
voltage level depends on the PLL frequency. This mode is the regulator adaptive mode
and is selected by flag ENRAD in register ACON2. In the adaptive mode, the OL2300
analog circuitry is supplied with the lowest possible voltage. This mode is the most power
effective.
If the oscillator is operated in regulated supply mode and VREG is set to regulator
adaptive mode, ENRAD must not be set before the power amplifier is activated. In
unregulated mode, ENRAD can be set directly after PLL startup (after tacq).
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Remark: Dropouts in clock output signal (CKOUT) might occur at the moment the
oscillator supply switches from unregulated to regulated mode. It mainly occurs if the
supply voltage is above 3.3 V. The behavior is caused by the internal time-constant of the
clock-buffer reference. This reference is derived from the signal amplitude at pin XTAL1.
The amplitude changes by switching to the regulated mode, and the clock-buffer
reference voltage settles to a new value. While settling, the clock signal might be absent.
6.1 Sequence for fixed low mode
Txxtal(set)
EN
t
set ENXR, ENPLL
TxCMD
clr ENPLL
SDIO
transmit data
t
PLLEN
t
tacq
PAON
t
unregulated
regulated
VDDXO
t
CKOUT
........
t
clockgap
Fig 7.
019aac607
Fixed low mode sequence
How long the clock is missing (clock gap time) depends on supply voltage, crystal
oscillator frequency, the value of the crystal load capacitors, temperature, and also on
process parameters. The worst case was found for high crystal frequency, high
temperature, and if the process shows high p-channel thresholds. A maximum gap time of
4 s appears under worst-case conditions at 3.6 V and 125 C. This value was measured
and simulated using an 18.37 MHz crystal (Nx5032GA). The gap time needs to be
considered if the external controller uses the clock signal.
Remark: If the nominal crystal frequencies can only be reached by unsymmetrical load
capacitances, the capacitor with the highest value should be applied to pin XTAL1. This
reduces the amplitude at pin XTAL1 and thus the settling time of the clock-buffer
reference voltage.
Example:
Crystal: Nx5032GA
Nominal frequency: 18.37 MHz
Load capacitance: 12 pF
Pin XTAL2  18 pF
Pin XTAL1  22 pF
Without pin capacitance of pins XTAL1 and XTAL2 and PCB parasitic.
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6.2 Sequence for adaptive mode
To use the regulator adaptive mode in conjunction with the regulated supply mode of the
oscillator (bit ENXR = logic 1, bit ENRAD = logic 1), the power amplifier should be
activated first in fixed low mode and then the ENRAD bit can be set.
Txxtal(set)
EN
t
SDIO
set ENXR, ENPLL,
AMH[13:10]=0
Tx1set ENRAD Tx2
transmit data
clr ENPLL
clr ENRAD
t
PLLEN
t
tacq
PAON
t
unregulated
VDDXO
fixed
low
adaptive
t
CKOUT
........
t
clockgap
Fig 8.
019aac608
Adaptive mode sequence
Tx1: transmit command: bit B = logic 0, bit C = logic 0, bit D = logic 1: PA is switched on,
no output power as AMH[13:10] = 0.
Tx2: transmit command: bit B = logic 1, bit D = logic 0 actual output power depends on
AMH[03:00].
After Tx1, pin EN goes LOW and the actual value on pin SDIO is latched (in this case pin
SDIO needs to be LOW to have an unmodulated output signal) the PA is activated and the
ACON1 setting is used (no output power).
With the Tx2 command the data is transmitted at an output power according to ACON0.
Remark: Bit ENRAD needs to be cleared before the PLL is enabled again; see Section 4
on page 10.
6.3 Application advice
The device supports a second fixed mode, the fixed high mode. The regulator operation is
similar to the fixed low mode; the regulator output is stabilized to a fixed value. In fixed
high mode the regulated voltage is about 200 mV higher compared to fixed low mode.
This mode is only available via test register TEST1. Fixed high mode is activated by
writing 0x08 to TEST1 and is deactivated by writing 0x00. This mode can be used to
reduce the voltage drop of the crystal oscillator supply in regulated supply mode.
Using fixed high mode as shown in Figure 9 avoids gaps in the clock signal at pin CKOUT.
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Txxtal(set)
EN
SDIO
set ENRAD (adaptive) or
TEST1=0X00 (fixed LOW)
TEST1=0x08
set ENXR, ENPLL,
AMH[13:10]=0
Tx1
t
Tx2
transmit data
clr ENPLL
clr ENRAD
t
PLLEN
t
tacq
PAON
t
fixed
HIGH
unregulated
VDDXO
fixed LOW or
adaptive
t
CKOUT
........
t
no clockgap
VREG
fixed
LOW
fixed
HIGH
fixed LOW or
adaptive
t
019aac609
Fig 9.
Fixed high mode sequence
Tx1: transmit command: B = 0, D = 1, PA is switched on, no output power as AMH[13:10]
= 0.
Tx2: transmit command: B = 1, D = 0, actual output power depends on AMH[03:00].
The PLL startup should be performed in fixed low mode. The fixed high mode is activated
after tACQ. Tx1 (B = 0, D = 1) enables the power amplifier with no output power (after
falling edge of pin EN while pin SDIO is LOW). An additional command activates the
adaptive mode or fixed low mode. After selecting the supply condition, the data
transmission can be started (Tx2 command). In Figure 9, the transparent mode is
selected but synchronized data transmission is also possible.
6.4 Soft modulation schemes
The OL2300 supports bandwidth-reducing modulation schemes for ASK and for FSK. In
both cases the required bandwidth of the emitted RF signal is reduced by low-pass
filtering of the baseband signal. The low-pass characteristic of the filter is flexible and can
be adjusted according to the requirements of the application.
Filtering is implemented by linear interpolation of intermediate steps in each transition.
This transforms the rectangular shape of the baseband data signal to a trapezoid shape.
The slope is adjustable by defining the transition time via special function register
MRCON.
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6.5 ASK
1
Tx Data
t
0
AMH
ASK
t
AML
AMH
Soft - ASK
AML
t
tSA
tM
019aac610
Fig 10. ASK soft modulation
The number of intermediate steps for ASK is limited according to the driver stage of the
power amplifier. A staircase replaces each transition. The actual number of steps depends
on the settings of the ACON registers.
n = AMH  AML[3:0].
The slope time tSA is defined by the value of RMP[6:0] in register MRCON.
RMP
t SA = n  ------------f REF
(3)
tM
t SA  ----2
(4)
The slope time needs to be limited in relation to the modulation frequency. If the timing
exceeds the limit, the modulation index will be scaled down.
The ASK baseband filter function is a number of Dirac pulses.
1
S ASK  t  = --- 
n
AN11065
Application note
n–1

   t – tSA  --n-
i
(5)
i=0
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NXP Semiconductors
UHF Transmitter OL2300
t
0
tSA
019aac611
sASK(t), shown for n = 11.
Fig 11. ASK baseband filter function
The capability of the filter function to limit the bandwidth strongly depends on the number
n. In general, the required bandwidth will decrease for high n and a long slope time.
Equation 6 shows the power-related filter function in the frequency domain.
1
S ASK  f  = --- 
n
n–1
e
i 2
-j2f  t SA  ---
n


i=0
(6)
0
-5
Attenuation [dB]
-10
-15
-20
-25
n=1
n=3
n=5
n = 10
n = 15
-30
-35
-40
0
1
2
3
4
5
f/fM
6
7
8
9
10
019aac612
ASK filter function SASK(f), shown for tSA = tM/2.
Fig 12. ASK filter function in the frequency domain
6.6 FSK
Due to the capability of the PLL, the number of intermediate steps is usually much higher
and for FSK a smooth transition is achieved.
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UHF Transmitter OL2300
Tx Data
1
t
0
fC+∆f
FSK
t
fC-∆f
fC+∆f
Soft - FSK
t
fC-∆f
tSF
019aac613
tM
Fig 13. FSK soft modulation
For FSK, the slope time tSF is defined too by the value RMP in register MRCON.
2  FSK  RMP
t SF =  2 – FBSL   ---------------------------------------f REF
(7)
tM
t SF  ----2
(8)
The slope time needs to be limited in relation to the modulation frequency. If the timing
exceeds the limit, the frequency deviation is reduced. The FSK value in register FCON
sets the frequency deviation. The flag FBSL is part of the transmitter control register
TXCON.
According to the increased number of intermediate steps, the FSK baseband filter function
can be assumed to be a rectangular pulse.
1, 0  t  t SF
1
S FSK  t  = ------- 0,
t0
t SF
0, t  t SF
(9)
1/tSF
t
0
tSF
019aac614
FSK baseband filter function SFSK(t).
Fig 14.
AN11065
Application note
FSK baseband filter function
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UHF Transmitter OL2300
Equation 10 shows the power-related filter function in the frequency domain.
sin  ft SF 
S FSK  f  = -----------------------ft SF
2
(10)
0
tSF/tM = 1/10
tSF/tM = 1/5
-5
tSF/tM = 1/3
Attenuation [dB]
-10
tSF/tM = 1/2
-15
-20
-25
-30
-35
-40
0
1
2
3
4
5
f/fM
6
7
8
9
10
019aac615
SFSK(f) in relation to SASK(f) with n = 12 (dashed).
Fig 15. Different FSK filter functions related to ASK filter function
7. Optimum output impedance
Output power and supply current were measured at different output impedances.
Two power setups were investigated at different output frequencies for the following
parameters:
Temperature T = [40, 25, 85] °C
Supply voltage VDD = [2.1, 2.4, 2.7, 3.0, 3.3, 3.6] V
Measurements were performed on one part. Depending on the output frequency, either a
device variant VHN or NHN was chosen. As the investigations were limited to one part,
only the typical performance of the OL2300 is shown here.
Two consecutive measurements were applied for each frequency setup.
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NXP Semiconductors
UHF Transmitter OL2300
VDD
choke
tuner
DC block
OL2300
P2
P1
019aac616
Fig 16. Measurement setup
In the first measurement, P1 and P2 were connected to a network analyzer to determine
the impedance applied to the power amplifier and the power loss inside the tuner for
specific tuner settings. At the same tuner settings the output power at P2 was measured
in a second step. For this the network analyzer was removed from P1, P2 and then
connected to a spectrum analyzer. In both measurements, the OL2300 was initialized
output frequency dependent, with the parameters shown in Table 4. The PLL was always
switched on. The power amplifier was enabled for the second measurement.
Measurement point P1 corresponds to the position of capacitor C6 in the layout
recommendations given in Section 2.2 on page 4.
The following information is represented in Smith charts based on 50  in the sections
below.
• effective output power provided by the OL2300 and the corresponding supply current
dependent on the applied impedance
• dependency of temperature and supply voltage on output power and supply current
Table 4.
Frequency setup with corresponding parameter set
Parameter
Frequency
315 MHz
434 MHz
868 MHz
915 MHz
fosc:
18.37036 MHz
13.28963 MHz
13.28963 MHz
13.28963 MHz
Bit XOSL:
1b
0b
0b
0b
Bit FBSL:
0b
0b
1b
1b
ACON[23:0]:
15d
15d
15d
15d
Bit ENXR:
1b
1b
1b
1b
Table 5.
Power setups
Parameter
Power setup
PAM (power amplifier mode)
1
2
2
3
Bit CASC
1b
0b
Bit ENRAD
1b
0b
Power setup 1:
PAM2 (power mode 2)
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NXP Semiconductors
UHF Transmitter OL2300
• High power
• Low stability
CASC1, ENRAD1
• Further stabilized and regulated output power
• Slightly reduced power
Power setup 2:
PAM3 (power mode 3)
• Maximum power
• No stabilization
7.1 Optimum output impedance measured at 315 MHz
7.1.1 Power setup 1
+j1.0
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
+j2.0
+j0.5
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac617
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 17. Output power with applied impedance at 315 MHz; power setup 1
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AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac618
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 18. Output power deviation at 315 MHz; power setup 1
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UHF Transmitter OL2300
+j1.0
mA
+j0.5
+j2.0
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac619
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 19. Supply current with applied impedance at 315 MHz; power setup 1
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NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac620
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 20. Supply current deviation at 315 MHz; power setup 1
This setup provides excellent performance for an output power of about 5 dBm. The
output impedance should be chosen to be 250+j0 . At this point the output power at pin
PAOUT is about 7 dBm; assuming a power loss of about 1 dB in the matching network
provides an available power of 6 dBm. By trimming parameter ACON, an output power of
5 dBm can be reached.
The overall stability of the output power is about ±1.5 dB at this matching point.
With increased impedance, the temperature stability increases but the supply voltage
stability decreases.
The imaginary part of the impedance should be about 0 . For mass production it may be
better to choose a small imaginary part of about +50 . Depending on the variation in
values of the components comprising the matching network, the actual matching
impedance can differ between devices. Adding a small imaginary part to the optimum
output impedance ensures that all devices will have an imaginary part that is not less than
0 . The output power deviation figure shows a slightly worse temperature stability
behavior in this area. The current supply is about 6.5 mA  1 mA at this point.
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UHF Transmitter OL2300
7.1.2 Power setup 2
+j1.0
+j2.0
+j0.5
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac621
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 21. Output power with applied impedance at 315 MHz; power setup 2
AN11065
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AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac622
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 22. Output power deviation at 315 MHz; power setup 2
AN11065
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UHF Transmitter OL2300
+j1.0
mA
+j0.5
+j2.0
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac623
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 23. Supply current with applied impedance at 315 MHz; power setup 2
AN11065
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AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac624
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 24. Supply current deviation at 315 MHz; power setup 2
Power setup 2 provides a maximum output power at pin PAOUT of 11 dBm at 25 C with a
2.7 V supply. This value is reached with an output impedance of 160 + j10 .
The optimum impedance varies with supply voltage and temperature. The real part of the
optimum impedance increases with an increase in supply voltage and decreases with an
increase in temperature.
At the given output impedance of 160 + j10 , the output power shows a deviation of
+2 dB/3 dB with temperature and supply voltage. The output power is more unstable with
changes in supply voltage than it is with changes in temperature.
The current supply is about 12 mA  2.5 mA for optimum output impedance.
AN11065
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UHF Transmitter OL2300
7.2 Optimum output impedance measured at 434 MHz
7.2.1 Power setup 1
+j1.0
+j2.0
+j0.5
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac625
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 25. Output power with applied impedance at 434 MHz; power setup 1
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AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac626
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 26. Output power deviation at 434 MHz; power setup 1
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UHF Transmitter OL2300
+j1.0
mA
+j2.0
+j0.5
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac627
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 27. Supply current with applied impedance at 434 MHz; power setup 1
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NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac628
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 28. Supply current deviation at 434 MHz; power setup 1
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UHF Transmitter OL2300
7.2.2 Power setup 2
+j1.0
+j2.0
+j0.5
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac629
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 29. Output power with applied impedance at 434 MHz; power setup 2
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AN11065
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UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac630
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 30. Output power deviation at 434 MHz; power setup 2
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UHF Transmitter OL2300
+j1.0
mA
+j2.0
+j0.5
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac631
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 31. Supply current with applied impedance at 434 MHz; power setup 2
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UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac632
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 32. Supply current deviation at 434 MHz; power setup 2
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UHF Transmitter OL2300
7.2.3 Optimum output impedance measured at 868 MHz
7.2.3.1
Power setup 1
+j1.0
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
+j2.0
+j0.5
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac633
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 33. Output power with applied impedance at 868 MHz; power setup 1
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UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac634
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 34. Output power deviation at 868 MHz; power setup 1
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UHF Transmitter OL2300
+j1.0
mA
+j2.0
+j0.5
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac635
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 35. Supply current with applied impedance at 868 MHz; power setup 1
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NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac636
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 36. Supply current deviation at 868 MHz; power setup 1
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UHF Transmitter OL2300
7.2.3.2
Power setup 2
+j1.0
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
+j2.0
+j0.5
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac637
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 37. Output power with applied impedance at 868 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
41 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac638
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 38. Output power deviation at 868 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
42 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
+j1.0
mA
+j2.0
+j0.5
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac639
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 39. Supply current with applied impedance at 868 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
43 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac640
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 40. Supply current deviation at 868 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
44 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
7.2.4 Optimum output impedance measured at 915 MHz
7.2.4.1
Power setup 1
+j1.0
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
+j2.0
+j0.5
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac641
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 41. Output power with applied impedance at 915 MHz; power setup 1
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
45 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac642
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 42. Output power deviation at 915 MHz; power setup 1
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
46 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
+j1.0
mA
+j2.0
+j0.5
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac643
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 43. Supply current with applied impedance at 915 MHz; power setup 1
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
47 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac644
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 44. Supply current deviation at 915 MHz; power setup 1
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
48 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
7.2.4.2
Power setup 2
+j1.0
+j5.0
+j0.2
0.2
0.0
dBm
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
+j2.0
+j0.5
0.5
1.0
2.0
5.0
∞
-j5.0
-j0.2
-j2.0
-j0.5
-j1.0
019aac645
POUT = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 45. Output power with applied impedance at 915 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
49 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
TR
VDDR[V]
-40 to 85°C
2.1 to 3.6V
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
dB
2
max(∆ POUT)
1
0
-1
-2
min(∆ POUT)
-3
-4
019aac646
Output power deviation: POUT = POUT (TR, VDDR)  POUT at 25 C, 2.7 V.
Fig 46. Output power deviation at 915 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
50 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
+j1.0
mA
+j2.0
+j0.5
15
14
13
+j5.0
+j0.2
12
0.2
0.0
0.5
1.0
2.0
5.0
11
∞
10
9
-j5.0
-j0.2
8
7
6
-j2.0
-j0.5
-j1.0
019aac647
IS = f(ZOUT).
VDD = 2.7 V, T = 25 C.
Fig 47. Supply current with applied impedance at 915 MHz; power setup 2
AN11065
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
51 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
-40 to 85°C
2.1 to 3.6V
TR
VDDR[V]
25°C
2.1 to 3.6V
-40 to 85°C
2.7V
mA
4
max(∆ IS)
3
2
1
0
-1
-2
min(∆ IS)
-3
-4
019aac648
IS = IS (TR, VDDR)  IS at 25 C, 2.7 V
Fig 48. Supply current deviation at 915 MHz; power setup 2
8. Abbreviations
Table 6.
Abbreviations
Acronym
Description
FSK
Frequency-Shift Keying
LSB
Least Significant Bit
MSB
Most Significant Bit
PLL
Phase-Locked Loop
SPI
Serial Peripheral Interface
VCO
Voltage-Controlled Oscillator
9. References
[1]
AN11065
Application note
OL2300 — Fractional-N PLL based transmitter data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
52 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
10. Legal information
10.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
10.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
AN11065
Application note
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
10.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 July 2011
© NXP B.V. 2011. All rights reserved.
53 of 54
AN11065
NXP Semiconductors
UHF Transmitter OL2300
11. Contents
1
2
2.1
2.2
3
3.1
3.2
3.3
4
5
6
6.1
6.2
6.3
6.4
6.5
6.6
7
7.1
7.1.1
7.1.2
7.2
7.2.1
7.2.2
7.2.3
7.2.3.1
7.2.3.2
7.2.4
7.2.4.1
7.2.4.2
8
9
10
10.1
10.2
10.3
11
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Board design . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Phase noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Frequency modulation . . . . . . . . . . . . . . . . . . . 7
Amplitude modulation . . . . . . . . . . . . . . . . . . . . 8
Inappropriate FC settings . . . . . . . . . . . . . . . . . 9
Reset conditions . . . . . . . . . . . . . . . . . . . . . . . 10
RF power trimming . . . . . . . . . . . . . . . . . . . . . 11
XO Supply options. . . . . . . . . . . . . . . . . . . . . . 12
Sequence for fixed low mode . . . . . . . . . . . . . 13
Sequence for adaptive mode . . . . . . . . . . . . . 14
Application advice. . . . . . . . . . . . . . . . . . . . . . 14
Soft modulation schemes . . . . . . . . . . . . . . . . 15
ASK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FSK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Optimum output impedance . . . . . . . . . . . . . . 19
Optimum output impedance measured
at 315 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Power setup 1. . . . . . . . . . . . . . . . . . . . . . . . . 21
Power setup 2. . . . . . . . . . . . . . . . . . . . . . . . . 25
Optimum output impedance measured
at 434 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Power setup 1. . . . . . . . . . . . . . . . . . . . . . . . . 29
Power setup 2. . . . . . . . . . . . . . . . . . . . . . . . . 33
Optimum output impedance measured
at 868 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Power setup 1. . . . . . . . . . . . . . . . . . . . . . . . . 37
Power setup 2. . . . . . . . . . . . . . . . . . . . . . . . . 41
Optimum output impedance measured
at 915 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Power setup 1. . . . . . . . . . . . . . . . . . . . . . . . . 45
Power setup 2. . . . . . . . . . . . . . . . . . . . . . . . . 49
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 52
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Legal information. . . . . . . . . . . . . . . . . . . . . . . 53
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 July 2011
Document identifier: AN11065