324 pin MAPBGA 4-Layer example

1&6'
3&%RDUG'HVLJQIRU3%*$
3&%RDUG'HVLJQIRU3%*$
324 BGA, 1.0 mm, 2 Signal Layer Trace Routing
Traces on bottom signal layer, #2
Power and ground pads (0.5 mm),
top signal layer, #1
Solder Joining Pad (0.5 mm),
top signal layer, #1
Plated Thru Hole via
0.1 mm line (4 mil), and
0.1 mm spaces
Top Surface Footprint
Semiconductor
Products Sector
1 - 8/18/99
1&6'
Space available = (2*(Pitch)2)1/2 - pad diameter - 2* mask relief
= 1.41 - 0.5 - (2*0.1)
= 0.71 mm
PP3LWFK5RXWLQJ
XVLQJPP3DG'LDPHWHU
1.41 mm
1.0 mm
6SDFHUHTXLUHGIRURQHOLQH
PLOOV
PLOOV
PLOOV
PLOOV
VOV
PP
PP
PP
PP
)RULQQHUOD\HUGLDPHWHURIWKHYLDGULOOLVPP
1RPDVNUHOLHILVUHTXLUHGVR6SDFHDYDLODEOH
3LWFKYLDGLDPHWHU
PPVR2.IRUPLOOV
Semiconductor
Products Sector
6SDFHUHTXLUHGIRUWZROLQHV
PLOOV
PLOOV
PLOOV
PLOOV
VOVOV
PP
PP
PP
PP
)RULQQHUOD\HUGLDJRQDO6SDFHDYDLODEOH
DUHDYLDGLDPHWHU
1.0 mm
PPVR2.IRUPLOOV
Space available = Pitch - pad diameter - 2* mask relief
= 1.0 - 0.5 - (2*0.1)
= 0.3 mm (so very close to allowing 4 mil l/s)
2 - 8/18/99
1&6'
PP3LWFK5RXWLQJ
XVLQJPP3DG'LDPHWHU
PLOOVPD[LPXP
XVLQJPP3DG'LDPHWHU
PLOOVPD[LPXP
XVLQJPP3DG'LDPHWHU
PLOOVPD[LPXPJHWWLQJFORVHWRPLOOV
XVLQJPP3DG'LDPHWHU
PLOOVPD[LPXP
Semiconductor
Products Sector
3 - 8/18/99