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BAL-NRF02D3
50 ohm nominal input / conjugate match balun to nRF51822CEAA/CDAB/CFAC and nRF51422-CEAA/CDAB/CFAC
Datasheet − production data
Benefits
• Very low profile: < 560 µm after reflow
• High RF performance
• RF BOM and area reduction
Applications
• 2.45 GHz impedance matched balun filter
Lead-free Flip-Chip package
5 bumps
• Optimized for Nordic's chip set
nRF51422-CEAA, nRF51422-CDAB,
nRF51422-CFAC and nRF51822-CEAA,
nRF51822-CDAB, nRF51822-CFAC
Figure 1. Pin coordinates
Description
Top view
3
2
DIFF
VDD
DIFF
1
SE
A
GND
B
STMicroelectronics BAL-NRF02D3 is an
ultraminiature balun. The BAL-NRF02D3
integrates matching network and harmonics filter.
Matching impedance has been customized for the
following Nordic Semiconductor circuits:
nRF51422-CEAA, nRF51422-CDAB, nRF51422CFAC and nRF51822-CEAA, nRF51822-CDAB,
nRF51822-CFAC.
The BAL-NRF02D3 uses STMicroelectronics IPD
technology on non-conductive glass substrate
which optimize RF performances.
The BAL-NRF02D3 has been tested and
approved by Nordic Semiconductor in the nRFgo
modules.
Features
• 50 Ω nominal input / conjugate match to Nordic
Semiconductor chips nRF51422-CEAA,
nRF51422-CDAB, nRF51422-CFAC and
nRF51822-CEAA, nRF51822-CDAB,
nRF51822-CFAC
• Low insertion loss
• Low amplitude imbalance
• Low phase imbalance
• Small footprint: < 1.2 mm2
June 2015
This is information on a product in full production.
DocID024794 Rev 5
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www.st.com
11
Application
1
BAL-NRF02D3
Application
Figure 2. Application schematic
C1
12pF
C2
X1
16MHz
12pF
P0.29
P0.28
P0.27
P0.26
P0.25
P0.24
P0.23
P0.22
P0.21
C8
100nF
C7
B7
A8
A7
C5
A6
B6
B5
A5
A4
A3
A2
VCC_nRF
VCC_nRF
AVDD
VSS
VSS
VSS
ANT2
ANT1
VDD_PA
DEC2
P0.20
P0.19
P0.18
P0.17
nRF51822
B1
B4
J8
P0.08
J7
P0.09
P0.10
H6
P0.11
J6
J5
P0.12
H5
P0.13
H4
P0.14
P0.15
J4
P0.16
J3
J2
SWDIO
SWDCLK H2
C8
H3
C11
100nF
VDD
DCC
P0.30
P0.31
P0.00
P0.01
P0.02
P0.03
P0.04
P0.05
P0.06
P0.07
VDD
VSS
VSS
P0.08
P0.09
P0.10
P0.11
P0.12
P0.13
P0.14
P0.15
P0.16
SWDIO/nRESET
SWDCLK
VSS
VSS
C7
100nF
P0.30
P0.31
P0.00
P0.01
P0.02
P0.03
P0.04
P0.05
P0.06
P0.07
B8
B9
D8
E8
C9
E9
D9
F9
F8
H9
G8
H7
H8
C9
1.0nF
P0.29
P0.28
P0.27
P0.26
P0.25
P0.24
P0.23
P0.22
P0.21
DEC1
XC2
XC1
VCC_nRF
A1
G6
G9
D7
C1
D1
E1
F1
G1
F2
H1
G2
B1
B3
A3
A2
P0.20
P0.19
P0.18
P0.17
R1
12k
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BAL-NRF02D3
C10
47nF
U1
nRF51822-CEAA
DocID024794 Rev 5
ANT2
SE
ANT1
VDD_PA GND
C3
2.2nF
A1 RF
B1
BAL-NRF02D3
2
Characteristics
Characteristics
Table 1. Absolute maximum ratings (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Typ.
Max.
-
20
Input Power RFIN
VESD
TOP
ESD ratings human body model (JESD22-A114-C), all I/O one at a
time while others connected to GND
2000
ESD ratings charge device model (JESD22-C101-C)
500
-
ESD ratings machine model, all I/O
200
-
Operating temperature (JESD22-A115-C), all I/O
-40
-
dBm
V
+105
°C
Table 2. Impedances (Tamb = 25 °C)
Value
Symbol
ZOUT
ZIN
Parameter
Unit
Min.
Typ.
Max.
Nominal differential output impedance
-
matched
-
Ω
Nominal input impedance
-
50
-
Ω
Table 3. RF performance (Tamb = 25 °C)
Value
Symbol
Parameter
Test condition
Unit
Min.
Typ.
2400
Max.
F
Frequency range (bandwidth)
2540
MHz
IL
Insertion loss in bandwidth
1.9
dB
RL
Return loss in bandwidth
12
dB
φimb
Phase imbalance
6
°
Aimb
Amplitude imbalance
0.15
dB
2f0
2nd harmonic S21 attenuation
4880 MHz
10
dB
3f0
3rd harmonic S21 attenuation
7320 MHz
20
dB
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Characteristics
2.1
BAL-NRF02D3
On-board measurements
Figure 3. Transmission (Tamb = 25 °C)
-0
Figure 4. Insertion loss (Tamb = 25 °C)
dB
dB
-0
-5
-0.5
-10
-1.0
-15
-1.5
-20
-2.0
-25
-2.5
F (GHz)
F (GHz)
-3.0
-30
0
1
2
3
4
6
5
7
8
2.41 2.42
2.40
Figure 5. Return loss on SE port
(Tamb = 25 °C)
2.43
2.44 2.45
2.46
2.47 2.48 2.49
2.50
Figure 6. Return loss on DIFF port
(Tamb = 25 °C)
dB
-15.0
-10
-11
dB
-17.5
-12
-20.0
-13
-22.5
-14
F (GHz)
F (GHz)
-25.0
-15
2.40
2.41 2.42
2.43
2.44 2.45
2.46
2.47 2.48 2.49
2.50
Figure 7. Amplitude imbalance (Tamb = 25 °C)
dB
2.40
15.0
0.4
12.5
10.0
5.0
0.1
2.5
2.46
2.47 2.48 2.49
2.50
degrees
0.0
0.0
-2.5
-0.1
-5.0
-0.2
-7.5
-0.3
-10.0
-0.4
F (GHz)
-7.5
F (GHz)
-15.0
-0.5
4/11
2.44 2.45
7.5
0.2
2.40
2.43
Figure 8. Phase imbalance (Tamb = 25 °C)
0.5
0.3
2.41 2.42
2.41 2.42
2.43
2.44 2.45
2.46
2.47 2.48 2.49
2.50
2.40
2.41 2.42
DocID024794 Rev 5
2.43
2.44 2.45
2.46
2.47 2.48 2.49
2.50
BAL-NRF02D3
Characteristics
Table 4. Compatibility matrix (nRF51422)
nRF51422 IC revision
Packet/variant
Build code
1
CEAA
A0A
2
CEAA
Bx0
CDAB
Ax0
CEAA
Cx0
CFAC
Ax0
3
Table 5. Compatibility matrix (nRF51822)
nRF51822 IC revision
Packet/variant
Build code
CEAA
BA
CEAA
B0
CEAA
CA0
CEAA
DA0
CEAA
Dx0
CDAB
Ax0
CEAA
Ex0
CFAC
Ax0
1
2
3
DocID024794 Rev 5
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Package information
3
BAL-NRF02D3
Package information
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9. Package dimensions
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—P
9''
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—P
6(
—P
—P
—P
—P“
*1'
',))
—P
—P“—P
—P
—P
—P“—P
7RSYLHZ
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—P
*1'
6(
—P
6/11
',))
9''
—P
—P
—P
DocID024794 Rev 5
—P
—P“—P
—P
—P“—P
—P
BAL-NRF02D3
Package information
Figure 10. Recommended land pattern
650 µm
Soldermask opening
Ø = 320 µm
Top layer pad
Ø = 220 µm
Layer 1
Layer 2
Layer 3
Layer 4
Figure 11. PCB stack-up recommendation
35um
35um
Layer 1
Layer 2
230um
9 30um
35um
35um
Layer 3
Layer 4
DocID024794 Rev 5
230um
7/11
Package information
BAL-NRF02D3
Figure 12. Marking
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
x x z
y ww
2.0 ± 0.05
4.0 ± 0.10
Ø 1.50 ± 0.10
3.5 ± 0.05
1.47 ± 0.05
8.0 +0.30-0.10
0.20 ± 0.02
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
0.95 ± 0.05
0.71 ± 0.05
All dimensions are typical values in mm
Note:
4.0 ± 0.10
User direction of unreeling
More information is available in the STMicroelectronics Application notes:
AN2348 Flip-Chip: “Package description and recommendations for use”
AN4315: “BAL-NRF02D3 matched balun with integrated harmonics filter for
Nordic Semiconductor ultralow power transceivers”
8/11
1.75 ± 0.10
Figure 13. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
DocID024794 Rev 5
BAL-NRF02D3
Package information
Figure 14. Footprint - 3 mils stencil -non solder
mask defined
Figure 15. Footprint - 3 mils stencil - solder
mask defined
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
Figure 16. Footprint - 5 mils stencil -non solder
mask defined
Figure 17. Footprint - 5 mils stencil - solder
mask defined
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P
GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P
DocID024794 Rev 5
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Ordering information
4
BAL-NRF02D3
Ordering information
Table 6. Ordering information
5
Order code
Marking
Weight
Base Qty
Delivery mode
BAL-NRF02D3
SK
1.58 mg
5000
Tape and Reel
Revision history
Table 7. Document revision history
10/11
Date
Revision
Changes
02-Jul-2013
1
Initial release
30-Aug-2013
2
Updated Table 1.
13-Oct-2014
3
Updated Figure 9.
25-Mar-2015
4
Updated cover page, added Table 4 and Table 5.
15-Jun-2015
5
Updated Table 1.
DocID024794 Rev 5
BAL-NRF02D3
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DocID024794 Rev 5
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