Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 2 ■ Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick ❐ Background wafer to 11 mil thick Level 3 Wafers are probed to guarantee full functionality and all static DC and AC parameters. All parameters are guaranteed and warranted, including device reliability. Die ❐ Die in wafer form 25 to 30 mil thick ❐ Background die to 14 mil thick ❐ Background die to 11 mil thick ❐ Known good die (KGD) levels 1, 2, 3, and 4 Wafers and die in wafer form are shipped in jars with die maps. Background die are shipped as die in waffle packs. Level 4 ■ Temperature ranges ❐ Commercial, industrial, automotive and military ■ Waffle pack packages Wafers are probed to guarantee all static DC parameters. RF testing guidelines and statistical data of packaged parts are provided. Background die are shipped as die in waffle packs. Yes None None No Yes Yes Partial None No Known Good Die (KGD) KGD is available in both die in wafer form and background die. Product in wafer form is not background and is anywhere from 25 to 30 mil thick. Background die are 14 or 11 mil thick, sawed, and shipped in waffle packs. The product in either form is tested at four different levels. 3 Yes Yes All All No 4 No Yes RF[1] None In package only[1] RF Testing Guaranteed Static/ DC Parameters Yes 2 Wafer Guaranteed AC Parameters Guaranteed Functionality 1 Cypress’s package products are sold in both wafer and die form. Cypress classifies them as follows: Wafers are probed at room temperature and high temperature to guarantee full functionality. Other parameters are guaranteed based on the level of product that is supplied to the customer. Details of product levels are described later in this document. Guaranteed Other including reliability Table 1. Wafer Test Levels Wafer and Die Classification Level ■ Wafers are probed to guarantee full functionality to all static DC and partial AC parameters. Other parameters are not guaranteed and warranted, including device reliability. Level 1 Wafers are probed to guarantee full functionality and all static DC parameters. Other parameters are not guaranteed and warranted, including device reliability. Note 1. Statistical RF parameters based on packaged parts; dice shipped in waffle packs are not tested. Average RF yield fallout (approximately 2%, varies by product) compensated by overshipment; yield excursions not included. Cypress Semiconductor Corporation Document Number: 38-05299 Rev. *E • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised February 12, 2014 Wafer and Die Information Sheet Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Operating Range Range [2, 3] Ambient Temperature [3] Storage temperature ................................ –65 C to +150 C Commercial 0 C to +70 C Ambient temperature with power applied .......................................... –55 C to +125 C Industrial –40 C to +85 C Automotive-E –40 C to +125 C Military –55 C to +125 C Functional Characteristics Silicon Type [3] Product Type Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs and sync SRAMs RF Products DC Test Parameters [3, 4] AC Test Parameters [3, 4] Wafer Per product spec None KGD 1 Per product spec None KGD 2 Per product spec Partial per product spec KGD 3 Per product spec Full per product spec KGD 4 Per product spec Statistical RF test data only Notes 2. Check product specific datasheets for available temperature ranges. 3. Shaded area is advance information. 4. Contact a Cypress Representative for product specific test parameters. Document Number: 38-05299 Rev. *E Page 2 of 7 Wafer and Die Information Sheet Ordering Information Silicon Type [5] Wafer KGD 1 Ordering Code [5, 6] Wafer Code [5] Wafer/Die Type [5] CYxxxx-WAFC WW Wafer (25 to 30 mil) CYxxxx-WW14C WW Wafer (14 mil) CYxxxx-WW11C WW Wafer (11 mil) CYxxxx-1XWC XW Die (25 to 30 mil) in wafer form CYxxxx-1XW14C XW Die (14 mil) in wafer form CYxxxx-1XW11C XW Die (11 mil) in wafer form CYxxxx-1X14C X Die (14 mil) in waffle pack CYxxxx-1X11C X Die (11 mil) in waffle pack CYxxxx-1X07C X Die (7 mil) in waffle pack CYxxxx-1XWI XW Die (25 to 30 mil) in wafer form CYxxxx-1XW14I XW Die (14 mil) in wafer form CYxxxx-1XW11I XW Die (11 mil) in wafer form CYxxxx-1X14I X Die (14 mil) in waffle pack CYxxxx-1X11I X Die (11 mil) in waffle pack CYxxxx-1X07I X Die (7 mil) in waffle pack CYxxxx-1XWE XW Die (25 to 30 mil) in wafer form CYxxxx-1XW14E XW Die (14 mil) in wafer form CYxxxx-1XW11E XW Die (11 mil) in wafer form CYxxxx-1X14E X Die (14 mil) in waffle pack CYxxxx-1X11E X Die (11 mil) in waffle pack CYxxxx-1X07E X Die (7 mil) in waffle pack CYxxxx-1XWM XW Die (25 to 30 mil) in wafer form Operating Range [5] Commercial Commercial Industrial Automotive Military Notes 5. Shaded area is advance information. 6. CYxxxx denotes the packaged product designator. For example, the Cypress part number CY7C1049B-12VI in KGD1 (14 mil) would be a CY7C1049B-1X14I. Not all combinations are available for all products. Contact a Cypress Representative for product availability. Document Number: 38-05299 Rev. *E Page 3 of 7 Wafer and Die Information Sheet Ordering Information (continued) Silicon Type [5] KGD 2 KGD 3 KGD 4 Ordering Code [5, 6] Wafer Code [5] Wafer/Die Type [5] CYxxxx-2XWC XW Die (25 to 30 mil) in wafer form CYxxxx-2XW14C XW Die (14 mil) in wafer form CYxxxx-2XW11C XW Die (11 mil) in wafer form CYxxxx-2X14C X Die (14 mil) in waffle pack CYxxxx-2X11C X Die (11 mil) in waffle pack CYxxxx-2X07C X Die (7 mil) in waffle pack CYxxxx-2XWI XW Die (25 to 30 mil) in wafer form CYxxxx-2XW14I XW Die (14 mil) in wafer form CYxxxx-2XW11I XW Die (11 mil) in wafer form CYxxxx-2X14I X Die (14 mil) in waffle pack CYxxxx-2X11I X Die (11 mil) in waffle pack CYxxxx-2X07I X Die (7 mil) in waffle pack CYxxxx-2XWE XW Die (25 to 30 mil) in wafer form CYxxxx-2XW14E XW Die (14 mil) in wafer form CYxxxx-2XW11E XW Die (11 mil) in wafer form CYxxxx-2X14E X Die (14 mil) in waffle pack CYxxxx-2X11E X Die (11 mil) in waffle pack CYxxxx-2X07E X Die (7 mil) in waffle pack CYxxxx-3XWC XW Die (25 to 30 mil) in wafer form CYxxxx-3XW14C XW Die (14 mil) in wafer form CYxxxx-3XW11C XW Die (11 mil) in wafer form CYxxxx-3X14C X Die (14 mil) in waffle pack CYxxxx-3X11C X Die (11 mil) in waffle pack CYxxxx-3X07C X Die (7 mil) in waffle pack CYxxxx-3XWI XW Die (25 to 30 mil) in wafer form CYxxxx-3XW14I XW Die (14 mil) in wafer form CYxxxx-3XW11I XW Die (11 mil) in wafer form CYxxxx-3X14I X Die (14 mil) in waffle pack CYxxxx-3X11I X Die (11 mil) in waffle pack CYxxxx-3X07I X Die (7 mil) in waffle pack CYxxxx-3XWE XW Die (25 to 30 mil) in wafer form CYxxxx-3XW14E XW Die (14 mil) in wafer form CYxxxx-3XW11E XW Die (11 mil) in wafer form CYxxxx-3X14E X Die (14 mil) in waffle pack CYxxxx-3X11E X Die (11 mil) in waffle pack CYxxxx-3X07E X Die (7 mil) in waffle pack CYRF6936-4X11C X Die (11 mil) in waffle pack Document Number: 38-05299 Rev. *E Operating Range [5] Commercial Industrial Automotive Commercial Industrial Automotive Commercial Page 4 of 7 Wafer and Die Information Sheet Ordering Code Definitions CY xxxxx - xxxxx X Temperature Range: X = C or I or E or M C = Commercial; I = Industrial; E = Extended; M = Military KGD/Package Type/Die Thickness Part Number Company ID: CY = Cypress Acronyms Document Conventions Table 2. Acronyms Used in this Document Acronym Description Units of Measure Table 3. Units of Measure COB Chip-On-Board FIFO First-In First-Out mil One-thousandth of an inch [0.001”] KGD Known Good Die C degree Celsius PROM Programmable Read-Only Memory RF Radio Frequency SRAM Static Random Access Memory USB LP Universal Serial Bus Low-Power Document Number: 38-05299 Rev. *E Symbol Unit of Measure Page 5 of 7 Wafer and Die Information Sheet Document History Page Document Title: Wafer and Die Information Sheet – Memory and Wireless / RF Products Document Number: 38-05299 Revision ECN Orig. of Change Submission Date Description of Change ** 116316 DFP/MEG 09/26/02 New SRAM wafer and die information sheet *A 121670 DFP/DKJ 12/10/02 Changed title to “Wafer and Die Infosheet Memory Products.” Added Dual ports, FIFOs, and PROMs to portfolio *B 2751796 AFB 08/13/09 Added KGD Level 4 for WUSBLP COB sales *C 2997682 JAT 07/31/10 1) Change: Added qualified package die (7 mil) in waffle pack Ordering Code X07 Sections affected: Ordering Information Impact: Additional Qualified 7 mil ordering option 2) Change: Clarified product type for RF products Sections affected: Functional Characteristics on page 2. Impact: Identify correct Product Type 3) Change: Corrected ordering code for CYRF6936-4X11C, added C thermal type for all commercial ordering codes flowing standard Cypress nomenclature Sections affected: Ordering Information Impact: Align ordering code information to Cypress standards 4) Change: Removed references to manufacturing test kit (MTK) with reference to spec 82-00026 Sections affected: Entire document Impact: Obsolete kit ordering information 5) Change: Clarified Automotive Operating Range to Automotive-E Sections affected: Operating Range on page 2 Impact: Differentiate standard automotive-A and automotive-E (extended) 6) Change: Corrected several miscellaneous document typos, updated Spec title from “Wafer and Die Infosheet” to “Wafer and Die Information Sheet.” Updated template and styles. Added Ordering code definitions, Acronym table, and Document conventions Sections affected: Entire document Impact: Document adheres to Cypress standards *D 3106457 JAT 12/09/2010 Sunset review; no technical updates. *E 4278996 HRP 02/12/2014 Updated Features: Included Military temperature range. Updated Operating Range: Included Military temperature range. Updated Ordering Information (Updated part numbers). Updated in new template. Completing Sunset Review. Document Number: 38-05299 Rev. *E Page 6 of 7 Wafer and Die Information Sheet Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/go/support cypress.com/go/touch USB Controllers Wireless/RF psoc.cypress.com/solutions cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2002-2014. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-05299 Rev. *E Revised February 12, 2014 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 7 of 7