INTEGRATED CIRCUITS DATA SHEET TDA8809T Radial error signal processor for compact disc players Product specification File under Integrated Circuits, IC01 November 1987 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T GENERAL DESCRIPTION The TDA8809T is a bipolar integrated circuit which provides control signals for the radial motor. These control signals are generated from radial error signals received from a photo-diode signal processor (TDA8808), and velocity control signals from the control processor. Features • Tracking error processor with automatic asymmetry control • AGC circuity with automatic start-up and wobble generator • Tracking control for fast forward/reverse scan, search, repeat and pause functions • Radial polarity - 4 - tracks counting • Possibility for car, home and portable applications. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Supply voltage range 4,5 5,0 5,5 V External voltage range Vex(+) pin 12 VP 10 12 V Vext(−) pin 13 −5,5 −5,0 0 V pin 12 to pin 13 4,5 − 12 V IP Vext(+) − Vext(−) Supply current − 5,3 − mA Tamb Operating ambient temperature range −30 − +85 °C PACKAGE OUTLINE 28-lead mini-pack; plastic (S028; SOT136A); SOT136-1; 1996 August 15. November 1987 2 Philips Semiconductors Product specification TDA8809T Fig.1 Block diagram. Radial error signal processor for compact disc players November 1987 3 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T PINNING PIN MNEMONIC DESCRIPTION 1 VP Positive supply voltage 2 Cosc1 3 Cosc2 Frequency setting capacitors for oscillator 4 Rwob Wobble generator input 5 Rosc Biassing resistor for oscillator frequency and internal amplitude 6 DIV4 Divide-by-4 input 7 REdig Digital output of sign (Re2 - Re1) 8 B3 9 B2 10 B1 Input control bits for off-, catch-, play-status and DAC output current 11 B0 12 Vext(+) Positive external voltage input 13 Vext(−) Negative external voltage input (also substrate connection) 14 GND Negative supply connection 15 RADout Current output of amplified (Re2 - Re1) input currents 16 REin Radial error input 17 RElag Voltage output of integrated (Re2 - Re1) input currents 18 Lag Connection of integrator capacitor for (Re1 - Re2) input currents 19 Lead Lead output 20 Vref Internal reference voltage output 21 AGC Gain control input for radial error signal 22 RDAC Biassing resistor for current output for track jumping (31⁄2 bits) 23 offset in Offset control input for radial offset 24 offset out Offset control output for radial offset 25 CLPF Low-pass filter for Re1 and Re2, used for radial offset control 26 CHPF High-pass filter for Re1 and Re2, used for radial offset control 27 Re1 Input for amplified currents from photo-diodes D1 and D2 28 Re2 Input for amplified currents from photo diodes D3 and D4 November 1987 Fig.2 Pinning diagram. 4 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER MIN. MAX. UNIT Supply voltage ranges (see Fig.3) VP pin 1 to pin 14 −0,3 13 V Vext pin 12 to pin 13 −0,3 13 V pin 14 to pin 13 −0,3 13 V Vext(−) Output voltage ranges VO except RADout 0 VP V VO RADout Vext(−) Vext(+) V RDAC current range 50 250 µA IRDAC Ptot Total power dissipation see Fig.4 Tstg Storage temperature range −55 +150 °C Tamb Operating ambient temperature range −30 +85 °C Tj Operating junction temperature − 150 °C THERMAL RESISTANCE From junction to ambient Fig.3 Rth j-a = Supply voltages; (a) Home application (b) Car application. November 1987 140 K/W Fig.4 Power derating curve. 5 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T CHARACTERISTICS VP = +5 V; V VGND = 0 V; Vext(+) = +5 V; Vext(−) = −5 V; IRDAC (pin 22) = −75 µA; IRwob (pin 4) = −8 µA; IRosc (pin 5) = −50 µA; VRADout = 0 V; Voffset in = Vlead = Vlag = VCosc1 = VCosc2 = Vref; Voffset in is connected to Voffset out; Tamb = 25 °C; all voltages measured with respect to VGND; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP Supply voltage range 4,5 5,0 5,5 V External voltage range (see Fig.3) Vext(+) pin 12 VP 10 12 V Vext(−) pin 13 −5,5 −5,0 0 V pin 12 to pin 13 4,5 − 12 V 4,0 5,3 6,6 mA 2,25 2,45 2,65 V − 25 − Ω 1,1 1,24 1,3 V − −50 − µA 1,1 1,23 1,3 V − −75 − µA Vext(+) − Vext(−) IP Supply current Reference output (Vref) Vref Output voltage ZO Output impedance IVref ≤ ±1 mA Reference input (Rosc) VRosc Input voltage level IRosc Input current IRosc = −50 µA Reference input (RDAC) VRDAC Input voltage level IRDAC Input current IRDAC = −75 µA Reference input (Rwob) VRwob Input voltage level IRwob Input current IRwob= −8 µA 150 165 180 mV − −8 − µA REdig output (REdig) IREdig Output source current note 1 (A) − −160 −50 µA IREdig Output sink current note1 (B) 0,4 3,5 − mA VREdig Output voltage HIGH IREdig = −50 µA; note 1 (A) 2,4 − − V VREdig Output voltage LOW IREdig = 400 µA; note 1 (B) 0 0,13 0,4 V November 1987 6 Philips Semiconductors Product specification Radial error signal processor for compact disc players SYMBOL PARAMETER TDA8809T CONDITIONS MIN. TYP. MAX. UNIT Digital inputs B0, B1, B2 and B3 VIH Input voltage HIGH note 2 2,0 − VP V VIL Input voltage LOW note 2 0 − 0,8 V IIH Input sink current HIGH 0 0,03 1,0 µA IIL Input source current LOW −3,0 −0,1 0 µA Divide-by-4 input (DIV4) VIH Input voltage HIGH divide-by-1 2,0 − VP V VIL Input voltage LOW divide-by-4 0 − 0,8 V µA IIH Input sink current HIGH 0 5,0 (5) IIL Input source current LOW −10 −3 0 µA fi Input frequency at Re1 and Re2 − 10 50 kHz Radial error inputs (Re1; Re2) VRe1, VRe2 Input voltage level VP−1,81 VP− 1,71 VP− 1,61 V IRe1, IRe2 Input current − −110 − µA ZRe1, ZRe2 Input impedance − 2,5 − kΩ −0,2 0 0,2 µA −0,45 +1,5 µA Gain control input (AGC) Offset current IRe1 = IRe2 = −110 µA rad on; lag hold off VAGC = 3,8 V; IRe1 = IRe2 = 0 IAGC Lag current for IRe1 = −85 µA; IRe2 = −115 µA Ilag minimum radial gain VAGC = 0,6 V −2,5 Ilag maximum radial gain VAGC = 3,8 V −42 −30 −18 µA − (5) − MΩ − −2 − µA 0,7 0,9 1,1 |ZAGC| Input impedance Gain VAGC = 3,8 V; VCosc2 = Vref + 1,4 V; VCosc1 = Vref; IRe1 = −100 µA; IAGC0 IRe2 = −100 µA IRe1 - IRe2 = 4 µA − IAGC0 then ∆I AGC -------------------------------------∆ ( IR e1 – I Re2 ) November 1987 IRe1 - IRe2 = −4 µA − IAGC0 7 Philips Semiconductors Product specification Radial error signal processor for compact disc players SYMBOL PARAMETER TDA8809T CONDITIONS MIN. TYP. MAX. UNIT Gain control (continued) Radial error trackcrossing rad off; VAGC = 3,8 V IRe2−IRe1 = −12 µA; IAGC IRe2+IRe1 = −200 µA IAGC IRe2+IRe1 = −200 µA −3 0 3 µA 39 49 59 µA −0,1 0 0,1 µA −115 −100 −85 µA +85 +100 +115 µA −7 0 +7 µA 0,17 0,21 0,25 −0,1 0 0,1 − (5) − IRe2−IRe1 = −48 µA; Offset control (offset out) Offset current rad on; ICHPF = 0; IRe1 = IRe2 = −110 µA Ioffset out Offset lag current for rad on; lag hold off; VAGC = 3,8 V; IRe1 = IRe2 = −110 µA minimum amplification Re1 Voffset in = Ilag maximum amplification Re2 Vref − 1,2 V Ilag maximum amplification Re1 Vref + 1,2 V minimum amplification Re2 Ilag Offset lag current Voffset in = note 3 Transconductance factor rad off; VAGC = 3,8 V; IRe1 = IRe2 = −100 µA; Vrange offset in = 0,6 V (int.); ∆I offset out -------------------------------------∆V offset in ⋅ I tot -------------------------------------V range offset in Itot = IRe1 + IRe2 rad off; VAGC = VGND IRe1 = IRe2 = −100 µA; Vrange offset in = 0,6 V (int.); ∆I offset out -------------------------------------∆V offset in ⋅ I tot -------------------------------------V range offset in Zoffset in November 1987 Itot = IRe1 + IRe2 Input impedance 8 MΩ Philips Semiconductors Product specification Radial error signal processor for compact disc players SYMBOL PARAMETER TDA8809T CONDITIONS MIN. TYP. MAX. UNIT High-pass filter (CHPF) Voltage level at ICHPF = 0 IRe1 = IRe2 = 0; ICLPF = 0 VCHPF VP−0,82 VP−0,72 VP−0,62 V −200 (5) 200 Ω 6,2 8,8 11,5 kΩ − 8 − kΩ Transresistance ∆V CHPF -------------------------------------∆ ( I Re1 – I Re2 ) from Re1, Re2 to CHPF IRe1 + IRe2 = −200 µA ∆V CHPF -------------------------------------∆ ( I Re1 + I Re2 ) ZCHPF Input impedance Low-pass filter (CLPF) 4,7 − VP V − 8 − kΩ VP−1,1 − − V Vlag = 0,9 V − − 1,1 V Vlag = 4,1 V −6,0 −3,5 −1,0 mA current output Vlag = 0,9 V 2,5 4,1 5,5 mA Output impedance f = < 10 kHz − − 50 Ω Offset (VRElag−Vref) lag short-circuit on; −10 − 10 mV Transfer lag → RElag f = < 10 kHz; −5% 1 5% − 0,4 − VCLPF Voltage level at ICLPF = 0 ZCLPF Input impedance IRe1 = IRe2 = 0 RElag output Output voltage range IRElag = −200 µA; Vlag = 4,25 V VRElag IRElag = 200 µA; VRElag Maximum source current output IRElag Maximum sink IRElag ZRElag lag hold on VRElag offset lag short-circuit off; lag hold on V RElag ----------------V lag Slew rate RElag output amplifier SR November 1987 lag short-circuit off; lag hold on 9 V/µs Philips Semiconductors Product specification Radial error signal processor for compact disc players SYMBOL PARAMETER TDA8809T CONDITIONS MIN. TYP. MAX. UNIT Lag push-pull current output, voltage input (pin 18) note 4 Output voltage Ilag = −20 µA; Vlag Voffset in = Vref−1,2 V Vlag Voffset = Vref + 1,2 V VP−1,5 − − V − − 1,5 V − (5) − MΩ lag short-circuit on; lag hold on; Ilag = ± 100 µA − 0,4 1 kΩ rad on − 0 − kΩ Ilag = 20 µA; |Zlag| Output impedance Switch lag short-circuit |Zlag sc| ∆V lag Impedance -------------∆V lag Radial error input (REin) |ZREin| November 1987 Input impedance 10 Philips Semiconductors Product specification Radial error signal processor for compact disc players SYMBOL PARAMETER TDA8809T CONDITIONS MIN. TYP. MAX. UNIT RADout push-pull current output Output voltage rad on IREin = 180 µA; VRADout IRADout = −50 µA VRADout IRADout = 50 µA Vext(+)−1,5 − − V − − Vext(−)+1,5 V −10% 1 10% IREin = −180 µA; Current gain IREin = ± 100 µA I RADout ------------------I REin SR |ZRADout| rad on; Slew rate − 0,4 − V/µs Output impedance − (5) − MΩ −5% −0,5 +15% −8% −2 +12% −0,02 0 0,02 −0,02 0 0,02 −14% 0,5 +6% −12% 2 +8% −0,1 0 0,1 −0,1 0 0,1 −5% −0,5 +15% −5% −0,375 +15% −5% −0,25 +15% −4% −0,125 +16% −14% +0,5 +6% − 13% +0,375 +7% − 13% +0,25 +7% − 13% +0,125 +7% Ratio of output current to reference current IREin = 0; IRDAC = −75 µA; I RADout ------------------I RDAC November 1987 see also Table 1 11 Philips Semiconductors Product specification Radial error signal processor for compact disc players SYMBOL PARAMETER TDA8809T CONDITIONS MIN. TYP. MAX. UNIT VAGC = 3,8 V Lead output Output voltage IRe1 = −90 µA; IRe2 = −100 µA; Ilead = −20 µA VP−1,5 − − V Ilead = 20 µA − − 1,5 V Offset current IRe1 = IRe2 = −100 µA −100 0 100 µA Current gain IRe1 = −120 µA; −11,2 −9,9 −8,8 − (5) − MΩ Vlead IRe1 = −100 µA; IRe2 = −90 µA; Vlead Ilead offset IRe2 = −100 µA ∆I lead ---------------------------∆ ( I –I ) Re1 Re2 |Zlead| Output impedance Oscillator (Cosc1 and Cosc2 connected to 12 nF capacitors) Amplitude oscillation (peak-to-peak value) Vosc1(p-p) Cosc1 1,05 1,25 1,45 V Vosc2(p-p) Cosc2 1,05 1,25 1,45 V IRe1 = I Re2= −110 µA 690 740 790 Hz lead (pin19) Rlead = 10 kΩ 0,85 1,05 1,25 V Clag (pin 18) Rlag = 10 kΩ; rad on; fosc Operating frequency Output voltages (peak-to-peak value) 0° injection Vlead(p-p) Vlag(p-p) lag hold off 85 105 125 mV Vlag(p-p) rad on; lag hold on − 0 20 mV rad on 90 110 130 mV Ragc = 10 kΩ Voffset in = Vref + 1V; rad on 200 250 300 mV 90° injection offset out ICHPF = −100 µA; Roffset out = 10 kΩ; Voffset out(p-p) 45° injection AGC VAGC(p-p) November 1987 12 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T Notes to the characteristics 1. REdig output conditions: (A) IRe1 > IRe2 + 5 µA; (B) IRe2 > IRe1 + 5 µA. 2. Input voltage HIGH indicates logic 1; Input voltage LOW indicates logic 0; see also Table 1. 3. DIV4 = HIGH; Voffset in adjusted for VREdig = 1,4 V; rad on; lag hold off; VAGC = 3,8 V; IRe1 = I Re2= −100 µA. 4. Output voltage conditions are: rad on; lag short-circuit off; lag hold off; VAGC = 3,8 V; IRe1 = IRe2 = −100 µA; Voffset = Vref − 1,2 V. 5. Value to be fixed. Table 1 Truth table for DAC output current FUNCTIONS DAC OUTPUT LOGICAL INPUTS INTERNAL SWITCHES IREout/IDAC B3 B2 B1 B0 lag s/c rad lag hold PUSH −1/2 0 0 0 0 off off on (kick) −2 0 0 0 1 off off off OFF 0 0 0 1 0 off off on OFF 0 0 0 1 1 on off off PULL 1/2 0 1 0 0 off off on (kick) 2 0 1 0 1 off off off CATCH 0 0 1 1 0 off on on PLAY 0 0 1 1 1 off on off PUSH −1/2 1 0 0 0 on off on PUSH −3/8 1 0 0 1 on off off PUSH −1/4 1 0 1 0 on off on PUSH −1/8 1 0 1 1 on off off PULL 1/2 1 1 0 0 on off on PULL 3/8 1 1 0 1 on off off PULL 1/4 1 1 1 0 on off on PULL 1/8 1 1 1 1 on off off Where: 0 = input voltage LOW; 1 = input voltage HIGH. November 1987 13 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE November 1987 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-24 14 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. November 1987 15 Philips Semiconductors Product specification Radial error signal processor for compact disc players TDA8809T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. November 1987 16