388 - HSBGA (35 X 35 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BT 6326.1339 mg Body Size (mil/mm) Package Weight – Site 2 35 X 35 mm N/A SUMMARY The 388 – HSBGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 050703 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BT388ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-06939 Rev. *F Page 1 of 4 388 - HSBGA (35 X 35 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material CAS Number Weight by mg % Weight of substance per Homogeneous Material SiO2 60676-86-0 170.1480 10.4900% 26,896 2.6896% Acrylic Trade Secret 149.2242 9.2000% 23,589 2.3589% 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 Trade Secret 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret 99.5909 242.9759 290.6627 637.9333 22.5458 7.9478 0.9732 603.7797 25.2892 3.1612 11.3296 0.7693 0.7693 6.1400% 14.9800% 17.9200% 39.3300% 1.3900% 0.4900% 0.0600% 95.5000% 4.0000% 0.5000% 77.0200% 5.2300% 15,743 38,408 45,946 100,841 3,564 1,256 154 95,442 3,998 500 1,791 122 1.5743% 3.8408% 4.5946% 10.0841% 0.3564% 0.1256% 0.0154% 9.5442% 0.3998% 0.0500% 0.1791% 0.0122% Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 7440-50-8 7440-02-0 7440-47-3 1.8417 124.7700 9.3491 0.0009 1780.8000 95.4000 95.4000 95.4000 42.4000 10.6000 1792.2537 10.0972 0.7212 5.2300% 12.5200% 100.0000% 99.9900% 0.0100% 84.0000% 4.5000% 4.5000% 4.5000% 2.0000% 0.5000% 99.4000% 0.5600% 0.0400% 122 291 19,723 1,478 0 281,499 15,080 15,080 15,080 6,702 1,676 283,309 1,596 114 0.0122% 0.0291% 1.9723% 0.1478% 0.0000% 28.1499% 1.5080% 1.5080% 1.5080% 0.6702% 0.1676% 28.3309% 0.1596% 0.0114% Purpose of Use Substance Composition Epoxy Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Heatslug Heat dissipation Bisphenol Triazol Cu Ni Au Br Sn Ag Cu Silver Epoxy Resin Functionalized Ester Diester Si Au Ion Impurities Silica (fused) Epoxy resinA Epoxy resinB Phenolic resin Metal Hydroxide Carbon Black Copper Nickel Chromium Package Weight (mg): 6326.1339 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-06939 Rev. *F Page 2 of 4 %Weight of Substance per package 100.0000 388 - HSBGA (35 X 35 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 4.0 < 10.0 < 2.0 < 2.0 < 2.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R PBB PPM PBDE PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 < 2.0 < 4.0 < 2.0 < 5.0 <5.0 --------- <5.0 ----------- CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-06939 Rev. *F Page 3 of 4 388 - HSBGA (35 X 35 mm) Pb-Free Package Document History Page Document Title: DATASHEET Document Number: Rev. ** *A 388 - HSBGA (35 X 35MM) PB-FREE PACKAGE MATERIAL DECLARATION 001-06939 ECN No. Orig. of Change 428920 EBZ 2900801 MAHA *B *C DCON 3196143 MAHA 3609953 HLR *D 4075211 YUM *E *F 4791987 HLR 5310673 HLR AVE Description of Change Initial Release. Updated Cypress logo. Changed the font color of the header to black. Revised the following for assembly site 1: 1. Rounded off the package weight on page 1 to a whole number. 2. Corrected the CAS number of gold for the bonding wire. Rounded off the package weight on Table B to a whole number. 3. Rounded off the weight of substances in Table B to 2 decimal places. 4. Added % Weight of substance per Homogeneous Material. 5. Recalculated PPM and %Weight of Substance per package. Revised Table II. DECLARATION OF PACKAGING INDIRECT MATERIALS. Changed CML to WEB in distribution list. Added the CAS number of Silicon. Updated Assembly Site 1 to reflect 4 decimal places on values of material composition table. Removed Tube material on Indirect Material Table. Added assembly site name in the assembly heading. Changed assembly code to assembly site name. Sunset Due – No Change. Changed Cypress Logo. Changed Proprietary CAS Number to Trade Secret. Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-06939 Rev. *F Page 4 of 4