TDA18214 Silicon tuner for digital terrestrial and cable TV reception Rev. 1 — 13 July 2012 Preliminary short data sheet 1. General description The TDA18214AHN and TDA18214HN are high performance silicon tuners designed for digital terrestrial and digital cable TV reception. The TDA18214AHN and TDA18214HN support all digital TV standards and deliver a Low IF (LIF) signal to a demodulator. The TDA18214AHN and TDA18214HN facilitate STB design by: • • • • Allowing on-board integration Drastically reducing the tuner Bill Of Material (BOM) Providing flexibility in system solution development Allowing straightforward, cost effective dual and multi-tuner applications optimization In multi-tuner application, the TDA18214AHN is the master tuner whereas the TDA18214HN is a slave tuner. 2. Features and benefits Single 3.3 V supply voltage Worldwide multistandard digital terrestrial and digital cable capabilities Alignment free RoHS compliant I2C-bus interface compatible with 3.3 V microcontrollers Crystal oscillator output buffer Slave Tuner Output (STO) for multi-tuner applications (TDA18214AHN only) Fully integrated oscillators 2 programmable General-Purpose Outputs (GPO) Loop-Through Output (LTO) 1.7 MHz, 6 MHz, 7 MHz, 8 MHz and 10 MHz channel bandwidths LIF channel center frequency output ranging from 0.8 MHz to 7.5 MHz Fully integrated IF selectivity; eliminating the need for external SAW filters Large flexibility in the IF filtering stage to ease the matching with various demodulators circuits Single-ended RF input, no need for external balun Up to 1 GHz RF input capability Excellent return loss compatible with cable requirements Power Level Detector (PLD) embedded Integrated gain control TDA18214 NXP Semiconductors Silicon tuner for digital terrestrial and cable TV reception Very fast tuning time Strong immunity to LTE interferers in the digital dividend bandwidth Strong immunity to WLAN interferers 3. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit 42 - 1002 MHz LNA Zi = 1 and RF < 870 MHz - 4.0 4.6 dB LNA Zi = 1 and 870 MHz < RF < 1 GHz - 5.4 6 dB fRF RF frequency full range of RF input NFtun tuner noise figure 75 impedance source; maximum gain jit phase jitter integrated from 250 Hz to 4 MHz - 0.4 0.6 degree image image rejection worst case, measured at 4 MHz IF frequency and for image levels above 60 dBV 57.5 63 - dB CSO composite worst interferer over RF second-order distortion frequency with respect to wanted carrier [1] - 60 50 dBc CTB composite triple beat worst interferer over RF frequency with respect to wanted carrier for frequency 550 MHz [1] - -65 60 dBc worst interferer over RF frequency with respect to wanted carrier for frequency > 550 MHz [1] - - 55 dBc 120 - - dBV ICP1dB [1] 1 dB input compression point at the tuner input and minimum gain Test scenario: 129 channels each 75 dBV. 4. Ordering information Table 2. Ordering information Type number Package Name TDA18214AHN/C1 TDA18214HN/C1 TDA18214_SDS Preliminary short data sheet Description HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 6 0.85 mm All information provided in this document is subject to legal disclaimers. Rev. 1. — 13 July 2012 Version SOT618-6 © NXP B.V. 2012. All rights reserved. 2 of 8 TDA18214 NXP Semiconductors Silicon tuner for digital terrestrial and cable TV reception 5. Block diagram to a second TDA18214AHN or to a TDA18214HN loop-through output CAPRFAGC LTO STO TDA18214AHN LNA/RF splitter RF tracking filter SURGE AND CB TRAP FILTER H3H5 and wireless filter IR mixer IF filters IFP IF amplifier RFIN IFN RF AGC VIFAGC CAPSMOOTH LO DIVIDER XTALINSEL clock input buffer XTALP Xtal oscillator POWER LEVEL DETECTOR SCL I2C-bus INTERFACE SDA AS TEMPERATURE SENSOR LC-VCO VCO REGULATOR ∆∑ PLL XTALN XTOUT1 GAIN MANAGEMENT IRQ l/O clock output buffer XTOUT2 CP VTUNE CAPREGVCO GPO2 GPO1/RFAGC_SENSE PLL loop filter Fig 1. aaa-002614 TDA18214AHN block diagram TDA18214_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1. — 13 July 2012 © NXP B.V. 2012. All rights reserved. 3 of 8 TDA18214 NXP Semiconductors Silicon tuner for digital terrestrial and cable TV reception loop-through output CAPRFAGC LTO n.c. TDA18214HN LNA/RF splitter RF tracking filter H3H5 and wireless filter IF filters IR mixer IFP IF amplifier RFIN SURGE AND CB TRAP FILTER IFN RF AGC VIFAGC CAPSMOOTH LO DIVIDER XTALINSEL clock input buffer XTALP Xtal oscillator SCL POWER LEVEL DETECTOR I2C-bus INTERFACE SDA AS TEMPERATURE SENSOR LC-VCO VCO REGULATOR ∆∑ PLL XTALN XTOUT1 GAIN MANAGEMENT IRQ l/O clock output buffer XTOUT2 CP VTUNE GPO2 CAPREGVCO GPO1/RFAGC_SENSE PLL loop filter Fig 2. aaa-002615 TDA18214HN block diagram 6. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage VI input voltage Conditions Min Max Unit 0.3 +3.6 V VCC < 3.3 V 0.3 VCC + 0.3 V VCC > 3.3 V 0.3 +3.6 V Tstg storage temperature 40 +150 C Tj junction temperature - 150 C Tamb ambient temperature 20 [1] C VESD electrostatic discharge voltage 2 +2 kV 750 - V EIA/JESD22-A114 (HBM) EIA/JESD22-C101-C (FCDM) class III[2] GPO pins: GPO1/RFAGC_SENSE and GPO2 VCC supply voltage 0 V < Vpu < 5.5 V; Rpu > 390 0.3 +5.5 V ICC supply current corresponding GPO ON 20 0 mA TDA18214_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1. — 13 July 2012 © NXP B.V. 2012. All rights reserved. 4 of 8 TDA18214 NXP Semiconductors Silicon tuner for digital terrestrial and cable TV reception [1] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction temperature is never exceeded. The junction temperature can be obtained by reading the temperature sensor bit via I2C-bus. The junction temperature: Tj = Tamb + Tj-c. where Tj-c = power Rth. [2] Class III: 500 V to 1000 V. 7. Abbreviations Table 4. Abbreviations Acronym Description AGC Automatic Gain Control BOM Bill Of Material FCDM Field-induced Charged-Device Model GPO General Purpose Outputs H3H5 Harmonic 3 and Harmonic 5 HBM Human Body Model IF Intermediate Frequency I/O Input/Output LC-VCO Inductors and Capacitors - Voltage Controlled Oscillator LIF Low IF LNA Low-Noise Amplifier LO Local Oscillator LTE Long-Term Evolution LTO Loop-Through Output PLD Power Level Detector PLL Phase-Locked Loop RF Radio Frequency RoHS Restriction of Hazardous Substances SAW Surface Acoustic Wave STB Set-Top Box STO Slave Tuner Output VCO Voltage Controlled Oscillator Xtal Crystal WLAN Wireless Local Area Network 8. Revision history Table 5. Revision history Document ID Release date Data sheet status TDA18214_SDS v.1 20120713 Preliminary short data sheet - TDA18214_SDS Preliminary short data sheet Change notice All information provided in this document is subject to legal disclaimers. Rev. 1. — 13 July 2012 Supersedes - © NXP B.V. 2012. All rights reserved. 5 of 8 TDA18214 NXP Semiconductors Silicon tuner for digital terrestrial and cable TV reception 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1. — 13 July 2012 © NXP B.V. 2012. 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Licenses ICs with DVB-T or DVB-T2 functionality Use of this product in any manner that complies with the DVB-T or the DVB-T2 standard may require licenses under applicable patents of the DVB-T respectively the DVB-T2 patent portfolio, which license is available from Sisvel S.p.A., Via Sestriere 100, 10060 None (TO), Italy, and under applicable patents of other parties. 9.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDA18214_SDS Preliminary short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1. — 13 July 2012 © NXP B.V. 2012. All rights reserved. 7 of 8 TDA18214 NXP Semiconductors Silicon tuner for digital terrestrial and cable TV reception 11. Contents 1 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 9.5 10 11 General description . . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 2 2 3 4 5 5 6 6 6 6 7 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 July 2012 Document identifier: TDA18214_SDS