IP4234CZ6 Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 Rev. 01 — 16 April 2009 Product data sheet 1. Product profile 1.1 General description The IP4234CZ6 is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive to capacitive loads, from being damaged by ElectroStatic Discharge (ESD). The π-filter structure is implemented with a small series resistor to provide the necessary protection to signal and supply components from ESD voltages greater than ±8 kV contact discharge according IEC 61000-4-2, level 4. The ESD protection is independent of the supply voltage due to the rail-to-rail diode architecture being connected to a Zener diode. The IP4234CZ6 is fabricated using monolithic silicon technology and integrates two ultra-low capacitance π-filter ESD protection diodes plus a Zener diode in a miniature 6-lead SOT457 package. 1.2 Features n n n n n n n n Pb-free and RoHS compliant Simple, direct signal routing provides for high speed signal integrity ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge Significant reduction in peak clamping and peak residual current Four low input capacitance (2.0 pF typical) rail-to-rail ESD protection diodes Low voltage clamping due to an integrated Zener diode Small 6-lead SO6 (SOT457) package IEC 61000-4-5 15 A Lightning (8/20 µs) compliant 1.3 Applications n General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside: u Cellular and PCS mobile handsets u PC/Notebook USB2.0/IEEE1394 ports u DVI interfaces u HDMI interfaces u Cordless telephones u Wireless data (WAN/LAN) systems u PDAs IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 2. Pinning information Table 1. Pinning Pin Description Simplified outline 1 ESD protection I/O channel 1 2 ground 3 ESD protection I/O channel 1 4 ESD protection I/O channel 2 5 supply voltage 6 ESD protection I/O channel 2 6 5 4 1 2 3 Graphic symbol 3 1 5 R 6 4 R 2 001aaj950 3. Ordering information Table 2. Ordering information Type number IP4234CZ6 Package Name Description Version TSOP6 plastic surface-mounted package (TSOP6); 6 leads SOT457 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VI input voltage Vesd electrostatic discharge voltage PPP peak pulse power Tstg storage temperature Min Max Unit GND − 0.5 +5.5 V all pins; IEC 61000-4-2 level 4; contact discharge −15 +15 kV tp = 8/20 µs; IEC 61000-4-5 15 A lightning - 100 W −55 +125 °C 5. Recommended operating conditions Table 4. Operating conditions Symbol Parameter Tamb ambient temperature Conditions IP4234CZ6_1 Product data sheet Min Max Unit −40 +85 °C © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 2 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 6. Characteristics Table 5. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions C(I/O-GND) input/output to ground pins 1, 3, 4, 6; VI = 0 V; capacitance f = 1 MHz; VCC = 3.0 V Min Typ Max Unit [1] - 2.5 - pF [1] - 40 - pF C(zd-GND) Zener diode to ground pin 5 to pin 2; VI = 0 V; f = 1 MHz; capacitance VCC = 3.0 V ILR reverse leakage current pins 1, 3, 4, 6 to ground; VI = 3.0 V - - 100 nA VBRzd Zener diode breakdown voltage pin 5 to pin 2; I = 1 mA 6 - 9 V VF forward voltage [1] - 0.7 - V [1] - 0.5 - Ω series resistance Rs [1] Tcase = 25 °C Guaranteed by design. 7. Application information 7.1 Universal serial bus 2.0 protection The IP4234CZ6 is optimized to protect a USB 2.0 port from ESD. The device is capable of protecting both USB data lines and the VBUS supply. A typical application is shown in Figure 1. VBUS 6 5 4 D− USB 2.0/ IEEE1394 TRANSCEIVER R R D+ 1 2 3 GND 001aaj951 Fig 1. Typical application of IP4234CZ6 To avoid a short circuit on the data lines when VBUS is shut down, a back drive protection diode can be attached to the IP4234CZ6. IP4234CZ6_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 3 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 8. Package outline Plastic surface-mounted package (TSOP6); 6 leads D SOT457 E B y A HE 6 X v M A 4 5 Q pin 1 index A A1 c 1 2 3 Lp bp e w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.1 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT457 Fig 2. JEITA SC-74 EUROPEAN PROJECTION ISSUE DATE 05-11-07 06-03-16 Package outline SOT457 (TSOP6) IP4234CZ6_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 4 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 9. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 9.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 9.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 9.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities IP4234CZ6_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 5 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 9.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 3) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 6 and 7 Table 6. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 7. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 3. IP4234CZ6_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 6 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 3. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 10. Abbreviations Table 8. Abbreviations Acronym Description DVI Digital Video Interface ESD ElectroStatic Discharge HDMI High Definition Multimedia interface LAN Local Area Network PCS Personal Computing System PDA Personal Digital Assistant RoHS Restriction of Hazardous Substances USB Universal Serial Bus WAN Wide Area Network 11. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4234CZ6_1 20090416 Product data sheet - - IP4234CZ6_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 7 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4234CZ6_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 16 April 2009 8 of 9 IP4234CZ6 NXP Semiconductors Single USB 2.0 ESD protection to IEC 61000-4-2 level 4 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 8 9 9.1 9.2 9.3 9.4 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Recommended operating conditions. . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Application information. . . . . . . . . . . . . . . . . . . Universal serial bus 2.0 protection . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . . Introduction to soldering . . . . . . . . . . . . . . . . . . Wave and reflow soldering . . . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 2 2 2 2 3 3 3 4 5 5 5 5 6 7 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 April 2009 Document identifier: IP4234CZ6_1