AD ADSP-21262SKBC-200

SHARC® Processor
ADSP-21262
SUMMARY
DAI incorporates two precision clock generators (PCGs), an
input data port (IDP) which includes the parallel data
acquisition port (PDAP), and three programmable timers,
all under software control through the signal routing unit
(SRU)
On-chip memory—2M bits of on-chip SRAM and a dedicated
4M bits of on-chip mask-programmable ROM
Six independent synchronous serial ports provide a variety
of serial communication protocols including TDM and I2S
modes
The ADSP-21262 is available with a 200 MHz core instruction
rate. For complete ordering information, see Ordering
Guide on Page 44.
High performance 32-bit/40-bit floating-point processor
optimized for high precision signal processing
applications
The ADSP-21262 SHARC DSP is code compatible with all
other SHARC DSPs
Single-Instruction Multiple-Data (SIMD) computational architecture—two 32-bit IEEE floating-point/32-bit fixedpoint/40-bit extended precision floating-point computational units, each with a multiplier, ALU, shifter, and
register file
High bandwidth I/O—A parallel port, SPI port, six serial
ports, digital audio interface (DAI), and JTAG
DUAL PORTED MEMORY
BLOCK 0
CORE PROCESSO R
INSTRUCTION
CACHE
32 ⴛ 48-BIT
TIMER
DAG1
8 ⴛ 4 ⴛ 32
DAG2
8 ⴛ 4 ⴛ 32
SRAM
1 MBIT
PROGRAM
SEQUENCER
ADDR
DUAL PORTED MEMORY
BLO CK 1
SRAM
1 MBIT
ROM
2 MBIT
ROM
2 MBIT
ADDR
DATA
DATA
32
PM ADDRESS BUS
32
DM ADDRESS BUS
64
PM DATA BUS
64
DM DATA BUS
IOA
(18)
DMA CO NTROLLER
PX REGISTER
PROCESSING
EL EMENT
(PEX)
IOD
(32)
4
22 C H A NN E LS
PROCESSING
ELEMENT
(PEY)
GPIO FLAGS/
IRQ/TIMEXP
4
SPI PO RT (1)
A D D RES S/
D A TA BUS / GPIO
6
3
SERIAL PORTS (6)
JTAG TEST & EMULATION
20
SIGNAL
ROUTING
UNIT
S
INPUT
DATA PORTS (8)
PARALLEL DATA
ACQUISITION PORT
16
C ON TR OL/GP IO
IOP
REGISTERS
(MEMORY MAPPED)
PARALLEL
PORT
CO NTROL,
STATUS,
DATA BUFFERS
PRECISI ON CLO CK
GENERATORS (2)
3
TIMERS (3)
DIGITAL AUDIO INTERFACE
I/O PROCESSOR
Figure 1. Functional Block Diagram
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
ADSP-21262
KEY FEATURES
At 200 MHz (5 ns) core instruction rate, the ADSP-21262
operates at 1200 MFLOPS peak/800 MFLOPS sustained
performance whether operating on fixed or floating point
data
400 MMACS sustained performance at 200 MHz
Super Harvard Architecture—three independent buses for
dual data fetch, instruction fetch, and nonintrusive, zerooverhead I/O
2M bits on-chip dual-ported SRAM (1M bit block 0, 1M bit
block 1) for simultaneous access by core processor and
DMA
4M bits on-chip dual-ported mask-programmable ROM
(2M bits in block 0 and 2M bits in block 1)
Dual data address generators (DAGs) with modulo and bitreverse addressing
Zero-overhead looping with single-cycle loop setup, providing efficient program sequencing
Single instruction multiple data (SIMD) architecture
provides:
Two computational processing elements
Concurrent execution— Each processing element executes
the same instruction, but operates on different data
Parallelism in buses and computational units allows: Single cycle executions (with or without SIMD) of a multiply
operation; an ALU operation; a dual memory read or
write; and an instruction fetch
Transfers between memory and core at up to four 32-bit
floating- or fixed-point words per cycle, sustained
2.4G Bytes/s bandwidth at 200 MHz core instruction rate.
In addition, 900M Bytes/sec is available via DMA
Accelerated FFT butterfly computation through a multiply
with add and subtract instruction
DMA controller supports:
22 zero-overhead DMA channels for transfers between
ADSP-21262 internal memory and serial ports (12), the
input data port (IDP) (8), SPI-compatible port (1), and the
parallel port (1)
32-bit background DMA transfers at core clock speed, in parallel with full-speed processor execution
Asynchronous parallel/external port provides:
Access to asynchronous external memory
16 multiplexed address/data lines support 24-bit address
external address range with 8-bit data or 16-bit address
external address range with 16-bit data
66M Byte per sec transfer rate for 200 MHz core rate
256 word page boundaries
External memory access in a dedicated DMA channel
Rev. A |
8- to 32-bit and 16- to 32-bit word packing options
Programmable wait state options: 2 to 31 CCLK
Digital audio interface (DAI) includes six serial ports, two precision clock generators, an input data port, three
programmable timers and a signal routing unit
Serial ports provide:
Six dual data line serial ports that operate at up to 50 Mbits/s
for a 200 MHz core on each data line — each has a clock,
frame sync, and two data lines that can be configured as
either a receiver or transmitter pair
Left-justified sample pair and I2S support, programmable
direction for up to 24 simultaneous receive or transmit
channels using two I2S compatible stereo devices per serial
port
TDM support for telecommunications interfaces including
128 TDM channel support for telephony interfaces such as
H.100/H.110
Up to 12 TDM stream support, each with 128 channels per
frame
Companding selection on a per channel basis in TDM mode
Input data port provides an additional input path to the DSP
core configurable as either eight channels of I2S or serial
data or as seven channels plus a single 20-bit wide synchronous parallel data acquisition port
Supports receive audio channel data in I2S, left-justified
sample pair, or right-justified mode
Signal routing unit provides configurable and flexible
connections between all DAI components, six serial ports,
an input data port, two precision clock generators, three
timers, 10 interrupts, six flag inputs, six flag outputs, and
20 SRU I/O pins (DAI_Px)
Serial peripheral interface (SPI)
Master or slave serial boot through SPI
Full-duplex operation
Master-slave mode multimaster support
Open drain outputs
Programmable baud rates, clock polarities, and phases
3 Muxed Flag/IRQ lines
1 Muxed Flag/Timer expired line
ROM based security features:
JTAG access to memory permitted with a 64-bit key
Protected memory regions that can be assigned to limit
access under program control to sensitive code
PLL has a wide variety of software and hardware multiplier/divider ratios
JTAG background telemetry for enhanced emulation
features
IEEE 1149.1 JTAG standard test access port and on-chip
emulation
Dual voltage: 3.3 V I/O, 1.2 V core
Available in 136-ball BGA and 144-lead LQFP packages
Lead free packages are also available
Page 2 of 44 |
May 2004
ADSP-21262
TABLE OF CONTENTS
General Description ..................................................4
Interrupts ........................................................20
ADSP-21262 Family Core Architecture .......................4
Core Timer ......................................................20
SIMD Computational Engine ................................4
Timer PWM_OUT Cycle Timing ..........................21
Independent, Parallel Computation Units .................5
Timer WDTH_CAP Timing ................................21
Data Register File ................................................5
DAI Pin to Pin Direct Routing .............................22
Single-Cycle Fetch of Instruction and Four Operands ..5
Precision Clock Generator (Direct Pin Routing) .......23
Instruction Cache ...............................................5
Flags ..............................................................24
Data Address Generators With Zero-Overhead
Hardware Circular Buffer Support .......................5
Memory Read–Parallel Port .................................25
Flexible Instruction Set ........................................6
Serial Ports ......................................................29
ADSP-21262 Memory and I/O Interface Features ..........6
Input Data Port (IDP) ........................................32
Dual-Ported On-Chip Memory ..............................6
Parallel Data Acquisition Port (PDAP) ...................33
DMA Controller .................................................6
SPI Interface—Master ........................................34
Digital Audio Interface (DAI) ................................6
SPI Interface—Slave ...........................................35
Serial Ports ........................................................6
JTAG Test Access Port and Emulation ...................36
Serial Peripheral (Compatible) Interface ...................8
Output Drive Currents ..........................................37
Parallel Port ......................................................8
Test Conditions ...................................................37
Timers .............................................................8
Capacitive Loading ...............................................37
ROM Based Security ............................................8
Environmental Conditions .....................................38
Program Booting ................................................8
Thermal Characteristics .........................................38
Memory Write—Parallel Port ..............................27
Phase-Locked Loop ............................................8
136-Ball BGA Pin Configurations ................................39
Power Supplies ...................................................8
144-LQFP Pin Configurations ....................................42
Target Board JTAG Emulator Connector .....................9
Package Dimensions ................................................ 43
Development Tools ................................................9
Ordering Guide ......................................................44
Designing an Emulator-Compatible DSP
Board (Target) ................................................. 10
Additional Information ......................................... 10
Pin Function Descriptions ........................................ 11
REVISION HISTORY
4/04–Data Sheet Changed from Rev. 0 to Rev. A
Address Data Pins as FLAGs .................................. 14
Added notes to AD pins ............................................11
Boot Modes ........................................................ 14
Added VIHCLKIN and VILCLKIN specifications .....................15
Core Instruction Rate to CLKIN Ratio Modes ............. 14
Changed specifications (tALERW, and tALEHZ) ................25-28
Address Data Modes ............................................. 14
Updated 136-BGA package drawing ............................43
ADSP-21262 Specifications ....................................... 15
Recommended Operating Conditions ....................... 15
Electrical Characteristics ........................................ 15
Absolute Maximum Ratings ................................... 16
ESD Sensitivity .................................................... 16
Timing Specifications ........................................... 16
Power-up Sequencing ........................................ 18
Clock Input ..................................................... 19
Clock Signals ................................................... 19
Reset ............................................................. 20
Rev. A |
Page 3 of 44 |
May 2004
ADSP-21262
GENERAL DESCRIPTION
The ADSP-21262 SHARC DSP is a member of the SIMD
SHARC family of DSPs featuring Analog Devices Super Harvard Architecture. The ADSP-21262 is source code compatible
with the ADSP-21160 and ADSP-21161 DSPs as well as with
first generation ADSP-2106x SHARC processors in SISD (Single-Instruction, Single-Data) mode. Like other SHARC DSPs,
the ADSP-21262 is a 32-bit/40-bit floating-point processor optimized for high precision signal processing applications with its
dual-ported on-chip SRAM, mask-programmable ROM, multiple internal buses to eliminate I/O bottlenecks, and an
innovative Digital Audio Interface (DAI).
• Three Programmable Interval Timers with PWM Generation, PWM Capture/Pulse Width Measurement, and
External Event Counter Capabilities
• On-chip dual-ported SRAM (2M bits)
• On-chip dual-ported mask-programmable ROM (4M bits)
• JTAG test access port
The block diagram of the ADSP-21262 IOP on Page 1, illustrates the following architectural features:
• 8- or 16-bit parallel port that supports interfaces to off-chip
memory peripherals
As shown in the functional block diagram on Page 1, the ADSP21262 uses two computational units to deliver a 5 to 10 times
performance increase over the ADSP-2106x on a range of DSP
algorithms. Fabricated in a state-of-the-art, high speed, CMOS
process, the ADSP-21262 DSP achieves an instruction cycle
time of 5 ns at 200 MHz. With its SIMD computational hardware, the ADSP-21262 can perform 1200 MFLOPS running at
200 MHz.
• DMA controller
• Six full duplex serial ports
• SPI compatible interface
• Digital Audio Interface that includes two precision clock
generators (PCG), an input data port (IDP), six serial ports,
eight serial interfaces, a 20-bit synchronous parallel input
port, 10 interrupts, six flag outputs, six flag inputs, three
timers, and a flexible signal routing unit (SRU)
Table 1 shows performance benchmarks for the ADSP-21262.
Table 1. ADSP-21262 Benchmarks (at 200 MHz)
Benchmark Algorithm
1024 Point Complex FFT (Radix 4, with reversal)
FIR Filter (per tap)1
IIR Filter (per biquad)1
Matrix Multiply (pipelined)
[3×3] × [3×1]
[4×4] × [4×1]
Divide (y/×)
Inverse Square Root
1
Speed
(at 200 MHz)
46 µs
2.5 ns
10 ns
22.5 ns
40 ns
15 ns
22.5 ns
Assumes two files in multichannel SIMD mode
Figure 2 on Page 5 shows one sample configuration of a SPORT
using the precision clock generator to interface with an I2S ADC
and an I2S DAC with a much lower jitter clock than the serial
port would generate itself. Many other SRU configurations are
possible.
ADSP-21262 FAMILY CORE ARCHITECTURE
The ADSP-21262 is code compatible at the assembly level with
the ADSP-21266, ADSP-21160 and ADSP-21161, and with the
first generation ADSP-2106x SHARC DSPs. The ADSP-21262
shares architectural features with the ADSP-2126x and
ADSP-2116x SIMD SHARC family of DSPs, as detailed in the
following sections.
SIMD Computational Engine
The ADSP-21262 continues SHARC’s industry leading standards of integration for DSPs, combining a high performance
32-bit DSP core with integrated, on-chip system features. These
features include 2 Mbits dual-ported SRAM memory, 4 Mbits
dual-ported ROM, an I/O processor that supports 22 DMA
channels, six serial ports, an SPI interface, external parallel bus,
and Digital Audio Interface (DAI).
The block diagram of the ADSP-21262 on Page 1 illustrates the
following architectural features:
• Two processing elements, each containing an ALU, Multiplier, Shifter, and Data Register File
• Data Address Generators (DAG1, DAG2)
• Program sequencer with instruction cache
• PM and DM buses capable of supporting four 32-bit data
transfers between memory and the core at every core processor cycle
Rev. A |
The ADSP-21262 contains two computational processing elements that operate as a Single-Instruction Multiple-Data
(SIMD) engine. The processing elements are referred to as PEX
and PEY and each contains an ALU, multiplier, shifter, and register file. PEX is always active, and PEY may be enabled by
setting the PEYEN mode bit in the MODE1 register. When this
mode is enabled, the same instruction is executed in both processing elements, but each processing element operates on
different data. This architecture is efficient at executing math
intensive DSP algorithms.
Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in
SIMD mode, twice the data bandwidth is required to sustain
computational operation in the processing elements. Because of
this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When
using the DAGs to transfer data in SIMD mode, two data values
are transferred with each access of memory or the register file.
Page 4 of 44 |
May 2004
ADSP-21262
ADSP-212 62
CLKO UT
CLKIN
CLOCK
ALE
XTAL
2
2
3
LATCH
AD15 -0
CLK_CFG1 -0
ADDR
DATA
BOO TCFG 1-0
RD
FLAG3 -1
OE
WR
WE
FLAG0
SCLK0
SFS0
SD0A
SD0B
SRU
DAI_P 18
DAI_P 19
DAI _P 20
DATA
DAI_P 1
DAI _P2
DAI _P3
ADDRESS
DAC
(OPTI ONAL)
CLK
FS
S DAT
CS
CONTRO L
ADC
(OPTI ONAL)
CLK
FS
S DAT
PARALLEL
PORT
RAM, ROM
BOOT ROM
I/O DE VICE
S PORT0
SPO RT1
S PORT2
S PORT3
S PORT4
S PORT5
CLK
FS
DAI
PCG A
P CGB
RESE T
J TAG
6
Figure 2. ADSP-21262 System Sample Configuration
Independent, Parallel Computation Units
Single-Cycle Fetch of Instruction and Four Operands
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats.
The ADSP-21262 features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data
(see Figure 1 on Page 1). With the ADSP-21262’s separate program and data memory buses and on-chip instruction cache,
the processor can simultaneously fetch four operands (two over
each data bus) and one instruction (from the cache), all in a single cycle.
Data Register File
A general-purpose data register file is contained in each
processing element. The register files transfer data between the
computation units and the data buses, and store intermediate
results. These 10-port, 32-register (16 primary, 16 secondary)
register files, combined with the ADSP-2126x enhanced Harvard architecture, allow unconstrained data flow between
computation units and internal memory. The registers in PEX
are referred to as R0-R15 and in PEY as S0-S15.
Rev. A |
Instruction Cache
The ADSP-21262 includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full-speed execution of core, looped operations
such as digital filter multiply-accumulates, and FFT butterfly
processing.
Data Address Generators with Zero-Overhead Hardware
Circular Buffer Support
The ADSP-21262’s two data address generators (DAGs) are
used for indirect addressing and implementing circular data
buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital
signal processing, and are commonly used in digital filters and
Page 5 of 44 |
May 2004
ADSP-21262
Fourier transforms. The two DAGs of the ADSP-21262 contain
sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs
automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation.
Circular buffers can start and end at any memory location.
Flexible Instruction Set
The 48-bit instruction word accommodates a variety of parallel
operations for concise programming. For example, the
ADSP-21262 can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetching up to four 32-bit values from memory—all in a single
instruction.
ADSP-21262 MEMORY AND I/O INTERFACE
FEATURES
Digital Audio Interface (DAI)
The Digital Audio Interface (DAI) provides the ability to connect various peripherals to any of the DSPs 20 DAI pins
(DAI_P[20:1]).
Programs make these connections using the Signal Routing
Unit (SRU, shown in Figure 1).
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be interconnected under software control. This provides easy use of the
DAI associated peripherals for a much wider variety of applications by using a larger set of algorithms than is possible with
nonconfigurable signal paths.
The ADSP-21262 adds the following architectural features to
the SIMD SHARC family core.
Dual-Ported On-Chip Memory
The ADSP-21262 contains two megabits of internal SRAM and
four megabits of internal mask-programmable ROM. Each
block can be configured for different combinations of code and
data storage (see ADSP-21262 Memory Map on Page 7). Each
memory block is dual-ported for single-cycle, independent
accesses by the core processor and I/O processor. The dualported memory, in combination with three separate on-chip
buses, allows two data transfers from the core and one from the
I/O processor, in a single cycle.
The ADSP-21262’s SRAM can be configured as a maximum of
64K words of 32-bit data, 128K words of 16-bit data, 42K words
of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to two megabits. All of the memory can be
accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles
the amount of data that may be stored on-chip. Conversion
between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory
block can store combinations of code and data, accesses are
most efficient when one block stores data using the DM bus for
transfers, and the other block stores instructions and data using
the PM bus for transfers.
Using the DM bus and PM buses, with one dedicated to each
memory block assures single-cycle execution with two data
transfers. In this case, the instruction must be available in the
cache.
DMA Controller
The ADSP-21262’s on-chip DMA controller allows zero-overhead data transfers without processor intervention. The DMA
controller operates independently and invisibly to the processor
core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers
can occur between the ADSP-21262’s internal memory and its
serial ports, the SPI-compatible (Serial Peripheral Interface)
port, the IDP (Input Data Port), Parallel Data Acquisition Port
Rev. A |
(PDAP), or the parallel port. Twenty-two channels of DMA are
available on the ADSP-21262—one for the SPI interface, 12 via
the serial ports, eight via the Input Data Port, and one via the
processor’s parallel port. Programs can be downloaded to the
ADSP-21262 using DMA transfers. Other DMA features
include interrupt generation upon completion of DMA transfers, and DMA chaining for automatic linked DMA transfers.
The DAI also includes six serial ports, two precision clock generators (PCGs), an input data port (IDP), six flag outputs and
six flag inputs, and three timers. The IDP provides an additional
input path to the DSP core configurable as either eight channels
of I2S or serial data, or as seven channels plus a single 20-bit
wide synchronous parallel data acquisition port. Each data
channel has its own DMA channel that is independent from the
ADSP-21262's serial ports.
For complete information on using the DAI, see the
ADSP-2126x SHARC DSP Peripherals Manual.
Serial Ports
The ADSP-21262 features six synchronous serial ports that provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices such as Analog Devices
AD183x family of audio codecs, DACs, or ADCs. The serial
ports are made up of two data lines, a clock, and frame sync. The
data lines can be programmed to either transmit or receive and
each data line has its own dedicated DMA channel.
Serial ports are enabled via 12 programmable and simultaneous
receive or transmit pins that support up to 24 transmit or 24
receive channels of serial data when all six SPORTs are enabled,
or six full duplex TDM streams of 128 channels per frame.
The serial ports operate at up to one-quarter of the DSP core
clock rate, providing each with a maximum data rate of
50M bits/s for a 200 MHz core. Serial port data can be automatically transferred to and from on-chip memory via dedicated
DMA channels. Each of the serial ports can work in conjunction
with another serial port to provide TDM support. One SPORT
provides two transmit signals while the other SPORT provides
the two receive signals. The frame sync and clock are shared.
Page 6 of 44 |
May 2004
ADSP-21262
ADDRESS
IOP REGISTERS
0x0000 0000 - 0x0003 FFFF
0x0004 0000
BLOCK 0 SRAM (1Mbit)
0x0004 3FFF
RESERVED
LONG WORD
ADDRESS
SPACE
BLOCK 0 ROM (2 Mbit)
0x0004 4000 - 0x0005 7FFF
0x0005 8000
ADDRESS
0x0005 FFFF
0x0006 0000
0x0020 0000
RESERVED
BLOCK 1 SRAM (1 Mbit)
RESERVED
BLOCK 1 ROM (2 Mbit)
0x00FF FFFF
0x0100 0000
0x0006 3FFF
0x0006 4000 - 0x0007 7FFF
0x0007 8000
EXTERNAL DMA
ADDRESS SPACE 1, 4
0x0007 FFFF
0x0008 0000
0x02FF FFFF
0x0300 0000
BLOCK 0 SRAM (1 Mbit)
RESERVED
0x0008 7FFF
0x3FFF FFFF
RESERVED
NORMAL WORD
ADDRESS
SPACE
BLOCK 0 ROM (2 Mbit) 2
0x0008 8000 - 0x000A FFFF
0x000B 0000
EXTERNAL MEMORY
SPACE
0x000B FFFF
0x000C 0000
BLOCK 1 SRAM (1 Mbit)
0x000C 7FFF
RESERVED
BLOCK 1 ROM (2 Mbit)3
0x000C 8000 - 0x000E FFFF
0x000F 0000
1EXTERNAL MEMORY IS NOT DIRECTLY ACCESSIBLE BY THE
CORE. DMA MUST BE USED TO READ OR WRITE TO THIS
MEMORY USING THE SPI OR PARALLEL PORT.
2BLOCK 0 ROM HAS A 48-BIT ADDRESS RANGE
0x000F FFFF
0x0010 0000
(0x000A 0000 - 0x000A AAAA).
3BLOCK 1 ROM HAS A 48-BIT ADDRESS RANGE
BLOCK 0 SRAM (1 Mbit)
(0x000E 0000 - 0x000E AAAA).
4USE THE EXTERNAL ADDRESSES LISTED HERE WITH THE
PARALLEL PORT DMA REGISTERS. THE PARALLEL PORT
GENERATES ADDRESS WITHIN THE
RANGE 0x0000 0000-0x00FF FFFF.
0x0010 FFFF
RESERVED
BLOCK 0 ROM (2 Mbit)
SHORT WORD
ADDRESS
SPACE
0x0011 0000 - 0x0015 FFFF
0x0016 0000
0x0017 FFFF
0x0018 0000
BLOCK 1 SRAM (1 Mbit)
0x0018 FFFF
RESERVED
BLOCK 1 ROM (2 Mbit)
0x0019 0000 - 0x001D FFFF
0x001E 0000
0x001F FFFF
INTERNAL MEMORY
SPACE
Figure 3. ADSP-21262 Memory Map
Rev. A |
Page 7 of 44 |
May 2004
ADSP-21262
Serial ports operate in four modes:
Timers
• Standard DSP serial mode
The ADSP-21262 has a total of four timers: a core timer able to
generate periodic software interrupts and three general-purpose
timers that can generate periodic interrupts and be independently set to operate in one of three modes:
• Multichannel (TDM) mode
• I2S mode
• Left-justified sample pair mode
• Pulse Waveform Generation mode
Left-justified sample pair mode is a mode where in each frame
sync cycle two samples of data are transmitted/received—one
sample on the high segment of the frame sync, the other on the
low segment of the frame sync. Programs have control over various attributes of this mode.
Each of the serial ports supports the left-justified sample pair
and I2S protocols (I2S is an industry standard interface commonly used by audio codecs, ADCs and DACs), with two data
pins, allowing four left-justified Sample Pair or I2S channels
(using two stereo devices) per serial port, with a maximum of up
to 24 audio channels. The serial ports permit little-endian or
big-endian transmission formats and word lengths selectable
from 3 bits to 32 bits. For the left-justified sample pair and I2S
modes, data-word lengths are selectable between 8 bits and 32
bits. Serial ports offer selectable synchronization and transmit
modes as well as optional µ-law or A-law companding selection
on a per channel basis. Serial port clocks and frame syncs can be
internally or externally generated.
Serial Peripheral (Compatible) Interface
Serial Peripheral Interface (SPI) is an industry standard synchronous serial link, enabling the ADSP-21262 SPI-compatible
port to communicate with other SPI-compatible devices. SPI is
an interface consisting of two data pins, one device select pin,
and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes. The SPI port can
operate in a multimaster environment by interfacing with up to
four other SPI-compatible devices, either acting as a master or
slave device. The ADSP-21262 SPI compatible peripheral implementation also features programmable baud rates up to
37.5 MHz, clock phases, and polarities. The ADSP-21262 SPI
compatible port uses open drain drivers to support a multimaster configuration and to avoid data contention.
Parallel Port
The Parallel Port provides interfaces to SRAM and peripheral
devices. The multiplexed address and data pins (AD15-0) can
access 8-bit devices with up to 24 bits of address, or 16-bit
devices with up to 16 bits of address. In either mode, 8- or 16bit, the maximum data transfer rate is one-third the core clock
speed. As an example, for a clock rate of 200 MHz, this is equivalent to 66M Bytes/sec.
DMA transfers are used to move data to and from internal
memory. Access to the core is also facilitated through the parallel port register read/write functions. The RD, WR, and ALE
(Address Latch Enable) pins are the control pins for the
parallel port.
• Pulse Width Count/Capture mode
• External Event Watchdog mode
The core timer can be configured to use FLAG3 as a Timer
Expired output signal, and each general-purpose timer has one
bidirectional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables all three
general-purpose timers independently.
ROM Based Security
The ADSP-21262 has a ROM security feature that provides
hardware support for securing user software code by preventing
unauthorized reading from the internal code when enabled.
When using this feature, the DSP does not boot-load any external code, executing exclusively from internal SRAM/ROM.
Additionally, the DSP is not freely accessible via the JTAG port.
Instead, a unique 64-bit key, which must be scanned in through
the JTAG or Test Access Port will be assigned to each customer.
The device will ignore a wrong key. Emulation features and
external boot modes are only available after the correct key is
scanned.
Program Booting
The internal memory of the ADSP-21262 boots at system
power-up from an 8-bit EPROM via the parallel port, an SPI
master, an SPI slave or an internal boot. Booting is determined
by the Boot Configuration (BOOTCFG1-0) pins. Selection of
the boot source is controlled via the SPI as either a master or
slave device, or it can immediately begin executing from ROM.
Phase-Locked Loop
The ADSP-21262 uses an on-chip Phase-Locked Loop (PLL) to
generate the internal clock for the core. On power-up, the
CLKCFG1-0 pins are used to select ratios of 16:1, 8:1, and 3:1.
After booting, numerous other ratios can be selected via software control. The ratios are made up of software configurable
numerator values from 1 to 32 and software configurable divisor values of 1, 2, 4, 8, and 16.
Power Supplies
The ADSP-21262 has separate power supply connections for the
internal (VDDINT), external (VDDEXT), and analog (AVDD/AVSS)
power supplies. The internal and analog supplies must meet the
1.2 V requirement. The external supply must meet the 3.3 V
requirement. All external supply pins must be connected to the
same power supply.
Note that the analog supply (AVDD) powers the ADSP-21262’s
clock generator PLL. To produce a stable clock, programs
should provide an external circuit to filter the power input to
Rev. A |
Page 8 of 44 |
May 2004
ADSP-21262
the AVDD pin. Place the filter as close as possible to the pin. For
an example circuit, see Figure 4. To prevent noise coupling, use
a wide trace for the analog ground (AVSS) signal and install a
decoupling capacitor as close as possible to the pin. Note that
the AVSS and AVDD pins specified in Figure 4 are inputs to the
SHARC and not the analog ground plane on the board.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
10⍀
VDDINT
AVDD
0.1␮F
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
• View mixed C/C++ and assembly code (interleaved source
and object information)
0.01␮F
• Insert breakpoints
AVSS
• Set conditional breakpoints on registers, memory,
and stacks
Figure 4. Analog Power (AVDD) Filter Circuit
• Trace instruction execution
TARGET BOARD JTAG EMULATOR CONNECTOR
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the ADSP-21262
processor to monitor and control the target board processor
during emulation. Analog Devices DSP Tools product line of
JTAG emulators provides emulation at full processor speed,
allowing inspection and modification of memory, registers, and
processor stacks. The processor’s JTAG interface ensures that
the emulator will not affect target system loading or timing.
For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appropriate emulator hardware user’s guide.
• Perform linear or statistical profiling of program execution
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
• Create custom debugger windows
The VisualDSP++ IDDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the SHARC development tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
• Control how the development tools process inputs and
generate outputs
DEVELOPMENT TOOLS
The ADSP-21262 is supported with a complete set of
CROSSCORETM software and hardware development tools,
including Analog Devices emulators and VisualDSP++TM development environment. The same emulator hardware that
supports other SHARC processors also fully emulates the
ADSP-21262.
The VisualDSP++ project management environment lets programmers develop and debug an application. This environment
includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to DSP assembly. The SHARC has
architectural features that improve the efficiency of compiled
C/C++ code.
The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
Rev. A |
• Maintain a one-to-one correspondence with the tool’s
command line switches
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the memory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
Threads, Critical and Unscheduled regions, Semaphores,
Events, and Device flags. The VDK also supports Priority-based,
Preemptive, Cooperative, and Time-Sliced scheduling
approaches. In addition, the VDK was designed to be scalable. If
the application does not use a specific feature, the support code
for that feature is excluded from the target system.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the generation of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.
VisualDSP++ Component Software Engineering (VCSE) is
Analog Devices’ technology for creating, using, and reusing
software components (independent modules of substantial
functionality) to quickly and reliably assemble software applications. Download components from the Web and drop them into
Page 9 of 44 |
May 2004
ADSP-21262
the application. Publish component archives from within
VisualDSP++. VCSE supports component implementation in
C/C++ or assembly language.
Use the Expert Linker to visually manipulate the placement of
code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data
to different areas of the DSP or external memory with the drag
of the mouse, examine run time stack and heap usage. The
Expert Linker is fully compatible with the existing Linker Definition File (LDF), allowing the developer to move between the
graphical and textual environments.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hardware tools include SHARC processor PC plug-in cards. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the EE-68: Analog Devices JTAG Emulation Technical
Reference on the Analog Devices website (www.analog.com)—
use site search on “EE-68.” This document is updated regularly
to keep pace with improvements to emulator support.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-21262
architecture and functionality. For detailed information on the
ADSP-2126x family core architecture and instruction set, refer
to the ADSP-2126x DSP Core Manual and the ADSP-21160
SHARC DSP Instruction Set Reference.
DESIGNING AN EMULATOR-COMPATIBLE DSP
BOARD (TARGET)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on each JTAG DSP. Nonintrusive incircuit emulation is assured by the use of the processor’s JTAG
interface—the emulator does not affect target system loading or
timing. The emulator uses the TAP to access the internal features of the DSP, allowing the developer to load code, set
breakpoints, observe variables, observe memory, and examine
registers. The DSP must be halted to send data and commands,
but once an operation has been completed by the emulator, the
DSP system is set running at full speed with no impact on system timing.
Rev. A |
Page 10 of 44 |
May 2004
ADSP-21262
PIN FUNCTION DESCRIPTIONS
ADSP-21262 pin definitions are listed below. Inputs identified
as synchronous (S) must meet timing requirements with respect
to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to
CLKIN (or to TCK for TRST). Tie or pull unused inputs to
VDDEXT or GND, except for the following:
• DAI_Px, SPICLK, MISO, MOSI, EMU, TMS,TRST, TDI,
and AD15-0 (NOTE: These pins have pull-up resistors.)
The following symbols appear in the Type column of Table 2:
A = Asynchronous, G = Ground, I = Input, O = Output, P =
Power Supply, S = Synchronous, (A/D) = Active Drive, (O/D) =
Open Drain, and T = Three-State.
Table 2. Pin Descriptions
Pin
Type
State During and
After Reset
AD15-0
I/O/T
Three-state with
pull-up enabled
RD
O
WR
O
ALE
O
FLAG3-0
I/O/A
Function
Parallel Port Address/Data. The ADSP-21262 parallel port and its corresponding
DMA unit output addresses and data for peripherals on these multiplexed pins. The
multiplex state is determined by the ALE pin. The parallel port can operate in either
8-bit or 16-bit mode. Each AD pin has a 22.5 kΩ internal pull-up resistor. See Address
Data Modes on Page 14 for details of the AD pin operation.
For 8-bit mode: ALE is automatically asserted whenever a change occurs in the upper
16 external address bits, A23-8; ALE is used in conjunction with an external latch to
retain the values of the A23-8.
For 16-bit mode: ALE is automatically asserted whenever a change occurs in the
address bits, A15-0; ALE is used in conjunction with an external latch to retain the
values of the A15-0. To use these pins as flags (FLAGS15-0) set (=1) Bit 20 of the
SYSCTL register and disable the parallel port. When used as an input, the IDP Channel
0 can use these pins for parallel input data.
Output only, driven Parallel Port Read Enable. RD is asserted low whenever the DSP reads 8-bit or
high1
16-bit data from an external memory device. When AD15-0 are flags, this pin remains
deasserted.
Output only, driven Parallel Port Write Enable. WR is asserted low whenever the DSP writes 8-bit or
high1
16-bit data to an external memory device. When AD15-0 are flags, this pin remains
deasserted.
Output only, driven Parallel Port Address Latch Enable. ALE is asserted whenever the DSP drives a new
low1
address on the parallel port address pin. On reset, ALE is active high. However, it can
be reconfigured using software to be active low. When AD15-0 are flags, this pin
remains deasserted.
Three-state
Flag Pins. Each flag pin is configured via control bits as either an input or output. As
an input, it can be tested as a condition. As an output, it can be used to signal external
peripherals. These pins can be used as an SPI interface slave select output during SPI
mastering. These pins are also multiplexed with the IRQx and the TIMEXP signals.
In SPI master boot mode, FLAG0 is the slave select pin that must be connected to an
SPI EPROM. FLAG0 is configured as a slave select during SPI master boot. When Bit
16 is set (=1) in the SYSCTL register, FLAG0 is configured as IRQ0.
When Bit 17 is set (=1) in the SYSCTL register, FLAG1 is configured as IRQ1.
When Bit 18 is set (=1) in the SYSCTL register, FLAG2 is configured as IRQ2.
When Bit 19 is set (=1) in the SYSCTL register, FLAG3 is configured as TIMEXP, which
indicates that the system timer has expired.
Rev. A |
Page 11 of 44 |
May 2004
ADSP-21262
Table 2. Pin Descriptions (Continued)
Pin
Type
State During and
After Reset
Function
DAI_P20-1
I/O/T
Three-state with
programmable
pull-up
SPICLK
I/O
Three-state with
pull-up enabled
SPIDS
I
Input only
MOSI
I/O (O/D)
Three-state with
pull-up enabled
MISO
I/O (O/D)
Three-state with
pull-up enabled
BOOTCFG1-0
I
Input only
Digital Audio Interface Pins. These pins provide the physical interface to the SRU.
The SRU configuration registers define the combination of on-chip peripheral inputs
or outputs connected to the pin and to the pin’s output enable. The configuration
registers of these peripherals then determine the exact behavior of the pin. Any input
or output signal present in the SRU may be routed to any of these pins. The SRU
provides the connection from the serial ports, input data port, precision clock generators, and timer to the DAI_P20-1 pins. These pins have internal 22.5 kΩ pull-up
resistors which are enabled on reset. These pull-ups can be disabled in the
DAI_PIN_PULLUP register.
Serial Peripheral Interface Clock Signal. Driven by the master, this signal controls
the rate at which data is transferred. The master may transmit data at a variety of
baud rates. SPICLK cycles once for each bit transmitted. SPICLK is a gated clock that
is active during data transfers, only for the length of the transferred word. Slave
devices ignore the serial clock if the slave select input is driven inactive (HIGH). SPICLK
is used to shift out and shift in the data driven on the MISO and MOSI lines. The data
is always shifted out on one clock edge and sampled on the opposite edge of the
clock. Clock polarity and clock phase relative to data are programmable into the
SPICTL control register and define the transfer format. SPICLK has a 22.5 kΩ internal
pull-up resistor.
Serial Peripheral Interface Slave Device Select. An active low signal used to select
the DSP as an SPI slave device. This input signal behaves like a chip select, and is
provided by the master device for the slave devices. In multimaster mode the DSP’s
SPIDS signal can be driven by a slave device to signal to the DSP (as SPI master) that
an error has occurred, as some other device is also trying to be the master device. If
asserted low when the device is in master mode, it is considered a multimaster error.
For a single-master, multiple-slave configuration where flag pins are used, this pin
must be tied or pulled high to VDDEXT on the master device. For ADSP-21262 to ADSP21262 SPI interaction, any of the master ADSP-21262's flag pins can be used to drive
the SPIDS signal on the ADSP-21262 SPI slave device.
SPI Master Out Slave In. If the ADSP-21262 is configured as a master, the MOSI pin
becomes a data transmit (output) pin, transmitting output data. If the ADSP-21262
is configured as a slave, the MOSI pin becomes a data receive (input) pin, receiving
input data. In an ADSP-21262 SPI interconnection, the data is shifted out from the
MOSI output pin of the master and shifted into the MOSI input(s) of the slave(s). MOSI
has a 22.5 kΩ internal pull-up resistor.
SPI Master In Slave Out. If the ADSP-21262 is configured as a master, the MISO pin
becomes a data receive (input) pin, receiving input data. If the ADSP-21262 is
configured as a slave, the MISO pin becomes a data transmit (output) pin, transmitting output data. In an ADSP-21262 SPI interconnection, the data is shifted out
from the MISO output pin of the slave and shifted into the MISO input pin of the
master. MISO has a 22.5 kΩ internal pull-up resistor. MISO can be configured as O/D
by setting the OPD bit in the SPICTL register.
Note: Only one slave is allowed to transmit data at any given time. To enable broadcast
transmission to multiple SPI slaves, the DSP's MISO pin may be disabled by setting
(=1) Bit 5 (DMISO) of the SPICTL register.
Boot Configuration Select. Selects the boot mode for the DSP. The BOOTCFG pins
must be valid before reset is asserted. See Table 4 on Page 14 for a description of the
boot modes.
Rev. A |
Page 12 of 44 |
May 2004
ADSP-21262
Table 2. Pin Descriptions (Continued)
Pin
Type
State During and
After Reset
Function
CLKIN
I
Input only
XTAL
O
Output only2
CLKCFG1-0
I
Input only
RSTOUT/CLKOUT
O
Output only
RESET
I/A
Input only
TCK
I
Input only3
TMS
I/S
TDI
I/S
TDO
TRST
O
I/A
Three-state with
pull-up enabled
Three-state with
pull-up enabled
Three-state4
Three-state with
pull-up enabled
EMU
O (O/D)
VDDINT
P
VDDEXT
P
AVDD
P
AVSS
GND
G
G
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-21262 clock input.
It configures the ADSP-21262 to use either its internal clock generator or an external
clock source. Connecting the necessary components to CLKIN and XTAL enables the
internal clock generator. Connecting the external clock to CLKIN while leaving XTAL
unconnected configures the ADSP-21262 to use the external clock source such as an
external clock oscillator. The core is clocked either by the PLL output or this clock
input depending on the CLKCFG1-0 pin settings. CLKIN may not be halted, changed,
or operated below the specified frequency.
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
Core/CLKIN Ratio Control. These pins set the start up clock frequency. See Table 5
on Page 14 for a description of the clock configuration modes.
Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset.
Reset Out/Local Clock Out. Drives out the core reset signal to an external device.
CLKOUT can also be configured as a reset out pin (RSTOUT). The functionality can be
switched between the PLL output clock and reset out by setting Bit 12 of the PMCTL
register. The default is reset out.
Processor Reset. Resets the ADSP-21262 to a known state. Upon deassertion, there
is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins
program execution from the hardware reset vector address. The RESET input must
be asserted (low) at power-up.
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted
(pulsed low) after power-up or held low for proper operation of the ADSP-21262.
Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 kΩ
internal pull-up resistor.
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a
22.5 kΩ internal pull-up resistor.
Test Data Output (JTAG). Serial scan output of the boundary scan path.
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low)
after power-up or held low for proper operation of the ADSP-21262. TRST has a
22.5 kΩ internal pull-up resistor.
Emulation Status. Must be connected to the ADSP-21262 Analog Devices DSP Tools
product line of JTAG emulators target board connector only. EMU has a 22.5 kΩ
internal pull-up resistor.
Core Power Supply. Nominally +1.2 V dc and supplies the DSP’s core processor
(13 pins on the BGA package, 32 pins on the LQFP package).
I/O Power Supply. Nominally +3.3 V dc (6 pins on the BGA package, 10 pins on the
LQFP package).
Analog Power Supply. Nominally +1.2 V dc and supplies the DSP’s internal PLL
(clock generator). This pin has the same specifications as VDDINT, except that added
filtering circuitry is required. For more information, see Power Supplies on Page 8.
Analog Power Supply Return.
Power Supply Return. (54 pins on the BGA package, 39 pins on the LQFP package).
Three-state with
pull-up enabled
1
RD, WR, and ALE are continuously driven by the DSP and will not be three-stated.
Output only is a three-state driver with its output path always enabled.
3
Input only is a three-state driver with both output paths.
4
Three-state is a three-state driver.
2
Rev. A |
Page 13 of 44 |
May 2004
ADSP-21262
ADDRESS DATA PINS AS FLAGS
ADDRESS DATA MODES
To use these pins as flags (FLAGS15-0) set (=1) Bit 20 of the
SYSCTL register and disable the parallel port.
The following table shows the functionality of the AD pins for
8-bit and 16-bit transfers to the parallel port. For 8-bit data
transfers, ALE latches address bits A23-A8 when asserted, followed by address bits A7-A0 and data bits D7-D0 when
deasserted. For 16-bit data transfers, ALE latches address bits
A15-A0 when asserted, followed by data bits D15-D0 when
deasserted.
Table 3. AD[15:0] to Flag Pin Mapping
AD Pin
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
Flag Pin
FLAG8
FLAG9
FLAG10
FLAG11
FLAG12
FLAG13
FLAG14
FLAG15
FLAG0
FLAG1
FLAG2
FLAG3
FLAG4
FLAG5
FLAG6
FLAG7
Table 6. Address/Data Mode Selection
EP Data
Mode
8-bit
8-bit
16-bit
16-bit
BOOT MODES
Table 4. Boot Mode Selection
BOOTCFG1-0
00
01
10
11
Booting Mode
SPI Slave Boot
SPI Master Boot
Parallel Port boot via EPROM
Internal Boot Mode (ROM code only)
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
Table 5. Core Instruction Rate/ CLKIN Ratio Selection
CLKCFG1-0
00
01
10
11
Core to CLKIN Ratio
3:1
16:1
8:1
Reserved
Rev. A |
Page 14 of 44 |
May 2004
ALE
Asserted
Deasserted
Asserted
Deasserted
AD7-0
Function
A15-8
D7-0
A7-0
D7-0
AD15-8
Function
A23-16
A7-0
A15-8
D15-8
ADSP-21262
ADSP-21262 SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
K Grade
Parameter1
Min
Max
Unit
VDDINT
Internal (Core) Supply Voltage
1.14
1.26
V
AVDD
Analog (PLL) Supply Voltage
1.14
1.26
V
VDDEXT
External (I/O) Supply Voltage
3.13
3.47
V
VIH
High Level Input Voltage2, @ VDDEXT = max
2.0
VDDEXT + 0.5
V
VIL
Low Level Input Voltage2 @ VDDEXT = min
–0.5
+0.8
V
VIH_CLKIN
High Level Input Voltage3, @ VDDEXT = max
1.74
VDDEXT + 0.5
V
VIL_CLKIN
Low Level Input Voltage, @ VDDEXT = min
–0.5
+1.28
V
TAMB
Ambient Operating Temperature4, 5
0
+70
°C
1
Specifications subject to change without notice.
Applies to input and bidirectional pins: AD15-0, FLAG3-0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOTCFGx, CLKCFGx, RESET, TCK, TMS, TDI, TRST.
3
Applies to input pin CLKIN.
4
See Thermal Characteristics on Page 38 for information on thermal specifications.
5
See Engineer-to-Engineer Note (No. 216) for further information.
2
ELECTRICAL CHARACTERISTICS
Parameter1
VOH
VOL
IIH
IIL
IILPU
IOZH
IOZL
IOZLPU
IDD-INTYP
AIDD
CIN
High Level Output Voltage2
Low Level Output Voltage2
High Level Input Current4, 5
Low Level Input Current4
Low Level Input Current Pull-Up5
Three-State Leakage Current 6, 7, 8
Three-State Leakage Current6
Three-State Leakage Current Pull-Up7
Supply Current (Internal)9, 10, 11
Supply Current (Analog)12
Input Capacitance13, 14
Test Conditions
@ VDDEXT = min, IOH = –1.0 mA3
@ VDDEXT = min, IOL = 1.0 mA3
@ VDDEXT = max, VIN = VDDEXT max
@ VDDEXT = max, VIN = 0 V
@ VDDEXT = max, VIN = 0 V
@ VDDEXT = max, VIN = VDDEXT max
@ VDDEXT = max, VIN = 0 V
@ VDDEXT = max, VIN = 0 V
tCCLK = 5.0 ns, VDDINT = 1.2 V, TAMB = +25°C
AVDD = max
fIN = 1 MHz, TCASE = 25°C, VIN = 1.2 V
1
Min
2.4
Specifications subject to change without notice.
Applies to output and bidirectional pins: AD15-0, RD, WR, ALE, FLAG3-0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, CLKOUT, XTAL.
3
See Output Drive Currents on Page 37 for typical drive current capabilities.
4
Applies to input pins: SPIDS, BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN.
5
Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
6
Applies to three-statable pins: FLAG3-0.
7
Applies to three-statable pins with 22.5 kΩ pull-ups: AD15-0, DAI_Px, SPICLK, MISO, MOSI.
8
Applies to open-drain output pins: EMU, MISO, MOSI.
9
Typical internal current data reflects nominal operating conditions.
10
See Engineer-to-Engineer Note (No. 216) for further information.
11
Characterized, but not tested.
12
Characterized, but not tested.
13
Applies to all signal pins.
14
Guaranteed, but not tested.
2
Rev. A |
Page 15 of 44 |
May 2004
Max
0.4
10
10
200
10
10
200
500
10
4.7
Unit
V
V
µA
µA
µA
µA
µA
µA
mA
mA
pF
ADSP-21262
ABSOLUTE MAXIMUM RATINGS
Parameter
Internal (Core) Supply Voltage (VDDINT)1
Analog (PLL) Supply Voltage (AVDD)1
External (I/O) Supply Voltage (VDDEXT)1
Input Voltage–0.5 V to VDDEXT1
Output Voltage Swing–0.5 V to VDDEXT1
Load Capacitance1
Storage Temperature Range1
Junction Temperature under Bias
1
Rating
–0.3 V to +1.4 V
–0.3 V to +1.4 V
–0.3 V to +3.8 V
+ 0.5 V
+ 0.5 V
200 pF
–65°C to +150°C
125°C
Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions greater than those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADSP-21262 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
TIMING SPECIFICATIONS
Table 8. Clock Periods
The ADSP-21262’s internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor
core, serial ports, and parallel port (as required for read/write
strobes in asynchronous access mode). During reset, program
the ratio between the DSP’s internal clock frequency and external (CLKIN) clock frequency with the CLKCFG1-0 pins. To
determine switching frequencies for the serial ports, divide
down the internal clock, using the programmable divider control of each port (DIVx for the serial ports).
The ADSP-21262’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the DSP uses an internal phase-locked loop (PLL). This
PLL-based clocking minimizes the skew between the system
clock (CLKIN) signal and the DSP’s internal clock (the clock
source for the parallel port logic and I/O pads).
Note the definitions of various clock periods that are a function
of CLKIN and the appropriate ratio control (Table 7 and
Table 8).
Table 7. ADSP-21262 CLKOUT and CCLK Clock
Generation Operation
Timing
Requirements
CLKIN
CCLK
Description
Calculation
Input Clock
Core Clock
1/tCK
1/tCCLK
Timing
Requirements
tCK
tCCLK
tSCLK
tSPICLK
1
Description1
CLKIN Clock Period
(Processor) Core Clock Period
Serial Port Clock Period = (tCCLK) × SR
SPI Clock Period = (tCCLK) × SPIR
where:
SR = serial port-to-core clock ratio (wide range, determined by
SPORT CLKDIV)
SPIR = SPI-to-Core Clock Ratio (wide range, determined by
SPIBAUD register)
DAI_Px = Serial Port Clock
SPICLK = SPI Clock
Figure 5 shows Core to CLKIN ratios of 3:1, 8:1, and 16:1 with
external oscillator or crystal. Note that more ratios are possible
and can be set through software using the power management
control register (PMCTL). For more information, see the
ADSP-2126x SHARC DSP Core Manual.
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times.
See Figure 30 on Page 37 under Test conditions for voltage reference levels.
Rev. A |
Page 16 of 44 |
May 2004
ADSP-21262
CLKOUT
CLKIN
XTAL
XTAL
OSC
PLLICLK
PLL
3:1, 8:1,
16:1
CCLK
(CORE CLOCK)
CLK-CFG [1:0]
Figure 5. Core Clock and System Clock Relationship to CLKIN
Rev. A |
Switching characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
as memory) is satisfied.
Timingrequirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Page 17 of 44 |
May 2004
ADSP-21262
Power-Up Sequencing
The timing requirements for DSP startup are given in Table 9.
Table 9. Power-Up Sequencing Timing Requirements (DSP Startup)
Parameter
Min
Max
Unit
Timing Requirements
tRSTVDD
RESET Low Before VDDINT/VDDEXT on
tIVDDEVDD
VDDINT on Before VDDEXT
tCLKVDD
CLKIN Valid After VDDINT/VDDEXT valid
0
1
ns
–50
200
ms
0
200
ms
2
µs
µs
tCLKRST
CLKIN Valid Before RESET Deasserted
10
tPLLRST
PLL Control Setup Before RESET Deasserted
203
Switching Characteristic
tCORERST
4096tCK4, 5
DSP Core Reset Deasserted After RESET Deasserted
1
Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds
depending on the design of the power supply subsystem.
2
Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to the crystal oscillator manufacturer's data sheet for startup time.
Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3
Based on CLKIN cycles.
4
Applies after the power-up sequence is complete. Subsequent resets require a minimum of 4 CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
5
The 4096 cycle count depends on tSRST specification in Table 11. If setup time is not met, 1 additional CLKIN cycle may be added to the core reset time, resulting in 4097
cycles maximum.
R ES E T
tR S T V D D
V D D IN T
tIV D D E V D D
V D D EX T
tC L K V D D
C LK IN
tC L K R S T
C LK _C FG 1-0
tC O R E R S T
t PL L R S T
R ST O U T*
*M U LTIP LE X ED W ITH C LK O U T
Figure 6. Power-Up Sequencing
Rev. A |
Page 18 of 44 |
May 2004
ADSP-21262
Clock Input
Table 10. Clock Input
Parameter
200 MHz
Min
Timing Requirements
tCK
CLKIN Period
tCKL
CLKIN Width Low
tCKH
CLKIN Width High
tCKRF
CLKIN Rise/Fall (0.4 V – 2.0 V)
tCCLK
CCLK Period3
151
61
61
5
1
Applies only for CLKCFG1-0 = 00 and default values for PLL control bits in PMCTL.
2
Applies only for CLKCFG1-0 = 01 and default values for PLL control bits in PMCTL.
3
Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK.
tCK
CLKIN
tCKH
tCKL
Figure 7. Clock Input
Clock Signals
The ADSP-21262 can use an external clock or a crystal. See
CLKIN pin description. The programmer can configure the
ADSP-21262 to use its internal clock generator by connecting
the necessary components to CLKIN and XTAL. Figure 8 shows
the component connections used for a crystal operating in fundamental mode. Note that the clock rate is achieved using a
12.5 MHz crystal and a PLL multiplier ratio 16:1
(CCLK:CLKIN).
CLKIN
C1
1M⍀
X1
XTAL
C2
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. CRYSTAL
SELECTION MUST COMPLY WITH CLKCFG1-0 = 10 OR = 01.
Figure 8. 200 MHz Operation with a 12.5 MHz Fundamental Mode
Crystal
Rev. A |
Page 19 of 44 |
May 2004
Unit
Max
1602
802
802
3
10
ns
ns
ns
ns
ns
ADSP-21262
Reset
Table 11. Reset
Parameter
Timing Requirements
tWRST
RESET Pulse Width Low1
tSRST
RESET Setup Before CLKIN Low
1
Min
Max
Unit
4tCK
8
ns
ns
Applies after the power-up sequence is complete. At power-up, the processor's internal phase-locked loop requires no more than 100 µs while RESET is low, assuming
stable VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tWRST
tSRST
RESET
Figure 9. Reset
Interrupts
The following timing specification applies to the FLAG0,
FLAG1, and FLAG2 pins when they are configured as IRQ0,
IRQ1, and IRQ2 interrupts. Also applies to DAI_P[20:1] pins
when configured as interrupts.
Table 12. Interrupts
Parameter
Timing Requirement
tIPW
IRQx Pulse Width
Min
Max
2 × tCCLK + 2
DAI_P20-1
(FLAG2-0)
(IRQ2-0)
Unit
ns
tIPW
Figure 10. Interrupts
Core Timer
The following timing specification applies to FLAG3 when it is
configured as the core timer (CTIMER).
Table 13. Core Timer
Parameter
Switching Characteristic
tWCTIM
CTIMER Pulse Width
Min
Max
4 × tCCLK – 1
FLAG3
(CTIMER)
ns
tWCTIM
Figure 11. Core Timer
Rev. A |
Page 20 of 44 |
Unit
May 2004
ADSP-21262
Timer PWM_OUT Cycle Timing
The following timing specification applies to Timer[2:0] in
PWM_OUT (pulse width modulation) mode. Timer signals are
routed to the DAI_P[20:1] pins through the SRU. Therefore, the
timing specifications provided below are valid at the
DAI_P[20:1] pins.
Table 14. Timer[2:0] PWM_OUT Timing
Parameter
Switching Characteristic
tPWMO
Timer[2:0] Pulse Width Output
Min
Max
Unit
2 tCCLK – 1
2(231 – 1) tCCLK
ns
Min
Max
Unit
2 tCCLK
2(231 – 1) tCCLK
ns
tPWMO
DAI_P[20:1]
(TIMER[2:0])
Figure 12. Timer[2:0] PWM_OUT Timing
Timer WDTH_CAP Timing
The following timing specification applies to Timer[2:0] in
WDTH_CAP (pulse width count and capture) mode. Timer signals are routed to the DAI_P[20:1] pins through the SRU.
Therefore, the timing specifications provided below are valid at
the DAI_P[20:1] pins.
Table 15. Timer[2:0] Width Capture Timing
Parameter
Timing Requirement
tPWI
Timer[2:0] Pulse Width
tPWI
DAI_P[20:1]
(TIMER[2:0])
Figure 13. Timer[2:0] Width Capture Timing
Rev. A |
Page 21 of 44 |
May 2004
ADSP-21262
DAI Pin to Pin Direct Routing
For direct pin connections only (for example DAI_PB01_I to
DAI_PB02_O).
Table 16. DAI Pin to Pin Routing
Parameter
Timing Requirement
tDPIO
Delay DAI Pin Input Valid to DAI Output Valid
Min
Max
Unit
1.5
10
ns
DAI_Pn
DAI_Pm
tDPIO
Figure 14. DAI Pin to Pin Direct Routing
Rev. A |
Page 22 of 44 |
May 2004
ADSP-21262
inputs and outputs are not directly routed to/from DAI pins (via
pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins
(DAI_P07 – DAI_P20).
Precision Clock Generator (Direct Pin Routing)
This timing is only valid when the SRU is configured such that
the Precision Clock Generator (PCG) takes its inputs directly
from the DAI pins (via pin buffers) and sends its outputs
directly to the DAI pins. For the other cases, where the PCG’s
Table 17. Precision Clock Generator (Direct Pin Routing)
Parameter
Timing Requirements
tPCGIW
Input Clock Period
tSTRIG
PCG Trigger Setup Before Falling Edge of PCG Input Clock
PCG Trigger Hold After Falling Edge of PCG Input Clock
tHTRIG
Min
20
2
2
Switching Characteristics
PCG Output Clock and Frame Sync Active Edge Delay After PCG Input
tDPCGIO
Clock
tDTRIG
PCG Output Clock and Frame Sync Delay After PCG Trigger
Output Clock Period
tPCGOW
2.5
2.5 + 2.5 × tPCGOW
40
tSTRIG
DAI_Pn
PCG_TRIGx_I
tPCGIW
tHTRIG
DAI_Pm
PCG_EXTx_I
(CLKIN)
tDPCGIO
DAI_Py
PCG_CLKx_O
tPCGOW
DAI_Pz
PCG_FSx_O
tDTRIG
Figure 15. Precision Clock Generator (Direct Pin Routing)
Rev. A |
Page 23 of 44 |
May 2004
Max
Unit
ns
ns
ns
10
ns
10 + 2.5 × tPCGOW ns
ns
ADSP-21262
Flags
The timing specifications provided below apply to the
FLAG[3:0] and DAI_P[20:1] pins, the parallel port, and the
serial peripheral interface (SPI). See Table 2 on Page 11 for
more information on flag use.
Table 18. Flags
Parameter
Timing Requirement
tFIPW
FLAG[3:0] IN Pulse Width
Min
2 × tCCLK + 3
ns
Switching Characteristic
tFOPW
FLAG[3:0] OUT Pulse Width
2 × tCCLK – 1
ns
DAI_P[20:1]
(FLAG3-0IN)
(AD[15:0])
tFIPW
DAI_P[20:1]
(FLAG3-0OUT)
(AD[15:0])
tFOPW
Figure 16. Flags
Rev. A |
Page 24 of 44 |
May 2004
Max
Unit
ADSP-21262
Memory Read—Parallel Port
Use these specifications for asynchronous interfacing to
memories (and memory-mapped peripherals) when the
ADSP-21262 is accessing external memory space.
Table 19. 8-Bit Memory Read Cycle
Parameter
Timing Requirements
Address/Data [7:0] Setup Before RD High
tDRS
tDRH
Address/Data [7:0] Hold After RD High
tDAD
Address [15:8] to Data Valid
Min
Unit
D + 0.5 × tCCLK – 3.5
ns
ns
ns
3.3
0
Switching Characteristics
tALEW
ALE Pulse Width
tALERW
ALE Deasserted to Read/Write Asserted
tADAS
Address/Data [15:0] Setup Before ALE Deasserted1
tADAH
Address/Data [15:0] Hold After ALE Deasserted1
ALE Deasserted1 to Address/Data[7:0] In High Z
tALEHZ
tRW
RD Pulse Width
tADRH
Address/Data [15:8] Hold After RD High
D = (Data Cycle Duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Max
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
0.5 × tCCLK – 0.8
D–2
0.5 × tCCLK – 1 + H
0.5 × tCCLK + 2.0
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
ALE
tALEW
tALERW
RD
tRW
WR
tALEHZ
tADAS
AD[15:8]
tADAH
tADRH
VALID ADDRESS
VALID ADDRESS
tDRS
AD[7:0]
VALID ADDRESS
tDAD
Figure 17. Read Cycle for 8-Bit Memory Timing
Rev. A |
Page 25 of 44 |
May 2004
tDRH
VALID DATA
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Table 20. 16-Bit Memory Read Cycle
Parameter
Timing Requirements
tDRS
tDRH
Min
Address/Data [15:0] Setup Before RD High
Address/Data [15:0] Hold After RD High
Switching Characteristics
tALEW
ALE Pulse Width
ALE Deasserted to Read/Write Asserted
tALERW
tADAS
Address/Data [15:0] Setup Before ALE Deasserted1
tADAH
Address/Data [15:0] Hold After ALE Deasserted1
tALEHZ
ALE Deasserted1 to Address/Data[15:0] In High Z
tRW
RD Pulse Width
D = (Data Cycle Duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Max
3.3
0
ns
ns
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
0.5 × tCCLK – 0.8
D–2
ns
ns
ns
ns
ns
ns
ns
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
ALE
tALEW
tALERW
RD
tRW
WR
tADAH
tADAS
AD[15:0]
tDRS
tALEHZ
Figure 18. Read Cycle for 16-Bit Memory Timing
Rev. A |
tDRH
VALID DATA
VALID ADDRESS
Page 26 of 44 |
May 2004
Unit
0.5tCCLK + 2.0
ADSP-21262
Memory Write—Parallel Port
Use these specifications for asynchronous interfacing to
memories (and memory-mapped peripherals) when the
ADSP-21262 is accessing external memory space.
Table 21. 8-Bit Memory Write Cycle
Parameter
Switching Characteristics
ALE Pulse Width
tALEW
tALERW
ALE Deasserted to Read/Write Asserted
tADAS
Address/Data [15:0] Setup Before ALE Deasserted1
tADAH
Address/Data [15:0] Hold After ALE Deasserted 1
tWW
WR Pulse Width
tADWL
Address/Data [15:8] to WR Low
Address/Data [15:8] Hold After WR High
tADWH
tALEHZ
ALE Deasserted1 to Address/Data[15:0] In High Z
tDWS
Address/Data [7:0] Setup Before WR High
tDWH
Address/Data [7:0] Hold After WR High
tDAWH
Address/Data to WR High
D = (Data Cycle Duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Min
Max
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
D–2
0.5 × tCCLK – 1.5
0.5 × tCCLK – 1 + H
0.5 × tCCLK – 0.8
D
0.5 × tCCLK – 1.5 + H
D
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
tALERW
ALE
tALEW
tDAWH
WR
tWW
RD
tALEHZ
tADAS
AD[15:8]
tADWL
tADWH
tADAH
VALID ADDRESS
VALID ADDRESS
tDWS
AD[7:0]
VALID ADDRESS
VALID DATA
Figure 19. Write Cycle for 8-Bit Memory Timing
Rev. A |
tDWH
Page 27 of 44 |
May 2004
0.5tCCLK + 2.0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Table 22. 16-Bit Memory Write Cycle
Parameter
Switching Characteristics
tALEW
ALE Pulse Width
ALE Deasserted to Read/Write Asserted
tALERW
tADAS
Address/Data [15:0] Setup Before ALE Deasserted1
tADAH
Address/Data [15:0] Hold After ALE Deasserted1
tWW
WR Pulse Width
tALEHZ
ALE Deasserted1 to Address/Data[15:0] In High Z
tDWS
Address/Data [15:0] Setup Before WR High
tDWH
Address/Data [15:0] Hold After WR High
D = (Data Cycle Duration) × tCCLK
H = tCCLK (if a hold cycle is specified, else H = 0)
1
Min
Max
2 × tCCLK – 2
1 × tCCLK – 0.5
2.5 × tCCLK – 2.0
0.5 × tCCLK – 0.8
D–2
0.5 × tCCLK –0.8
D
0.5 × tCCLK – 1.5 + H
On reset, ALE is an active high cycle. However, it can be reconfigured by software to be active low.
ALE
tALEW
tALERW
tWW
WR
RD
tALEHZ
tADAS
AD[15:0]
tADAH
VALID ADDRESS
tDWS
VALID DATA
Figure 20. Write Cycle for 16-Bit Memory Timing
Rev. A |
tDWH
Page 28 of 44 |
May 2004
0.5tCCLK + 2.0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Serial Ports
To determine whether communication is possible between two
devices at clock speed n, the following specifications must be
confirmed: 1) frame sync delay and frame sync setup and hold,
2) data delay and data setup and hold, and 3) SCLK width.
Serial port signals (SCLK, FS, DxA,/DxB) are routed to the
DAI_P[20:1] pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P[20:1] pins.
Table 23. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)1
tHFSE
FS Hold After SCLK
(Externally Generated FS in Either Transmit or Receive Mode)1
tSDRE
Receive Data Setup Before Receive SCLK1
tHDRE
Receive Data Hold After SCLK1
tSCLKW
SCLK Width
tSCLK
SCLK Period
Switching Characteristics
tDFSE
FS Delay After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)2
tHOFSE
FS Hold After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)2
tDDTE
Transmit Data Delay After Transmit SCLK2
tHDTE
Transmit Data Hold After Transmit SCLK2
1
2
Min
Max
Unit
2.5
ns
2.5
2.5
2.5
7
20
ns
ns
ns
ns
ns
7
ns
7
ns
ns
ns
2
2
Referenced to sample edge.
Referenced to drive edge.
Table 24. Serial Ports—Internal Clock
Parameter
Timing Requirements
tSFSI
FS Setup Before SCLK (Externally Generated FS in Either Transmit or
Receive Mode)1
tHFSI
FS Hold After SCLK (Externally Generated FS in Either Transmit or Receive
Mode)1
tSDRI
Receive Data Setup Before SCLK1
tHDRI
Receive Data Hold After SCLK1
Switching Characteristics
tDFSI
FS Delay After SCLK (Internally Generated FS in Transmit Mode)2
FS Hold After SCLK (Internally Generated FS in Transmit Mode)2
tHOFSI
tDFSI
FS Delay After SCLK (Internally Generated FS in Receive or Mode)2
tHOFSI
FS Hold After SCLK (Internally Generated FS in Receive Mode)2
tDDTI
Transmit Data Delay After SCLK2
tHDTI
Transmit Data Hold After SCLK2
tSCLKIW
Transmit or Receive SCLK Width
1
2
Referenced to the sample edge.
Referenced to drive edge.
Rev. A |
Page 29 of 44 |
May 2004
Min
Max
Unit
6
ns
1.5
6
1.5
ns
ns
ns
3
–1.0
3
–1.0
3
–1.0
0.5tSCLK – 2
0.5tSCLK + 2
ns
ns
ns
ns
ns
ns
ns
ADSP-21262
Table 25. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
tDDTEN
Data Enable from External Transmit SCLK1
Data Disable from External Transmit SCLK1
tDDTTE
tDDTIN
Data Enable from Internal Transmit SCLK1
1
Min
Max
Unit
7
ns
ns
ns
Max
Unit
7
ns
ns
2
–1
Referenced to drive edge.
Table 26. Serial Ports—External Late Frame Sync
Parameter
Min
Switching Characteristics
tDDTLFSE
Data Delay from Late External Transmit FS or External Receive FS with
MCE = 1, MFD = 01
tDDTENFS
Data Enable for MCE = 1, MFD = 01
0.5
1
The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair mode as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DIA_P[20:0]
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DIA_P[20:0]
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DIA_P[20:0]
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DIA_P[20:0]
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DIA_P[20:0]
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DIA_P[20:0]
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
NOTE
SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P[20:1] PINS
USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P[20:1] PINS.
Figure 21. External Late Frame Sync1
1
This figure reflects changes made to support left-justified sample pair mode.
Rev. A |
Page 30 of 44 |
May 2004
ADSP-21262
DATA RECEIVE— EXTERNAL CLOCK
DATA RECEIVE— INTERNAL CLOCK
DRIVE EDGE
DRIVE EDGE
SAMPLE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P[20:1]
(SCLK)
DAI_P[20:1]
(SCLK)
tDFSI
tDFSE
tHFSI
tSFSI
tHOFSI
DAI_P[20:1]
(FS)
tHFSE
tSFSE
tHOFSE
DAI_P[20:1]
(FS)
tSDRI
tHDRI
DAI_P[20:1]
(DATA CHANNEL A/B)
tSDRE
tHDRE
DAI_P[20:1]
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT — INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT — EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P[20:1]
(SCLK)
DAI_P[20:1]
(SCLK)
tDFSI
tHOFSI
tDFSE
tHFSI
tSFSI
DAI_P[20:1]
(FS)
tHOFSE
tSFSE
tHFSE
DAI_P[20:1]
(FS)
tDDTI
tHDTI
tDDTE
tHDTE
DAI_P[20:1]
(DATA CHANNEL A/B)
DAI_P[20:1]
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
DAI_P[20:1]
SCLK (EXT)
SCLK
tDDTEN
tDDTTE
DAI_P[20:1]
(DATA CHANNEL A/B)
DRIVE EDGE
DAI_P[20:1]
SCLK (INT)
tDDTIN
DAI_P[20:1]
(DATA CHANNEL A/B)
Figure 22. Serial Ports
Rev. A |
Page 31 of 44 |
May 2004
ADSP-21262
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 27. IDP
Signals (SCLK, FS, SDATA) are routed to the DAI_P[20:1] pins
using the SRU. Therefore, the timing specifications provided
below are valid at the DAI_P[20:1] pins.
Table 27. Input Data Port
Parameter
Timing Requirements
tSISFS
FS Setup Before SCLK Rising Edge1
tSIHFS
FS Hold After SCLK Rising Edge1
SData Setup Before SCLK Rising Edge1
tSISD
tSIHD
SData Hold After SCLK Rising Edge1
tIDPCLKW
Clock Width
tIDPCLK
Clock Period
1
Min
Max
2.5
2.5
2.5
2.5
7
20
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via the Precision Clock Generators (PCG) or SPORTs. PCG's input can be either
CLKIN or any of the DAI pins.
SAMPLE EDGE
tIDPCLKW
DAI_P[20:1]
(SCLK)
tSIHFS
tSISFS
DAI_P[20:1]
(FS)
tSISD
tSIHD
DAI_P[20:1]
(SDATA)
Figure 23. IDP Master Timing
Rev. A |
Page 32 of 44 |
May 2004
ADSP-21262
most significant 16 bits of external PDAP data can be provided
through either the parallel port AD[15:0] or the DAI_P[20:5]
pins. The remaining 4 bits can only be sourced through
DAI_P[4:1]. The timing below is valid at the DAI_P[20:1] pins
or at the AD[15:0] pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in
Table 28. PDAP is the parallel mode operation of Channel 0 of
the IDP. For details on the operation of the IDP, see the IDP
chapter of the ADSP-2126x Peripherals Manual. Note that the
Table 28. Parallel Data Acquisition Port (PDAP)
1
Parameter
Timing Requirements
tSPCLKEN
PDAP_CLKEN Setup Before PDAP_CLK Sample Edge1
tHPCLKEN
PDAP_CLKEN Hold After PDAP_CLK Sample Edge1
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge1
tPDSD
tPDHD
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge1
tPDCLKW
Clock Width
tPDCLK
Clock Period
Min
Max
Unit
2.5
2.5
2.5
2.5
7
20
ns
ns
ns
ns
ns
ns
Switching Characteristics
tPDHLDD
Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word
tPDSTRB
PDAP Strobe Pulse Width
2 × tCCLK
1 × tCCLK – 1
ns
ns
Source pins of DATA are ADDR[7:0], DATA[7:0], or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
t PDCLK
t PDCLKW
DAI_P[20:1]
(PDAP_CLK)
t SPCLKEN
t HPCLKEN
DAI_P[20:1]
(PDAP_CLKEN)
t PDSD
t PDHD
DATA
DAI_P[20:1]
(PDAP_STROBE)
tPDSTRB
t PDHLDD
Figure 24. PDAP Timing
Rev. A |
Page 33 of 44 |
May 2004
ADSP-21262
SPI Interface—Master
Table 29. SPI Interface Protocol — Master Switching and Timing Specifications
Parameter
Switching Characteristics
tSPICLKM
Serial Clock Cycle
tSPICHM
Serial Clock High Period
tSPICLM
Serial Clock Low Period
tDDSPIDM
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDM
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tSDSCIM
FLAG3-0 OUT (SPI device select) Low to First SPICLK Edge
Last SPICLK Edge to FLAG3-0 OUT High
tHDSM
tSPITDM
Sequential Transfer Delay
Min
Max
10
4 × tCCLK – 2
4 × tCCLK – 1
4 × tCCLK – 1
ns
ns
ns
ns
ns
ns
ns
ns
Timing Requirements
tSSPIDM
tHSPIDM
5
2
ns
ns
8 × tCCLK
4 × tCCLK – 2
4 × tCCLK – 2
3
Data Input Valid to SPICLK Edge (Data Input Setup Time)
SPICLK Last Sampling Edge to Data Input Not Valid
FLAG3-0
(OUTPUT)
tSDSCIM
tSPICHM
tSPICLM
tSPICLM
tSPICHM
tSPICLKM
tHDSM
tSPIT DM
SPICLK
(CP = 0)
(OUTPUT)
SPICLK
(CP = 1)
(OUTPUT)
t HDSPIDM
tD D S P I D M
MOSI
(OUTPUT)
MSB
LSB
tS S P I D M
CPHASE = 1
tSSPIDM
MISO
(INPUT)
MSB
VALID
LSB
VALID
tDDSPIDM
MOSI
(OUTPUT)
CPHASE = 0
MISO
(INPUT)
tH S P I D M
tHSPIDM
tHDSPIDM
MSB
tSSPIDM
LSB
tHSPIDM
MSB
VALID
LSB
VALID
Figure 25. SPI Master Timing
Rev. A |
Page 34 of 44 |
May 2004
Unit
ADSP-21262
SPI Interface—Slave
Table 30. SPI Interface Protocol—Slave Switching and Timing Specifications
Parameter
Switching Characteristics
tDSOE
SPIDS Assertion to Data Out Active
tDSDHI
SPIDS Deassertion to Data High Impedance
tDDSPIDS
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDS
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tDSOV
SPIDS Assertion to Data Out Valid (CPHASE = 0)
Timing Requirements
tSPICLKS
tSPICHS
tSPICLS
tSDSCO
tHDS
tSSPIDS
tHSPIDS
tSDPPW
Min
Max
Unit
0
0
5
5
7.5
ns
ns
ns
ns
ns
2 × tCCLK – 2
5 × tCCLK + 2
Serial Clock Cycle
Serial Clock High Period
Serial Clock Low Period
SPIDS Assertion to First SPICLK Edge
CPHASE = 0
CPHASE = 1
Last SPICLK Edge to SPIDS Not Asserted CPHASE = 0
Data Input Valid to SPICLK Edge (Data Input Setup Time)
SPICLK Last Sampling Edge to Data Input Not Valid
SPIDS Deassertion Pulse Width (CPHASE = 0)
4 × tCCLK
2 × tCCLK – 2
2 × tCCLK – 2
ns
ns
ns
2 × tCCLK + 1
2 × tCCLK + 1
2 × tCCLK
2
2
2 × tCCLK
ns
ns
ns
ns
ns
ns
SPIDS
(INPUT)
t S P IC H S
tSPICLS
tSPICL KS
tHDS
SPICLK
(CP = 0)
(INPUT)
tSPICLS
tSDSCO
SPICLK
(CP = 1)
(INPUT)
tSPICHS
tDSDHI
tDDSPIDS
tDSOE
tSDPPW
tDDSPIDS
MISO
(OUTPUT)
tHDSPIDS
MSB
LSB
tHSPIDS
tSSPIDS
CPHASE = 1
tSSPIDS
MOSI
(INPUT)
MSB VALID
LSB VALID
tDSOV
MISO
(OUTPUT)
LSB
MSB
CPHASE = 0
MOSI
(INPUT)
tHDSPIDS
tDDSPIDS
tD S O E
tHSPIDS
tSSPIDS
MSB VALID
LSB VALID
Figure 26. SPI Slave Timing
Rev. A |
Page 35 of 44 |
May 2004
tDSDHI
ADSP-21262
JTAG Test Access Port and Emulation
Table 31. JTAG Test Access Port and Emulation
Parameter
Timing Requirements
tTCK
TCK Period
tSTAP
TDI, TMS Setup Before TCK High
tHTAP
TDI, TMS Hold After TCK High
tSSYS
System Inputs Setup Before TCK High1
tHSYS
System Inputs Hold After TCK High1
tTRSTW
TRST Pulse Width
Min
20
5
6
7
8
4tCK
Switching Characteristics
tDTDO
TDO Delay from TCK Low
System Outputs Delay After TCK Low2
tDSYS
1
2
tTCK
TCK
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 27. IEEE 11499.1 JTAG Test Access Port
Rev. A |
Page 36 of 44 |
May 2004
Unit
ns
ns
ns
ns
ns
ns
7
10
System Inputs = AD15-0, SPIDS, CLKCFG1-0, RESET, BOOTCFG1-0, MISO, MOSI, SPICLK, DAI_Px, FLAG3-0
System Outputs = MISO, MOSI, SPICLK, DAI_Px, AD15-0, RD, WR, FLAG3-0, CLKOUT, EMU, ALE.
tSTAP
Max
ns
ns
ADSP-21262
OUTPUT DRIVE CURRENTS
CAPACITIVE LOADING
Figure 28 shows typical I-V characteristics for the output drivers of the ADSP-21262. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 29). Figure 33 shows graphically
how output delays and holds vary with load capacitance. The
graphs of Figure 31, Figure 32, and Figure 33 may not be linear
outside the ranges shown for Typical Output Delay vs. Load
Capacitance and Typical Output Rise Time (20% – 80%, V =
Min) vs. Load Capacitance.
40
VOH
3.3V, 25° C
20
3.47V, 0° C
12.0
10
3.11V, 70° C
10.0
0
-10
RISE AND FALL TIMES (ns)
SOURCE (VDDEXT) CURRENT (mA)
30
3.3V, 25° C
3.11V, 70° C
-20
VOL
-30
3.47V, 0° C
-40
0
0.5
1
1.5
2
2.5
SWEEP (VDDEXT) VOLTAGE (V)
3
3.5
RISE
y = 0.0904x + 1.9426
FALL
8.0
6.0
4.0
y = 0.0722x + 1.4042
2.0
Figure 28. ADSP-21262 Typical Drive
0
0
20
40
TEST CONDITIONS
60
80
100
120
100
120
LOAD CAPACITANCE (pF)
The ac signal specifications (timing parameters) appear in
Table 10 on Page 19 through Table 31 on Page 36. These include
output disable time, output enable time, and capacitive loading.
Figure 31. Typical Output Rise/Fall Time
(20%-80%, VDDEXT = Max)
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 30. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
1.5V
RISE
10
RISE AND FALL TIMES (ns)
50⍀
TO
OUTPUT
PIN
12
y = 0.0915x + 2.2207
FALL
8
6
y = 0.0728x +1.6336
4
30pF
2
0
0
Figure 29. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
INPUT
1.5V
OR
OUTPUT
20
40
60
80
LOAD CAPACITANCE (pF)
Figure 32. Typical Output Rise/Fall Time
(20%-80%, VDDEXT = Min)
1.5V
Figure 30. Voltage Reference Levels for AC Measurements
Rev. A |
Page 37 of 44 |
May 2004
ADSP-21262
where:
7
TA = Ambient Temperature °C
OUTPUT DELAY OR HOLD (ns)
6
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
5
4
Values of θJB are provided for package comparison and PCB
design considerations.
y = 0.0904x - 2.712
3
2
1
Table 32. Thermal Characteristics for 136-Ball BGA1
0
Parameter
θJA
θJMA
θJMA
θJB
θJC
ΨJT
ΨJMT
ΨJMT
-1
-2
-3
-4
0
20
40
60
80
100
120
LOAD CAPACITANCE (pF)
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
1
ENVIRONMENTAL CONDITIONS
The ADSP-21262 processor is rated for performance over the
commercial temperature range, TAMB = 0°C to 70°C.
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
28.2
24.4
23.3
20.1
7.0
0.1
0.3
0.4
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
The thermal characteristics values provided in this table are modeled values.
Table 33. Thermal Characteristics for 144-Lead LQFP1
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
THERMAL CHARACTERISTICS
Table 32 and Table 33 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-toboard measurement complies with JESD51-8. The junction-tocase measurement complies with MIL-STD-883. All measurements use a 2S2P JEDEC test board.
To determine the Junction Temperature of the device while on
the application PCB, use:
1
T J = T CASE + ( Ψ JT × P D )
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
The thermal characteristics values provided in this table are modeled values.
where:
TJ = Junction temperature °C
TCASE = Case temperature (°C) measured at the top center of the
package
ΨJT = Junction-to-Top (of package) characterization parameter
is the Typical value from Table 32 and Table 33.
PD = Power dissipation (see EE Note #216)
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approximation of TJ by the equation:
T J = T A + ( θ JA × P D )
Rev. A |
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Page 38 of 44 |
May 2004
ADSP-21262
136-BALL BGA PIN CONFIGURATIONS
The following table and shows the ADSP-21262’s pin names
and their default function after reset (in parentheses). Figure 34
on Page 41 shows the BGA package pin assignments.
Table 34. 136-Ball BGA Pin Assignments
Pin Name
CLKCFG0
XTAL
TMS
TCK
TDI
CLKOUT
TDO
EMU
MOSI
MISO
SPIDS
VDDINT
GND
GND
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
FLAG3
BGA Pin
No.
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
E01
E02
E04
E05
E06
E09
E10
E11
E13
E14
Pin Name
CLKCFG1
GND
VDDEXT
CLKIN
TRST
AVSS
AVDD
VDDEXT
SPICLK
RESET
VDDINT
GND
GND
GND
FLAG1
FLAG0
GND
GND
GND
GND
GND
GND
FLAG2
DAI_P20 (SFS45)
Rev. A |
BGA Pin
No.
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
F01
F02
F04
F05
F06
F09
F10
F11
F13
F14
Pin Name
BOOTCFG1
BOOTCFG0
GND
GND
GND
VDDINT
BGA Pin
No.
C01
C02
C03
C12
C13
C14
AD7
VDDINT
VDDEXT
DAI_P19 (SCLK45)
G01
G02
G13
G14
Page 39 of 44 |
May 2004
Pin Name
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
VDDINT
BGA Pin
No.
D01
D02
D04
D05
D06
D09
D10
D11
D13
D14
AD6
VDDEXT
DAI_P18 (SD5B)
DAI_P17 (SD5A)
H01
H02
H13
H14
ADSP-21262
Table 34. 136-Ball BGA Pin Assignments (Continued)
Pin Name
AD5
AD4
GND
GND
GND
GND
GND
GND
VDDINT
DAI_P16 (SD4B)
AD15
ALE
RD
VDDINT
VDDEXT
AD8
VDDINT
DAI_P2 (SD0B)
VDDEXT
DAI_P4 (SFS0)
VDDINT
VDDINT
GND
DAI_P10 SD2B)
BGA Pin
No.
J01
J02
J04
J05
J06
J09
J10
J11
J13
J14
N01
N02
N03
N04
N05
N06
N07
N08
N09
N10
N11
N12
N13
N14
Pin Name
BGA Pin
No.
K01
K02
K04
K05
K06
K09
K10
K11
K13
K14
P01
P02
P03
P04
P05
P06
P07
P08
P09
P10
P11
P12
P13
P14
AD3
VDDINT
GND
GND
GND
GND
GND
GND
GND
DAI_P15 (SD4A)
AD14
AD13
AD12
AD11
AD10
AD9
DAI_P1 (SD0A)
DAI_P3 (SCLK0)
DAI_P5 (SD1A)
DAI_P6 (SD1B)
DAI_P7 (SCLK1)
DAI_P8 (SFS1)
DAI_P9 (SD2A)
DAI_P11 (SD3A)
Rev. A |
Pin Name
AD2
AD1
GND
GND
GND
GND
GND
GND
GND
DAI_P14 (SFS23)
Page 40 of 44 |
May 2004
BGA Pin
No.
L01
L02
L04
L05
L06
L09
L10
L11
L13
L14
Pin Name
AD0
WR
GND
GND
DAI_P12 (SD3B)
DAI_P13 (SCLK23)
BGA Pin
No.
M01
M02
M03
M12
M13
M14
ADSP-21262
14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY
VDDINT
GND*
AVDD
VDDEXT
AVSS
I/O SIGNALS
*USE THE CENTER BLOCK OF GROUND PINS TO PROVIDE
THERMAL PATHWAYS TO YOUR PRINTED
CIRCUIT BOARD’S GROUND PLANE.
Figure 34. 136-Ball BGA Pin Assignments (Bottom View, Summary)
Rev. A |
Page 41 of 44 |
May 2004
ADSP-21262
144-LEAD LQFP PIN CONFIGURATIONS
The following table shows the ADSP-21262’s pin names and
their default function after reset (in parentheses).
Table 35. 144-Lead LQFP Pin Assignments
Pin Name
VDDINT
CLKCFG0
CLKCFG1
BOOTCFG0
BOOTCFG1
GND
VDDEXT
GND
VDDINT
GND
VDDINT
GND
VDDINT
GND
FLAG0
FLAG1
AD7
GND
VDDINT
GND
VDDEXT
GND
VDDINT
AD6
AD5
AD4
VDDINT
GND
AD3
AD2
VDDEXT
GND
AD1
AD0
WR
VDDINT
LQFP
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Pin Name
VDDINT
GND
RD
ALE
AD15
AD14
AD13
GND
VDDEXT
AD12
VDDINT
GND
AD11
AD10
AD9
AD8
DAI_P1 (SD0A)
VDDINT
GND
DAI_P2 (SD0B)
DAI_P3 (SCLK0)
GND
VDDEXT
VDDINT
GND
DAI_P4 (SFS0)
DAI_P5 (SD1A)
DAI_P6 (SD1B)
DAI_P7 (SCLK1)
VDDINT
GND
VDDINT
GND
DAI_P8 (SFS1)
DAI_P9 (SD2A)
VDDINT
LQFP
Pin No.
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
Rev. A |
Pin Name
LQFP
Pin No.
VDDEXT
73
GND
74
VDDINT
75
GND
76
DAI_P10 (SD2B)
77
DAI_P11 (SD3A)
78
DAI_P12 (SD3B)
79
DAI_P13 (SCLK23) 80
DAI_P14 (SFS23)
81
DAI_P15 (SD4A)
82
VDDINT
83
GND
84
GND
85
DAI_P16 (SD4B)
86
DAI_P17 (SD5A)
87
DAI_P18 (SD5B)
88
DAI_P19 (SCLK45) 89
VDDINT
90
GND
91
GND
92
VDDEXT
93
DAI_P20 (SFS45)
94
GND
95
VDDINT
96
FLAG2
97
FLAG3
98
VDDINT
99
GND
100
101
VDDINT
GND
102
VDDINT
103
GND
104
VDDINT
105
GND
106
VDDINT
107
VDDINT
108
Page 42 of 44 |
May 2004
Pin Name
GND
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDEXT
GND
VDDINT
GND
VDDINT
RESET
SPIDS
GND
VDDINT
SPICLK
MISO
MOSI
GND
VDDINT
VDDEXT
AVDD
AVSS
GND
CLKOUT
EMU
TDO
TDI
TRST
TCK
TMS
GND
CLKIN
XTAL
VDDEXT
LQFP
Pin No.
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
ADSP-21262
PACKAGE DIMENSIONS
The ADSP-21262 is available in a 136-ball BGA package and a
144-lead LQFP package shown in Figure 35 and Figure 36.
10.40 BSC SQ
12.00 BSC SQ
0.80
BSC
TYP
PIN A1 INDICATOR
A
B
C
D
E
F
G
H
J
K
L
M
N
P
0.80
BSC
TYP
14 13 12 11 10 9 8 7 6 5 4 3 2 1
BOTTOM VIEW
TOP VIEW
1.70
MAX
1.31
1.21
1.10
DETAIL A
0.25
1. DIMENSIONS ARE IN MILIMETERS (MM).
MIN
2. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.150 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
3. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.08 MM
OF ITS IDEAL POSITION RELATIVE TO THE BALL GRID.
4. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
THE BALL DIAMETER.
5. CENTER DIMENSIONS ARE NOMINAL.
(BALL
DIAMETER)
DETAIL A
Figure 35. 136-Ball BGA (BC-136)
Rev. A |
Page 43 of 44 |
SEATING
PLANE
0.50
0.46
0.40
May 2004
0.12 MAX (BALL
COPLANARITY)
ADSP-21262
22.00 BSC SQ
20.00 BSC SQ
109
144
1
108
PIN 1 INDICATOR
0.50
BSC
TYP
(LEAD
PITCH)
0.27
0.22 TYP
0.17
SEATING
PLANE
0.08 MAX (LEAD
COPLANARITY)
1. DIMENSIONS ARE IN MILLIMETERS AND COMPLY
WITH JEDEC STANDARD MS-026-BFB.
0.15
0.05
2. ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08
OF ITS IDEAL POSITION WHEN MEASURED IN THE
LATERAL DIRECTION.
1.45
1.40
1.35
0.75
0.60 TYP
0.45
3. CENTER DIMENSIONS ARE NOMINAL.
73
36
72
37
1.60 MAX
DETAIL A
DETAIL A
TOP VIEW (PINS DOWN)
Figure 36. 144-Lead LQFP (ST-144)
ORDERING GUIDE
Part Number
ADSP-21262SKBC-200
ADSP-21262SKBCZ2002
ADSP-21262SKSTZ2002
1
2
Ambient Temperature
Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
Instruction
Rate
200 MHz
200 MHz
200 MHz
On-Chip
SRAM
2 Mbit
2 Mbit
2 Mbit
ROM
Operating Voltage Package1
4 Mbit
4 Mbit
4 Mbit
1.2 INT/3.3 EXT V
1.2 INT/3.3 EXT V
1.2 INT/3.3 EXT V
BC indicates Ball Grid Array package. ST indicates Low Profile Quad Flat package.
Z = Pb-free part. For more information about lead-free package offerings, please visit www.analog.com.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04442–0–4/04(A)
Rev. A |
Page 44 of 44 |
May 2004
136-Lead BGA
136-Lead BGA
144-Lead LQFP