Data Sheet

TDA18214
Silicon tuner for digital terrestrial and cable TV reception
Rev. 2 — 11 February 2013
Product short data sheet
1. General description
The TDA18214AHN and TDA18214HN are high performance silicon tuners designed for
digital terrestrial and digital cable TV reception.
The TDA18214AHN and TDA18214HN support all digital TV standards and deliver a Low
IF (LIF) signal to a demodulator.
The TDA18214AHN and TDA18214HN facilitate STB design by:
•
•
•
•
Allowing on-board integration
Drastically reducing the tuner Bill Of Material (BOM)
Providing flexibility in system solution development
Allowing straightforward, cost effective dual and multi-tuner applications optimization
In multi-tuner application, the TDA18214AHN is the master tuner whereas the
TDA18214HN is a slave tuner.
2. Features and benefits
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Single 3.3 V supply voltage
Worldwide multistandard digital terrestrial and digital cable capabilities
Alignment free
RoHS compliant
I2C-bus interface compatible with 3.3 V microcontrollers
Crystal oscillator output buffer
Slave Tuner Output (STO) for multi-tuner applications (TDA18214AHN only)
Fully integrated oscillators
2 programmable General-Purpose Outputs (GPO)
Loop-Through Output (LTO)
1.7 MHz, 6 MHz, 7 MHz, 8 MHz and 10 MHz channel bandwidths
LIF channel center frequency output ranging from 0.8 MHz to 7.5 MHz
Fully integrated IF selectivity; eliminating the need for external SAW filters
Large flexibility in the IF filtering stage to ease the matching with various demodulators
circuits
Single-ended RF input, no need for external balun
Up to 1 GHz RF input capability
Excellent return loss compatible with cable requirements
Power Level Detector (PLD) embedded
Integrated gain control
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
 Very fast tuning time
 Strong immunity to LTE interferers in the digital dividend bandwidth
 Strong immunity to WLAN interferers
3. Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
42
-
1002
MHz
LNA Zi = 1 and
RF < 870 MHz
-
4.0
4.6
dB
LNA Zi = 1 and
870 MHz < RF < 1 GHz
-
5.4
6
dB
fRF
RF frequency
full range of RF input
NFtun
tuner noise figure
75  impedance source;
maximum gain
jit
phase jitter
integrated from 250 Hz to
4 MHz
-
0.4
0.6
degree
image
image rejection
worst case, measured at
4 MHz IF frequency and for
image levels above
60 dBV
57.5
63
-
dB
CSO
composite
worst interferer over RF
second-order distortion frequency with respect to
wanted carrier
[1]
-
60
50
dBc
CTB
composite triple beat
worst interferer over RF
frequency with respect to
wanted carrier for frequency
 550 MHz
[1]
-
-65
60
dBc
worst interferer over RF
frequency with respect to
wanted carrier for frequency
> 550 MHz
[1]
-
-
55
dBc
120
-
-
dBV
ICP1dB
[1]
1 dB input
compression point
at the tuner input and
minimum gain
Test scenario: 129 channels each 75 dBV.
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
TDA18214AHN/C1
TDA18214HN/C1
TDA18214_SDS
Product short data sheet
Description
HVQFN40 plastic thermal enhanced very thin quad flat
package; no leads; 40 terminals; body
6  6  0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 February 2013
Version
SOT618-6
© NXP B.V. 2013. All rights reserved.
2 of 8
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
5. Block diagram
to a second
TDA18214AHN
or to a
TDA18214HN
loop-through
output
CAPRFAGC
LTO
STO
TDA18214AHN
LNA/RF
splitter
RF tracking
filter
SURGE AND CB
TRAP FILTER
H3H5 and
wireless filter
IR mixer
IF filters
IFP
IF amplifier
RFIN
IFN
RF AGC
VIFAGC
CAPSMOOTH
LO
DIVIDER
XTALINSEL
clock input
buffer
XTALP
Xtal
oscillator
POWER LEVEL
DETECTOR
SCL
I2C-bus
INTERFACE
SDA
AS
TEMPERATURE
SENSOR
LC-VCO
VCO
REGULATOR
∆∑ PLL
XTALN
XTOUT1
GAIN
MANAGEMENT
IRQ
l/O
clock output
buffer
XTOUT2
CP
VTUNE
CAPREGVCO
GPO2
GPO1/RFAGC_SENSE
PLL loop
filter
Fig 1.
aaa-002614
TDA18214AHN block diagram
TDA18214_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 February 2013
© NXP B.V. 2013. All rights reserved.
3 of 8
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
loop-through
output
CAPRFAGC
LTO
n.c.
TDA18214HN
LNA/RF
splitter
RF tracking
filter
H3H5 and
wireless filter
IF filters
IR mixer
IFP
IF amplifier
RFIN
SURGE AND CB
TRAP FILTER
IFN
RF AGC
VIFAGC
CAPSMOOTH
LO
DIVIDER
XTALINSEL
clock input
buffer
XTALP
Xtal
oscillator
SCL
POWER LEVEL
DETECTOR
I2C-bus
INTERFACE
SDA
AS
TEMPERATURE
SENSOR
LC-VCO
VCO
REGULATOR
∆∑ PLL
XTALN
XTOUT1
GAIN
MANAGEMENT
IRQ
l/O
clock output
buffer
XTOUT2
CP
VTUNE
GPO2
CAPREGVCO
GPO1/RFAGC_SENSE
PLL loop
filter
Fig 2.
aaa-002615
TDA18214HN block diagram
6. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VCC
supply voltage
VI
input voltage
Conditions
Min
Max
Unit
0.3
+3.6
V
VCC < 3.3 V
0.3
VCC + 0.3 V
VCC > 3.3 V
0.3
+3.6
V
Tstg
storage temperature
40
+150
C
Tj
junction temperature
-
150
C
Tamb
ambient temperature
20
[1]
C
VESD
electrostatic discharge voltage
2
+2
kV
750
-
V
EIA/JESD22-A114 (HBM)
EIA/JESD22-C101-C (FCDM) class
III[2]
GPO pins: GPO1/RFAGC_SENSE and GPO2
VCC
supply voltage
0 V < Vpu < 5.5 V; Rpu > 390 
0.3
+5.5
V
ICC
supply current
corresponding GPO ON
20
0
mA
TDA18214_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 February 2013
© NXP B.V. 2013. All rights reserved.
4 of 8
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
[1]
The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design
of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction
temperature is never exceeded. The junction temperature can be obtained by reading the temperature sensor bit via I2C-bus. The
junction temperature: Tj = Tamb + Tj-c. where Tj-c = power  Rth.
[2]
Class III: 500 V to 1000 V.
7. Abbreviations
Table 4.
Abbreviations
Acronym
Description
AGC
Automatic Gain Control
BOM
Bill Of Material
FCDM
Field-induced Charged-Device Model
GPO
General Purpose Outputs
H3H5
Harmonic 3 and Harmonic 5
HBM
Human Body Model
IF
Intermediate Frequency
I/O
Input/Output
LC-VCO
Inductors and Capacitors - Voltage Controlled Oscillator
LIF
Low IF
LNA
Low-Noise Amplifier
LO
Local Oscillator
LTE
Long-Term Evolution
LTO
Loop-Through Output
PLD
Power Level Detector
PLL
Phase-Locked Loop
RF
Radio Frequency
RoHS
Restriction of Hazardous Substances
SAW
Surface Acoustic Wave
STB
Set-Top Box
STO
Slave Tuner Output
VCO
Voltage Controlled Oscillator
Xtal
Crystal
WLAN
Wireless Local Area Network
8. Revision history
Table 5.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA18214_SDS v.2
20130211
Product short data sheet
-
TDA18214_SDS v.1
TDA18214_SDS v.1
20120713
Preliminary short data sheet -
TDA18214_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 February 2013
-
© NXP B.V. 2013. All rights reserved.
5 of 8
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TDA18214_SDS
Product short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 February 2013
© NXP B.V. 2013. All rights reserved.
6 of 8
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
9.4
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Licenses
ICs with DVB-T or DVB-T2 functionality
Use of this product in any manner that complies with the DVB-T or the
DVB-T2 standard may require licenses under applicable patents of the
DVB-T respectively the DVB-T2 patent portfolio, which license is available
from Sisvel S.p.A., Via Sestriere 100, 10060 None (TO), Italy, and under
applicable patents of other parties.
9.5
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TDA18214_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 11 February 2013
© NXP B.V. 2013. All rights reserved.
7 of 8
TDA18214
NXP Semiconductors
Silicon tuner for digital terrestrial and cable TV reception
11. Contents
1
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
9.5
10
11
General description . . . . . . . . . . . . . . . . . . . . . .
Features and benefits . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
2
2
3
4
5
5
6
6
6
6
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 February 2013
Document identifier: TDA18214_SDS