40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LQ B1. 67.7583 mg B2. 65.7172mg Body Size (mil/mm) Package Weight – Site 2 6X6X0.6 mm B1.60.1039 mg B2. 60.9100 mg SUMMARY The QFN 40L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434-24LQXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 123807, 141702 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ40CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 1 of 7 40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free B1. MATERIAL COMPOSITION (Note 3) Copper Wire Material Purpose of Use Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous material 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 34.6900 1.0200 0.2450 0.0500 0.7076 0.0098 0.0098 0.3540 96.3478% 2.8329% 0.6805% 0.1389% 97.3047% 1.3476% 1.3476% 73.5508% 511,967 15,053 3,616 738 10,443 145 145 5,224 51.1967% 1.5053% 0.3616% 0.0738% 1.0443% 0.0145% 0.0145% 0.5224% Trade Secret 0.0998 20.7355% 1,473 0.1473% Trade Secret 0.0090 1.8699% 133 0.0133% Trade Secret Trade Secret 7440-21-3 0.0100 0.0085 7.0448 2.0777% 1.7661% 100.0000% 148 125 103,969 0.0148% 0.0125% 10.3969% 2.5400 100.0000% 37,486 3.7486% 85.1146% 3.5782% 4.2462% 4.0553% 0.4294% 2.5763% 263,289 11,069 13,135 12,545 1,328 7,969 26.3289% 1.1069% 1.3135% 1.2545% 0.1328% 0.7969% % Total: 100.0000 Die Circuit Copper Nickel Silicon Magnesium Nickel Palladium Gold Silver Carbocyclic Acrylate Bismaleimaide Resin Additive Acrylate ester Silicon Wire Interconnect Copper 7440-50-8 Encapsulation SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Others 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 Trade Secret 17.8400 0.7500 0.8900 0.8500 0.0900 0.5400 Package Weight (mg): 67.7583 Leadframe Base Material Lead Finish External Plating Die Attach Mold Compound Adhesive PPM % weight of substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 2 of 7 40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free B2 MATERIAL COMPOSITION (Note 3) Copper-Palladium Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation 33.9561 0.8765 0.1234 0.0523 0.7465 0.0026 0.0013 0.3477 % weight of substance per Homogeneous material 96.9944% 2.5037% 0.3525% 0.1494% 99.4803% 0.3465% 0.1732% 73.4940% 516,700 13,337 1,878 796 11,359 40 20 5,291 51.6700% 1.3337% 0.1878% 0.0796% 1.1359% 0.0040% 0.0020% 0.5291% Trade Secret 0.0968 20.4608% 1,473 0.1473% Trade Secret 0.0098 2.0714% 149 0.0149% Trade Secret Trade Secret 7440-21-3 7440-50-8 0.0095 0.0093 6.8155 2.5819 2.0080% 1.9658% 100.0000% 145 142 103,710 39,288 0.0145% 0.0142% 10.3710% 3.9288% 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 Trade Secret 0.0002 16.6212 0.6327 0.8439 0.8454 0.1297 1.0149 3 252,920 9,628 12,841 12,864 1,974 15,443 0.0003% 25.2920% 0.9628% 1.2841% 1.2864% 0.1974% 1.5443% Package Weight (mg): 65.7172 % Total: 100.0000 Substance Composition CAS Number Weight by mg Copper Nickel Silicon Magnesium Nickel Palladium Gold Silver Carbocyclic Acrylate Bismaleimaide Resin Acrylate ester Additive Silicon Copper 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crytalline 99.9923% 0.0077% 82.7428% 3.1497% 4.2011% 4.2085% 0.6457% 5.0523% PPM % weight of substance per package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 3 of 7 40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 130902, 134515 (See Note 1) I. DECLARATION OF PACKAGED UNITS B. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ40ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 4 of 7 40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free B1. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper Iron Phosphorus Zinc Nickel Palladium Gold Epoxy Resin Phenol Resin SiO2 Filler Acrylic Copolymer Silicon Copper Epoxy Resin-A Epoxy Resin-B Phenol Resin Carbon Black Silica fused Silica fused Silica, crystalline * 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade secret Trade secret Trade secret 1333-86-4 60676-86-0 76361-86-9 14808-60-7 Package Weight (mg): Weight by mg 24.1800 0.5828 0.0074 0.0298 0.5820 0.0150 0.0030 0.1248 0.1248 0.0520 0.7384 3.6000 1.6497 0.8520 0.8520 1.4910 0.1136 22.1520 2.8400 0.1136 60.1039 % weight of substance per Homogeneous material 97.5000% 2.3500% 0.0300% 0.1200% 97.0000% 2.5000% 0.5000% 12.0000% 12.0000% 5.0000% 71.0000% 100.0000% 100.0000% 2.9985% 2.9985% 5.2474% 0.3998% 77.9610% 9.9950% 0.3998% PPM % weight of substance per package 402,304 9,697 124 495 9,683 250 50 2,076 2,076 865 12,285 59,896 27,447 14,175 14,175 24,807 1,890 368,563 47,252 1,890 40.2304% 0.9697% 0.0124% 0.0495% 0.9683% 0.0250% 0.0050% 0.2076% 0.2076% 0.0865% 1.2285% 5.9896% 2.7447% 1.4175% 1.4175% 2.4807% 0.1890% 36.8563% 4.7252% 0.1890% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 5 of 7 40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free B2. MATERIAL COMPOSITION (Note 3) Using CuPd Wire Material Purpose of Use Substance Composition Leadframe Base Material Copper Iron Phosphorus Zinc Lead Finish External Plating Sn Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-31-5 Novolak Epoxy Resin Phenol Resin Amorphous Silica Acrylic Copolymer Silicon Copper Palladium Epoxy Resin Phenol Resin Silica(Amorphous) A Silica(Amorphous) B Carbon Black Trade Secret Trade Secret 68611-44-9 Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade secret Trade secret 60676-86-0 76361-86-9 1333-86-4 Package Weight (mg): 24.1800 0.5828 0.0074 0.0298 % weight of substance per Homogeneous material 97.5000% 2.3500% 0.0300% 0.1200% 396,979 9,568 122 489 39.7000% 0.9600% 0.0100% 0.0500% 1.4200 100.0000% 23313 2.3300% 2,049 0.2000% 2,049 854 12,123 59,104 27,084 5 37,301 18,650 0.2000% 0.0900% 1.2100% 5.9100% 2.6950% 0.0050% 3.7300% 1.8700% 370,212 37.0200% 37,301 3.7300% 2,798 0.2800% % Total: 100.0000 Weight by mg 0.1248 0.1248 0.0520 0.7384 3.6000 1.6497 0.0003 2.2720 1.1360 22.5496 2.2720 0.1704 PPM 12.0000% 12.0000% 5.0000% 71.0000% 100.0000% 99.9800% 0.0200% 8.0000% 4.0000% 79.4000% 8.0000% 0.6000% 60.9100 % weight of substance per package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 6 of 7 40L – QFN 6X6X0.6 mm (Saw Version) Pb-Free Document History Page Document Title: Document Number: Rev. 40L - QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-86585 ** *A ECN No. Orig. of Change 3929717 AWP 4066975 YUM *B 4248774 JARG *C 4370018 AWP *D 4943171 YUM DCON Description of Change Initial spec release. Added assembly site name in the assembly heading. Changed assembly code to assembly site name. Removed entire Tube row in the Indirect Materials section. Added material composition for Assembly Site 2 – ASE Taiwan. Reference QTP 130902. Added B1 to identify Copper and also added the whole table of B2 for the Copper-Palladium wire reference-QTP#141702 for Assembly Site 1. Added material composition for Assembly Site 2 – ASE Taiwan. Reference QTP 134515. Removed distribution and posting. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-86585 Rev. *D Page 7 of 7