AD ADSP

a
SHARC® Processor
ADSP-21367
Preliminary Technical Data
SUMMARY
processor algorithm combination support will vary
depending upon the chip version and the system configurations. Please visit www.analog.com
Single-Instruction Multiple-Data (SIMD) computational
architecture
On-chip memory—2M bit of on-chip SRAM and a dedicated
6M bit of on-chip mask-programmable ROM
Code compatible with all other members of the SHARC family
The ADSP-21367 is available with a 400 MHz core instruction
rate with unique audio centric peripherals such as the Digital Audio Interface, S/PDIF transceiver, serial ports, 8channel asynchronous sample rate converter, precision
clock generators and more. For complete ordering information, see Ordering Guide on page 47
High performance 32-bit/40-bit floating point processor
optimized for high performance automotive audio
processing
Audio decoder and post processor-algorithm support with
32-bit floating-point implementations
Non-volatile memory may be configured to support audio
decoders and post processor-algorithms like PCM, Dolby
Digital EX, Dolby Prologic IIx, Dolby Digital Plus, Dolby
headphone, DTS 96/24, Neo:6, DTS ES, DTS Lossless,
MPEG2 AAC, MPEG2 2channel, MP3, WMAPro, and Multichannel encoder. Functions like Bass management, Delay,
Speaker equalization, Graphic equalization, Decoder/post-
JTAG TEST & EMULATION
4 BLOCKS OF
ON-CHIP MEMORY
INSTRUCTION
CACHE
32 X 48-BIT
TIMER
EXTERNAL PORT
2M BIT RAM, 6M BIT ROM
SDRAM
CONTROL LER
DAG2
8X4X32
DAG1
8X4X32
ADDR
PROGRAM
SEQUENCER
DATA
ASYNCHRONOUS
MEMORY
INTERFACE
24
CONTROL PINS
CORE PROCESSOR
8
3
ADDRESS
11
C ONTROL
32
DATA
32
32
64
64
IOA(24)
PROCESSING
EL EMENT
(PEX)
PROCESSING
ELEMENT
(PEY)
PWM (16)
S
SRC (8 CHANNELS)
SPDIF (RX/TX)
SERIAL PORTS (8)
SPI PORT (2)
INPUT DATA PORT/
PDAP
TWO WIRE
INTERFACE
DAI PINS
DPI PINS
DPI ROUTI NG UNIT
GPIO FLAGS/
IRQ/TIMEXP
DMA
CONTROLLER
34 CHANNE LS
PRECISION CLOCK
GENERATORS (4)
DM ADDRESS BUS
PM DATA BUS
DM DATA BUS
IOD(32)
IOP REGIST ER (MEMORY MAPPED)
CONTROL, STATUS, & DATA BUFFERS
DAI ROUTING UNI T
4
PX REGISTER
PM ADDRESS BUS
MEMORY-T OMEMORY DMA (2)
UART (2)
TIMERS (3)
DIGITAL PERIPHERAL INTERFACE
DIGITAL AUDIO INTERFACE
20
14
I/O PROCESSOR
Figure 1. Functional Block Diagram – Processor Core
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. PrA
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However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
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registered trademarks are the property of their respective companies.
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© 2004 Analog Devices, Inc. All rights reserved.
ADSP-21367
Preliminary Technical Data
KEY FEATURES – PROCESSOR CORE
At 400 MHz (2.5 ns) core instruction rate, the ADSP-21367
performs 2.4 GFLOPS/800 MMACS
2M bit on-chip SRAM (0.75M Bit in blocks 0 and 1, and 250K
Bit in blocks 2 and 3) for simultaneous access by the core
processor and DMA
6M bit on-chip mask-programmable ROM (3M bit in block 0
and 3M bit in block 1)
Dual Data Address Generators (DAGs) with modulo and bitreverse addressing
Zero-overhead looping with single-cycle loop setup, providing efficient program sequencing
Single Instruction Multiple Data (SIMD) architecture
provides:
Two computational processing elements
Concurrent execution
Code compatibility with other SHARC family members at
the assembly level
Parallelism in busses and computational units allows: Single cycle executions (with or without SIMD) of a multiply
operation, an ALU operation, a dual memory read or
write, and an instruction fetch
Transfers between memory and core at a sustained 6.0G
bytes/s bandwidth at 400 MHz core instruction rate
INPUT/OUTPUT FEATURES
DMA Controller supports:
34 zero-overhead DMA channels for transfers between
ADSP-21367 internal memory and a variety of
peripherals
32-bit DMA transfers at core clock speed, in parallel with
full-speed processor execution
32-Bit Wide External Port Provides Glueless Connection to
both Synchronous (SDRAM) and Asynchronous Memory
Devices
Programmable wait state options: 2 to 31 SCLK cycles
Delay-line DMA engine maintains circular buffers in external memory with tap/offset based reads
SDRAM accesses at 166MHz and Asynchronous accesses at
66MHz
4 Memory Select lines allows multiple external memory
devices
Digital Audio Interface (DAI) includes eight serial ports, four
Precision Clock Generators, an Input Data Port, an S/PDIF
transceiver, an 8-channel asynchronous sample rate converter, and a Signal Routing Unit
Digital Peripheral Interface (DPI) includes, three timers, two
UARTs, two SPI ports, and a two wire interface port
Outputs of PCG's C and D can be driven on to DPI pins
Eight dual data line serial ports that operate at up to 50M
bits/s on each data line — each has a clock, frame sync and
two data lines that can be configured as either a receiver or
transmitter pair
TDM support for telecommunications interfaces including
128 TDM channel support for newer telephony interfaces
such as H.100/H.110
Rev. PrA |
Up to 16 TDM stream support, each with 128 channels per
frame
Companding selection on a per channel basis in TDM mode
Input data port, configurable as eight channels of serial data
or seven channels of serial data and a single channel of up
to a 20-bit wide parallel data
Signal routing unit provides configurable and flexible connections between all DAI/DPI components
2 Muxed Flag/IRQ lines
1 Muxed Flag/Timer expired line /MS pin
1 Muxed Flag/IRQ /MS pin
DEDICATED AUDIO COMPONENTS
S/PDIF Compatible Digital Audio receiver/transmitter supports EIAJ CP-340 (CP-1201), IEC-958, AES/EBU standards
Left-justified, I2S or right-justified serial data input with
16, 18, 20 or 24-bit word widths (transmitter)
Sample Rate Converter (SRC) contains a Serial Input Port, Deemphasis Filter, Sample Rate Converter (SRC) and Serial
Output Port providing up to -128db SNR performance.
Supports Left Justified, I2S, TDM and Right Justified 24, 20,
18 and 16-bit serial formats (input)
Pulse Width Modulation provides:
16 PWM outputs configured as four groups of four outputs
supports center-aligned or edge-aligned PWM waveforms
ROM Based Security features include:
JTAG access to memory permitted with a 64-bit key
Protected memory regions that can be assigned to limit
access under program control to sensitive code
PLL has a wide variety of software and hardware multiplier/divider ratios
Dual voltage: 3.3 V I/O, 1.3 V core
Available in 256-ball BGA and 208-lead LQFP Packages (see
Ordering Guide on page 47)
Page 2 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
TABLE OF CONTENTS
Summary ............................................................... 1
Pin Function Descriptions ........................................ 12
Key Features – Processor Core ................................. 2
Address Data Modes ............................................ 14
Input/Output Features ........................................... 2
Boot Modes ....................................................... 14
Dedicated Audio Components ................................. 2
Core Instruction Rate to CLKIN Ratio Modes ............ 14
General Description ................................................. 4
ADSP-21367 Specifications ....................................... 15
ADSP-21367 Family Core Architecture ...................... 4
Recommended Operating Conditions ...................... 15
SIMD Computational Engine ............................... 4
Electrical Characteristics ....................................... 15
Independent, Parallel Computation Units ................ 4
Absolute Maximum Ratings ................................... 16
Data Register File ............................................... 5
ESD Sensitivity ................................................... 16
Single-Cycle Fetch of Instruction and Four Operands . 5
Timing Specifications ........................................... 16
Instruction Cache .............................................. 5
Power-Up Sequencing ....................................... 18
Data Address Generators With Zero-Overhead Hardware
Circular Buffer Support .................................... 5
Clock Input .................................................... 19
Flexible Instruction Set ....................................... 6
Reset ............................................................. 20
ADSP-21367 Memory ............................................ 6
Interrupts ....................................................... 20
On-Chip Memory .............................................. 6
Core Timer ..................................................... 21
External Memory .................................................. 6
Timer PWM_OUT Cycle Timing ......................... 21
SDRAM Controller ............................................ 7
Timer WDTH_CAP Timing ............................... 22
Asynchronous Controller .................................... 7
DAI and DPI Pin to Pin Direct Routing ................. 22
ADSP-21367 Input/Output Features .......................... 7
Precision Clock Generator (Direct Pin Routing) ...... 23
DMA Controller ................................................ 7
Flags ............................................................. 24
Digital Audio Interface (DAI) ............................... 7
SDRAM Interface Timing .................................. 25
Serial Ports ....................................................... 8
External Port Bus Request and Grant Cycle Timing .. 26
S/PDIF Compatible Digital Audio Receiver/Transmitter
and Synchronous/Asynchronous Sample
Rate Converter ............................................... 8
Serial Ports ..................................................... 27
Digital Peripheral Interface (DPI) .......................... 8
Parallel Data Acquisition Port (PDAP) .................. 31
Serial Peripheral (Compatible) Interface .................. 8
Sample Rate Converter—Serial Input Port .............. 32
UART Port ...................................................... 8
Sample Rate Converter—Serial Output Port ........... 33
Timers ............................................................ 9
SPDIF Transmitter ........................................... 34
Two Wire Interface Port (TWI) ............................. 9
SPDIF Receiver ................................................ 36
Pulse Width Modulation ..................................... 9
SPI Interface—Master ....................................... 38
ROM Based Security ........................................... 9
SPI Interface—Slave .......................................... 39
System Design ...................................................... 9
Universal Asynchronous Receiver-Transmitter
(UART) Port—Receive and Transmit Timing ...... 40
Program Booting .............................................. 10
Power Supplies ................................................. 10
Target Board JTAG Emulator Connector ................ 10
Development Tools .............................................. 10
Designing an Emulator-Compatible DSP
Board (Target) .............................................. 11
Evaluation Kit .................................................. 11
Clock Signals ................................................... 19
Input Data Port ............................................... 30
JTAG Test Access Port and Emulation .................. 41
Output Drive Currents ......................................... 42
Test Conditions .................................................. 42
Capacitive Loading .............................................. 42
Thermal Characteristics ........................................ 43
Ordering Guide ..................................................... 45
Additional Information ......................................... 11
Rev. PrA |
Page 3 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
GENERAL DESCRIPTION
The ADSP-21367 SHARC processor is a members of the SIMD
SHARC family of DSPs that feature Analog Devices' Super Harvard Architecture. The ADSP-21367 is source code compatible
with the ADSP-2126x, and ADSP-2116x, DSPs as well as with
first generation ADSP-2106x SHARC processors in SISD (Single-Instruction, Single-Data) mode. The ADSP-21367 is a 32bit/40-bit floating point processors optimized for high performance automotive audio applications with its large on-chip
SRAM and mask-programmable ROM, multiple internal buses
to eliminate I/O bottlenecks, and an innovative Digital Audio
Interface (DAI).
As shown in the functional block diagram on page 1, the
ADSP-21367 uses two computational units to deliver a significant performance increase over the previous SHARC processors
on a range of DSP algorithms. Fabricated in a state-of-the-art,
high speed, CMOS process, the ADSP-21367 processor achieves
an instruction cycle time of 2.5 ns at 400 MHz. With its SIMD
computational hardware, the ADSP-21367 can perform 2.4
GFLOPS running at 400 MHz.
Table 1 shows performance benchmarks for the ADSP-21367.
Table 1. ADSP-21367 Benchmarks (at 400 MHz)
Benchmark Algorithm
Speed
(at 400 MHz)
1024 Point Complex FFT (Radix 4, with reversal) 23.25 µs
FIR Filter (per tap)1
1.25 ns
1
IIR Filter (per biquad)
5.0 ns
Matrix Multiply (pipelined)
[3x3] × [3x1]
11.25 ns
[4x4] × [4x1]
20.0 ns
Divide (y/×)
8.75 ns
Inverse Square Root
13.5 ns
1
Assumes two files in multichannel SIMD mode
The ADSP-21367 continues SHARC’s industry leading standards of integration for DSPs, combining a high performance
32-bit DSP core with integrated, on-chip system features.
The block diagram of the ADSP-21367 on page 1, illustrates the
following architectural features:
• Two processing elements, each of which comprises an
ALU, Multiplier, Shifter and Data Register File
• On-Chip mask-programmable ROM (6M bit)
• JTAG test access port
The block diagram of the ADSP-21367 on page 1 also illustrates
the following architectural features:
• DMA controller
• Eight full duplex serial ports
• Two SPI-compatible interface ports
• Digital Audio Interface that includes four precision clock
generators (PCG), an input data port (IDP), an S/PDIF
receiver/transmitter, eight channels asynchronous sample
rate converters, eight serial ports, eight serial interfaces, a
20-bit parallel input port, a flexible signal routing unit
(SRU), and a Digital Peripheral Interface (DPI)
ADSP-21367 FAMILY CORE ARCHITECTURE
The ADSP-21367 is code compatible at the assembly level with
the ADSP-2126x, ADSP-21160 and ADSP-21161, and with the
first generation ADSP-2106x SHARC processors. The ADSP21367 shares architectural features with the ADSP-2126x and
ADSP-2116x SIMD SHARC processors, as detailed in the following sections.
SIMD Computational Engine
The ADSP-21367 contains two computational processing elements that operate as a Single-Instruction Multiple-Data
(SIMD) engine. The processing elements are referred to as PEX
and PEY and each contains an ALU, multiplier, shifter and register file. PEX is always active, and PEY may be enabled by
setting the PEYEN mode bit in the MODE1 register. When this
mode is enabled, the same instruction is executed in both processing elements, but each processing element operates on
different data. This architecture is efficient at executing math
intensive DSP algorithms.
Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in
SIMD mode, twice the data bandwidth is required to sustain
computational operation in the processing elements. Because of
this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When
using the DAGs to transfer data in SIMD mode, two data values
are transferred with each access of memory or the register file.
Independent, Parallel Computation Units
• Data Address Generators (DAG1, DAG2)
• Program sequencer with instruction cache
• PM and DM buses capable of supporting four 32-bit data
transfers between memory and the core at every core processor cycle
• Three Programmable Interval Timers with PWM Generation, PWM Capture/Pulse width Measurement, and
External Event Counter Capabilities
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing ele-
• On-Chip SRAM (2M bit)
Rev. PrA |
Page 4 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs
automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation.
Circular buffers can start and end at any memory location.
ments. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats.
Data Register File
A general-purpose data register file is contained in each processing element. The register files transfer data between the
computation units and the data buses, and store intermediate
results. These 10-port, 32-register (16 primary, 16 secondary)
register files, combined with the ADSP-2136x enhanced Harvard architecture, allow unconstrained data flow between
computation units and internal memory. The registers in PEX
are referred to as R0-R15 and in PEY as S0-S15.
Flexible Instruction Set
The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the
ADSP-21367 can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetching up to four 32-bit values from memory—all in a single
instruction.
Single-Cycle Fetch of Instruction and Four Operands
ADSP-21367 MEMORY
The ADSP-21367 features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data
(see Figure 1 on page 1). With the ADSP-21367’s separate program and data memory buses and on-chip instruction cache,
the processor can simultaneously fetch four operands (two over
each data bus) and one instruction (from the cache), all in a single cycle.
The ADSP-21367 adds the following architectural features to
the SIMD SHARC family core.
Instruction Cache
The ADSP-21367 includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full-speed execution of core, looped operations
such as digital filter multiply-accumulates, and FFT butterfly
processing.
Data Address Generators With Zero-Overhead Hardware
Circular Buffer Support
The ADSP-21367’s two data address generators (DAGs) are
used for indirect addressing and implementing circular data
buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital
signal processing, and are commonly used in digital filters and
Fourier transforms. The two DAGs of the ADSP-21367 contain
On-Chip Memory
The ADSP-21367 contains two megabits of internal RAM and
six megabits of internal mask-programmable ROM. Each block
can be configured for different combinations of code and data
storage (see Table 2). Each memory block supports single-cycle,
independent accesses by the core processor and I/O processor.
The ADSP-21367 memory architecture, in combination with its
separate on-chip buses, allow two data transfers from the core
and one from the I/O processor, in a single cycle.
The ADSP-21367’s, SRAM can be configured as a maximum of
64K words of 32-bit data, 128K words of 16-bit data, 42K words
of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to three megabits. All of the memory can be
accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles
the amount of data that may be stored on-chip. Conversion
between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory
block can store combinations of code and data, accesses are
most efficient when one block stores data using the DM bus for
transfers, and the other block stores instructions and data using
the PM bus for transfers.
Table 2. ADSP-21367 Internal Memory Space
IOP Registers 0x0000 0000 - 0003 FFFF
Long Word (64 bits)
Extended Precision Normal or Normal Word (32 bits)
Instruction Word (48 bits)
Short Word (16 bits)
BLOCK 0 ROM
0x0004 0000–0x0004 BFFF
BLOCK 0 ROM
0x0008 0000–0x0008 FFFF
BLOCK 0 ROM
0x0008 0000–0x0009 7FFF
BLOCK 0 ROM
0x0010 0000–0x0012 FFFF
Reserved
0x0004 F000–0x0004 FFFF
Reserved
0x0009 4000–0x0009 FFFF
Reserved
0x0009 E0000–0x0009 FFFF
Reserved
0x0013 C000–0x0013 FFFF
BLOCK 0 RAM
0x0004 C000–0x0004 EFFF
BLOCK 0 RAM
0x0009 0000–0x0009 3FFF
BLOCK 0 RAM
0x0009 8000–0x0009 DFFF
BLOCK 0 RAM
0x0013 0000–0x0013 BFFF
BLOCK 1 ROM
0x0005 0000–0x0005 BFFF
BLOCK 1 ROM
0x000A 0000–0x000A FFFF
BLOCK 1 ROM
0x000A 0000– 0x000B 7FFF
BLOCK 1 ROM
0x0014 0000–0x0016 FFFF
Rev. PrA |
Page 5 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
Table 2. ADSP-21367 Internal Memory Space (Continued)
IOP Registers 0x0000 0000 - 0003 FFFF
Long Word (64 bits)
Extended Precision Normal or Normal Word (32 bits)
Instruction Word (48 bits)
Short Word (16 bits)
Reserved
0x0005 F000–0x0005 FFFF
Reserved
0x000B 4000–0x000B FFFF
Reserved
0x000B E000– 0x000B FFFF
Reserved
0x0017 C000–0x0017 FFFF
BLOCK 1 RAM
0x0005 C000–0x0005 EFFF
BLOCK 1 RAM
0x000B 0000–0x000B 3FFF
BLOCK 1 RAM
0x000B 8000–0x000B DFFF
BLOCK 1 RAM
0x0017 0000–0x0017 BFFF
BLOCK 2 RAM
0x0006 0000–0x0006 0FFF
BLOCK 2 RAM
0x000C 0000–0x000C 1554
BLOCK 2 RAM
0x000C 0000–0x000C 1FFF
BLOCK 2 RAM
0x0018 0000–0x0018 3FFF
Reserved
0x0006 1000– 0x0006 FFFF
Reserved
0x000C 1555–0x000C 3FFF
Reserved
0x000C 2000–0x000D FFFF
Reserved
0x0018 4000–0x001B FFFF
BLOCK 3 RAM
0x0007 0000–0x0007 0FFF
BLOCK 3 RAM
0x000E 0000–0x000E 1554
BLOCK 3 RAM
0x000E 0000–0x000E 1FFF
BLOCK 3 RAM
0x001C 0000–0x001C 3FFF
Reserved
0x0007 1000– 0x0007 FFFF
Reserved
0x000E 1555–0x000F FFFF
Reserved
0x000E 2000–0x000F FFFF
Reserved
0x001C 4000–0x001F FFFF
Using the DM bus and PM buses, with one bus dedicated to
each memory block, assures single-cycle execution with two
data transfers. In this case, the instruction must be available in
the cache.
EXTERNAL MEMORY
The External Port on the ADSP-21367 SHARC provides a high
performance, glueless interface to a wide variety of industrystandard memory devices. The 32-bit wide bus may be used to
interface to synchronous and/or asynchronous memory devices
through the use of it's separate internal memory controllers: the
first is an SDRAM controller for connection of industry-standard synchronous DRAM devices and DIMMs (Dual Inline
Memory Module), while the second is an asynchronous memory controller intended to interface to a variety of memory
devices. Four memory select pins enable up to four separate
devices to coexist, supporting any desired combination of synchronous and asynchronous device types.
SDRAM Controller
The SDRAM controller provides an interface to up to four separate banks of industry-standard SDRAM devices or DIMMs, at
speeds up to fSCLK. Fully compliant with the SDRAM standard,
each bank can has it's own memory select line (MS0–MS3), and
can be configured to contain between 16M bytes and
128M bytes of memory.
The controller maintains all of the banks as a contiguous
address space so that the processor sees this as a single address
space, even if different size devices are used in the different
banks.
A set of programmable timing parameters is available to configure the SDRAM banks to support slower memory devices. The
memory banks can be configured as either 32 bits wide for maximum performance and bandwidth or 16 bits wide for
minimum device count and lower system cost.
Rev. PrA |
The SDRAM controller address, data, clock, and command pins
can drive loads up to 30 pF. For larger memory systems, the
SDRAM controller external buffer timing should be selected
and external buffering should be provided so that the load on
the SDRAM controller pins does not exceed 30 pF.
Asynchronous Controller
The asynchronous memory controller provides a configurable
interface for up to four separate banks of memory or I/O
devices. Each bank can be independently programmed with different timing parameters, enabling connection to a wide variety
of memory devices including SRAM, ROM, and flash EPROM,
as well as I/O devices that interface with standard memory control lines. Bank0 occupies a 14.7M word window and banks 1, 2,
and 3 occupy a 16M word window in the processor’s address
space but, if not fully populated, these windows are not made
contiguous by the memory controller logic. The banks can also
be configured as 8-bit, 16-bit, or 32-bit wide buses for ease of
interfacing to a range of memories and I/O devices tailored
either to high performance or to low cost and power.
The asynchronous memory controller is capable of a maximum
throughput of 267M bytes/sec using a 66MHz external bus
speed. Other features include 8 to 32-bit and 16 to 32-bit packing and unpacking, booting from Bank Select 1, and support for
delay line DMA.
ADSP-21367 INPUT/OUTPUT FEATURES
The ADSP-21367 I/O processor provides 34 channels of DMA,
as well as an extensive set of peripherals. These include a 20 pin
Digital Audio Interface which controls:
• Eight Serial ports
• S/PDIF Receiver/Transmitter
• Four Precision Clock generators
Page 6 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
For complete information on using the DAI, see the ADSP2136x SHARC Processor Hardware Reference.
• Four Sample Rate Converters
• Internal Data port/Parallel Data Acquisition port
Serial Ports
The ADSP-21367 processor also contains a 14 pin Digital
Peripheral Interface which controls:
The ADSP-21367 features eight synchronous serial ports that
provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices such as Analog devices AD183x
family of audio codecs, ADCs, and DACs. The serial ports are
made up of two data lines, a clock and frame sync. The data
lines can be programmed to either transmit or receive and each
data line has a dedicated DMA channel.
• Three general-purpose timers
• Two Serial Peripheral Interfaces
• Two Universal Asynchronous Receiver/Transmitters
(UARTs)
• A Two Wire Interface/I2C
DMA Controller
The ADSP-21367’s on-chip DMA controller allows data transfers without processor intervention. The DMA controller
operates independently and invisibly to the processor core,
allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can
occur between the ADSP-21367’s internal memory and its serial
ports, the SPI-compatible (Serial Peripheral Interface) ports, the
IDP (Input Data Port), the Parallel Data Acquisition Port
(PDAP) or the UART. Thirty-four channels of DMA are available on the ADSP-21367—sixteen via the serial ports, eight via
the Input Data Port, four for the UARTs, two for the SPI interface, two for the external port, and two for memory-to-memory
transfers. Programs can be downloaded to the ADSP-21367
using DMA transfers. Other DMA features include interrupt
generation upon completion of DMA transfers, and DMA
chaining for automatic linked DMA transfers.
Delay Line DMA
The ADSP-21367 processor provides Delay Line DMA functionality. This allows processor reads and writes to external
Delay Line Buffers (and hence to external memory) with limited
core interaction.
Digital Audio Interface (DAI)
The Digital Audio Interface (DAI) provides the ability to connect various peripherals to any of the DSPs DAI pins
(DAI_P20–1).
Programs make these connections using the Signal Routing
Unit (SRU, shown in Figure 1.
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI
associated peripherals for a much wider variety of applications
by using a larger set of algorithms than is possible with non configurable signal paths.
The DAI also includes eight serial ports, an S/PDIF
receiver/transmitter, four precision clock generators (PCG),
eight channels of synchronous sample rate converters, and an
input data port (IDP). The IDP provides an additional input
path to the ADSP-21367 core, configurable as either eight channels of I2S serial data or as seven channels plus a single 20-bit
wide synchronous parallel data acquisition port. Each data
channel has its own DMA channel that is independent from the
ADSP-21367's serial ports.
Rev. PrA |
Serial ports are enabled via 16 programmable and simultaneous
receive or transmit pins that support up to 32 transmit or 32
receive channels of audio data when all eight SPORTS are
enabled, or eight full duplex TDM streams of 128 channels per
frame.
The serial ports operate at a maximum data rate of 50M bits/s.
Serial port data can be automatically transferred to and from
on-chip memory via dedicated DMA channels. Each of the
serial ports can work in conjunction with another serial port to
provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals.
The frame sync and clock are shared.
Serial ports operate in five modes:
• Standard DSP serial mode
• Multichannel (TDM) mode with support for Packed I2S
mode
• I2S mode
• Packed I2S mode
• Left-justified sample pair mode
Left-justified sample pair mode is a mode where in each frame
sync cycle two samples of data are transmitted/received—one
sample on the high segment of the frame sync, the other on the
low segment of the frame sync. Programs have control over various attributes of this mode.
Each of the serial ports supports the left-justified sample pair
and I2S protocols (I2S is an industry standard interface commonly used by audio codecs, ADCs and DACs such as the
Analog Devices AD183x family), with two data pins, allowing
four left-justified sample pair or I2S channels (using two stereo
devices) per serial port, with a maximum of up to 32 I2S channels. The serial ports permit little-endian or big-endian
transmission formats and word lengths selectable from 3 bits to
32 bits. For the left-justified sample pair and I2S modes, dataword lengths are selectable between 8 bits and 32 bits. Serial
ports offer selectable synchronization and transmit modes as
well as optional µ-law or A-law companding selection on a per
channel basis. Serial port clocks and frame syncs can be internally or externally generated.
The serial ports also contain frame sync error detection logic
where the serial ports detect frame syncs that arrive early (for
example frame syncs that arrive while the transmission/reception of the previous word is occurring). All the serial ports also
share one dedicated error interrupt.
Page 7 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
S/PDIF Compatible Digital Audio Receiver/Transmitter
and Synchronous/Asynchronous Sample Rate Converter
The S/PDIF transmitter has no separate DMA channels. It
receives audio data in serial format and converts it into a
biphase encoded signal. The serial data input to the transmitter
can be formatted as left justified, I2S or right justified with word
widths of 16, 18, 20, or 24 bits.
The serial data, clock, and frame sync inputs to the S/PDIF
transmitter are routed through the Signal Routing Unit (SRU).
They can come from a variety of sources such as the SPORTs,
external pins, the precision clock generators (PCGs), or the
sample rate converters (SRC) and are controlled by the SRU
control registers.
The sample rate converter (SRC) contains four SRC blocks and
is the same core as that used in the AD1896 192 kHz Stereo
Asynchronous Sample Rate Converter and provides up to
128dB SNR. The SRC block is used to perform synchronous or
asynchronous sample rate conversion across independent stereo
channels, without using internal processor resources. The four
SRC blocks can also be configured to operate together to convert multichannel audio data without phase mismatches.
Finally, the SRC is used to clean up audio data from jittery clock
sources such as the S/PDIF receiver.
interface standard. The UART port also includes support for 5
to 8 data bits, 1 or 2 stop bits, and none, even, or odd parity. The
UART port supports two modes of operation:
• PIO (Programmed I/O) – The processor sends or receives
data by writing or reading I/O-mapped UART registers.
The data is double-buffered on both transmit and receive.
• DMA (Direct Memory Access) – The DMA controller
transfers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. The UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
The UART port's baud rate, serial data format, error code generation and status, and interrupts are programmable:
• Supporting bit rates ranging from (fSCLK/ 1,048,576) to
(fSCLK/16) bits per second.
• Supporting data formats from 7 to12 bits per frame.
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
The UART port’s clock rate is calculated as:
f SCLK
UART Clock Rate = -----------------------------------------------16 × UART_Divisor
Digital Peripheral Interface (DPI)
The Digital Peripheral Interface provides connections to two
serial peripheral interface ports, two universal asynchronous
receiver-transmitters (UARTs), a Two Wire Interface (TWI), 12
Flags, and three general-purpose timers.
Where the 16-bit UART_Divisor comes from the DLH register
(most significant 8 bits) and DLL register (least significant
8 bits).
Serial Peripheral (Compatible) Interface
In conjunction with the general-purpose timer functions, autobaud detection is supported.
The ADSP-21367 SHARC processor contains two Serial Peripheral Interface ports (SPIs). The SPI is an industry standard
synchronous serial link, enabling the ADSP-21367 SPI compatible port to communicate with other SPI compatible devices. The
SPI consists of two data pins, one device select pin, and one
clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes. The SPI port can operate
in a multimaster environment by interfacing with up to four
other SPI compatible devices, either acting as a master or slave
device. The ADSP-21367 SPI compatible peripheral implementation also features programmable baud rate and clock phase
and polarities. The ADSP-21367 SPI compatible port uses open
drain drivers to support a multimaster configuration and to
avoid data contention.
UART Port
The ADSP-21367 processor provides a full-duplex Universal
Asynchronous Receiver/Transmitter (UART) port, which is
fully compatible with PC-standard UARTs. The UART port
provides a simplified UART interface to other peripherals or
hosts, supporting full-duplex, DMA-supported, asynchronous
transfers of serial data. The UART also has multiprocessor communication capability using 9-bit address detection. This allows
it to be used in multidrop networks through the RS-485 data
Rev. PrA |
Timers
The ADSP-21367 has a total of four timers: a core timer that can
generate periodic software interrupts and three general purpose
timers that can generate periodic interrupts and be independently set to operate in one of three modes:
• Pulse Waveform Generation mode
• Pulse Width Count /Capture mode
• External Event Watchdog mode
The core timer can be configured to use FLAG3 as a Timer
Expired signal, and each general purpose timer has one bidirectional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables all three
general purpose timers independently.
Page 8 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
Two Wire Interface Port (TWI)
SYSTEM DESIGN
The TWI is a bi-directional 2-wire, serial bus used to move 8-bit
data while maintaining compliance with the I2C bus protocol.
The TWI Master incorporates the following features:
The following sections provide an introduction to system design
options and power supply issues.
• Simultaneous Master and Slave operation on multiple
device systems with support for multi master data
arbitration
Program Booting
The internal memory of the ADSP-21367 boots at system
power-up from an 8-bit EPROM via the external port, an SPI
master, an SPI slave or an internal boot. Booting is determined
by the Boot Configuration (BOOTCFG1–0) pins (see Table 4 on
page 14). Selection of the boot source is controlled via the SPI as
either a master or slave device, or it can immediately begin executing from ROM.
• Digital filtering and timed event processing
• 7 and 10 bit addressing
• 100K bits/s and 400K bits/s data rates
• Low interrupt rate
Power Supplies
Pulse Width Modulation
The PWM module is a flexible, programmable, PWM waveform
generator that can be programmed to generate the required
switching patterns for various applications related to motor and
engine control or audio power control. The PWM generator can
generate either center-aligned or edge-aligned PWM waveforms. In addition, it can generate complementary signals on
two outputs in paired mode or independent signals in non
paired mode (applicable to a single group of four PWM
waveforms).
The entire PWM module has four groups of four PWM outputs
each. Therefore, this module generates 16 PWM outputs in
total. Each PWM group produces two pairs of PWM signals on
the four PWM outputs.
The PWM generator is capable of operating in two distinct
modes while generating center-aligned PWM waveforms: single
update mode or double update mode. In single update mode the
duty cycle values are programmable only once per PWM period.
This results in PWM patterns that are symmetrical about the
mid-point of the PWM period. In double update mode, a second updating of the PWM registers is implemented at the midpoint of the PWM period. In this mode, it is possible to produce
asymmetrical PWM patterns that produce lower harmonic distortion in three-phase PWM inverters.
The ADSP-21367 has separate power supply connections for the
internal (VDDINT), external (VDDEXT), and analog (AVDD/AVSS)
power supplies. The internal and analog supplies must meet the
1.3V requirement. The external supply must meet the 3.3V
requirement. All external supply pins must be connected to the
same power supply.
Note that the analog supply (AVDD) powers the ADSP-21367’s
clock generator PLL. To produce a stable clock, programs
should provide an external circuit to filter the power input to
the AVDD pin. Place the filter as close as possible to the pin. For
an example circuit, see Figure 2. To prevent noise coupling, use
a wide trace for the analog ground (AVSS) signal and install a
decoupling capacitor as close as possible to the pin. Note that
the AVSS and AVDD pins specified in Figure 2 are inputs to the
processor and not the analog ground plane on the board. For
more information, see Electrical Characteristics on page 15.
10⍀
VDDINT
AVDD
0.1␮F
0.01␮F
AVSS
Figure 2. Analog Power (AVDD) Filter Circuit
ROM Based Security
The ADSP-21367 has a ROM security feature that provides
hardware support for securing user software code by preventing
unauthorized reading from the internal code when enabled.
When using this feature, the processor does not boot-load any
external code, executing exclusively from internal SRAM/ROM.
Additionally, the processor is not freely accessible via the JTAG
port. Instead, a unique 64-bit key, which must be scanned in
through the JTAG or Test Access Port will be assigned to each
customer. The device will ignore a wrong key. Emulation features and external boot modes are only available after the
correct key is scanned.
Rev. PrA |
Target Board JTAG Emulator Connector
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the ADSP-21367 processor to monitor and control the target board processor during
emulation. Analog Devices DSP Tools product line of JTAG
emulators provides emulation at full processor speed, allowing
inspection and modification of memory, registers, and processor stacks. The processor's JTAG interface ensures that the
emulator will not affect target system loading or timing.
For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appropriate “Emulator Hardware User's Guide”.
Page 9 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
DEVELOPMENT TOOLS
The ADSP-21367 is supported with a complete set of
CROSSCORE® software and hardware development tools,
including Analog Devices emulators and VisualDSP++® development environment. The same emulator hardware that
supports other SHARC processors also fully emulates the
ADSP-21367.
The VisualDSP++ project management environment lets programmers develop and debug an application. This environment
includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to DSP assembly. The SHARC has
architectural features that improve the efficiency of compiled
C/C++ code.
The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to non intrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• View mixed C/C++ and assembly code (interleaved source
and object information)
• Insert breakpoints
• Set conditional breakpoints on registers, memory,
and stacks
• Trace instruction execution
• Perform linear or statistical profiling of program execution
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
• Create custom debugger windows
Rev. PrA |
The VisualDSP++ IDDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the SHARC development tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tool’s
command line switches
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the memory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
Threads, Critical and Unscheduled regions, Semaphores,
Events, and Device flags. The VDK also supports Priority-based,
Preemptive, Cooperative, and Time-Sliced scheduling
approaches. In addition, the VDK was designed to be scalable. If
the application does not use a specific feature, the support code
for that feature is excluded from the target system.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the generation of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.
VisualDSP++ Component Software Engineering (VCSE) is
Analog Devices’ technology for creating, using, and reusing
software components (independent modules of substantial
functionality) to quickly and reliably assemble software applications. Download components from the Web and drop them into
the application. Publish component archives from within
VisualDSP++. VCSE supports component implementation in
C/C++ or assembly language.
Use the Expert Linker to visually manipulate the placement of
code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data
to different areas of the processor or external memory with the
drag of the mouse, examine run time stack and heap usage. The
Expert Linker is fully compatible with the existing Linker Definition File (LDF), allowing the developer to move between the
graphical and textual environments.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hardware tools include SHARC processor PC plug-in cards. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
Page 10 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
Designing an Emulator-Compatible DSP Board (Target)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on each JTAG DSP. Nonintrusive incircuit emulation is assured by the use of the processor’s JTAG
interface—the emulator does not affect target system loading or
timing. The emulator uses the TAP to access the internal features of the processor, allowing the developer to load code, set
breakpoints, observe variables, observe memory, and examine
registers. The processor must be halted to send data and commands, but once an operation has been completed by the
emulator, the DSP system is set running at full speed with no
impact on system timing.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices
JTAG Emulation Technical Reference on the Analog Devices
website (www.analog.com)—use site search on “EE-68.” This
document is updated regularly to keep pace with improvements
to emulator support.
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the
VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute,
and debug programs for the EZ-KIT Lite system. It also allows
in-circuit programming of the on-board Flash device to store
user-specific boot code, enabling the board to run as a standalone unit without being connected to the PC.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any custom defined system. Connecting one of Analog Devices JTAG
emulators to the EZ-KIT Lite board enables high-speed, nonintrusive emulation.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-21367
architecture and functionality. For detailed information on the
ADSP-2136x Family core architecture and instruction set, refer
to the ADSP-2136x SHARC Processor Hardware Reference and
the ADSP-2136x SHARC Processor Programming Reference.
Evaluation Kit
Analog Devices offers a range of EZ-KIT Lite evaluation platforms to use as a cost effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
includes an evaluation board along with an evaluation suite of
the VisualDSP++ development and debugging environment
with the C/C++ compiler, assembler, and linker. Also included
are sample application programs, power supply, and a USB
cable. All evaluation versions of the software tools are limited
for use only with the EZ-KIT Lite product.
Rev. PrA |
Page 11 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
PIN FUNCTION DESCRIPTIONS
The following symbols appear in the Type column of TBD:
A = Asynchronous, G = Ground, I = Input, O = Output,
P = Power Supply, S = Synchronous, (A/D) = Active Drive,
(O/D) = Open Drain, and T = Three-State, (pd) = pull-down
resistor, (pu) = pull-up resistor.
Table 3. Pin List
Name
Type
State During
and After
Reset
Description
ADDR23–0
I/O with programmable
PUP1
Three-state
External Address Bus.
DATA31–0
I/O with programmable
PUP
Three-state
External Data Bus.
DAI _P20–1
I/O with programmable2 PUP
Three-state
Digital Audio Interface Pins. These pins provide the physical interface to the SRU.
The SRU configuration registers define the combination of on-chip peripheral inputs
or outputs connected to the pin and to the pin’s output enable. The configuration
registers of these peripherals then determines the exact behavior of the pin. Any
input or output signal present in the SRU may be routed to any of these pins. The SRU
provides the connection from the Serial ports, Input data port, precision clock generators and timers, sample rate converters and SPI to the DAI_P20–1 pins These pins
have internal 22.5 kΩ pull-up resistors which are enabled on reset. These pull-ups can
be disabled in the DAI_PIN_PULLUP register.
DPI _P14–1
I/O with programmable3 PUP
Three-state
Digital Peripheral Interface.
ACK
Input with programmable PUP1
Memory Acknowledge. External devices can deassert ACK (low) to add wait states
to an external memory access. ACK is used by I/O devices, memory controllers, or
other peripherals to hold off completion of an external memory access.
RD
I/O with programmable
PUP1
External Port Read Enable. RD is asserted low whenever the processor reads 8-bit
or 16-bit data from an external memory device. When AD15–0 are flags, this pin
remains deasserted. RD has a 22.5 kΩ internal pull-up resistor.
WR
Output with programmable PUP1
External Port Write Enable. WR is asserted low whenever the processor writes 8-bit
or 16-bit data to an external memory device. When AD15–0 are flags, this pin remains
deasserted. WR has a 22.5 kΩ internal pull-up resistor.
SDRAS
Output with programmable PUP1
SDRAM Row Address Strobe. Connect to SDRAM’s RAS pin.
SDCAS
Output with programmable PUP1
SDRAM column address select. Connect to SDRAM’s CAS pin.
SDWE
Output with programmable PUP1
SDRAM Write Enable. Connect to SDRAM’s WE or W buffer pin.
SDCKE
Output with programmable PUP1
SDRAM Clock Enable. Connect to SDRAM’s CKE pin.
SDA10
Output with programmable PUP1
SDRAM A10.
SDCLK0
I/O
SDRAM Clock Configure.
Rev. PrA |
Page 12 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
Table 3. Pin List
Name
Type
State During
and After
Reset
MS0–1
I/O with programmable
PUP1
Memory Select Lines 0–1. These lines are asserted (low) as chip selects for the corresponding banks of external memory. Memory bank size must be defined in the
ADSP-21062’s system control register (SYSCON). The MS3-0 lines are decoded memory
address lines that change at the same time as the other address lines. When no
external memory access is occurring the MS3-0 lines are inactive; they are active
however when a conditional memory access instruction is executed, whether or not
the condition is true. In a multiprocessing system the MS3-0 lines are output by the
bus master.
FLAG[0]/IRQ0
I/O
FLAG0/Interrupt Request0.
FLAG[1]/IRQ1
I/O
FLAG1/Interrupt Request1.
FLAG[2]/IRQ2/
MS2
I/O with
programmable1 pullup (for MS mode)
FLAG2/Interrupt Request/Memory Select2.
FLAG[3]/TIMEX
P/MS3
I/O with
programmable1 pullup (for MS mode)
FLAG3/Timer Expired/Memory Select3.
TDI
Input with pull-up
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a
22.5 kΩ internal pull-up resistor.
TDO
Output
Test Data Output (JTAG). Serial scan output of the boundary scan path.
TMS
Input with pull-up
Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 kΩ
internal pull-up resistor.
TCK
Input
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted
(pulsed low) after power-up or held low for proper operation of the ADSP-21367.
TRST
Input with pull-up
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low)
after power-up or held low for proper operation of the ADSP-21367. TRST has a 22.5
kΩ internal pull-up resistor.
EMU
Output with pull-up
Emulation Status. Must be connected to the ADSP-21367 Analog Devices DSP Tools
product line of JTAG emulators target board connector only. EMU has a 22.5 kΩ
internal pull-up resistor.
CLK_CFG1–0
Input
Core/CLKIN Ratio Control. These pins set the start up clock frequency. See Table 5
for a description of the clock configuration modes.
Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset.
BOOT_CFG1–0
Input
Boot Configuration Select. These pins select the boot mode for the processor. The
BOOTCFG pins must be valid before reset is asserted. See Table 4 for a description of
the boot modes.
RESET
Input
Processor Reset. Resets the ADSP-21367 to a known state. Upon deassertion, there
is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins
program execution from the hardware reset vector address. The RESET input must be
asserted (low) at power-up.
Rev. PrA |
Description
Page 13 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
Table 3. Pin List
Name
Type
State During
and After
Reset
XTAL
Output
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-21367 clock input.
It configures the ADSP-21367 to use either its internal clock generator or an external
clock source. Connecting the necessary components to CLKIN and XTAL enables the
internal clock generator. Connecting the external clock to CLKIN while leaving XTAL
unconnected configures the ADSP-21367 to use the external clock source such as an
external clock oscillator. The core is clocked either by the PLL output or this clock input
depending on the CLKCFG1–0 pin settings. CLKIN may not be halted, changed, or
operated below the specified frequency.
CLKIN
CLKOUT
Description
Local Clock Out. CLKOUT can also be configured as a reset out pin.The functionality
can be switched between the PLL output clock and reset out by setting bit 12 of the
PMCTREG register. The default is reset out.
Output
1
Pull-up is always enabled for ID - 000 in uniprocessor mode and ID- 001 in Multiprocessing mode.
Pull-up can be enabled/disabled, value of pull-up cannot be programmed.
3
OP is three-statable
2
ADDRESS/DATA MODES
TBD
BOOT MODES
Table 4. Boot Mode Selection
BOOTCFG1–0
00
01
10
Booting Mode
SPI Slave Boot
SPI Master Boot
AMI boot via EPROM
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
For details on processor timing, see Timing Specifications and
Figure 3 on page 17.
Table 5. Core Instruction Rate/ CLKIN Ratio Selection
CLKCFG1–0
00
01
10
Core to CLKIN Ratio
6:1
32:1
16:1
Rev. PrA |
Page 14 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
ADSP-21367 SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
K Grade
Parameter1
Min
Max
Unit
VDDINT
Internal (Core) Supply Voltage
1.235
1.365
V
AVDD
Analog (PLL) Supply Voltage
1.235
1.365
V
VDDEXT
External (I/O) Supply Voltage
3.13
3.47
V
VIH
High Level Input Voltage @ VDDEXT = max
2.0
VDDEXT + 0.5
V
VIL2
Low Level Input Voltage @ VDDEXT = min
–0.5
+0.8
V
VIH_CLKIN3
High Level Input Voltage @ VDDEXT = max
1.74
VDDEXT + 0.5
V
VIL_CLKIN
Low Level Input Voltage @ VDDEXT = min
–0.5
+1.19
V
Ambient Operating Temperature
0
+70
°C
2
4, 5
TAMB
1
Specifications subject to change without notice.
Applies to input and bidirectional pins: AD15–0, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOTCFGx, CLKCFGx, RESET, TCK, TMS, TDI, TRST.
3
Applies to input pin CLKIN.
4
See Thermal Characteristics on page 41 for information on thermal specifications.
5
See Engineer-to-Engineer Note (No. TBD) for further information.
2
ELECTRICAL CHARACTERISTICS
Parameter1
VOH2
VOL2
IIH4, 5
IIL4
IILPU5
IOZH6, 7
IOZL6
IOZLPU7
IDD-INTYP8, 9
AIDD10
CIN11, 12
High Level Output Voltage
Low Level Output Voltage
High Level Input Current
Low Level Input Current
Low Level Input Current Pull-up
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current Pull-up
Supply Current (Internal)
Supply Current (Analog)
Input Capacitance
Test Conditions
@ VDDEXT = min, IOH = –1.0 mA3
@ VDDEXT = min, IOL = 1.0 mA3
@ VDDEXT = max, VIN = VDDEXT max
@ VDDEXT = max, VIN = 0 V
@ VDDEXT = max, VIN = 0 V
@ VDDEXT= max, VIN = VDDEXT max
@ VDDEXT = max, VIN = 0 V
@ VDDEXT = max, VIN = 0 V
tCCLK = 5.0 ns, VDDINT = 1.3
AVDD = max
fIN=1 MHz, TCASE=25°C, VIN=1.3V
1
Min
2.4
Specifications subject to change without notice.
Applies to output and bidirectional pins: AD15–0, RD, WR, ALE, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, CLKOUT, XTAL.
3
See Output Drive Currents on page 41 for typical drive current capabilities.
4
Applies to input pins: SPIDS, BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN.
5
Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
6
Applies to three-statable pins: FLAG3–0.
7
Applies to three-statable pins with 22.5 kΩ pull-ups: AD15–0, DAI_Px, SPICLK, EMU, MISO, MOSI.
8
Typical internal current data reflects nominal operating conditions.
9
See Engineer-to-Engineer Note (No. TBD) for further information.
10
Characterized, but not tested.
11
Applies to all signal pins.
12
Guaranteed, but not tested.
2
Rev. PrA |
Page 15 of 48 | November 2004
Max
0.4
10
10
200
10
10
200
500
10
4.7
Unit
V
V
µA
µA
µA
µA
µA
µA
mA
mA
pF
ADSP-21367
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Parameter
Internal (Core) Supply Voltage (VDDINT)1
Analog (PLL) Supply Voltage (AVDD)1
External (I/O) Supply Voltage (VDDEXT)1
Input Voltage–0.5 V to VDDEXT1
Output Voltage Swing–0.5 V to VDDEXT1
Load Capacitance1
Storage Temperature Range1
Junction Temperature under Bias
1
Rating
–0.3 V to +1.5 V
–0.3 V to +1.5 V
–0.3 V to +4.6 V
+ 0.5 V
+ 0.5 V
200 pF
–65°C to +150°C
125°C
Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions greater than those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADSP-21367 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TIMING SPECIFICATIONS
Table 7. Clock Periods
The ADSP-21367’s internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor
core, serial ports, and parallel port (as required for read/write
strobes in asynchronous access mode). During reset, program
the ratio between the processor’s internal clock frequency and
external (CLKIN) clock frequency with the CLKCFG1–0 pins
(see Table 5 on page 14). To determine switching frequencies
for the serial ports, divide down the internal clock, using the
programmable divider control of each port (DIVx for the serial
ports).
The ADSP-21367’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the processor uses an internal phase-locked loop (PLL).
This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the processor’s internal clock (the
clock source for the parallel port logic and I/O pads).
Note the definitions of various clock periods that are a function
of CLKIN and the appropriate ratio control (Table 6).
Table 6. ADSP-21367 CLKOUT and CCLK Clock
Generation Operation
Timing
Requirements
CLKIN
CCLK
Description
Calculation
Input Clock
Core Clock
1/tCK
1/tCCLK
Rev. PrA |
Timing
Requirements
tCK
tCCLK
tPCLK
tSCLK
tSDCLK
tSPICLK
1
Description1
CLKIN Clock Period
(Processor) Core Clock Period
(Peripheral) Clock Period = 2 × tCCLK
Serial Port Clock Period = (tPCLK) × SR
SDRAM Clock Period = (TBD)
SPI Clock Period = (tPCLK) × SPIR
where:
SR = serial port-to-core clock ratio (wide range, determined by SPORT
CLKDIV)
SPIR = SPI-to-Core Clock Ratio (wide range, determined by SPIBAUD register)
DAI_Px = Serial Port Clock
SPICLK = SPI Clock
Figure 3 shows Core to CLKIN ratios of 6:1, 16:1 and 32:1 with
external oscillator or crystal. Note that more ratios are possible
and can be set through software using the power management
control register (PMCTL). For more information, see the ADSP2136x SHARC Processor Programming Reference.
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times. See
Figure 34 on page 41 under Test Conditions for voltage reference levels.
Page 16 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
CLKOUT
CLKIN
XTAL
XTAL
OSC
PLLILCLK
PLL
6:1, 16:1,
32:1
CCLK
(CORE CLOCK)
SDCLK
(SDRAM CLOCK)
CLK-CFG [1:0]
Figure 3. Core Clock and System Clock Relationship to CLKIN
Rev. PrA |
Switching Characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
as memory) is satisfied.
Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Page 17 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
Power-Up Sequencing
The timing requirements for processor startup are given in
Table 8.
Table 8. Power Up Sequencing Timing Requirements (Processor Startup)
Parameter
Timing Requirements
tRSTVDD
tIVDDEVDD
tCLKVDD1
tCLKRST
tPLLRST
Min
RESET Low Before VDDINT/VDDEXT on
VDDINT on Before VDDEXT
CLKIN Valid After VDDINT/VDDEXT Valid
CLKIN Valid Before RESET Deasserted
PLL Control Setup Before RESET Deasserted
0
–50
0
102
203
Switching Characteristic
Core Reset Deasserted After RESET Deasserted
tCORERST
Max
200
200
Unit
ns
ms
ms
µs
µs
4096tCK + 2 tCCLK 4, 5
1
Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.3 and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds
depending on the design of the power supply subsystem.
2
Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's datasheet for startup time.
Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3
Based on CLKIN cycles
4
Applies after the power-up sequence is complete. Subsequent resets require a minimum of 4 CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
5
The 4096 cycle count depends on tSRST specification in Table 10. If setup time is not met, 1 additional CLKIN cycle may be added to the core reset time, resulting in 4097
cycles maximum.
RESET
tRSTVDD
VDDINT
tIVDDEVDD
VDDEXT
tCLKVDD
CLKIN
tCLKRST
CLK_CFG1-0
tPLLRST
tCORERST
RSTOUT
Figure 4. Power-Up Sequencing
Rev. PrA |
Page 18 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
Clock Input
Table 9. Clock Input
Parameter
400 MHz
Min
Timing Requirements
tCK
CLKIN Period
tCKL
CLKIN Width Low
tCKH
CLKIN Width High
tCKRF
CLKIN Rise/Fall (0.4V–2.0V)
tCCLK3
CCLK Period
151
61
61
2.51
1
Applies only for CLKCFG1–0 = 00 and default values for PLL control bits in PMCTL.
Applies only for CLKCFG1–0 = 01 and default values for PLL control bits in PMCTL.
3
Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK.
2
tCK
CLKIN
tCKH
tCKL
Figure 5. Clock Input
Clock Signals
The ADSP-21367 can use an external clock or a crystal. See the
CLKIN pin description in TBD. The programmer can configure
the ADSP-21367 to use its internal clock generator by connecting the necessary components to CLKIN and XTAL. Figure 6
shows the component connections used for a crystal operating
in fundamental mode. Note that the clock rate is achieved using
a 16.67 MHz crystal and a PLL multiplier ratio 16:1
(CCLK:CLKIN achieves a clock speed of 266 MHz). To achieve
the full core clock rate, programs need to configure the multiplier bits in the PMCTL register.
CLKIN
C1
1M⍀
X1
XTAL
C2
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. CRYSTAL
SELECTION MUST COMPLY WITH CLKCFG1-0 = 10 OR = 01.
Figure 6. 400 MHz Operation (Fundamental Mode Crystal)
Rev. PrA |
Page 19 of 48 | November 2004
Unit
Max
3202
1502
1502
TBD
10
ns
ns
ns
ns
ns
ADSP-21367
Preliminary Technical Data
Reset
Table 10. Reset
Parameter
Timing Requirements
tWRST1
RESET Pulse Width Low
tSRST
RESET Setup Before CLKIN Low
1
Min
Max
Unit
4tCK
8
ns
ns
Applies after the power-up sequence is complete. At power-up, the processor's internal phase-locked loop requires no more than 100 µs while RESET is low, assuming
stable VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tSRST
tWRST
RESET
Figure 7. Reset
Interrupts
The following timing specification applies to the FLAG0,
FLAG1, and FLAG2 pins when they are configured as IRQ0,
IRQ1, and IRQ2 interrupts.
Table 11. Interrupts
Parameter
Timing Requirement
tIPW
IRQx Pulse Width
Min
2 × tPCLK +2
DPI14-1
FLAG2-0
(IRQ2-0)
tIPW
Figure 8. Interrupts
Rev. PrA |
Page 20 of 48 | November 2004
Max
Unit
ns
Preliminary Technical Data
ADSP-21367
Core Timer
The following timing specification applies to FLAG3 when it is
configured as the core timer (CTIMER).
Table 12. Core Timer
Parameter
Switching Characteristic
tWCTIM
CTIMER Pulse width
Min
Max
4 × tPCLK – 1
Unit
ns
tWCTIM
FLAG3
(CTIMER)
Figure 9. Core Timer
Timer PWM_OUT Cycle Timing
The following timing specification applies to Timer0, Timer1,
and Timer2 in PWM_OUT (pulse width modulation) mode.
Timer signals are routed to the DAI_P20–1 pins through the
SRU. Therefore, the timing specifications provided below are
valid at the DAI_P20–1 pins.
Table 13. Timer PWM_OUT Timing
Parameter
Switching Characteristic
tPWMO
Timer Pulse Width Output
Min
Max
Unit
2 tPCLK – 1
2(231 – 1) tPCLK
ns
tPWMO
DPI14-0
(TIMER2-0)
Figure 10. Timer PWM_OUT Timing
Rev. PrA |
Page 21 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
Timer WDTH_CAP Timing
The following timing specification applies to Timer0, Timer1,
and Timer2 in WDTH_CAP (pulse width count and capture)
mode. Timer signals are routed to the DAI_P20–1 pins through
the SRU. Therefore, the timing specification provided below are
valid at the DAI_P20–1 pins.
Table 14. Timer Width Capture Timing
Parameter
Timing Requirement
tPWI
Timer Pulse Width
Min
Max
Unit
2 tPCLK
2(231– 1) tPCLK
ns
tPWI
DPI14-0
(TIMER2-0)
Figure 11. Timer Width Capture Timing
Pin to Pin Direct Routing (DAI and DPI)
For direct pin connections only (for example DAI_PB01_I to
DAI_PB02_O).
Table 15. DAI Pin to Pin Routing
Parameter
Timing Requirement
tDPIO
Delay DAI Pin Input Valid to DAI Output Valid
Min
Max
Unit
1.5
10
ns
DAI_Pn
DPI_Pn
DAI_pm
DPI_Pm
tDPIO
Figure 12. DAI Pin to Pin Direct Routing
Rev. PrA |
Page 22 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
inputs and outputs are not directly routed to/from DAI pins (via
pin buffers) there is no timing data available. All Timing Parameters and Switching Characteristics apply to external DAI pins
(DAI_P07 – DAI_P20).
Precision Clock Generator (Direct Pin Routing)
This timing is only valid when the SRU is configured such that
the Precision Clock Generator (PCG) takes its inputs directly
from the DAI pins (via pin buffers) and sends its outputs
directly to the DAI pins. For the other cases, where the PCG’s
Table 16. Precision Clock Generator (Direct Pin Routing)
Parameter
Timing Requirements
tPCGIW
Input Clock Period
tSTRIG
PCG Trigger Setup Before Falling Edge of PCG Input Clock
PCG Trigger Hold After Falling Edge of PCG Input Clock
tHTRIG
Min
24
2
2
Switching Characteristics
PCG Output Clock and Frame Sync Active Edge Delay After
tDPCGIO
PCG Input Clock
PCG Output Clock and Frame Sync Delay After PCG Trigger
tDTRIG
Output Clock Period
tPCGOW
2.5
10
ns
2.5 + 2.5 × tPCGOW 10 + 2.5 × tPCGOW ns
48
tSTRIG
DAI_Pn
DPI_Pn
PCG_TRIGx_I
tPCGIW
tHTRIG
DAI_Pm
DPI_Pm
PCG_EXTx_I
(CLKIN)
tDPCGIO
DAI_Py
DPI_Py
PCG_CLKx_O
tPCGOW
DAI_Pz
DPI_Pz
PCG_FSx_O
tDTRIG
Figure 13. Precision Clock Generator (Direct Pin Routing)
Rev. PrA |
Page 23 of 48 | November 2004
Max
Unit
ns
ns
ADSP-21367
Preliminary Technical Data
Flags
The timing specifications provided below apply to the FLAG3–0
and DPI_P14–1 pins, the parallel port, and the serial peripheral
interface (SPI). See TBD for more information on flag use.
Table 17. Flags
Parameter
Timing Requirement
FLAG3–0 IN Pulse Width
tFIPW
Min
2 × tPCLK + 3
ns
Switching Characteristic
FLAG3–0 OUT Pulse Width
tFOPW
2 × tPCLK – 1
ns
DPI_P140-1
(FLAG3-0IN)
(DATA31-0)
tFIPW
DPI_P14-1
(FLAG3-0OUT )
(DATA31-0)
tFOPW
Figure 14. Flags
Rev. PrA |
Page 24 of 48 | November 2004
Max
Unit
Preliminary Technical Data
ADSP-21367
SDRAM Interface Timing
Table 18. SDRAM Interface Timing1
Parameter
Timing Requirement
tSSDAT
DATA Setup Before CLKOUT
tHSDAT
DATA Hold After CLKOUT
Switching Characteristic
tSCLK
CLKOUT Period
tSCLKH
CLKOUT Width High
tSCLKL
CLKOUT Width Low
Command, ADDR, Data Delay After CLKOUT2
tDCAD
tHCAD
Command, ADDR, Data Hold After CLKOUT1
tDSDAT
Data Disable After CLKOUT
tENSDAT
Data Enable After CLKOUT
1
2
Minimum
ns
ns
TBD
TBD
TBD
ns
ns
ns
ns
ns
ns
ns
TBD
TBD
TBD
TBD
tSCLK
tSCLKH
SDCLK
t SSDAT
t SCLKL
tHSDAT
DATA (IN)
t DCAD
tENSDAT
tD SDA T
tHCAD
DATA(OUT)
tDCAD
CMND ADDR
(OUT)
tHCAD
NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
Figure 15. SDRAM Interface Timing
Page 25 of 48 | November 2004
Unit
TBD
TBD
For VDDINT = 1.3 V.
Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
Rev. PrA |
Maximum
ADSP-21367
Preliminary Technical Data
Serial Ports
To determine whether communication is possible between two
devices at clock speed n, the following specifications must be
confirmed: 1) frame sync delay and frame sync setup and hold,
2) data delay and data setup and hold, and 3) SCLK width.
Serial port signals (SCLK, FS, data channel A,/data channel B)
are routed to the DAI_P20–1 pins using the SRU. Therefore, the
timing specifications provided below are valid at the
DAI_P20–1 pins.
Table 19. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE1
FS Setup Before SCLK
(Externally Generated FS in either Transmit or Receive Mode)
tHFSE1
FS Hold After SCLK
(Externally Generated FS in either Transmit or Receive Mode)
1
tSDRE
Receive Data Setup Before Receive SCLK
tHDRE1
Receive Data Hold After SCLK
tSCLKW
SCLK Width
tSCLK
SCLK Period
Switching Characteristics
tDFSE2
FS Delay After SCLK
(Internally Generated FS in either Transmit or Receive Mode)
tHOFSE2
FS Hold After SCLK
(Internally Generated FS in either Transmit or Receive Mode)
tDDTE2
Transmit Data Delay After Transmit SCLK
tHDTE2
Transmit Data Hold After Transmit SCLK
1
2
Min
Max
Unit
2.5
ns
2.5
2.5
2.5
24
48
ns
ns
ns
ns
ns
7
ns
7
ns
ns
ns
2
2
Referenced to sample edge.
Referenced to drive edge.
Table 20. Serial Ports—Internal Clock
Parameter
Timing Requirements
FS Setup Before SCLK
tSFSI1
(Externally Generated FS in either Transmit or Receive Mode)
FS Hold After SCLK
tHFSI1
(Externally Generated FS in either Transmit or Receive Mode)
1
tSDRI
Receive Data Setup Before SCLK
tHDRI1
Receive Data Hold After SCLK
Switching Characteristics
tDFSI2
FS Delay After SCLK (Internally Generated FS in Transmit Mode)
FS Hold After SCLK (Internally Generated FS in Transmit Mode)
tHOFSI2
2
tDFSI
FS Delay After SCLK (Internally Generated FS in Receive or Mode)
tHOFSI2
FS Hold After SCLK (Internally Generated FS in Receive Mode)
tDDTI2
Transmit Data Delay After SCLK
2
tHDTI
Transmit Data Hold After SCLK
tSCLKIW
Transmit or Receive SCLK Width
1
2
Referenced to the sample edge.
Referenced to drive edge.
Rev. PrA |
Page 26 of 48 | November 2004
Min
Max
Unit
7
ns
2.5
7
2.5
ns
ns
ns
3
–1.0
3
–1.0
3
–1.0
0.5tSCLK – 2
0.5tSCLK + 2
ns
ns
ns
ns
ns
ns
ns
Preliminary Technical Data
ADSP-21367
Table 21. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
tDDTEN1
Data Enable from External Transmit SCLK
Data Disable from External Transmit SCLK
tDDTTE1
tDDTIN1
Data Enable from Internal Transmit SCLK
1
Min
Max
Unit
7
ns
ns
ns
Max
Unit
7
ns
ns
2
–1
Referenced to drive edge.
Table 22. Serial Ports—External Late Frame Sync
Parameter
Min
Switching Characteristics
tDDTLFSE1
Data Delay from Late External Transmit FS or External Receive FS
with MCE = 1, MFD = 0
tDDTENFS1
Data Enable for MCE = 1, MFD = 0
0.5
1
The tDDTLFSE and tDDTENFS parameters apply to Left-justified Sample Pair as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DAI_P20-1
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20-1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DAI_P20-1
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20-1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
NOTE
SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20-1 PINS
USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20-1 PINS.
Figure 16. External Late Frame Sync1
1
This figure reflects changes made to support Left-justified Sample Pair mode.
Rev. PrA |
Page 27 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
DATA RECEIVE— EXTERNAL CLOCK
DATA RECEIVE— INTERNAL CLOCK
DRIVE EDGE
DRIVE EDGE
SAMPLE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20-1
(SCLK)
DAI_P20-1
(SCLK)
tDFSI
tDFSE
tHFSI
tSFSI
tHOFSI
DAI_P20-1
(FS)
tHFSE
tSFSE
tHOFSE
DAI_P20-1
(FS)
tSDRI
tHDRI
DAI_P20-1
(DATA CHANNEL A/B)
tSDRE
tHDRE
DAI_P20-1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT — INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT — EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20-1
(SCLK)
DAI_P20-1
(SCLK)
tDFSI
tHOFSI
tDFSE
tHFSI
tSFSI
tHOFSE
tSFSE
tHFSE
DAI_P20-1
(FS)
DAI_P20-1
(FS)
tDDTI
tHDTI
tHDTE
tDDTE
DAI_P20-1
(DATA CHANNEL A/B)
DAI_P20-1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
DAI_P20-1
SCLK (EXT)
SCLK
tDDTEN
tDDTTE
DAI_P20-1
(DATA CHANNEL A/B)
DRIVE EDGE
DAI_P20-1
SCLK (INT)
tDDTIN
DAI_P20-1
(DATA CHANNEL A/B)
Figure 17. Serial Ports
Rev. PrA |
Page 28 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
Input Data Port
The timing requirements for the IDP are given in Table 23.IDP
Signals (SCLK, FS, SDATA) are routed to the DAI_P20–1 pins
using the SRU. Therefore, the timing specifications provided
below are valid at the DAI_P20–1 pins.
Table 23. IDP
Parameter
Timing Requirements
tSISFS1
FS Setup Before SCLK Rising Edge
1
tSIHFS
FS Hold After SCLK Rising Edge
SData Setup Before SCLK Rising Edge
tSISD1
tSIHD1
SData Hold After SCLK Rising Edge
tIDPCLKW
Clock Width
tIDPCLK
Clock Period
1
Min
2.5
2.5
2.5
2.5
9
24
Max
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tIPDCLK
tIPDCLKW
DAI_P20-1
(SCLK)
tSISFS
tSIHFS
DAI_P20-1
(FS)
tSISD
tSIHD
DAI_P20-1
(SDATA)
Figure 18. IDP Master Timing
Rev. PrA |
Page 29 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
ence. Note that the most significant 16 bits of external PDAP
data can be provided through either the parallel port AD15–0 or
the DAI_P20–5 pins. The remaining 4 bits can only be sourced
through DAI_P4–1. The timing below is valid at the
DAI_P20–1 pins or at the AD15–0 pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in
Table 24. PDAP is the parallel mode operation of channel 0 of
the IDP. For details on the operation of the IDP, see the IDP
chapter of the ADSP-2136x SHARC Processor Hardware ReferTable 24. Parallel Data Acquisition Port (PDAP)
1
Parameter
Timing Requirements
tSPCLKEN1
PDAP_CLKEN Setup Before PDAP_CLK Sample Edge
1
tHPCLKEN
PDAP_CLKEN Hold After PDAP_CLK Sample Edge
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge
tPDSD1
tPDHD1
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge
tPDCLKW
Clock Width
tPDCLK
Clock Period
Min
Max
Unit
2.5
2.5
2.5
2.5
7
24
ns
ns
ns
ns
ns
ns
Switching Characteristics
tPDHLDD
Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word
tPDSTRB
PDAP Strobe Pulse Width
2 × tCCLK
1 × tCCLK – 1
ns
ns
Source pins of DATA are ADDR7–0, DATA7–0, or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
t PDCLK
t PDCLKW
DAI_P20-1
(PDAP_CLK)
t SPCLKEN
t HPCLKEN
DAI_P20-1
(PDAP_CLKEN)
t PDSD
t PDHD
DATA
DAI_P20-1
(PDAP_STROBE)
tPDSTRB
t PDHLDD
Figure 19. PDAP Timing
Rev. PrA |
Page 30 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
Sample Rate Converter—Serial Input Port
The SRC input signals (SCLK, FS, and SDATA) are routed from
the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided in Table 25 are valid at the DAI_P20–1 pins.
Table 25. SRC, Serial Input Port
Parameter
Timing Requirements
FS Setup Before SCLK Rising Edge
tSRCSFS1
tSRCHFS1
FS Hold After SCLK Rising Edge
tSRCSD1
SData Setup Before SCLK Rising Edge
1
tSRCHD
SData Hold After SCLK Rising Edge
tSRCCLKW
Clock Width
tSRCCLK
Clock Period
1
Min
4
5.5
4
5.5
9
20
Max
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
tSRCCLKW
DAI_P20-1
(SCLK)
tSRCSFS
tSRCHFS
DAI_P20-1
(FS)
tSRCSD
tSRCHD
DAI_P20-1
(SDATA)
Figure 20. SRC Serial Input Port Timing
Rev. PrA |
Page 31 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
and delay specification with regard to SCLK. Note that SCLK
rising edge is the sampling edge and the falling edge is the drive
edge.
Sample Rate Converter—Serial Output Port
For the serial output port, the frame-sync is an input and it
should meet setup and hold times with regard to SCLK on the
output port. The serial data output, SDATA, has a hold time
Table 26. SRC, Serial Output Port
Parameter
Timing Requirements
FS Setup Before SCLK Rising Edge
tSRCSFS1
tSRCHFS1
FS Hold Before SCLK Rising Edge
Min
4
5.5
Switching Characteristics
tSRCTDD1
Transmit Data Delay After SCLK Falling Edge
1
tSRCTDH
Transmit Data Hold After SCLK Falling Edge
1
Max
ns
ns
7
2
Unit
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
DAI_P20-1
(SCLK)
tSRCCLKW
tSRCSFS
tSRCHFS
DAI_P20-1
(FS)
tSRCTDH
tSRCTDD
DAI_P20-1
(SDATA)
Figure 21. SRC Serial Output Port Timing
Rev. PrA |
Page 32 of 48 | November 2004
Preliminary Technical Data
ADSP-21367
SPDIF Transmitter
Serial data input to the SPDIF transmitter can be formatted as
left justified, I2S or right justified with word widths of 16, 18, 20,
or 24 bits. The following sections provide timing for the
transmitter.
SPDIF Transmitter—Serial Input Waveforms
Figure 22 shows the right-justified mode. LRCLK is HI for the
left channel and LO for the right channel. Data is valid on the
rising edge of SCLK. The MSB is delayed 12-bit clock periods
(in 20-bit output mode) or 16-bit clock periods (in 16-bit output
LRCLK
mode) from an LRCLK transition, so that when there are 64
SCLK periods per LRCLK period, the LSB of the data will be
right-justified to the next LRCLK transition.
RIGHT CHANNEL
LEFT CHANNEL
SCLK
SDATA
MSB
LSB
MSB-1
MSB-2
LSB+2 LSB+1
LSB
MSB
MSB-1 MSB-2
LSB+2
LSB+1
LSB
Figure 22. Right-Justified Mode
Figure 23 shows the default I2S-justified mode. LRCLK is LO
for the left channel and HI for the right channel. Data is valid on
the rising edge of SCLK. The MSB is left-justified to an LRCLK
transition but with a single SCLK period delay.
RIGHT CHANNEL
LRCLK
LEFT CHANNEL
SCLK
SDATA
MSB
MSB-1 MSB-2
LSB+2 LSB+1
MSB
LSB
MSB-1
MSB-2
LSB+2
LSB+1
MSB
LSB
Figure 23. I2S-Justified Mode
Figure 24 shows the left-justified mode. LRCLK is HI for the left
channel and LO for the right channel. Data is valid on the rising
edge of SCLK. The MSB is left-justified to an LRCLK transition
with no MSB delay.
LRCLK
RIGHT CHANNEL
LEFT CHANNEL
SCLK
SDATA
MSB
MSB-1
MSB-2
LSB+2
LSB+1
LSB
MSB
MSB-1
MSB-2
Figure 24. Left-Justified Mode
Rev. PrA |
Page 33 of 48 | November 2004
LSB+2
LSB+1
LSB
MSB
MSB+1
ADSP-21367
Preliminary Technical Data
SPDIF Transmitter Input Data Timing
The timing requirements for the Input port are given in
Table 27. Input Signals (SCLK, FS, SDATA) are routed to the
DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins.
Table 27. SPDIF Transmitter Input Data Timing
Parameter
Timing Requirements
tSIFS1
FS Setup Before SCLK Rising Edge
tSIHFS1
FS Hold After SCLK Rising Edge
tSISD1
SData Setup Before SCLK Rising Edge
tSIHD1
SData Hold After SCLK Rising Edge
Clock Width
tSISCLKW
tSISCLK
Clock Period
1
Min
Max
4
5.5
4
5.5
9
20
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
t SISCLKW
DAI_P20-1
(SCLK)
tSIHFS
tSISFS
DAI_P20-1
(FS)
t SISD
tSIH D
DAI_P20-1
(SDATA)
Figure 25. SPDIF Transmitter Input Timing
Over Sampling Clock (TXCLK) Switching Characteristics
SPDIF Transmitter has an over sampling clock. This TXCLK
input is divided down to generate the Biphase Clock.
Table 28. Over Sampling Clock (TXCLK) Switching Characteristics
Parameter
TXCLK Frequency for TXCLK = 768 × FS
TXCLK Frequency for TXCLK = 512 × FS
TXCLK Frequency for TXCLK = 384 × FS
TXCLK Frequency for TXCLK = 256 × FS
Frame Rate
Min
Rev. PrA |
Page 34 of 48 | November 2004
Max
147.5
98.4
73.8
49.2
192.0
Unit
MHz
MHz
MHz
MHz
MHz
Preliminary Technical Data
ADSP-21367
SPDIF Receiver
The following sections describe timing as it relates to the SPDIF
receiver.
Internal Digital PLL Mode
In internal Digital Phase-locked Loop mode the internal PLL
(Digital PLL) generates the 512 × Fs clock.
Table 29. SPDIF Receiver Internal Digital PLL Mode Timing
Parameter
Switching Characteristics
LRCLK Delay After SCLK
tDFSI
tHOFSI
LRCLK Hold After SCLK
tDDTI
Transmit Data Delay After SCLK
tHDTI
Transmit Data Hold After SCLK
tSCLKIW1
Transmit SCLK Width
tCCLK
Core Clock Period
1
Min
Max
Unit
5
ns
ns
ns
ns
ns
ns
–2
5
–2
40
5
SCLK frequency is 64 x FS where FS = the frequency of LRCLK.
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
DAI_P20-1
(SCLK)
tDFSI
tSFSI
tHOFSI
tHFSI
DAI_P20-1
(FS)
tHDTI
tDDTI
DAI_P20-1
(DATA CHANNEL A/B)
Figure 26. SPDIF Receiver Internal Digital PLL Mode Timing
Rev. PrA |
Page 35 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
External PLL Mode
In External PLL Mode internal Digital PLL is disabled and the
receiver runs on the PLL that is connected to the processor
externally. This external PLL generates the 512 x Fs clock
(MCLK) from the reference clock (LRCLK) and gives it to
SPDIF receiver.
Table 30. SPDIF Receiver External PLL Mode Timing
Parameter
Timing Requirements
tMCP
FMCLK
tBDM
tLDM
tDDP
tDDS
tDDH
Min
MCLK Period
MCLK Frequency (1/tMCP)
SCLK Propagation Delay from MCLK to the Falling Edge
LRCLK Propagation Delay From MCLK
Data Propagation Delay From MCLK
Data Output Setup To SCLK
Data Output Hold From SCLK
Max
10
100
30
30
30
1/2 SCLK Period
1/2 SCLK Period
MCLK INPUT
(NOT TO SCALE)
BCLK OUTPUT
tBDM
LRCLK
OUTPUT
tLDM
tDDS
SDATA OUTPUT
I2S-JUSTIFIED
MSB
MODE
tDDH
tDDP
tDDS
tDDS
SDATA OUTPUT
RIGHT-JUSTIFIED
MODE
MSB
tDDH
tDDP
Figure 27. SPDIF Receiver External PLL Mode Timing
Rev. PrA |
Page 36 of 48 | November 2004
LSB
tDDH
Unit
ns
MHz
ns
ns
ns
ns
ns
Preliminary Technical Data
ADSP-21367
SPI Interface—Master
The ADSP-21367 contains two SPI ports. The primary has dedicated pins and the secondary is available through the DPI. The
timing provided in Table 31 and Table 32 on page 38 applies to
both.
Table 31. SPI Interface Protocol — Master Switching and Timing Specifications
Parameter
Timing Requirements
tSSPIDM
Data Input Valid To SPICLK Edge (Data Input Set-up Time)
tHSPIDM
SPICLK Last Sampling Edge To Data Input Not Valid
Switching Characteristics
tSPICLKM
Serial Clock Cycle
SErial Clock High Period
tSPICHM
tSPICLM
Serial Clock Low Period
tDDSPIDM
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDM
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tSDSCIM
FLAG3–0IN (SPI device select) Low to First SPICLK Edge
tHDSM
Last SPICLK Edge to FLAG3–0IN High
Sequential Transfer Delay
tSPITDM
Min
Max
8
2
ns
ns
8 × tPCLK
4 × tPCLK
4 × tPCLK – 2
ns
ns
ns
0
2
4 × tPCLK – 2
4 × tPCLK – 1
4 × tPCLK – 1
ns
ns
ns
ns
FLAG3-0
(OUTPUT)
t SD SCIM
t SPI CH M
t SPIC LM
t SPIC LM
t SPI CHM
t S P IC LK M
t HDS M
tSPIT DM
SPICLK
(CP = 0)
(OUTPUT)
SPICLK
(CP = 1)
(OUTPUT)
t HDSPIDM
t DDSPI DM
MOSI
(OUTPUT)
MSB
LSB
t SSPID M
CPHASE=1
t SSPI DM
MSB
VALID
LSB
VALID
t DDSPIDM
MOSI
(OUTPUT)
CPHASE=0
MISO
(INPUT)
t HSPIDM
t HSSPIDM
MISO
(INPUT)
t HDSPIDM
MSB
t SSPIDM
LSB
tH SPID M
MSB
VALID
LSB
VALID
Figure 28. SPI Master Timing
Rev. PrA |
Unit
Page 37 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
SPI Interface—Slave
Table 32. SPI Interface Protocol —Slave Switching and Timing Specifications
Parameter
Timing Requirements
tSPICLKS
tSPICHS
tSPICLS
tSDSCO
tHDS
tSSPIDS
tHSPIDS
tSDPPW
Min
Serial Clock Cycle
Serial Clock High Period
Serial Clock Low Period
SPIDS Assertion to First SPICLK Edge
CPHASE = 0
CPHASE = 1
Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0
Data Input Valid to SPICLK edge (Data Input Set-up Time)
SPICLK Last Sampling Edge to Data Input Not Valid
SPIDS Deassertion Pulse Width (CPHASE=0)
Switching Characteristics
tDSOE
SPIDS Assertion to Data Out Active
tDSDHI
SPIDS Deassertion to Data High Impedance
tDDSPIDS
SPICLK Edge to Data Out Valid (Data Out Delay Time)
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tHDSPIDS
tDSOV
SPIDS Assertion to Data Out Valid (CPHASE=0)
Max
4 × tPCLK
2 × tPCLK
2 × tPCLK – 2
ns
ns
ns
ns
2 × tPCLK
2 × tPCLK
2 × tPCLK
2
2
2 × tPCLK
ns
ns
ns
ns
0
0
4
4
9.4
2 × tPCLK
5 × tPCLK
SPIDS
(INPUT)
tS P I C L S
t S P I C HS
tSPICLKS
tHD S
SPICLK
(CP = 0)
(INPUT)
tS P I C L S
t S D S CO
SPICLK
(CP = 1)
(INPUT)
t D SD H I
t D D S PI D S
MISO
(OUTPUT)
t SD P P W
t S P IC HS
t DD S P ID S
tD S O E
t H DL S B S
MSB
LSB
t H S PI D S
t S S P ID S
CPHASE=1
MOSI
(INPUT)
t S S P I DS
LSB
VALID
MSB
VALID
tD S O V
MISO
(OUTPUT)
tHDLSBS
tD D S P ID S
t D S OE
LSB
MSB
CPHASE=0
MOSI
(INPUT)
t HS P I D S
t SS P ID S
LSB
VALID
MSB
VALID
Figure 29. SPI Slave Timing
Rev. PrA |
Page 38 of 48 | November 2004
Unit
t D S DH I
ns
ns
ns
ns
ns
Preliminary Technical Data
ADSP-21367
Universal Asynchronous Receiver-Transmitter
(UART) Port—Receive and Transmit Timing
Figure 30 describes UART port receive and transmit operations.
The maximum baud rate is SCLK/16. As shown in Figure 30
there is some latency between the generation internal UART
interrupts and the external data operations. These latencies are
negligible at the data transmission rates for the UART.
CLKOUT
(SAMPLE CLOCK)
RXD
DATA(5–8)
STOP
RECEIVE
INTERNAL
UART RECEIVE
INTERRUPT
UART RECEIVE BIT SET BY DATA STOP;
CLEARED BY FIFO READ
START
TXD
DATA(5–8)
STOP (1–2)
TRANSMIT
INTERNAL
UART TRANSMIT
INTERRUPT
UART TRANSMIT BIT SET BY PROGRAM;
CLEARED BY WRITE TO TRANSMIT
Figure 30. UART Port—Receive and Transmit Timing
Rev. PrA |
Page 39 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
JTAG Test Access Port and Emulation
Table 33. JTAG Test Access Port and Emulation
Parameter
Timing Requirements
tTCK
TCK Period
tSTAP
TDI, TMS Setup Before TCK High
tHTAP
TDI, TMS Hold After TCK High
tSSYS1
System Inputs Setup Before TCK Low
1
tHSYS
System Inputs Hold After TCK Low
tTRSTW
TRST Pulse Width
Min
tCK
5
6
7
18
4tCK
Switching Characteristics
tDTDO
TDO Delay from TCK Low
2
System Outputs Delay After TCK Low
tDSYS
1
2
Max
ns
ns
ns
ns
ns
ns
7
10
System Inputs = AD15–0, SPIDS, CLKCFG1–0, RESET, BOOTCFG1–0, MISO, MOSI, SPICLK, DAI_Px, FLAG3–0.
System Outputs = MISO, MOSI, SPICLK, DAI_Px, AD15–0, RD, WR, FLAG3–0, CLKOUT, EMU, ALE.
tTCK
TC
K
tSTAP
tHTAP
TM
S
TD
I
tDTDO
TD
O
tSSYS
SYSTEM
IN
PU
TS
tDSYS
SYSTEM
O
U
TPU
TS
Figure 31. IEEE 1149.1 JTAG Test Access Port
Rev. PrA |
Page 40 of 48 | November 2004
Unit
tHSYS
ns
ns
Preliminary Technical Data
ADSP-21367
OUTPUT DRIVE CURRENTS
CAPACITIVE LOADING
Figure 32 shows typical I-V characteristics for the output drivers of the ADSP-21367. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 33). Figure 37 shows graphically
how output delays and holds vary with load capacitance. The
graphs of Figure 35, Figure 36, and Figure 37 may not be linear
outside the ranges shown for Typical Output Delay vs. Load
Capacitance and Typical Output Rise Time (20%-80%, V=Min)
vs. Load Capacitance.
TBD
TBD
Figure 32. ADSP-21367 Typical Drive
TEST CONDITIONS
The ac signal specifications (timing parameters) appear
Table 10 on page 20 through Table 33 on page 40. These include
output disable time, output enable time, and capacitive loading.
The timing specifications for the SHARC apply for the voltage
reference levels in Figure 33.
Figure 35. Typical Output Rise/Fall Time (20%-80%,
VDDEXT = Max)
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 34. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
TBD
50⍀
TO
OUTPUT
PIN
1.5V
30pF
Figure 36. Typical Output Rise/Fall Time (20%-80%,
VDDEXT =Min)
Figure 33. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
TBD
INPUT
1.5V
OR
OUTPUT
1.5V
Figure 37. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
Figure 34. Voltage Reference Levels for AC Measurements
THERMAL CHARACTERISTICS
commercial temperature range, TAMB = –40°C to 85°C.
The ADSP-21367 processor is rated for performance over the
Rev. PrA |
Page 41 of 48 | November 2004
ADSP-21367
Preliminary Technical Data
Table 34 through Table 36 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-toboard measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA). The junction-to-case measurement complies with MILSTD-883. All measurements use a 2S2P JEDEC test board.
To determine the Junction Temperature of the device while on
the application PCB, use:
Table 35. Thermal Characteristics for 256 Ball SBGA (Thermal vias in PCB)
Parameter
ΨJT
ΨJMT
ΨJMT
where:
TJ = Junction temperature °C
TCASE = Case temperature (°C) measured at the top center of
the package
ΨJT = Junction-to-Top (of package) characterization parameter
is the Typical value from Table 34 and Table 36.
PD = Power dissipation (see EE Note #TBD)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approximation of TJ by the equation:
T J = T A + ( θ JA × P D )
where:
TA = Ambient Temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics values provided in Table 34 through Table 36 are modeled values.
Table 34. Thermal Characteristics for 256 Ball SBGA (No
thermal vias in PCB)
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 35. Thermal Characteristics for 256 Ball SBGA (Thermal vias in PCB)
Parameter
θJA
θJMA
θJMA
θJC
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
TBD
TBD
TBD
Unit
°C/W
°C/W
°C/W
Table 36. Thermal Characteristics for 208-Lead MQFP
T J = T CASE + ( Ψ JT × P D )
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
TBD
TBD
TBD
TBD
Unit
°C/W
°C/W
°C/W
°C/W
Rev. PrA |
Page 42 of 48 | November 2004
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Preliminary Technical Data
ADSP-21367
256-BALL SBGA PINOUT
Table 37. 256-Ball SBGA Pin Assignment (Numerically by Ball Number)
Ball No.
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
E01
E02
E03
E04
E17
E18
E19
E20
J01
J02
J03
J04
Signal
NC
TDI
TMS
CLK_CFG0
CLK_CFG1
EMU
DAI4
DAI1
DPI14
DPI12
DPI10
DPI9
DPI7
DPI6
DPI3
DPI2
CLKOUT
DATA31
NC
NC
DAI11
DAI8
VDD
VDD
GND
GND
DATA25
DATA23
DAI19
DAI18
GND
GND
Ball No.
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
F01
F02
F03
F04
F17
F18
F19
F20
K01
K02
K03
K04
Signal
DAI5
SDCLK1
TRST
TCK
BOOTCFG_0
BOOTCFG_1
TDO
DAI3
DAI2
DPI13
DPI11
DPI8
DPI5
DPI4
DPI1
RESET
DATA30
DATA29
DATA28
NC
DAI14
DAI12
GND
GND
IOVDD
GND
ID2
DATA21
FLAG0
DAI20
GND
IOVDD
Rev. PrA |
Ball No.
C01
C02
C03
C04
C05
C06
C07
C08
C09
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
G01
G02
G03
G04
G17
G18
G19
G20
L01
L02
L03
L04
Signal
DAI9
DAI7
GND
IOVDD
GND
GND
VDD
GND
GND
VDD
GND
GND
VDD
GND
GND
VDD
VDD
VDD
DATA27
RPBA
DAI15
DAI13
GND
IOVDD
VDD
VDD
DATA22
DATA20
FLAG2
FLAG1
VDD
VDD
Page 43 of 48 | November 2004
Ball No.
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
H01
H02
H03
H04
H17
H18
H19
H20
M01
M02
M03
M04
Signal
DAI10
DAI6
GND
IOVDD
GND
IOVDD
VDD
GND
IOVDD
VDD
GND
IOVDD
VDD
GND
IOVDD
GND
IOVDD
GND
DATA26
DATA24
DAI17
DAI16
VDD
VDD
IOVDD
GND
DATA19
DATA18
ACK
FLAG3
GND
GND
ADSP-21367
Preliminary Technical Data
Table 37. 256-Ball SBGA Pin Assignment (Numerically by Ball Number) (Continued)
Ball No.
J17
J18
J19
J20
N01
N02
N03
N04
N17
N18
N19
N20
U01
U02
U03
U04
U05
U06
U07
U08
U09
U10
U11
U12
U13
U14
U15
U16
U17
U18
U19
U20
Signal
GND
GND
ID1
DATA17
RD
SDCLK0
GND
IOVDD
GND
GND
DATA11
DATA10
MS0
MS1
VDD
GND
IOVDD
GND
IOVDD
VDD
IOVDD
GND
IOVDD
VDD
IOVDD
IOVDD
VDD
IOVDD
VDD
VDD
DATA0
DATA2
Ball No.
K17
K18
K19
K20
P01
P02
P03
P04
P17
P18
P19
P20
V01
V02
V03
V04
V05
V06
V07
V08
V09
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
Signal
VDD
VDD
ID0
DATA16
SDA10
WR
VDD
VDD
VDD
VDD
DATA8
DATA9
ADDR22
ADDR23
VDD
GND
GND
GND
GND
VDD
GND
GND
GND
VDD
GND
IOVDD
VDD
GND
GND
GND
DATA1
DATA3
Rev. PrA |
Ball No.
L17
L18
L19
L20
R01
R02
R03
R04
R17
R18
R19
R20
W01
W02
W03
W04
W05
W06
W07
W08
W09
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
Signal
VDD
VDD
DATA15
DATA14
SDWE
SDRAS
GND
GND
IOVDD
GND
DATA6
DATA7
GND
ADDR21
ADDR19
ADDR20
ADDR17
ADDR16
ADDR15
ADDR14
AVDD
AVSS
ADDR13
ADDR12
ADDR10
ADDR8
ADDR5
ADDR4
ADDR1
ADDR2
ADDR0
NC
Page 44 of 48 | November 2004
Ball No.
M17
M18
M19
M20
T01
T02
T03
T04
T17
T18
T19
T20
Y01
Y02
Y03
Y04
Y05
Y06
Y07
Y08
Y09
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Signal
IOVDD
GND
DATA12
DATA13
SDCKE
SDCAS
GND
IOVDD
GND
GND
DATA5
DATA4
GND
NC
NC
ADDR18
BR1
BR2
XTAL2
CLKIN
NC
NC
BR3
BR4
ADDR11
ADDR9
ADDR7
ADDR6
ADDR3
GND
GND
NC
Preliminary Technical Data
ADSP-21367
208-LEAD MQFP PINOUT
Table 38. 208-Lead MQFP Pin Assignment (Numerically by Lead Number)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Signal
VDD
DATA28
DATA27
GND
IOVDD
DATA26
DATA25
DATA24
DATA23
GND
VDD
DATA22
DATA21
DATA20
IOVDD
GND
DATA19
DATA18
VDD
GND
DATA17
VDD
GND
VDD
GND
DATA16
DATA15
DATA14
DATA13
DATA12
IOVDD
GND
VDD
GND
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
IOVDD
GND
VDD
DATA4
Pin No.
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
Signal
VDD
GND
IOVDD
ADDR0
ADDR2
ADDR1
ADDR4
ADDR3
ADDR5
GND
VDD
GND
IOVDD
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
GND
VDD
GND
IOVDD
ADDR11
ADDR12
ADDR13
GND
VDD
AVSS
AVDD
GND
CLKIN
XTAL2
IOVDD
GND
VDD
ADDR14
GND
IOVDD
ADDR15
ADDR16
ADDR17
ADDR18
GND
IOVDD
Rev. PrA |
Pin No.
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
Signal
VDD
GND
IOVDD
SDCAS
SDRAS
SDCKE
SDWE
WR
SDA10
GND
IOVDD
SDCLK0
GND
VDD
RD
ACK
FLAG3
FLAG2
FLAG1
FLAG0
DAI20
GND
VDD
GND
IOVDD
DAI19
DAI18
DAI17
DAI16
DAI15
DAI14
DAI13
DAI12
VDD
IOVDD
GND
VDD
GND
DAI11
DAI10
DAI8
DAI9
DAI6
DAI7
Page 45 of 48 | November 2004
Pin No.
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
Signal
VDD
VDD
GND
VDD
VDD
VDD
TDI
TRST
TCK
GND
VDD
TMS
CLK_CFG0
BOOTCFG0
CLK_CFG1
EMU
BOOTCFG1
TDO
DAI4
DAI2
DAI3
DAI1
IOVDD
GND
VDD
GND
DPI14
DPI13
DPI12
DPI11
DPI10
DPI9
DPI8
DPI7
IOVDD
GND
VDD
GND
DPI6
DPI5
DPI4
DPI3
DPI1
DPI2
ADSP-21367
Preliminary Technical Data
Table 38. 208-Lead MQFP Pin Assignment (Numerically by Lead Number) (Continued)
Pin No.
45
46
47
48
49
50
51
52
Signal
DATA5
DATA2
DATA3
DATA0
DATA1
IOVDD
GND
VDD
Pin No.
97
98
99
100
101
102
103
104
Signal
ADDR19
ADDR20
ADDR21
ADDR23
ADDR22
MS1
MS0
VDD
Pin No.
149
150
151
152
153
154
155
156
Signal
DAI5
IOVDD
GND
VDD
GND
VDD
GND
VDD
Pin No.
201
202
203
204
205
206
207
208
Signal
CLKOUT
RESET
IOVDD
GND
DATA30
DATA31
DATA29
VDD
PACKAGE DIMENSIONS
The ADSP-21367 is available in a 208-lead-free MQFP package
and 256-ball lead-free and leaded SBGA packages
A1 CORNER
INDEX AREA
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A1 BALL
INDICATOR
BOTTOM
VIEW
TOP VIEW
27.00
BSC SQ
24.13
REF SQ
1.27
NOM
1.00
0.80
0.60
0.70
0.60
0.50
1.70 MAX
0.10
MIN
0.20
COPLANARITY
SEATING
PLANE
DIMENSIONS ARE IN MILLIMETERS AND COMPLY
WITH JEDEC STANDARDS MO-192-BAL-2.
0.90
BALL
0.75
DIAMETER
0.60
Figure 38. 256-Lead SBGA, Thermally Enhanced (BP-256)
Rev. PrA |
Page 46 of 48 | November 2004
0.25 MIN 4X
Preliminary Technical Data
ADSP-21367
0.75
0.60
0.45
30.85
30.60 SQ
30.35
4.10
MAX
208
1
SEATING
PLANE
157
156
PIN 1 INDICATOR
28.20
28.00 SQ
27.80
TOP VIEW
(PINS DOWN)
3.60
3.40
3.20
VIEW A
0.50
0.25
105
104
52
0.20
0.09
53
0.50
BSC
0.08 MAX
(LEAD COPLANARITY)
(LEAD PITCH)
0.27
0.17
(LEAD WIDTH)
VIEW A
ROTATED 90° CCW
NOTES:
1. THE ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 FROM ITS IDEAL
POSITION WHEN MEASURED IN THE LATERAL DIRECTION.
2. CENTER DIMENSIONS ARE TYPICAL UNLESS OTHERWISE NOTED.
3. DIMENSIONS ARE IN MILLIMETERS AND COMPLY WITH
JEDEC STANDARD MS-029, FA-1.
Figure 39. 208-Lead MQFP (S-208-2)
ORDERING GUIDE
Analog Devices offers a wide variety of audio algorithms and
combinations to run on the ADSP-21367 processor. These
products are sold as part of a chip set, bundled with necessary
application software under special part numbers. For a complete
list, visit our web site at www.analog.com/SHARC.
Part Number1, 2
1
2
These product also may contain 3rd party IPs that may require
users to have authorization from the respective IP holders to
receive them. Royalty for use of the 3rd party IPs may also be
payable by users.
On-Chip
SRAM
2M bit
ROM
Operating Voltage Packages
ADSP-21367SKSZ-ENG
Ambient Temperature Instruction
Range
Rate
0°C to + 70°C
266 MHz
6M bit
1.2 INT/3.3 EXT V
ADSP-21367SKBP-ENG
0°C to +70°C
400 MHz
2M bit
6M bit
1.3 INT/3.3 EXT V
ADSP-21367SKBPZENG
0°C to +70°C
400 MHz
2M bit
6M bit
1.3 INT/3.3 EXT V
B indicates Ball Grid Array package.
Z indicates Lead Free package. For more information about lead free package offerings, please visit www.analog.com.
Rev. PrA |
Page 47 of 48 | November 2004
208-Lead MQFP,
Pb-Free
256-Ball SBGA, PbBearing
256-Ball SBGA, PbFree
ADSP-21367
Preliminary Technical Data
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR05267-0-11/04(PrA)
Rev. PrA |
Page 48 of 48 | November 2004