TSL2591 datasheet

TSL2591
Datasheet - Apr. 2013 - ams163.5
General Description
The TSL2591 is a very-high sensitivity light-to-digital converter
that transforms light intensity into a digital signal output
capable of direct I 2C interface. The device combines one
broadband photodiode (visible plus infrared) and one
infrared-responding photodiode on a single CMOS integrated
circuit. Two integrating ADCs convert the photodiode currents
into a digital output that represents the irradiance measured on
each channel. This digital output can be input to a
microprocessor where illuminance (ambient light level) in lux is
derived using an empirical formula to approximate the human
eye response. The TSL2591 supports a traditional level style
interrupt that remains asserted until the firmware clears it.
Figure TSL2591 – 1:
Key Benefits and Features
Benefits
Features
Approximates Human Eye Response
Dual Diode
Flexible Operation
Programmable Analog Gain and Integration Time
Suited for Operation Behind Dark Glass
600M:1 Dynamic Range
Low Operating Overhead
Low Power 3.0 μA Sleep State
I2C Fast Mode Compatible Interface
Datasheet - Apr. 2013 - ams163.5
• Two Internal Interrupt Sources
• Programmable Upper and Lower Thresholds
• One Interrupt Includes Programmable Persistence Filter
User Selectable Sleep Mode
• Data Rates up to 400 kbit/s
• Input Voltage Levels Compatible with 3.0V Bus
TSL2591 – 1
Figure TSL2591 – 2:
Block Diagram
Detailed Description
The TSL2591 contains two integrating analog-to-digital
converters (ADC) that integrate currents from two photodiodes.
Integration of both channels occurs simultaneously. Upon
completion of the conversion cycle, the conversion result is
transferred to the Channel 0 and Channel 1 data registers,
respectively. The transfers are double-buffered to ensure that
the integrity of the data is maintained. After the transfer, the
device automatically begins the next integration cycle.
Communication with the device is accomplished through a
standard, two-wire I 2C serial bus. Consequently, the TSL2591
can be easily connected to a microcontroller or embedded
controller. No external circuitry is required for signal
conditioning. Because the output of the device is digital, the
output is effectively immune to noise when compared to an
analog signal.
The TSL2591 also supports an interrupt feature that simplifies
and improves system efficiency by eliminating the need to poll
a sensor for a light intensity value. The primary purpose of the
interrupt function is to detect a meaningful change in light
intensity. The concept of a meaningful change can be defined
by the user both in terms of light intensity and time, or
persistence, of that change in intensity. The device has the
ability to define two sets of thresholds, both above and below
the current light level. An interrupt is generated when the value
of a conversion exceeds either of these limits. One set of
thresholds can be configured to trigger an interrupt only when
the ambient light exceeds them for a configurable amount of
time (persistence) while the other set can be configured to
trigger an immediate interrupt.
TSL2591 – 2
Datasheet - Apr. 2013 - ams163.5
The TSL2591 pin assignments are described below.
Pin Assignment
Figure TSL2591 – 3:
Pin Diagram
Package FN Dual Flat No-Lead (Top
View): Package drawing is not to scale.
SCL
1
6
SDA
INT
2
5
VDD
GND 3
4
NC
Figure TSL2591 – 4:
Pin Description
Pin Number
Pin Name
1
SCL
I2C serial clock input terminal
2
INT
Interrupt — open drain output (active low).
3
GND
Power supply ground. All voltages are referenced to GND.
4
NC
No connect — do not connect.
5
VDD
Supply voltage
6
SDA
I2C serial data I/O terminal
Datasheet - Apr. 2013 - ams163.5
Description
TSL2591 – 3
Ordering Information
Figure TSL2591 – 5:
Ordering Information
Ordering Code
Address
Interface
Delivery form
TSL25911FN
0x29
I2C Vbus = VDD Interface
ODFN-6
TSL25913FN*
0x29
I2C Vbus = 1.8V
ODFN-6
*Contact factory for availability.
Notes:
1. All products are RoHS compliant and ams green.
2. Buy our products or get free samples online at www.ams.com/ICdirect
3. Technical Support is available at www.ams.com/Technical-Support
4. For further information and requests, email us at [email protected]
5. (or) find your local distributor at www.ams.com/distributor
6. Please contact ams for alternate address device availability.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these
or any other conditions beyond those indicated under
“Operating Conditions” is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure TSL2591 – 6:
Absolute Maximum Ratings
Parameter
Min
Supply voltage, VDD
Max
Units
3.8
V
Input terminal voltage
-0.5
3.8
V
Output terminal voltage
-0.5
3.8
V
Output terminal current
-1
20
mA
Storage temperature range, Tstg
-40
85
ºC
2000
V
ESD tolerance, human body model
TSL2591 – 4
Comments
All voltages are with respect to GND
Datasheet - Apr. 2013 - ams163.5
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Electrical Characteristics
Figure TSL2591 – 7:
Recommended Operating Conditions
Symbol
VDD
TA
Parameter
Min
Typ
Max
Units
Supply voltage
2.7
3
3.6
V
Operating free-air temperature
-30
70
ºC
Figure TSL2591 – 8:
Operating Characteristics, VDD=3V, TA =25ºC (unless otherwise noted)
Symbol
Parameter
Conditions
IDD
Supply Current
Active
Sleep state - no I 2C activity
VOL
INT, SDA output low
voltage
3mA sink current
6mA sink current
ILEAK
Leakage current, SDA,
SCL, INT pins
VIH
SCL, SDA input high
voltage
VIL
SCL, SDA input low
voltage
Datasheet - Apr. 2013 - ams163.5
Min
Typ
Max
Units
275
2.3
325
4
μA
0
0
0.4
0.6
V
-5
5
μA
0.7 VDD
V
0.3 VDD
V
TSL2591 – 5
Figure TSL2591 – 9:
ALS Characteristics, VDD=3V, TA=25ºC, AGAIN = Max, AEN=1, (unless otherwise noted) (Notes 1, 2, 3),
Parameter
Conditions
Dark ADC count
value
Ee = 0,
ATIME=000b (100ms)
ADC integration
time step size
ATIME = 000b (100ms)
Channel
Min
CH0
CH1
0
0
Max
Units
25
25
counts
108
ms
1
6
steps
95
ADC number of
integration steps
(Note 4)
Typ
101
ADC counts per
step
ATIME = 000b (100ms)
0
37888
counts
ADC count value
ATIME = 101b (600ms)
0
65535
counts
White light (Note 2)
Ee = 4.98 μW/cm2
ATIME = 000b (100 ms)
CH0
CH1
25500
30000
4996
34500
CH0
CH1
25500
30000
19522
34500
White light (Note 2)
0.116
0.166
0.216
λp = 850 nm (Note 3)
0.456
0.652
0.848
counts
ADC count value
λp = 850 nm (Note 3)
Ee = 5.62 μW/cm2,
ATIME = 000b (100 ms)
ADC count value
ratio: CH1/CH0
White light (Note 2)
ATIME = 000b (100 ms)
CH0
CH1
6024
1003
λp = 850 nm (Note 3)
ATIME = 000b (100 ms)
CH0
CH1
5338
3474
Noise
(Note 4)
White light (Note 2)
Ee = 4.98 μW/cm2
ATIME = 000b (100 ms)
CH0
1
Gain scaling,
relative to 1× gain
setting
AGAIN = Low
AGAIN = Med
AGAIN = High
AGAIN = Max
Re
Irradiance
responsivity
counts
counts/
(μW/cm2)
2
1 standard
deviation
1
25
428
9876
×
Notes:
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible white
LEDs and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production
2. The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 4000 K.
3. The 850 nm irradiance is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength
λ p = 850 nm and spectral halfwidth Δλ½ = 42 nm.
4. Parameter ensured by design and is not 100% tested.
TSL2591 – 6
Datasheet - Apr. 2013 - ams163.5
The timing characteristics of TSL2591 are given below.
Timing Characteristics
Figure TSL2591 – 10:
AC Electrical Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Parameter†
Description
Min
Typ
Max
Units
400
kHz
f(SCL)
Clock frequency (I2C only)
t(BUF)
Bus free time between start and stop
condition
1.3
μs
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
t(HDSTA)
0
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
† Specified by design and characterization; not production tested.
Timing Diagrams
Figure TSL2591 – 11:
Parameter Measurement Information
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 7
Typical Operating Characteristics
Figure TSL2591 – 12:
Spectral Responsivity
Spectral Responsivity: Two channel
response allows for tunable illuminance
(lux) calculation regardless of
transmissivity of glass.
1
0.9
Normalized Responsivity
0.8
CH0
0.7
0.6
0.5
0.4
CH1
0.3
0.2
0.1
0
300
400
500
600
700
800
900 1000 1100
λ - Wavelength - nm
Figure TSL2591 – 13:
White Normalized Responsivity vs. Angular Displacement
White LED Angular Response: Near
cosine angular response for broadband
white light sources.
100%
Response - Normalized to 0º
90%
CH0
80%
70%
60%
50%
40%
30%
20%
CH1
10%
0%
-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90
Incedent Angle - º
TSL2591 – 8
Datasheet - Apr. 2013 - ams163.5
IDD vs. VDD vs. Temp: Effect of supply
voltage and temperature on active
current.
IDD - Active Current Normalized @ 3V, 25ºC
Figure TSL2591 – 14:
Normalized IDD vs. VDD and Temperature
1.2
1.15
75°C
1.1
50°C
25°C
1.05
5°C
1
0.95
0.9
2.7
2.8
2.9
3
3.1
3.2
3.3
3.4
3.5
3.6
VDD - Source Voltage - V
Figure TSL2591 – 15:
Response to White LED vs. Temperature
White LED Response v Temp: Effect of
temperature on the device response for
a broadband white light source.
Response - Normalized to 25ºC
110%
105%
Ch 0
100%
Ch 1
95%
90%
0
10
20
30
40
50
60
70
Temperature - ºC
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 9
The device is controlled and monitored by registers accessed
Register Description
through the I 2C serial interface. These registers provide for a
variety of control functions and can be read to determine results
of the ADC conversions. The register set is summarized in Figure
TSL2591 - 16.
Figure TSL2591 – 16:
Register Description
Address
Register Name
R/W
--
COMMAND
W
0x00
ENABLE
0x01
Register Function
Reset
Value
Specifies Register Address
0x00
R/W
Enables states and interrupts
0x00
CONFIG
R/W
ALS gain and integration time configuration
0x00
0x04
AILTL
R/W
ALS interrupt low threshold low byte
0x00
0x05
AILTH
R/W
ALS interrupt low threshold high byte
0x00
0x06
AIHTL
R/W
ALS interrupt high threshold low byte
0x00
0x07
AIHTH
R/W
ALS interrupt high threshold high byte
0x00
0x08
NPAILTL
R/W
No Persist ALS interrupt low threshold low byte
0x00
0x09
NPAILTH
R/W
No Persist ALS interrupt low threshold high byte
0x00
0x0A
NPAIHTL
R/W
No Persist ALS interrupt high threshold low byte
0x00
0x0B
NPAIHTH
R/W
No Persist ALS interrupt high threshold high
byte
0x00
0x0C
PERSIST
R/W
Interrupt persistence filter
0x00
0x11
PID
R
Package ID
--
0x12
ID
R
Device ID
ID
0x13
STATUS
R
Device status
0x00
0x14
C0DATAL
R
CH0 ADC low data byte
0x00
0x15
C0DATAH
R
CH0 ADC high data byte
0x00
0x16
C1DATAL
R
CH1 ADC low data byte
0x00
0x17
C1DATAH
R
CH1 ADC high data byte
0x00
Note: JGS-Stopped here.
TSL2591 – 10
Datasheet - Apr. 2013 - ams163.5
The COMMAND register specifies the address of the target
register for future read and write operations, as well as issues
special function commands.
Command Register
7
CMD
6
5
4
3
TRANSACTION
Fields
Bits
CMD
7
2
1
0
ADDR/SF
Description
Select Command Register. Must write as 1 when addressing
COMMAND register.
Select type of transaction to follow in subsequent data transfers
FIELD VALUE
TRANSACTION
DESCRIPTION
00
Reserved - Do not use
01
Normal Operation
10
Reserved – Do not use
11
Special Function – See description below
6:5
Address field/special function field. Depending on the transaction
type, see above, this field either specifies a special function
command or selects the specific control-status-data register for
subsequent read and write transactions. The field values listed
below apply only to special function commands.
FIELD VALUE
ADDR/SF
4:0
DESCRIPTION
00100
Interrupt set – forces an interrupt
00110
Clears ALS interrupt
00111
Clears ALS and no persist ALS interrupt
01010
Clears no persist ALS interrupt
other
Reserved – Do not write
The interrupt set special function command sets the interrupt bits
in the status register (0x13). For the interrupt to be visible on the
INT pin, one of the interrupt enable bits in the enable register
(0x00) must be asserted.
The interrupt set special function must be cleared with an interrupt
clear special function. The ALS interrupt clear special functions
clear any pending interrupt(s) and are self-clearing.
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 11
The ENABLE register is used to power the device on/off, enable
functions and interrupts.
Enable Register (0x00)
7
6
5
4
NPIEN
SAI
Reserved
AIEN
3
2
Reserved
1
0
AEN
PON
Fields
Bits
NPIEN
7
No Persist Interrupt Enable. When asserted NP Threshold
conditions will generate an interrupt, bypassing the persist filter.
SAI
6
Sleep after interrupt. When asserted, the device will power down at
the end of an ALS cycle if an interrupt has been generated.
Reserved
5
Reserved. Write as 0.
AIEN
4
ALS Interrupt Enable. When asserted permits ALS interrupts to be
generated, subject to the persist filter.
Reserved
3:2
AEN
1
ALS Enable. This field activates ALS function. Writing a one
activates the ALS. Writing a zero disables the ALS.
PON
0
Power ON. This field activates the internal oscillator to permit the
timers and ADC channels to operate. Writing a one activates the
oscillator. Writing a zero disables the oscillator.
TSL2591 – 12
Description
Reserved. Write as 0.
Datasheet - Apr. 2013 - ams163.5
The CONTROL register is used to configure the ALS gain and
integration time. In addition, a system reset is provided. Upon
power up, the CONTROL register resets to 0x00.
Control Register (0x01)
7
6
SRESET
Reserved
5
4
3
AGAIN
2
1
Reserved
0
ATIME
Fields
Bits
Description
SRESET
7
System reset. When asserted, the device will reset equivalent to a
power-on reset. SRESET is self-clearing.
Reserved
6
Reserved. Write as 0.
ALS gain sets the gain of the internal integration amplifiers for both
photodiode channels.
FIELD VALUE
AGAIN
Reserved
5:4
3
DESCRIPTION
00
Low gain mode
01
Medium gain mode
10
High gain mode
11
Maximum gain mode
Reserved. Write as 0.
ALS time sets the internal ADC integration time for both
photodiode channels.
ATIME
2:0
Datasheet - Apr. 2013 - ams163.5
FIELD VALUE
INTEGRATION TIME
MAX COUNT
000
100 ms
37888
001
200 ms
65535
010
300 ms
65535
011
400 ms
65535
100
500 ms
65535
101
600 ms
65535
TSL2591 – 13
ALS Interrupt Threshold Register
(0x04 − 0x0B)
The ALS interrupt threshold registers provide the values to be
used as the high and low trigger points for the comparison
function for interrupt generation. If C0DATA crosses below the
low threshold specified, or above the higher threshold, an
interrupt is asserted on the interrupt pin.
If the C0DATA exceeds the persist thresholds (registers: 0x04 –
0x07) for the number of persist cycles configured in the PERSIST
register an interrupt will be triggered. If the C0DATA exceeds
the no-persist thresholds (registers: 0x08 – 0x0B) an interrupt
will be triggered immediately following the end of the current
integration.
Note that while the interrupt is observable in the STATUS
register (0x13), it is visible only on the INT pin when AIEN or
NPIEN are enabled in the ENABLE register (0x00).
Upon power up, the interrupt threshold registers default to
0x00.
Register
Address
Bits
AILTL
0x04
7:0
ALS low threshold lower byte
AILTH
0x05
7:0
ALS low threshold upper byte
AIHTL
0x06
7:0
ALS high threshold lower byte
AIHTH
0x07
7:0
ALS high threshold upper byte
NPAILTL
0x08
7:0
No Persist ALS low threshold lower byte
NPAILTH
0x09
7:0
No Persist ALS low threshold upper byte
NPAIHTL
0x0A
7:0
No Persist ALS high threshold lower byte
NPAIHTH
0x0B
7:0
No Persist ALS high threshold upper byte
TSL2591 – 14
Description
Datasheet - Apr. 2013 - ams163.5
The Interrupt persistence filter sets the number of consecutive
out-of-range ALS cycles necessary to generate an interrupt.
Out-of-range is determined by comparing C0DATA (0x14 and
0x15) to the interrupt threshold registers (0x04 - 0x07). Note
that the no-persist ALS interrupt is not affected by the interrupt
persistence filter. Upon power up, the interrupt persistence
filter register resets to 0x00.
PERSIST Register (0x0C)
7
6
5
4
3
2
Reserved
Field
Bits
Reserved
7:4
1
0
APERS
Description
Reserved. Write as 0.
ALS interrupt persistence filter
FIELD VALUE
APERS
PERSISTENCE
0000
Every ALS cycle generates an interrupt
0001
Any value outside of threshold range
0010
2 consecutive values out of range
0011
3 consecutive values out of range
0100
5 consecutive values out of range
0101
10 consecutive values out of range
0110
15 consecutive values out of range
0111
20 consecutive values out of range
1000
25 consecutive values out of range
1001
30 consecutive values out of range
1010
35 consecutive values out of range
1011
40 consecutive values out of range
1100
45 consecutive values out of range
1101
50 consecutive values out of range
1110
55 consecutive values out of range
1111
60 consecutive values out of range
3:0
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 15
The PID register provides an identification of the devices
package. This register is a read-only register whose value never
changes.
PID Register (0x11)
7
6
5
Reserved
4
3
2
PACKAGEID
0
Reserved
Field
Bits
Reserved
7:6
Reserved.
PID
5:4
Package Identification = 00
Reserved
3:0
Reserved.
Description
The ID register provides the device identification. This register
is a read-only register whose value never changes.
ID Register (I0x12)
7
1
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
Device Identification = 0x50
The Status Register provides the internal status of the device.
This register is read only.
Status Register (0x13)
7
6
Reserved
Description
5
4
NPINTR
AINT
3
2
1
Reserved
0
AVALID
Field
Bits
Reserved
7:6
NPINTR
5
No-persist Interrupt. Indicates that the device has encountered a
no-persist interrupt condition.
AINT
4
ALS Interrupt. Indicates that the device is asserting an ALS
interrupt.
Reserved
3:1
AVALID
0
TSL2591 – 16
Description
Reserved. Write at zero.
Reserved.
ALS Valid. Indicates that the ADC channels have completed an
integration cycle since the AEN bit was asserted.
Datasheet - Apr. 2013 - ams163.5
ALS Data Register (0x14 - 0x17)
ALS data is stored as two 16-bit values; one for each channel.
When the lower byte of either channel is read, the upper byte
of the same channel is latched into a shadow register. The
shadow register ensures that both bytes are the result of the
same ALS integration cycle, even if additional integration cycles
occur between the lower byte and upper byte register readings.
Each channel independently operates the upper byte shadow
register. So to minimize the potential for skew between CH0
and CH1 data, it is recommended to read all four ADC bytes in
sequence. The simplest way to accomplish this is to perform a
four-byte I2C read operation using the auto-increment
protocol, which is set in the Command register TRANSACTION
field.
Register
Address
Bits
C0DATAL
0x14
7:0
ALS CH0 data low byte
C0DATAH
0x15
7:0
ALS CH0 data high byte
C1DATAL
0x16
7:0
ALS CH1 data low byte
C1DATAH
0x17
7:0
ALS CH1 data high byte
Datasheet - Apr. 2013 - ams163.5
Description
TSL2591 – 17
Application Information
Figure TSL2591 - 17 shows a typical hardware application
circuit. A 1-μF low-ESR decoupling capacitor should be placed
as close as possible to the VDD pin. V BUS in this figure refers to
the I2C bus voltage, which is equal to V DD.
Figure TSL2591 – 17:
Typical Application Hardware Circuit
TSL2591
The I 2C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I2 C bus speed, the I 2C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
TSL2591 – 18
Datasheet - Apr. 2013 - ams163.5
PCB Pad Layout
Suggested land pattern based on the IPC−7351B Generic
Requirements for Surface Mount Design and Land Pattern
Standard (2010) for the small outline no-lead (SON) package is
shown in Figure TSL2591 - 18.
Figure TSL2591 – 18:
Suggested FN Package PCB Layout (Top View)
Notes:
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 19
Package Drawings and Markings
Figure TSL2591 – 19:
FN Package – Dual Flat No-Lead Packaging Configuration
Notes:
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerence of ±75 μm.
3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NIPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
TSL2591 – 20
Datasheet - Apr. 2013 - ams163.5
Mechanical Data
Figure TSL2591 – 20:
FN Package Carrier Tape and Reel Information
Notes:
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing AO , B O and K O are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481 - B.
6. In accordance with EIA Standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 21
Soldering Information
The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure TSL2591 – 21:
Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
Device
2.5 ºC/sec
tsoak
2 to 3 minutes
Time above 217 ºC (T1)
t1
Max 60 sec
Time above 230 ºC (T2)
t2
Max 50 sec
Time above Tpeak - 10 ºC (T3)
t3
Max 10 sec
Peak temperature in reflow
Tpeak
260 ºC
Soak time
Temperature gradient in cooling
Max -5 ºC/sec
Figure TSL2591 – 22:
Solder Reflow Profile Graph
Note: Not to scale – for reference only.
TSL2591 – 22
Datasheet - Apr. 2013 - ams163.5
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: < 40°C
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The FN package has been assigned a moisture sensitivity level
of MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: < 30°C
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 23
RoHS Compliant and ams Green
Statement
The term RoHS complaint means that ams products fully comply
with current RoHS directive. Our semiconductor products do
not contain any chemicals for all 6 substance categories,
including the requirement that lead not exceed 0.1% by weight
in homogeneous materials. Where designed to be soldered at
high temperatures, RoHS compliant products are suitable for
use in specified lead-free processes. ams Green means RoHS
compliant and no Sb/Br). ams defines Green that additionally
to RoHS compliance our products are free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed
0.1% by weight in homogeneous material).
Important Information and Disclaimer The information
provided in this statement represents ams knowledge and
belief as of the date that it is provided. ams bases its knowledge
and belief on information provided by third parties, and makes
no representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams has taken and continues to
take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams
and ams suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
TSL2591 – 24
Datasheet - Apr. 2013 - ams163.5
Copyrights
Copyright © 1997-2013, ams AG, Tobelbaderstrasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered ®.
All rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Disclaimer
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its Term of Sale. ams
AG makes no warranty, express, statutory, implied, or by
description regarding the information set forth herein or
regarding the freedom of the described devices from patent
infringement. ams AG reserves the right to change
specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is
necessary to check with ams AG for current information. This
product is intended for use in normal commercial applications.
Applications requiring extended temperature range, unusual
environmental requirements, or high reliability applications,
such as military, medical life-support or life-sustaining
equipment are specifically not recommended without
additional processing by ams AG for each application. For
shipments of less than 100 parts the manufacturing flow might
show deviations from the standard production flow, such as test
flow or test location.
The information furnished here by ams AG is believed to be
correct and accurate. However, ams AG shall not be liable to
recipient or any third party for any damages, including but not
limited to personal injury, property damage, loss of profits, loss
of use, interruption of business or indirect, special, incidental
or consequential damages, of any kind, in connection with or
arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or
any third party shall arise or flow out of ams AG rendering of
technical or other services.
Datasheet - Apr. 2013 - ams163.5
TSL2591 – 25