CY7C1329H 2-Mbit (64 K × 32) Pipelined Sync SRAM 2-Mbit (64 K × 32) Pipelined Sync SRAM Features for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depth-expansion Chip Enables (CE2 and CE3), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BW[A:D] and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and the ZZ pin. ■ Registered inputs and outputs for pipelined operation ■ 64 K × 32 common I/O architecture ■ 3.3 V core power supply ■ 2.5 V/3.3 V I/O operation ■ Fast clock-to-output times ❐ 4.0 ns (for 133-MHz device) ■ Provide high-performance 3-1-1-1 access rate ■ User-selectable burst counter supporting Intel Pentium® interleaved or linear burst sequences ■ Separate processor and controller address strobes ■ Synchronous self-timed write ■ Asynchronous output enable ■ Offered in JEDEC-standard lead-free 100-pin TQFP package ■ “ZZ” Sleep Mode Option Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV). Address, data inputs, and write controls are registered on-chip to initiate a self-timed Write cycle. This part supports Byte Write operations (see Pin Definitions on page 4 and Truth Table on page 7 for further details). Write cycles can be one to four bytes wide as controlled by the Byte Write control inputs. GW when active LOW causes all bytes to be written. The CY7C1329H operates from a +3.3 V core power supply while all outputs operate with either a +2.5 V or +3.3 V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible. For a complete list of related documentation, click here. Functional Description The CY7C1329H SRAM integrates 64 K × 32 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter Logic Block Diagram A0, A1, A ADDRESS REGISTER 2 A[1:0] MODE ADV CLK Q1 BURST COUNTER CLR AND Q0 LOGIC ADSC ADSP BWD DQD BYTE WRITE REGISTER DQD BYTE WRITE DRIVER BWC DQC BYTE WRITE REGISTER DQC BYTE WRITE DRIVER DQB BYTE WRITE REGISTER DQB BYTE WRITE DRIVER BWB BWA BWE GW CE1 CE2 CE3 OE ZZ MEMORY ARRAY SENSE AMPS OUTPUT REGISTERS OUTPUT BUFFERS E DQs DQA BYTE WRITE DRIVER DQA BYTE WRITE REGISTER ENABLE REGISTER INPUT REGISTERS PIPELINED ENABLE SLEEP CONTROL Cypress Semiconductor Corporation Document Number: 38-05673 Rev. *H • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised November 20, 2014 CY7C1329H Contents Selection Guide ................................................................ 3 Pin Configurations ........................................................... 3 Pin Definitions .................................................................. 4 Functional Overview ........................................................ 5 Single Read Accesses ................................................ 5 Single Write Accesses Initiated by ADSP ................... 5 Single Write Accesses Initiated by ADSC ................... 5 Burst Sequences ......................................................... 5 Sleep Mode ................................................................. 5 Interleaved Burst Address Table ................................. 6 Linear Burst Address Table ......................................... 6 ZZ Mode Electrical Characteristics .............................. 6 Truth Table ........................................................................ 7 Truth Table for Read/Write .............................................. 8 Maximum Ratings ............................................................. 9 Operating Range ............................................................... 9 Electrical Characteristics ................................................. 9 Capacitance .................................................................... 10 Document Number: 38-05673 Rev. *H Thermal Resistance ........................................................ 10 AC Test Loads and Waveforms ..................................... 10 Switching Characteristics .............................................. 11 Switching Waveforms .................................................... 12 Ordering Information ...................................................... 16 Ordering Code Definitions ......................................... 16 Package Diagram ............................................................ 17 Acronyms ........................................................................ 18 Document Conventions ................................................. 18 Units of Measure ....................................................... 18 Document History Page ................................................. 19 Sales, Solutions, and Legal Information ...................... 20 Worldwide Sales and Design Support ....................... 20 Products .................................................................... 20 PSoC® Solutions ...................................................... 20 Cypress Developer Community ................................. 20 Technical Support ..................................................... 20 Page 2 of 20 CY7C1329H Selection Guide 133 MHz Unit Maximum Access Time Description 4.0 ns Maximum Operating Current 225 mA Maximum CMOS Standby Current 40 mA Pin Configurations BYTE C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 CY7C1329H 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 NC DQB DQB VDDQ VSSQ DQB DQB DQB DQB VSSQ VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSSQ DQA DQA DQA DQA VSSQ VDDQ DQA DQA NC BYTE B BYTE A MODE A A A A A1 A0 NC/72M NC/36M VSS VDD NC/18M NC/9M A A A A A A NC/4M 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 BYTE D NC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE1 CE2 BWD BWC BWB BWA CE3 VDD VSS CLK GW BWE OE ADSC ADSP ADV A A Figure 1. 100-pin TQFP (14 × 20 × 1.4 mm) pinout Document Number: 38-05673 Rev. *H Page 3 of 20 CY7C1329H Pin Definitions Name A0, A1, A I/O Description InputAddress Inputs used to select one of the 64K address locations. Sampled at the rising edge of the Synchronous CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A1:A0 feed the 2-bit counter. InputByte Write Select Inputs, active LOW. Qualified with BWE to conduct Byte Writes to the SRAM. BWA, BWB, BWC, BWD Synchronous Sampled on the rising edge of CLK. GW InputGlobal Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global Write Synchronous is conducted (All bytes are written, regardless of the values on BW[A:D] and BWE). BWE InputByte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted Synchronous LOW to conduct a Byte Write. CLK InputClock Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst counter when ADV is asserted LOW, during a burst operation. CE1 InputChip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2 Synchronous and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a new external address is loaded. CE2 InputChip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1 Synchronous and CE3 to select/deselect the device. CE2 is sampled only when a new external address is loaded. CE3 InputChip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1 Synchronous and CE2 to select/deselect the device. CE3 is sampled only when a new external address is loaded. OE InputOutput Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW, Asynchronous the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE is masked during the first clock of a Read cycle when emerging from a deselected state. ADV InputAdvance Input signal, sampled on the rising edge of CLK, active LOW. When asserted, it Synchronous automatically increments the address in a burst cycle. ADSP InputAddress Strobe from Processor, sampled on the rising edge of CLK, active LOW. When asserted Synchronous LOW, A is captured in the address registers. A1:A0 are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is deasserted HIGH. ADSC InputAddress Strobe from Controller, sampled on the rising edge of CLK, active LOW. When asserted Synchronous LOW, A is captured in the address registers. A1:A0 are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ZZ InputZZ “sleep” Input, active HIGH. This input, when HIGH places the device in a non-time-critical “sleep” Asynchronous condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ pin has an internal pull-down. DQA, DQB DQC, DQD I/OBidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the Synchronous rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by “A” during the previous clock rise of the Read cycle. The direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ are placed in a tri-state condition. VDD Power Supply Power supply inputs to the core of the device. Ground Ground for the core of the device. VDDQ I/O Power Supply Power supply for the I/O circuitry. VSSQ I/O Ground Ground for the I/O circuitry. VSS MODE NC InputStatic Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or left floating selects interleaved burst sequence. This is a strap pin and should remain static during device operation. Mode Pin has an internal pull-up. – No Connects. Not internally connected to the die. 4M, 9M, 18M, 72M, 144M, 288M, 576M and 1G are address expansion pins and are not internally connected to the die. Document Number: 38-05673 Rev. *H Page 4 of 20 CY7C1329H Functional Overview All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The CY7C1329H supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium and i486 processors. The linear burst sequence is suited for processors that utilize a linear burst sequence. The burst order is user selectable, and is determined by sampling the MODE input. Accesses can be initiated with either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC). Address advancement through the burst sequence is controlled by the ADV input. A two-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access. Byte Write operations are qualified with the Byte Write Enable (BWE) and Byte Write Select (BW[A:D]) inputs. A Global Write Enable (GW) overrides all Byte Write inputs and writes data to all four bytes. All Writes are simplified with on-chip synchronous self-timed Write circuitry. Three synchronous Chip Selects (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. ADSP is ignored if CE1 is HIGH. Single Read Accesses This access is initiated when the following conditions are satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2) CE1, CE2, CE3 are all asserted active, and (3) the Write signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1 is HIGH. The address presented to the address inputs (A) is stored into the address advancement logic and the address register while being presented to the memory array. The corresponding data is allowed to propagate to the input of the output registers. At the rising edge of the next clock the data is allowed to propagate through the output register and onto the data bus within tCO if OE is active LOW. The only exception occurs when the SRAM is emerging from a deselected state to a selected state, its outputs are always tri-stated during the first cycle of the access. After the first cycle of the access, the outputs are controlled by the OE signal. Consecutive single Read cycles are supported. Once the SRAM is deselected at clock rise by the chip select and either ADSP or ADSC signals, its output will tri-state immediately. Single Write Accesses Initiated by ADSP This access is initiated when both of the following conditions are satisfied at clock rise: (1) ADSP is asserted LOW, and (2) CE1, CE2, CE3 are all asserted active. The address presented to A is loaded into the address register and the address advancement logic while being delivered to the RAM array. The Write signals (GW, BWE, and BW[A:D]) and ADV inputs are ignored during this first cycle. ADSP-triggered Write accesses require two clock cycles to complete. If GW is asserted LOW on the second clock rise, the data presented to the DQ inputs is written into the corresponding address location in the memory array. If GW is HIGH, then the Document Number: 38-05673 Rev. *H Write operation is controlled by BWE and BW[A:D] signals. The CY7C1329H provides Byte Write capability that is described in the Write Cycle Descriptions table. Asserting the Byte Write Enable input (BWE) with the selected Byte Write (BW[A:D]) input, will selectively write to only the desired bytes. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Because the CY7C1329H is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQ inputs. Doing so will tri-state the output drivers. As a safety precaution, DQs are automatically tri-stated whenever a Write cycle is detected, regardless of the state of OE. Single Write Accesses Initiated by ADSC ADSC Write accesses are initiated when the following conditions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deasserted HIGH, (3) CE1, CE2, CE3 are all asserted active, and (4) the appropriate combination of the Write inputs (GW, BWE, and BW[A:D]) are asserted active to conduct a Write to the desired byte(s). ADSC-triggered Write accesses require a single clock cycle to complete. The address presented to A is loaded into the address register and the address advancement logic while being delivered to the memory array. The ADV input is ignored during this cycle. If a global Write is conducted, the data presented to DQ is written into the corresponding address location in the memory core. If a Byte Write is conducted, only the selected bytes are written. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Because the CY7C1329H is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQ inputs. Doing so will tri-state the output drivers. As a safety precaution, DQs are automatically tri-stated whenever a Write cycle is detected, regardless of the state of OE. Burst Sequences The CY7C1329H provides a two-bit wraparound counter, fed by A1:A0, that implements either an interleaved or linear burst sequence. The interleaved burst sequence is designed specifically to support Intel Pentium applications. The linear burst sequence is designed to support processors that follow a linear burst sequence. The burst sequence is user selectable through the MODE input.Asserting ADV LOW at clock rise will automatically increment the burst counter to the next address in the burst sequence. Both Read and Write burst operations are supported. Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, CE3, ADSP, and ADSC must remain inactive for the duration of tZZREC after the ZZ input returns LOW. Page 5 of 20 CY7C1329H Interleaved Burst Address Table Linear Burst Address Table (MODE = Floating or VDD) (MODE = GND) First Address A1:A0 Second Address A1:A0 Third Address A1:A0 Fourth Address A1:A0 First Address A1:A0 Second Address A1:A0 Third Address A1:A0 Fourth Address A1:A0 00 01 10 11 00 01 10 11 01 00 11 10 01 10 11 00 10 11 00 01 10 11 00 01 11 10 01 00 11 00 01 10 ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max Unit IDDZZ Sleep mode standby current ZZ > VDD– 0.2 V – 40 mA tZZS Device operation to ZZ ZZ > VDD – 0.2 V – 2tCYC ns tZZREC ZZ recovery time ZZ < 0.2 V 2tCYC – ns tZZI ZZ Active to sleep current This parameter is sampled – 2tCYC ns tRZZI ZZ Inactive to exit sleep current This parameter is sampled 0 – ns Document Number: 38-05673 Rev. *H Page 6 of 20 CY7C1329H Truth Table The Truth Table for part CY7C1329H is as follows. [1, 2, 3, 4, 5, 6] Next Cycle Add. Used CE1 CE2 CE3 ZZ ADSP ADSC ADV WRITE OE CLK DQ Deselect cycle, power-down None H X X L X L X X X L–H Tristate Deselect cycle, power-down None L L X L L X X X X L–H Tristate Deselect cycle, power-down None L X H L L X X X X L–H Tristate Deselect cycle, power-down None L L X L H L X X X L–H Tristate Deselect cycle, power-down None L X H L H L X X X L–H Tristate Snooze mode, power-down None X X X H X X X X X Read Cycle, Begin Burst External L H L L L X X X L L–H Q Read Cycle, Begin Burst External L H L L L X X X H L–H Tristate Write Cycle, Begin Burst External L H L L H L X L X L–H D Read Cycle, Begin Burst External L H L L H L X H L L–H Q Read Cycle, Begin Burst External L H L L H L X H H L–H Tristate Read Cycle, Continue Burst Next X X X L H H L H H L–H Tristate Read Cycle, Continue Burst Next X X X L H H L H L L–H Q Read Cycle, Continue Burst Next H X X L X H L H L L–H Q Read Cycle, Continue Burst Next H X X L X H L H H L–H Tristate Write cycle, continue burst Next X X X L H H L L X L–H D Write cycle, continue burst Next H X X L X H L L X L–H D Read cycle, suspend burst Current X X X L H H H H L L–H Q Read cycle, suspend burst Current X X X L H H H H H L–H Tristate Read cycle, suspend burst Current H X X L X H H H L L–H Q Read cycle, suspend burst Current H X X L X H H H H L–H Tristate Write cycle, suspend burst Current X X X L H H H L X L–H D Write cycle, suspend burst Current H X X L X H H L X L–H D X Tristate Notes 1. X = “Don't Care.” H = Logic HIGH, L = Logic LOW. 2. WRITE = L when any one or more Byte Write Enable signals (BWA, BWB, BWC, BWD) and BWE = L or GW = L. WRITE = H when all Byte Write Enable signals (BWA, BWB, BWC, BWD), BWE, GW = H. 3. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock. 4. CE1, CE2, and CE3 are available only in the TQFP package. 5. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BW[A:D]. Writes may occur only on subsequent clocks after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the Write cycle to allow the outputs to Tri-State. OE is a don't care for the remainder of the Write cycle. 6. OE is asynchronous and is not sampled with the clock rise. It is masked internally during Write cycles. During a Read cycle all data bits are Tri-State when OE is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW). Document Number: 38-05673 Rev. *H Page 7 of 20 CY7C1329H Truth Table for Read/Write The Truth Table for read or write for part CY7C1329H is as follows. [7, 8] GW BWE BWD BWC BWB BWA Read Function H H X X X X Read H L H H H H Write Byte A – DQA H L H H H L Write Byte B – DQB H L H H L H Write Bytes B, A H L H H L L Write Byte C – DQC H L H L H H Write Bytes C, A H L H L H L Write Bytes C, B H L H L L H Write Bytes C, B, A H L H L L L Write Byte D – DQD H L L H H H Write Bytes D, A H L L H H L Write Bytes D, B H L L H L H Write Bytes D, B, A H L L H L L Write Bytes D, C H L L L H H Write Bytes D, C, A H L L L H L Write Bytes D, C, B H L L L L H Write All Bytes H L L L L L Write All Bytes L X X X X X Notes 7. X = “Don't Care.” H = Logic HIGH, L = Logic LOW. 8. WRITE = L when any one or more Byte Write Enable signals (BWA, BWB, BWC, BWD) and BWE = L or GW = L. WRITE = H when all Byte Write Enable signals (BWA, BWB, BWC, BWD), BWE, GW = H. Document Number: 38-05673 Rev. *H Page 8 of 20 CY7C1329H Maximum Ratings DC Input Voltage ................................ –0.5 V to VDD + 0.5 V Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Storage Temperature ............................... –65 C to +150C Ambient Temperature with Power Applied ......................................... –55 C to +125 C Supply Voltage on VDD Relative to GND .....–0.5 V to +4.6 V Current into Outputs (LOW) ........................................ 20 mA Static Discharge Voltage (per MIL-STD-883, Method 3015) ......................... > 2001 V Latch-up Current ................................................... > 200 mA Operating Range Supply Voltage on VDDQ Relative to GND .... –0.5 V to +VDD Range DC Voltage Applied to Outputs in Tri-State ........................................–0.5 V to VDDQ + 0.5 V Commercial Ambient Temperature 0 °C to +70 °C VDD VDDQ 3.3 V– 5% / 2.5 V – 5% to + 10% VDD Electrical Characteristics Over the Operating Range Parameter [9, 10] Description VDD Power Supply Voltage VDDQ I/O Supply Voltage VOH Output HIGH Voltage VOL Output LOW Voltage VIH Input HIGH Voltage [9] Test Conditions Min Max Unit 3.135 3.6 V for 3.3 V I/O 3.135 VDD V for 2.5 V I/O 2.375 2.625 V for 3.3 V I/O, IOH = –4.0 mA 2.4 – V for 2.5 V I/O, IOH = –1.0 mA 2.0 – V – 0.4 V for 3.3 V I/O, IOL = 8.0 mA for 2.5 V I/O, IOL = 1.0 mA [9] – 0.4 V for 3.3 V I/O 2.0 VDD + 0.3 V V for 2.5 V I/O 1.7 VDD + 0.3 V V for 3.3 V I/O –0.3 0.8 V for 2.5 V I/O VIL Input LOW Voltage –0.3 0.7 V IX Input Leakage Current except ZZ GND VI VDDQ and MODE –5 5 A Input Current of MODE Input = VSS –30 – A Input = VDD – 5 A Input = VSS –5 – A Input = VDD – 30 A Input Current of ZZ IOZ Output Leakage Current GND VI VDDQ, Output Disabled –5 5 A IDD VDD Operating Supply Current VDD = Max, IOUT = 0 mA, f = fMAX = 1/tCYC 7.5-ns cycle, 133 MHz – 225 mA ISB1 Automatic CS Power-down Current – TTL Inputs VDD = Max, Device Deselected, 7.5-ns cycle, VIN VIH or VIN VIL, 133 MHz f = fMAX = 1/tCYC – 90 mA ISB2 Automatic CS Power-down Current – CMOS Inputs VDD = Max, Device Deselected, 7.5-ns cycle, VIN 0.3 V or VIN > VDDQ – 0.3 V, 133 MHz f=0 – 40 mA Notes 9. Overshoot: VIH(AC) < VDD + 1.5 V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2 V (Pulse width less than tCYC/2). 10. TPower-up: Assumes a linear ramp from 0 V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD. Document Number: 38-05673 Rev. *H Page 9 of 20 CY7C1329H Electrical Characteristics (continued) Over the Operating Range Parameter [9, 10] Description Test Conditions Min Max Unit ISB3 Automatic CS Power-down Current – CMOS Inputs VDD = Max, Device Deselected, 7.5-ns cycle, VIN 0.3 V or VIN > VDDQ – 0.3 V, 133 MHz f = fMAX = 1/tCYC – 75 mA ISB4 Automatic CS Power-down Current – TTL Inputs VDD = Max, Device Deselected, 7.5-ns cycle, VIN VIH or VIN VIL, f = 0 133 MHz – 45 mA Capacitance Parameter [11] Description Test Conditions 100-pin TQFP Max Unit TA = 25 C, f = 1 MHz, VDD = 3.3 V, VDDQ = 2.5 V CIN Input capacitance 5 pF CCLK Clock input capacitance 5 pF CI/O Input/Output capacitance 5 pF Test Conditions 100-pin TQFP Package Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51 30.32 C/W 6.85 C/W Thermal Resistance Parameter [11] Description JA Thermal resistance (junction to ambient) JC Thermal resistance (junction to case) AC Test Loads and Waveforms Figure 2. AC Test Loads and Waveforms 3.3 V I/O Test Load R = 317 3.3 V OUTPUT OUTPUT RL = 50 Z0 = 50 VT = 1.5 V (a) INCLUDING JIG AND SCOPE OUTPUT RL = 50 VT = 1.25 V (a) R = 351 10% (c) ALL INPUT PULSES VDDQ INCLUDING JIG AND SCOPE 1 ns (b) GND 5 pF 90% 10% 90% 1 ns R = 1667 2.5 V Z0 = 50 GND 5 pF 2.5 V I/O Test Load OUTPUT ALL INPUT PULSES VDDQ R =1538 (b) 10% 90% 10% 90% 1 ns 1 ns (c) Note 11. Tested initially and after any design or process change that may affect these parameters. Document Number: 38-05673 Rev. *H Page 10 of 20 CY7C1329H Switching Characteristics Over the Operating Range Parameter [12, 13] tPOWER Description VDD(typical) to the First Access [14] 133 MHz Unit Min Max 1 – ms Clock tCYC Clock Cycle Time 7.5 – ns tCH Clock HIGH 3.0 – ns tCL Clock LOW 3.0 – ns Output Times tCO Data Output Valid after CLK Rise – 4.0 ns tDOH Data Output Hold after CLK Rise 1.5 – ns Clock to Low Z [15, 16, 17] 0 – ns tCHZ Clock to High Z [15, 16, 17] – 4.0 ns tOEV OE LOW to Output Valid – 4.5 ns tOELZ OE LOW to Output Low Z [15, 16, 17] 0 – ns – 4.0 ns tCLZ tOEHZ OE HIGH to Output High Z [15, 16, 17] Set-up Times tAS Address Set-up before CLK Rise 1.5 – ns tADS ADSC, ADSP Set-up before CLK Rise 1.5 – ns tADVS ADV Set-up before CLK Rise 1.5 – ns tWES GW, BWE, BW[A:D] Set-up before CLK Rise 1.5 – ns tDS Data Input Set-up before CLK Rise 1.5 – ns tCES Chip Enable Set-Up before CLK Rise 1.5 – ns tAH Address Hold after CLK Rise 0.5 – ns tADH ADSP, ADSC Hold after CLK Rise 0.5 – ns tADVH ADV Hold after CLK Rise 0.5 – ns tWEH GW, BWE, BW[A:D] Hold after CLK Rise 0.5 – ns tDH Data Input Hold after CLK Rise 0.5 – ns tCEH Chip Enable Hold after CLK Rise 0.5 – ns Hold Times Notes 12. Timing reference level is 1.5 V when VDDQ = 3.3 V and is 1.25 V when VDDQ = 2.5 V. 13. Test conditions shown in (a) ofFigure 2 on page 10 unless otherwise noted. 14. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a Read or Write operation can be initiated. 15. tCHZ, tCLZ, tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of Figure 2 on page 10. Transition is measured ± 200 mV from steady-state voltage. 16. At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High Z prior to Low Z under the same system conditions. 17. This parameter is sampled and not 100% tested. Document Number: 38-05673 Rev. *H Page 11 of 20 CY7C1329H Switching Waveforms Figure 3. Read Cycle Timing [18] t CYC CLK t CH t ADS t CL t ADH ADSP tADS tADH ADSC tAS tAH A1 ADDRESS A2 tWES A3 Burst continued with new base address tWEH GW, BWE, BW[A:D] tCES Deselect cycle tCEH CE tADVS tADVH ADV ADV suspends burst. OE t OEHZ t CLZ Data Out (Q) High-Z Q(A1) tOEV tCO t OELZ tDOH Q(A2) t CHZ Q(A2 + 1) Q(A2 + 2) Q(A2 + 3) Q(A2) Q(A2 + 1) t CO Burst wraps around to its initial state Single READ BURST READ DON’T CARE UNDEFINED Note 18. On this diagram, when CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH, CE1 is HIGH or CE2 is LOW or CE3 is HIGH. Document Number: 38-05673 Rev. *H Page 12 of 20 CY7C1329H Switching Waveforms (continued) Figure 4. Write Cycle Timing [19, 20] t CYC CLK tCH tADS tCL tADH ADSP tADS ADSC extends burst tADH tADS tADH ADSC tAS tAH A1 ADDRESS A2 A3 Byte write signals are ignored for first cycle when ADSP initiates burst tWES tWEH BWE, BW[A :D] tWES tWEH GW tCES tCEH CE t t ADVS ADVH ADV ADV suspends burst OE tDS Data In (D) High-Z t OEHZ tDH D(A1) D(A2) D(A2 + 1) D(A2 + 1) D(A2 + 2) D(A2 + 3) D(A3) D(A3 + 1) D(A3 + 2) Data Out (Q) BURST READ Single WRITE BURST WRITE DON’T CARE Extended BURST WRITE UNDEFINED Notes 19. On this diagram, when CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH, CE1 is HIGH or CE2 is LOW or CE3 is HIGH. 20. Full width Write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BW[A : D] LOW. Document Number: 38-05673 Rev. *H Page 13 of 20 CY7C1329H Switching Waveforms (continued) Figure 5. Read/Write Cycle Timing [21, 22, 23] tCYC CLK tCL tCH tADS tADH ADSP ADSC tAS ADDRESS A1 tAH A2 A3 A4 tWES tWEH tDS tDH A5 A6 D(A5) D(A6) BWE, BW[A:D] tCES tCEH CE ADV OE tCO tOELZ Data In (D) High-Z tCLZ Data Out (Q) High-Z Q(A1) Back-to-Back READs tOEHZ D(A3) Q(A4) Q(A2) Single WRITE Q(A4+1) Q(A4+2) Q(A4+3) BURST READ DON’T CARE Back-to-Back WRITEs UNDEFINED Notes 21. On this diagram, when CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH, CE1 is HIGH or CE2 is LOW or CE3 is HIGH. 22. The data bus (Q) remains in High Z following a Write cycle unless an ADSP, ADSC, or ADV cycle is performed. 23. GW is HIGH. Document Number: 38-05673 Rev. *H Page 14 of 20 CY7C1329H Switching Waveforms (continued) Figure 6. ZZ Mode Timing [24, 25] CLK t ZZ ZZ I t ZZREC t ZZI SUPPLY I DDZZ t RZZI ALL INPUTS (except ZZ) Outputs (Q) DESELECT or READ Only High-Z DON’T CARE Notes 24. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device. 25. DQs are in High Z when exiting ZZ sleep mode. Document Number: 38-05673 Rev. *H Page 15 of 20 CY7C1329H Ordering Information Cypress offers other versions of this type of product in many different configurations and features. The following table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office closest to you, visit us at http://www.cypress.com/go/datasheet/offices. Speed (MHz) 133 Ordering Code CY7C1329H-133AXC Package Diagram Package Type 51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free Operating Range Commercial Ordering Code Definitions CY 7 C 1329 H - 133 A X C Temperature Range: C = Commercial Pb-free Package Type: A = 100-pin TQFP Speed: 133 MHz Process Technology: H 90 nm Part Identifier: 1329 = SCD, 064 K × 32 (2 Mb) Technology Code: C = CMOS Marketing Code: 7 = SRAM Company ID: CY = Cypress Document Number: 38-05673 Rev. *H Page 16 of 20 CY7C1329H Package Diagram Figure 7. 100-pin TQFP (14 × 20 × 1.4 mm) A100RA Package Outline, 51-85050 51-85050 *E Document Number: 38-05673 Rev. *H Page 17 of 20 CY7C1329H Acronyms Acronym Document Conventions Description Units of Measure CE Chip Enable CMOS Complementary Metal Oxide Semiconductor °C degree Celsius EIA Electronic Industries Alliance MHz megahertz I/O Input/Output µA microampere JEDEC Joint Electron Devices Engineering Council mA milliampere OE Output Enable mm millimeter SRAM Static Random Access Memory ms millisecond TQFP Thin Quad Flat Pack mV millivolt TTL Transistor-Transistor Logic nm nanometer ns nanosecond ohm % percent Document Number: 38-05673 Rev. *H Symbol Unit of Measure pF picofarad V volt W watt Page 18 of 20 CY7C1329H Document History Page Document Title: CY7C1329H, 2-Mbit (64 K × 32) Pipelined Sync SRAM Document Number: 38-05673 Rev. ECN No. Issue Date Orig. of Change Description of Change ** 347357 See ECN PCI New data sheet. *A 424820 See ECN RXU Changed status from Preliminary to Final. Changed address of Cypress Semiconductor Corporation from “3901 North First Street” to “198 Champion Court”. Updated Pin Definitions (Changed Three-State to Tri-State). Updated Functional Overview (Changed Three-State to Tri-State). Updated Truth Table (Updated Note 6 (Changed Three-State to Tri-State)). Updated Maximum Ratings (Changed Three-State to Tri-State). Updated Electrical Characteristics (Updated Note 10 (Changed test condition from VIH < VDD to VIH VDD), changed “Input Load Current except ZZ and MODE” to “Input Leakage Current except ZZ and MODE”). Updated Ordering Information (Updated part numbers, replaced Package Name column with Package Diagram in the Ordering Information table). Replaced Package Diagram. *B 433014 See ECN NXR Updated Features (Included 3.3 V I/O option). Updated Functional Description (Included 3.3 V I/O option). Updated Electrical Characteristics (Included 3.3 V I/O option). Updated AC Test Loads and Waveforms (Updated Figure 2 (Included 3.3 V I/O option)). Updated Switching Characteristics (Updated Note 12 (Included 3.3 V I/O option)). Updated Ordering Information (Updated part numbers). *C 2896585 03/20/2010 NJY Updated Ordering Information (Removed obsolete part numbers) Updated Package Diagram. *D 3052882 10/08/2010 NJY Updated Ordering Information (Removed obsolete part numbers) and added Ordering Code Definitions. *E 3293640 06/27/2011 NJY Updated Package Diagram. Added Acronyms and Units of Measure. Updated in new template. *F 3613761 05/10/2012 NJY Updated Features (Removed 166 MHz frequency related information). Updated Functional Description (Removed the Note “For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.” and its reference). Updated Selection Guide (Removed 166 MHz frequency related information). Updated Pin Definitions (Removed BGA related information). Updated Operating Range (Removed Industrial Temperature Range). Updated Electrical Characteristics (Removed 166 MHz frequency related information). Updated Switching Characteristics (Removed 166 MHz frequency related information). *G 4081869 07/30/2013 PRIT Updated Truth Table. Updated in new template. *H 4575272 11/20/2014 PRIT Added related documentation hyperlink in page 1. Updated package diagram. Document Number: 38-05673 Rev. *H Page 19 of 20 CY7C1329H Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/go/support cypress.com/go/touch USB Controllers Wireless/RF psoc.cypress.com/solutions cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2005-2014. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-05673 Rev. *H Revised November 20, 2014 Page 20 of 20 i486 is a trademark, and Intel and Pentium are registered trademarks, of Intel Corporation. PowerPC is a registered trademark of IBM Corporation. All products and company names mentioned in this document may be the trademarks of their respective holders.