SS8027G 3.3V 1A Low Dropout Regulator FEATURES DESCRIPTION Dropout voltage typically 0. 8V @ I O = 1A Output current in excess of 1A Output voltage accuracy ±2% Quiescent current, typically 600µA Internal short circuit current limit Internal over temperature protection The SS8027G positive 3.3V voltage regulator features the ability to source 1A of output current with a dropout voltage of typically 0.8V over the entire operating temperature range. A low quiescent current is provided over the entire output current range. The typical quiescent current is 0.6mA. Furthermore, quiescent current is reduced when the regulator is in the dropout mode (V IN < 3.3V). APPLICATIONS CD-R/W ADSL Cable Modem Set -Top-Box LAN switch/Hub Router DVD-R/W Familiar regulat or features such as over-temperature and over-current protection circuits are provided to prevent the device from being damaged by abnormal operating conditions. Pb-free, RoHS compliant. ORDERING INFORMATION SS8027GTXXXX Packing Type Pin Option Package Type PACKAGE TYPE PIN OPTION GT3 : TO 220 Pb-free GT4 : TO 252 Pb-free GT5 : TO 263 Pb-free GT6 : SOT 223 Pb-free 1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN TYPICAL APPLICATION PACKING 2 GND V IN VOUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND TR : Tape & Reel TB : Tube PIN CONFIGURATION IO VIN SS8027G C1 0.47µF IQ VOUT Top View Top View COUT 10µF 1 2 3 TO-220 5/26/2005 Rev.2.2 Top View www.SiliconStandard.com 1 2 3 TO-252 and TO-263 1 2 3 SOT-223 1 of 10 SS8027G Absolute Maximum Ratings (Note 1) Input Voltage……………………….……………...................................................................……..……10V Power Dissipation Internally Limited . (Note 2) Maximum Junction Temperature.…..……………...............................................................………...150°C Storage Temperature Range….……....................................................................................…...-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering TO 220, TO 263 Pac kage…………….........................................................................…..………..260°C, 10s TO 252, SOT 223 Package………………….........................................................................………260°C, 4s Continuous Power Dissipation (TA = +25°C) SOT 223(1) ……………………..................................................................………….………………....0.8W TO 252(1) ……………………………..................................................................….………………..….1.0W TO 263(1) ……………………………..................................................................….………………..….1.6W TO 220(1) ………………………….………..................................................................……………..….2.0W Note (1): See Recommended Minimum Footprint Operating Conditions (Note 1) Input Voltage……………………………….....................................................................…………….4V~7V Temperature Range………….…….........................................................................................……-40°C ≤ TJ ≤125°C Electrical Characteristics VIN =5V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature CONDITIONS 50mA < IO <1A 4V < V IN < 7V, IO = 10mA 50mA < IO < 1A 200mA DC and 100mA AC, fo = 120Hz V IN = 5V f i = 120Hz, 1V P-P , Io = 100mA IO = 1A IO = 100mA MIN TYP MAX UNITS 3.234 3.3 20 30 100 0.6 42 0.8 200 1.9 125 3.366 30 50 V mV mV mΩ mA dB V mV A °C 1.6 Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the SS8027G in the SOT-223 package, θ JA is 156°C/W; in the TO-252 pac kage, θJA is 125°C/W; in the TO-263 package, θJA is 75°C/W, and in the TO-220 package, θJA is 60°C/W (no heat sink). [See Recommended Minimum Footprint] If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance junction-to-case (θJC) of 3°C/W and the thermal resistance added by the heat sink and thermal interface.The thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the pac kage. The safe operation area of SOT-223, TO-252, TO-263 or TO-220 packages can be seen in “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty-cycle pulse techniques are used during test to maintain the junction temperature as close to ambient temperature as possible. Note4: The output capacitor should be a tantalum or aluminum type. 5/26/2005 Rev.2.2 www.SiliconStandard.com 2 of 10 SS8027G Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques, so that average chip temperature is not significantly affected. 5/26/2005 Rev.2.2 Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques, so that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. www.SiliconStandard.com 3 of 10 SS8027G Typical Performance Characteristics (V IN=5V, CIN=1µF, COUT =10µF, TA=25°C, unless otherwise noted.) Line Transient Load Transient Ch1: Vout (offset=3.30V) Ch2: Vin (offset=5.0V) Iout=100mA Ch1: Vout (offset=3.30V) Ch2: Iout (780mA/div) Dropout Voltage vs. Load Current 1200 3.360 1000 Dropout Voltage (mV) Output Voltage (V) Output Voltage vs. Load Current 3.380 3.340 3.320 3.300 3.280 800 600 400 200 3.260 0 0 100 200 300 400 500 600 700 800 900 1000 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Load Current (mA) Ground Current vs. Load Current 2.2 2.0 Ground Current (mA) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) 5/26/2005 Rev.2.2 www.SiliconStandard.com 4 of 10 SS8027G Typical Performance Characteristics (continued) Safe Operating Area of SOT 223 Maximum Power Dissipation of SOT 223 1200 1.0 Maximum recommended output current TA =25°C,Still Air 1100 0.9 1000 700 0.7 TA=25¢ J TA=55¢ J 600 TA=85¢ J 500 400 300 Power Dissipation (W) 800 Output Current (mA) 0.8 1oz Copper on SOT 223 Package Mounted on recommended mimimum footprint (R£ JcA=156°C/W) 900 0.6 0.5 0.4 Still Air 1oz Copper on SOT 223 Package Mounted on recommend mimimum footprint (R£ JcA=156°C/W) 0.3 0.2 200 0.1 100 0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature T A (°C) Input-Output Voltage Differential VIN-VOUT (V) Note: VIN(max) <= 6.5V Safe Operating Area of TO 252 Maximum Power Dissipation of TO 252 1200 1.2 Maximum recommended output current TA=25°C,Still Air 1.1 1000 1.0 900 0.9 800 TA=25¢ J 700 TA=55¢ J TA=85¢ J 600 500 400 1oz Copper on TO 252 Package Mounted on recommended mimimum footprint (R£ JcA=125°C/W) 300 200 100 Power Dissipation (W) Output Current (mA) 1100 0.8 0.7 0.6 0.5 Still Air 1oz Copper on TO 252 Package Mounted on recommend mimimum footprint (R£ JcA=125°C/W) 0.4 0.3 0.2 0.1 0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature T A (°C) Input-Output Voltaage Differential VIN-VOUT (V) Note: VIN(max) <= 6.5V Safe Operating Area of TO 263 Maximum Power Dissipation of TO 263 1.8 1200 Maximum recommended output current TA=25°C,Still Air 1100 1.6 1000 1.4 800 700 TA=25¢ J 600 TA=55¢ J 500 TA=85¢ J 400 1oz Copper on TO 263 Package Mounted on recommended mimimum footprint (R£ JcA=75°C/W) 300 200 100 Power Dissipation (W) Output Current (mA) 900 1.2 1.0 0.8 0.6 Still Air 1oz Copper on TO 263 Package Mounted on recommend mimimum footprint (R£ JcA=75°C/W) 0.4 0.2 0.0 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 25 35 45 Input-Output Voltaage Differential VIN-VOUT (V) 55 65 75 85 95 105 115 125 Amibent Temperature T A (¢ )J Note: VIN(max) <= 6.5V 5/26/2005 Rev.2.2 www.SiliconStandard.com 5 of 10 SS8027G Typical Performance Characteristics (continued) Safe Operating Area of TO 220 Maximum Power Dissipation of TO 220 1200 2.4 Maximum recommended output current TA=25°C,Still Air No Heat Sink 2.2 1000 2.0 900 1.8 800 1.6 700 TA=25¢ J TA=55¢ J 600 TA=85¢ J 500 400 300 Mounted on TO 220 recommended mimimum footprint, without heat sink (R £ cJ A=60°C/W) 200 100 Power Dissipation (W) Output Current (mA) 1100 No Heat Sink 1.4 1.2 1.0 0.8 Still Air 1oz Copper on TO 220 Package Mounted on recommend mimimum footprint (R£ cJA =60°C/W) 0.6 0.4 0.2 0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 25 35 Input-Output Voltaage Differential VIN-V OUT (V) 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Note: VIN(max) <= 6.5V Recommended Minimum Footprint 5/26/2005 Rev.2.2 www.SiliconStandard.com 6 of 10 SS8027G Package Information E A E1 E1 R F d D D1 I L e C A1 b e1 b1 TO-220 (GT3) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 4.318 4.826 0.170 0.190 A1 2.46 2.72 0.097 0.107 b 0.69 0.94 0.027 0.037 b1 1.143 1.397 0.045 0.055 C 0.304 0.460 0.012 0.018 D 3.429 3.683 0.135 0.145 D1 8.53 9.04 0.336 0.356 d 2.62 2.87 0.103 0.113 E 9.906 10.40 0.390 0.410 E1 2.84 5.13 0.112 0.202 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 F 1.143 1.397 0.045 0.055 I 3.454 3.962 0.136 0.156 L 13.589 14.351 0.535 0.565 5/26/2005 Rev.2.2 www.SiliconStandard.com 7 of 10 SS8027G E A F E1 L1 H D L2 A1 L3 θ b e C e1 TO-252 (GT4) Package SYMBOL MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.205 e 2.26BSC 0.215 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4° 5/26/2005 Rev.2.2 www.SiliconStandard.com 8 of 10 SS8027G A D α B1 C 1 3°(4X ) H E L L2 e e1 13°(4X) A1 B SOT-223 (GT6) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 0.146 e 2.30 BSC e1 4.60 BSC H 6.70 0.090 BSC 0.181 BSC 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 0.06 BSC 0.0024 BSC a 0º 10º 0º 10º Package Orientation Feed Direction TO-252 and TO-263 Package Orientation 5/26/2005 Rev.2.2 Feed Direction SOT 223 Package Orientation www.SiliconStandard.com 9 of 10 SS8027G A E A1 L3 D H C L1 L e L2 A2 e1 b b1 TO-263 (GT5) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.70 10.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 L3 1.40MAX 0.111 0.055MAX Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 5/26/2005 Rev.2.2 www.SiliconStandard.com 10 of 10