Q3 - 2005

Product Reliability
Cypress
2005 Q3 RELIABILITY REPORT
TABLE OF CONTENTS
1.0
OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM
2
2.0
DEVICE RELIABILITY
3
3.0
2.1
EARLY FAILURE RATE SUMMARY
3
2.2
LONG TERM FAILURE RATE SUMMARY
4
PACKAGE RELIABILITY
5
3.1
PRESSURE COOKER TEST
6
3.2
HAST (HIGHLY ACCELERATED STRESS TEST)
7
3.3
TEMPERATURE CYCLE
8
APPENDIX A: FAILURE RATE CALCULATION
9
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
13
APPENDIX C: EQUIVALENCE OF STRESS TEST CONDITIONS
15
APPENDIX D: RELIABILITY DATA
16
Note: The results reported herein are for 3rd Quarter 2005.
2005 Q3 RELIABILITY REPORT
Page 1 of 64
Product Reliability
Cypress
1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR, INC. TOTAL QUALITY MANAGEMENT SYSTEM
This report summarizes Cypress Semiconductor Product Reliability for the period of the 3rd quarter of 2005. It
includes data from devices fabricated at the Round Rock, Texas; Minnesota and Fab foundry facilities and
packaged-device data from assembly sites at Cypress Philippines and sub-contractors.
Cypress Semiconductor has established aggressive reliability objectives to assure that all products exhibit
reliability, which exceeds customer reliability requirements for purchased components. The quality standard at
Cypress is zero defects resulting in a culture requiring continuous improvement in quality and reliability.
Product reliability is assured by a total quality management system. The quality management system is
described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number
90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review
and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4)
manufacturing identification of "Maverick Lot" yield limits; (5) formal training and certification of manufacturing
personnel; (6) qualification of new products and manufacturing processes; (7) continuous reliability monitoring;
(8) formal failure analysis and corrective action; and (9) competitive benchmarking.
Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress
Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress
Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard
production material. Sample selection is based on generic product families. These generic products are
designed with very similar design rules and manufactured from a core set of processes.
Reliability strategy requires that every failure that occurs during reliability testing be subjected to failure
analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism.
Corrective action is then implemented to prevent future failures, resulting in continuous improvement in product
reliability.
Copies of the Cypress Semiconductor documents referenced herein are available through your Cypress
Semiconductor sales representative. Questions about product reliability may be addressed to the undersigned.
Sabbas Daniel
Director of Reliability
Francis Courreges
Vice-President for Quality
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134-1599
Cypress Quality Fax: (408) 943-2165
2005 Q3 RELIABILITY REPORT
Page 2 of 64
Product Reliability
Cypress
2.0
PRODUCT RELIABILITY
In product stress testing, the main emphasis is on the useful life section of the bathtub curve. The test
methodology used to predict the useful life period is a steady-state life test under a dynamic bias and at
temperatures 125°C or 150°C for the maximum specified use voltage of the product. The duration at these
temperatures is 1,000 and 500 hours, respectively.
In Cypress, product reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. Each fab site and technology family from each product line are being
sampled for product monitor. These reliability tests utilize the following stress factors to accelerate failure:
temperature, current and /or voltage. The product reliability tests currently employed at Cypress include Early
Failure Rate (EFR) and Long Term Failure Rate (LFR) .
2.1
EARLY FAILURE RATE SUMMARY
Early Failure Rate Determination: High Temperature Operating Life testing (HTOL), for as long
as 96 hours, is used to estimate device early failure rate. This stress will typically correspond
to the first 2000 hours of device operation in a system environment. The remainder of the
device’s lifetime is characterized with extended LFR testing (See Section 3)
Test
:
Conditions :
Duration
:
Failure
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal + 15%, 150°C or 125°C.
48 hours HTOL at 150°C or 96 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Table 1. Early Failure Rate Summary
Technology
B53
C8
FL28
P20
P26
POWER 165
PROMOS .17
R28
R42
R5
R7
R8
R9
S4
STARM
TSMC 130
TSMC 150
TSMC 180
Grand Total
Device Hours
6,194
315,230
19,277
6,194
49,920
425,899
248,903
77,568
29,203
582,165
1,689,622
389,133
2,942,855
606,573
6,194
56,578
73,177
54,225
7,578,908
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
Insufficient
17
Insufficient
Insufficient
Insufficient
13
22
Insufficient
Insufficient
9
3
14
2
9
Insufficient
Insufficient
Insufficient
Insufficient
0
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample.
2005 Q3 RELIABILITY REPORT
Page 3 of 64
Product Reliability
Cypress
2.2
LONG TERM FAILURE RATE SUMMARY
A High Temperature Operating Life test (HTOL) is used to estimate long-term reliability. By
operating the devices at accelerated temperature and voltage, hundreds of thousands of use
hours can be compressed into hundreds of test hours.
Test
:
Conditions :
Duration
:
Failure
Fit Rate
:
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal +15% 150°C or 125°C.
A minimum of 80 hours at 150°C or 168 hours at 125°C
Generally 500 hours at 150°C or 1000 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Derated to 55° C ambient, with 60% upper confidence bound for 0 failures,
Ea =0.7ev (Refer to Appendix A)
Table 2. Long Term Failure Rate Summary
Technology
B53
C8
FL28
P20
PROMOS .17
R28
R42
R5
R7
R8
R9
S4
STARM
TSMC 130
Grand Total
Device Hours
64,516
494,171
138,787
48,387
48,387
143,600
144,625
876,606
965,025
317,690
1,623,012
859,905
48,387
185,455
185,455
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
Insufficient
11
Insufficient
Insufficient
Insufficient
Insufficient
Insufficient
6
6
17
3
6
Insufficient
29
29
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample
2005 Q3 RELIABILITY REPORT
Page 4 of 64
Product Reliability
Cypress
3.0
PACKAGE RELIABILITY
Package-level reliability testing refers to the assessment of the over-all reliability of the device in packaged
form. This consists of subjecting packaged samples to reliability tests that expose the various sample sets to
different stress conditions, after which the samples are tested for any degradation in quality after the stress.
In Cypress, package reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. The reliability test employed is chosen based on the failure
mechanism, as different stress tests accelerate different failure mechanisms. These reliability tests utilize one
or more of the following stress factors to accelerate failure: temperature, moisture or humidity, current, voltage,
and pressure. The package reliability tests currently employed at Cypress include Pressure Cooker Test
(PCT, Highly Accelerated Stress Test (HAST), Temperature Cycle Test (TCT), and High Temperature Storage
(HTS). Figure 1 shows the Cypress package reliability stress flow.
Surface-mount samples are preconditioned per Jedec Std JESD22-A113 prior to package reliability testing.
This is required prior TCT, PCT and HAST testing. Preconditioning simulates the board mounting process of
the customer. It normally consists of a temperature cycle to simulate exposure to different temperatures
during shipping, a bake to drive away the moisture inside the packages of the samples, a soak to drive a
controlled amount of moisture into the package, and three cycles of convection reflow. Packages are soaked
and reflowed based on its shipping moisture sensitivity classification. The samples are tested (acoustic and
electrical) after preconditioning, failures from which are considered as preconditioning failures and not reliability
failures. Preconditioning failures should be taken seriously, since these imply that the samples are not robust
enough to even withstand the board mounting process.
Cypress conducts all major classes of package reliability tests on each of its package families. The package
characteristics and assembly locations are the primary considerations when grouping packages into package
families. A package family may consist of a group of 44-lead to 144-lead TQFP packages manufactured at a
particular manufacturing location.
Initital
Electrical Testing
Time Zero
Acoustic Analysis
(serialized 15 units)
Moisture
Pre-conditioning
Post Pre-Con
Electrical Testing
Post Pre-Con
Acoustic Analysis
(same serialized units)
Temperature Cycle Test
(TCT)
(300, 500, 1000 cycles))
Pressure Cooker Test
(PCT)
(168 hours)
Highly Accelerated
Stress Test (HAST)
(128 hours)
High Temperature
Storage (HTS)
(500, 1000 hours)
Post Stress
Electrical Testing
Figure 1. Cypress Package Reliability Stress Flow
2005 Q3 RELIABILITY REPORT
Page 5 of 64
Product Reliability
Cypress
3.1
PRESSURE COOKER TEST (PCT)
The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure
environmental durability of epoxy-packaged parts. Passivation cracks, ionic contamination,
and corrosion susceptibility are all accelerated by this stress.
Conditions
Pre-Conditioning
:
:
Failure Modes
Failure Mechanism
:
:
15 PSIG, 121°C, No bias, for a minimum of 168 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 3. Pressure Cooker Test Failure Rate Summary
Package
TQFP
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (1.27)
PBGA (Cavity/Heatsink, Pb-Free)
PBGA (Cavity/Heatsink)
FBGA (0.75-0.8, Pb-Free)
FVBGA (0.75-0.8, 0.3mm)
FBGA (1.0, Pb-Free)
PBGA (1.27, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
FLIPCHIP (Build-Up Substrate w/ HS)
PLCC
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
PQFP
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
CERDIP (Windowed)
TSOP/ TSSOP
TSOP I
TSOP (Reverse)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q3 RELIABILITY REPORT
Sample Size
718
50
245
394
384
532
244
95
50
46
149
48
98
97
45
198
200
449
97
615
625
100
637
240
755
99
100
579
530
149
100
669
194
144
434
50
150
788
11,097
# Failed Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 6 of 64
Product Reliability
Cypress
3.2
HIGHLY ACCELERATED STRESS TEST (HAST)
Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This
change was necessary because our package reliability had improved to the point where the
old 85°C/85% R.H. Temperature-humidity-bias testing would not induce failures. Failures are
necessary to judge progress and compare packaging changes. HAST testing has been shown
to be at least twenty times more accelerated then 85°C/85% R.H. temperature-humidity-bias
testing.
Conditions
:
Pre-Conditioning
:
Failure Modes
Failure Mechanism
:
:
Present Conditions: 130°C / 85% RH minimum power dissipation, for
a minimum of 128 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 4. Highly Accelerated Stress Test (HAST) Failure Rate Summary
Package
TQFP
TQFP (Thermal, Pb-Free)
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (Cavity/Heatsink, Pb-Free)
FVBGA (0.75-0.8, 0.3mm)
PBGA (1.27, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
FLIPCHIP (Build-Up Substrate w/ HS)
PLCC
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
CERDIP (Windowed)
TSOP/ TSSOP
TSOP I
TSOP (Reverse)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q3 RELIABILITY REPORT
Sample Size
321
46
46
31
145
183
192
98
182
285
238
133
150
87
276
185
387
98
516
195
339
88
99
528
472
100
47
584
148
30
411
93
188
429
7,350
# Failed
0
0
0
0
0
0
0
0
0
0
0
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7
Defects %
0
0
0
0
0
0
0
0
0
0
0
5%
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0.10%
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
Substrate related problem
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 7 of 64
Product Reliability
Cypress
3.3
TEMPERATURE CYCLE TEST (TC)
Differences in thermal expansion coefficients are accentuated by cycling devices through
temperature extremes. If the materials do not expand and contract equally, large stresses can
develop. The Temperature Cycle test stresses mechanical integrity by exposing a device to
alternating temperature extremes. Weakness and thermal expansion mismatches in die
interconnections, die attach, and wire bonds are often detected with this acceleration test.
Condition
:
Pre-Condition
:
Duration
:
Failure Mode
Failure Mechanism
:
:
MIL-STD-883D, Method 1010, Condition B, -55°C to 125°C
MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C
(Refer to Appendix C for derating factor calculation)
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
300 cycles minimum at Condition C,
1000 cycles minimum at Condition B
Parametric shifts and catatrophic failures
Wire bond, cracked or lifted die and package failure.
Table 5. Temperature Cycling Failure Rate Summary
Package
TQFP
TQFP (Thermal, Pb-Free)
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (1.27)
PBGA (Cavity/Heatsink, Pb-Free)
PBGA (Cavity/Heatsink)
FBGA (0.75-0.8, Pb-Free)
FVBGA (0.75-0.8, 0.3mm)
FBGA (1.0, Pb-Free)
PBGA (1.27, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
DE
FLIPCHIP (Build-Up Substrate w/ HS)
PLCC
PLCC (Pb-Free)
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
PQFP
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
CERDIP (Windowed)
TSOP/ TSSOP
TSOP I
TSOP (Reverse)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q3 RELIABILITY REPORT
Sample Size
975
99
50
244
394
734
1,219
244
245
50
45
292
100
143
243
135
751
250
50
470
1,072
100
722
535
148
925
240
914
100
100
582
520
150
299
776
194
145
486
149
247
1,165
16,302
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 8 of 64
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION
Thermal Acceleration Factors
Acceleration factors (AF) for thermal stresses (Early Failure Rate, Latent Failure Rate, Data Retention and
High Temperature Storage) are calculated from the Arrhenius equation)
AF = exp
Ea
k
1 - 1
Tu Tt
where :
Ea = Activation Energy of the defect mechanism
K = Boltzmann’s constant = 8.62 x 10 –5 eV/Kelvin
Tt is the junction temperature of the device under stress
Tu is the junction temperature of the device at use conditions
While there is no substitute for experimentally determining the activation energy, obtaining this information is
very difficult because few devices fail stress tests. In the absence of experimental data, the following literature
values are used.
Activation
Energy Ea
Failure Mechanism
Charge Gain
(eV)
0.3-0.6
Charge Loss (defects)
0.6
Charge Loss (Ionic contamination, edge bits)
0.9
Charge loss (intrinsic wear out)
0.3-0.6
Electromigration
0.6-1.0
Intermetallic Growth
1.0
Ionic Contamination
1.0-1.4
Silicon Bulk Defects
0.5
Oxide Defects
0.3
Unknown/Non-Visual Defect (NVD)
0.45
2005 Q3 RELIABILITY REPORT
Page 9 of 64
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Temperature-Humidity Acceleration Factors
Cypress estimates acceleration factors for temperature-humidity stresses (Pressure Cooker Test and Highly
Accelerated Stress Test) from a model developed by Hallberg and Peck (“Quality and Reliability Engineering
International”. Vol. 7, 1991).
-3
where :
AF = RHt exp Ea
RHu
k
1 - 1
Tu Tt
Tu = use environment junction temperature (°K)
Tt = test environment junction temperature (°K)
Ea = failure mechanism activation energy (0.9 for corrosion)
k = Boltzman’s Constant (8.62 x 10 –5 eV/oKelvin)
RHu = use environment relative humidity
RHt = test environment relative humidity
AF = acceleration factor
The Hallberg and Peck model requires the stress junction temperature and relative humidity as well as the use
temperature and relative humidity. To estimate the use relative humidity, we assume that the device room
temperature is 35 oC (95 oF) and the room relative humidity is 100%. From any Handbook of Chemistry and
Physics, the vapor pressure of water VP (water) at 35 oC is 41.175 mm Hg. If we assume that the device will
operate with a junction temperature of 70 oC (VP (water) at 70 oC is 233.7 mm Hg), the junction relative
humidity (RHj) is
RHj
= 100%
41.175
233.7
= 17.6%
The operating conditions of the devices are then 70 oC and 17.6% relative humidity.
Our Pressure Cooker Test (PCT) submits the devices to a temperature of 121 oC and 100% relative humidity.
Using the Hallberg and Peck model, the acceleration factor for the PCT stress can be calculated:
AF =
2005 Q3 RELIABILITY REPORT
17.6
100
-3
exp 0.9
k
1_ - 1_
343 394
= 9, 433
Page 10 of 64
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
The acceleration factor for HAST is calculated similarly, except that junction temperature heating effects must
be included when estimating the relative humidity at the die surface.
Assuming an average junction
temperature rise of 5 oC, the relative humidity at the die surface during 130 C HAST testing can be calculated.
VP (130 oC) = 2026.10 mm Hg
VP (135 oC) = 2347.26 mm Hg
RHj
AF =
= 85%
17.6
73.4
-3
2026.10
2347.26
exp 0.9
k
= 73.4%
1_ - 1_
343 408
= 9,261
Similarly, for 140 oC HAST testing,
VP (140 oC) = 2710.92 mm Hg
VP (145 oC) = 3116.76 mm Hg
RHj
AF =
2005 Q3 RELIABILITY REPORT
= 85%
17.6
73.9
-3
2710.92
3116.76
exp 0.9
k
= 73.9%
1_ - 1_
343 418
= 17,433
Page 11 of 64
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Failure Rate Calculation
For all but LFR test, Cypress reports the failure rate in terms of ppm. Early life reliability is reported in terms of
ppm defective expected during the first year of use under typical use conditions. No upper confidence bound
will be used for this estimate. The ppm defective is the ratio of the number of rejects to the number of samples
and expressed in ppm.
PPM =
Total Rejects x 1,000,000
Total Samples
Intrinsic, or later life reliability, shall be reported using the exponential model, in terms of FITs, with a 60%
upper confidence bound for 0 failures or the demonstrated FIT estimate in the case there are failures.
FR (FIT) =χ2α, 2n +2 /(2 * AF * Device Hours) * 10 9
where:
χ2 α,2n +2 = Chi square factor for 2n +2 degrees of freedom at 60% confidence level.
n = number of failure.
AF = Thermal Acceleration factor and is calculated per Arrhenius equation assuming a 0.7eV activation energy.
Voltage acceleration factor is not included in failure rate calculation even though voltage acceleration may be
used during stress. Typical use conditions shall be considered to be 55°C ambient with a 15°C temperature
rise at the junction. Thus, use junction temperature is 70°C.
2005 Q3 RELIABILITY REPORT
Page 12 of 64
Product Reliability
Cypress
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
Two acceleration factor (AF) models are used to model temperature cycle failures. The model proposed by
Zelenka [1] and others uses the epoxy molding temperature (Tmold = 170 °C) and the minimum temperature
reached during temperature cycling , (Tmin).
m
AFbrittle =
Tmold - Tmin,stress
Tmold - Tmin,stress
The model constant, m, is experimentally calculated for each failure mechanism. The acceleration factor is
labeled ‘brittle’ because the derivation of this equation assumes brittle fracture mechanics. Basically, the
model assumed that cracks advance a little every time the maximum stress is reached. The maximum stress
is assumed to be proportional to the difference in temperature between the minimum and maximum stress
temperatures. For plastic-encapsulated devices, the stress is minimum during molding, (Tmold), and a
maximum during the lowest temperature reached during temperature cycling, (Tmin).
The model constant, m, is a function of the failure mechanism.
Thin film cracking
Al/Au Intermetallic fractures
Chip-out (cratering) bond failures
m = 12 (Blish and Vaney [2])
m=4
m = 7 (Dunn and McPherson [3])
For ductile materials, dislocation movement dominates the fracture mechanics and a different model is used.
The second, and most widely accepted model, use the difference between the minimum and maximum
temperatures during temperature cycle testing (Tmin and Tmax) to calculate an acceleration factor.
m
AFductile =
Tmax, stress - Tmin,stress
Tmax,use - Tmin,use
The model constant, ‘m’, is again experimentally calculate for each failure mechanism.
Coffin and Manson [4] developed this model from empirical observations of metal fatigue. In ductile materials,
if the applied stress is high enough, dislocation are produced. At the high temperature condition of the
temperature cycling stress, dislocations are forced towards one metal surface. At the low temperature , the
dislocations try to glide back to their original position, but many cannot because they became entangled with
other dislocations. After many cyles, these tangles grow until cracking, and finally failure, occurs. Both
minimum and maximum temperatures are important, because both contribute to dislocation movement and
entanglement. This model is recommended for any failures involving ductile materials. Model constants for
ductile failure mechanism follow.
Wirebond breakage
Solder Fatigue
2005 Q3 RELIABILITY REPORT
m = 5.16 (Cypress experimentation)
m = 2 (Blish and Vaney [2])
Page 13 of 64
Product Reliability
Cypress
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS (cont.)
Our commercial devices are specified to operate between 0°C and 70 °C. Using this information, the
acceleration factor, AF, between use and Military Condition C stress testing (-65°C to 150°C), for the brittle,
thin film cracking failure mechanism and ductile, wire bond breakage failure mechanism can be calculated.
12
AF brittle
=
170 - (-65)
170 - 0
AF ductile
=
150 - (-65)
70 - 0
=
49
5.16
=
327
References:
[1] R.L. Zelenka, IEEE/IRPS, pp. 30-34, 1991
[2] R.C. Blish and P.R. Vaney, IEEE/IRPS, pp 22-29, 1991
[3] C.F. Dunn and J.W. McPherson, IEEE/IRPS, pp 252-258, 1990
[4] S.S. Manson, thermal Stress and Low-Cycle Fatigue, (Robert Krieger : Malabar, Florida), 1981.
2005 Q3 RELIABILITY REPORT
Page 14 of 64
Product Reliability
Cypress
APPENDIX C: EQUIVALENCE OF DIFFERENT STRESS TEST CONDITIONS
During stress testing, more than one set of test conditions were used. To account for this difference, stress
test hours or cycles at the lower stress condition were derated and then added to the total for the most severe
stress test condition.
Dynamic (HTOL)
HTOL (EFR/LFR) test is performed at 150 °C and 125 °C. Using the Arrhenius equation (Appendix A) and an
activation energy of 0.7 eV, the derating factor, DF, between 125°C and 150 °C can be calculated.
DF (between 125C and 150C) = exp
0.6 ____1 _______ - ______1______
k 150 + 15 + 273
125 + 15 + 273
= 0.326
Derating calculation assumes a 15 °C rise due to junction heating.
Temperature Cycling
Two different temperature cycling conditions were used to measure reliability, -65°C to 150°C and –55°C to
125°C. Using the brittle failure mechanism model with m = 12, the derating factor between -65°C to 150°C and
–55°C to 125°C is calculated.
12
DF
=
170 - (-55)
170 – (-65)
=
1.685
Using the ductile failure mechanism model with m = 5.16, the derating factor between -65°C to 150°C and –
55°C to 125°C is obtained.
5.16
DF
=
125 - (-55)
150 - (-65)
=
2.501
HAST
The derating factor between two HAST conditions, 140 °C / 85%RH and 130 °C / 85% RH is simply the ratio of
the acceleration factors (See Appendix A)
DF
2005 Q3 RELIABILITY REPORT
=
9,261_
17, 433
=
0.531
Page 15 of 64
Product Reliability
Cypress
APPENDIX D: RELIABILITY DATA
Summary Detail -- EFR Performance
From: 10/5/2004
To:
Technology
B53
Temp
Eval Num Division
Device
Volt
SS
125
MR04407 DCD
CY7B993V-5AC
4.0
200
0
200
0
Summary for 'Technology' = B53 (1 detail record)
Rej
Hours
FA
10/3/2005
Results
96
C8
125
033805
CCD
7C87740A
2.3
169
0
96
96
125
033805
CCD
7C87741A
2.3
304
0
125
033805
CCD
CY2SSTU877
2.3
126
0
96
125
033805
CCD
7C87741A
2.3
500
0
96
125
033805
CCD
7C87741A
2.3
276
0
96
125
033805
CCD
7C87741A
2.3
89
0
96
125
033805
CCD
CY7C68013A
3.8
514
0
96
125
042106
CCD
CY2SSTU877
2.3
505
0
96
125
042106
CCD
7C87741A
2.3
196
0
96
125
042106
CCD
CY7C68013A
3.8
514
0
96
125
042106
CCD
7C87741A
2.3
500
0
96
125
042106
CCD
7C87741A
2.3
89
0
96
125
042106
CCD
CY2SSTU877
2.3
126
0
96
125
042106
CCD
7C87741A
2.3
276
0
96
125
042106
CCD
7C87740A
2.3
150
0
96
125
042106
CCD
7C87740A
2.3
304
0
96
125
044503
CCD
CY7C68013
3.8
645
0
96
125
125
044503
050305
CCD
CCD
CY7C68013
CY2SSTU877BVXI
3.8
2.3
645
508
0
0
96
96
125
050305
CCD
CY2SSTU877BVXI
2.3
510
0
96
150
042105
CCD
CY2SSTU32864BFXI
2.3
391
0
48
150
042105
CCD
CY2SSTU32864BFXI
2.3
391
0
48
150
042105
CCD
CY2SSTU32864BFXI
2.3
296
0
48
150
042507
CCD
CY284KOTP
3.8
135
0
48
150
042507
CCD
CY284KOTP
3.8
135
0
48
150
042507
CCD
CY284KOTP
3.8
135
0
48
150
042507
2005 Q3 RELIABILITY REPORT
CCD
CY284KOTP
3.8
135
0
48
Page 16 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
SS
150
042507
CCD
CY284KOTP
3.8
135
0
48
150
042507
CCD
CY284KOTP
3.8
130
0
48
150
042507
CCD
CY284KOTP
3.8
68
0
48
150
042507
CCD
CY284KOTP
3.8
135
0
48
9032
0
Summary for 'Technology' = C8 (31 detail records)
Rej
Hours
FA
Results
FL28
125
MR04304 DCD
CY7C371I-83JC
5.75
200
0
96
125
MR04304 DCD
CY7C371I-83JC
5.75
150
0
72
150
MR04405 CCD
CY22392FC
3.8
200
0
48
550
0
200
0
200
0
545
495
0
0
1040
0
Summary for 'Technology' = FL28 (3 detail records)
P20
125
MR05105 DCD
CY7C343-35JC
5.75
Summary for 'Technology' = P20 (1 detail record)
96H
P26
150
150
044506
044506
CCD
CCD
7C65113ET-OSC
7C65113ET-OSC
5.75
5.75
Summary for 'Technology' = P26 (2 detail records)
48
48
POWER 165
125
043313
MID
CYK256K16SCCBU
3.8
50
0
96
125
051502
MID
CYK512K16SCCAU
3.8
1912
0
96
125
051502
MID
CYK512K16SCCAU
3.8
1944
0
96
125
051502
MID
CYK512K16SCCAU
3.8
1865
0
96
125
052102
MID
CYK128K16MCCBU-70BVIT
3.8
1000
0
96
125
052102
MID
CYK128K16MCCBU-70BVIT
3.8
1499
0
96
125
052102
MID
CYK128K16MCCBU-70BVIT
3.8
1000
0
96
125
052102
MID
CYK128K16MCCBU-70BVIT
3.8
1000
0
96
125
052102
MID
CYK128K16MCCBU-70BVIT
3.8
1498
0
96
125
052102
MID
CYK128K16MCCBU-70BVIT
3.8
1499
0
96
125
MR04405 MID
CYK512K16SCCAU-70BAI
4.5
198
0
96
125°C
MR04308 MID
CYK256K16MCCBU-70BVI
3.8
288
0
96
13753
0
Summary for 'Technology' = POWER 165 (12 detail records)
PROMOS .17
125
044007
MID
U0166TFF7BZ-GBVI
2.1
2718
0
96
125
044007
MID
U0166TFF7AZ-GBVI
2.1
491
0
96
125
044007
MID
U0166TFF7AZ-GBVI
2.1
578
0
96
125
044007
2005 Q3 RELIABILITY REPORT
MID
U0166TFF7BZ-GBVI
2.1
1349
0
96
Page 17 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
SS
125
045001
MID
U0166TFF7AZ-GBVI
2.1
1251
0
125
045001
MID
U0166TFF7AZ-GBVI
2.1
1238
0
96
125
125
MR04408 MID
MR04408 MID
U01766TFF7AZ
U01766TFF7AZ
2.3
2.3
300
150
0
0
96
72
8075
0
Summary for 'Technology' = PROMOS .17 (8 detail records)
Rej
Hours
FA
Results
96
R28
150
040606
CCD
7C421DT-MJC
5.75
355
0
48
150
040606
CCD
7C136GT-MJC
3.6
799
0
48
150
040606
CCD
7C421DT-MJC
5.75
108
0
48
150
040606
CCD
7C421DT-MJC
5.75
354
0
48
1616
0
Summary for 'Technology' = R28 (4 detail records)
R42
125
MR04307 MID
CY62256LL-70SNI
5.75
298
0
125
MR04307 MID
CY62256LL-70SNI
5.75
150
0
72
125
MR05204 DCD
CY7C09389V-9AC
3.8
50
0
48
125
MR05204 DCD
CY7C09389V-9AC
3.8
150
0
48
125
MR05207 MID
CY62256LL-70SNC
5.75
200
0
96
150
MR05301 DCD
CY7C038V-25AC
3.8
150
0
48
150
MR05301 DCD
CY7C038V-25AC
3.8
0
48
Summary for 'Technology' = R42 (7 detail records)
998
0
96
R5
125
035002
DCD
CY7C0430CV-133BGI
3.8
216
0
24
125
035002
DCD
CY7C0430CV-133BGI
3.8
120
0
12
125
035002
DCD
CY7C0430CV-133BGI
3.8
216
0
48
125
035002
DCD
CY7C0430CV-133BGI
3.8
120
0
48
125
035002
DCD
CY7C0430CV-133BGI
3.8
336
0
6
125
125
035002
035002
DCD
DCD
CY7C0430CV-133BGI
CY7C0430CV-133BGI
3.8
3.8
258
409
0
0
96
48
125
035002
DCD
CY7C0430CV-133BGI
3.8
409
0
48
125
035002
DCD
CY7C0430CV-133BGI
3.8
336
0
6
125
035002
DCD
CY7C0430CV-133BGI
3.8
216
0
24
125
035002
DCD
CY7C0430CV-133BGI
3.8
120
0
24
125
040903
CCD
CY28437OXC
3.8
260
0
96
125
040903
CCD
CY28437OXC
3.8
260
0
110
125
040903
CCD
CY28437OXC
3.8
260
0
110
125
040903
CCD
CY28437OXC
3.8
182
0
96
2005 Q3 RELIABILITY REPORT
Page 18 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
SS
Rej
Hours
125
040903
CCD
CY28437OXC
3.8
38
0
96
125
042301
DCD
CYISM560BSXC
3.8
1028
0
96
125
042301
DCD
CYISM560BSXC
3.8
492
0
96
125
042301
DCD
CYISM560BSXC
3.8
160
0
96
125
042301
DCD
CYISM560BSXC
3.8
177
0
96
125
044401
CCD
CY7C65640C
3.8
504
0
96
125
044401
CCD
CY7C65640
3.8
489
0
96
125
050303
CCD
CY7C68000-56PVXC
3.8
442
0
96
125
MR04406 MID
CY62136VLL-55ZI
3.8
50
0
96
125
MR04406 MID
CY62136VLL-55ZI
3.8
0
96
125
MR05105 MID
CY7C1399B-12VC
3.8
200
0
48
125
MR05105 MID
CY7C1009B-15VC
3.8
200
0
48
125
MR05202 MID
CY62136VLL-70ZI
3.8
299
0
96
125
MR05300 MID
CG6513AM
2.3
200
0
48
125
MR05302 MID
CY62136VLL-70ZXI
2.3
298
0
96
150
041303
CCD
CY221R28
2.875
477
0
48
150
150
041303
041303
CCD
CCD
CY221R28
CY221R28
2.875
2.875
520
500
0
0
48
48
150
043801
CCD
CY2309CSXI
3.8
504
0
48
150
043801
CCD
CY2309CSXI
3.8
496
0
48
150
045102
DCD
CYDC256A16-55AXI
3.45
178
0
48
150
045102
DCD
CYDC256A16-55AXI
3.45
628
0
48
150
045102
DCD
CYDC256A16-55AXI
3.45
358
0
48
150
050303
CCD
CY7C68000-56PVXC
3.8
458
0
48
150
050303
CCD
CY7C68000-56PVXC
3.8
457
0
48
150
050303
CCD
CY7C68000-56PVXC
3.8
429
0
48
150
050303
CCD
CY7C68000-56PVXC
3.8
187
0
48
150
050303
CCD
CY7C68000-56PVXC
3.8
155
0
48
150
051903
CCD
CY221R28-ZXC
2.875
500
0
48
150
051903
CCD
CY221R28-ZXC
2.875
492
0
48
150
051903
CCD
CY221R28-ZXC
2.875
500
0
48
150
MR04404 MID
CY7C1329-100AC
3.8
200
0
48H
150
MR04405 MID
CY7C1021B-15ZI
3.8
150
0
48
150
MR04405 MID
CY7C1021B-15ZI
3.8
50
0
48
150
MR04407 MID
CY7C1021BV33L-10ZC
3.8
200
0
48
150
MR04407 MID
CY7C1021B-15ZC
3.8
200
0
48
2005 Q3 RELIABILITY REPORT
FA
Results
Page 19 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
SS
150
MR05103 MID
CY7C1009B-15VC
3.8
200
0
48
150
MR05104 MID
CY7C1399B-12VC
3.8
196
0
48
16330
0
Summary for 'Technology' = R5 (53 detail records)
Rej
Hours
FA
Results
R7
125
044102
DCD
CY7C0832
2.3
114
0
48
125
125
044102
044102
DCD
DCD
CY7C0832
CY7C0832
2.3
2.3
114
61
0
0
48
48
125
044102
DCD
CY7C0832
2.3
101
0
48
125
044102
DCD
CY7C0832
2.3
720
0
48
125
044102
DCD
CY7C0832
2.3
101
0
48
125
044102
DCD
CY7C0832
2.3
720
0
48
125
044102
DCD
CY7C0832
2.3
61
0
48
125
044910
MID
CY7C1313V18
2.07
692
0
48
125
044910
MID
CY7C1313V18
2.07
576
0
48
125
044910
MID
CY7C1313V18
2.07
615
0
48
125
053206
MID
CY7C1313V18
2.07
295
0
96
125
053206
MID
CY7C1313V18
2.07
1774
0
96
125
053206
MID
CY7C1313V18
2.07
197
0
96
125
MR04307 MID
CY62147CV30LL-70BAI
3.45
300
0
96
125
MR04404 MID
CY7C1041CV33-12ZI
2.3
150
125
MR04407 MID
CY7C1061AV33-10ZC
2.4
125
MR04407 MID
CY7C1061AV33-10ZC
2.4
125
MR05106 MID
CY7C1041CV33-12ZC
125
MR05106 MID
CY7C1021CV33-12ZC
125
MR05106 MID
125
125
125
0
420
0
116
200
0
22
2.3
538
0
48
2.3
673
0
48
CY7C1021CV33-15ZC
2.3
337
0
48
MR05106 MID
CY7C1041CV33-15ZC
2.3
269
0
48
MR05106 MID
CY7C1021CV33-12ZC
2.3
673
0
48
MR05107 MID
CY62137CV30LL-55BVI
3.45
999
0
96
125
MR05108 MID
CY7C1041CV33-15ZC
2.3
270
0
96
150
044203
DCD
CY7C1370
2.3
1390
0
48
150
044203
MID
CY7C1021B
2.3
3382
0
48
150
150
MR04306 MID
MR04306 MID
CY7C1361B-100AC
CY7C1361B-100AC
2.3
2.3
149
300
0
0
32
48
150
MR04306 MID
CY7C1347F-133AC
2.3
150
0
32
150
MR04306 MID
CY7C1347F-133AC
2.3
299
0
48
150
MR04307 MID
CY7C1049CV33-15VI
2.3
300
0
48
2005 Q3 RELIABILITY REPORT
Page 20 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
SS
Rej
Hours
150
MR04307 MID
CY7C1049CV33-15VI
2.3
150
0
32
150
MR04404 MID
CY7C1041CV33-12ZI
2.3
150
0
32
150
MR04404 MID
CY7C1041CV33-12ZI
2.3
0
48
150
MR04404 MID
CY7C1041CV33-12ZI
2.3
198
0
48
150
MR04407 MID
CY7C1372CV25-167AC
2.3
200
0
48
150
MR05102 MID
CY7C1041CV33-10ZC
2.3
500
0
48
150
MR05102 MID
CY7C1041CV33-10ZC
2.3
200
150
MR05104 MID
CY7C1041CV33-10VC
2.3
150
MR05104 MID
CY7C1041CV33-10VC
2.3
147
0
48
0
48
0
12
150
MR05105 MID
CY7C1041CV33-15ZI
2.3
400
0
48
150
MR05106 MID
CY7C1021CV33-8ZC
2.3
296
0
48
150
MR05106 MID
CY7C1041CV33-15ZC
2.3
269
0
48
150
MR05106 MID
CY7C1021CV33-15ZC
2.3
675
0
48
150
MR05107 MID
CY7C1021CV33-15ZC
2.3
675
0
48
150
MR05107 MID
CY7C1021CV33-15Z
2.3
675
0
48
150
MR05107 MID
CY7C1021CV33-15ZXC
2.3
645
0
48
150
MR05108 MID
CY7C1021CV33-8VC
2.3
60
0
48
150
MR05204 MID
CY7C1049CV33-10VC
2.3
330
0
48
150
MR05204 MID
CY7C1021CV33-8VC
2.3
316
0
48
150
MR05205 MID
CY7C1021CV33-8VC
2.3
799
0
48
150
MR05209 MID
CY7C1041CV33-15ZC
2.3
493
0
48
150
150
MR05210 MID
MR05302 MID
CY7C1049CV33-20VC
CY7C1021CV33-15VC
2.3
2.3
200
200
0
0
0
48
150
MR05302 MID
CY7C1021CV33-15VXC
2.3
200
0
48
150
MR05306 MID
CG5978AT
2.3
8997
0
48
150
MR05306 MID
CG5978AT
2.3
2000
0
48
150
MR05306 MID
CG5978AT
2.3
5985
0
48
41280
0
Summary for 'Technology' = R7 (59 detail records)
FA
Results
R8
125
044202
MID
CY62157DV
2.4
2454
0
96
125
044202
MID
CY62157DV
2.4
1396
0
96
125
044202
MID
CY62157DV
2.4
1120
0
96
125
044304
MID
CY62147DV30L
2.4
683
0
96
125
045103
MID
CY62157DV30L
2.4
1677
0
96
125
045103
MID
CY62157DV30L
2.4
254
0
96
125
045103
MID
CY62157DV30L
2.4
2194
0
96
2005 Q3 RELIABILITY REPORT
Page 21 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
MID
Device
Volt
SS
Rej
Hours
125
045103
CY62157DV30L
2.4
1510
0
96
125
MR04307 MID
CY62157DV30L-45BVI
2.4
150
0
72
125
MR05103 MID
CY62147DV30LL-55BVI
2.4
200
0
96
125
MR05104 MID
CY62146DV30LL-70ZSXI
2.4
198
0
96H
150
MR05107 MID
CY62128DV30LL-70SI
2.4
195
0
48
150
MR05202 MID
CY62128DV30LL-55ZI
2.4
300
0
48
12331
0
Summary for 'Technology' = R8 (13 detail records)
FA
Results
R9
125
044201
MID
CY7C1413AV18-200BZC
2.25
970
0
96
125
125
044201
044201
MID
MID
CY7C1413AV18-200BZC
CY7C1413AV18-200BZC
2.25
2.25
144
1752
0
0
96
96
125
044201
MID
CY7C1413AV18-200BZC
2.25
265
0
96
125
051207
MID
CY7C1312BV18-200BZC
2.25
1803
0
96
125
051505
MID
CY7C1312BV18-250BZC
2.25
764
0
96
125
051505
MID
CY7C1312BV18-250BZC
2.25
989
0
96
125
051505
MID
CY7C1312BV18-250BZC
2.25
912
0
96
125
051901
MID
CY7C1512V18-250BZC
2.25
1613
0
96
150
032003
MID
CY7C1460AV33
2.25
2597
0
48
150
044103
MID
CY7C1347G
2.25
2447
0
48
150
044103
MID
CY7C1350
2.25
1479
0
36
150
044103
MID
CY7C1350
2.25
3135
0
12
150
044103
MID
CY7C1350
2.25
1533
0
12
150
044103
MID
CY7C1347G
2.25
2362
0
48
150
044103
MID
CY7C1350
2.25
2020
0
48
150
044403
MID
CY7C1470
2.25
560
0
48
150
044403
MID
CY7C1470
2.25
833
0
48
150
044403
MID
CY7C1470
2.25
447
0
48
150
044911
MID
CY7C1360
2.25
2369
0
48
150
044911
MID
CY7C1360
2.25
2227
0
48
150
045003
MID
7C1370EC-RAZC
2.25
1893
0
36
150
045003
MID
7C1370EC-RAZC
2.25
1618
0
48
150
045003
MID
7C1370EC-RAZC
2.25
1576
0
48
150
045003
MID
7C1370EC-RAZC
2.25
1909
0
12
150
050902
MID
CY7C1347G-166AXC
2.25
4421
0
48
150
050902
MID
CY7C1347G-166AXC
2.25
1305
0
48
150
050902
MID
CY7C1347G-166AXC
2.25
1307
0
48
2005 Q3 RELIABILITY REPORT
Page 22 of 64
Product Reliability
Cypress
Technology
Temp
150
Eval Num Division
051006
MID
Device
CY7C1347G
Volt
2.25
SS
3478
Rej
0
Hours
48
150
051006
MID
CY7C1347G
2.25
1679
0
48
150
051006
MID
CY7C1470
2.25
801
0
48
150
051006
MID
CY7C1347G
2.25
1727
0
48
150
051103
MID
CY7C1460AV33
2.25
1903
0
48
150
051103
MID
CY7C1460AV33
2.25
274
0
48
150
051103
MID
CY7C1460AV33
2.25
442
0
48
150
052203
MID
CY7C1370
2.25
1285
0
48
150
052203
MID
CY7C1370
2.25
1167
0
48
150
052203
MID
CY7C1370
2.25
1076
0
48
150
052206
MID
CY7C1347G-166AXC
2.25
1242
0
48
150
052206
MID
CY7C1347G-166AXC
2.25
1480
0
48
150
052206
MID
CY7C1347G-166AXC
2.25
1572
0
48
150
053405
MID
CY7C1360C
2.25
1281
0
48
150
053405
MID
CY7C1360C
2.25
2851
0
48
150
053405
MID
CY7C1360C
2.25
2846
0
48
70354
0
Summary for 'Technology' = R9 (44 detail records)
FA
Results
S4
125
040901
CCD
CY8C29466
5.5
1002
0
96
125
040901
CCD
CY8C29466
5.5
1005
0
96
125
040906
CCD
CY8C29466
5.5
1005
0
96
125
040906
CCD
CY8C29466
5.5
1000
0
96
125
040906
CCD
CY8C29466
5.5
1002
0
96
125
042501
CCD
CY8C21323
5.5
1024
0
96
125
125
042505
042702
CCD
CCD
CY8C21334
CY8C24423A
53.5
5.5
1007
427
0
0
96
48
125
042702
CCD
CY8C24423A
5.5
428
0
48
125
042702
CCD
CY8C24423A
5.5
428
0
48
125
042702
CCD
CY8C24423A
5.5
420
0
48
125
042702
CCD
CY8C24423A
5.5
420
0
48
125
042702
CCD
CY8C24423A
5.5
420
0
48
125
042809
CCD
CY8C24423A
5.5
829
0
48
125
043804
CCD
CY7C63913
5.75
1015
0
96
125
044602
CCD
CY8C24494-24PVXI
5.5
1008
0
96
125
044703
CCD
CY8C24423A-12PVXE
5.5
859
0
12
125
044703
CCD
CY8C24423A-12PVXE
5.5
653
0
12
2005 Q3 RELIABILITY REPORT
Page 23 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
SS
Rej
Hours
125
044703
CCD
CY8C24423A-12PVXE
5.5
576
0
12
125
044703
CCD
CY8C24423A-12PVXE
5.5
852
0
12
125
052004
CCD
CY8C21234-24SXI
5.5
1002
0
120
125
053402
CCD
CY8C27443-24PVXI
5.5
1010
0
96
125
053403
CCD
CY8C24423A-24PVXI
5.5
1004
0
96
125
053603
CCD
CY8C24794-24LFXI
5.5
923
0
96
125
MR04307 CCD
CY8C27443-24PVXI
5.5
150
0
72
125
MR05104 CCD
CY8C27443-24PXI
5.5
185
0
96
125
MR05204 CCD
CY22393ZXC-541
3.8
300
0
48
125
MR05208 CCD
CY8C24223A-24PVXI
5.5
200
0
96
125
MR05208 CCD
CY8C26443-24PVI
5.5
149
0
96
150
042806
CCD
CY5048SXI
3.8
1010
0
48
150
050507
CCD
CY22389FZXC
3.8
496
0
48
150
050507
CCD
CY22389FZXC
3.8
540
0
48
CY22392ZC-366
3.8
199
22548
0
0
48
150
MR05107 CCD
Summary for 'Technology' = S4 (33 detail records)
FA
Results
STARM
125
MR05103 DCD
CY7B933-JC
6.5
50
0
96
125
MR05103 DCD
CY7B933-JC
6.5
75
0
96
125
MR05103 DCD
CY7B933-JC
6.5
75
0
96
200
0
Summary for 'Technology' = STARM (3 detail records)
TSMC 130
125
025107
DCD
CYNSE10512
1.35
135
0
96
125
025107
DCD
CYNSE10512B
1.35
50
0
12
125
025107
DCD
CYNSE10512
1.38
33
0
96
125
025107
DCD
CYNSE10512B
1.35
49
0
48
125
025107
DCD
CYNSE10512B
1.35
20
0
48
125
025107
DCD
CYNSE10512
1.38
6
0
48
125
025107
DCD
CYNSE10512B
1.35
20
0
24
125
025107
DCD
CYNSE10512B
1.35
176
0
96
125
025107
DCD
CYNSE10512
1.35
62
0
96
125
025107
DCD
CYNSE10512B
1.35
28
0
96
125
025107
DCD
CYNSE10512B
1.35
20
0
12
125
025107
DCD
CYNSE10512
1.38
17
0
48
125
025107
DCD
CYNSE10512B
1.35
48
0
96
125
025107
DCD
CYNSE10512B
1.35
50
0
24
2005 Q3 RELIABILITY REPORT
Page 24 of 64
Product Reliability
Cypress
Technology
Temp
Eva lNum Division
Device
Volt
SS
125
025107
DCD
CYNSE10512
1.35
72
0
125
025107
DCD
CYNSE10512
1.38
6
0
48
125
125
025107
025107
DCD
DCD
CYNSE10512
CYNSE10512
1.35
1.38
144
5
0
0
96
48
125
025107
DCD
CYNSE10512
1.38
17
0
48
125
025107
DCD
CYNSE10512B
1.35
20
0
12
125
025107
DCD
CYNSE10512
1.38
57
0
96
125
025107
DCD
CYNSE10512B
1.35
50
0
12
125
025107
DCD
CYNSE10512
1.38
5
0
48
125
041401
DCD
CYNSE10512
1.38
5
0
48
125
041401
DCD
CYNSE10512B
1.35
20
0
24
125
041401
DCD
CYNSE10512
1.35
144
0
96
125
041401
DCD
CYNSE10512
1.35
62
0
96
125
041401
DCD
CYNSE10512B
1.35
48
0
96
125
041401
DCD
CYNSE10512B
1.35
50
0
24
125
041401
DCD
CYNSE10512
1.38
17
0
48
125
041401
DCD
CYNSE10512B
1.35
50
0
12
125
041401
DCD
CYNSE10512B
1.35
20
0
12
125
041401
DCD
CYNSE10512B
1.35
28
0
96
125
041401
DCD
CYNSE10512
1.38
33
0
96
125
041401
DCD
CYNSE10512B
1.35
50
0
12
125
041401
DCD
CYNSE10512B
1.35
20
0
12
125
041401
DCD
CYNSE10512
1.38
6
0
48
125
041401
DCD
CYNSE10512
1.35
72
0
96
125
041401
DCD
CYNSE10512
1.38
5
0
48
125
041401
DCD
CYNSE10512B
1.35
49
0
48
125
041401
DCD
CYNSE10512B
1.35
20
0
48
125
041401
DCD
CYNSE10512
1.35
135
0
96
125
125
041401
041401
DCD
DCD
CYNSE10512
CYNSE10512
1.38
1.38
57
17
0
0
96
48
125
041401
DCD
CYNSE10512B
1.35
176
0
96
125
041401
DCD
CYNSE10512
1.38
6
0
48
125
044108
DCD
CYNSE10512A
1.35
28
0
96
125
044108
DCD
CYNSE10512A
1.35
31
0
96
125
044108
DCD
CYNSE10512A
1.35
36
0
96
125
044108
DCD
CYNSE10512A
1.35
27
0
96
2005 Q3 RELIABILITY REPORT
Rej
Hours
FA
Results
96
Page 25 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num Division
Device
Volt
Summary for 'Technology' = TSMC 130 (50 detail records)
SS
Rej
Hours
2302
0
FA
Results
TSMC 150
125
044101
DCD
CYNSE70129D
2.1
551
0
125
044101
DCD
CYNSE70129D
2.1
551
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
101
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
177
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
134
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
184
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
152
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
128
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
196
0
96
125
044909
DCD
CYNSE70130B-125BBC
1.8
189
0
96
2363
0
Summary for 'Technology' = TSMC 150 (10 detail records)
96
TSMC 180
125
043305
DCD
CYNSE70128
1.725
346
0
96
125
043305
DCD
CYNSE70128
1.725
549
0
96
125
125
043305
044108
DCD
DCD
CYNSE70128
CYNSE10512A
1.725
1.35
395
70
0
0
96
96
125
044108
DCD
CYNSE10512A
1.35
32
0
96
125
044108
DCD
CYNSE10512A
1.35
85
0
96
125
044108
DCD
CYNSE10512A
1.35
144
0
96
125
044108
DCD
CYNSE10512A
1.35
130
0
96
1751
0
Summary for 'Technology' = TSMC 180 (8 detail records)
Grand Total
2005 Q3 RELIABILITY REPORT
204,923
0
Page 26 of 64
Product Reliability
Cypress
Summary Detail -- LFR Performance
Technology
Temp
Eval Num
Division
Device
Volt
SS
Rej
Hours
FA
Results
B53
125
MR044075
DCD
CY7B993V-5AC
4.0
200
0
832
125
MR044075
DCD
CY7B993V-5AC
4.0
200
0
168
400
0
Summary for 'Technology' = B53 (2 detail records)
C8
125
033805
CCD
CY7C68013A
2.35
253
0
1000
125
033805
CCD
7C87740A
2.35
150
0
168
125
033805
CCD
CY7C68013A
3.8
208
0
928
125
033805
CCD
7C87741A
2.35
150
0
832
125
033805
CCD
CY7C68013A
3.8
200
0
168
125
033805
CCD
CY7C68013A
3.8
208
0
72
125
042106
CCD
CY7C68013A
3.8
200
0
168
125
042106
CCD
7C682005AC-RSPC
3.8
208
0
72
125
042106
CCD
7C82877A
2.35
123
0
168
125
042106
CCD
CY7C68013A
3.8
208
0
832
125
042106
CCD
7C87741A
2.35
196
0
1000
125
042106
CCD
7C87741A
2.35
253
0
1000
125
042106
CCD
7C87740A
2.35
150
0
832
125
042106
CCD
7C87740A
2.35
150
0
168
150
042507
CCD
CY284KOTP
3.8
110
Summary for 'Technology' = C8 (15 detail records)
135
0
2792
0
FL28
125
MR043045
DCD
CY7C371I-83JC
5.75
150
0
168
125
MR043045
DCD
CY7C371I-83JC
5.75
150
0
832
150
MR044053
CCD
CY22392FC
3.8
200
0
32
150
MR044053
CCD
CY22392FC
3.8
200
0
420
700
0
Summary for 'Technology' = FL28 (4 detail records)
2005 Q3 RELIABILITY REPORT
Page 27 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
Volt
125
MR051058
DCD
CY7C343-35JC
5.75
125
MR051058
DCD
CY7C343-35JC
5.75
SS
Rej
Hours
150
0
832
150
0
168
300
0
FA
Results
P20
Summary for 'Technology' = P20 (2 detail records)
PROMOS .17
125
MR044080
MID
U01766TFF7AZ
2.36
150
0
168
125
MR044080
MID
U01766TFF7AZ
2.36
150
0
832
300
0
Summary for 'Technology' = PROMOS .17 (2 detail records)
R28
150
040606
CCD
7C421DT-MJC
5.75
120
0
420
150
040606
CCD
7C136GT-MJC
3.6
120
0
420
150
040606
CCD
7C136GT-MJC
3.6
120
0
80
150
040606
CCD
7C421DT-MJC
5.75
355
0
80
150
MR052086
MID
CY7C185-25VC
0
150
0
32
865
0
Summary for 'Technology' = R28 (5 detail records)
R42
125
MR043076
MID
CY62256LL-70SNI
5.75
150
0
832
125
MR043076
MID
CY62256LL-70SNI
5.75
150
0
168
125
MR052043
DCD
CY7C09389V-9AC
3.8
150
0
80
125
MR052043
DCD
CY7C09389V-9AC
3.8
150
0
420
125
MR052079
MID
CY62256LL-70SNC
5.75
148
0
832
125
MR052079
MID
CY62256LL-70SNC
5.75
150
0
168
125
MR053011
DCD
CY7C038V-25AC
0
150
0
80
125
MR053011
DCD
CY7C038V-25AC
0
420
Summary for 'Technology' = R42 (8 detail records)
150
0
1198
0
R5
125
035002
DCD
CY7C0430CV-133BGI
3.8
180
0
168
125
035002
DCD
CY7C0430CV-133BGI
3.8
179
0
168
125
035002
DCD
CY7C0430CV-133BGI
3.8
180
0
464
2005 Q3 RELIABILITY REPORT
Page 28 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
125
035002
DCD
CY7C0430CV-133BGI
3.8
180
0
36
125
035002
DCD
CY7C0430CV-133BGI
3.8
179
0
832
125
035002
DCD
CY7C0430CV-133BGI
3.8
180
0
332
125
MR051054
MID
CY7C1399B-12VC
3.8
150
0
80
125
MR051054
MID
CY7C1399B-12VC
3.8
150
0
420
125
MR051055
MID
CY7C1009B-15VC
3.8
150
0
420
125
MR051055
MID
CY7C1009B-15VC
3.8
150
0
80
125
MR052029
MID
CY62136VLL-70ZI
3.8
150
0
832
125
MR052029
MID
CY62136VLL-70ZI
3.8
150
0
168
125
MR053007
MID
CG6513AM
2.3
150
0
80
125
MR053007
MID
CG6513AM
2.3
150
0
432
125
MR053022
MID
CY62136VLL-70ZXI
2.3
150
0
168
150
041303
CCD
CY221R28
2.87
120
0
80
150
041303
CCD
CY221R28
2.87
119
0
278
150
043801
CCD
CY2309CSXI
3.8
120
0
420
150
043801
CCD
CY2309CSXI
3.8
120
0
80
150
045102
DCD
CYDC256A16-55AXI
3.45
120
0
420
150
045102
DCD
CYDC256A16-55AXI
3.45
120
0
80
150
050303
CCD
CY7C68000-56PVXC
3.8
116
0
80
150
050303
CCD
CY7C68000-56PVXC
3.8
116
0
80
150
051903
CCD
CY221R28-ZXC
2.87
116
0
420
150
051903
CCD
CY221R28-ZXC
2.87
116
0
80
150
051903
CCD
CY221R28-ZXC
2.87
116
0
420
150
051903
CCD
CY221R28-ZXC
2.87
116
0
80
150
MR044048
MID
CY7C1329-100AC
3.8
200
0
48H
150
MR044048
MID
CY7C1329-100AC
3.8
200
0
32
150
MR044050
MID
CY7C1021B-15ZI
3.8
149
0
420
150
MR044050
MID
CY7C1021B-15ZI
3.8
150
0
80
150
MR044071
MID
CY7C1021BV33L-10ZC
3.8
15
0
420
2005 Q3 RELIABILITY REPORT
Volt
SS
Rej
Hours
FA
Results
Page 29 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
Volt
150
MR044071
MID
CY7C1021BV33L-10ZC
3.8
150
0
80
150
MR044073
MID
CY7C1021B-15ZC
3.8
150
0
80
150
MR044073
MID
CY7C1021B-15ZC
3.8
150
0
420
150
MR051030
MID
CY7C1009B-15VC
3.8
150
0
80
150
MR051030
MID
CY7C1009B-15VC
3.8
150
0
420
150
MR051042
MID
CY7C1399B-12VC
3.8
150
0
404
150
MR051042
MID
CY7C1399B-12VC
3.8
96
Summary for 'Technology' = R5 (39 detail records)
SS
Rej
150
0
5607
0
Hours
FA
Results
R7
125
MR042042
MID
CY7C1061AV33-12ZC
2.45
150
0
832
125
MR043056
MID
CY7C1069AV33-10ZC
2.45
148
0
832
125
MR043078
MID
CY62147CV30LL-70BAI
3.45
150
0
181
125
MR043078
MID
CY62147CV30LL-70BAI
3.45
150
0
819
125
MR044074
MID
CY7C1061AV33-10ZC
2.45
150
0
179
125
MR051033
MID
CY62137CV30LL-70BVI
2.4
0
168
125
MR051061
MID
CY7C1021CV33-12ZC
2.3
150
0
80
125
MR051061
MID
CY7C1021CV33-12ZC
2.3
150
0
420
150
MR043063
MID
CY7C1361B-100AC
2.3
149
0
80
150
MR043063
MID
CY7C1361B-100AC
2.3
149
0
420
150
MR043064
MID
CY7C1347F-133AC
2.3
150
0
80
150
MR043073
MID
CY7C1049CV33-15VI
2.3
150
0
80
150
MR043073
MID
CY7C1049CV33-15VI
2.3
150
0
420
150
MR044049
MID
CY7C1041CV33-12ZI
2.3
198
0
48
150
MR044049
MID
CY7C1041CV33-12ZI
2.3
150
0
32
150
MR044049
MID
CY7C1041CV33-12ZI
2.3
150
0
420
150
MR044072
MID
CY7C1372CV25-167AC
2.3
200
0
80
150
MR051025
MID
CY7C1041CV33-10ZC
2.3
150
0
80
150
MR051025
MID
CY7C1041CV33-10ZC
2.3
150
0
420
150
MR051025
MID
CY7C1041CV33-10ZC
2.3
150
0
80
2005 Q3 RELIABILITY REPORT
Page 30 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
Volt
150
MR051025
MID
CY7C1041CV33-10ZC
2.3
150
MR051062
MID
CY7C1021CV33-15ZC
150
MR051062
MID
150
MR052048
150
Rej
Hours
150
0
420
2.3
150
0
80
CY7C1021CV33-15ZC
2.3
150
0
420
MID
CY7C1049CV33-10VC
2.3
150
0
80
MR052049
MID
CY7C1021CV33-8VC
2.3
150
0
89
150
MR052049
MID
CY7C1021CV33-8VC
2.3
150
0
411
150
MR052050
MID
CY7C1021CV33-8VC
2.3
150
0
411
150
MR052050
MID
CY7C1021CV33-8VC
2.3
150
0
89
150
MR053025
MID
CY7C1021CV33-15VC
2.3
150
0
420
150
MR053025
MID
CY7C1021CV33-15VC
2.3
150
0
80
150
MR053026
MID
CY7C1021CV33-15VXC
2.3
150
0
420
150
MR053026
MID
CY7C1021CV33-15VXC
2.3
150
0
80
150C MR051067
MID
CY7C1021CV33-12ZC
2.3
150
0
80
4894
0
Summary for 'Technology' = R7 (33 detail records)
SS
FA
Results
R8
125
MR043074
MID
CY62157DV30L-45BVI
2.4
150
0
168
125
MR043074
MID
CY62157DV30L-45BVI
2.4
150
0
832
125
MR043074
MID
CY62157DV30L-45BVI
2.4
150
0
808
125
MR043074
MID
CY62157DV30L-45BVI
2.4
150
0
192
125
MR051032
MID
CY62147DV30LL-55BVI
2.4
150
0
168
125
MR051032
MID
CY62147DV30LL-55BVI
2.4
150
0
832
125
MR051044
MID
CY62146DV30LL-70ZSXI
2.4
150
0
168
150
042703
MID
CY62157DV30L
2.4
55
0
408
150
MR051077
MID
CY62128DV30LL-70SI
2.4
150
0
80
150
MR051077
MID
CY62128DV30LL-70SI
2.4
150
0
420
150
MR052028
MID
CY62128DV30LL-55ZI
2.4
150
0
32
150
MR052028
MID
CY62128DV30LL-55ZI
2.4
148
0
420
1703
0
Summary for 'Technology' = R8 (12 detail records)
2005 Q3 RELIABILITY REPORT
Page 31 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
Volt
SS
Rej
Hours
FA
Results
R9
150
044403
MID
CY7C1470
2.25
397
0
500
150
044403
MID
CY7C1470
2.25
394
0
500
150
044403
MID
CY7C1470
2.25
397
0
500
150
051103
MID
CY7C1460AV33
2.25
274
0
168
150
051103
MID
CY7C1460AV33
2.25
442
0
168
150
051103
MID
CY7C1460AV33
2.25
400
0
168
150
051103
MID
CY7C1460AV33
2.25
272
0
332
150
051103
MID
CY7C1460AV33
2.25
437
0
332
150
051103
MID
CY7C1460AV33
2.25
398
0
332
150
052203
MID
CY7C1370
2.25
948
0
500
4359
0
Summary for 'Technology' = R9 (10 detail records)
S4
125
040901
CCD
CY8C29466
5.5
615
0
168
125
040901
CCD
CY8C29466
5.5
600
0
168
125
040901
CCD
CY8C29466
5.5
600
0
332
125
040901
CCD
CY8C29466
5.5
614
0
332
125
042702
CCD
CY8C24423A
5.5
82
0
1000
125
042702
CCD
CY8C24423A
5.5
78
0
1000
125
042702
CCD
CY8C24423A
5.5
80
0
1000
125
052004
CCD
CY8C21234-24SXI
5.5
235
0
120
125
052004
CCD
CY8C21234-24SXI
5.5
235
0
630
125
052004
CCD
CY8C21234-24SXI
5.5
235
0
630
125
052004
CCD
CY8C21234-24SXI
5.5
235
0
120
125
052004
CCD
CY8C21234-24SXI
5.5
235
0
750
125
MR043048
CCD
CY25104ZXC-2
2.45
148
0
832
125
MR043048
CCD
CY25104ZXC-2
2.45
148
0
640
125
MR043075
CCD
CY8C27443-24PVXI
5.5
150
0
168
125
MR051040
CCD
CY8C27443-24PXI
5.5
185
0
832
2005 Q3 RELIABILITY REPORT
Page 32 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
Volt
SS
Rej
Hours
125
MR051040
CCD
CY8C27443-24PXI
5.5
185
0
168
125
MR052042
CCD
CY22393ZXC-541
3.8
150
0
98
125
MR052042
CCD
CY22393ZXC-541
3.8
150
0
402
125
MR052082
CCD
CY8C24223A-24PVXI
5.5
143
0
168
125
MR052082
CCD
CY8C24223A-24PVXI
5.5
143
0
832
125
MR052083
CCD
CY8C26443-24PVI
5.5
0
832
125
MR052083
CCD
CY8C26443-24PVI
5.5
149
0
168
150
042806
CCD
CY5048SXI
3.8
129
0
420
150
042806
CCD
CY5048SXI
3.8
130
0
80
150
050507
CCD
CY22389FZXC
3.8
120
0
80
150
050507
CCD
CY22389FZXC
3.8
120
0
420
150
MR051076
CCD
CY22392ZC-366
3.8
150
0
80
150
MR051076
CCD
CY22392ZC-366
3.8
420
Summary for 'Technology' = S4 (29 detail records)
150
0
6194
0
FA
Results
STARM
125
MR051034
DCD
CY7B933-JC
6.5
75
0
832
125
MR051034
DCD
CY7B933-JC
6.5
75
0
168
125
MR051034
DCD
CY7B933-JC
6.5
75
0
168
125
MR051034
DCD
CY7B933-JC
6.5
75
0
832
300
0
Summary for 'Technology' = STARM (4 detail records)
TSMC 130
125
025107
DCD
CYNSE10512
1.35
165
0
168
125
025107
DCD
CYNSE10512B
1.35
122
0
168
125
025107
DCD
CYNSE10512B
1.35
119
0
832
125
025107
DCD
CYNSE10512
1.35
52
0
168
125
025107
DCD
CYNSE10512
1.35
52
0
200
125
025107
DCD
CYNSE10512B
1.35
28
0
40
125
025107
DCD
CYNSE10512
1.38
23
0
168
125
025107
DCD
CYNSE10512B
1.35
20
0
632
2005 Q3 RELIABILITY REPORT
Page 33 of 64
Product Reliability
Cypress
Technology
Temp
Eval Num
Division
Device
Volt
SS
Rej
Hours
125
025107
DCD
CYNSE10512B
1.35
20
0
168
125
025107
DCD
CYNSE10512
1.38
22
0
500
125
025107
DCD
CYNSE10512B
1.35
28
0
168
125
025107
DCD
CYNSE10512B
1.35
28
0
792
125
025107
DCD
CYNSE10512B
1.35
20
0
200
125
025107
DCD
CYNSE10512
1.35
52
0
632
125
025107
DCD
CYNSE10512
1.38
23
0
168
125
041401
DCD
CYNSE10512B
1.35
28
0
40
125
041401
DCD
CYNSE10512
1.38
22
0
500
125
041401
DCD
CYNSE10512B
1.35
119
0
832
125
041401
DCD
CYNSE10512B
1.35
20
0
632
125
041401
DCD
CYNSE10512
1.38
23
0
168
125
041401
DCD
CYNSE10512
1.35
52
0
632
125
041401
DCD
CYNSE10512
1.35
52
0
200
125
041401
DCD
CYNSE10512B
1.35
28
0
792
125
041401
DCD
CYNSE10512
1.35
52
0
168
125
041401
DCD
CYNSE10512B
1.35
28
0
168
125
041401
DCD
CYNSE10512B
1.35
122
0
168
125
041401
DCD
CYNSE10512B
1.35
20
0
168
125
041401
DCD
CYNSE10512
1.38
23
0
168
125
041401
DCD
CYNSE10512
1.35
165
0
168
125
041401
DCD
CYNSE10512B
1.35
20
0
200
125
044701
DCD
7C71050AJ-GQFGC
1.35
66
0
476
125
044701
DCD
7C71050AJ-GQFGC
1.35
69
0
168
1683
0
Summary for 'Technology' = TSMC 130 (32 detail records)
Grand Total
2005 Q3 RELIABILITY REPORT
31295
FA
Results
0
Page 34 of 64
Product Reliability
Cypress
Summary Detail, Package -- PCT Performance
BldKit
TQFP
A100
Loc
Eval Num
Device
Readout
SS
Rejects
R-CML
045002
C9TC
168
30
0
A100
R-CML
045002
C9TC
168
30
0
A100
R-CML
045002
C9TC
168
40
0
A100
R-CML
045002
C9TC
168
30
0
A100
R-CML
045002
C9TC
168
30
0
A100RKGAB
R-CML
MR043042
CY7C68013-100AC
176
50
0
A100RKGAB
R-CML
MR044020
CY7C1329-100AC
176
49
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
168
65
0
0
A100SFAGE
R-CML
MR052002
CY7C0241-25AC
168
50
A128SAGLL
R-CML
050801
CY7C1019CV33-15VC
168
44
0
A144GGAGE
G-TAIWAN
MR051009
CY7C057V-12AC
168
50
0
A144GGAGE
G-TAIWAN
MR052033
CY7C057V-15AI
168
50
0
A32AXGAGE
SI-SIGNETI
MR043085
CY29947AC
176
50
0
A52AEGAGE
Q-KOREA
MR052004
CY29972AI
176
50
0
A52ASGAGE
Q-KOREA
MR044009
CY7B9973V-AC
168
50
0
A52ASGAGE
Q-KOREA
MR051035
CY7B9973V-AC
168
50
0
718
0
50
0
50
0
Summary for 'Family' = TQFP (16 detail records)
TQFP (10x10)
AS6513GAGB
G-TAIWAN
MR052089
CY7C4215V-15ASC
168
Summary for 'Family' = TQFP (10x10) (1 detail record)
TQFP (Thermal)
AT120AAAGE
L-SEOL
MR052023
CYS25G0101DX-ATC
168
50
0
AT120AGAGE
L-SEOL
MR043058
CYS25G0101DX-ATI
176
50
0
AT120AGAGE
L-SEOL
MR044077
CYS25G0101DX-ATC
168
45
0
AT120AGAGE
L-SEOL
MR051082
CYS25G0101DX-ATC
168
50
0
AT120AHAGE
L-SEOL
041701
7B9532BC-LATC
176
50
0
245
0
50
0
Summary for 'Family' = TQFP (Thermal) (5 detail records)
TQFP (Pb-Free)
AZ100RRG
R-CML
044403
CY7C1470
AZ100RRG
R-CML
044403
CY7C1470
168
51
0
AZ100RRLL
R-CML
032003
7C1460BC-RAZC
168
44
0
AZ100RRLL
R-CML
051006
CY7C1470
168
50
0
AZ128CGAL
G-TAIWAN
033805
7C681000AC-GAZC
168
50
0
2005 Q3 RELIABILITY REPORT
168
FA
Results
Page 35 of 64
Product Reliability
Cypress
BldKit
Loc
AZ128CGAL
G-TAIWAN
Eval Num
033805
Device
Readout
SS
Rejects
7C681000AC-GAZC
168
50
0
AZ144GGAL
G-TAIWAN
MR052074
CY7C056V-12AXC
168
49
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
168
50
0
394
0
Summary for 'Family' = TQFP (Pb-Free) (8 detail records)
FBGA (0.75-0.8)
BA48AAALE
RA-CML
042602
7C621464BC-RABAI
168
44
0
BA48AVALE
RA-CML
MR043061
CY62147CV30LL-70B
168
50
0
0
BA48BQAALE
RA-CML
MR041055
CY62137CVSL-70BAI
176
45
BA48BQAALE
RA-CML
MR044068
CY62137CV30LL-70B
168
49
0
BA48BWALE
G-TAIWAN
MR043025
CY7C1021CV33-15BAI
176
46
0
BA48CRALE
T-TAIWAN
MR044056
CY62137CVSL-70BAI
168
50
0
BA48DCALE
BA48DCALE
G-TAIWAN
G-TAIWAN
045109
045109
7C1069AC-GBAC
7C1061AC-GBAIB
168
168
50
50
0
0
384
0
Summary for 'Family' = FBGA (0.75-0.8) (8 detail records)
FBGA (1.0)
BB100EAGE
G-TAIWAN
MR052032
CYP15G0101DXB-BBI
168
49
0
BB144DALE
G-TAIWAN
044006
7C08333AC-GBBC
168
48
0
BB165AALE
G-TAIWAN
044201
7C1414BC-GBBC
168
48
0
BB165GALE
G-TAIWAN
045107
7R1371CC-GBBCB
168
49
0
BB165KALE
G-TAIWAN
044501
7C1470AC-GBBC
168
50
0
BB165KALE
G-TAIWAN
050704
7C1470AC-GBBC
168
48
0
BB172AAGE
G-TAIWAN
MR051007
CY7C057V-15BBI
168
48
0
BB172BALE
G-TAIWAN
MR043032
CY7C0852V-133BBC
168
44
0
BB172BALE
G-TAIWAN
044102
7C08523DC-GBBCB
168
48
0
BB209BALE
G-TAIWAN
050702
7C1474AC-GBBC
168
50
0
BB256HALE
RA-CML
043308
CYNSE70130B
168
Summary for 'Family' = FBGA (1.0) (11 detail records)
50
0
532
0
0
PBGA (1.27)
BG119MALE
G-TAIWAN
MR043086
CY7C1373CV25-100B
168
50
BG119VALE
G-TAIWAN
052602
7C1330DC-GBGC
168
50
0
BG272BAGE
G-TAIWAN
035002
7C04301CC-GBGI
168
50
0
BG272BAGE
G-TAIWAN
035002
7C04301CC-GBGI
168
48
0
BG282BAGE
G-TAIWAN
MR052005
CY37512P256-83BGC
168
46
0
244
0
50
0
Summary for 'Family' = PBGA (1.27) (5 detail records)
PBGA (Cavity/Heatsink, Pb-Free)
BJ256L2GL
G-TAIWAN
2005 Q3 RELIABILITY REPORT
044507
CY28323BPVC
168
FA
Results
Page 36 of 64
Product Reliability
Cypress
BldKit
BJ256L2GL
Loc
G-TAIWN
Eval Num
044507
Device
CY28323BPVC
Readout
168
Summary for 'Family' = PBGA (Cavity/Heatsink, Pb-Free) (2 detail
SS
45
Rejects
0
95
0
PBGA (Cavity/Heatsink)
BL256L2GE
G-TAIWAN
MR051006
CYP15G0401DXB-BGI
176
19
0
BL256L2GE
MR051006
CYP15G0401DXB-BGI
168
31
0
50
0
46
0
46
0
G-TAIWAN
Summary for 'Family' = PBGA (Cavity/Heatsink) (2 detail records)
FBGA (0.75-0.8, Pb-Free)
BP96AALL
G-TAIWAN
042105
7C83864AC-GBPC
168
Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
FVBGA (0.75-0.8, 0.3mm)
BV48AFALE
G-TAIWAN
MR042030
CY62167DV30LL-70B
168
50
0
BV48HAALE
G-TAIWAN
MR051014
CY62147CV33LL-70B
176
50
0
BV48NAALE
RA-CML
042801
7R62357DC-RABVI
168
49
0
149
0
48
0
48
0
Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (3 detail records)
FBGA (1.0, Pb-Free)
BW100EAGL
G-TAIWAN
MR051023
CYP15G0101DXB-BB
168
Summary for 'Family' = FBGA (1.0, Pb-Free) (1 detail record)
PBGA (1.27, Pb-Free)
BY119MAGL
G-TAIWAN
041103
7R1370CC-GBYCB
168
48
0
BY119MAGL
041103
7R1370CC-GBYCB
168
50
0
98
0
G-TAIWAN
Summary for 'Family' = PBGA (1.27, Pb-Free) (2 detail records)
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
050202
CY7C015V18-35AC
168
50
0
BZ52BGAGL
042106
7C82877A
168
47
0
97
0
45
0
45
0
G-TAIWAN
Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (2 detail records)
FLIPCHIP (Build-Up Substrate w/ HS)
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
168
Summary for 'Family' = FLIPCHIP (Build-Up Substrate w/ HS) (1 detail
PLCC
J32RBGAGB
X-THALND
MR051031
CY7B991-2JC
168
50
0
J32RBGAGB
X-THALND
MR052018
CY7B991-5JC
168
50
0
J52SFGAGB
M-PHIL
MR051036
CY7C136-25JC
168
50
0
J84SFGACB
M-PHIL
MR044035
CY7C346B-35JC
176
48
0
198
0
Summary for 'Family' = PLCC (4 detail records)
2005 Q3 RELIABILITY REPORT
FA
Results
Page 37 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Readout
SS
Rejects
QFN (Punch Type)
LF56AGAGE
L-SEOL
MR043023
CY7C68013-56LFC
176
50
0
LF56AGAGE
L-SEOL
MR044081
CY7C65640A-LFC
168
50
0
LF56AGAGE
L-SEOL
MR051075
CY7C65640A-LFC
176
50
0
LF56CGAGL
T-TAIWAN
MR043019
CY7C1019CV33-12ZC
168
47
0
LF56CGAGL
T-TAIWAN
MR043019
CY7C1019CV33-12ZC
176
3
0
200
0
Summary for 'Family' = QFN (Punch Type) (5 detail records)
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
168
50
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
168
50
0
LY48D1GAL
LY48EGAGL
L-SEOL
L-SEOL
044508
052401
7B6953AC-LLYC
7B6953B-LLYC
168
168
49
50
0
0
LY56AGAGL
L-SEOL
MR044065
CY7C68300A-56LFXC
176
50
0
LY56DGAGL
L-SEOL
MR051046
CP6241AM
176
50
0
LY56FGALL
RA-CML
050303
CY7C109B-20VCT
168
50
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
168
50
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
168
50
0
449
0
Summary for 'Family' = QFN (Punch Type, Pb-Free) (9 detail records)
PQFP
N52DXGAGB
G-TAIWAN
MR051005
CY7C136-55NC
168
50
0
N52DXGAGB
G-TAIWAN
MR052031
CY7C136-55NC
168
47
0
97
0
Summary for 'Family' = PQFP (2 detail records)
SSOP
O2023GAGB
T-TAIWAN
MR044062
CY8C26233-24PVI
168
50
0
O2026XAGB
T-TAIWAN
053205
IMISM530AYB
168
45
0
O2026XAGB
T-TAIWAN
053205
IMISM530AYB
168
45
0
O2028GAGE
T-TAIWAN
MR044066
CY2CC810OI
176
50
0
O2028GAGE
T-TAIWAN
053205
CY2CC810OI
176
50
0
O2824GAGB
T-TAIWAN
MR043059
CY28400OC
176
49
0
O2824GAGB
T-TAIWAN
MR051038
CY28508OC
168
50
0
O2824GAGB
T-TAIWAN
053205
CY28506OC
168
45
0
O4816XAGB
T-TAIWAN
053205
CY28342OC
168
45
0
O56
R-CML
042507
CY284KOTP
168
46
0
O563AXAGB
R-CML
MR044016
CY28341OC-2T
168
50
0
O563AXAGN
R-CML
MR052017
CY28419OC
168
40
0
2005 Q3 RELIABILITY REPORT
FA
Results
Page 38 of 64
Product Reliability
Cypress
BldKit
O563BXAGE
Loc
R-CML
Eval Num
MR051021
Device
CP6221BM
Readout
168
Summary for 'Family' = SSOP (13 detail records)
SS
50
Rejects
0
615
0
PDIP
P1832XAGB
X-THALND
MR043057
CP6238AM
176
50
0
P243FGAGE
M-PHIL
MR052025
CY7C194-25PC
168
50
0
P2831GAGB
O-INDNS
MR044033
CY7C185-20PC
168
50
0
P2839GAGB
X-THALND
MR052061
CY7C466A-10PTC
168
50
0
P283EGAGE
O-INDNS
MR051001
CY8C26443-24PI
168
45
0
P2869AAGE
O-INDNS
052406
7C62256EC-OPC
168
45
0
P286BGAGB
O-INDNS
052406
CY62256LL-70PC
168
45
0
P286EGAGB
O-INDNS
MR043039
CY62256L-70PC
168
50
0
P286EGAGB
O-INDNS
052406
CY62256L-70PC
168
50
0
P286EGAGB
O-INDNS
052406
CY62256LL-70PC
168
50
0
P286FGAGB
X-THALND
MR044027
CY62256LL-70PC
176
50
0
P406AGAGB
O-INDNS
052406
CY7C634121C-PC
168
45
0
P406AGAGB
O-INDNS
052406
CP5748AM
168
Summary for 'Family' = PDIP (13 detail records)
45
0
625
0
PDIP (Pb-Free)
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
168
50
0
PZ2831GAN
O-INDNS
040901
8C29466AT-OPZI
168
50
0
100
0
Summary for 'Family' = PDIP (Pb-Free) (2 detail records)
SOIC (GullWing)
S0815EAGB
SL-INDIA
MR043080
CY27022SC
176
50
0
S0815PAGN
S0815PAGN
RA-CML
RA-CML
MR044055
MR051018
CY2410SC-1
CY2305SC-1H
176
168
48
50
0
0
S1615DAAGB
M-PHIL
MR051027
CY2292F
168
50
0
S1615EAGB
M-PHIL
MR044011
CY2309SC-1H
168
50
0
S1615EAGB
M-PHIL
MR053002
CY2309SC-1H
168
50
0
S183CGAGN
RA-CML
043303
CY7C63723-SC
168
50
0
S24314AGL
RA-CML
MR044028
CP6124AM
168
50
0
S2439GAGB
O-INDNS
MR043029
CY7B9910-2SC
168
45
0
S283HGAGB
O-INDNS
MR051003
CY2314ANZSC-1
168
45
0
S283HGAGB
O-INDNS
MR052073
CY7B933-SC
168
49
0
S324513GB
R-CML
MR051078
CY62128BLL-70SI
168
50
0
S324513GN
R-CML
MR053003
CY6525AM
168
50
0
637
0
Summary for 'Family' = SOIC (GullWing) (13 detail records)
2005 Q3 RELIABILITY REPORT
FA
Results
Page 39 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Readout
SS
Rejects
SOIC (GullWing, 450 footprint)
SN2831AHB
R-CML
MR043024
CY62256LL-70SNI
168
50
0
SN2831AHB
R-CML
MR044008
CY62256LL-70SNC
168
45
0
SN2831AHN
R-CML
MR051008
CY62256LL-70SNC
168
50
0
SN2831AHN
R-CML
MR052013
CY62256L-70SNC
168
50
0
SN2833AGB
O-INDNS
MR043031
CY6264-70SNC
168
45
0
240
0
Summary for 'Family' = SOIC (GullWing, 450 footprint) (5 detail records)
SSOP (Pb-Free)
SP1621AGB
M-PHIL
040606
W198BF-MSPC
168
48
0
SP1621AGB
M-PHIL
040606
W198BF-MSPC
168
50
0
SP2023GAL
T-TAIWAN
042501
8C21323AT-**TSPI
168
50
0
SP2023GAL
SP28214GL
T-TAIWAN
T-TAIWAN
042505
052004
8C21334AT-TSPI
CY8C21234-24SXI
168
168
45
45
0
0
SP2824GAN
T-TAIWAN
MR044076
CY28353OXC-2
168
50
0
SP483FAGN
RA-CML
MR044007
CY28405OXC
168
45
0
SP563AAGN
R-CML
MR043047
CY28RS480OXC
168
47
0
SP563AAGN
R-CML
MR044010
CY28410OXC
168
45
0
SP563AAGN
R-CML
MR051019
CY28410OXC
168
50
0
SP563AAGN
R-CML
040903
7C828437AC-RSPC
168
45
0
SP563BAGL
R-CML
042101
7C682020AC-RSPC
176
65
0
SP563BAGL
R-CML
042101
7C682020AC-RSPC
176
63
0
SP563BAGL
R-CML
042101
7C682005AC-RSPC
176
57
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
168
50
0
755
0
Summary for 'Family' = SSOP (Pb-Free) (15 detail records)
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR043016
CY7C63743-QXC
176
50
0
SQ2414AGN
R-CML
MR044042
CY7C63101A-QXC
168
49
0
99
0
Summary for 'Family' = QSOP (Pb-Free) (2 detail records)
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN
R-CML
MR044002
CY62256LL-70SNXC
168
50
0
SY2831AHN
CY62256L-70SNXC
168
50
0
100
0
0
R-CML
MR052010
Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (2 detail
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
043801
7C823C09AC-MSZI
168
48
SZ1615DGN
M-PHIL
043801
7C823C09AC-MSZI
168
48
0
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
168
45
0
2005 Q3 RELIABILITY REPORT
FA
Results
Page 40 of 64
Product Reliability
Cypress
BldKit
SZ1615DGN
Loc
M-PHIL
Eval Num
052004
Device
CY8C21234-24SXI
Readout
168
SS
45
Rejects
0
SZ1615EGN
M-PHIL
MR044014
CY2309NZSXC-1H
168
50
0
SZ1615EGN
M-PHIL
MR051029
CY2308SXC-1H
168
50
0
SZ1615EGN
M-PHIL
MR052046
CY2309SXC-1H
168
50
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
168
50
0
SZ183BGAL
RA-CML
MR044082
CY7C65640A-LFC
168
50
0
SZ324510GL
R-CML
MR051022
CY62128BLL-70SXI
168
50
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70S
176
45
0
SZ815DAGN
M-PHIL
042806
7C80330AT-MSZC
168
48
0
579
0
Summary for 'Family' = SOIC (GullWing, Pb-Free) (12 detail records)
SOIC (J lead)
V243GGALE
O-INDNS
MR043002
CY7C197B-12VC
176
50
0
V28CGAGB
O-INDNS
MR044064
CY7C106B-20VC
168
50
0
V324EGAGB
O-INDNS
MR042040
CY7C1019BV33-15VC
168
45
0
V324EGAGB
O-INDNS
MR051002
CY7C1019B-12VC
168
45
0
V3644GALE
R-CML
MR042067
CY7C1049B-25VI
176
45
0
V3646GALE
R-CML
MR043065
CY7C1049CV33-12VC
168
50
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
168
45
0
V444WGALL
R-CML
MR052019
CY7C1021B-12VI
168
50
0
V444YAALE
R-CML
MR051015
CY7C1041CV33-12VC
168
50
0
V444ZGALE
R-CML
MR043007
CY7C1021CV33-10VC
168
50
0
V444ZGALL
R-CML
MR053004
CY7C1021CV33
168
50
0
530
0
Summary for 'Family' = SOIC (J lead) (11 detail records)
SOIC (J lead, Pb-Free)
VZ444WAGL
R-CML
MR052001
CY7C1021B-15VXC
168
50
0
VZ444ZAGL
R-CML
MR043067
CY7C1021CV33-12VX
168
50
0
VZ444ZALL
R-CML
MR053005
CY7C1021CV33-8VXC
168
Summary for 'Family' = SOIC (J lead, Pb-Free) (3 detail records)
49
0
149
0
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
042114
W129DF-TSC
168
50
0
W129DF-TSC
050701
CY7C65640-LFXC
168
50
0
100
0
T-TAIWAN
Summary for 'Family' = CERDIP (Windowed) (2 detail records)
TSOP/ TSSOP
Z1611XAGB
M-PHIL
MR044012
CY22392ZC-366
168
50
0
Z1613GAGB
T-TAIWAN
MR043049
CY2308ZC-1H
168
42
0
Z1613GAGB
T-TAIWAN
MR051011
CY2309ZI-1H
168
45
0
Z1613GAGB
T-TAIWAN
MR052039
CY2308ZC-1H
168
46
0
2005 Q3 RELIABILITY REPORT
FA
Results
Page 41 of 64
Product Reliability
Cypress
BldKit
Loc
Z1619GAGN
RA-CML
Eval Num
MR052027
Device
CY22392ZC-366
Readout
168
SS
50
Rejects
Z32RLGAGE
T-TAIWAN
MR044024
CY62128BLL-70ZC
168
50
0
Z32RYAALE
T-TAIWAN
MR042036
CY62128DV30LL-55ZI
168
50
0
Z32RYAALE
T-TAIWAN
MR043017
CY62128DV30LL-55ZI
168
49
0
Z32RYAALE
T-TAIWAN
MR043060
CY62128DV30LL-70ZI
176
49
0
Z4824BGAN
R-CML
MR043087
CY28339ZC
168
50
0
Z5624BAGN
R-CML
MR043004
CY28409ZC
168
45
0
Z5624BAGN
R-CML
MR044015
CY28346ZC
176
43
0
Z5624BAGN
R-CML
MR051050
CY28346ZI-2T
168
50
0
Z5624BAGN
R-CML
044903
CY28346ZC-2
176
Summary for 'Family' = TSOP/ TSSOP (14 detail records)
TSOP I
ZA32RHAALB
R-CML
MR043044
CY62128DV30LL-70Z
50
0
669
0
168
50
0
ZA32RHAALB
R-CML
MR044017
CY62128DV30LL-70Z
176
44
0
ZA32RHAALB
R-CML
MR051012
CY62128DV30LL-55Z
168
50
0
ZA32RHAALB
R-CML
MR052020
CY62128DV30LL-55Z
168
50
0
194
0
Summary for 'Family' = TSOP I (4 detail records)
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
CY62256LL-70ZRI
168
45
0
ZR28R2AGN
R-CML
MR051013
CY62256LL-70ZRI
168
50
0
ZR32RKAGB
T-TAIWAN
MR044023
CY62128BLL-55ZRI
168
Summary for 'Family' = TSOP (Reverse) (3 detail records)
49
0
144
0
TSOP II
ZS324CA3E
T-TAIWAN
MR044070
CY7C1019B-12ZC
176
44
0
ZS324FAGE
T-TAIWAN
MR043018
CY7C1019CV33-12ZC
176
49
0
ZS324FAGE
T-TAIWAN
MR051037
CY7C1019CV33-12ZC
168
50
0
ZS324FAGE
T-TAIWAN
MR052009
CY7C1019CV33-12ZC
168
50
0
ZS444ABALE
R-CML
MR043041
CY7C1021CV33-12ZC
168
50
0
ZS444ABALE
R-CML
MR044021
CY7C1021CV33-15ZC
168
45
0
ZS444AKALN
R-CML
MR052022
CY7C1041CV33-15ZC
168
50
0
ZS544AALE
G-TAIWAN
MR043062
CY7C1069AV33-10ZC
168
50
0
ZS544AALE
G-TAIWAN
MR044031
CY7C1069AV33-12ZC
168
46
0
434
0
50
0
Summary for 'Family' = TSOP II (9 detail records)
TSOP (Pb-Free)
ZT28R2AGN
R-CML
2005 Q3 RELIABILITY REPORT
MR044001
CY62256LL-70ZXC
168
FA
Results
0
Page 42 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Summary for 'Family' = TSOP (Pb-Free) (1 detail record)
Readout
SS
50
Rejects
0
TSOP II (Pb-Free)
ZW444AFLL
R-CML
MR044004
CY62146DV30LL-70Z
168
50
ZW444NAGN
R-CML
MR051047
CY62126DV30LL-55Z
168
50
0
ZW544AALE
G-TAIWAN
042902
7C1069AC-GZWC
168
50
0
150
0
50
0
Summary for 'Family' = TSOP II (Pb-Free) (3 detail records)
TSSOP (Pb-Free)
ZZ0812AGL
T-TAIWAN
MR043048
CY25104ZXC-2
176
ZZ1613GAN
T-TAIWAN
MR052077
CY2309ZXI-1H
168
50
0
T-TAIWAN
MR043020
CY7C1019CV33-12ZC
168
49
0
ZZ2411AGN
T-TAIWAN
MR043066
CY22313ZXC
176
50
0
ZZ2411AGN
T-TAIWAN
MR051051
CY22313ZXC
168
50
0
ZZ2415GAL
RA-CML
MR051028
CY22313ZXC
168
50
0
ZZ2415GAL
RA-CML
MR052006
CY22313ZXC
168
50
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
168
49
0
ZZ2817AGL
RA-CML
041303
7C89000AC-RAZZC
168
50
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
168
44
0
ZZ2817AGL
RA-CML
051903
CY221R28-ZXC
168
50
0
ZZ5624BG
R-CML
052802
CY28411ZXC
168
49
0
ZZ5624BGN
R-CML
MR051026
CY28442ZXC
176
50
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
168
49
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
168
48
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
168
50
0
2005 Q3 RELIABILITY REPORT
788
11097
Results
0
ZZ2411AGN
Summary for 'Family' = TSSOP (Pb-Free) (16 detail records)
Grand Total
FA
0
0
Page 43 of 64
Product Reliability
Cypress
Summary Detail, Package -- HAST Performance
BldKit
Assy Site
Eval Num
A100R1AKB
R-CML
033805
A100R1AKB
R-CML
042106
A100RKGAB
R-CML
Device
SS
Rej
7C682001AC-RAC
47
0
7C682001AC-RAC
47
0
044603
CY7C1339B-133AI
44
0
FA
Results
TQFP
A100SFAGE
R-CML
MR052002
CY7C0241-25AC
48
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15VC
39
0
A32AXGAGE
SI-SIGNETI
MR043085
CY29947AC
46
0
A52ASGAGE
Q-KOREA
MR044009
CY7B9973V-AC
Summary for 'Family' = A (7 detail records)
50
0
321
0
46
0
46
0
46
0
46
0
TQFP (Thermal, Pb-Free)
AG120AGAL
L-SEOL
041701
7B9532BC-LAGC
Summary for 'Family' = AG (1 detail record)
TQFP (10x10)
AS6513GAGB
G-TAIWAN
MR052089
CY7C4215V-15ASC
Summary for 'Family' = AS (1 detail record)
TQFP (Thermal)
AT120AHAGE
L-SEOL
041701
7B9532BC-LATC
28
0
AT120AHAGE
L-SEOL
041701
7B9532BC-LATC
3
0
31
0
Summary for 'Family' = AT (2 detail records)
TQFP (Pb-Free)
AZ100RRG
R-CML
044403
CY7C1470
49
0
AZ100RRG
R-CML
044403
CY7C1470
46
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
50
0
145
0
Summary for 'Family' = AZ (3 detail records)
FBGA (0.75-0.8)
BA48AAALE
RA-CML
042602
7C621464BC-RABAI
43
0
BA48CJALE
GO-CHPMS
MR042043
CG6078AA
50
0
BA48DCALE
G-TAIWAN
045109
7C1069AC-GBAC
45
0
BA48DJALE
G-TAIWAN
052502
CY62177DV30L
45
0
183
0
Summary for 'Family' = BA (4 detail records)
2005 Q3 RELIABILITY REPORT
Page 44 of 64
Product Reliability
Cypress
BldKit
Assy Site
Eval Num
Device
SS
Rej
FA
Results
FBGA (1.0)
BB144DALE
G-TAIWAN
044006
7C08333AC-GBBC
50
0
BB165KALE
G-TAIWAN
044501
7C1470AC-GBBC
48
0
BB209BALE
G-TAIWAN
050702
7C1474AC-GBBC
47
0
BB256HALE
RA-CML
043308
7C76040CJ-RABBC
Summary for 'Family' = BB (4 detail records)
47
0
192
0
PBGA (Cavity/Heatsink, Pb-Free)
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
28
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
39
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
20
0
BJ504AAGL
G-TAIWAN
044507
Summary for 'Family' = BJ (4 detail records)
CY7C9536B-BLXC
11
98
0
0
FVBGA (0.75-0.8, 0.3mm)
BV48ADALE
G-TAIWAN
MR041048
CY62127DV30LL-70BVI
48
0
BV48AFALE
G-TAIWAN
MR042030
CY62167DV30LL-70BVI
44
0
BV48HAALE
G-TAIWAN
MR051014
CY62147CV33LL-70BVI
45
0
BV48NAALE
RA-CML
042801
7R62357DC-RABVI
Summary for 'Family' = BV (4 detail records)
45
0
182
0
PBGA (1.27, Pb-Free)
BY119MAGL
G-TAIWAN
041103
7R1370CC-GBYC
47
0
BY119MAGL
G-TAIWAN
041103
7R1370CC-GBYC
48
0
BY119MAGL
G-TAIWAN
044005
7R1370CC-GBYC
48
0
BY119MAGL
G-TAIWAN
044005
7R1370CC-GBYC
47
0
BY119MAGL
G-TAIWAN
044005
7R1370CC-GBYC
47
0
BY388BAGL
G-TAIWAN
041103
7C39485EH-GBYC
12
0
BY388BAGL
G-TAIWAN
041103
7C39485EH-GBYC
Summary for 'Family' = BY (7 detail records)
36
0
285
0
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
052002
7C02618AC-GBZI
48
0
BZ100AALE
G-TAIWAN
052002
7C02618AC-GBZIB
48
0
BZ100AALE
G-TAIWAN
050202
CY7C015V18-35AC
48
0
BZ100AALE
G-TAIWAN
050202
7C02618AC-GBZI
48
0
2005 Q3 RELIABILITY REPORT
Page 45 of 64
Product Reliability
Cypress
BldKit
Assy Site
Eval Num
BZ52BGAGL
G-TAIWAN
042106
Summary for 'Family' = BZ (5 detail records)
Device
SS
Rej
C72SSTU877V
46
238
0
0
FA
Results
025107-5A1
Substrate related defect.
FLIPCHIP (Build-Up Substrate w/ HS)
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
12
7
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
12
0
FG388AGAGE
GQ-KOREA
025107
7C71020AJ-GQFGCB
20
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGC
24
0
FG388AGAGE
GQ-KOREA
025107
7C71020AJ-GQFGCB
20
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
11
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
22
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
Summary for 'Family' = FG (8 detail records)
12
0
133
7
PLCC
J32RBGAGB
X-THALND
MR051031
CY7B991-2JC
50
0
J32RBGAGB
X-THALND
MR052018
CY7B991-5JC
50
0
J52SFGAGB
M-PHIL
MR051036
CY7C136-25JC
50
0
150
0
Summary for 'Family' = J (3 detail records)
QFN (Punch Type)
LF56AGAGE
L-SEOL
MR044081
CY7C65640A-LFC
44
0
LF56AGAGE
L-SEOL
MR051075
CY7C65640A-LFC
43
0
87
0
Summary for 'Family' = LF (2 detail records)
QFN (Punch Type, Pb-Free)
LY32BGAGL
LY48D1GAL
RA-CML
L-SEOL
052610
044508
CY8C21434-24LFXI
7B6953AC-LLYC
47
49
0
0
LY48EGAGL
L-SEOL
052401
7B6953B-LLYC
50
0
LY56DGAGL
L-SEOL
MR051046
CP6241AM
45
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
28
0
LY56FGALL
RA-CML
050303
CY7C109B-20VCT
40
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
17
0
276
0
Summary for 'Family' = LY (7 detail records)
2005 Q3 RELIABILITY REPORT
Page 46 of 64
Product Reliability
Cypress
BldKit
Assy Site
Eval Num
Device
SS
Rej
FA
Results
SSOP
O2023GAGB
T-TAIWAN
MR044062
CY8C26233-24PVI
49
0
O2824GAGB
T-TAIWAN
MR043059
CY28400OC
49
0
O563BXAGE
R-CML
MR051021
CP6221BM
40
0
O563BXAGE
R-CML
033805
7C682000AC-ROC
Summary for 'Family' = O (4 detail records)
47
0
185
0
PDIP
P1832XAGB
X-THALND
MR043057
CP6238AM
47
0
0
P243FGAGE
M-PHIL
MR052025
CY7C194-25PC
46
P2831GAGB
O-INDNS
MR044033
CY7C185-20PC
50
0
P2839GAGB
X-THALND
MR052061
CY7C466A-10PTC
50
0
P283EGAGE
O-INDNS
MR051001
CY8C26443-24PI
44
0
P286EGAGB
O-INDNS
MR043039
CY62256L-70PC
50
0
P286EGAGB
O-INDNS
052406
CY62256L-70PC
50
0
P286FGAGB
X-THALND
MR044027
CY62256LL-70PC
50
0
387
0
Summary for 'Family' = P (8 detail records)
PDIP (Pb-Free)
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
48
0
PZ2831GAN
O-INDNS
040901
8C29466AT-OPZI
50
0
98
0
Summary for 'Family' = PZ (2 detail records)
SOIC (GullWing)
S0815EAGB
SL-INDIA
MR043080
CY27022SC
47
0
S0815PAGN
RA-CML
MR044055
CY2410SC-1
42
0
S0815PAGN
RA-CML
MR051018
CY2305SC-1H
46
0
S1615DAAGB
M-PHIL
MR051027
CY2292F
48
0
S1615EAGB
M-PHIL
MR044011
CY2309SC-1H
47
0
S1615EAGB
M-PHIL
MR053002
CY2309SC-1H
41
0
S24314AGL
RA-CML
MR044028
CP6124AM
50
0
S2439GAGB
O-INDNS
MR043029
CY7B9910-2SC
45
0
S283HGAGB
O-INDNS
MR052073
CY7B933-SC
50
0
S324513GN
R-CML
MR052036
CY62128BLL-70SC
50
0
S324513GN
R-CML
MR053003
CY6525AM
50
0
516
0
Summary for 'Family' = S (11 detail records)
2005 Q3 RELIABILITY REPORT
Page 47 of 64
Product Reliability
Cypress
BldKit
Assy Site
Eval Num
Device
SS
Rej
0
FA
Results
SOIC (GullWing, 450 footprint)
SN2831AHB
R-CML
MR043024
CY62256LL-70SNI
50
SN2831AHB
R-CML
MR044008
CY62256LL-70SNC
45
0
SN2831AHN
R-CML
MR051008
CY62256LL-70SNC
50
0
SN2831AHN
R-CML
MR052013
CY62256L-70SNC
Summary for 'Family' = SN (4 detail records)
50
0
195
0
SSOP (Pb-Free)
SP1621AGB
M-PHIL
040606
W198BF-MSPC
50
0
SP1621AGB
M-PHIL
040606
W198BF-MSPC
50
0
SP483FAGN
RA-CML
MR044007
CY28405OXC
44
0
SP563BAGL
R-CML
042101
7C682020AC-RSPC
50
0
SP563BAGL
R-CML
042101
7C682020AC-RSPC
50
0
SP563BAGL
R-CML
042101
7C682005AC-RSPC
45
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
50
0
339
0
Summary for 'Family' = SP (7 detail records)
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR043016
CY7C63743-QXC
44
0
SQ2414AGN
R-CML
MR044042
CY7C63101A-QXC
44
0
88
0
Summary for 'Family' = SQ (2 detail records)
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN
R-CML
MR044002
CY62256LL-70SNXC
50
0
SY2831AHN
R-CML
MR052010
CY62256L-70SNXC
49
0
99
0
Summary for 'Family' = SY (2 detail records)
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
44
0
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
49
0
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
44
0
SZ1615EGN
M-PHIL
MR044014
CY2309NZSXC-1H
48
0
2005 Q3 RELIABILITY REPORT
Page 48 of 64
Product Reliability
Cypress
BldKit
SZ1615EGN
Assy Site
M-PHIL
Eval Num
MR051029
Device
CY2308SXC-1H
SS
48
Rej
0
SZ1615EGN
M-PHIL
MR052046
CY2309SXC-1H
47
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
50
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
49
0
SZ183BGAL
RA-CML
MR044082
CY7C65640A-LFC
50
0
SZ324510GL
R-CML
MR051022
CY62128BLL-70SXI
50
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70SXI
24
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70SXI
25
0
528
0
Summary for 'Family' = SZ (12 detail records)
FA
Results
SOIC (J lead)
V243GGALE
O-INDNS
MR043002
CY7C197B-12VC
42
0
V28CGAGB
O-INDNS
MR044064
CY7C106B-20VC
50
0
V324EGAGB
O-INDNS
MR042040
CY7C1019BV33-15VC
45
0
V3644GALE
R-CML
MR042067
CY7C1049B-25VI
44
0
V3646GALE
R-CML
MR043065
CY7C1049CV33-12VC
49
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
24
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
19
0
V444WGALL
R-CML
MR052019
CY7C1021B-12VI
50
0
V444YAALE
R-CML
MR051015
CY7C1041CV33-12VC
49
0
V444ZGALE
R-CML
MR043007
CY7C1021CV33-10VC
50
0
V444ZGALL
R-CML
MR053004
CY7C1021CV33
Summary for 'Family' = V (11 detail records)
50
0
472
0
50
50
0
0
100
0
47
0
47
0
0
SOIC (J lead, Pb-Free)
VZ444WAGL
VZ444ZAGL
R-CML
R-CML
MR052001
MR043067
CY7C1021B-15VXC
CY7C1021CV33-12VXC
Summary for 'Family' = VZ (2 detail records)
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
042114
W129DF-TSC
Summary for 'Family' = W (1 detail record)
TSOP/ TSSOP
Z1613GAGB
T-TAIWAN
MR043049
CY2308ZC-1H
42
Z1613GAGB
T-TAIWAN
MR051011
CY2309ZI-1H
45
0
Z1613GAGB
T-TAIWAN
2005 Q3 RELIABILITY REPORT
MR052039
CY2308ZC-1H
45
0
Page 49 of 64
Product Reliability
Cypress
BldKit
Assy Site
Eval Num
Device
SS
Rej
Z1619GAGN
RA-CML
MR052027
CY22392ZC-366
47
0
Z32RLGAGE
T-TAIWAN
MR044024
CY62128BLL-70ZC
49
0
Z32RYAALE
T-TAIWAN
MR042036
CY62128DV30LL-55ZI
50
0
Z32RYAALE
T-TAIWAN
MR043017
CY62128DV30LL-55ZI
38
0
Z32RYAALE
T-TAIWAN
MR043017
CY62128DV30LL-55ZI
4
0
Z32RYAALE
T-TAIWAN
MR043060
CY62128DV30LL-70ZI
50
0
Z4824BGAN
R-CML
MR043087
CY28339ZC
50
0
Z5624BAGN
R-CML
MR043004
CY28409ZC
22
0
Z5624BAGN
R-CML
MR044015
CY28346ZC
45
0
Z5624BAGN
R-CML
MR051050
CY28346ZI-2T
49
0
Z5624BAGN
R-CML
044903
CY28346ZC-2T
48
0
584
0
Summary for 'Family' = Z (14 detail records)
FA
Results
TSOP I
ZA32RHAALB
ZA32RHAALB
R-CML
R-CML
MR043044
MR043044
CY62128DV30LL-70ZAI
CY62128DV30LL-70ZAI
5
45
0
0
ZA32RHAALB
R-CML
MR051012
CY62128DV30LL-55ZAI
50
0
ZA32RHAALB
R-CML
MR052020
CY62128DV30LL-55ZAI
48
0
148
0
30
0
30
0
Summary for 'Family' = ZA (4 detail records)
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
CY62256LL-70ZRI
Summary for 'Family' = ZR (1 detail record)
TSOP II
ZS324CA3E
T-TAIWAN
MR044070
CY7C1019B-12ZC
44
0
ZS324FAGE
T-TAIWAN
MR043018
CY7C1019CV33-12ZC
48
0
ZS324FAGE
T-TAIWAN
MR051037
CY7C1019CV33-12ZC
50
0
ZS324FAGE
T-TAIWAN
MR052009
CY7C1019CV33-12ZC
48
0
ZS444ABALE
R-CML
MR033005
CY7C1021CV33-12ZC
50
0
ZS444ABALE
R-CML
MR043041
CY7C1021CV33-12ZC
45
0
ZS444ABALE
R-CML
MR044021
CY7C1021CV33-15ZC
45
0
ZS544AALE
G-TAIWAN
MR043062
CY7C1069AV33-10ZC
49
0
ZS544AALE
G-TAIWAN
MR044031
CY7C1069AV33-12ZC
32
0
411
0
Summary for 'Family' = ZS (9 detail records)
2005 Q3 RELIABILITY REPORT
Page 50 of 64
Product Reliability
Cypress
BldKit
Assy Site
Eval Num
Device
SS
Rej
FA
ZT28R2AGN
R-CML
MR044001
CY62256LL-70ZXC
44
0
ZT32RYAGL
T-TAIWAN
MR051079
CY2308SC-1
49
0
93
0
45
0
Results
TSOP (Pb-Free)
Summary for 'Family' = ZT (2 detail records)
TSOP II (Pb-Free)
ZW444ADALL
R-CML
MR052003
CY7C1041CV33-15ZXC
ZW444AFLL
R-CML
MR044004
CY62146DV30LL-70ZSXI
48
0
ZW444NAGN
R-CML
MR051047
CY62126DV30LL-55ZXI
45
0
ZW544AALE
G-TAIWAN
042902
7C1069AC-GZWCB
50
0
188
0
44
0
Summary for 'Family' = ZW (4 detail records)
TSSOP (Pb-Free)
ZZ0812AGL
T-TAIWAN
MR043048
CY25104ZXC-2
ZZ1613GAN
T-TAIWAN
MR052077
CY2309ZXI-1H
48
0
ZZ2411AGN
T-TAIWAN
MR043020
CY7C1019CV33-12ZC
50
0
ZZ2411AGN
T-TAIWAN
MR043066
CY22313ZXC
50
0
ZZ2411AGN
T-TAIWAN
MR051051
CY22313ZXC
49
0
ZZ2415GAL
RA-CML
MR051028
CY22313ZXC
50
0
ZZ2415GAL
RA-CML
MR052006
CY22313ZXC
49
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
48
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
41
0
Summary for 'Family' = ZZ (9 detail records)
429
0
Grand Total
7350
2005 Q3 RELIABILITY REPORT
7
Page 51 of 64
Product Reliability
Cypress
Summary Detail, Package -- TC Performance
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
FA
Results
TQFP
A100
R-CML
045002
C9TC
150C
-65C
300
21
0
A100
R-CML
045002
C9TC
150C
-65C
300
30
0
A100
R-CML
045002
C9TC
150C
-65C
300
30
0
A100
R-CML
045002
C9TC
150C
-65C
300
30
0
A100
R-CML
045002
C9TC
150C
-65C
300
40
0
A100RKGAB
R-CML
MR043042
CY7C68013-100AC
150C
-65C
300
50
0
A100RKGAB
R-CML
MR044020
CY7C1329-100AC
150C
-65C
300
48
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
150C
-65C
300
50
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
150C
-65C
300
45
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
150C
-65C
300
50
0
A100RQALE
R-CML
041805
7R1380CC-RACB
150C
-65C
300
50
0
A100SFAGE
R-CML
MR052002
CY7C0241-25AC
150C
-65C
300
50
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15V
150C
-65C
300
45
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15V
150C
-65C
300
45
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15V
150C
-65C
300
44
0
A144GGAGE
G-TAIWAN
MR051009
CY7C057V-12AC
150C
-65C
300
47
0
A144GGAGE
G-TAIWAN
MR052033
CY7C057V-15AI
150C
-65C
300
50
0
A32AXGAGE
SI-SIGNETI
MR043085
CY29947AC
150C
-65C
300
50
0
A44SFGAGB
R-CML
041805
7C37620BF-RAC
150C
-65C
300
50
0
A52AEGAGE
Q-KOREA
MR052004
CY29972AI
150C
-65C
300
50
0
A52ASGAGE
Q-KOREA
MR044009
CY7B9973V-AC
150C
-65C
300
50
0
CYS25G0101DX-AT
150C
-65C
300
50
975
0
0
7B9532BC-LAGC
150C
-65C
300
49
0
AG120AGAL
L-SEOL
041701
7B9532BC-LAGC
Summary for 'Family' = TQFP (Thermal, Pb-Free) (2 detail records)
150C
-65C
300
50
99
0
0
150C
-65C
300
50
50
0
0
A64FXGAGE
G-TAIWAN
MR044078
Summary for 'Family' = TQFP (22 detail records)
TQFP (Thermal, Pb-Free)
AG120AGAL
L-SEOL
041701
TQFP (10x10)
AS6513GAGB
G-TAIWAN
MR052089
Summary for 'Family' = TQFP (10x10) (1 detail record)
2005 Q3 RELIABILITY REPORT
CY7C4215V-15ASC
Page 52 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
FA
Results
TQFP (Thermal)
AT120AAAGE
L-SEOL
MR052023
CYS25G0101DX-AT
150C
-65C
300
50
0
AT120AGAGE
L-SEOL
MR043058
CYS25G0101DX-ATI
150C
-65C
300
50
0
AT120AGAGE
L-SEOL
MR044077
CYS25G0101DX-AT
150C
-65C
300
45
0
AT120AGAGE
L-SEOL
MR051082
CYS25G0101DX-AT
150C
-65C
300
49
0
7B9532BC-LATC
150C
-65C
300
50
244
0
0
0
AT120AHAGE
L-SEOL
041701
Summary for 'Family' = TQFP (Thermal) (5 detail records)
TQFP (Pb-Free)
AZ100RRLL
R-CML
MR052096
CY7C1471V25-133A
150C
-65C
300
50
AZ100RRLL
R-CML
032003
7C1460BC-RAZC
150C
-65C
300
49
0
AZ128CGAL
G-TAIWAN
033805
7C681000AC-GAZC
150C
-65C
300
50
0
AZ128CGAL
G-TAIWAN
033805
7C681000AC-GAZC
150C
-65C
300
50
0
AZ144GGAL
G-TAIWAN
MR052074
CY7C056V-12AXC
150C
-65C
300
49
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
150C
-65C
300
50
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
150C
-65C
300
50
0
CY7B9945V-5AXCT
150C
-65C
300
46
394
0
0
AZ52ASGAL
Q-KOREA
051902
Summary for 'Family' = TQFP (Pb-Free) (8 detail records)
FBGA (0.75-0.8)
BA48AAALE
RA-CML
042602
7C621464BC-RABAI
150C
-65C
300
49
0
BA48AAALE
RA-CML
042602
7C621464BC-RABAI
150C
-65C
300
48
0
BA48AAALE
RA-CML
042602
7C621464BC-RABAI
150C
-65C
300
50
0
BA48AVALE
RA-CML
MR043061
CY62147CV30LL-70
150C
-65C
300
50
0
BA48BQAALE
RA-CML
MR044068
CY62137CV30LL-70
150C
-65C
300
47
0
BA48BWALE
G-TAIWAN
MR043025
CY7C1021CV33-15B
150C
-65C
300
48
0
BA48CJALE
GO-CHPMS
MR042043
CG6078AA
150C
-65C
300
49
0
BA48CRALE
T-TAIWAN
MR044056
CY62137CVSL-70BA
150C
-65C
300
48
0
BA48DCALE
G-TAIWAN
045109
7C1069AC-GBAC
150C
-65C
300
50
0
BA48DCALE
G-TAIWAN
045109
7C1069AC-GBAC
150C
-65C
300
50
0
BA48DCALE
G-TAIWAN
045109
7C1061AC-GBAIB
150C
-65C
300
50
0
BA48DJALE
G-TAIWAN
052502
CY62177DV30L
150C
-65C
300
50
0
BA48DJALE
G-TAIWAN
052502
CY62177DV30L
150C
-65C
300
50
0
BA48DJALE
G-TAIWAN
052502
CY62177DV30L
150C
-65C
300
45
0
150C
-65C
300
50
734
0
0
BA48NGALE
G-TAIWAN
041805
7C62147CC-GBAIB
Summary for 'Family' = FBGA (0.75-0.8) (15 detail records)
2005 Q3 RELIABILITY REPORT
Page 53 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
FA
Results
FBGA (1.0)
BB100EAGE
G-TAIWAN
MR052032
CYP15G0101DXB-B
150C
-65C
300
50
0
BB144CALE
G-TAIWAN
044006
7C08323AC-GBBC
150C
-65C
300
50
0
BB144CALE
G-TAIWAN
044006
7C08323AC-GBBC
150C
-65C
300
50
0
BB144DALE
G-TAIWAN
044006
7C08333AC-GBBC
150C
-65C
300
48
0
BB165AALE
G-TAIWAN
044201
7C1414BC-GBBC
150C
-65C
300
48
0
BB165GALE
G-TAIWAN
045107
7R1371CC-GBBCB
150C
-65C
300
50
0
BB165GALE
G-TAIWAN
045107
7R1371CC-GBBCB
150C
-65C
300
50
0
BB165GALE
G-TAIWAN
045107
7R1371CC-GBBCB
150C
-65C
300
50
0
BB165KALE
G-TAIWAN
044501
7C1470AC-GBBC
150C
-65C
300
50
0
BB165KALE
G-TAIWAN
044501
7C1470AC-GBBC
150C
-65C
300
45
0
BB165KALE
G-TAIWAN
050704
7C1470AC-GBBC
150C
-65C
300
49
0
BB165KALE
G-TAIWAN
050704
7C1470AC-GBBC
150C
-65C
300
48
0
BB165KALE
G-TAIWAN
050704
7C1470AC-GBBC
150C
-65C
300
48
0
BB172AAGE
G-TAIWAN
MR051007
CY7C057V-15BBI
150C
-65C
300
50
0
BB172BALE
G-TAIWAN
MR043032
CY7C0852V-133BBC
150C
-65C
300
41
0
BB172BALE
G-TAIWAN
044102
7C08523DC-GBBCB
150C
-65C
300
48
0
BB209BALE
G-TAIWAN
050702
7C1474AC-GBBC
150C
-65C
300
46
0
BB209BALE
G-TAIWAN
050702
7C1474AC-GBBC
150C
-65C
300
49
0
BB209BALE
G-TAIWAN
050702
7C1474AC-GBBC
150C
-65C
300
50
0
BB256HALE
RA-CML
043308
CYNSE70130B
150C
-65C
300
50
0
BB256HALE
RA-CML
043308
CYNSE70130B
150C
-65C
300
50
0
BB256HALE
RA-CML
043308
CYNSE70130B
150C
-65C
300
49
0
BB484SDLE
G-TAIWAN
041505
7C08643AC-GBBCB
150C
-65C
300
50
0
BB484SDLE
G-TAIWAN
044104
CYD18S72AV
150C
-65C
300
50
0
CYD18S72AV
150C
-65C
300
50
1219
0
0
BB484SDLE
G-TAIWAN
044104
Summary for 'Family' = FBGA (1.0) (25 detail records)
PBGA (1.27)
BG119MALE
G-TAIWAN
MR043086
CY7C1373CV25-100
150C
-65C
300
50
0
BG119VALE
G-TAIWAN
052602
7C1330DC-GBGC
150C
-65C
300
50
0
BG272BAGE
G-TAIWAN
035002
7C04301CC-GBGI
150C
-65C
300
48
0
BG272BAGE
G-TAIWAN
035002
7C04301CC-GBGI
150C
-65C
300
47
0
CY37512P256-83BG
150C
-65C
300
49
244
0
0
BG282BAGE
G-TAIWAN
MR052005
Summary for 'Family' = PBGA (1.27) (5 detail records)
2005 Q3 RELIABILITY REPORT
Page 54 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
FA
Results
PBGA (Cavity/Heatsink,
BJ256L2GL
G-TAIWAN
044507
CY28323BPVC
150C
-65C
300
49
0
BJ256L2GL
G-TAIWN
044507
CY28323BPVC
150C
-65C
300
47
0
BJ256L2GL
G-TAIWAN
044507
CY28323BPVC
150C
-65C
300
50
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
150C
-65C
300
50
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
Summary for 'Family' = PBGA (Cavity/Heatsink, Pb-Free) (5 detail records)
150C
-65C
300
49
245
0
0
150C
-65C
300
50
50
0
0
150C
-65C
300
45
45
0
0
PBGA (Cavity/Heatsink)
BL256L2GE
G-TAIWAN
MR051006
CYP15G0401DXB-B
Summary for 'Family' = PBGA (Cavity/Heatsink) (1 detail record)
FBGA (0.75-0.8, Pb-Free)
BP96AALL
G-TAIWAN
042105
7C83864AC-GBPC
Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
FVBGA (0.75-0.8, 0.3mm)
BV48ADALE
G-TAIWAN
MR041048
CY62127DV30LL-70
150C
-65C
300
49
0
BV48AFALE
G-TAIWAN
MR042030
CY62167DV30LL-70
150C
-65C
300
50
0
BV48HAALE
G-TAIWAN
MR051014
CY62147CV33LL-70
150C
-65C
300
50
0
BV48NAALE
RA-CML
042801
7R62357DC-RABVI
150C
-65C
300
50
0
BV48NAALE
RA-CML
042801
7R62357DC-RABVI
150C
-65C
300
48
0
BV48NAALE
RA-CML
042801
7R62357DC-RABVI
Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (6 detail records)
150C
-65C
300
45
292
0
0
FBGA (1.0, Pb-Free)
BW100EAGL
G-TAIWAN
MR051023
CYP15G0101DXB-B
BW484SDLL
G-TAIWAN
044004
7C39782AH-GBWC
Summary for 'Family' = FBGA (1.0, Pb-Free) (2 detail records)
150C
-65C
300
50
0
150C
-65C
300
50
100
0
0
PBGA (1.27, Pb-Free)
BY119MAGL
G-TAIWAN
041103
7R1370CC-GBYCB
150C
-65C
300
45
0
BY119MAGL
G-TAIWAN
041103
7R1370CC-GBYCB
150C
-65C
300
50
0
BY388BAGL
G-TAIWAN
041103
7C39485EH-GBYC
Summary for 'Family' = PBGA (1.27, Pb-Free) (3 detail records)
150C
-65C
300
48
143
0
0
2005 Q3 RELIABILITY REPORT
Page 55 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
FA
Results
FA
Results
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
050202
CY7C015V18-35AC
150C
-65C
300
50
BZ100AALE
L-SEOL
050202
CYDM256A16-55BV
150C
-65C
300
50
0
0
BZ100AALE
G-TAIWAN
050202
CYDM256A16-55BV
150C
-65C
300
50
0
BZ52BGAGL
G-TAIWAN
042106
7C82877A
150C
-65C
300
47
0
BZ52BGAGL
G-TAIWAN
042106
7C82877A
Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (5 detail records)
150C
-65C
300
46
243
0
0
SS
DE
BldKit
Device
Condition
Cycles
DE001AAGL
SV-CHINA
Loc
052405
Eval Num
7M6341AT-SVDEC
65C
-25C
120
45
Rejects
0
DE001AAGL
SV-CHINA
052405
7M6341AT-SVDEC
65C
-25C
120
45
0
DE001AAGL
SV-CHINA
052405
Summary for 'Family' = DE (3 detail records)
7M6341AT-SVDEC
65C
-25C
120
45
135
0
0
FLIPCHIP (Build-Up
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGC
125C
-55C
500
24
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
125C
-55C
500
23
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGC
125C
-55C
1000
24
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGC
125C
-55C
1000
48
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
125C
-55C
500
23
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGC
125C
-55C
500
48
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
125C
-55C
500
22
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
125C
-55C
1000
21
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
125C
-55C
1000
22
0
FG388AGAGE
GQ-KOREA
025107
7C71050AJ-GQFGCB
125C
-55C
1000
23
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
125C
-55C
500
45
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
125C
-55C
1000
44
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
125C
-55C
500
45
0
FG388AGAGE
GQ-KOREA
044701
7C71050AJ-GQFGC
125C
-55C
500
45
0
FG388BAGE
GQ-KOREA
043404
7C71050BJ-GQFGCB
125C
-55C
1000
48
0
FG388BAGE
GQ-KOREA
043404
7C71050BJ-GQFGCB
125C
-55C
1000
52
0
FG388BAGE
GQ-KOREA
043404
7C71050BJ-GQFGCB
125C
-55C
500
47
0
FG388BAGE
GQ-KOREA
043404
7C71050BJ-GQFGCB
125C
-55C
500
52
0
FG388BAGE
GQ-KOREA
043404
7C71050BJ-GQFGCB
125C
-55C
500
48
0
FG388BAGE
GQ-KOREA
043404
7C71050BJ-GQFGCB
Summary for 'Family' = FLIPCHIP (Build-Up Substrate w/ HS) (20 detail
125C
-55C
1000
47
751
0
0
2005 Q3 RELIABILITY REPORT
Page 56 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
FA
Results
PLCC
J32RBGAGB
X-THALND
MR051031
CY7B991-2JC
150C
-65C
300
50
J32RBGAGB
X-THALND
MR052018
CY7B991-5JC
150C
-65C
300
50
0
J52SFGAGB
M-PHIL
MR051036
CY7C136-25JC
150C
-65C
300
50
0
J84SDGAGB
M-PHIL
041805
7C025DT-MJCB
150C
-65C
300
50
0
CY7C346B-35JC
150C
-65C
300
50
250
0
0
CY7C421-20JXC
150C
-65C
300
50
50
0
0
J84SFGACB
M-PHIL
MR044035
Summary for 'Family' = PLCC (5 detail records)
0
PLCC (Pb-Free)
JZ32RBGAN
M-PHIL
MR051056
Summary for 'Family' = PLCC (Pb-Free) (1 detail record)
QFN (Punch Type)
LF48AGAGE
L-SEOL
050404
7B6934AC-LLFC
100C
-40C
100
45
0
LF48AGAGE
L-SEOL
050404
7B6934AC-LLFC
100C
-40C
100
45
0
LF48AGAGE
L-SEOL
050404
7B6934AC-LLFC
100C
-40C
500
45
0
LF48AGAGE
L-SEOL
050404
7B6934AC-LLFC
100C
-40C
500
45
0
LF48AGAGE
L-SEOL
050404
7B6934AC-LLFC
100C
-40C
500
45
0
LF48AGAGE
L-SEOL
050404
7B6934AC-LLFC
100C
-40C
100
45
0
LF56AGAGE
L-SEOL
MR043023
CY7C68013-56LFC
150C
-65C
300
50
0
LF56AGAGE
L-SEOL
MR044081
CY7C65640A-LFC
150C
-65C
300
50
0
LF56AGAGE
L-SEOL
MR051075
CY7C65640A-LFC
LF56CGAGL
T-TAIWAN
MR043019
CY7C1019CV33-12Z
Summary for 'Family' = QFN (Punch Type) (10 detail records)
150C
-65C
300
50
0
150C
-65C
300
50
470
0
0
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
150C
-65C
300
50
0
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
150C
-65C
300
50
0
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
150C
-65C
300
49
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
150C
-65C
300
50
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
150C
-65C
300
50
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
150C
-65C
300
50
0
LY48D1GAL
L-SEOL
044508
7B6953AC-LLYC
150C
-65C
300
125
0
LY48D1GAL
L-SEOL
044508
7B6953AC-LLYC
150C
-65C
300
125
0
LY48D1GAL
L-SEOL
044508
7B6953AC-LLYC
150C
-65C
300
125
0
LY48EGAGL
L-SEOL
052401
7B6953B-LLYC
150C
-65C
300
50
0
LY48EGAGL
L-SEOL
052401
7B6953B-LLYC
150C
-65C
300
50
0
LY48EGAGL
L-SEOL
052401
7B6953B-LLYC
150C
-65C
300
50
0
2005 Q3 RELIABILITY REPORT
Page 57 of 64
Product Reliability
Cypress
BldKit
LY56AGAGL
Loc
L-SEOL
Eval Num
MR044065
Device
Condition
Cycles
CY7C68300A-56LFX
150C
300
-65C
SS
49
Rejects
FA
Results
0
LY56DGAGL
L-SEOL
MR051046
CP6241AM
150C
-65C
300
50
0
LY56FGALL
RA-CML
050303
CY7C109B-20VCT
150C
-65C
300
49
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
Summary for 'Family' = QFN (Punch Type, Pb-Free) (17 detail records)
150C
-65C
300
50
1072
0
0
PQFP
N52DXGAGB
MR051005
CY7C136-55NC
150C
-65C
300
50
0
N52DXGAGB
G-TAIWAN
MR052031
Summary for 'Family' = PQFP (2 detail records)
G-TAIWAN
CY7C136-55NC
150C
-65C
300
50
100
0
0
SSOP
O2023GAGB
T-TAIWAN
MR044062
CY8C26233-24PVI
150C
-65C
300
50
0
O2024GAGE
M-PHIL
MR044067
CY2DP314OI
150C
-65C
300
50
0
O2026XAGB
T-TAIWAN
053205
IMISM530AYB
150C
-65C
300
45
0
O2026XAGB
T-TAIWAN
053205
IMISM530AYB
150C
-65C
300
45
0
O2028GAGE
T-TAIWAN
MR044066
CY2CC810OI
150C
-65C
300
50
0
O2028GAGE
T-TAIWAN
053205
CY2CC810OI
150C
-65C
300
50
0
O2824GAGB
T-TAIWAN
MR043059
CY28400OC
150C
-65C
300
49
0
O2824GAGB
T-TAIWAN
MR051038
CY28508OC
150C
-65C
300
49
0
O2824GAGB
T-TAIWAN
053205
CY28508OC
150C
-65C
300
49
0
O2824GAGB
T-TAIWAN
053205
CY28506OC
150C
-65C
300
45
0
O4816XAGB
T-TAIWAN
053205
CY28342OC
150C
-65C
300
45
0
O56
R-CML
042507
CY284KOTP
150C
-65C
300
46
0
O563AXAGB
R-CML
MR044016
CY28341OC-2T
150C
-65C
300
50
0
O563AXAGN
R-CML
MR052017
CY28419OC
150C
-65C
300
49
0
CP6221BM
150C
-65C
300
50
722
0
0
O563BXAGE
R-CML
MR051021
Summary for 'Family' = SSOP (15 detail records)
PDIP
P1832XAGB
X-THALND
MR043057
CP6238AM
150C
-65C
300
50
0
P243FGAGE
M-PHIL
MR052025
CY7C194-25PC
150C
-65C
300
50
0
P2831GAGB
O-INDNS
MR044033
CY7C185-20PC
150C
-65C
300
50
0
P2839GAGB
X-THALND
MR052061
CY7C466A-10PTC
150C
-65C
300
50
0
P283EGAGE
O-INDNS
MR051001
CY8C26443-24PI
150C
-65C
300
45
0
2005 Q3 RELIABILITY REPORT
Page 58 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
P286BGAGB
O-INDNS
052406
CY62256LL-70PC
150C
-65C
300
45
P286EGAGB
O-INDNS
MR043039
CY62256L-70PC
150C
-65C
300
50
0
P286EGAGB
O-INDNS
052406
CY62256LL-70PC
150C
-65C
300
50
0
P286EGAGB
O-INDNS
052406
CY62256L-70PC
150C
-65C
300
50
0
P286FGAGB
X-THALND
MR044027
CY62256LL-70PC
150C
-65C
300
50
0
CP5748AM
150C
-65C
300
45
535
0
0
P406AGAGB
O-INDNS
052406
Summary for 'Family' = PDIP (11 detail records)
FA
Results
0
PDIP (Pb-Free)
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
150C
-65C
300
50
0
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
150C
-65C
300
48
0
CY7C63743-PXC
150C
-65C
300
50
148
0
0
0
PZ243AAGN
X-THALND
051206
Summary for 'Family' = PDIP (Pb-Free) (3 detail records)
SOIC (GullWing)
S0815EAGB
SL-INDIA
MR043080
CY27022SC
150C
-65C
300
48
S0815PAGN
RA-CML
MR044055
CY2410SC-1
150C
-65C
300
50
0
S0815PAGN
RA-CML
MR051018
CY2305SC-1H
150C
-65C
300
50
0
S1615DAAGB
M-PHIL
MR051027
CY2292F
150C
-65C
300
50
0
S1615EAGB
M-PHIL
MR044011
CY2309SC-1H
150C
-65C
300
48
0
S1615EAGB
M-PHIL
MR053002
CY2309SC-1H
150C
-65C
300
48
0
S183CGAGN
RA-CML
043303
CY7C63723-SC
150C
-65C
300
50
0
S183CGAGN
RA-CML
043303
CY7C63723-SC
150C
-65C
300
50
0
S183CGAGN
RA-CML
043303
CY7C63723-SC
150C
-65C
300
50
0
S183CGAGN
RA-CML
043303
CY7C63723-SC
150C
-65C
300
50
0
S24314AGL
RA-CML
MR044028
CP6124AM
150C
-65C
300
50
0
S2439GAGB
O-INDNS
MR043029
CY7B9910-2SC
150C
-65C
300
45
0
S2837GAGB
X-THALND
MR044029
CY7C64013-SC
150C
-65C
300
50
0
S283HGAGB
O-INDNS
MR044063
CY8C24423-24SI
150C
-65C
300
50
0
S283HGAGB
O-INDNS
MR051003
CY2314ANZSC-1
150C
-65C
300
45
0
S283HGAGB
O-INDNS
MR052073
CY7B933-SC
150C
-65C
300
50
0
S324513GB
R-CML
MR051078
CY62128BLL-70SI
150C
-65C
300
42
0
S324513GN
R-CML
MR052036
CY62128BLL-70SC
150C
-65C
300
49
0
150C
-65C
300
50
925
0
0
S324513GN
R-CML
MR053003
CY6525AM
Summary for 'Family' = SOIC (GullWing) (19 detail records)
SOIC (GullWing, 450
SN2831AHB
R-CML
SN2831AHB
R-CML
2005 Q3 RELIABILITY REPORT
MR043024
CY62256LL-70SNI
150C
-65C
300
50
0
MR044008
CY62256LL-70SNC
150C
-65C
300
45
0
Page 59 of 64
Product Reliability
Cypress
BldKit
SN2831AHN
SN2831AHN
Device
Condition
Cycles
R-CML
Loc
MR051008
Eval Num
CY62256LL-70SNC
150C
-65C
300
R-CML
MR052013
CY62256L-70SNC
150C
-65C
300
50
0
150C
-65C
300
45
240
0
0
SN2833AGB
O-INDNS
MR043031
CY6264-70SNC
Summary for 'Family' = SOIC (GullWing, 450 footprint) (5 detail records)
SS
50
Rejects
FA
Results
0
SSOP (Pb-Free)
SP1621AGB
M-PHIL
040606
W198BF-MSPC
150C
-65C
300
49
0
SP1621AGB
M-PHIL
040606
W198BF-MSPC
150C
-65C
300
50
0
SP2023GAL
T-TAIWAN
042501
8C21323AT-**TSPI
150C
-65C
300
50
0
SP2023GAL
T-TAIWAN
042505
8C21334AT-TSPI
150C
-65C
300
45
0
SP2814GAL
T-TAIWAN
053402
CY8C27443-24PVXI
150C
-65C
300
45
0
SP28214GL
T-TAIWAN
052004
CY8C21234-24SXI
150C
-65C
300
50
0
SP2821AGB
M-PHIL
040606
W40S111DF-MSPC
150C
-65C
300
50
0
SP2824GAN
T-TAIWAN
MR044076
CY28353OXC-2
150C
-65C
300
49
0
SP483FAGN
RA-CML
MR044007
CY28405OXC
150C
-65C
300
45
0
SP563AAGN
R-CML
MR043047
CY28RS480OXC
150C
-65C
300
48
0
SP563AAGN
R-CML
MR044010
CY28410OXC
150C
-65C
300
43
0
SP563AAGN
R-CML
MR051019
CY28410OXC
150C
-65C
300
50
0
SP563AAGN
R-CML
040903
7C828437AC-RSPC
150C
-65C
300
45
0
SP563BAGL
R-CML
042101
7C682020AC-RSPC
150C
-65C
300
50
0
SP563BAGL
R-CML
042101
7C682020AC-RSPC
150C
-65C
300
50
0
SP563BAGL
R-CML
042101
7C682005AC-RSPC
150C
-65C
300
45
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
150C
-65C
300
50
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
150C
-65C
300
50
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
Summary for 'Family' = SSOP (Pb-Free) (19 detail records)
150C
-65C
300
50
914
0
0
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR043016
SQ2414AGN
R-CML
MR044042
Summary for 'Family' = QSOP (Pb-Free) (2 detail records)
CY7C63743-QXC
150C
-65C
300
50
0
CY7C63101A-QXC
150C
-65C
300
50
100
0
0
SOIC (GullWing, 450
SY2831AHN
R-CML
MR044002
CY62256LL-70SNXC
SY2831AHN
R-CML
MR052010
CY62256L-70SNXC
Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (2 detail
150C
-65C
300
50
0
150C
-65C
300
50
100
0
0
150C
-65C
300
48
0
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
2005 Q3 RELIABILITY REPORT
043801
7C823C09AC-MSZI
Page 60 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
150C
-65C
300
45
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
150C
-65C
300
45
0
SZ1615EGN
M-PHIL
MR044014
CY2309NZSXC-1H
150C
-65C
300
50
0
SZ1615EGN
M-PHIL
MR051029
CY2308SXC-1H
150C
-65C
300
50
0
SZ1615EGN
M-PHIL
MR052046
CY2309SXC-1H
150C
-65C
300
48
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
150C
-65C
300
50
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
150C
-65C
300
50
0
SZ183BGAL
RA-CML
MR044082
CY7C65640A-LFC
150C
-65C
300
50
0
SZ324510GL
R-CML
MR051022
CY62128BLL-70SXI
150C
-65C
300
48
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70
150C
-65C
300
50
0
150C
-65C
300
48
582
0
0
SZ815DAGN
M-PHIL
042806
7C80330AT-MSZC
Summary for 'Family' = SOIC (GullWing, Pb-Free) (12 detail records)
FA
Results
0
SOIC (J lead)
V243GGALE
O-INDNS
MR043002
CY7C197B-12VC
150C
-65C
300
50
0
V28CGAGB
O-INDNS
MR044064
CY7C106B-20VC
150C
-65C
300
48
0
V32419GLL
R-CML
052803
CY7C1019D
150C
-65C
300
45
0
V324EGAGB
O-INDNS
MR042040
CY7C1019BV33-15V
150C
-65C
300
45
0
0
V324EGAGB
O-INDNS
MR051002
CY7C1019B-12VC
150C
-65C
300
45
V3644GALE
R-CML
MR042067
CY7C1049B-25VI
150C
-65C
300
43
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
150C
-65C
300
45
0
V444WGALL
R-CML
MR052019
CY7C1021B-12VI
150C
-65C
300
49
0
V444YAALE
R-CML
MR051015
CY7C1041CV33-12V
150C
-65C
300
50
0
V444ZGALE
R-CML
MR043007
CY7C1021CV33-10V
150C
-65C
300
50
0
CY7C1021CV33
150C
-65C
300
50
520
0
0
V444ZGALL
R-CML
MR053004
Summary for 'Family' = SOIC (J lead) (11 detail records)
SOIC (J lead, Pb-Free)
VZ444WAGL
R-CML
MR052001
CY7C1021B-15VXC
150C
-65C
300
50
0
VZ444ZAGL
R-CML
MR043067
CY7C1021CV33-12V
150C
-65C
300
50
0
VZ444ZALL
R-CML
MR053005
CY7C1021CV33-8VX
Summary for 'Family' = SOIC (J lead, Pb-Free) (3 detail records)
150C
-65C
300
50
150
0
0
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
042114
W129DF-TSC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
042114
W129DF-TSC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
042114
W129DF-TSC
150C
-65C
300
49
0
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
150C
-65C
300
50
0
2005 Q3 RELIABILITY REPORT
Page 61 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
Summary for 'Family' = CERDIP (Windowed) (6 detail records)
Condition
Cycles
SS
150C
-65C
300
50
299
Rejects
0
0
FA
Results
TSOP/ TSSOP
Z1611XAGB
M-PHIL
MR044012
CY22392ZC-366
150C
-65C
300
50
0
Z1613GAGB
T-TAIWAN
MR043049
CY2308ZC-1H
150C
-65C
300
46
0
Z1613GAGB
T-TAIWAN
MR051011
CY2309ZI-1H
150C
-65C
300
45
0
Z1613GAGB
T-TAIWAN
MR052039
CY2308ZC-1H
150C
-65C
300
50
0
Z1619GAGN
RA-CML
MR052027
CY22392ZC-366
150C
-65C
300
48
0
Z32RLGAGE
T-TAIWAN
MR044024
CY62128BLL-70ZC
150C
-65C
300
50
0
Z32RYAALE
T-TAIWAN
MR042036
CY62128DV30LL-55
150C
-65C
300
50
0
Z32RYAALE
T-TAIWAN
MR043017
CY62128DV30LL-55
150C
-65C
300
49
0
Z32RYAALE
T-TAIWAN
MR043060
CY62128DV30LL-70
150C
-65C
300
50
0
Z4824BGAN
R-CML
MR043087
CY28339ZC
150C
-65C
300
47
0
Z5624BAGN
R-CML
MR043004
CY28409ZC
150C
-65C
300
50
0
Z5624BAGN
R-CML
MR044015
CY28346ZC
150C
-65C
300
43
0
Z5624BAGN
R-CML
MR051050
CY28346ZI-2T
150C
-65C
300
50
0
Z5624BAGN
R-CML
044903
CY28346ZC-2T
150C
-65C
300
50
0
Z5624BAGN
R-CML
044903
CY28346ZC-2
150C
-65C
300
49
0
CY28346ZC-2T
150C
-65C
300
49
776
0
0
Z5624BAGN
R-CML
044903
Summary for 'Family' = TSOP/ TSSOP (16 detail records)
TSOP I
ZA32RHAALB
R-CML
MR043044
CY62128DV30LL-70
150C
-65C
300
50
0
ZA32RHAALB
R-CML
MR044017
CY62128DV30LL-70
150C
-65C
300
45
0
ZA32RHAALB
R-CML
MR051012
CY62128DV30LL-55
150C
-65C
300
50
0
ZA32RHAALB
R-CML
MR052020
Summary for 'Family' = TSOP I (4 detail records)
CY62128DV30LL-55
150C
-65C
300
49
194
0
0
CY62256LL-70ZRI
150C
-65C
300
45
0
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
ZR28R2AGN
R-CML
MR051013
ZR32RKAGB
T-TAIWAN
MR044023
Summary for 'Family' = TSOP (Reverse) (3 detail records)
CY62256LL-70ZRI
150C
-65C
300
50
0
CY62128BLL-55ZRI
150C
-65C
300
50
145
0
0
TSOP II
ZS324CA3E
T-TAIWAN
MR044070
CY7C1019B-12ZC
150C
-65C
300
44
0
ZS324FAGE
T-TAIWAN
MR043018
CY7C1019CV33-12Z
150C
-65C
300
49
0
2005 Q3 RELIABILITY REPORT
Page 62 of 64
Product Reliability
Cypress
BldKit
Loc
Eval Num
Device
Condition
Cycles
SS
Rejects
ZS324FAGE
T-TAIWAN
MR052009
CY7C1019CV33-12Z
150C
-65C
300
50
0
ZS444ABALE
R-CML
MR033005
CY7C1021CV33-12Z
150C
-65C
300
50
0
ZS444ABALE
R-CML
MR043041
CY7C1021CV33-12Z
150C
-65C
300
49
0
ZS444ABALE
R-CML
MR044021
CY7C1021CV33-15Z
150C
-65C
300
44
0
ZS444AKALN
R-CML
MR052022
CY7C1041CV33-15Z
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR043062
CY7C1069AV33-10Z
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR044031
CY7C1069AV33-12Z
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR052030
Summary for 'Family' = TSOP II (10 detail records)
CY7C1069AV33-12Z
150C
-65C
300
50
486
0
0
FA
Results
TSOP (Pb-Free)
ZT28R2AGN
R-CML
MR044001
CY62256LL-70ZXC
150C
-65C
300
49
0
ZT28R4AGL
R-CML
MR052011
CY7C1399B-15ZXC
150C
-65C
300
50
0
CY2308SC-1
150C
-65C
300
50
149
0
0
ZT32RYAGL
T-TAIWAN
MR051079
Summary for 'Family' = TSOP (Pb-Free) (3 detail records)
TSOP II (Pb-Free)
ZW444ADALL
R-CML
MR052003
CY7C1041CV33-15Z
150C
-65C
300
50
0
ZW444AFLL
R-CML
MR044004
CY62146DV30LL-70
150C
-65C
300
50
0
ZW444NAGN
R-CML
MR051047
CY62126DV30LL-55
150C
-65C
300
50
0
ZW544AALE
G-TAIWAN
042902
7C1069AC-GZWC
150C
-65C
300
48
0
150C
-65C
300
49
247
0
0
0
ZW544AALE
G-TAIWAN
042902
7C1069AC-GZWCB
Summary for 'Family' = TSOP II (Pb-Free) (5 detail records)
TSSOP (Pb-Free)
ZZ0812AGL
T-TAIWAN
MR043048
CY25104ZXC-2
150C
-65C
300
50
ZZ1613GAN
T-TAIWAN
MR052077
CY2309ZXI-1H
150C
-65C
300
50
0
ZZ2411AGN
T-TAIWAN
MR043020
CY7C1019CV33-12Z
150C
-65C
300
50
0
ZZ2411AGN
T-TAIWAN
MR043066
CY22313ZXC
150C
-65C
300
50
0
ZZ2411AGN
T-TAIWAN
MR051051
CY22313ZXC
150C
-65C
300
48
0
ZZ2415GAL
RA-CML
MR051028
CY22313ZXC
150C
-65C
300
46
0
ZZ2415GAL
RA-CML
MR052006
CY22313ZXC
150C
-65C
300
49
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
150C
-65C
300
50
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
150C
-65C
300
49
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
150C
-65C
300
50
0
ZZ2817AGL
RA-CML
041303
7C89000AC-RAZZC
150C
-65C
300
50
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
150C
-65C
300
45
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
150C
-65C
300
45
0
042701
7C89000AC-RAZZC
150C
-65C
300
46
0
ZZ2817AGL
RA-CML
2005 Q3 RELIABILITY REPORT
Page 63 of 64
Product Reliability
Cypress
BldKit
ZZ2817AGL
Loc
RA-CML
Eval Num
051903
Device
Condition
Cycles
CY221R28-ZXC
150C
-65C
300
SS
50
Rejects
0
ZZ2817AGL
RA-CML
051903
CY221R28-ZXC
150C
-65C
300
50
0
ZZ5624BG
R-CML
052802
CY28411ZXC
150C
-65C
300
47
0
ZZ5624BG
R-CML
052802
CY28411ZXC
150C
-65C
300
46
0
ZZ5624BG
R-CML
052802
CY28411ZXC
150C
-65C
300
45
0
ZZ5624BGN
R-CML
MR043046
CY28442ZXC-2
150C
-65C
300
50
0
ZZ5624BGN
R-CML
MR051026
CY28442ZXC
150C
-65C
300
50
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
150C
-65C
300
50
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
150C
-65C
300
50
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
Summary for 'Family' = TSSOP (Pb-Free) (24 detail records)
150C
-65C
300
49
1165
0
0
16302
0
Grand Total
2005 Q3 RELIABILITY REPORT
FA
Results
Page 64 of 64