32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 LQ 39.9716 mg 43.8983 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 4 Package Weight – Site 5 B1: 45.0101 mg B2: 44.9921 mg B3: 44.9921mg Package Weight – Site 6 5X5X0.6 mm 46.7401 mg B1: 42.0100 mg B2: 42.0402 mg B3: 40.9366 mg N/A SUMMARY The QFN 32L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434-24LQXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: PT UNISEM Batam Package Qualification Report # 070307 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ32-PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 1 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Purpose of Use Base Material Frame Plating Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ag Ni Pd Au Silver Epoxy resin t-Butyl Phenylglycidyl ether Dicyadiamide Phenolic Hardener Si Au Silica Fused Epoxy Resin1 Phenol Resin Carbon Black 7440-50-8 7440-21-3 7439-95-4 7440-22-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 2101-60-8 15.6796 0.1187 0.0285 0.0047 0.7370 0.0080 0.0050 0.9619 0.1953 0.0976 % weight of substance per Homogeneous material 99.0500% 0.7500% 0.1800% 0.0300% 98.2600% 1.0700% 0.6700% 73.9900% 15.0200% 7.5100% 461-58-5 Trade Secret 0.0060 0.0393 0.4600% 3.0200% 150 982 0.0150 0.0982 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 2.2600 0.5600 18.0560 0.5781 0.5781 0.0578 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 56540 14010 451721 14463 14463 1446 5.6540 1.4010 45.1721 1.4463 1.4463 0.1446 CAS Number Package Weight (mg): Weight by mg 39.9716 PPM % weight of substance per package 392269 2970 713 119 18437 201 126 24064 4885 2442 39.2269 0.2970 0.0713 0.0119 1.8437 0.0201 0.0126 2.4064 0.4885 0.2442 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 2 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 3 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P3/P4) Package Qualification Report # 083909 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ32Amkor Philippines (P3/P4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 4 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Ag Bismaleimide Methacrylate Ester Polymer Acrylate Si Au Phenol Resin Epoxy Resin Carbon Black Silica Fused Crystalline silica Metal hydro oxide 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret Trade Secret 28.5383 0.6878 0.0088 0.0351 0.5660 0.0120 0.0020 %weight of substance per Homogeneous material 97.5000 2.3500 0.0300 0.1200 97.5800 2.0700 0.3500 0.3034 0.0111 0.0111 82.0000 3.0000 3.0000 6,491 237 237 0.6491 0.0237 0.0237 Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret 1333-86-4 60676-86-0 0.0037 0.0407 1.5300 0.3200 1.3203 1.3203 0.0734 9.5355 1.0000 11.0000 100.0000 100.0000 9.0000 9.0000 0.5000 65.0000 79 871 32,734 6,846 28,248 28,248 1,569 204,012 0.0079 0.0871 3.2734 0.6846 2.8248 2.8248 0.1569 20.4012 14808-60-7 0.2934 2.0000 6,277 0.6277 Trade Secret 2.1272 14.5000 45,510 4.5510 CAS Number Package Weight (mg): Weight by mg 46.7401 610,574 14,716 188 751 12,109 257 43 % weight of substance per package 61.0574 1.4716 0.0188 0.0751 1.2109 0.0257 0.0043 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 5 of 18 100.0000 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 6 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package ASSEMBLY Site 3: CARSEM Malaysia Package Qualification Report # 072202 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ32CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 7 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Silver Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Si Au Silica Fused Epoxy Resin Phenol Resin Carbon Black CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret % weight of substance per Homogeneous material 16.9169 0.3954 0.0035 0.0225 0.2000 0.0174 0.0026 0.4686 0.1320 2101-60-8 461-58-5 Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 97.5600% 2.2800% 0.0200% 0.1300% 90.9100% 7.9100% 1.1900% 71.0000% 385,366 9,006 79 514 4,556 396 60 10,675 3,007 % weight of substance per package 38.5366 0.9006 0.0079 0.0514 0.4556 0.0396 0.0060 1.0675 0.3007 PPM 0.0198 20.0000% 3.0000% 451 0.0451 0.0198 0.0198 1.4800 0.6800 22.0382 0.7056 0.7056 0.0706 3.0000% 3.0000% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 451 451 33,714 15,490 502,030 16,074 16,074 1,607 0.0451 0.0451 3.3714 1.5490 50.2030 1.6074 1.6074 0.1607 43.8983 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 8 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package ASSEMBLY Site 4: Cypress Manufacturing Limited (CML) Package Qualification Report # 085002, 092002, 120207 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ32CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 9 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using G7470LA Mold Compound Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Proprietary Bismaleimide Proprietary Polymer Methacrylate Acylate ester Organic Peroxide Silicon Gold Palladium Silica Fused Metal OH Phenol Resin Epoxy Resin Carbon Black CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 17.5533 0.4325 0.0126 0.0216 0.3668 0.0066 0.0066 0.2160 0.0243 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 0.0135 0.0054 0.0054 0.0054 3.6700 2.0295 0.0205 15.5937 0.5286 0.7048 0.7048 0.0881 Package Weight (mg): 42.0100 % weight of substance per Homogeneous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 99.0000% 1.0000% 88.5000% 3.0000% 4.0000% 4.0000% 0.5000% PPM % weight of substance per package 417,836 10,295 300 515 8,731 157 157 5,142 578 41.7836 1.0295 0.0300 0.0515 0.8731 0.0157 0.0157 0.5142 0.0578 321 129 129 129 87,360 48,310 488 371,190 12,583 16,777 16,777 2,097 0.0321 0.0129 0.0129 0.0129 8.7360 4.8310 0.0488 37.1190 1.2583 1.6777 1.6777 0.2097 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 10 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using CEL9220HF13 Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Ni Si Mg Nickel Palladium Gold Silver 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Silicon Trade Secret Gold Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Others 17.5373 0.5469 0.1185 0.0273 0.3764 0.0068 0.0068 0.2160 % weight of substance per Homogeneo us material 96.2000 3.0000 0.6500 0.1500 96.5200 1.7400 1.7400 80.0000 417,157 13,009 2,819 650 8,954 161 161 5,138 % weight of substanc e per package 41.7157 1.3009 0.2819 0.0650 0.8954 0.0161 0.0161 0.5138 0.0243 9.0000 578 0.0578 0.0135 0.0054 0.0054 5.000 2.0000 2.0000 321 128 128 0.0321 0.0128 0.0128 0.0054 3.6700 2.0000 100.0000 128 87,298 0.0128 8.7298 2.0295 0.0205 15.5127 0.5752 0.4358 0.6101 0.0349 0.2615 99.0000 1.0000 89.0000 3.3000 2.5000 3.5000 0.2000 1.5000 48,275 488 368,999 13,682 10,365 14,511 829 6,219 4.8275 0.0488 36.8999 1.3682 1.0365 1.4511 0.0829 0.6219 % Total: 100.0000 Weight by mg PPM Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 Trade Secret Package Weight (mg): 42.0402 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 11 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Substance Composition Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Cu Ni Si Mg Nickel Palladium Gold Silver 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Silicon Trade Secret Copper SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Others 7440-50-8 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 Trade Secret 17.5300 0.5500 0.1200 0.0300 0.3700 0.0100 0.0100 0.2100 % weight of substance per Homogeneous material 96.1602% 3.0170% 0.6583% 0.1646% 94.8718% 2.5641% 2.5641% 77.7778% 428,223 13,435 2,931 733 9,038 244 244 5,130 42.8223% 1.3435% 0.2931% 0.0733% 0.9038% 0.0244% 0.0244% 0.5130% 0.0200 7.4074% 489 0.0489% 0.0100 0.0100 0.0100 3.7037% 3.7037% 3.7037% 244 244 244 0.0244% 0.0244% 0.0244% 0.0100 3.6700 3.7037% 100.0000% 244 89,651 0.0244% 8.9651% 0.9466 15.5100 0.5800 0.4400 0.6100 0.0300 0.2600 100.0000% 88.9845% 3.3276% 2.5244% 3.4997% 0.1721% 1.4917% 23,124 378,879 14,168 10,748 14,901 733 6,351 2.3124% 37.8879% 1.4168% 1.0748% 1.4901% 0.0733% 0.6351% Weight by mg PPM % weight of substance per package Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 Package Weight (mg): 40.9366 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 12 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 112104, 114401 / 120604 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ32ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 13 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Nickel Silicon Magnesium Copper Nickel Palladium Gold Silver Acrylic resin 7440-02-0 7440-21-3 7439-95-4 7440-50-8 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Trade Secret Gold Ion Impurities Epoxy resin A Epoxy resin B Phenol resin Carbon Black Silica Fused Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 0.6582 0.1426 0.0329 21.1063 0.5334 0.0206 0.0060 0.8400 0.0900 % weight of substance per Homogeneous material 3.0000 0.6500 0.1500 96.2000 95.2500 3.6800 1.0700 70.0000 7.5000 0.1110 Weight by mg PPM % weight of substance per package 14,623 3,168 731 468,924 11,851 458 133 18,663 2,000 1.4623 0.3168 0.0731 46.8924 1.1851 0.0458 0.0133 1.8663 0.2000 9.2500 2,466 0.2466 0.0420 0.0900 0.0120 0.0150 1.9000 3.5000 7.5000 1.0000 1.2500 100.0000 933 2,000 267 333 42,213 0.0933 0.2000 0.0267 0.0333 4.2213 0.2000 0.0000 0.8645 0.5763 1.2679 0.0961 16.4053 99.9900 0.0100 4.5000 3.0000 6.6000 0.5000 85.4000 4,443 0 19,206 12,804 28,168 2,134 364,482 0.4443 0.0000 1.9206 1.2804 2.8168 0.2134 36.4482 45.0101 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 14 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper -Palladium Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Nickel Silicon Magnesium Copper Nickel Palladium Gold Silver Acrylic resin 7440-02-0 7440-21-3 7439-95-4 7440-50-8 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Trade Secret Copper Palladium Epoxy resin A Epoxy resin B Phenol resin Carbon Black Silica Fused Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 0.7170 0.1554 0.0359 22.9918 0.5294 0.0205 0.0059 0.2940 0.0315 3.0000 0.6500 0.1500 96.2000 95.2500 3.6800 1.0700 70.0000 7.5000 15,936 3,453 797 511,023 11,766 455 132 6,535 700 % weight of substance per package 1.5936 0.3453 0.0797 51.1023 1.1766 0.0455 0.0132 0.6535 0.0700 0.0389 9.2500 863 0.0863 0.0147 0.0315 0.0042 0.0053 1.5260 3.5000 7.5000 1.0000 1.2500 100.0000 327 700 93 117 33,917 0.0327 0.0700 0.0093 0.0117 3.3917 0.1362 0.0038 0.8303 0.5535 1.2177 0.0923 15.7563 97.3000 2.7000 4.5000 3.0000 6.6000 0.5000 85.4000 3,028 84 18,453 12,302 27,065 2,050 350,204 0.3028 0.0084 1.8453 1.2302 2.7065 0.2050 35.0204 Weight by mg 44.9921 % weight of substance per Homogeneous material PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 15 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Substance Composition 0.7170 0.1554 0.0359 22.9918 0.5294 0.0205 0.0059 0.2940 0.0315 3.0000 0.6500 0.1500 96.2000 95.2500 3.6800 1.0700 70.0000 7.5000 15,936 3,453 797 511,023 11,766 455 132 6,535 700 % weight of substance per package 1.5936 0.3453 0.0797 51.1023 1.1766 0.0455 0.0132 0.6535 0.0700 0.0389 9.2500 863 0.0863 Trade Secret Trade Secret Trade Secret 7440-21-3 0.0147 0.0315 0.0042 0.0053 1.5260 3.5000 7.5000 1.0000 1.2500 100.0000 327 700 93 117 33,917 0.0327 0.0700 0.0093 0.0117 3.3917 0.1400 100.0000 3,112 0.3112 0.8303 0.5535 1.2177 0.0923 15.7563 4.5000 3.0000 6.6000 0.5000 85.4000 18,453 12,302 27,065 2,050 350,204 1.8453 1.2302 2.7065 0.2050 35.0204 CAS Number Nickel Silicon Magnesium Copper Nickel Palladium Gold Silver Acrylic resin 7440-02-0 7440-21-3 7439-95-4 7440-50-8 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Die Circuit Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Wire Interconnect Copper 7440-50-8 Encapsulation Epoxy resin A Epoxy resin B Phenol resin Carbon Black Silica Fused Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Die Attach Mold Compound Adhesive Trade Secret Package Weight (mg): Weight by mg % weight of substance per Homogeneous material 44.9921 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 16 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-16544 ** *A ECN No. Orig. of Change 1191046 EBZ 2611863 DPT *B 2668368 EBZ *C *D 2703184 HLR 2704171 HLR *E 2862441 MAHA *F 3264886 VFR *G 3453554 VFR *H 3533023 COPI *I 3602037 VFR *J 3999400 HLR Description of Change Initial spec release. Add Amkor Phil (P3) for 32QFN (LQ32). Change distribution from CML to WEB. Add Carsem Malaysia (CA) as additional site for 32QFN (LQ32) package Changed the reference package qualification report number for assembly site 3 from 082109 to 072202. Added Assembly site 4. QTP No. 085002. Added Assembly Site 5. QTP No. 092002 – CEL9220HF13 Mold Compound. Corrected the following for the lead frame of assembly site 5: 1. Material composition and CAS numbers 2. Weight by mg 3. % weight of substance per Homogeneous material 4. PPM 5. % weight of substance per package Corrected the following for the lead finish of assembly site 5: 1. Weight by mg 2. PPM 3. % weight of substance per package Added PMDD for Assembly Site 6, ASE-G. Reference QTP # 112104. Added PMDD for Assembly Site 7. Reference QTP # 114401 – ASEK Copper wire qualification. Added PMDD for Assembly Site 8. Reference QTP # 120207 – Autoline RA Copper wire qualification. Added Table B2 for Site 7 PMDD with reference QTP # 120604 – ASEK Pure Cu Wire qualification. Updated material composition table of Assembly Sites 1 to 6 to reflect 4 decimal places on values Removed Tube material on Indirect Materials table. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 17 of 18 32L – QFN 5X5X0.6 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-16544 *K ECN No. Orig. of Change 4052508 YUM *L 5320102 HLR MQJ Description of Change Added assembly site name in the assembly heading in site 1, 2, 3, 4 and 5. Changed assembly code to assembly site name in site site 1, 2, 3, 4 and 5. Consolidate material composition in one assembly site. 1. CML 2.ASET Changed Cypress Logo. Changed the substances with “------------- “and Proprietary to “Trade Secret". Removed Distribution: WEB and Posting: None in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-16544 Rev. *L Page 18 of 18