TSL2591

TSL2591
Light-to-Digital Converter
General Description
The TSL2591 is a very-high sensitivity light-to-digital converter
that transforms light intensity into a digital signal output
capable of direct I²C interface. The device combines one
broadband photodiode (visible plus infrared) and one
infrared-responding photodiode on a single CMOS integrated
circuit. Two integrating ADCs convert the photodiode currents
into a digital output that represents the irradiance measured
on each channel. This digital output can be input to a
microprocessor where illuminance (ambient light level) in lux
is derived using an empirical formula to approximate the
human eye response. The TSL2591 supports a traditional level
style interrupt that remains asserted until the firmware clears it.
Ordering Information and Content Guide appear at end of
datasheet.
Figure 1:
Added Value of Using TSL2591
Benefits
Features
Approximates Human Eye Response
Dual Diode
Flexible Operation
Programmable Analog Gain and Integration Time
Suited for Operation Behind Dark Glass
600M:1 Dynamic Range
Low Operating Overhead
Low Power 3.0 μA Sleep State
I²C Fast Mode Compatible Interface
ams Datasheet
[v2-00] 2015-Jun-30
• Two Internal Interrupt Sources
• Programmable Upper and Lower Thresholds
• One Interrupt Includes Programmable Persistence Filter
User Selectable Sleep Mode
• Data Rates up to 400 kbit/s
• Input Voltage Levels Compatible with 3.0V Bus
Page 1
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TSL2591 − General Description
Block Diagram
The functional blocks of this device for reference are
shown below:
Figure 2:
Block Diagram
Page 2
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Detailed Description
Detailed Description
The TSL2591 contains two integrating analog-to-digital
converters (ADC) that integrate currents from two photodiodes.
Integration of both channels occurs simultaneously. Upon
completion of the conversion cycle, the conversion result is
transferred to the Channel 0 and Channel 1 data registers,
respectively. The transfers are double-buffered to ensure that
the integrity of the data is maintained. After the transfer, the
device automatically begins the next integration cycle.
Communication with the device is accomplished through a
standard, two-wire I²C serial bus. Consequently, the TSL2591
can be easily connected to a microcontroller or embedded
controller. No external circuitry is required for signal
conditioning. Because the output of the device is digital, the
output is effectively immune to noise when compared to an
analog signal.
The TSL2591 also supports an interrupt feature that simplifies
and improves system efficiency by eliminating the need to poll
a sensor for a light intensity value. The primary purpose of the
interrupt function is to detect a meaningful change in light
intensity. The concept of a meaningful change can be defined
by the user both in terms of light intensity and time, or
persistence, of that change in intensity. The device has the
ability to define two sets of thresholds, both above and below
the current light level. An interrupt is generated when the value
of a conversion exceeds either of these limits. One set of
thresholds can be configured to trigger an interrupt only when
the ambient light exceeds them for a configurable amount of
time (persistence) while the other set can be configured to
trigger an immediate interrupt.
ams Datasheet
[v2-00] 2015-Jun-30
Page 3
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TSL2591 − Pin Assignment
The TSL2591 pin assignments are described below.
Pin Assignment
Figure 3:
Pin Diagram
Package FN Dual Flat No-Lead (Top
View): Package drawing is not to scale.
SCL
1
6
SDA
INT
2
5
VDD
GND 3
4
NC
Figure 4:
Pin Description
Pin Number
Pin Name
1
SCL
I²C serial clock input terminal
2
INT
Interrupt — open drain output (active low).
3
GND
Power supply ground. All voltages are referenced to GND.
4
NC
No connect — do not connect.
5
VDD
Supply voltage
6
SDA
I²C serial data I/O terminal
Page 4
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Description
ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings
Parameter
Min
Max
Units
3.8
V
Supply voltage, VDD
Input terminal voltage
-0.5
3.8
V
Output terminal voltage
-0.5
3.8
V
Output terminal current
-1
20
mA
Storage temperature range, Tstg
-40
85
ºC
ESD tolerance, human body model
ams Datasheet
[v2-00] 2015-Jun-30
±2000
Comments
All voltages are with respect to GND
V
Page 5
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TSL2591 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
Parameter
VDD
TA
Min
Typ
Max
Units
Supply voltage
2.7
3
3.6
V
Operating free-air temperature
-30
70
ºC
Figure 7:
Operating Characteristics, V DD=3V, TA=25ºC (unless otherwise noted)
Symbol
Parameter
Conditions
IDD
Supply Current
Active
Sleep state - no I²C activity
VOL
INT, SDA output low
voltage
3mA sink current
6mA sink current
ILEAK
Leakage current, SDA,
SCL, INT pins
VIH
SCL, SDA input high
voltage
VIL
SCL, SDA input low
voltage
Page 6
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Min
Typ
Max
Units
275
2.3
325
4
μA
0
0
0.4
0.6
V
-5
5
μA
0.7 VDD
V
0.3 VDD
V
ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Electrical Characteristics
Figure 8:
ALS Characteristics, V DD=3V, TA=25ºC, AGAIN = Max, AEN=1, (unless otherwise noted)(1) (2) (3)
Parameter
Conditions
Dark ADC count
value
Ee = 0,
ATIME=000b (100ms)
ADC integration
time step size
ATIME = 000b (100ms)
Channel
Min
CH0
CH1
0
0
Max
Units
25
25
counts
108
ms
1
6
steps
95
ADC number of
integration steps
(Note (4))
Typ
101
ADC counts per
step
ATIME = 000b (100ms)
0
37888
counts
ADC count value
ATIME = 101b (600ms)
0
65535
counts
White light (2)
Ee = 4.98 μW/cm2
ATIME = 000b (100 ms)
CH0
CH1
25500
30000
4996
34500
CH0
CH1
25500
30000
19522
34500
White light (2)
0.116
0.166
0.216
λp = 850 nm (3)
0.456
0.652
0.848
counts
ADC count value
λp = 850 nm (3)
Ee = 5.62 μW/cm2,
ATIME = 000b (100 ms)
ADC count value
ratio: CH1/CH0
Re
Irradiance
responsivity
Noise (4)
Gain scaling,
relative to 1× gain
setting
(AGAIN = Low)
White light (2)
ATIME = 000b (100 ms)
CH0
CH1
6024
1003
λp = 850 nm (3)
ATIME = 000b (100 ms)
CH0
CH1
5338
3474
White light (2)
Ee = 4.98 μW/cm2
ATIME = 000b (100 ms)
CH0
1
2
counts
counts/
(μW/cm2)
AGAIN = Med
20
25
30
AGAIN = High
332
415
498
AGAIN = Max
8000
10000
12000
1 standard
deviation
×
Note(s) and/or Footnote(s):
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible white LEDs
and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production
2. The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 4000 K.
3. The 850 nm irradiance is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength λ p =
850 nm and spectral halfwidth Δλ½ = 42 nm.
4. Parameter ensured by design and is not 100% tested.
ams Datasheet
[v2-00] 2015-Jun-30
Page 7
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TSL2591 − Timing Characteristics
The timing characteristics of TSL2591 are given below.
Timing Characteristics
Figure 9:
AC Electrical Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Parameter(1)
Description
Min
Typ
Max
Units
400
kHz
f(SCL)
Clock frequency (I²C only)
t(BUF)
Bus free time between start and stop
condition
1.3
μs
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
t(HDSTA)
0
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Note(s) and/or Footnote(s):
1. Specified by design and characterization; not production tested.
Timing Diagrams
Figure 10:
Parameter Measurement Information
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 11:
Spectral Responsivity
Spectral Responsivity: Two channel
response allows for tunable illuminance
(lux) calculation regardless of
transmissivity of glass.
1
0.9
Normalized Responsivity
0.8
CH0
0.7
0.6
0.5
0.4
CH1
0.3
0.2
0.1
0
300
400
500
600
700
800
900 1000 1100
λ - Wavelength - nm
Figure 12:
White Normalized Responsivity vs. Angular Displacement
White LED Angular Response: Near
cosine angular response for broadband
white light sources.
100%
Response - Normalized to 0º
90%
CH0
80%
70%
60%
50%
40%
30%
20%
CH1
10%
0%
-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90
Incedent Angle - º
ams Datasheet
[v2-00] 2015-Jun-30
Page 9
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TSL2591 − Typical Operating Characteristics
IDD vs. VDD and Temp: Effect of supply
voltage and temperature on active
current.
IDD - Active Current Normalized @ 3V, 25ºC
Figure 13:
Normalized IDD vs. VDD and Temperature
1.2
1.15
75°C
1.1
50°C
25°C
1.05
5°C
1
0.95
0.9
2.7
2.8
2.9
3
3.1
3.2
3.3
3.4
3.5
3.6
VDD - Source Voltage - V
Figure 14:
Response to White LED vs. Temperature
White LED Response vs. Temp: Effect of
temperature on the device response for
a broadband white light source.
Response - Normalized to 25ºC
110%
105%
Ch 0
100%
Ch 1
95%
90%
0
10
20
30
40
50
60
70
Temperature - ºC
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Register Description
The device is controlled and monitored by registers accessed
through the I²C serial interface. These registers provide for a
variety of control functions and can be read to determine results
of the ADC conversions. The register set is summarized in
Figure 15.
Register Description
Figure 15:
Register Description
Address
Register Name
R/W
--
COMMAND
W
0x00
ENABLE
0x01
Reset
Value
Register Function
Specifies Register Address
0x00
R/W
Enables states and interrupts
0x00
CONFIG
R/W
ALS gain and integration time configuration
0x00
0x04
AILTL
R/W
ALS interrupt low threshold low byte
0x00
0x05
AILTH
R/W
ALS interrupt low threshold high byte
0x00
0x06
AIHTL
R/W
ALS interrupt high threshold low byte
0x00
0x07
AIHTH
R/W
ALS interrupt high threshold high byte
0x00
0x08
NPAILTL
R/W
No Persist ALS interrupt low threshold low byte
0x00
0x09
NPAILTH
R/W
No Persist ALS interrupt low threshold high byte
0x00
0x0A
NPAIHTL
R/W
No Persist ALS interrupt high threshold low byte
0x00
0x0B
NPAIHTH
R/W
No Persist ALS interrupt high threshold high
byte
0x00
0x0C
PERSIST
R/W
Interrupt persistence filter
0x00
0x11
PID
R
Package ID
--
0x12
ID
R
Device ID
ID
0x13
STATUS
R
Device status
0x00
0x14
C0DATAL
R
CH0 ADC low data byte
0x00
0x15
C0DATAH
R
CH0 ADC high data byte
0x00
0x16
C1DATAL
R
CH1 ADC low data byte
0x00
0x17
C1DATAH
R
CH1 ADC high data byte
0x00
Note(s) and/or Footnote(s):
1. Devices with a primary I2C address of 0x29 also have a secondary I2C address of 0x28 that can be used for read only registers to
quickly read in a single block I2C transaction.
ams Datasheet
[v2-00] 2015-Jun-30
Page 11
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TSL2591 − Register Description
The COMMAND register specifies the address of the target
register for future read and write operations, as well as issues
special function commands.
Command Register
7
CMD
6
5
4
3
TRANSACTION
Fields
Bits
CMD
7
2
1
0
ADDR/SF
Description
Select Command Register. Must write as 1 when addressing
COMMAND register.
Select type of transaction to follow in subsequent data transfers
FIELD VALUE
TRANSACTION
DESCRIPTION
00
Reserved - Do not use
01
Normal Operation
10
Reserved – Do not use
11
Special Function – See description below
6:5
Address field/special function field. Depending on the transaction
type, see above, this field either specifies a special function
command or selects the specific control-status-data register for
subsequent read and write transactions. The field values listed
below apply only to special function commands.
FIELD VALUE
ADDR/SF
4:0
DESCRIPTION
00100
Interrupt set – forces an interrupt
00110
Clears ALS interrupt
00111
Clears ALS and no persist ALS interrupt
01010
Clears no persist ALS interrupt
other
Reserved – Do not write
The interrupt set special function command sets the interrupt bits
in the status register (0x13). For the interrupt to be visible on the
INT pin, one of the interrupt enable bits in the enable register
(0x00) must be asserted.
The interrupt set special function must be cleared with an interrupt
clear special function. The ALS interrupt clear special functions
clear any pending interrupt(s) and are self-clearing.
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Register Description
The ENABLE register is used to power the device on/off, enable
functions and interrupts.
Enable Register (0x00)
7
6
5
4
NPIEN
SAI
Reserved
AIEN
3
2
Reserved
1
0
AEN
PON
Fields
Bits
NPIEN
7
No Persist Interrupt Enable. When asserted NP Threshold
conditions will generate an interrupt, bypassing the persist filter.
SAI
6
Sleep after interrupt. When asserted, the device will power down at
the end of an ALS cycle if an interrupt has been generated.
Reserved
5
Reserved. Write as 0.
AIEN
4
ALS Interrupt Enable. When asserted permits ALS interrupts to be
generated, subject to the persist filter.
Reserved
3:2
AEN
1
ALS Enable. This field activates ALS function. Writing a one
activates the ALS. Writing a zero disables the ALS.
PON
0
Power ON. This field activates the internal oscillator to permit the
timers and ADC channels to operate. Writing a one activates the
oscillator. Writing a zero disables the oscillator.
ams Datasheet
[v2-00] 2015-Jun-30
Description
Reserved. Write as 0.
Page 13
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TSL2591 − Register Description
The CONTROL register is used to configure the ALS gain and
integration time. In addition, a system reset is provided. Upon
power up, the CONTROL register resets to 0x00.
Control Register (0x01)
7
6
SRESET
Reserved
5
4
3
AGAIN
2
1
Reserved
0
ATIME
Fields
Bits
Description
SRESET
7
System reset. When asserted, the device will reset equivalent to a
power-on reset. SRESET is self-clearing.
Reserved
6
Reserved. Write as 0.
ALS gain sets the gain of the internal integration amplifiers for both
photodiode channels.
FIELD VALUE
AGAIN
Reserved
5:4
3
DESCRIPTION
00
Low gain mode
01
Medium gain mode
10
High gain mode
11
Maximum gain mode
Reserved. Write as 0.
ALS time sets the internal ADC integration time for both
photodiode channels.
ATIME
Page 14
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2:0
FIELD VALUE
INTEGRATION TIME
MAX COUNT
000
100 ms
37888
001
200 ms
65535
010
300 ms
65535
011
400 ms
65535
100
500 ms
65535
101
600 ms
65535
ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Register Description
ALS Interrupt Threshold Register
(0x04 − 0x0B)
The ALS interrupt threshold registers provide the values to be
used as the high and low trigger points for the comparison
function for interrupt generation. If C0DATA crosses below the
low threshold specified, or above the higher threshold, an
interrupt is asserted on the interrupt pin.
If the C0DATA exceeds the persist thresholds (registers: 0x04 –
0x07) for the number of persist cycles configured in the PERSIST
register an interrupt will be triggered. If the C0DATA exceeds
the no-persist thresholds (registers: 0x08 – 0x0B) an interrupt
will be triggered immediately following the end of the current
integration.
Note that while the interrupt is observable in the STATUS
register (0x13), it is visible only on the INT pin when AIEN or
NPIEN are enabled in the ENABLE register (0x00).
Upon power up, the interrupt threshold registers default to
0x00.
Register
Address
Bits
AILTL
0x04
7:0
ALS low threshold lower byte
AILTH
0x05
7:0
ALS low threshold upper byte
AIHTL
0x06
7:0
ALS high threshold lower byte
AIHTH
0x07
7:0
ALS high threshold upper byte
NPAILTL
0x08
7:0
No Persist ALS low threshold lower byte
NPAILTH
0x09
7:0
No Persist ALS low threshold upper byte
NPAIHTL
0x0A
7:0
No Persist ALS high threshold lower byte
NPAIHTH
0x0B
7:0
No Persist ALS high threshold upper byte
ams Datasheet
[v2-00] 2015-Jun-30
Description
Page 15
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TSL2591 − Register Description
The Interrupt persistence filter sets the number of consecutive
out-of-range ALS cycles necessary to generate an interrupt.
Out-of-range is determined by comparing C0DATA (0x14 and
0x15) to the interrupt threshold registers (0x04 - 0x07). Note
that the no-persist ALS interrupt is not affected by the interrupt
persistence filter. Upon power up, the interrupt persistence
filter register resets to 0x00.
PERSIST Register (0x0C)
7
6
5
4
3
2
Reserved
Field
Bits
Reserved
7:4
1
0
APERS
Description
Reserved. Write as 0.
ALS interrupt persistence filter
FIELD VALUE
APERS
Page 16
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PERSISTENCE
0000
Every ALS cycle generates an interrupt
0001
Any value outside of threshold range
0010
2 consecutive values out of range
0011
3 consecutive values out of range
0100
5 consecutive values out of range
0101
10 consecutive values out of range
0110
15 consecutive values out of range
0111
20 consecutive values out of range
1000
25 consecutive values out of range
1001
30 consecutive values out of range
1010
35 consecutive values out of range
1011
40 consecutive values out of range
1100
45 consecutive values out of range
1101
50 consecutive values out of range
1110
55 consecutive values out of range
1111
60 consecutive values out of range
3:0
ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Register Description
The PID register provides an identification of the devices
package. This register is a read-only register whose value never
changes.
PID Register (0x11)
7
6
5
Reserved
4
3
2
PACKAGEID
0
Reserved
Field
Bits
Reserved
7:6
Reserved.
PID
5:4
Package Identification = 00
Reserved
3:0
Reserved.
Description
The ID register provides the device identification. This register
is a read-only register whose value never changes.
ID Register (0x12)
7
1
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
ams Datasheet
[v2-00] 2015-Jun-30
Description
Device Identification = 0x50
Page 17
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TSL2591 − Register Description
The Status Register provides the internal status of the device.
This register is read only.
Status Register (0x13)
7
6
Reserved
5
4
NPINTR
AINT
3
2
Reserved
1
0
AVALID
Field
Bits
Reserved
7:6
NPINTR
5
No-persist Interrupt. Indicates that the device has encountered a
no-persist interrupt condition.
AINT
4
ALS Interrupt. Indicates that the device is asserting an ALS
interrupt.
Reserved
3:1
AVALID
0
Page 18
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Description
Reserved. Write at zero.
Reserved.
ALS Valid. Indicates that the ADC channels have completed an
integration cycle since the AEN bit was asserted.
ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Register Description
ALS Data Register (0x14 - 0x17)
ALS data is stored as two 16-bit values; one for each channel.
When the lower byte of either channel is read, the upper byte
of the same channel is latched into a shadow register. The
shadow register ensures that both bytes are the result of the
same ALS integration cycle, even if additional integration cycles
occur between the lower byte and upper byte register readings.
Each channel independently operates the upper byte shadow
register. So to minimize the potential for skew between CH0
and CH1 data, it is recommended to read all four ADC bytes in
sequence.
Register
Address
Bits
C0DATAL
0x14
7:0
ALS CH0 data low byte
C0DATAH
0x15
7:0
ALS CH0 data high byte
C1DATAL
0x16
7:0
ALS CH1 data low byte
C1DATAH
0x17
7:0
ALS CH1 data high byte
ams Datasheet
[v2-00] 2015-Jun-30
Description
Page 19
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TSL2591 − Application Information
Application Information
Figure 16 shows a typical hardware application circuit. A 1-μF
low-ESR decoupling capacitor should be placed as close as
possible to the VDD pin. VBUS in this figure refers to the I²C bus
voltage, which is equal to V DD.
Figure 16:
Typical Application Hardware Circuit
TSL2591
The I²C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
Page 20
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − PCB Pad Layout
PCB Pad Layout
Suggested land pattern based on the IPC−7351B Generic
Requirements for Surface Mount Design and Land Pattern
Standard (2010) for the small outline no-lead (SON) package is
shown in Figure 17.
Figure 17:
Suggested FN Package PCB Layout (Top View)
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
ams Datasheet
[v2-00] 2015-Jun-30
Page 21
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TSL2591 − Package Drawings & Markings
Package Drawings & Markings
Figure 18:
FN Package – Dual Flat No-Lead Packaging Configuration
Note(s) and/or Footnote(s):
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerence of ±75 μm.
3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NIPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Page 22
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Mechanical Data
Mechanical Data
Figure 19:
FN Package Carrier Tape and Reel Information
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing AO, B O and KO are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481 - B.
6. In accordance with EIA Standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet
[v2-00] 2015-Jun-30
Page 23
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TSL2591 − Soldering Information
Soldering Information
The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 20:
Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
Device
2.5 ºC/sec
tsoak
2 to 3 minutes
Time above 217 ºC (T1)
t1
Max 60 sec
Time above 230 ºC (T2)
t2
Max 50 sec
Time above Tpeak - 10 ºC (T3)
t3
Max 10 sec
Peak temperature in reflow
Tpeak
260 ºC
Soak time
Temperature gradient in cooling
Max -5 ºC/sec
Figure 21:
Solder Reflow Profile Graph
Note(s) and/or Footnote(s):
1. Not to scale – for reference only.
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TSL2591 − Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: < 40°C
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The FN package has been assigned a moisture sensitivity level
of MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: < 30°C
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
ams Datasheet
[v2-00] 2015-Jun-30
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TSL2591 − Ordering & Contact Information
Ordering & Contact Information
Figure 22:
Ordering Information
Ordering Code
Address
Interface
Delivery Form
TSL25911FN
0x29
I²C Vbus = VDD Interface
ODFN-6
TSL25913FN (1)
0x29
I²C Vbus = 1.8V
ODFN-6
Note(s) and/or Footnote(s):
1. Contact factory for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
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TSL2591 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v2-00] 2015-Jun-30
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TSL2591 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
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ams Datasheet
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TSL2591 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v2-00] 2015-Jun-30
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 29
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TSL2591 − Revision Information
Revision Information
Changes from 163.5 (2013-Apr) to current revision 2-00 (2015-Jun-30)
Page
Content was updated to the latest ams design
Updated Figure 8
7
Updated note under Figure 15
11
Updated ID Register
17
Updated ALS Data Register
19
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
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ams Datasheet
[v2-00] 2015-Jun-30
TSL2591 − Content Guide
Content Guide
ams Datasheet
[v2-00] 2015-Jun-30
1
2
General Description
Block Diagram
3
4
5
6
8
8
9
Detailed Description
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
Timing Characteristics
Timing Diagrams
Typical Operating Characteristics
11
12
13
14
15
16
17
17
18
19
Register Description
Command Register
Enable Register (0x00)
Control Register (0x01)
ALS Interrupt Threshold Register (0x04 − 0x0B)
PERSIST Register (0x0C)
PID Register (0x11)
ID Register (0x12)
Status Register (0x13)
ALS Data Register (0x14 - 0x17)
20
21
22
23
24
Application Information
PCB Pad Layout
Package Drawings & Markings
Mechanical Data
Soldering Information
25
25
25
25
25
26
27
28
29
30
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 31
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