16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 LG B1 : 13.9899 mg B2 : 15.1901 mg 16.7999 mg Package Weight – Site 5 12.7001 mg Body Size (mil/mm) Package Weight – Site 2 3x3x0.6mm 20.5801 mg Package Weight – Site 4 B1 : 13.8347 mg B2 : 13.0455 mg B3 : 19.7932 mg SUMMARY The QFN COL 16L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2) Package Qualification Report #063602, 104001 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LG16Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 1 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1 : NiPdAu with Hitachi Mold Compound Material Leadframe Purpose of Use Base Material Frame Plating Lead Finish Die Attach External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ag Ni Pd Au Specific EpoxyResin Bisphenol A Glycidylether Fused Silica Additive Si Au Epoxy Resin-1 Epoxy Resin-2 Phenol resin Silica Fused Carbon Black Metal Hydroxide Others CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-22-4 7440-02-0 7440-05-3 7440-57-5 ( Trade secret ) 25068-38-6 60676-86-0 -------------------7440-21-3 7440-57-5 ( Trade secret ) ( Trade secret ) ( Trade secret ) 60676-86-0 1333-86-4 ( Trade secret ) -------------------- Package Weight (mg): Weight by mg 5.9079 0.0401 0.0090 0.0329 0.1867 0.0031 0.0002 0.0210 % weight of substance per Homogeneous material 98.6300% 0.6700% 0.1500% 0.5500% 98.2400% 1.6300% 0.1300% 422,297 2,869 642 2,355 13,342 221 18 1,501 % weight of substance per package 42.2297% 0.2869% 0.0642% 0.2355% 1.3342% 0.0221% 0.0018% 0.1501% 500 0.0500% 7,005 1,001 85,061 4,289 18,356 9,178 13,767 379,969 918 22,945 13,767 0.7005% 0.1001% 8.5061% 0.4289% 1.8356% 0.9178% 1.3767% 37.9969% 0.0918% 2.2945% 1.3767% % Total: 100.0000 PPM 15.0000% 0.0070 0.0980 0.0140 1.1900 0.0600 0.2568 0.1284 0.1926 5.3158 0.0128 0.3210 0.1926 13.9899 5.0000% 70.0000% 10.0000% 100.0000% 100.0000% 4.0000% 2.0000% 3.0000% 82.8000% 0.2000% 5.0000% 3.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 2 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B2 : NiPdAu-Ag with Sumitomo Mold Compound Material Substance Composition Purpose of Use Leadframe Base Material Lead Finish External Plating Cu Si Ni Mg Ni Pd Au-Ag Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Epoxy Silica Bisphenol Additive Si Au Others Silica Fused Epoxy Resin Phenol resin Carbon Black CAS Number 7440-50-8 7440-21-3 7440-02-0 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary 7631-86-9 Proprietary Proprietary 7440-21-3 7440-57-5 --------------------60676-86-0 ( Trade secret ) ( Trade secret ) 1333-86-4 Package Weight (mg): 7.0996 0.0480 0.2214 0.0111 0.0098 0.0002 % weight of substance per Homogeneous material 96.2000% 0.6500% 3.0000% 0.1500% 97.5400% 2.0700% 467384 3158 14575 729 642 14 46.7384% 0.3158% 1.4575% 0.0729% 0.0642% 0.0014% 0.0000 0.3900 3 0.0003% 0.0300 0.1400 0.0100 0.0200 0.4100 0.0693 0.0007 6.1944 0.5340 0.3560 0.0356 15.0000% 70.0000% 5.0000% 10.0000% 100.0000% 99.0400% 0.9600% 87.0000% 7.5000% 5.0000% 0.5000% 1975 9217 658 1317 26991 4564 44 407795 35155 23436 2344 0.1975% 0.9217% 0.0658% 0.1317% 2.6991% 0.4564% 0.0044% 40.7795% 3.5155% 2.3436% 0.2344% Weight by mg 15.1901 % weight of substance per package PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 5.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 0.5 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 0.16 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 0.5 <2.0 PBB PPM <0.0005 <0.0005 <50.0 ------<5.0 PBDE PPM <0.0005 <0.0005 <45.0 -------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 3 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package ASSEMBLY Site 2 – CARSEM Malaysia Package Qualification Report #100303 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LG16CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 4 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Ni Mg Ni Pd Au Treated silica Glycol ethers Metal Oxide Curing agent & hardener Epoxy resin Si Au Silica Fused Epoxy Resin Phenol resin Carbon Black 7440-50-8 7440-21-3 7440-02-0 7439-95-4 7440-02-0 7440-05-3 7440-57-5 Proprietary Proprietary Proprietary Proprietary 9.2927 0.0485 0.3392 0.0097 0.1091 0.0095 0.0014 0.0024 0.0066 0.0093 0.0024 95.9000% 0.5000% 3.5000% 0.1000% 90.9100% 7.9100% 1.1900% 8.0000% 22.0000% 31.0000% 8.0000% 451,541 2,354 16,480 471 5,301 461 69 117 321 452 117 % weight of substance per package 45.1541% 0.2354% 1.6480% 0.0471% 0.5301% 0.0461% 0.0069% 0.0117% 0.0321% 0.0452% 0.0117% -------------------7440-21-3 7440-57-5 60676-86-0 ( Trade secret ) ( Trade secret ) 1333-86-4 0.0093 0.4100 0.2000 9.4918 0.3039 0.3039 0.0304 31.0000% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 452 19,922 9,718 461,215 14,767 14,767 1,477 0.0452% 1.9922% 0.9718% 46.1215% 1.4767% 1.4767% 0.1477% CAS Number Package Weight (mg): % weight of substance per Homogeneous material Weight by mg 20.5801 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 5.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 0.5 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 0.16 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 0.5 <2.0 PBB PPM <0.0005 <0.0005 <50.0 ------<5.0 PBDE PPM <0.0005 <0.0005 <45.0 -------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 5 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package ASSEMBLY Site 3: Amkor Technology Seoul Korea Package Qualification Report 104205 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LG16-AMKOR Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 6 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose Leadframe Base material Leadfinish External Plating Die Attach Die Wire Mold compound Adhesive Circuit Interconnect Encapsulation % weight of substance per Homogenous material % weight of substance per package Substance Composition CAS Number Weight by mg Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) Nickel (Ni) Palladium (Pd) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7.0997 0.2001 0.0478 0.0103 0.2162 0.0051 96.4900% 2.7200% 0.6500% 0.1400% 96.9400% 2.2800% 422603 11913 2847 613 12868 303 42.2603% 1.1913% 0.2847% 0.0613% 1.2868% 0.0303% Gold-Silver (Au-Ag) 7440-57-5 / 7440-22-4 Epoxy resin Silica Silicon Gold (Au) Epoxy resin Phenolic resin Proprietary Proprietary 7440-21-3 7440-57-5 Proprietary Proprietary 0.0017 0.2058 0.0042 1.8600 0.0750 0.5298 0.3502 0.7800% 98.0000% 2.0000% 100.0000% 100.0000% 7.4900% 4.9500% 104 12250 250 110714 4464 31538 20843 0.0104% 1.2250% 0.0250% 11.0714% 0.4464% 3.1538% 2.0843% Silica, vitreous (SiO2) 60676-86-0 Carbon black 1333-86-4 6.1600 0.0198 87.0800% 0.2800% 366669 1179 36.6669% 0.1179% Bismuth compounds Proprietary 0.0071 0.1000% 421 0.0421% Organic phosphorous compounds Proprietary 0.0071 0.1000% 421 0.0421% % Total: 100.0000 Package Weight (mg): 16.7999 PPM II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 5.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 0.5 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 0.16 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 0.5 <2.0 PBB PPM <0.0005 <0.0005 <50.0 ------<5.0 PBDE PPM <0.0005 <0.0005 <45.0 -------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 7 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package ASSEMBLY Site 4: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 112603, 114903, 132901 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LG16ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 8 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: Gold Wire Material Purpose Leadframe Base material Leadfinish External Plating Die Attach Die Wire Mold compound Adhesive Circuit Interconnect Encapsulation % weight of substance per Homogenous material % weight of substance per package Substance Composition CAS Number Weight by mg Nickel (Ni) Silicon (Si) Magnesium (Mg) Copper (Cu) Nickel (Ni) Palladium (Pd) 7440-02-0 7440-21-3 7439-95-4 7440-50-8 7440-02-0 7440-05-3 0.1648 0.0386 0.0093 4.9378 0.1201 0.0049 3.2000% 0.7500% 0.1800% 95.8800% 93.8500% 3.8400% 11,912 2,792 670 356,911 8,681 355 1.1912 0.2792 0.0670 35.6911 0.8681 0.0355 Gold-Silver (Au-Ag) 7440-57-5 7440-22-4 Epoxy Resin Phenol Resin SiO2 Filler Acrylic copolymer Silicon (Si) Gold (Au) Epoxy Resin A Epoxy Resin B 64425-84-4 Proprietary Proprietary Proprietary 7440-21-3 7440-57-5 Proprietary Proprietary 0.0030 0.1638 0.1638 0.0683 0.9694 0.9000 0.0500 0.2808 0.1872 2.3100% 12.0000% 12.0000% 5.0000% 71.0000% 100.0000% 100.0000% 4.5000% 3.0000% 214 11,843 11,843 4,935 70,072 65,053 3,614 20,300 13,533 0.0214 1.1843 1.1843 0.4935 7.0072 6.5053 0.3614 2.0300 1.3533 Phenol Resin Proprietary Carbon Black 1333-86-4 0.4119 0.0312 6.6000% 0.5000% 29,773 2,256 2.9773 0.2256 Silica Fused 60676-86-0 5.3298 85.4000% 385,244 38.5244 Package Weight (mg): 13.8347 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 9 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B2: Copper Wire Material Leadframe Purpose Base material Substance Composition Nickel Silicon Magnesium Copper External Plating Adhesive Circuit Interconnect 12630 2960 710 378438 1.2630% 0.2960% 0.0710% 37.8438% 0.0030 0.0050 2.3485% 3.9379% 230 386 0.0230% 0.0386% Nickel 7440-02-0 0.1198 93.7136% 9185 0.9185% Epoxy Resin 64425-84-4 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade secret Trade secret Trade secret 0.0468 12.0000% 3587 0.3587% 0.0468 12.0000% 3587 0.3587% 0.0195 5.0000% 1495 0.1495% 0.2769 71.0000% 21226 2.1226% 1.5280 100.0000% 117130 11.7130% 0.0200 100.0000% 1533 0.1533% 0.2624 4.5000% 20111 2.0111% 0.1749 3.0000% 13407 1.3407% Palladium SiO2 Filler Si Copper Epoxy Resin A Epoxy Resin B Mold compound Encapsulation PPM % weight of substance per package 3.1997% 0.7499% 0.1800% 95.8704% Acrylic Copolymer Die Wire % weight of substance per Homogenous material 0.1648 0.0386 0.0093 4.9369 Phenol Resin Die Attach Weight by mg 7440-02-0 7440-21-3 7439-95-4 7440-50-8 7440-57-5 7440-22-4 7440-05-3 Gold-Silver Leadfinish CAS Number Phenol Resin Carbon Black 1333-86-4 0.3848 0.0292 6.6000% 0.5000% 29496 2235 2.9496% 0.2235% Silica Fused 60676-86-0 4.9788 85.4000% 381654 38.1654% Package Weight (mg): 13.0455 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 10 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B3: Copper-Palladium Wire Material Purpose Leadframe Base material Leadfinish External Plating Die Attach Adhesive Die Wire Mold compound Circuit Interconnect Encapsulation Substance Composition Copper Nickel Silicon Magnesium Sn Phenol Resin Novolak Epoxy Resin Amorphous Silica Acrylic Copolymer Si Copper Palladium Epoxy Resin Phenol Resin CAS Number % weight of substance per Homogenous material Weight by mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-57-5 Trade Secret 6.8302 0.2130 0.0462 0.0107 1.9000 0.0748 96.2000 3.0000 0.6500 0.1500 100.0000 12.0000 Trade Secret 0.0748 12.0000 68611-44-9 0.0374 6.0000 Trade Secret 0.4361 70.0000 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret 1.9200 0.6099 0.0001 0.6112 0.4584 100.0000 99.9800 0.0200 8.0000 6.0000 Carbon Black 1333-86-4 0.0229 0.3000 Silica Fused 60676-86-0 6.5475 85.7000 Package Weight (mg): 19.7932 PPM % weight of substance per package 345,078 10,761 2,334 541 95,993 3,779 34.5078 1.0761 0.2334 0.0541 9.5993 0.3779 3,779 0.3779 1,890 0.1890 22,033 97,003 30,814 5 30,879 23,159 2.2033 9.7003 3.0814 0.0005 3.0879 2.3159 1,157 330,795 0.1157 33.0795 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 5.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 0.5 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 0.16 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 0.5 <2.0 PBB PPM <0.0005 <0.0005 <50.0 ------<5.0 PBDE PPM <0.0005 <0.0005 <45.0 -------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 11 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package ASSEMBLY Site 5: Cypress Manufacturing Ltd. (CML) Package Qualification Report # 132703 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LG16CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 12 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Copper-Palladium Wire Material Purpose Leadframe Base material Leadfinish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold compound Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material % weight of substance per package PPM Copper Nickel Silicon Magnesium Nickel Palladium 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 2.9699 0.0926 0.0201 0.0046 0.0620 0.0011 96.2000 3.0000 0.6500 0.1500 96.5204 1.7370 233,853 7,293 1,580 365 4,883 88 23.3853 0.7293 0.1580 0.0365 0.4883 0.0088 Gold 7440-57-5 0.0006 0.8713 44 0.0044 Silver 7440-22-4 0.0006 0.1823 0.0391 0.8713 70.0000 15.0000 44 14,354 3,076 0.0044 1.4354 0.3076 13.0000 2.0000 100.0000 99.0000 1.0000 87.7500 5.0000 2,666 410 287,089 17,272 174 374,524 21,340 0.2666 0.0410 28.7089 1.7272 0.0174 37.4524 2.1340 7.0000 0.2500 29,877 1,067 2.9877 0.1067 Fused Silica Epoxy Resin Bisphenol A Glycidylether Additive Si Copper Palladium 60676-86-0 Trade Secret 25068-38-6 Trade Secret 7440-21-3 7440-50-8 7440-05-3 SiO2 Phenol Resin 60676-86-0 Trade secret 0.0339 0.0052 3.6460 0.2194 0.0022 4.7565 0.2710 Epoxy Resin Carbon Black Trade secret 1333-86-4 0.3794 0.0136 Encapsulation Package Weight (mg): 12.7001 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 5.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 0.5 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 0.16 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 0.5 <2.0 PBB PPM <0.0005 <0.0005 <50.0 ------<5.0 PBDE PPM <0.0005 <0.0005 <45.0 -------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 13 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package Document History Page Document Title: 16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-11888 Rev. ** *A ECN No. Orig. of Change 602896 EBZ 2741730 MAHA *B Dcon 2889372 EBZ *C 3072300 JSO *D *E 3103478 NKZ 3210958 MAHA *F *G *H 3260116 VFR 3304831 VFR 3422772 HLR *I 3464531 EBZ *J 4052625 YUM *K 4113495 HLR Description of Change Initial spec release. Corrected the package weight of assembly site 1 on page 1. Corrected the following data on the material composition table of assembly site 1: a. Weight by mg b. % weight of substance per Homogeneous material c. % weight of substance per package d. Package weight Change CML to WEB in distribution list. Included additional assembly site Carsem Malaysia (CA) Corrected title in the document history page to match the title in the header. Included assembly site #3 Added B2 Corrected Material Composition in Assembly 3. Corrected the QTP number of assembly site 2 from 0100303 to 100303. Added QTP # 104903 to Assembly Site 3 Added PMDD for Site 4. Updated the material composition table for Assembly Sites 1 to 4 to reflect 4 decimal places on values. Added QTP # 114903 to Assembly Site 4. Added package weight B2 for Site 4. Added B1 Gold Wire for Material Composition table for Site-4. Added Material Composition table B2 Copper Wire for Site-4 Added assembly site name in the Assembly heading in site 1, 2, 3 and 4. Changed Assembly code to Assembly site name in site 1, 2, 3 and 4. Removed entire Tube row in the Indirect materials section. Added CuPd material composition for Assembly Site 4. Added Assembly Site 5 for CML – CuPd. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 14 of 15 16L – QFN 3x3x0.6mm Chip On Leads (Saw Version) Pb-Free Package Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-11888 Rev. *K Page 15 of 15