32L - TQFP (7X7X1.4MM) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 AZ B1: 152.9087 mg B2: 179.9871 mg Body Size (mil/mm) Package Weight – Site 2 7x7x1.4 mm 134.0000 mg SUMMARY The 32L-TQFP Pb-Free package is qualified at two assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101, 120201 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ32ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 1 of 7 32L - TQFP (7X7X1.4MM) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number 21.8910 0.7488 0.1593 0.0391 5.0991 4.4000 % weight of substance per Homogenous material 78.3500% 2.6800% 0.5700% 0.1400% 18.2500% 100.0000% 143,164 4,897 1,042 256 33,347 28,775 14.3164% 0.4897% 0.1042% 0.0256% 3.3347% 2.8775% Weight by mg PPM % weight of substance per package Copper Nickel Silicon Magnesium Silver Tin 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-31-5 Epoxy Resin Silver Metal Silicon Gold Ion Impurities Epoxy Resin Phenol Resin Aromatic Phosphate Silica Others Proprietary 7440-22-4 Proprietary 7440-21-3 7440-57-5 Proprietary 85954-11-6 26834-02-6 139189-30-3 0.1600 0.8700 0.0600 6.0000 1.4000 0.0001 5.6035 4.4716 1.6811 14.6800% 79.8200% 5.5000% 100.0000% 100.0000% 0.0100% 5.0000% 3.9900% 1.5000% 1,046 5,690 392 39,239 9,156 1 36,646 29,244 10,994 0.1046% 0.5690% 0.0392% 3.9239% 0.9156% 0.0001% 3.6646% 2.9244% 1.0994% 60676-86-0 Trade Secret 99.2044 1.1207 88.5200% 1.0000% 648,782 7,329 64.8782% 0.7329% Package Weight (mg): 152.9087 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 2 of 7 32L - TQFP (7X7X1.4MM) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper wire material Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Nickel Silicon Magnesium Silver Tin Silver Epoxy Resin A Epoxy Resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Silicon Copper (Cu) Epoxy Resin A Epoxy, Cresol Novolac Phenol Resin Metal Hydroxide Carbon Black Silica, Crystalline Silica Fused B Silica Fused A 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-31-5 67.6131 1.7925 0.3585 0.0717 1.8642 3.7400 % weight of substance per Homogenous material 94.3000% 2.5000% 0.5000% 0.1000% 2.6000% 100.0000% 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 0.3874 0.0198 0.0198 0.0198 0.0198 0.0248 78.1000% 4.0000% 4.0000% 4.0000% 4.0000% 5.0000% 2152 110 110 110 110 138 0.2152% 0.0110% 0.0110% 0.0110% 0.0110% 0.0138% 461-58-5 Trade secret 0.0015 0.0030 0.3000% 0.6000% 8 17 0.0008% 0.0017% 7440-21-3 7440-50-8 Trade secret 29690-82-2 3.4810 0.1800 4.0156 4.0156 100.0000% 100.0000% 4.0000% 4.0000% 19340 1000 22311 22311 1.9340% 0.1000% 2.2311% 2.2311% Trade secret Trade secret 1333-86-4 14808-60-7 4.0156 4.0156 0.4016 0.2008 4.0000% 4.0000% 0.4000% 0.2000% 22311 22311 2231 1116 2.2311% 2.2311% 0.2231% 0.1116% 7631-86-9 60676-86-0 5.4211 78.3043 5.4000% 78.0000% 30119 435055 3.0119% 43.5055% CAS Number Package Weight (mg): Weight by mg 179.9871 PPM % weight of substance per package 375655 9959 1992 398 10357 20779 37.5655% 0.9959% 0.1992% 0.0398% 1.0357% 2.0779% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 3 of 7 32L - TQFP (7X7X1.4MM) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 4 of 7 32L - TQFP (7X7X1.4MM) Pb-Free Package ASSEMBLY Site 2: Amkor Technology Bupyeong Korea Package Qualification Report # 034602 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ32Amkor Bupyeong As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 5 of 7 32L - TQFP (7X7X1.4MM) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu 7440-50-8 42.6495 % weight of substance per Homogenous material 97.4400% Cr Sn 7440-47-3 7440-31-5 0.1313 0.1094 0.3000% 0.2500% 980 817 0.0980% 0.0817% Zn Ag Pure Sn 7440-66-6 7440-22-4 7440-31-5 0.0788 0.8010 2.5300 0.1800% 1.8300% 100.0000% 588 5,978 18,881 0.0588% 0.5978% 1.8881% Ag Epoxy Resin Anhydride Si Au Multi-aromatic Resin SiO2 Carbon Black 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 0.1900 0.6700 0.0900 3.4600 1.1100 9.4507 20.0000% 70.5300% 9.4700% 100.0000% 100.0000% 11.5000% 1,418 5,000 671 25,821 8,284 70,528 0.1418% 0.5000% 0.0671% 2.5821% 0.8284% 7.0528% 72.3102 0.4191 87.9900% 0.5100% 539,628 3,128 53.9628% 0.3128% Substance Composition CAS Number 60676-86-0 1333-86-4 Package Weight (mg): Weight by mg 134.0000 318,280 % weight of substance per package 31.8280% PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 6 of 7 32L - TQFP (7X7X1.4MM) Pb-Free Package Document History Page Document Title: Document Number: 32L-TQFP 7X7X1.4MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05016 Rev. ECN No. Orig. of Change ** 399402 YXP *A 412826 YXP *B 2614465 HLR *C *D Dcon 2793268 HLR 3473256 HLR *E 3560005 EBZ *F 4032211 YUM *G 4083873 YUM *H *I 4617357 HLR 5083865 HLR MEL Description of Change New Specification Combined data of PMDD with spec 001-04357 (32L-TQFP 7x7x1.0mm). Changed spec title (deleted package size – 7x7x1.4 mm) to cover both package sizes of 32L-TQFP. Edited summary section, for Site 2 package weight and body size. Updated PMDD form with the below changes: Added “(PMDD)” at header section Edited footnote Changed Cypress Logo. Changed the CAS Number of Gold. Added the %weight of homogenous on material composition table. Completed the RoHS substance on Indirect Material table. Updated Document Title. Replaced CML with WEB in distribution list. Changed Assembly code for Assembly Site 2 – M to Q. Updated the material composition table to reflect 4 decimal places on values Added package weight B2 for Site 1. Added Material Composition table B2 using copper wire material for Site 1. Added reference QTP #120201 for Site 1. Added assembly site name in the Assembly heading in site 1 and 2. Changed Assembly code to Assembly Site Name in site 1 and 2. Changed the body size from “7x7mm” to “7x7x1.4mm” to align it to the Document title. Sunset Due – No Change Changed the substances with “------------- “to “Trade Secret. Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05016 Rev. *I Page 7 of 7