32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LT 43.8986 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 3 Package Weight – Site 5 67.9928 mg B1: 68.7901 mg B2: 64.9671 mg Package Weight – Site 4 Package Weight – Site 6 5X5X1.0 mm B1: 69.9000 mg B2: 68.0100 mg B3: 66.9064 mg B4: 69.4639 mg 68.1200 mg N/A SUMMARY The QFN 32L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434-24LTXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: CARSEM Malaysia Package Qualification Report # 074701 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT32CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 1 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Purpose of Use Material Lead Frame Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper Iron Phosphorus Zinc Nickel Palladium Gold Bismaleimide Acrylates Carbolycyclic Acrylate. Silver Additives Si Au Fused Silica Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 proprietary proprietary Proprietary 7440-22-4 proprietary 7440-21-3 7440-57-5 60676-86-0 Proprietary proprietary 1333-86-4 Package Weight (mg): Weight by mg 16.9156 0.4024 0.0052 0.0225 0.2027 0.0176 0.0026 0.0234 0.0234 0.1560 0.5538 0.0234 1.4700 0.5600 22.0382 0.7056 0.7056 0.0706 % weight of substance per Homogeneous material 97.5300% 2.3200% 0.0300% 0.1300% 90.9100% 7.9100% 1.1800% 3.0000% 3.0000% 20.0000% 71.0000% 3.0000% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 43.8986 PPM 385332 9166 119 514 4618 402 60 533 533 3554 12615 533 33486 12757 502024 16073 16073 1607 % Total: % weight of substance per package 38.5332 0.9166 0.0119 0.0514 0.4618 0.0402 0.0060 0.0533 0.0533 0.3554 1.2615 0.0533 3.3486 1.2757 50.2024 1.6073 1.6073 0.1607 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 2 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report # 082902, 093803, 120204 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT32CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 3 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 4) Gold Palladium Wire Using HITACHI (CEL 9220HF13) MOLD COMPOUND Material Purpose of Use Lead Frame Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg Copper Iron Phosphorus Zinc Nickel Palladium Gold Bismaleimide Polymer Acrylate Ester Methacrylate Silver Organic Peroxide Si Au Pd Fused Silica (SiO2) Metal OH Epoxy Resin Phenol Resin Carbon Black Others 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 proprietary proprietary proprietary proprietary 7440-22-4 proprietary 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Proprietary proprietary 1333-86-4 proprietary 28.7554 0.7085 0.0207 0.0354 0.4247 0.0076 0.0077 0.0216 0.0120 0.0048 0.0048 0.1920 0.0048 3.7100 0.8019 0.0081 31.3102 1.1609 1.2313 0.8795 0.0704 0.5277 Package Weight (mg): 69.9000 % weight of substance per Homogeneous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7300% 1.7400% 9.0000% 5.0000% 2.0000% 2.0000% 80.0000% 2.0000% 100.0000% 99.0000% 1.0000% 89.0000% 3.3000% 3.5000% 2.5000% 0.2000% 1.5000% 411,380 10,136 296 507 6,076 109 110 309 172 69 69 2,747 69 53,076 11,472 116 447,929 16,609 17,615 12,582 1,007 7,549 % weight of substanc e per package 41.1380 1.0136 0.0296 0.0507 0.6076 0.0109 0.0110 0.0309 0.0172 0.0069 0.0069 0.2747 0.0069 5.3076 1.1472 0.0116 44.7929 1.6609 1.7615 1.2582 0.1007 0.7549 % Total: 100.0000 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 4 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Gold Palladium Wire Using NITTO (GE 7470LA) MOLD COMPOUND Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Gold Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 Package Weight (mg): Weight by mg 28.7749 0.7090 0.0207 0.0354 0.4440 0.0080 0.0080 0.1998 0.0540 0.0054 0.0054 0.0054 3.6700 2.0295 0.0205 26.7367 0.9606 1.2808 1.2808 0.1601 1.6010 68.0100 % weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 99.0000% 1.0000% 83.5000% 3.0000% 4.0000% 4.0000% 0.5000% 5.0000% PPM % weight of substance per package 423,098 10,424 304 521 6,528 118 118 2,938 794 79 79 79 53,963 29,841 301 393,129 14,124 18,833 18,833 2,354 23,541 % Total: 42.3098 1.0424 0.0304 0.0521 0.6528 0.0118 0.0118 0.2938 0.0794 0.0079 0.0079 0.0079 5.3963 2.9841 0.0301 39.3129 1.4124 1.8833 1.8833 0.2354 2.3541 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 5 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Copper Wire Using NITTO (GE 7470LA) MOLD COMPOUND Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Copper SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 Package Weight (mg): Weight by mg 28.7749 0.7090 0.0207 0.0354 0.4440 0.0080 0.0080 0.1998 0.0540 0.0054 0.0054 0.0054 3.6700 0.9464 26.7367 0.9606 1.2808 1.2808 0.1601 1.6010 66.9064 % weight of substance per Homogeneo us material 97.4100% 2.4001% 0.0701% 0.1198% 96.5217% 1.7391% 1.7391% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 83.5000% 3.0000% 4.0000% 4.0000% 0.5000% 5.0000% PPM % weight of substance per package 430,077 10,597 309 529 6,636 120 120 2,986 807 81 81 81 54,853 14,145 399,613 14,357 19,143 19,143 2,393 23,929 % Total: 43.0077% 1.0597% 0.0309% 0.0529% 0.6636% 0.0120% 0.0120% 0.2986% 0.0807% 0.0081% 0.0081% 0.0081% 5.4853% 1.4145% 39.9613% 1.4357% 1.9143% 1.9143% 0.2393% 2.3929% 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 6 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) Copper Wire Using HITACHI (CEL 9220HF13) MOLD COMPOUND Material Purpose of Use Lead Frame Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg Copper Iron Phosphorus Zinc Nickel Palladium Gold Bismaleimide Polymer Acrylate Ester Methacrylate Silver Organic Peroxide Si Copper Fused Silica (SiO2) Metal OH Epoxy Resin Phenol Resin Carbon Black Others 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 proprietary proprietary proprietary proprietary 7440-22-4 proprietary 7440-21-3 7440-50-8 60676-86-0 Trade Secret Proprietary proprietary 1333-86-4 proprietary 28.7554 0.7085 0.0207 0.0354 0.4247 0.0076 0.0077 0.0216 0.012 0.0048 0.0048 0.192 0.0048 3.71 0.3739 31.3102 1.1609 1.2313 0.8795 0.0704 0.5277 Package Weight (mg): % weight of substance per Homogeneous material 97.4099% 2.4001% 0.0701% 0.1199% 96.5227% 1.7273% 1.7500% 9.0000% 5.0000% 2.0000% 2.0000% 80.0000% 2.0000% 100.0000% 100.0000% 89.0000% 3.2999% 3.5000% 2.5000% 0.2001% 1.5000% 69.4639 PPM 413,962 10,200 298 510 6,114 109 111 311 173 69 69 2,764 69 53,409 5,383 450,741 16,712 17,726 12,661 1,013 7,597 % weight of substance per package 41.3962% 1.0200% 0.0298% 0.0510% 0.6114% 0.0109% 0.0111% 0.0311% 0.0173% 0.0069% 0.0069% 0.2764% 0.0069% 5.3409% 0.5383% 45.0741% 1.6712% 1.7726% 1.2661% 0.1013% 0.7597% % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 7 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 3: Advanced Semiconductor Engineering Shanghai Package Qualification Report # 084007 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT32ASE Shanghai As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 8 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Lead Frame Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorus Zinc Nickel Palladium Gold Silver Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy resin Silver Acrylate Peroxide Additive Si Au Pd Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary 25.7613 0.6211 0.0106 0.0396 0.3200 0.0100 0.0100 0.0100 0.0360 97.4700% 2.3500% 0.0400% 0.1500% 91.4300% 2.8600% 2.8600% 2.8600% 8.0000% 378,884 9,135 155 583 4,706 147 147 147 529 % weight of substance per package 37.8884 0.9135 0.0155 0.0583 0.4706 0.0147 0.0147 0.0147 0.0529 proprietary 0.0225 5.0000% 331 0.0331 proprietary 0.0045 1.0000% 66 0.0066 proprietary 7440-22-4 proprietary proprietary proprietary 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Proprietary proprietary 1333-86-4 0.0113 0.3465 0.0225 0.0023 0.0045 3.6600 0.3465 0.0035 31.7888 2.9400 1.8375 0.1838 2.5000% 77.0000% 5.0000% 0.5000% 1.0000% 100.0000% 99.0000% 1.0000% 86.5000% 8.0000% 5.0000% 0.5000% 165 5,096 331 33 66 53,829 5,096 51 467,532 43,240 27,025 2,702 0.0165 0.5096 0.0331 0.0033 0.0066 5.3829 0.5096 0.0051 46.7532 4.3240 2.7025 0.2702 CAS Number Package Weight (mg): Weight by mg % weight of substance per Homogeneous material 67.9928 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 9 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 4: Amkor Technology Philippines (P3/P4) Package Qualification Report # 083907 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT32-Amkor Philippines (P3/P4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 10 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Lead Frame Lead Finish Purpose of Use Base material External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper Nickel Silicon Magnesium Nickel Palladium Gold Silver Bismaleimide Methacrylate Ester Polymer Silver Acrylate Si Au Silica Fused Metal hydro oxide Epoxy Resin Phenol Resin Crystalline Silica Carbon Black 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary proprietary proprietary 7440-22-4 proprietary 7440-21-3 7440-57-5 60676-86-0 Proprietary Proprietary proprietary 14808-60-7 1333-86-4 Package Weight (mg): 37.1332 1.1580 0.2509 0.0579 0.5660 0.0120 0.0020 96.2000% 3.0000% 0.6500% 0.1500% 97.5800% 2.0700% 0.3500% 545,115 16,999 3,683 850 8,308 176 30 % weight of substance per package 54.5115 1.6999 0.3683 0.0850 0.8308 0.0176 0.0030 0.0255 0.0255 0.0085 0.6970 0.0935 3.3100 0.5400 15.7560 3.5148 2.1816 2.1816 0.4848 0.1212 3.0000% 3.0000% 1.0000% 82.0000% 11.0000% 100.0000% 100.0000% 65.0000% 14.5000% 9.0000% 9.0000% 2.0000% 0.5000% 374 374 125 10232 1373 48591 7927 231298 51597 32026 32026 7117 1779 0.0374 0.0374 0.0125 1.0232 0.1373 4.8591 0.7927 23.1298 5.1597 3.2026 3.2026 0.7117 0.1779 Weight by mg % weight of substance per Homogeneous material 68.1200 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 11 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 111812, 114907 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT32ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 12 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Gold Ion Impurities Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 28.8109 0.7099 0.0148 0.0444 0.3776 0.0176 0.0048 0.7070 0.0758 % weight of substance per Homogeneo us material 97.4000% 2.4000% 0.0500% 0.1500% 94.3900% 4.4100% 1.2000% 70.0000% 7.5000% 0.0934 0.0354 0.0758 0.0101 0.0126 3.5000 0.3000 0.0000 1.5300 1.0200 2.2440 0.1700 29.0360 9.2500% 3.5000% 7.5000% 1.0000% 1.2500% 100.0000% 99.9900% 0.0100% 4.5000% 3.0000% 6.6000% 0.5000% 85.4000% Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 68.7901 PPM % weight of substance per package 418,824 10,320 215 645 5,489 256 70 10,278 1,101 41.8824 1.0320 0.0215 0.0645 0.5489 0.0256 0.0070 1.0278 0.1101 1,358 514 1,101 147 184 50,879 4,361 0 22,242 14,828 32,621 2,471 422,096 0.1358 0.0514 0.1101 0.0147 0.0184 5.0879 0.4361 0.0000 2.2242 1.4828 3.2621 0.2471 42.2096 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 13 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 35.0280 0.8820 0.0324 0.0576 0.4653 0.0218 0.0059 0.2940 0.0315 % weight of substance per Homogeneo us material 97.3000 2.4500 0.0900 0.1600 94.3880 4.4120 1.2000 70.0000 7.5000 0.0389 0.0147 0.0315 0.0042 0.0053 3.5740 0.1400 1.0953 0.7302 1.6064 0.1217 20.7864 9.2500 3.5000 7.5000 1.0000 1.2500 100.0000 100.0000 4.5000 3.0000 6.6000 0.5000 85.4000 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 64.9671 PPM % weight of substance per package 539,166 13,576 499 887 7,163 335 91 4,525 485 53.9166 1.3576 0.0499 0.0887 0.7163 0.0335 0.0091 0.4525 0.0485 598 226 485 65 81 55,012 2,154 16,859 11,240 24,727 1,873 319,953 0.0598 0.0226 0.0485 0.0065 0.0081 5.5012 0.2154 1.6859 1.1240 2.4727 0.1873 31.9953 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 14 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package Document History Page Document Title: 32L - QFN 5X5X1.0 MM (SAW VERSION) PB-FREE PACKAGE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-43056 Rev. ECN No. ** *A 1728304 2559346 *B 2599417 Orig. of Description of Change Change DPT Initial spec release. OKO Include Autoline CML for additional site of 32LT QFN Removed Lead Substance on the Leadframe material based on MSDS, Removed the Material name for Leadframe and Adhesive. DPT Add ASE Shanghai for additional site of 32QFN (LT32B). Changed body thickness from 5X5X0.93mm to 5X5X1.0mm per POD#001-30999 in Document title. *C *D *E 2611720 2703729 2826390 Dcon DPT HLR HLR *F 3261110 VFR *G 3429897 HLR *H 3473917 VFR *I 3533023 COPI *J 4055149 YUM Removed inactive distribution CML to WEB Add Amkor Phil (P3) for additional site of 32QFN (LT32B). Added Assembly Site 5. QTP No. 085001 – Nitto 7470. Changed referenced QTP No. 085001 on Assembly site 5 to QTP No. 093803. Revised the material composition table of assembly site 5 based on the materials indicated on the qualification report. Changed Package weight of Assembly Site 5. Added Assembly Site 6 – ASE Taiwan (G). Reference QTP # 111812. Updated the material composition table for Assembly Sites 1 to 6 to reflect 4 decimal places on values. Added Assembly Site 7 – ASE Taiwan (G) Copper wire qualification. Reference QTP # 114907. Added Assembly Site 8 – AUTOLINE RA Copper wire qualification. Reference QTP # 120204. Added assembly site name in the Assembly heading in site 1, 2, 3, 4 and 5. Changed Assembly code to assembly site name in site 1, 2, 3, 4 and 5. Removed Tube in the Indirect Materials section. Consolidate material composition in one assembly site. 1. CML 2. ASET Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 15 of 16 32L – QFN 5X5X1.0 mm (Saw Version) Pb-Free Package Document History Page Document Title: 32L - QFN 5X5X1.0 MM (SAW VERSION) PB-FREE PACKAGE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-43056 Rev. ECN No. *K 4081278 *L *M 4572853 5026871 Orig. of Description of Change Change YUM Edited header and corrected the package size (5x5x0.93) to (5x5x1.0) and added the “Saw Version”. HLR Sunset Due – No Change HLR Changed the substances with “------------- and Proprietary “to “Trade Secret”. MEL Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-43056 Rev. *M Page 16 of 16