172-FBGA (15 x 15 mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BB 439.0026 mg Body Size (mil/mm) Package Weight – Site 2 15 x 15 mm N/A SUMMARY The 172-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1 – Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 005006(Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 6.6748 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 15,204 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05410 Rev. *F Page 1 of 4 172-FBGA (15 x 15 mm) Non Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation SiO2 60676-86-0 15.5837 % weight of substance per Homogenous material 11.0000% Acrylic 29690-82-2 14.1670 Epoxy 68541-56-0 Bisphenol Triazol Cu Ni 13676-54-5 25722-66-1 7440-50-8 7440-02-0 Au Br Sn Pb Ag Epoxy Resin Functionalized Ester Diester Si Au Silica Fused Epoxy Resin Phenolic Resin Silica Antimony Pentoxide Brominated Compound Silica Quartz Carbon Black Silica Cristobalite Antimony Trioxide Substance Composition 35,498 % weight of substance per package 3.5498 10.0000% 32,271 3.2271 11.3336 8.0000% 25,817 2.5817 21.2505 24.7923 51.5395 2.1251 15.0000% 17.5000% 36.3800% 1.5000% 48,406 56,474 117,401 4,841 4.8406 5.6474 11.7401 0.4841 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 Trade Secret Trade Secret 0.7934 0.0850 11.3652 6.6748 19.1803 1.3611 1.3611 0.5600% 0.0600% 63.0000% 37.0000% 76.6600% 5.4400% 5.4400% 1,807 194 25,889 15,204 43,691 3,100 3,100 0.1807 0.0194 2.5889 1.5204 4.3691 0.3100 0.3100 Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 7631-86-9 1314-60-9 3.1200 22.7000 7.2000 150.7766 22.4370 11.2185 33.6555 1.2340 12.4700% 100.0000% 100.0000% 67.2000% 10.0000% 5.0000% 15.0000% 0.5500% 7,107 51,708 16,401 343,453 51,109 25,555 76,664 2,811 0.7107 5.1708 1.6401 34.3453 5.1109 2.5555 7.6664 0.2811 Trade Secret 1.2340 0.5500% 2,811 0.2811 14808-60-7 1333-86-4 14464-46-1 1309-64-4 1.1219 1.1219 1.1219 0.4487 0.5000% 0.5000% 0.5000% 0.2000% 2,555 2,555 2,555 1,022 0.2555 0.2555 0.2555 0.1022 CAS Number Package Weight (mg): Weight by mg 439.0026 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05410 Rev. *F Page 2 of 4 172-FBGA (15 x 15 mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05410 Rev. *F Page 3 of 4 172-FBGA (15 x 15 mm) Non Pb-Free Package Document History Page Document Title: Document Number: 172-FBGA 15X15MM NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05410 Rev. ECN No. Orig. of Change ** 402752 GFJ *A 2584298 HLR *B 2791449 HLR *C 3447000 HLR *D 4031247 YUM *E 4210985 HLR *F 5052095 HLR SLLO Description of Change New document Added the CAS number for Br and Antimony Pentoxide. Changed CAS number of Au. Changed the value of Pb on the Declaration of Packaged Units. Added the %weight of homogenous on material composition table. Completed the RoHS substance on Indirect Material table. Change the reference Package QTP No. to 005006. Deleted 044501, 021801 and 021113. Updated the material composition table to reflect 4 decimal places on values. Removed tube material on declaration of packaging table. Added assembly site name in the Assembly heading. Added the weight for Lead (Pb) on Section 1 for Banned Susbtances. Changed the substances with “------------- “to “Trade Secret. Removed Distribution and Posting Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05410 Rev. *F Page 4 of 4