74ALVCH16374 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Rev. 03 — 27 April 2010 Product data sheet 1. General description The 74ALVCH16374 is 16-bit edge-triggered flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications. Incorporates bus hold data inputs which eliminate the need for external pull-up or pull-down resistors to hold unused inputs. The 74ALVCH16374 consists of 2 sections of eight edge-triggered flip-flops. A clock (CP) input and an output enable (OE) are provided per 8-bit section. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH CP transition. When OE is LOW, the contents of the flip-flops are available at the outputs. When OE is HIGH, the outputs go the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. 2. Features and benefits Wide supply voltage range from 1.2 V to 3.6 V Complies with JEDEC standard JESD8-B CMOS low power consumption MULTIBYTE flow-through standard pin-out architecture Low inductance multiple VCC and GND pins for minimum noise and ground bounce Direct interface with TTL levels All data inputs have bus hold Output drive capability 50 Ω transmission lines at 85 °C Current drive ±24 mA at VCC = 3.0 V 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 3. Ordering information Table 1. Ordering information Type number Temperature range Package Name Description Version 74ALVCH16374DL −40 °C to +85 °C SSOP48 plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 74LVCH16374DGG −40 °C to +85 °C TSSOP48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 4. Functional diagram Fig 1. 1 24 1OE 2OE 47 1D0 1Q0 2 46 1D1 1Q1 3 44 1D2 1Q2 5 43 1D3 1Q3 6 41 1D4 1Q4 8 40 1D5 1Q5 9 38 1D6 1Q6 11 37 1D7 1Q7 12 36 2D0 2Q0 13 35 2D1 2Q1 14 33 2D2 2Q2 16 32 2D3 2Q3 17 30 2D4 2Q4 19 29 2D5 2Q5 20 27 2D6 2Q6 22 26 2D7 2Q7 23 1CP 2CP 48 25 001aal770 Logic symbol 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 2 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 1OE 1CP 2OE 2CP 1D0 1D1 1D2 1D3 1D4 1D5 1D6 1D7 2D0 2D1 2D2 2D3 2D4 2D5 2D6 2D7 1 48 24 25 47 1EN C1 2EN C2 1D 2 1 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 2D 13 2 35 14 33 16 32 17 30 19 29 20 27 22 26 23 1Q0 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 2Q0 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7 001aal772 Fig 2. IEC logic symbol VCC data input to internal circuit mna705 Fig 3. Bus hold circuit 1D0 D Q 1Q0 2D0 CP D Q 2Q0 CP FF1 FF9 1CP 2CP 1OE 2OE to 7 other channels to 7 other channels 001aal771 Fig 4. Logic diagram 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 3 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 5. Pinning information 5.1 Pinning 74ALVCH16374 1OE 1 48 1CP 1Q0 2 47 1D0 1Q1 3 46 1D1 GND 4 45 GND 1Q2 5 44 1D2 1Q3 6 43 1D3 VCC 7 42 VCC 1Q4 8 41 1D4 1Q5 9 40 1D5 GND 10 39 GND 1Q6 11 38 1D6 1Q7 12 37 1D7 2Q0 13 36 2D0 2Q1 14 35 2D1 GND 15 34 GND 2Q2 16 33 2D2 2Q3 17 32 2D3 VCC 18 31 VCC 2Q4 19 30 2D4 2Q5 20 29 2D5 GND 21 28 GND 2Q6 22 27 2D6 2Q7 23 26 2D7 2OE 24 25 2CP 001aal769 Fig 5. Pin configuration 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 4 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE, 2OE 1, 24 output enable input (active LOW) 1Q0 to 1Q7 2, 3, 5, 6, 8, 9, 11, 12 3-state flip-flop outputs 2Q0 to 2Q7 13, 14, 16, 17, 19, 20, 22, 23 3-state flip-flop outputs GND 4, 10, 15, 21, 28, 34, 39, 45 ground (0 V) VCC 7, 18, 31, 42 positive supply voltage 1D0 to 1D7 47, 46, 44, 43, 41, 40, 38, 37 data inputs 2D0 to 2D7 36, 35, 33, 32, 30, 29, 27, 26 data inputs 1CP, 2CP 48, 25 clock input 6. Functional description 6.1 Function table Table 3. Function table[1] Inputs nOE nCP Dn Internal flip-flops L ↑ l L L L ↑ h H H H ↑ l L Z H ↑ h H Z [1] Outputs Q0 to Q7 Operating mode load and read register load register and disable outputs H = HIGH voltage level; L = LOW voltage level; h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition; I = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition; ↑ = LOW-to-HIGH clock transition; Z = high-impedance OFF-state. 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 5 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI < 0 V VI input voltage control inputs [1] data inputs [1] output clamping current IOK Conditions VO > VCC or VO < 0 V [1] Min Max Unit −0.5 +4.6 V −50 - mA −0.5 +4.6 V −0.5 VCC + 0.5 V - ±50 mA −0.5 VCC + 0.5 V - ±50 mA VO output voltage IO output current ICC supply current - 100 mA IGND ground current −100 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation VO = 0 V to VCC Tamb = −40 °C to +125 °C; SSOP48 package [2] - 850 mW TSSOP48 package [3] - 600 mW [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Above 55 °C the value of Ptot derates linearly with 11.3 mW/K. [3] Above 55 °C the value of Ptot derates linearly with 8 mW/K. 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Conditions VCC supply voltage maximum speed performance VI input voltage Min Typ Max Unit CL = 30 pF 2.3 - 2.7 V CL = 50 pF 3.0 - 3.6 V low voltage applications 1.2 - 3.6 V data inputs 0 - VCC V control inputs 0 - 5.5 V 0 - VCC V −40 - +85 °C VO output voltage Tamb ambient temperature Δt/ΔV input transition rise and fall rate VCC = 2.3 V to 3.0 V 0 - 20 ns/V VCC = 3.0 V to 3.6 V 0 - 10 ns/V 74ALVCH16374_3 Product data sheet in free air All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 6 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit Tamb = −40 °C to +85 °C VIH VIL VOH VOL II IOZ ILIZ ICC HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage input leakage current OFF-state output current VCC = 1.2 V VCC - - V VCC = 1.8 V 0.7VCC 0.9 - V VCC = 2.3 V to 2.7 V 1.7 1.2 - V VCC = 2.7 V to 3.6 V 2.0 1.5 - V 0 V VCC = 1.2 V - - VCC = 1.8 V - 0.9 VCC = 2.3 V to 2.7 V - 1.2 0.7 V VCC = 2.7 V to 3.6 V - 1.5 0.8 V IO = −100 μA; VCC = 1.8 V to 3.6 V VCC − 0.2 VCC - V IO = −6 mA; VCC = 1.8 V VCC − 0.4 VCC − 0.1 - V IO = −6 mA; VCC = 2.3 V VCC − 0.3 VCC − 0.08 - V IO = −12 mA; VCC = 2.3 V VCC − 0.5 VCC − 0.17 - V IO = −12 mA; VCC = 2.7 V VCC − 0.5 VCC − 0.14 - V IO = −18 mA; VCC = 2.3 V VCC − 0.6 VCC − 0.26 - V IO = −24 mA; VCC = 3.0 V VCC − 1.0 VCC − 0.28 - V IO = 100 μA; VCC = 1.8 V to 3.6 V - 0 0.20 V IO = 6 mA; VCC = 1.8 V - 0.09 0.30 V IO = 6 mA; VCC = 2.3 V - 0.07 0.20 V VI = VIH or VIL VI = VIH or VIL IO = 12 mA; VCC = 2.3 V - 0.15 0.40 V IO = 12 mA; VCC = 2.7 V - 0.14 0.40 V IO = 18 mA; VCC = 2.3 V - 0.23 0.60 V IO = 24 mA; VCC = 3.0 V - 0.27 0.55 V control input; VI = 5.5 V or GND - 0.1 5 μA data input; VI = VCC or GND - 0.1 5 μA VCC = 1.8 V to 2.7 V - 0.1 5 μA VCC = 2.7 V to 3.6 V - 0.1 10 μA VCC = 1.8 V to 2.7 V - 0.1 10 μA VCC = 3.6 V - 0.1 15 μA VCC = 1.8 V to 2.7 V - 0.1 20 μA VCC = 2.7 V to 3.6 V - 0.2 40 μA VCC = 1.8 V to 3.6 V VI = VIH or VIL; VO = VCC or GND OFF-state input leakage current VI = VCC or GND supply current VI = VCC or GND; IO = 0 A; 74ALVCH16374_3 Product data sheet 0.2VCC V All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 7 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Table 6. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions ΔICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 2.7 V to 3.6 V bus hold LOW current IBHL IBHH IBHLO IBHHO bus hold HIGH current bus hold LOW overdrive current bus hold HIGH overdrive current Min Max Unit per control input - 5 500 μA per data I/O input - 150 750 μA VCC = 2.3 V; VI = 0.7 V [2] 45 - - μA VCC = 3.0 V; VI = 0.8 V [2] 75 150 - μA VCC = 2.3 V; VI = 1.7 V [2] −45 - - μA VCC = 3.0 V; VI = 2.0 V [2] −75 −175 - μA VCC = 2.7 V [2] 300 - - μA VCC = 3.6 V [2] 450 - - μA VCC = 2.7 V [2] −300 - - μA VCC = 3.6 V [2] −450 - - μA - 5.0 - pF Typ[1] Max Unit input capacitance CI Typ[1] [1] All typical values are measured at Tamb = 25 °C. [2] Valid for data inputs of bus hold parts only. 10. Dynamic characteristics Table 7. Dynamic characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V); test circuit Figure 9. Symbol Parameter Conditions Min Tamb = −40 °C to +85 °C fmax maximum frequency see Figure 6 VCC = 1.8 V VCC = 2.3 V to 2.7 V [2] VCC = 2.7 V tpd propagation delay VCC = 3.0 V to 3.6 V [3] nCP to nQn; see Figure 6 [4] VCC = 1.2 V VCC = 1.8 V VCC = 2.3 V to 2.7 V [2] VCC = 2.7 V ten enable time VCC = 3.0 V to 3.6 V [3] nOE to nQn; see Figure 7 [4] VCC = 1.2 V VCC = 1.8 V VCC = 2.3 V to 2.7 V [2] VCC = 2.7 V VCC = 3.0 V to 3.6 V 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 [3] 125 250 - MHz 150 300 - MHz 150 300 - MHz 200 350 - MHz - 7.7 - ns 1.5 3.6 6.5 ns 1.0 2.3 4.3 ns 1.0 2.3 3.8 ns 1.0 2.4 3.4 ns - 8.7 - ns 1.5 4.0 7.2 ns 1.0 2.6 4.8 ns 1.0 2.9 4.8 ns 1.0 2.3 4.0 ns © NXP B.V. 2010. All rights reserved. 8 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Table 7. Dynamic characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V); test circuit Figure 9. Symbol tdis Parameter disable time Conditions nOE to nQn; see Figure 7 VCC = 1.2 V VCC = 1.8 V VCC = 2.3 V to 2.7 V [2] VCC = 2.7 V VCC = 3.0 V to 3.6 V pulse width tW [3] VCC = 2.3 V to 2.7 V [2] VCC = 2.7 V VCC = 3.0 V to 3.6 V set-up time [3] VCC = 2.3 V to 2.7 V 1.5 3.1 5.4 ns 1.0 2.1 4.0 ns 1.0 2.9 4.5 ns 1.0 2.6 4.1 ns 4.0 2.0 - ns 3.0 1.6 - ns 3.0 1.6 - ns 2.5 1.4 - ns ns - ns 1.2 0.2 - ns 1.5 0.4 - ns [3] 1.2 0.2 - ns 0.6 −0.2 - ns Dn to nCP; see Figure 8 VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V per flip-flop; VI = GND to VCC [2] [3] 0.8 −0.1 - ns 0.6 −0.2 - ns 0.8 0.0 - ns [5] outputs enabled - 16 - pF outputs disabled - 10 - pF [1] All typical values are measured at Tamb = 25 °C. [2] Typical values are measured at VCC = 2.5 V. [3] Typical values are measured at VCC = 3.3 V. [4] - 0.2 VCC = 2.7 V power dissipation capacitance 6.2 1.5 VCC = 1.8 V CPD - Unit [2] VCC = 2.7 V VCC = 3.0 V to 3.6 V hold time Max Dn to nCP; see Figure 8 VCC = 1.8 V th Typ[1] nCP HIGH or LOW; see Figure 6 VCC = 1.8 V tsu Min [4] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [5] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 9 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 11. Waveforms 1 / fmax VI nCP input GND VM VM VM tW tPHL tPLH VOH nQn output VOL VM VM 001aal773 Measurement points are given in Table 8. VOL and VOH are typical output levels that occur with the output load. Fig 6. Propagation delay, clock input (nCP) to data output (nQn), and pulse width VI nOE input VM VM GND tPLZ tPZL VCC nQn output LOW-to-OFF OFF-to-LOW VM VX VOL tPZH tPHZ VOH VY nQn output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled 001aal795 Measurement points are given in Table 8. VOL and VOH are typical output levels that occur with the output load. Fig 7. 3-state enable and disable times VI nCP input GND VM VM VM tsu tsu th th VI nDn input GND VM VM VM VM 001aal774 The shaded areas indicate when the input is permitted to change for predictable output performance. Fig 8. Data setup and hold times for input (nDn) to input (nCP) 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 10 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Table 8. Measurement points Supply voltage Input VCC VI Output VM VM VX VY 2.3 V to 2.7 V and VCC < 2.3 V 0.5 0.5 VOL + 0.15 V VOH − 0.15 V 2.7 V 2.7 V 2.7 V 1.5 V VOL + 0.3 V VOH − 0.3 V 3.0 V to 3.6 V 2.7 V 2.7 V 1.5 V VOL + 0.3 V VOH − 0.3 V 12. Test information VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 9. Table 9. Load circuit for measuring switching times Test data Supply voltage Input VCC VI tr, tf CL RL tPLH, tPHL tPLZ, tPZL tPHZ, tPZH 2.3 V to 2.7 V and < 2.3 V VCC ≤ 2.0 ns 30 pF 500 Ω open 2 × VCC GND 2.7 V 2.7 V 2.5 ns 50 pF 500 Ω open 2 × VCC GND 3.0 V to 3.6 V 2.7 V 2.5 ns 50 pF 500 Ω open 2 × VCC GND 74ALVCH16374_3 Product data sheet Load VEXT All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 11 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 13. Package outline SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 D E A X c y HE v M A Z 25 48 Q A2 A1 A (A 3) θ pin 1 index Lp L 24 1 detail X w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.8 0.4 0.2 2.35 2.20 0.25 0.3 0.2 0.22 0.13 16.00 15.75 7.6 7.4 0.635 10.4 10.1 1.4 1.0 0.6 1.2 1.0 0.25 0.18 0.1 0.85 0.40 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-118 Fig 10. Package outline SOT370-1 (SSOP48) 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 12 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.8 0.4 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 11. Package outline SOT362-1 (TSSOP48) 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 13 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 14. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74ALVCH16374_3 20100427 Product data sheet - 74ALVCH16374_2 Modifications: – The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. – Legal texts have been adapted to the new company name where appropriate. – Table 7 “Dynamic characteristics”: voltage ranges corrected. 74ALVCH16374_2 74ALVCH16374_3 Product data sheet 19980618 Product specification - All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 74ALVCH16374_1 © NXP B.V. 2010. All rights reserved. 14 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74ALVCH16374_3 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 15 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74ALVCH16374_3 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 © NXP B.V. 2010. All rights reserved. 16 of 17 74ALVCH16374 NXP Semiconductors 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 18. Contents 1 2 3 4 5 5.1 5.2 6 6.1 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 5 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 April 2010 Document identifier: 74ALVCH16374_3