INTEGRATED CIRCUITS DATA SHEET TDA8042M Quadrature demodulator Product specification File under Integrated Circuits, IC02 1997 Apr 11 Philips Semiconductors Product specification Quadrature demodulator TDA8042M FEATURES GENERAL DESCRIPTION • 5 V supply voltage The TDA8042M is a monolitic bipolar IC dedicated for BPSK and QPSK demodulation. It is designed to be used together with the TDA8043 as part of a complete BPSK/QPSK satellite demodulator and decoder. The bandwidth of the TDA8042M allows symbol rates up to 45 Msymbols/s. It includes two matched mixers, an IF gain controlled amplifier, a symmetrical oscillator, a 0°/90° phase shifter, two low-pass filters and two matched baseband amplifiers. • Internal voltage reference • 350 to 650 MHz input frequency range • On-chip 0° and 90° phase shifter • Symbol rate up to 45 Msymbols/s • High input sensitivity • Built-in voltage stabilizer • AGC amplifier with 21 dB control range The high input sensitivity makes interfacing with various sources easy. The input sensitivity can be adjusted by means of an internal AGC amplifier. • AGC detector. APPLICATION The oscillator operates at half the IF frequency. The local oscillator signal driving the mixers is made by doubling the oscillator frequency by an internal frequency multiplier. The oscillator frequency can be set by the appropriate external LC tank circuit. The internal wideband phase shifter provides two oscillator signals which are 90 degrees out of phase to drive the mixers. • Binary Phase-Shift Keying (BPSK) and Quadrature Phase-Shift Keying (QPSK) demodulation. An AGC detector at the I and Q outputs makes it possible to keep the I and Q signals at a constant level to drive the analog-to-digital converters of the TDA8043. QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage ICC supply current Vi(RF) CONDITIONS MIN. TYP. MAX. UNIT 4.75 5.0 5.25 V 54 67.5 81 mA operating input level − 57 − dBµV fi(RF) RF input signal frequency 350 − 650 MHz VolQ(p-p) I and Q output voltage (peak-to-peak value) − 0.8 − V ∆EΦ(I-Q) phase matching error between I and Q channels − 0.7 2 deg ∆EG(I-Q) gain matching error between I and Q channels − 0.15 0.8 dB ∆Gtilt gain tilt error between I and Q channels − 0.3 0.5 dB VCC = 5.0 V ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8042M SSOP20 1997 Apr 11 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm 2 VERSION SOT266-1 Philips Semiconductors Product specification Quadrature demodulator TDA8042M BLOCK DIAGRAM handbook, full pagewidth IDET GND1 VAGC IOUT GND2 1 20 DET 2 19 I 3 VOLTAGE REFERENCE 4 5 17 × 16 VCO IFA IFB VCC2 QOUT 6 0° 7 8 ×2 90° 15 14 13 × 32 9 10 GND1 18 12 11 Q TDA8042M MBH968 Fig.1 Block diagram. 1997 Apr 11 3 VTH GND1 VCC1 OSCDIS OSCA OSCB GND1 FDIV(A) FDIV(B) VCC1 Philips Semiconductors Product specification Quadrature demodulator TDA8042M PINNING SYMBOL PIN DESCRIPTION IDET 1 AGC detector output signal GND1 2 ground VAGC 3 gain control input voltage IOUT 4 I channel amplifier output GND2 5 ground IFA 6 IF input A IFB 7 IF input B VCC2 8 supply voltage 2 QOUT 9 Q channel amplifier output IFA 6 15 OSCB GND1 10 ground IFB 7 14 GND1 VCC1 11 supply voltage 1 FDIV(B) 12 prescaler output B FDIV(A) 13 prescaler output A GND1 14 ground OSCB 15 oscillator tank circuit B OSCA 16 oscillator tank circuit A OSCDIS 17 oscillator disable input VCC1 18 supply voltage 1 GND1 19 ground VTH 20 AGC threshold voltage input 1997 Apr 11 handbook, halfpage IDET 1 20 VTH GND1 2 19 GND1 VAGC 3 18 VCC1 IOUT 4 17 OSCDIS GND2 5 16 OSCA TDA8042M VCC2 8 13 FDIV(A) QOUT 9 12 FDIV(B) GND1 10 11 VCC1 MBH967 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification Quadrature demodulator TDA8042M LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.3 +6.0 V Vi input voltage on all pins −0.3 VCC V Ptot total power dissipation − 470 mW Tstg IC storage temperature −55 +150 °C Tj junction temperature − +150 °C 0 +70(1) °C Tamb operating ambient temperature Note 1. The operating ambient temperature can be extended up to +85 °C providing the supply voltage remains lower or equal to 5.2 V in order to maintain the junction temperature below 150 °C. QUALITY SPECIFICATION All pins withstand the ESD test in accordance with “UZW-BO/FQ-A302 (human body model)” and with “UZW-BO/FQ-B302 (machine model)”. These numbers can be found in the “Quality reference Handbook”. The handbook can be ordered using the code 9397 750 00192. THERMAL CHARACTERISTICS SYMBOL Rth j-a 1997 Apr 11 PARAMETER thermal resistance from junction to ambient in free air 5 VALUE UNIT 120 K/W Philips Semiconductors Product specification Quadrature demodulator TDA8042M CHARACTERISTICS VCC = 5 V; Tamb = 25 °C; RL(IQ) = 1 kΩ; measured in application circuit of Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCC1 supply voltage 4.75 5.0 5.25 V VCC2 supply voltage 4.75 5.0 5.25 V ICC1 supply current VCC1 = VCC2 = 5.0 V 41 51 61 mA ICC2 supply current VCC1 = VCC2 = 5.0 V 13 16.5 20 mA 21 29 − dB input level = Vi(RF)min 0.5 − 2 V input level = Vi(RF)max 3.5 − 4.5 V − 20 − kΩ Vo = 1.6 V (peak-to-peak value) − 3.6 − V Vo = 0.8 V (peak-to-peak value) − 2.4 − V Vo = 0.4 V (peak-to-peak value) − 1.8 − V − 10 − kΩ − 1 − mA 350 − 650 MHz AGC GCR gain control range GVAGC voltage gain control at pin 3 RiVAGC input resistance at pin 3 Vth AGC threshold voltage RiVTH VTH input resistance Idet maximum AGC detector output current (absolute value) note 1 note 2 note 3 QPSK demodulator fi(RF) RF input signal frequency Ri(RF) RF input impedance (resistive part) fi(RF) = 480 MHz − 50 − Ω Xi(RF) RF input impedance (reactive part) fi(RF) = 480 MHz − 19 − Ω Vi(RF) operating RF input level note 1 57 − 78 dBµV ∆EΦ(I-Q) phase matching error between I and Q channels note 4 − 0.7 2 deg ∆EG(I-Q) gain matching error between I and Q channels note 5 − 0.15 0.8 dB ∆Gtilt gain tilt error between I and Q channels note 6 − 0.3 0.5 dB F DSB noise figure source impedance = 50 Ω; note 7 − 13 17 dB d3(IQ) third-order intermodulation distortion in I and Q channels note 8 − 50 − dB 1997 Apr 11 6 Philips Semiconductors Product specification Quadrature demodulator SYMBOL TDA8042M PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Oscillator fosc oscillator frequency note 9 175 − 325 MHz ∆fosc frequency drift note 10 − − 500 kHz ∆VCC = ±5% − − 100 kHz measured10 kHz from fosc; note 11 − − 91 dBc/Hz oscillator disabled − − 1.0 V oscillator enabled 4.0 − − V V Nosc oscillator phase noise Vosc(dis) oscillator disable voltage at pin 17 Prescaler VOH HIGH level output voltage note 12 4.0 − − VOL LOW level output voltage note 12 − − 3.35 V δ output duty cycle 40 50 60 % DIVspu(IQ) output spurious voltage at I and Q outputs − −50 − dB note 13 I and Q internal filters B−1 bandwidth for 1 dB attenuation 30 − − MHz B−30 bandwidth for 30 dB attenuation − 450 − MHz − 2.45 − V − 0.8 − V I and Q output amplifiers VO(IQ)(DC) I and Q channels DC output voltage Vo(IQ)(p-p) I and Q channels output voltage (peak-to-peak value) Vclip(p-p) I and Q output clipping level (peak-to-peak value) RL(IQ) I and Q channels output load resistance Ro(IQ) αct(I-Q) note 14 1.8 V 500 − − Ω I and Q channels output resistance − 67 − Ω crosstalk between I and Q channels 30 − − dB note 15 Notes 1. The voltage gain control range (GVAGC) is defined as the DC voltage to be applied on pin 3 to get a signal level of 800 mV (peak-to-peak value) at I and Q outputs. The lowest control voltage corresponds to the highest sensitivity and gain. 2. Vth is the level of voltage to be applied at pin 20 to get a current Idet of 0.5 mA at pin 1. This voltage depends on the amplitude of the signal at I and Q outputs. The AGC threshold voltage can be set by a resistive voltage divider connected at pin 20. Without the external resistors Vth is set at a value close to 2.35 V. 3. The current Idet increases when the output level (at pins 4 and 9) increases above the value set by the adjustment of Vth. 4. The phase error is defined as the phase quadrature imbalance between I and Q channels. 5. The gain error is defined as the phase quadrature imbalance between I and Q channels. 6. The tilt is defined as the difference between the maximum and the minimum channel gain measured in a frequency band of ±30 MHz around fi(RF). The specified tilt is the maximum tilt value found in one of the I and Q channels. 1997 Apr 11 7 Philips Semiconductors Product specification Quadrature demodulator TDA8042M 7. The specified noise figure is the maximum value obtained from I and Q channels noise measurement. The figure holds for the maximum gain (GVAGC = 0.5 V). 8. The specified intermodulation distortion is the minimum value obtained from intermodulation measurements in I and Q channels. The specified value is the minimum distance between wanted signal and intermodulation products measured at the output for a wanted output level of 0.8 V (peak-to-peak value). 9. The oscillator is tuned with an appropriate tank circuit designed for each frequency limit. 10. The drift of the oscillator frequency with temperature is defined for ∆Tamb = 25 °C. It is measured in the application circuit (see Fig.4) with a temperature compensated tank circuit. The temperature compensation used for this measurement is realized using the application which is depicted in Fig.3. 11. The phase noise is measured at the oscillator frequency (= 240 MHz). Due to the internal frequency doubler the phase noise at the input of the mixers will be 6 dB worse. 12. Measured with a high impedance load (RL > 5 kΩ) connected at pins 12 and 13. 13. The prescaler output spurious voltage at I and Q outputs are measured with respect to an output level of 800 mV (peak-to-peak value). 14. Measured with an input signal fi(RF) + 500 kHz (i.e. 480.5 MHz). 15. The load should be AC-coupled. handbook, full pagewidth to pin 15 TOKO ref.: 100 082 93278 8.2 pF NP0 2.2 pF NP0 6 pF N470 to pin 16 MBH969 Fig.3 Temperature compensation circuit. 1997 Apr 11 8 1 pF N470 Philips Semiconductors Product specification Quadrature demodulator TDA8042M APPLICATION INFORMATION handbook, full pagewidth 5V 100 nF 5 kΩ IDET test point GND1 20 1 2 19 3 18 4 17 5 16 5V VAGC 1 kΩ 100 nF 1 kΩ IOUT 1 kΩ VTH 100 nF NOT ON THE TESTBOARD VCC1 100 nF IFA ANZAC 50 Ω 5V OSCDIS 100 nF OSCA 18 pF TDA8042M RF 5V maximum GND1 100 nF GND2 + 6 15 7 14 8 13 TOKO ref.: 100 082 93278 OSCB 10 nF IFB H-183-4 GND1 10 nF VCC2 5V 100 nF 1 kΩ FDIV(A) 10 nF QOUT 12 9 FDIV(B) 100 nF to prescaler 470 Ω 10 nF GND1 10 11 MBH970 Fig.4 Application diagram. 1997 Apr 11 470 Ω 9 VCC1 100 nF 5V Philips Semiconductors Product specification Quadrature demodulator TDA8042M PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1997 Apr 11 EUROPEAN PROJECTION 10 o Philips Semiconductors Product specification Quadrature demodulator TDA8042M If wave soldering cannot be avoided, the following conditions must be observed: SOLDERING Introduction • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. 1997 Apr 11 11 Philips Semiconductors Product specification Quadrature demodulator TDA8042M DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Apr 11 12 Philips Semiconductors Product specification Quadrature demodulator TDA8042M NOTES 1997 Apr 11 13 Philips Semiconductors Product specification Quadrature demodulator TDA8042M NOTES 1997 Apr 11 14 Philips Semiconductors Product specification Quadrature demodulator TDA8042M NOTES 1997 Apr 11 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/01/pp16 Date of release: 1997 Apr 11 Document order number: 9397 750 00909