292-PBGA Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BG 2,859.0200 mg Body Size (mil/mm) Package Weight – Site 2 27 x 27 mm N/A SUMMARY The 292-PBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 052210 and 013508 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 53,200 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05118 Rev. *E Page 1 of 4 292-PBGA Non Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect SiO2 60676-86-0 128.6600 % Weight of Substance per Homogenous Material 9.2700% Acrylic 29690-82-2 120.6500 Epoxy 68541-56-0 Bisphenol Triazol Cu 13676-54-5 25722-66-1 7440-50-8 Ni 7440-02-0 Au Br Sn Pb Ag Epoxy Resin Si Au Silica Fused 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 --------------7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 14808-60-7 Substance Composition Epoxy Resin Phenolic Resin Mold Compound Encapsulation Mixed Siloxanes Brominated Resin Silica Antimony Trioxide Carbon Black Silica Cristobalite Antimony Pentoxide CAS Number Weight by mg PPM % Weight of Substance per Package 45,000 4.5000% 8.7000% 42,200 4.2200% 85.7700 6.1800% 30,000 3.0000% 214.4300 262.1700 552.3600 15.4500% 18.9000% 39.8100% 75,000 91,700 193,200 7.5000% 9.1700% 19.3200% 17.1500 1.2400% 6,000 0.6000% 5.7200 0.5700 327.3600 152.1000 2.0000 6.8600 72.0500 12.5800 642.1400 0.4100% 0.0400% 68.2800% 31.7200% 22.5700% 77.4300% 100.0000% 100.0000% 71.4600% 2,000 200 114,500 53,200 700 2,400 25,200 4,400 224,600 0.2000% 0.0200% 11.4500% 5.3200% 0.0700% 0.2400% 2.5200% 0.4400% 22.4600% 117.7900 13.1200% 41,200 4.1200% 32.8800 3.6600% 11,500 1.1500% 42.3100 4.7100% 14,800 1.4800% 18.5800 2.0700% 6,500 0.6500% 8.5800 0.9500% 3,000 0.3000% 1309-64-4 8.5800 0.9500% 3,000 0.3000% 1333-86-4 8.5800 0.9500% 3,000 0.3000% 14464-46-1 8.5800 0.9500% 3,000 0.3000% 1309-64-4 10.5800 1.1800% 3,700 0.3700% % Total: 100.0000 Package Weight (mg): 2,859.0200 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05118 Rev. *E Page 2 of 4 292-PBGA Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape < 5.0 < 5.0 < 5.0 Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Material PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05118 Rev. *E Page 3 of 4 292-PBGA Non Pb-Free Package Document History Page Document Title: Document Number: 292-PBGA NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05118 ** *A Orig. of Change 400429 GFJ 2581994 JARG *B 3358816 JARG *C 3770961 JARG *D 4043504 YUM *E 5007167 MRB Rev. ECN No. DCON Description of Change New document Added column for %weight of substance per homogeneous material in material composition. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table Updated Cypress Logo. Change CAS number for Au in material composition table Add CAS number for Br in material composition table Updated Declaration of Packaging / Indirect Materials for Assembly Site 1 Changed the format of the Title to All Caps. Changed Title from PMDD to PACKAGE MATERIAL DECLARATION DATASHEET Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places. Added Assembly Site Name in the Assembly heading. Changed Assembly code to Assembly Site Name. Removed entire Tube row in the Indirect Materials section. Changed CAS # from “-------------“ to Trade Secret Removed distribution and posting form the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05118 Rev. *E Page 4 of 4