172-FBGA 15X15MM NON PB-FREE Package Material Declaration Datasheet.pdf

172-FBGA (15 x 15 mm)
Non Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BB
439.0026 mg
Body Size (mil/mm)
Package Weight – Site 2
15 x 15 mm
N/A
SUMMARY
The 172-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are
RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above
allowable levels).
ASSEMBLY Site 1 – Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 005006(Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS
are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is
not considered Pb-Free or RoHS compliant.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
Analysis
Report
(Note 2)
0
0
6.6748
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
15,204
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05410 Rev. *F
Page 1 of 4
172-FBGA (15 x 15 mm)
Non Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
SiO2
60676-86-0
15.5837
% weight of
substance per
Homogenous
material
11.0000%
Acrylic
29690-82-2
14.1670
Epoxy
68541-56-0
Bisphenol
Triazol
Cu
Ni
13676-54-5
25722-66-1
7440-50-8
7440-02-0
Au
Br
Sn
Pb
Ag
Epoxy Resin
Functionalized
Ester
Diester
Si
Au
Silica Fused
Epoxy Resin
Phenolic Resin
Silica
Antimony
Pentoxide
Brominated
Compound
Silica Quartz
Carbon Black
Silica Cristobalite
Antimony
Trioxide
Substance
Composition
35,498
% weight of
substance
per
package
3.5498
10.0000%
32,271
3.2271
11.3336
8.0000%
25,817
2.5817
21.2505
24.7923
51.5395
2.1251
15.0000%
17.5000%
36.3800%
1.5000%
48,406
56,474
117,401
4,841
4.8406
5.6474
11.7401
0.4841
7440-57-5
7726-95-6
7440-31-5
7439-92-1
7440-22-4
Trade Secret
Trade Secret
0.7934
0.0850
11.3652
6.6748
19.1803
1.3611
1.3611
0.5600%
0.0600%
63.0000%
37.0000%
76.6600%
5.4400%
5.4400%
1,807
194
25,889
15,204
43,691
3,100
3,100
0.1807
0.0194
2.5889
1.5204
4.3691
0.3100
0.3100
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
7631-86-9
1314-60-9
3.1200
22.7000
7.2000
150.7766
22.4370
11.2185
33.6555
1.2340
12.4700%
100.0000%
100.0000%
67.2000%
10.0000%
5.0000%
15.0000%
0.5500%
7,107
51,708
16,401
343,453
51,109
25,555
76,664
2,811
0.7107
5.1708
1.6401
34.3453
5.1109
2.5555
7.6664
0.2811
Trade Secret
1.2340
0.5500%
2,811
0.2811
14808-60-7
1333-86-4
14464-46-1
1309-64-4
1.1219
1.1219
1.1219
0.4487
0.5000%
0.5000%
0.5000%
0.2000%
2,555
2,555
2,555
1,022
0.2555
0.2555
0.2555
0.1022
CAS Number
Package Weight (mg):
Weight by
mg
439.0026
PPM
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05410 Rev. *F
Page 2 of 4
172-FBGA (15 x 15 mm)
Non Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
PBDE
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05410 Rev. *F
Page 3 of 4
172-FBGA (15 x 15 mm)
Non Pb-Free Package
Document History Page
Document Title:
Document Number:
172-FBGA 15X15MM NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-05410
Rev. ECN No. Orig. of
Change
**
402752
GFJ
*A
2584298 HLR
*B
2791449 HLR
*C
3447000 HLR
*D
4031247 YUM
*E
4210985 HLR
*F
5052095 HLR
SLLO
Description of Change
New document
Added the CAS number for Br and Antimony Pentoxide.
Changed CAS number of Au.
Changed the value of Pb on the Declaration of Packaged Units.
Added the %weight of homogenous on material composition
table.
Completed the RoHS substance on Indirect Material table.
Change the reference Package QTP No. to 005006. Deleted
044501, 021801 and 021113.
Updated the material composition table to reflect 4 decimal
places on values.
Removed tube material on declaration of packaging table.
Added assembly site name in the Assembly heading.
Added the weight for Lead (Pb) on Section 1 for Banned
Susbtances.
Changed the substances with “------------- “to “Trade Secret.
Removed Distribution and Posting
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05410 Rev. *F
Page 4 of 4