1&6' 3&%RDUG'HVLJQIRU3%*$ 3&%RDUG'HVLJQIRU3%*$ 324 BGA, 1.0 mm, 2 Signal Layer Trace Routing Traces on bottom signal layer, #2 Power and ground pads (0.5 mm), top signal layer, #1 Solder Joining Pad (0.5 mm), top signal layer, #1 Plated Thru Hole via 0.1 mm line (4 mil), and 0.1 mm spaces Top Surface Footprint Semiconductor Products Sector 1 - 8/18/99 1&6' Space available = (2*(Pitch)2)1/2 - pad diameter - 2* mask relief = 1.41 - 0.5 - (2*0.1) = 0.71 mm PP3LWFK5RXWLQJ XVLQJPP3DG'LDPHWHU 1.41 mm 1.0 mm 6SDFHUHTXLUHGIRURQHOLQH PLOOV PLOOV PLOOV PLOOV VOV PP PP PP PP )RULQQHUOD\HUGLDPHWHURIWKHYLDGULOOLVPP 1RPDVNUHOLHILVUHTXLUHGVR6SDFHDYDLODEOH 3LWFKYLDGLDPHWHU PPVR2.IRUPLOOV Semiconductor Products Sector 6SDFHUHTXLUHGIRUWZROLQHV PLOOV PLOOV PLOOV PLOOV VOVOV PP PP PP PP )RULQQHUOD\HUGLDJRQDO6SDFHDYDLODEOH DUHDYLDGLDPHWHU 1.0 mm PPVR2.IRUPLOOV Space available = Pitch - pad diameter - 2* mask relief = 1.0 - 0.5 - (2*0.1) = 0.3 mm (so very close to allowing 4 mil l/s) 2 - 8/18/99 1&6' PP3LWFK5RXWLQJ XVLQJPP3DG'LDPHWHU PLOOVPD[LPXP XVLQJPP3DG'LDPHWHU PLOOVPD[LPXP XVLQJPP3DG'LDPHWHU PLOOVPD[LPXPJHWWLQJFORVHWRPLOOV XVLQJPP3DG'LDPHWHU PLOOVPD[LPXP Semiconductor Products Sector 3 - 8/18/99