Q4 - 2005

Product Reliability
Cypress
2005 Q4 RELIABILITY REPORT
TABLE OF CONTENTS
1.0
OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM
2
2.0
DEVICE RELIABILITY
3
3.0
2.1
EARLY FAILURE RATE SUMMARY
3
2.2
LONG TERM FAILURE RATE SUMMARY
4
PACKAGE RELIABILITY
5
3.1
PRESSURE COOKER TEST
6
3.2
HAST (HIGHLY ACCELERATED STRESS TEST)
7
3.3
TEMPERATURE CYCLE
8
APPENDIX A: FAILURE RATE CALCULATION
9
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
13
APPENDIX C: EQUIVALENCE OF STRESS TEST CONDITIONS
15
APPENDIX D: RELIABILITY DATA
16
Note: The results reported herein are for 4th Quarter 2005.
2005 Q4 RELIABILITY REPORT
Page 1 of 48
Product Reliability
Cypress
1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR, INC. TOTAL QUALITY MANAGEMENT SYSTEM
This report summarizes Cypress Semiconductor Product Reliability for the period of the 4th quarter of 2005. It
includes data from devices fabricated at the Round Rock, Texas; Minnesota and Fab foundry facilities and
packaged-device data from assembly sites at Cypress Philippines and sub-contractors.
Cypress Semiconductor has established aggressive reliability objectives to assure that all products exhibit
reliability, which exceeds customer reliability requirements for purchased components. The quality standard at
Cypress is zero defects resulting in a culture requiring continuous improvement in quality and reliability.
Product reliability is assured by a total quality management system. The quality management system is
described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number
90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review
and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4)
manufacturing identification of "Maverick Lot" yield limits; (5) formal training and certification of manufacturing
personnel; (6) qualification of new products and manufacturing processes; (7) continuous reliability monitoring;
(8) formal failure analysis and corrective action; and (9) competitive benchmarking.
Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress
Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress
Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard
production material. Sample selection is based on generic product families. These generic products are
designed with very similar design rules and manufactured from a core set of processes.
Reliability strategy requires that every failure that occurs during reliability testing be subjected to failure
analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism.
Corrective action is then implemented to prevent future failures, resulting in continuous improvement in product
reliability.
Copies of the Cypress Semiconductor documents referenced herein are available through your Cypress
Semiconductor sales representative. Questions about product reliability may be addressed to the undersigned.
Sabbas Daniel
Vice-President for Quality
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134-1599
Cypress Quality Fax: (408) 943-2165
2005 Q4 RELIABILITY REPORT
Page 2 of 48
Product Reliability
Cypress
2.0
PRODUCT RELIABILITY
In product stress testing, the main emphasis is on the useful life section of the bathtub curve. The test
methodology used to predict the useful life period is a steady-state life test under a dynamic bias and at
temperatures 125°C or 150°C for the maximum specified use voltage of the product. The duration at these
temperatures is 1,000 and 500 hours, respectively.
In Cypress, product reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. Each fab site and technology family from each product line are being
sampled for product monitor. These reliability tests utilize the following stress factors to accelerate failure:
temperature, current and /or voltage. The product reliability tests currently employed at Cypress include Early
Failure Rate (EFR) and Long Term Failure Rate (LFR) .
2.1
EARLY FAILURE RATE SUMMARY
Early Failure Rate Determination: High Temperature Operating Life testing (HTOL), for as long
as 96 hours, is used to estimate device early failure rate. This stress will typically correspond
to the first 2000 hours of device operation in a system environment. The remainder of the
device’s lifetime is characterized with extended LFR testing (See Section 3)
Test
:
Conditions :
Duration
:
Failure
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal + 15%, 150°C or 125°C.
48 hours HTOL at 150°C or 96 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Table 1. Early Failure Rate Summary
Technology
B53
C8
FL28
P20
POWER165
PROMOS .17
R42
R5
R7
R8
R9
S4
STARM
T013
TOWER 165
TSMC 150
TSMC 180
Grand Total
Device Hours
6,194
215,607
9,600
6,194
28,955
89,853
244,456
575,941
1,834,119
385,943
2,968,528
340,653
103,151
30,178
409,301
34,126
72,186
7,354,984
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
Insufficient
25
Insufficient
Insufficient
Insufficient
Insufficient
22
9
3
14
2
16
Insufficient
Insufficient
13
Insufficient
Insufficient
1
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample.
2005 Q4 RELIABILITY REPORT
Page 3 of 48
Product Reliability
Cypress
2.2
LONG TERM FAILURE RATE SUMMARY
A High Temperature Operating Life test (HTOL) is used to estimate long-term reliability. By
operating the devices at accelerated temperature and voltage, hundreds of thousands of use
hours can be compressed into hundreds of test hours.
Test
:
Conditions :
Duration
:
Failure
Fit Rate
:
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal +15% 150°C or 125°C.
A minimum of 80 hours at 150°C or 168 hours at 125°C
Generally 500 hours at 150°C or 1000 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Derated to 55° C ambient, with 60% upper confidence bound for 0 failures,
Ea =0.7ev (Refer to Appendix A)
Table 2. Long Term Failure Rate Summary
Technology
B53
C8
FL28
P20
POWER165
PROMOS .17
R42
R5
R7
R8
R9
S4
STARM
T013
TSMC 180
Grand Total
Device Hours
64,516
240,290
84,000
48,387
24,194
48,387
428,094
852,273
727,967
298,579
1,552,064
536,671
232,336
109,093
22,151
5,269,002
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
Insufficient
22
Insufficient
Insufficient
Insufficient
Insufficient
13
6
7
18
3
10
23
Insufficient
Insufficient
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample
2005 Q4 RELIABILITY REPORT
Page 4 of 48
Product Reliability
Cypress
3.0
PACKAGE RELIABILITY
Package-level reliability testing refers to the assessment of the over-all reliability of the device in packaged
form. This consists of subjecting packaged samples to reliability tests that expose the various sample sets to
different stress conditions, after which the samples are tested for any degradation in quality after the stress.
In Cypress, package reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. The reliability test employed is chosen based on the failure
mechanism, as different stress tests accelerate different failure mechanisms. These reliability tests utilize one
or more of the following stress factors to accelerate failure: temperature, moisture or humidity, current, voltage,
and pressure. The package reliability tests currently employed at Cypress include Pressure Cooker Test
(PCT, Highly Accelerated Stress Test (HAST), Temperature Cycle Test (TCT), and High Temperature Storage
(HTS). Figure 1 shows the Cypress package reliability stress flow.
Surface-mount samples are preconditioned per Jedec Std JESD22-A113 prior to package reliability testing.
This is required prior TCT, PCT and HAST testing. Preconditioning simulates the board mounting process of
the customer. It normally consists of a temperature cycle to simulate exposure to different temperatures
during shipping, a bake to drive away the moisture inside the packages of the samples, a soak to drive a
controlled amount of moisture into the package, and three cycles of convection reflow. Packages are soaked
and reflowed based on its shipping moisture sensitivity classification. The samples are tested (acoustic and
electrical) after preconditioning, failures from which are considered as preconditioning failures and not reliability
failures. Preconditioning failures should be taken seriously, since these imply that the samples are not robust
enough to even withstand the board mounting process.
Cypress conducts all major classes of package reliability tests on each of its package families. The package
characteristics and assembly locations are the primary considerations when grouping packages into package
families. A package family may consist of a group of 44-lead to 144-lead TQFP packages manufactured at a
particular manufacturing location.
Initital
Electrical Testing
Time Zero
Acoustic Analysis
(serialized 15 units)
Moisture
Pre-conditioning
Post Pre-Con
Electrical Testing
Post Pre-Con
Acoustic Analysis
(same serialized units)
Temperature Cycle Test
(TCT)
(300, 500, 1000 cycles))
Pressure Cooker Test
(PCT)
(168 hours)
Highly Accelerated
Stress Test (HAST)
(128 hours)
High Temperature
Storage (HTS)
(500, 1000 hours)
Post Stress
Electrical Testing
Figure 1. Cypress Package Reliability Stress Flow
2005 Q4 RELIABILITY REPORT
Page 5 of 48
Product Reliability
Cypress
3.1
PRESSURE COOKER TEST (PCT)
The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure
environmental durability of epoxy-packaged parts. Passivation cracks, ionic contamination,
and corrosion susceptibility are all accelerated by this stress.
Conditions
Pre-Conditioning
:
:
Failure Modes
Failure Mechanism
:
:
15 PSIG, 121°C, No bias, for a minimum of 168 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 3. Pressure Cooker Test Failure Rate Summary
Package
TQFP
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (1.27)
PBGA (Heat Spreader)
PBGA (Cavity/Heatsink, Pb-Free)
FBGA (0.75-0.8, Pb-Free)
PBGA (Cavity/Heatsink)
FVBGA (0.75-0.8, 0.3mm)
FBGA (1.0, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
PLCC
PLCC (Pb-Free)
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
PQFP
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
CERDIP (Windowed)
TSOP/ TSSOP
TSOP I
TSOP (Reverse)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSOP (Reverse, Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q4 RELIABILITY REPORT
Sample Size
554
100
195
1,277
215
146
140
47
95
50
100
501
95
144
448
50
200
645
147
438
235
235
487
150
630
280
535
435
245
50
439
150
95
453
99
199
50
639
10,993
# Failed Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 6 of 48
Product Reliability
Cypress
3.2
HIGHLY ACCELERATED STRESS TEST (HAST)
Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This
change was necessary because our package reliability had improved to the point where the
old 85°C/85% R.H. Temperature-humidity-bias testing would not induce failures. Failures are
necessary to judge progress and compare packaging changes. HAST testing has been shown
to be at least twenty times more accelerated then 85°C/85% R.H. temperature-humidity-bias
testing.
Conditions
:
Pre-Conditioning
:
Failure Modes
Failure Mechanism
:
:
Present Conditions: 130°C / 85% RH minimum power dissipation, for
a minimum of 128 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 4. Highly Accelerated Stress Test (HAST) Failure Rate Summary
Package
TQFP
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
PBGA (Cavity/Heatsink, Pb-Free)
FVBGA (0.75-0.8, 0.3mm)
PLCC
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
TSOP/ TSSOP
TSOP I
TSOP (Reverse)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSOP (Reverse, Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q4 RELIABILITY REPORT
Sample Size
316
96
31
291
147
98
65
250
132
274
196
235
137
569
191
290
391
453
567
291
449
144
69
406
97
372
47
474
7,078
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 7 of 48
Product Reliability
Cypress
3.3
TEMPERATURE CYCLE TEST (TC)
Differences in thermal expansion coefficients are accentuated by cycling devices through
temperature extremes. If the materials do not expand and contract equally, large stresses can
develop. The Temperature Cycle test stresses mechanical integrity by exposing a device to
alternating temperature extremes. Weakness and thermal expansion mismatches in die
interconnections, die attach, and wire bonds are often detected with this acceleration test.
Condition
:
Pre-Condition
:
Duration
:
Failure Mode
Failure Mechanism
:
:
MIL-STD-883D, Method 1010, Condition B, -55°C to 125°C
MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C
(Refer to Appendix C for derating factor calculation)
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
300 cycles minimum at Condition C,
1000 cycles minimum at Condition B
Parametric shifts and catatrophic failures
Wire bond, cracked or lifted die and package failure.
Table 5. Temperature Cycling Failure Rate Summary
Package
TQFP
TQFP (Thermal, Pb-Free)
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (1.27)
PBGA (Heat Spreader)
PBGA (Cavity/Heatsink, Pb-Free)
FBGA (0.75-0.8, Pb-Free)
PBGA (Cavity/Heatsink)
FVBGA (0.75-0.8, 0.3mm)
FBGA (1.0, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
PLCC
PLCC (Pb-Free)
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
PQFP
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
CERDIP (Windowed)
TSOP/ TSSOP
TSOP I
TSOP (Reverse)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSOP (Reverse, Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q4 RELIABILITY REPORT
Sample Size
837
50
196
194
614
476
100
242
50
245
60
100
702
50
373
350
100
150
1,045
150
396
235
283
823
195
732
100
98
440
427
495
150
441
194
190
438
150
345
50
1,011
13,277
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 8 of 48
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION
Thermal Acceleration Factors
Acceleration factors (AF) for thermal stresses (Early Failure Rate, Latent Failure Rate, Data Retention and
High Temperature Storage) are calculated from the Arrhenius equation)
AF = exp
Ea
k
1 - 1
Tu Tt
where :
Ea = Activation Energy of the defect mechanism
K = Boltzmann’s constant = 8.62 x 10 –5 eV/Kelvin
Tt is the junction temperature of the device under stress
Tu is the junction temperature of the device at use conditions
While there is no substitute for experimentally determining the activation energy, obtaining this information is
very difficult because few devices fail stress tests. In the absence of experimental data, the following literature
values are used.
Activation
Energy Ea
Failure Mechanism
Charge Gain
(eV)
0.3-0.6
Charge Loss (defects)
0.6
Charge Loss (Ionic contamination, edge bits)
0.9
Charge loss (intrinsic wear out)
0.3-0.6
Electromigration
0.6-1.0
Intermetallic Growth
1.0
Ionic Contamination
1.0-1.4
Silicon Bulk Defects
0.5
Oxide Defects
0.3
Unknown/Non-Visual Defect (NVD)
0.45
2005 Q4 RELIABILITY REPORT
Page 9 of 48
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Temperature-Humidity Acceleration Factors
Cypress estimates acceleration factors for temperature-humidity stresses (Pressure Cooker Test and Highly
Accelerated Stress Test) from a model developed by Hallberg and Peck (“Quality and Reliability Engineering
International”. Vol. 7, 1991).
-3
AF = RHt
RHu
exp Ea
k
1 - 1
Tu Tt
where :
Tu = use environment junction temperature (°K)
Tt = test environment junction temperature (°K)
Ea = failure mechanism activation energy (0.9 for corrosion)
o
k = Boltzman’s Constant (8.62 x 10 –5 eV/ Kelvin)
RHu = use environment relative humidity
RHt = test environment relative humidity
AF = acceleration factor
The Hallberg and Peck model requires the stress junction temperature and relative humidity as well as the use
temperature and relative humidity. To estimate the use relative humidity, we assume that the device room
o
o
temperature is 35 C (95 F) and the room relative humidity is 100%. From any Handbook of Chemistry and
o
Physics, the vapor pressure of water VP (water) at 35 C is 41.175 mm Hg. If we assume that the device will
o
o
operate with a junction temperature of 70 C (VP (water) at 70 C is 233.7 mm Hg), the junction relative
humidity (RHj) is
RHj
= 100%
41.175
233.7
= 17.6%
o
The operating conditions of the devices are then 70 C and 17.6% relative humidity.
o
Our Pressure Cooker Test (PCT) submits the devices to a temperature of 121 C and 100% relative humidity.
Using the Hallberg and Peck model, the acceleration factor for the PCT stress can be calculated:
-3
AF =
2005 Q4 RELIABILITY REPORT
17.6
100
exp 0.9
k
1_ - 1_
343 394
= 9, 433
Page 10 of 48
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
The acceleration factor for HAST is calculated similarly, except that junction temperature heating effects must
be included when estimating the relative humidity at the die surface.
Assuming an average junction
o
temperature rise of 5 C, the relative humidity at the die surface during 130 C HAST testing can be calculated.
o
VP (130 C) = 2026.10 mm Hg
o
VP (135 C) = 2347.26 mm Hg
RHj
= 85%
2026.10
2347.26
= 73.4%
-3
AF =
17.6
73.4
exp 0.9
k
1_ - 1_
343 408
= 9,261
o
Similarly, for 140 C HAST testing,
o
VP (140 C) = 2710.92 mm Hg
o
VP (145 C) = 3116.76 mm Hg
RHj
= 85%
2710.92
3116.76
= 73.9%
-3
AF =
2005 Q4 RELIABILITY REPORT
17.6
73.9
exp 0.9
k
1_ - 1_
343 418
= 17,433
Page 11 of 48
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Failure Rate Calculation
For all but LFR test, Cypress reports the failure rate in terms of ppm. Early life reliability is reported in terms of
ppm defective expected during the first year of use under typical use conditions. No upper confidence bound
will be used for this estimate. The ppm defective is the ratio of the number of rejects to the number of samples
and expressed in ppm.
PPM =
Total Rejects x 1,000,000
Total Samples
Intrinsic, or later life reliability, shall be reported using the exponential model, in terms of FITs, with a 60%
upper confidence bound for 0 failures or the demonstrated FIT estimate in the case there are failures.
FR (FIT) =? 2? , 2n +2 /(2 * AF * Device Hours) * 10 9
where:
? 2 ? ,2n +2 = Chi square factor for 2n +2 degrees of freedom at 60% confidence level.
n = number of failure.
AF = Thermal Acceleration factor and is calculated per Arrhenius equation assuming a 0.7eV activation energy.
Voltage acceleration factor is not included in failure rate calculation even though voltage acceleration may be
used during stress. Typical use conditions shall be considered to be 55°C ambient with a 15°C temperature
rise at the junction. Thus, use junction temperature is 70°C.
2005 Q4 RELIABILITY REPORT
Page 12 of 48
Product Reliability
Cypress
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
Two acceleration factor (AF) models are used to model temperature cycle failures. The model proposed by
Zelenka [1] and others uses the epoxy molding temperature (Tmold = 170 °C) and the minimum temperature
reached during temperature cycling , (Tmin).
m
AFbrittle =
Tmold - Tmin,stress
Tmold - Tmin,stress
The model constant, m, is experimentally calculated for each failure mechanism. The acceleration factor is
labeled ‘brittle’ because the derivation of this equation assumes brittle fracture mechanics. Basically, the
model assumed that cracks advance a little every time the maximum stress is reached. The maximum stress
is assumed to be proportional to the difference in temperature between the minimum and maximum stress
temperatures. For plastic-encapsulated devices, the stress is minimum during molding, (Tmold), and a
maximum during the lowest temperature reached during temperature cycling, (Tmin).
The model constant, m, is a function of the failure mechanism.
Thin film cracking
Al/Au Intermetallic fractures
Chip-out (cratering) bond failures
m = 12 (Blish and Vaney [2])
m=4
m = 7 (Dunn and McPherson [3])
For ductile materials, dislocation movement dominates the fracture mechanics and a different model is used.
The second, and most widely accepted model, use the difference between the minimum and maximum
temperatures during temperature cycle testing (Tmin and Tmax) to calculate an acceleration factor.
m
AFductile =
Tmax, stress - Tmin,stress
Tmax,use - Tmin,use
The model constant, ‘m’, is again experimentally calculate for each failure mechanism.
Coffin and Manson [4] developed this model from empirical observations of metal fatigue. In ductile materials,
if the applied stress is high enough, dislocation are produced. At the high temperature condition of the
temperature cycling stress, dislocations are forced towards one metal surface. At the low temperature , the
dislocations try to glide back to their original position, but many cannot because they became entangled with
other dislocations. After many cyles, these tangles grow until cracking, and finally failure, occurs. Both
minimum and maximum temperatures are important, because both contribute to dislocation movement and
entanglement. This model is recommended for any failures involving ductile materials. Model constants for
ductile failure mechanism follow.
Wirebond breakage
Solder Fatigue
2005 Q4 RELIABILITY REPORT
m = 5.16 (Cypress experimentation)
m = 2 (Blish and Vaney [2])
Page 13 of 48
Product Reliability
Cypress
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS (cont.)
Our commercial devices are specified to operate between 0°C and 70 °C. Using this information, the
acceleration factor, AF, between use and Military Condition C stress testing (-65°C to 150°C), for the brittle,
thin film cracking failure mechanism and ductile, wire bond breakage failure mechanism can be calculated.
12
AF brittle
=
170 - (-65)
170 - 0
AF ductile
=
150 - (-65)
70 - 0
=
49
5.16
=
327
References:
[1] R.L. Zelenka, IEEE/IRPS, pp. 30-34, 1991
[2] R.C. Blish and P.R. Vaney, IEEE/IRPS, pp 22-29, 1991
[3] C.F. Dunn and J.W. McPherson, IEEE/IRPS, pp 252-258, 1990
[4] S.S. Manson, thermal Stress and Low-Cycle Fatigue, (Robert Krieger : Malabar, Florida), 1981.
2005 Q4 RELIABILITY REPORT
Page 14 of 48
Product Reliability
Cypress
APPENDIX C: EQUIVALENCE OF DIFFERENT STRESS TEST CONDITIONS
During stress testing, more than one set of test conditions were used. To account for this difference, stress
test hours or cycles at the lower stress condition were derated and then added to the total for the most severe
stress test condition.
Dynamic (HTOL)
HTOL (EFR/LFR) test is performed at 150 °C and 125 °C. Using the Arrhenius equation (Appendix A) and an
activation energy of 0.7 eV, the derating factor, DF, between 125°C and 150 °C can be calculated.
DF (between 125C and 150C) = exp
0.6 ____1 _______ - ______1______
k 150 + 15 + 273
125 + 15 + 273
= 0.326
Derating calculation assumes a 15 °C rise due to junction heating.
Temperature Cycling
Two different temperature cycling conditions were used to measure reliability, -65°C to 150°C and –55°C to
125°C. Using the brittle failure mechanism model with m = 12, the derating factor between -65°C to 150°C and
–55°C to 125°C is calculated.
12
DF
=
170 - (-55)
170 – (-65)
=
1.685
Using the ductile failure mechanism model with m = 5.16, the derating factor between -65°C to 150°C and –
55°C to 125°C is obtained.
5.16
DF
=
125 - (-55)
150 - (-65)
=
2.501
HAST
The derating factor between two HAST conditions, 140 °C / 85%RH and 130 °C / 85% RH is simply the ratio of
the acceleration factors (See Appendix A)
DF
2005 Q4 RELIABILITY REPORT
=
9,261_
17, 433
=
0.531
Page 15 of 48
Product Reliability
Cypress
APPENDIX D: RELIABILITY DATA
Summary Detail -- EFR Performance
Technology
Temp
Eval Num
125C
MR044075
Division Device
Volt
SS
Rej
Hours
4.0V
200
0
200
0
FA Results
B53
DCD
CY7B993V-5AC
Summary for 'Technology' = B53 (1 detail record)
96
C8
125C
033805
CCD
7C682005AC-RSPC
3.8V
514
0
96
125C
042106
CCD
7C82877A
2.35V
505
0
96
125C
042106
CCD
7C87741A
2.35V
276
0
96
125C
042106
CCD
7C82877A
2.35V
126
0
96
125C
044503
CCD
CY7C68013
3.8V
645
0
96
125C
044503
CCD
CY7C68013
3.8V
645
0
96
125C
050305
CCD
7C828771BC-GBZI
2.35V
508
0
96
125C
050305
CCD
7C828771BC-GBZI
2.35V
510
0
96
150C
042105
CCD
7C83864AC-GBPC
2.35V
391
0
48
150C
042105
CCD
7C83864AC-GBPC
2.35V
296
0
48
150C
042105
CCD
7C83864AC-GBPC
2.35V
391
0
48
150C
042507
CCD
CY284KOTP
3.8V
130
0
48
150C
042507
CCD
CY284KOTP
3.8V
135
0
48
150C
042507
CCD
CY284KOTP
3.8V
135
0
48
150C
042507
CCD
CY284KOTP
3.8V
135
0
48
150C
042507
CCD
CY284KOTP
3.8v
68
0
48
150C
042507
CCD
CY284KOTP
3.8V
135
0
48
150C
150C
042507
042507
CCD
CCD
CY284KOTP
CY284KOTP
3.8V
3.8V
135
135
0
0
48
48
5815
0
200
0
200
0
200
0
200
0
Summary for 'Technology' = C8 (19 detail records)
FL28
150C
MR044053
CCD
CY22392FC
3.8V
Summary for 'Technology' = FL28 (1 detail record)
48
P20
125C
MR051058
DCD
CY7C343-35JC
5.75V
Summary for 'Technology' = P20 (1 detail record)
96
POWER165
125°C
MR043088
MID
CYK256K16MCCBU-70BVI
3.8V
288
0
96
125C
MR044059
MID
CYK512K16SCCAU-70BAI
4.5V
198
0
96
125C
MR051083
MID
K128K6C9BW
3.8
200
0
96
125C
MR052047
MID
CYK128K16MCCBU-55BVIT
3.8V
249
0
96
935
0
Summary for 'Technology' = POWER165 (4 detail records)
PROMOS .17
125C
045001
MID
U0166TFF7AZ-GBVI
2.1V
1238
0
96
125C
045001
MID
U0166TFF7AZ-GBVI
2.1V
1251
0
96
125C
MR044080
MID
U01766TFF7AZ
2.36
300
0
96
125C
MR044080
MID
U01766TFF7AZ
2.36
150
0
72
2939
0
Summary for 'Technology' = PROMOS .17 (4 detail records)
2005 Q4 RELIABILITY REPORT
Page 16 of 48
Product Reliability
Cypress
Technology
Temp
Eval Num
Division Device
Volt
SS
125C
125C
MR043076
MR043076
MID
MID
125C
MR052043
125C
125C
Rej
Hours
CY62256LL-70SNI
CY62256LL-70SNI
5.75V
5.75V
150
298
0
0
72
96
DCD
CY7C09389V-9AC
3.8V
150
0
48
MR052043
DCD
CY7C09389V-9AC
3.8V
50
0
48
MR052079
MID
CY62256LL-70SNC
5.75V
200
0
96
125C
MR053024
MID
CG6521M
5.75V
196
0
96
150C
053007
DCD
CY7C027V
3.8V
388
0
48
150C
053007
DCD
CY7C027V
3.8V
1059
0
48
150C
053007
DCD
CY7C027V
3.8V
366
0
48
150C
053407
MID
CY62256LL
5.75V
849
0
48
150C
053407
MID
CY62256LL
5.75V
850
0
48
150C
053407
MID
CY62256LL
5.75V
846
0
48
150C
MR053011
DCD
CY7C038V-25AC
3.8V
150
0
48
150C
MR053011
DCD
CY7C038V-25AC
3.8V
0
48
FA Results
R42
Summary for 'Technology' = R42 (14 detail records)
5552
0
R5
125C
040903
CCD
7C828437AC-RSPC
3.8V
260
0
96
125C
040903
CCD
7C828437AC-RSPC
3.8V
260
0
110
125C
040903
CCD
7C828437AC-RSPC
3.8V
182
0
96
125C
040903
CCD
7C828437AC-RSPC
3.8V
260
0
110
125C
040903
CCD
7C828437AC-RSPC
3.8V
38
0
96
125C
050303
CCD
CY7C68000-56PVXC
3.8V
442
0
96
125C
MR044060
MID
CY62136VLL-55ZI
3.8V
50
0
96
125C
MR044060
MID
CY62136VLL-55ZI
3.8V
0
96
125C
MR051054
MID
CY7C1399B-12VC
3.8V
200
0
48
125C
125C
MR051055
MR052024
MID
MID
CY7C1009B-15VC
CY22392FC
3.8V
3.8V
200
300
0
0
48
48
125C
MR052029
MID
CY62136VLL-70ZI
3.8V
299
0
96
125C
MR053007
MID
CG6513AM
2.3V
200
0
48
125C
MR053022
MID
CY62136VLL-70ZXI
2.3V
298
0
96
125C
MR053048
MID
CY7C1399B-12VC
2.45
300
0
48
150C
041303
CCD
7C89000AC-RAZZC
2.875V
500
0
48
150C
041303
CCD
7C89000AC-RAZZC
2.875V
477
0
48
150C
041303
CCD
7C89000AC-RAZZC
2.875V
520
0
48
150C
043801
CCD
7C823C09AC-MSZI
3.8V
496
0
48
150C
043801
CCD
7C823C09AC-MSZI
3.8V
504
0
48
150C
045102
DCD
CYDC256A16-55AXI
3.45V
178
0
48
150C
045102
DCD
CYDC256A16-55AXI
3.45V
358
0
48
150C
045102
DCD
CYDC256A16-55AXI
3.45V
628
0
48
150C
050303
CCD
CY7C68000-56PVXC
3.8V
155
0
48
150C
050303
CCD
CY7C68000-56PVXC
3.8V
429
0
48
150C
050303
CCD
CY7C68000-56PVXC
3.8V
187
0
48
150C
050303
CCD
CY7C68000-56PVXC
3.8V
458
0
48
150C
050303
CCD
CY7C68000-56PVXC
3.8V
457
0
48
150C
051903
CCD
CY221R28-ZXC
2.875V
500
0
48
150C
051903
CCD
CY221R28-ZXC
2.875V
492
0
48
150C
051903
CCD
CY221R28-ZXC
2.875V
500
0
48
2005 Q4 RELIABILITY REPORT
Page 17 of 48
Product Reliability
Cypress
Technology
Temp
Eval Num
Volt
SS
150C
052103
Division Device
DCD
7C02628AC-RAZI
3.45V
328
0
48
150C
052103
DCD
7C02628AC-RAZI
3.45V
330
0
48
150C
052103
DCD
CYD256B16-55AXI
3.45V
330
0
48
150C
052103
DCD
CYD256B16-55AXI
3.45V
328
0
48
150C
150C
052103
052103
DCD
DCD
7C02628AC-RAZI
CYD256B16-55AXI
3.45V
3.45V
332
332
0
0
48
48
150C
MR044048
MID
CY7C1329-100AC
3.8
200
0
48
150C
MR044048
MID
CY7C1329-100AC
3.8
200
0
48
150C
MR044050
MID
CY7C1021B-15ZI
3.8V
150
0
48
150C
MR044050
MID
CY7C1021B-15ZI
3.8V
50
0
48
150C
MR044071
MID
CY7C1021BV33L-10ZC
3.8V
200
0
48
150C
MR044073
MID
CY7C1021B-15ZC
3.8V
200
0
48
150C
MR051030
MID
CY7C1009B-15VC
3.8V
200
0
48
150C
MR051042
MID
CY7C1399B-12VC
3.8V
196
0
48
13504
0
114
0
48
Summary for 'Technology' = R5 (45 detail records)
Rej
Hours
FA Results
R7
125C
044102
DCD
CY7C0832
2.3V
125C
044102
DCD
CY7C0832
2.3V
61
0
48
125C
044102
DCD
CY7C0832
2.3V
720
0
48
125C
044102
DCD
CY7C0832
2.3V
101
0
48
125C
044102
DCD
CY7C0832
2.3V
101
0
48
125C
044102
DCD
CY7C0832
2.3V
114
0
48
125C
044102
DCD
CY7C0832
2.3V
61
0
48
125C
044102
DCD
CY7C0832
2.3V
720
0
48
125C
053206
MID
CY7C1313V18
2.07V
295
0
96
125C
053206
MID
CY7C1313V18
2.07V
1774
0
96
125C
053206
MID
CY7C1313V18
2.07V
197
0
96
125C
MR043078
MID
CY62147CV30LL-70BAI
3.45V
300
0
96
125C
MR044074
MID
CY7C1061AV33-10ZC
2.45V
0
116
125C
125C
MR044074
MR051060
MID
MID
CY7C1061AV33-10ZC
CY7C1041CV33-12ZC
2.45V
2.3V
200
538
0
0
22
48
125C
MR051061
MID
CY7C1021CV33-12ZC
2.3V
673
0
48
125C
MR051062
MID
CY7C1021CV33-15ZC
2.3V
337
0
48
125C
MR051063
MID
CY7C1041CV33-15ZC
2.3V
269
0
48
125C
MR051067
MID
CY7C1021CV33-12ZC
2.3V
673
0
48
125C
MR051074
MID
CY62137CV30LL-55BVI
3.45V
999
0
96
125C
MR051081
MID
CY7C1041CV33-15ZC
2.3V
270
0
96
150C
050505
MID
CY7C1360B
2.3V
3486
0
48
150C
MR043064
MID
CY7C1347F-133AC
2.3V
299
0
48
150C
MR043064
MID
CY7C1347F-133AC
2.3V
150
0
32
150C
MR044049
MID
CY7C1041CV33-12ZI
2.3V
150
0
32
150C
MR044049
MID
CY7C1041CV33-12ZI
2.3V
198
0
48
150C
MR044049
MID
CY7C1041CV33-12ZI
2.3V
150
0
420
150C
MR044049
MID
CY7C1041CV33-12ZI
2.3V
0
48
150C
MR044072
MID
CY7C1372CV25-167AC
2.3V
200
0
48
150C
MR051025
MID
CY7C1041CV33-10ZC
2.3V
200
0
48
150C
MR051025
MID
CY7C1041CV33-10ZC
2.3V
500
0
48
150C
MR051048
MID
CY7C1041CV33-10VC
2.3V
0
48
2005 Q4 RELIABILITY REPORT
Page 18 of 48
Product Reliability
Cypress
Technology
Temp
Eval Num
Volt
SS
150C
MR051048
Division Device
MID
CY7C1041CV33-10VC
2.3V
147
0
12
150C
MR051053
MID
CY7C1041CV33-15ZI
2.3V
400
0
48
150C
MR051064
MID
CY7C1021CV33-8ZC
2.3V
296
0
48
150C
MR051068
MID
CY7C1041CV33-15ZC
2.3V
269
0
48
150C
MR051069
MID
CY7C1021CV33-15ZC
2.3V
675
0
48
150C
MR051070
MID
CY7C1021CV33-15ZC
2.3V
675
0
48
150C
MR051072
MID
CY7C1021CV33-15Z
2.3V
675
0
48
150C
150C
MR051073
MR051084
MID
MID
CY7C1021CV33-15ZXC
CY7C1021CV33-8VC
2.3V
2.3V
645
60
0
0
48
48
150C
MR052048
MID
CY7C1049CV33-10VC
2.3V
330
0
48
150C
MR052049
MID
CY7C1021CV33-8VC
2.3V
316
0
48
150C
MR052050
MID
CY7C1021CV33-8VC
2.3V
799
0
48
150C
MR052063
MID
CY7C1041CV33-10ZC
2.3V
101
0
48
150C
MR052081
MID
CY7C1049CV33-12ZCT
2.3V
615
0
48
150C
MR052091
MID
CY7C1041CV33-15ZC
2.3V
493
0
48
150C
MR052100
MID
CY7C1021CV33-15ZC
2.3V
500
0
48
150C
MR052102
MID
CY7C1041CV33-10ZC
2.3V
598
0
48
150C
MR053025
MID
CY7C1021CV33-15VC
2.3V
200
0
48
150C
MR053026
MID
CY7C1021CV33-15VXC
2.3V
200
0
48
150C
MR053062
MID
CG5978AT
2.3V
8997
0
48
150C
MR053063
MID
CG5978AT
2.3V
2000
0
48
150C
MR053064
MID
CG5978AT
2.3V
5985
0
48
150C
MR054045
MID
CY7C1041CV33-10ZC
2.3V
3000
0
48
41826
0
Summary for 'Technology' = R7 (55 detail records)
Rej
Hours
FA Results
R8
125C
044304
MID
CY62147DV30L
2.4V
683
0
96
125C
045103
MID
7C62157DC-RABVI
2.4V
2194
0
96
125C
045103
MID
7C62157DC-RABVI
2.4V
1510
0
96
125C
045103
MID
7C62157DC-RABVI
2.4V
254
0
96
125C
045103
MID
7C62157DC-RABVI
2.4V
1677
0
96
125C
054806
MID
CY62167DV30
2.4V
1627
0
96
125C
054806
MID
CY62167DV30
2.4V
1750
0
96
125C
125C
054806
MR043074
MID
MID
CY62167DV30
CY62157DV30L-45BVI
2.4V
2.4V
1490
150
0
0
96
72
125C
MR051032
MID
CY62147DV30LL-55BVI
2.4V
200
0
96
125C
MR051044
MID
CY62146DV30LL-70ZSXI
2.4V
198
0
96
150C
MR051077
MID
CY62128DV30LL-70SI
2.4V
195
0
48
150C
MR052028
MID
CY62128DV30LL-55ZI
2.4V
300
0
48
12228
0
Summary for 'Technology' = R8 (13 detail records)
R9
125C
044201
MID
CY7C1413AV18-200BZC
2.25V
265
0
96
125C
044201
MID
CY7C1413AV18-200BZC
2.25V
1752
0
96
125C
044201
MID
CY7C1413AV18-200BZC
2.25V
144
0
96
125C
044201
MID
CY7C1413AV18-200BZC
2.25V
970
0
96
125C
051505
MID
CY7C1312BV18-250BZC
2.25V
764
0
96
125C
051505
MID
CY7C1312BV18-250BZC
2.25V
912
0
96
125C
051505
MID
CY7C1312BV18-250BZC
2.25V
989
0
96
125C
051901
MID
CY7C1512V18-250BZC
2.25V
1613
0
96
2005 Q4 RELIABILITY REPORT
Page 19 of 48
Product Reliability
Cypress
Technology
Temp
Eval Num
Volt
SS
125C
054003
Division Device
MID
CY7C1514AC
2.25V
600
0
96
125C
054003
MID
CY7C1513AC
2.25V
273
0
96
125C
054003
MID
CYC15121AC
2.25V
1113
0
96
125C
054302
MID
CY62147EV30*
1.85V
679
0
96
125C
054302
MID
CY62147EV30*
1.85V
1711
0
96
125C
054302
MID
CY62147EV30*
1.85V
4031
0
96
125C
MR052054
MID
CY7C1347G-133AXC
2.25V
200
0
48
125C
MR052056
MID
CY7C1347G-133AXC
2.25V
148
0
48
125C
MR052057
MID
CY7C1347G-133AXC
2.25V
200
0
48
125C
150C
MR052058
044911
MID
MID
CY7C1347G-133AXC
CY7C1360
2.25V
2.25V
199
2227
0
0
48
48
150C
044911
MID
CY7C1360
2.25V
2369
0
48
150C
045003
MID
7C1370EC-RAZC
2.25V
1893
0
36
150C
045003
MID
7C1370EC-RAZC
2.25V
1618
0
48
150C
045003
MID
7C1370EC-RAZC
2.25V
1909
0
12
150C
045003
MID
7C1370EC-RAZC
2.25V
1576
0
48
150C
050902
MID
CY7C1347G-166AXC
2.25V
1307
0
48
150C
050902
MID
CY7C1347G-166AXC
2.25V
1305
0
48
150C
050902
MID
CY7C1347G-166AXC
2.25V
4421
0
48
150C
051006
MID
CY7C1347G
2.25V
1679
0
48
150C
051006
MID
CY7C1470
2.25V
801
0
48
150C
051006
MID
CY7C1347G
2.25V
1727
0
48
150C
051006
MID
CY7C1347G
2.25V
3478
0
48
150C
051103
MID
7C1460BC-RAZCB
2.25V
442
0
48
150C
051103
MID
7C1460BC-RAZCB
2.25V
1903
0
48
150C
051103
MID
7C1460BC-RAZCB
2.25V
274
0
48
150C
052203
MID
CY7C1370
2.25V
1285
0
48
150C
052203
MID
CY7C1370
2.25V
1167
0
48
150C
052203
MID
CY7C1370
2.25V
1076
0
48
150C
052206
MID
CY7C1347G-166AXC
2.25V
1242
0
48
150C
052206
MID
CY7C1347G-166AXC
2.25V
1480
0
48
150C
052206
MID
CY7C1347G-166AXC
2.25V
1572
0
48
150C
052607
MID
CY7C1339G
850
0
24
150C
052607
MID
CY7C1339G
847
0
24
150C
052607
MID
CY7C1339G
848
0
24
150C
150C
053405
053405
MID
MID
CY7C1360C
CY7C1360C
2.25V
2.25V
2846
2851
0
0
48
48
150C
053405
MID
CY7C1360C
2.25V
1281
0
48
150C
054801
MID
CY7C1470V33
2.25 V
590
0
48
150C
054801
MID
CY7C1470V33
2.25 V
1161
0
48
150C
054801
MID
CY7C1470V33
2.25 V
705
0
48
150C
MR052060
MID
CY7C1327G-133AXC
0
199
0
48
150C
MR053065
MID
CY7C1370D-167AXI
2.3V
1846
0
48
150C
MR053066
MID
CY7C1370D-167AXI
2.3V
2732
0
48
150C
MR053067
MID
CY7C1370D-167AXI
2.3V
1070
0
48
71140
0
Summary for 'Technology' = R9 (53 detail records)
2005 Q4 RELIABILITY REPORT
Rej
Hours
FA Results
Page 20 of 48
Product Reliability
Cypress
Technology
Temp
Eval Num
Division Device
Volt
SS
125C
042501
CCD
125C
044602
CCD
125C
044703
125C
125C
Rej
Hours
CY8C21323-24PVXI
5.5V
1024
0
96
CY8C24494-24PVXI
5.5V
1008
0
96
CCD
CY8C24423A-12PVXE
5.5V
653
0
12
044703
CCD
CY8C24423A-12PVXE
5.5V
576
0
12
044703
CCD
CY8C24423A-12PVXE
5.5V
852
0
12
125C
044703
CCD
CY8C24423A-12PVXE
5.5V
859
0
12
125C
052004
CCD
CY8C21234-24SXI
5.5V
1002
0
120
125C
053402
CCD
CY8C27443-24PVXI
5.5V
1010
0
96
125C
053403
CCD
CY8C24423A-24PVXI
5.5V
1004
0
96
125C
053603
CCD
CY8C24794-24LFXI
5.5V
923
0
96
125C
MR043075
CCD
CY8C27443-24PVXI
5.5V
150
0
72
125C
MR051040
CCD
CY8C27443-24PXI
5.5V
185
0
96
125C
MR052042
CCD
CY22393ZXC-541
3.8V
300
0
48
125C
125C
MR052082
MR052083
CCD
CCD
CY8C24223A-24PVXI
CY8C26443-24PVI
5.5V
5.5V
200
149
0
0
96
96
125C
MR053020
CCD
CY22392ZXI-353
2.3V
270
0
48
150C
042806
CCD
7C80330AT-MSZC
3.8V
1010
0
48
150C
050507
CCD
7C84980AT-TZZC
3.8V
540
0
48
150C
050507
CCD
7C84980AT-TZZC
3.8V
496
0
48
150C
MR051076
CCD
CY22392ZC-366
3.8V
199
0
48
12410
0
FA Results
S4
Summary for 'Technology' = S4 (20 detail records)
STARM
110C
MR044046
DCD
CY7B923-400JC
5.75V
150
0
832
110C
MR044046
DCD
CY7B923-400JC
5.75V
150
0
72
110C
MR044046
DCD
CY7B923-400JC
5.75V
200
0
96
125C
MR051034
DCD
CY7B933-JC
6.5V
75
0
96
125C
MR051034
DCD
CY7B933-JC
6.5V
50
0
96
125C
MR051034
DCD
CY7B933-JC
6.5V
75
0
96
125C
MR052076
DCD
CY7B991-7JCT
6.6V
200
0
96
125C
MR054023
CCD
CY7B991-5JC
2.4V
100
0
96
125C
MR054023
CCD
CY7B991-5JC
2.4V
200
0
96
1200
0
Summary for 'Technology' = STARM (9 detail records)
T013
125C
025107
DCD
7C71050AJ-GQFGC
1.38V
57
0
96
125C
025107
DCD
7C71050AJ-GQFGC
1.38V
5
0
48
125C
025107
DCD
7C71050AJ-GQFGC
1.38V
6
0
48
125C
025107
DCD
7C71050AJ-GQFGC
1.38V
17
0
48
125C
125C
025107
025107
DCD
DCD
7C71050AJ-GQFGC
7C71050AJ-GQFGC
1.38V
1.38V
33
6
0
0
96
48
125C
025107
DCD
7C71050AJ-GQFGC
1.38V
17
0
48
125C
025107
DCD
7C71050AJ-GQFGCB
1.35V
144
0
96
125C
025107
DCD
7C71050AJ-GQFGCB
1.35V
72
0
96
125C
025107
DCD
7C71050AJ-GQFGCB
1.35V
135
0
96
125C
025107
DCD
7C71050AJ-GQFGCB
1.35V
62
0
96
125C
025107
DCD
7C71050BJ-GQFGC
1.35V
48
0
96
125C
025107
DCD
7C71050AJ-GQFGC
1.38V
5
0
48
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
50
0
12
2005 Q4 RELIABILITY REPORT
Page 21 of 48
Product Reliability
Cypress
Technology
Temp
Eval Num
Volt
SS
125C
041401
Division Device
DCD
7C71050BJ-GQFGC
1.35V
20
0
12
125C
041401
DCD
7C71050BJ-GQFGCB
1.35V
176
0
96
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
49
0
48
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
50
0
12
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
20
0
24
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
50
0
24
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
28
0
96
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
20
0
48
125C
041401
DCD
7C71050BJ-GQFGC
1.35V
20
0
12
125C
044108
DCD
7C71051CJ-GQFGCB
1.35V
31
0
96
125C
044108
DCD
7C71051CJ-GQFGCB
1.35V
27
0
96
125C
044108
DCD
7C71051CJ-GQFGCB
1.35V
28
0
96
125C
044108
DCD
7C71051CJ-GQFGCB
1.35V
36
0
96
1212
0
1912
1865
0
0
96
96
Summary for 'Technology' = T013 (27 detail records)
Rej
Hours
FA Results
TOWER 165
125C
125C
051502
051502
MID
MID
CYK512K16SCCAU
CYK512K16SCCAU
125C
051502
MID
CYK512K16SCCAU
1944
0
96
125C
052102
MID
CYK128K16MCCBU-70BVIT
3.8V
1499
0
96
125C
052102
MID
CYK128K16MCCBU-70BVIT
3.8V
1498
0
96
125C
052102
MID
CYK128K16MCCBU-70BVIT
3.8V
1499
0
96
125C
052102
MID
CYK128K16MCCBU-70BVIT
3.8V
1000
0
96
125C
052102
MID
CYK128K16MCCBU-70BVIT
3.8V
1000
0
96
125C
052102
MID
CYK128K16MCCBU-70BVIT
3.8V
1000
0
96
13217
0
Summary for 'Technology' = TOWER 165 (9 detail records)
TSMC 150
125C
044101
DCD
CYNSE70129D
2.1V
551
0
96
125C
044101
DCD
CYNSE70129D
2.1V
551
0
96
1102
0
Summary for 'Technology' = TSMC 150 (2 detail records)
TSMC 180
125C
034001
DCD
7C72250BJ-GQFGCB
1.38V
181
0
96
125C
034001
DCD
7C72250BJ-GQFGC
1.38V
129
0
96
125C
034001
DCD
7C72220BJ-GQFGCB
1.38V
127
0
96
125C
034001
DCD
7C72250AJ-GQFGC
1.8V
143
0
96
125C
034002
DCD
7C72220AJ-GQFGC
1.8V
0
96
125C
043305
DCD
CYNSE70128
1.725
395
0
96
125C
043305
DCD
CYNSE70128
1.725
549
0
96
125C
043305
DCD
CYNSE70128
1.725
346
0
96
125C
044108
DCD
CYNSE10512A
1.35V
70
0
96
125C
125C
044108
044108
DCD
DCD
CYNSE10512A
CYNSE10512A
1.35V
1.35V
85
144
0
0
96
96
125C
044108
DCD
CYNSE10512A
1.35V
32
0
96
125C
044108
DCD
CYNSE10512A
1.35V
130
0
96
2331
0
186011
0
Summary for 'Technology' = TSMC 180 (13 detail records)
Grand Total
2005 Q4 RELIABILITY REPORT
Page 22 of 48
Product Reliability
Cypress
Summary Detail -- LFR Performance
Technology
B53
Temp
Eval Num
125C MR044075
Division
Family
DCD
TDP
CY7B993V-5AC
4.0V
200
0
832
TDP
CY7B993V-5AC
4.0V
200
400
0
0
168
125C MR044075 DCD
Summary for 'Technology' = B53 (2 detail records)
Device
Volt
SS Reject
Duration
FA Results
C8
125C 033805
CCD
USB
7C682001AC-RAC
3.8V
200
0
168
125C 033805
CCD
USB
7C682005AC-RSP
3.8V
208
0
928
125C 033805
CCD
USB
7C682005AC-RSP
3.8V
208
0
72
125C 042106
CCD
7C87740A
2.35
150
0
832
125C 042106
CCD
7C682001AC-RAC
3.8V
200
0
168
125C 042106
CCD
7C87741A
2.35
253
0
1000
125C 042106
CCD
7C82877A
2.35
123
0
168
125C 042106
CCD
7C87740A
2.35
150
0
168
CY284KOTP
3.8V
135
1627
0
0
110
CY22392FC
3.8V
200
200
0
0
420
CY7C343-35JC
5.75
150
0
168
CY7C343-35JC
5.75
150
300
0
0
832
SPDRM
CYK128K16MCCB
0
150
0
332
125C MR052047 MID
SPDRM
Summary for 'Technology' = POWER165 (2 detail records)
CYK128K16MCCB
0
150
300
0
0
168
SPDRM
U01766TFF7AZ
2.36
150
0
832
125
MR044080 MID
SPDRM
Summary for 'Technology' = PROMOS .17 (2 detail records)
U01766TFF7AZ
2.36
150
300
0
0
168
USB
TDP
150C 042507
CCD
Summary for 'Technology' = C8 (9 detail records)
FL28
150C MR044053 CCD
Summary for 'Technology' = FL28 (1 detail record)
CPLD
P20
125C MR051058
DCD
125C MR051058 DCD
Summary for 'Technology' = P20 (2 detail records)
POWER165
125C MR052047
MID
PROMOS .17
125
MR044080
MID
R42
125
MR043076
MID
MPWR
CY62256LL-70SNI
5.75
150
0
168
125
MR043076
MID
MPWR
CY62256LL-70SNI
5.75
150
0
832
125
MR053034
MID
MPWR
CG6520AM
5.25
147
0
832
125
MR053034
MID
MPWR
CG6520AM
5.25
150
0
168
125C MR052043
DCD
-
CY7C09389V-9AC
3.8V
150
0
420
125C MR052043
DCD
-
CY7C09389V-9AC
3.8V
150
0
80
125C MR052079
MID
MPWR
CY62256LL-70SNC
5.75
150
0
168
125C MR052079
MID
MPWR
CY62256LL-70SNC
5.75
148
0
832
125C MR053011
DCD
SPCM
CY7C038V-25AC
3.8V
150
0
80
125C MR053011
DCD
SPCM
CY7C038V-25AC
3.8V
150
0
420
125C MR053024
MID
MPWR
CG6521M
5.75
150
0
168
125C MR053024
MID
MPWR
CG6521M
5.75
150
0
832
2005 Q4 RELIABILITY REPORT
Page 23 of 48
Product Reliability
Cypress
Technology
Temp
Division
Family
150C 053407
Eval Num
MID
MPWR
CY62256LL
5.75
125
0
500
150C 053407
MID
MPWR
CY62256LL
5.75
125
0
500
MPWR
CY62256LL
5.75
125
2170
0
0
500
150C 053407
MID
Summary for 'Technology' = R42 (15 detail records)
Device
Volt
SS Reject
Duration
FA Results
R5
125C MR044048
MID
SYNC
CY7C1329-100AC
3.8V
200
0
48
125C MR044048
MID
SYNC
CY7C1329-100AC
3.8V
200
0
48
125C MR051054
MID
FAST
CY7C1399B-12VC
3.8V
150
0
80
125C MR051054
MID
FAST
CY7C1399B-12VC
3.8V
150
0
420
125C MR051055
MID
FAST
CY7C1009B-15VC
3.8V
150
0
80
125C MR051055
MID
FAST
CY7C1009B-15VC
3.8V
150
0
420
125C MR052024
MID
FAST
CY22392FC
3.8V
150
0
90
125C MR052029
MID
MPWR
CY62136VLL-70ZI
3.8V
150
0
832
125C MR052029
MID
MPWR
CY62136VLL-70ZI
3.8V
150
0
168
125C MR053007
MID
FAST
CG6513AM
2.3V
150
0
80
125C MR053022
MID
MPWR
CY62136VLL-70ZXI
2.3V
150
0
168
125C MR053048
MID
FAST
CY7C1399B-12VC
2.45
150
0
32
150
MR044050
MID
FAST
CY7C1021B-15ZI
3.8V
149
0
420
150
MR044050
MID
FAST
CY7C1021B-15ZI
3.8V
150
0
80
150C 041303
CCD
PTG
7C89000AC-RAZZ
2.87
119
0
278
150C 041303
CCD
PTG
7C89000AC-RAZZ
2.87
120
0
80
150C 043801
CCD
TDP
7C823C09AC-MSZI
3.8V
120
0
80
150C 043801
CCD
TDP
7C823C09AC-MSZI
3.8V
120
0
420
150C 045102
DCD
SPCM
CYDC256A16-55A
3.45
120
0
420
150C 045102
DCD
SPCM
CYDC256A16-55A
3.45
120
0
80
150C 050303
CCD
PCD
CY7C68000-56PVX
3.8V
116
0
80
150C 050303
CCD
PCD
CY7C68000-56PVX
3.8V
116
0
80
150C 051903
CCD
GPCLK
CY221R28-ZXC
2.87
116
0
80
150C 051903
CCD
GPCLK
CY221R28-ZXC
2.87
116
0
420
150C 051903
CCD
GPCLK
CY221R28-ZXC
2.87
116
0
420
150C 051903
CCD
GPCLK
CY221R28-ZXC
2.87
116
0
80
150C 052103
DCD
DCD
CYD256B16-55AXI
3.45
119
0
420
150C 052103
DCD
DCD
CYD256B16-55AXI
3.45
120
0
80
150C MR044071
MID
FAST
CY7C1021BV33L-1
3.8V
150
0
80
150C MR044071
MID
FAST
CY7C1021BV33L-1
3.8V
150
0
420
150C MR044073
MID
FAST
CY7C1021B-15ZC
3.8V
150
0
420
150C MR044073
MID
FAST
CY7C1021B-15ZC
3.8V
150
0
80
150C MR051030
MID
FAST
CY7C1009B-15VC
3.8V
150
0
420
150C MR051030
MID
FAST
CY7C1009B-15VC
3.8V
150
0
80
150C MR051042
MID
FAST
CY7C1399B-12VC
3.8V
150
0
404
FAST
CY7C1399B-12VC
3.8V
150
5053
0
0
96
150C MR051042 MID
Summary for 'Technology' = R5 (36 detail records)
R7
MR044072
MID
SYNC
CY7C1372CV25-16
2.3V
200
0
80
125C MR043078
MID
MPWR
CY62147CV30LL-7
3.45
150
0
181
125C MR043078
MID
MPWR
CY62147CV30LL-7
3.45
150
0
819
2005 Q4 RELIABILITY REPORT
Page 24 of 48
Product Reliability
Cypress
Technology
Temp
Division
Family
125C MR044074
Eval Num
MID
FAST
125C MR051061
MID
125C MR051061
MID
150
MR043064
MID
150
MR051025
MID
150
SYNC
Device
Volt
SS Reject
Duration
CY7C1061AV33-10
2.45
150
0
179
CY7C1021CV33-12
2.3V
150
0
420
CY7C1021CV33-12
2.3V
150
0
80
CY7C1347F-133A
2.3V
150
0
80
CY7C1041CV33-10
2.3V
150
0
420
80
MR051025
MID
CY7C1041CV33-10
2.3V
150
0
150C MR044049
MID
FAST
CY7C1041CV33-12
2.3V
150
0
32
150C MR044049
MID
FAST
CY7C1041CV33-12
2.3V
150
0
420
150C MR044049
MID
FAST
CY7C1041CV33-12
2.3V
198
0
48
150C MR051025
MID
CY7C1041CV33-10
2.3V
150
0
80
150C MR051025
MID
CY7C1041CV33-10
2.3V
150
0
420
150C MR051062
MID
CY7C1021CV33-15
2.3V
150
0
420
150C MR051062
MID
CY7C1021CV33-15
2.3V
150
0
80
150C MR051067
MID
FAST
CY7C1021CV33-12
2.3V
150
0
80
150C MR052048
MID
FAST
CY7C1049CV33-10
2.3V
150
0
80
150C MR052049
MID
-
CY7C1021CV33-8
2.3V
150
0
411
150C MR052049
MID
-
CY7C1021CV33-8
2.3V
150
0
89
150C MR052050
MID
CY7C1021CV33-8
2.3V
150
0
411
150C MR052050
MID
CY7C1021CV33-8
2.3V
150
0
89
150C MR053025
MID
FAST
CY7C1021CV33-15
2.3V
150
0
80
150C MR053025
MID
FAST
CY7C1021CV33-15
2.3V
150
0
420
150C MR053026
MID
FAST
CY7C1021CV33-15
2.3V
150
0
420
FAST
CY7C1021CV33-15
2.3V
150
3998
0
0
80
150C MR053026 MID
Summary for 'Technology' = R7 (26 detail records)
FA Results
R8
125
MR043074
MID
MPWR
CY62157DV30L-45
2.4V
150
0
808
125
MR043074
MID
MPWR
CY62157DV30L-45
2.4V
150
0
192
125
MR043074
MID
MPWR
CY62157DV30L-45
2.4V
150
0
168
125
MR043074
MID
MPWR
CY62157DV30L-45
2.4V
150
0
832
125
MR051080
MID
-
CY62157DV30LL-7
2.4V
150
0
168
125C MR051032
MID
MPWR
CY62147DV30LL-5
2.4V
150
0
832
125C MR051032
MID
MPWR
CY62147DV30LL-5
2.4V
150
0
168
125C MR051044
MID
MPWR
CY62146DV30LL-7
2.4V
150
0
168
150
MR051077
MID
-
CY62128DV30LL-7
2.4V
150
0
420
150
MR051077
MID
-
CY62128DV30LL-7
2.4V
150
0
80
MPWR
CY62128DV30LL-5
2.4V
148
1648
0
0
420
150C MR052028 MID
Summary for 'Technology' = R8 (11 detail records)
R9
125C MR052056
MID
SYNC
CY7C1347G-133AX
2.3V
146
0
408
125C MR052058
MID
SYNC
CY7C1347G-133AX
2.45
147
0
420
150C 051103
MID
SYNC
7C1460BC-RAZCB
2.25
272
0
332
150C 051103
MID
SYNC
7C1460BC-RAZCB
2.25
437
0
332
150C 051103
MID
SYNC
7C1460BC-RAZCB
2.25
442
0
168
150C 051103
MID
SYNC
7C1460BC-RAZCB
2.25
400
0
168
150C 051103
MID
SYNC
7C1460BC-RAZCB
2.25
398
0
332
150C 051103
MID
SYNC
7C1460BC-RAZCB
2.25
274
0
168
2005 Q4 RELIABILITY REPORT
Page 25 of 48
Product Reliability
Cypress
Technology
Temp
Division
Family
150C 052203
Eval Num
MID
SYNC
CY7C1370
150C 052607
MID
SYNC
CY7C1339G
150C 054302
MID
MPWR
CY62147
150C 054302
MID
MPWR
CY62147EV30*
150C 054302
MID
MPWR
150C 054302
MID
150C 054302
MID
150C 054801
MID
Summary for 'Technology' = R9 (16 detail records)
Device
Volt
2.25
SS Reject
Duration
948
0
500
50
0
408
1.85
400
0
420
1.85
400
0
80
CY62147EV30*
1.85
400
0
80
MPWR
CY62147
1.85
400
0
80
MPWR
CY62147EV30*
1.85
400
0
420
SYNC
CY7C1470V33
2.25
394
5908
0
0
80
FA Results
S4
CCD
CMS
CY8C27443-24PVX
5.5V
150
0
168
125C 052004
125
MR043075
CCD
PSOC
CY8C21234-24SXI
5.5V
235
0
630
125C 052004
CCD
PSOC
CY8C21234-24SXI
5.5V
235
0
120
125C 052004
CCD
PSOC
CY8C21234-24SXI
5.5V
235
0
630
125C 052004
CCD
PSOC
CY8C21234-24SXI
5.5V
235
0
120
125C 052004
CCD
PSOC
CY8C21234-24SXI
5.5V
235
0
750
125C MR051040
CCD
PSOC
CY8C27443-24PXI
5.5V
185
0
168
125C MR051040
CCD
PSOC
CY8C27443-24PXI
5.5V
185
0
832
125C MR052042
CCD
-
CY22393ZXC-541
3.8V
150
0
402
125C MR052042
CCD
-
CY22393ZXC-541
3.8V
150
0
98
125C MR052082
CCD
PSOC
CY8C24223A-24PV
5.5V
143
0
168
125C MR052082
CCD
PSOC
CY8C24223A-24PV
5.5V
143
0
832
125C MR052083
CCD
PSOC
CY8C26443-24PVI
5.5V
149
0
168
125C MR053020
CCD
GPCLK
CY22392ZXI-353
2.3V
150
0
420
150
MR051076
CCD
-
CY22392ZC-366
3.8V
150
0
420
150
MR051076
CCD
-
CY22392ZC-366
3.8V
150
0
80
150C 042806
CCD
PTG
7C80330AT-MSZC
3.8V
130
0
80
150C 042806
CCD
PTG
7C80330AT-MSZC
3.8V
129
0
420
150C 050507
CCD
GPCLK
7C84980AT-TZZC
3.8V
120
0
420
GPCLK
7C84980AT-TZZC
3.8V
120
3379
0
0
80
150C 050507
CCD
Summary for 'Technology' = S4 (20 detail records)
STARM
110
MR044046
DCD
COM
CY7B923-400JC
5.75
150
0
72
110
COM
CY7B923-400JC
5.75
150
0
832
CY7B933-JC
6.5V
75
0
832
MR044046
DCD
125C MR051034
DCD
125C MR051034
DCD
COM
CY7B933-JC
6.5V
75
0
832
125C MR051034
DCD
COM
CY7B933-JC
6.5V
75
0
168
125C MR051034
DCD
CY7B933-JC
6.5V
75
0
168
125C MR052076
DCD
CY7B991-7JCT
6.6V
149
0
832
125C MR052076
DCD
125C MR054023
CCD
CY7B991-7JCT
6.6V
149
0
168
GPCLK
CY7B991-5JC
2.4V
200
0
168
125C MR054023 CCD
GPCLK
Summary for 'Technology' = STARM (10 detail records)
CY7B991-5JC
2.4V
200
1298
0
0
832
T013
125C 025107
DCD
NPS
7C71050AJ-GQFG
1.35
52
0
632
125C 025107
DCD
NPS
7C71050AJ-GQFG
1.35
165
0
168
125C 025107
DCD
NPS
7C71050AJ-GQFG
1.35
52
0
200
2005 Q4 RELIABILITY REPORT
Page 26 of 48
Product Reliability
Cypress
Technology
Temp
Division
Family
125C 025107
Eval Num
DCD
NPS
7C71050AJ-GQFG
1.38
23
0
168
125C 025107
DCD
NPS
7C71050BJ-GQFG
1.35
122
0
168
125C 025107
DCD
NPS
7C71050BJ-GQFG
1.35
119
0
832
125C 025107
DCD
NPS
7C71050AJ-GQFG
1.38
23
0
168
125C 025107
DCD
NPS
7C71050AJ-GQFG
1.35
52
0
168
125C 025107
DCD
NPS
7C71050AJ-GQFG
1.38
22
0
500
125C 034001
DCD
NPS
7C72250BJ-GQFG
1.38
46
0
168
125C 034001
DCD
NPS
7C72250BJ-GQFG
1.38
43
0
500
125C 041401
DCD
NPS
7C71050BJ-GQFG
1.35
20
0
168
125C 041401
DCD
NPS
7C71050BJ-GQFG
1.35
28
0
168
125C 041401
DCD
NPS
7C71050BJ-GQFG
1.35
20
0
632
125C 041401
DCD
NPS
7C71050BJ-GQFG
1.35
28
0
40
125C 041401
DCD
NPS
7C71050BJ-GQFG
1.35
20
0
200
125C 041401
DCD
NPS
7C71050BJ-GQFG
1.35
28
0
792
125C 044701
DCD
NPS
7C71050AJ-GQFG
1.35
66
0
476
NPS
7C71050AJ-GQFG
1.35
69
998
0
0
168
125C 034001
DCD
NPS
Summary for 'Technology' = TSMC 180 (1 detail record)
7C72250AJ-GQFG
1.8V
141
141
0
0
487
27720
0
125C 044701
DCD
Summary for 'Technology' = T013 (19 detail records)
Device
Volt
SS Reject
Duration
FA Results
TSMC 180
Grand Total
2005 Q4 RELIABILITY REPORT
Page 27 of 48
Product Reliability
Cypress
Summary Detail, Package -- HAST Performance
BldKit
Loc
EvalNum
A100RKGAB
R-CML
044603
A100SEGAGL
R-CML
MR053027
A100SFAGE
R-CML
A100SGAGE
A128SAGLL
Device
SS
Rej
CY7C1339B-133AI
44
0
CY7C9689A-AC
41
0
MR052002
CY7C0241-25AC
48
0
R-CML
MR044045
CS6247AS
48
0
R-CML
050801
CY7C1019CV33-15VC
39
0
A32AXGAGE
SI-SIGNETI
MR043085
CY29947AC
46
0
A52ASGAGE
Q-KOREA
MR044009
CY7B9973V-AC
FA
Results
TQFP
Summary for 'Family' = A (7 detail records)
50
0
316
0
TQFP (10x10)
AS64CGAGB
Q-KOREA
MR053050
CY7C4275V-15ASC
50
0
AS6513GAGB
G-TAIWAN
MR052089
CY7C4215V-15ASC
46
0
96
0
28
0
Summary for 'Family' = AS (2 detail records)
TQFP (Thermal)
AT120AHAGE
L-SEOL
041701
CYS25G0101DX-ATC
AT120AHAGE
L-SEOL
041701
CYS25G0101DX-ATC
Summary for 'Family' = AT (2 detail records)
3
0
31
0
TQFP (Pb-Free)
AZ100RIALL
R-CML
053103
CY7C1370
49
0
AZ100RSLL
AZ100RSLL
R-CML
R-CML
053103
053103
CY7C1360C
CY7C1470A
48
49
0
0
AZ100SEGL
R-CML
MR051024
CY8C29866-24AXI
46
0
AZ100SGAL
R-CML
053007
CY7C027V
49
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
Summary for 'Family' = AZ (6 detail records)
50
0
291
0
FBGA (0.75-0.8)
BA48AUALE
RA-CML
MR052085
CY7C1021BV33L-15BAI
12
0
BA48DCALE
G-TAIWAN
045109
CY7C1061AV33-10BGI
45
0
BA48DJALE
G-TAIWAN
045101
7C62172DC-GBAI
45
0
BA48DJALE
G-TAIWAN
052502
CY62177DV30L
45
0
147
0
Summary for 'Family' = BA (4 detail records)
PBGA (Cavity/Heatsink, Pb-Free)
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
11
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
39
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
20
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
28
0
98
0
Summary for 'Family' = BJ (4 detail records)
2005 Q4 RELIABILITY REPORT
Page 28 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
SS
Rej
FA
Results
FVBGA (0.75-0.8, 0.3mm)
BV48HAALE
G-TAIWAN
MR051014
CY62147CV33LL-70BVI
45
0
BV48VAALE
G-TAIWAN
MR052084
CY62137CV30LL-70BVIT
20
0
65
0
Summary for 'Family' = BV (2 detail records)
PLCC
J32RBGAGB
X-THALND
MR051031
CY7B991-2JC
50
0
J32RBGAGB
X-THALND
MR052018
CY7B991-5JC
50
0
J32RBGAGB
X-THALND
MR053042
CY7B991-5JI
50
0
J32RNGAGE
M-PHIL
MR053031
CY7C4271V-25JC
50
0
J52SFGAGB
M-PHIL
MR051036
CY7C136-25JC
50
0
250
0
Summary for 'Family' = J (5 detail records)
QFN (Punch Type)
LF56AGAGE
L-SEOL
MR044081
CY7C65640A-LFC
44
0
LF56AGAGE
L-SEOL
MR051075
CY7C65640A-LFC
43
0
LF56EGAGE
AC-ASE
054207
CY7C65640-LFC
45
0
132
0
Summary for 'Family' = LF (3 detail records)
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
47
0
LY56DGAGL
L-SEOL
MR051046
CP6241AM
45
0
LY56DGAGL
L-SEOL
MR053010
CY8C24794-24LFXI
49
0
LY56FGALL
RA-CML
050303
CY7C109B-20VCT
40
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
17
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
28
0
LY72AGAGL
L-SEOL
054206
CY28447LF-XC
48
0
274
0
Summary for 'Family' = LY (7 detail records)
SSOP
O2023GAGB
T-TAIWAN
MR044062
CY8C26233-24PVI
49
0
O2824GAGB
O5615GAGB
T-TAIWAN
T-TAIWAN
MR043059
MR053016
CY28400OC
CY28419OC
49
26
0
0
O563AXAGB
R-CML
MR053029
CY28346OC
32
0
O563BXAGE
R-CML
MR051021
CP6221BM
Summary for 'Family' = O (5 detail records)
40
0
196
0
PDIP
P203CGAGB
O-INDNS
MR053013
CY7C168A-35PC
45
0
P243FGAGE
M-PHIL
MR052025
CY7C194-25PC
46
0
P2839GAGB
X-THALND
MR052061
CY7C466A-10PTC
50
0
P283EGAGE
O-INDNS
MR051001
CY8C26443-24PI
44
0
P286EGAGB
O-INDNS
MR054044
CY62256LL-70PC
Summary for 'Family' = P (5 detail records)
50
0
235
0
PDIP (Pb-Free)
PZ183AAGN
O-INDNS
MR052015
CY7C63231A-PXC
44
0
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
48
0
2005 Q4 RELIABILITY REPORT
Page 29 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
PZ2831GAN
O-INDNS
MR053014
Device
CY7C64013A-PXC
Summary for 'Family' = PZ (3 detail records)
SS
Rej
45
0
137
0
FA
Results
SOIC (GullWing)
S0815PAGN
RA-CML
MR044055
CY2410SC-1
42
0
S0815PAGN
RA-CML
MR051018
CY2305SC-1H
46
0
S1615DAAGB
M-PHIL
MR051027
CY2292F
48
0
S1615EAGB
M-PHIL
MR052037
CY2309SC-1H
48
0
S1615EAGB
M-PHIL
MR053002
CY2309SC-1H
41
0
S183CGAGN
RA-CML
NR051009
CY7C63723-SC
49
S24314AGL
RA-CML
MR044028
S283HGAGB
O-INDNS
MR052073
CY7B933-SC
50
0
S283HGAGB
O-INDNS
MR053043
CY8C24423-24SI
50
0
S324513GN
R-CML
MR052036
CY62128BLL-70SC
50
0
S324513GN
R-CML
MR053003
CY6525AM
50
0
S324513GN
R-CML
MR054036
CY62128BLL-55SC
45
0
569
0
CP6124AM
Summary for 'Family' = S (12 detail records)
50
0
0
SOIC (GullWing, 450 footprint)
SN2831AHB
R-CML
MR044008
CY62256LL-70SNC
45
0
SN2831AHN
R-CML
MR051008
CY62256LL-70SNC
50
0
SN2831AHN
R-CML
MR052013
CY62256L-70SNC
50
0
SN2831AHN
R-CML
MR053037
CY62256L-70SNC
Summary for 'Family' = SN (4 detail records)
46
0
191
0
SSOP (Pb-Free)
SP2824CAN
T-TAIWAN
053005
CY28400OXC
48
0
SP483FAGN
RA-CML
MR044007
CY28405OXC
44
0
SP563AAGN
R-CML
MR053021
CY28410OXC
13
0
SP563AAGN
R-CML
MR053021
CY28410OXC
35
0
SP563BAGL
R-CML
042101
CY7C68300B-56PVXC
50
0
SP563BAGL
R-CML
042101
CY7C68300B-56PVXC
50
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
Summary for 'Family' = SP (7 detail records)
50
0
290
0
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN
R-CML
MR044002
CY62256LL-70SNXC
50
0
SY2831AHN
R-CML
MR052010
CY62256L-70SNXC
49
0
SY2831AHN
R-CML
MR053036
CY62256LL-70SNXI
45
0
SY2831AHN
R-CML
053407
CY62256LL
52
0
SY2831AHN
R-CML
053407
CY62256LL
45
0
SY2831AHN
R-CML
053407
CY62256LL
33
0
SY2831AHN
R-CML
053407
CY62256LL
85
0
SY2831AHN
R-CML
053407
CY62256LL
32
0
391
0
Summary for 'Family' = SY (8 detail records)
2005 Q4 RELIABILITY REPORT
Page 30 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
SS
Rej
FA
Results
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
44
0
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
44
0
SZ1615EGN
M-PHIL
MR051029
CY2308SXC-1H
48
0
SZ1615EGN
M-PHIL
MR052046
CY2309SXC-1H
47
0
SZ1615KGN
RA-CML
MR051016
CY2309SXC-1H
47
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
50
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
49
0
SZ28327GL
R-CML
054604
CY7C65113C-SXC
49
0
SZ324510GL
R-CML
MR051022
CY62128BLL-70SXI
50
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70SXI
25
0
453
0
Summary for 'Family' = SZ (10 detail records)
SOIC (J lead)
V284CGAGB
O-INDNS
MR043030
CY7C107B-20VC
45
0
V28CGAGB
V3233GALN
O-INDNS
R-CML
MR044064
054809
CY7C106B-20VC
CY7C188
50
48
0
0
V32419GLL
R-CML
MR043012
CY7C1019CV33-10VC
50
0
V324EGAGB
O-INDNS
MR052014
CY7C1019B-10VC
44
0
V324FGAGB
O-INDNS
MR053015
CY7C109B-20VC
44
0
V3646GALE
R-CML
MR043065
CY7C1049CV33-12VC
49
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
19
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
24
0
V444WGALL
R-CML
MR052019
CY7C1021B-12VI
50
0
V444YAALE
R-CML
MR051015
CY7C1041CV33-12VC
49
0
V444ZGALL
R-CML
MR053004
CY7C1021CV33
50
0
V444ZGALL
R-CML
MR054001
CY7C1021CV33-15VC
45
0
567
0
Summary for 'Family' = V (13 detail records)
SOIC (J lead, Pb-Free)
VZ243GGBLL
O-INDNS
052801
CY7C197
50
0
VZ243GGBLL
O-INDNS
052801
CY7C197
50
0
VZ32418LL
R-CML
054008
CY7C109B
45
0
VZ3644GALL
R-CML
MR053038
CY7C1049B-20VXI
46
0
VZ444WAGL
R-CML
MR052001
CY7C1021B-15VXC
50
0
VZ444ZAGL
R-CML
MR043067
CY7C1021CV33-12VXC
50
0
291
0
Summary for 'Family' = VZ (6 detail records)
TSOP/ TSSOP
Z1613GAGB
T-TAIWAN
MR051011
CY2309ZI-1H
45
0
Z1613GAGB
T-TAIWAN
MR052039
CY2308ZC-1H
45
0
Z1619GAGN
Z1619GAGN
RA-CML
R-CML
MR052027
MR054006
CY22392ZC-366
CY2308ZC-1H
47
50
0
0
Z4824BGAN
R-CML
MR043087
CY28339ZC
50
0
Z5624BAGN
R-CML
MR043004
CY28409ZC
22
0
Z5624BAGN
R-CML
MR044015
CY28346ZC
45
0
Z5624BAGN
R-CML
MR051050
CY28346ZI-2T
49
0
2005 Q4 RELIABILITY REPORT
Page 31 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
SS
Rej
Z5624BAGN
R-CML
MR052012
Device
CY28409ZC
48
0
Z5624BAGN
R-CML
MR053046
CY28409ZC
48
0
449
0
Summary for 'Family' = Z (10 detail records)
FA
Results
TSOP I
ZA32RHAALB
R-CML
MR051012
CY62128DV30LL-55ZAI
50
0
ZA32RHAALB
R-CML
MR052020
CY62128DV30LL-55ZAI
48
0
ZA32RHAALB
R-CML
MR053056
CY62128DV30LL-55ZAI
Summary for 'Family' = ZA (3 detail records)
46
0
144
0
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
CY62256LL-70ZRI
30
0
ZR28R2AGN
R-CML
MR053049
CY62256LL-70ZRI
39
0
69
0
Summary for 'Family' = ZR (2 detail records)
TSOP II
ZS324CA3E
T-TAIWAN
MR044070
CY7C1019B-12ZC
44
0
ZS324FAGE
T-TAIWAN
MR051037
CY7C1019CV33-12ZC
50
0
ZS324FAGE
T-TAIWAN
MR052009
CY7C1019CV33-12ZC
48
0
ZS324FAGE
T-TAIWAN
MR053055
CY7C1019CV33-12ZC
48
0
ZS444ABALE
R-CML
MR053058
CS6125AT
44
ZS444ABALL
R-CML
MR051010
ZS444AJALN
R-CML
MR054008
CY7C1021CV33-15ZC
45
0
ZS444YAGL
R-CML
053007
CY7C1041B-15ZC
50
0
ZS544AALE
G-TAIWAN
MR044031
CY7C1069AV33-12ZC
CY7C1021CV33-15ZC
Summary for 'Family' = ZS (9 detail records)
45
0
0
32
0
406
0
TSOP (Pb-Free)
ZT32RKGGL
T-TAIWAN
MR052044
CY7C109B-15ZXC
48
0
ZT32RYAGL
T-TAIWAN
MR051079
CY2308SC-1
49
0
97
0
Summary for 'Family' = ZT (2 detail records)
TSOP II (Pb-Free)
ZW444ADALL
R-CML
MR052003
CY7C1041CV33-15ZXC
45
0
ZW444AFLL
R-CML
054302
CY62137EV30*
45
0
ZW444AFLL
R-CML
054302
CY62147EV30*
45
0
ZW444NAGN
R-CML
MR051047
CY62126DV30LL-55ZXI
45
0
ZW444RAGN
R-CML
053102
CY62137VLL-ZSXE
49
0
ZW444VAGL
R-CML
MR053033
CY7C1021B-15ZXI
47
0
ZW444VAGL
R-CML
MR054003
CY7C1021B-15ZXC
50
0
ZW544AALL
G-TAIWAN
MR054015
CY7C1061AV33-12ZXC
Summary for 'Family' = ZW (8 detail records)
46
0
372
0
47
0
47
0
TSOP (Reverse, Pb-Free)
ZY28R2AGN
R-CML
Summary for 'Family' = ZY (1 detail record)
2005 Q4 RELIABILITY REPORT
MR053057
CY62256LL-70ZRXI
Page 32 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
ZZ0812AGL
T-TAIWAN
MR043048
ZZ1613GAN
T-TAIWAN
MR052077
ZZ2411AGN
T-TAIWAN
ZZ2411AGN
ZZ2415GAL
Device
SS
Rej
CY25104ZXC-2
44
0
CY2309ZXI-1H
48
0
MR043066
CY22313ZXC
50
0
T-TAIWAN
MR051051
CY22313ZXC
49
0
RA-CML
MR051028
CY22313ZXC
50
0
ZZ2415GAL
RA-CML
MR052006
CY22313ZXC
49
0
ZZ2415GAL
RA-CML
MR052038
CY22313ZXC
48
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
48
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
41
0
ZZ5624BGN
R-CML
MR053047
CY28442ZXCT
FA
Results
TSSOP (Pb-Free)
47
0
Summary for 'Family' = ZZ (10 detail records)
474
0
Grand Total
7078
2005 Q4 RELIABILITY REPORT
0
Page 33 of 48
Product Reliability
Cypress
Summary Detail, Package -- PCT Performance
BldKit
TQFP
A100AGAGE
A100RKGAB
Loc
EvalNum
Device
Readout
G-TAIWAN
NR053003
7C0283BC-GACB
168
50
0
R-CML
044603
CY7C1339B-133AI
168
65
0
A100SFAGE
R-CML
MR052002
CY7C0241-25AC
168
50
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15VC
168
44
0
A144GGAGE
G-TAIWAN
MR051009
CY7C057V-12AC
168
50
0
A144GGAGE
G-TAIWAN
MR052033
CY7C057V-15AI
168
50
0
A52AEGAGE
Q-KOREA
MR052004
CY29972AI
176
50
0
A52ASGAGE
Q-KOREA
MR051035
CY7B9973V-AC
168
50
0
A52CXGAGE
S-AMT
MR044057
CY29774AI
168
50
0
A52CXGAGE
SI-SIGNETI
MR051017
CY29773AIT
168
50
0
A64FXGAGE
G-TAIWAN
MR054058
CY7C144AV-25AC
168
45
0
554
0
Summary for 'Family' = TQFP (11 detail records)
SS
Rejects
TQFP (10x10)
AS64CGAGB
Q-KOREA
MR053050
CY7C4275V-15ASC
168
50
0
AS6513GAGB
G-TAIWAN
MR052089
CY7C4215V-15ASC
168
50
0
100
0
Summary for 'Family' = TQFP (10x10) (2 detail records)
TQFP (Thermal)
AT120AAAGE
L-SEOL
MR052023
CYS25G0101DX-ATC
168
50
0
AT120AGAGE
L-SEOL
MR044077
CYS25G0101DX-ATC
168
45
0
AT120AGAGE
L-SEOL
MR051082
CYS25G0101DX-ATC
168
50
0
AT120AHAGE
L-SEOL
041701
CYS25G0101DX-ATC
Summary for 'Family' = TQFP (Thermal) (4 detail records)
176
50
195
0
0
TQFP (Pb-Free)
AZ100RIALL
R-CML
053103
CY7C1370
168
50
0
AZ100RRLL
051702
CY7C1470V33
168
50
0
AZ100RRLL
051006
CY7C1470
168
50
0
AZ100RSLL
R-CML
053103
CY7C1360C
168
50
0
AZ100RSLL
R-CML
053103
CY7C1360C
168
49
0
AZ100SEGL
R-CML
MR051024
CY8C29866-24AXI
176
48
0
AZ100SGAL
R-CML
053007
CY7C027V
168
50
0
AZ100SGAL
R-CML
053007
CY7C027V
168
50
0
AZ100SGAL
R-CML
053007
CY7C027V
168
59
0
AZ100SGAL
R-CML
053007
CY7C038V
168
347
0
AZ100SGAL
R-CML
053007
CY7C027V
168
60
0
AZ100SGAL
R-CML
053007
CY7C038V
168
315
0
AZ144GGAL
G-TAIWAN
MR052074
CY7C056V-12AXC
168
49
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
168
50
0
1277
0
Summary for 'Family' = TQFP (Pb-Free) (14 detail records)
FBGA (0.75-0.8)
BA48AUALE
RA-CML
MR052085
CY7C1021BV33L-15B
176
23
0
BA48BVALE
G-TAIWAN
MR053008
CY62137CVSL-70BAI
168
42
0
BA48DCALE
G-TAIWAN
045109
CY7C1061AV33-10BG
168
50
0
BA48DDALE
RA-CML
053101
CY512K6C9A-70BAI
176
50
0
BA48HVALE
RA-CML
MR051066
CS5854AT
168
50
0
215
0
Summary for 'Family' = FBGA (0.75-0.8) (5 detail records)
2005 Q4 RELIABILITY REPORT
FA Results
Page 34 of 48
Product Reliability
Cypress
BldKit
FBGA (1.0)
BB100EAGE
Loc
EvalNum
Device
Readout
G-TAIWAN
MR052032
CYP15G0101DXB-BBI
168
49
0
BB165GALE
G-TAIWAN
045107
7R1371CC-GBBCB
168
49
0
BB172AAGE
G-TAIWAN
MR051007
CY7C057V-15BBI
168
48
0
146
0
Summary for 'Family' = FBGA (1.0) (3 detail records)
SS
Rejects
PBGA (1.27)
BG119MALE
G-TAIWAN
MR043086
CY7C1373CV25-100B
168
50
0
BG272AAGE
G-TAIWAN
MR052034
CY7C0430BV-100BGI
168
44
0
BG282BAGE
G-TAIWAN
MR052005
CY37512P256-83BGC
168
46
0
140
0
47
0
47
0
Summary for 'Family' = PBGA (1.27) (3 detail records)
PBGA (Heat Spreader)
BH388AAGE
G-TAIWAN
MR043082
CYNSE70128-66BGC
168
Summary for 'Family' = PBGA (Heat Spreader) (1 detail record)
PBGA (Cavity/Heatsink, Pb-Free)
BJ256L2GL
G-TAIWAN
044507
CY28323BPVC
168
45
0
BJ256L2GL
044507
CY28323BPVC
168
50
0
95
0
50
0
50
0
G-TAIWAN
Summary for 'Family' = PBGA (Cavity/Heatsink, Pb-Free) (2 detail
FBGA (0.75-0.8, Pb-Free)
BK48CDALL
T-TAIWAN
053702
CY7C1041CV33-20BA
168
Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
PBGA (Cavity/Heatsink)
BL256L2GE
G-TAIWAN
MR051006
CYP15G0401DXB-BGI
176
19
0
BL256L2GE
BL256L2GE
MR051006
MR054018
CYP15G0401DXB-BGI
CYP15G0401DXB-BG
168
168
31
50
0
0
100
0
G-TAIWAN
G-TAIWAN
Summary for 'Family' = PBGA (Cavity/Heatsink) (3 detail records)
FVBGA (0.75-0.8, 0.3mm)
BV48BKALE
RA-CML
MR053023
CYK128K6C7BW-70B
176
49
0
BV48BLAGE
G-TAIWAN
MR053035
CYK256K16MCBU-70
168
49
0
BV48BTALN
RA-CML
054302
CY62147EV30*
168
50
0
BV48BTALN
RA-CML
054302
CY62147EV30*
168
50
0
BV48BTLAN
RA-CML
054302
CY62147EV30*
168
50
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
168
76
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
168
77
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
168
50
0
BV48HAALE
G-TAIWAN
MR051014
CY62147CV33LL-70B
176
50
0
501
0
Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (9 detail records)
FBGA (1.0, Pb-Free)
BW100EAGL
G-TAIWAN
MR051023
CYP15G0101DXB-BB
168
48
0
BW484SDLL
050309
CY22313ZXCT
176
47
0
95
0
G-TAIWAN
Summary for 'Family' = FBGA (1.0, Pb-Free) (2 detail records)
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
050202
CY7C015V18-35AC
168
50
0
BZ48BKALE
MR052088
CYK128K16SCBU-55B
176
50
0
043306
CY62147
168
44
0
144
0
RA-CML
BZ48BTALN
Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (3 detail records)
2005 Q4 RELIABILITY REPORT
FA Results
Page 35 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
Readout
SS
Rejects
PLCC
J28SEGAGB
M-PHIL
MR054019
CY7B923-JC
168
50
0
J32RBGAGB
X-ALPHA
MR051031
CY7B991-2JC
168
50
0
J32RBGAGB
X-ALPHA
MR052018
CY7B991-5JC
168
50
0
J32RBGAGB
X-ALPHA
MR053042
CY7B991-5JI
168
50
0
J32RBGAGB
X-ALPHA
MR054059
CY7B9911-5JC
168
50
0
J32RNGAGE
M-PHIL
MR053031
CY7C4271V-25JC
168
50
0
J52SFGAGB
M-PHIL
MR051036
CY7C136-25JC
168
50
0
J68SCGAGB
X-ALPHA
MR054061
CY7C144-55JCT
168
50
0
J84SFGACB
M-PHIL
MR044035
CY7C346B-35JC
176
48
0
448
0
50
0
50
0
Summary for 'Family' = PLCC (9 detail records)
PLCC (Pb-Free)
JZ32RBGAN
M-PHIL
MR053028
CY7C419-15JXC
168
Summary for 'Family' = PLCC (Pb-Free) (1 detail record)
QFN (Punch Type)
LF56AGAGE
L-SEOL
MR044081
CY7C65640A-LFC
168
50
0
LF56AGAGE
L-SEOL
MR051075
CY7C65640A-LFC
176
50
0
LF56CGAGL
T-TAIWAN
MR044040
CY7C65640-LFC
168
50
0
LF56EGAGE
AC-ASE
054207
CY7C65640-LFC
176
50
0
200
0
Summary for 'Family' = QFN (Punch Type) (4 detail records)
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
168
50
0
LY56AGAGL
MR044065
CY7C68300A-56LFXC
176
50
0
044504
CY7C65630-56LFXC
168
45
0
L-SEOL
LY56AGAL
LY56DGAGL
LY56DGAGL
L-SEOL
L-SEOL
MR051046
MR053010
CP6241AM
CY8C24794-24LFXI
176
168
50
50
0
0
LY56FGALL
RA-CML
050302
CY7C65640-LFXC
168
50
0
LY56FGALL
RA-CML
050302
CY7C65640-LFXC
168
50
0
LY56FGALL
RA-CML
053008
CY7C65640-LFXC
168
50
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
168
50
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
168
50
0
LY56FGALL
RA-CML
050303
CY7C109B-20VCT
168
50
0
LY56FGALL
RA-CML
NR051005
CY7C65640-LFXC
168
50
0
LY72AGAGL
L-SEOL
054206
CY28447LF-XC
168
50
0
645
0
Summary for 'Family' = QFN (Punch Type, Pb-Free) (13 detail records)
PQFP
N52DXGAGB
G-TAIWAN
MR051005
CY7C136-55NC
168
50
0
N52DXGAGB
G-TAIWAN
MR052031
CY7C136-55NC
168
47
0
N52DXGAGB
G-TAIWAN
MR054060
CY7C131-55NC
168
50
0
147
0
Summary for 'Family' = PQFP (3 detail records)
SSOP
O2024GAGE
M-PHIL
MR052007
CY2DP314OI
168
48
0
O2024GAGE
M-PHIL
MR053001
CY2DP3140I
168
50
0
O2028GAGE
T-TAIWAN
MR044066
CY2CC810OI
176
50
0
O2824GAGB
T-TAIWAN
MR051038
CY28508OC
168
50
0
O2824GAGB
T-TAIWAN
MR052035
CY28352OC
168
50
0
O5615GAGB
T-TAIWAN
MR053016
CY28419OC
168
50
0
O563AXAGB
R-CML
MR053029
CY28346OC
168
50
0
2005 Q4 RELIABILITY REPORT
FA Results
Page 36 of 48
Product Reliability
Cypress
BldKit
O563AXAGN
O563BXAGE
Loc
R-CML
R-CML
EvalNum
Device
MR052017
MR051021
CY28419OC
CP6221BM
Readout
168
168
Summary for 'Family' = SSOP (9 detail records)
SS
Rejects
40
50
0
0
438
0
PDIP
P203CGAGB
O-INDNS
MR053013
CY7C168A-35PC
168
45
0
P2406AAGN
O-INDNS
043805
CY7C63913-PXC
168
45
0
P243FGAGE
M-PHIL
MR052025
CY7C194-25PC
168
50
0
P2839GAGB
X-ALPHA
MR052061
CY7C466A-10PTC
168
50
0
P283EGAGE
O-INDNS
MR051001
CY8C26443-24PI
168
45
0
235
0
Summary for 'Family' = PDIP (5 detail records)
PDIP (Pb-Free)
PZ06AAGN
O-INDNS
054604
CY7C63413
168
50
0
PZ183AAGN
O-INDNS
MR051004
CY7C63231A-PXC
168
45
0
PZ183AAGN
O-INDNS
MR052015
CY7C63231A-PXC
168
45
0
PZ243AAGN
X-ALPHA
051206
CY7C63743-PXC
168
50
0
PZ2831GAN
O-INDNS
MR053014
CY7C64013A-PXC
168
45
0
235
0
Summary for 'Family' = PDIP (Pb-Free) (5 detail records)
SOIC (GullWing)
S0815PAGN
RA-CML
MR044055
CY2410SC-1
176
48
0
S0815PAGN
RA-CML
MR051018
CY2305SC-1H
168
50
0
S1615DAAGB
M-PHIL
MR051027
CY2292F
168
50
0
S1615EAGB
M-PHIL
MR053002
CY2309SC-1H
168
50
0
S283HGAGB
O-INDNS
MR051003
CY2314ANZSC-1
168
45
0
S283HGAGB
O-INDNS
MR052073
CY7B933-SC
168
49
0
S283HGAGB
S324513GB
O-INDNS
R-CML
MR053043
MR051078
CY8C24423-24SI
CY62128BLL-70SI
168
168
50
50
0
0
S324513GN
R-CML
MR053003
CY6525AM
168
50
0
S324513GN
R-CML
MR054036
CY62128BLL-55SC
168
Summary for 'Family' = SOIC (GullWing) (10 detail records)
45
0
487
0
SOIC (GullWing, 450 footprint)
SN2831AHN
R-CML
MR051008
CY62256LL-70SNC
168
50
0
SN2831AHN
R-CML
MR052013
CY62256L-70SNC
168
50
0
SN2831AHN
R-CML
MR053037
CY62256L-70SNC
168
Summary for 'Family' = SOIC (GullWing, 450 footprint) (3 detail records)
50
0
150
0
SSOP (Pb-Free)
SP2023GAL
T-TAIWAN
042501
CY8C21323-24PVXI
168
50
0
SP28214GL
T-TAIWAN
052004
CY8C21234-24SXI
168
45
0
SP2824CAN
T-TAIWAN
053005
CY28400OXC
176
50
0
SP2824GAN
T-TAIWAN
MR044076
CY28353OXC-2
168
50
0
SP2824GAN
T-TAIWAN
MR052008
CY28508OXC
176
50
0
SP563AAGN
R-CML
MR051019
CY28410OXC
168
50
0
SP563AAGN
R-CML
MR052040
CY28410OXC
168
50
0
SP563AAGN
R-CML
MR053021
CY28410OXC
168
50
0
SP563BAGL
R-CML
042101
CY7C68300B-56PVXC
176
63
0
SP563BAGL
R-CML
042101
CY7C68300B-56PVXC
176
65
0
SP563BAGL
R-CML
042101
CY7C68300B-56PVXC
176
57
0
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
168
50
0
630
0
Summary for 'Family' = SSOP (Pb-Free) (12 detail records)
2005 Q4 RELIABILITY REPORT
FA Results
Page 37 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
Readout
SS
Rejects
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN
R-CML
MR052010
CY62256L-70SNXC
168
50
0
SY2831AHN
R-CML
MR053036
CY62256LL-70SNXI
168
50
0
SY2831AHN
R-CML
053407
CY62256LL
168
90
0
SY2831AHN
R-CML
053407
CY62256LL
168
90
0
280
0
Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (4 detail
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
168
45
0
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
168
45
0
SZ1615EGN
M-PHIL
MR051029
CY2308SXC-1H
168
50
0
SZ1615EGN
M-PHIL
MR052046
CY2309SXC-1H
168
50
0
SZ1615KGN
RA-CML
MR051016
CY2309SXC-1H
168
50
0
SZ24315GN
RA-CML
054501
CY7C63743
168
50
0
SZ24315GN
RA-CML
MR053032
CY7C63743-SXC
168
50
0
SZ28327GL
R-CML
054604
CY7C64013C-SXC
168
50
0
SZ28327GL
R-CML
054604
CY7C65113C-SXC
168
50
0
SZ324510GL
R-CML
MR051022
CY62128BLL-70SXI
168
50
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70S
176
45
0
535
0
Summary for 'Family' = SOIC (GullWing, Pb-Free) (11 detail records)
SOIC (J lead)
V28CGAGB
O-INDNS
MR044064
CY7C106B-20VC
168
50
0
V3233GALN
R-CML
054502
CY7C188
168
50
0
V3233GALN
R-CML
054809
CY7C188
168
50
0
V324EGAGB
O-INDNS
MR051002
CY7C1019B-12VC
168
45
0
V324EGAGB
V324FGAGB
O-INDNS
O-INDNS
MR052014
MR053015
CY7C1019B-10VC
CY7C109B-20VC
168
168
45
45
0
0
V444WGALL
R-CML
MR052019
CY7C1021B-12VI
168
50
0
V444YAALE
R-CML
MR051015
CY7C1041CV33-12VC
168
50
0
V444ZGALL
R-CML
MR053004
CY7C1021CV33
168
50
0
435
0
Summary for 'Family' = SOIC (J lead) (9 detail records)
SOIC (J lead, Pb-Free)
VZ243GGBLL
O-INDNS
052801
CY7C197
168
50
0
VZ32418LL
R-CML
054008
CY7C109B
168
50
0
VZ3644GALL
R-CML
MR053038
CY7C1049B-20VXI
168
46
0
VZ444WAGL
R-CML
MR052001
CY7C1021B-15VXC
168
50
0
VZ444ZALL
R-CML
MR053005
CY7C1021CV33-8VXC
168
Summary for 'Family' = SOIC (J lead, Pb-Free) (5 detail records)
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
168
Summary for 'Family' = CERDIP (Windowed) (1 detail record)
49
0
245
0
50
0
50
0
TSOP/ TSSOP
Z1613GAGB
T-TAIWAN
MR051011
CY2309ZI-1H
168
45
0
Z1613GAGB
T-TAIWAN
MR052039
CY2308ZC-1H
168
46
0
Z1619GAGN
RA-CML
MR052027
CY22392ZC-366
168
50
0
Z1619GAGN
RA-CML
MR053059
CY26049ZC-36
168
48
0
2005 Q4 RELIABILITY REPORT
FA Results
Page 38 of 48
Product Reliability
Cypress
EvalNum
Device
Z32RKGBGE
BldKit
T-TAIWAN
Loc
MR054005
CY7C109B-12ZC
Readout
176
50
0
Z5624BAGN
R-CML
MR051050
CY28346ZI-2T
168
50
0
Z5624BAGN
R-CML
MR052012
CY28409ZC
168
50
0
Z5624BAGN
Z5624BAGN
R-CML
R-CML
MR053046
044903
CY28409ZC
CY28346ZC-2
168
176
50
50
0
0
439
0
Summary for 'Family' = TSOP/ TSSOP (9 detail records)
SS
Rejects
TSOP I
ZA32RHAALB
R-CML
MR051012
CY62128DV30LL-55Z
168
50
0
ZA32RHAALB
R-CML
MR052020
CY62128DV30LL-55Z
168
50
0
ZA32RHAALB
R-CML
MR053056
CY62128DV30LL-55Z
168
50
0
150
0
Summary for 'Family' = TSOP I (3 detail records)
TSOP (Reverse)
ZR28R2AGN
R-CML
MR051013
CY62256LL-70ZRI
168
50
0
ZR28R2AGN
R-CML
MR053049
CY62256LL-70ZRI
168
45
0
95
0
Summary for 'Family' = TSOP (Reverse) (2 detail records)
TSOP II
ZS324CA3E
T-TAIWAN
MR044070
CY7C1019B-12ZC
176
44
0
ZS324FAGE
T-TAIWAN
MR051037
CY7C1019CV33-12ZC
168
50
0
ZS324FAGE
T-TAIWAN
MR052009
CY7C1019CV33-12ZC
168
50
0
ZS324FAGE
T-TAIWAN
MR053055
CY7C1019CV33-12ZC
168
50
0
ZS444ABALE
R-CML
MR053058
CS6125AT
168
50
0
ZS444ABALL
R-CML
MR051010
CY7C1021CV33-15ZC
168
50
0
ZS444AJALN
R-CML
MR054008
CY7C1021CV33-15ZC
168
49
0
ZS444AKALN
R-CML
MR052022
CY7C1041CV33-15ZC
168
50
0
ZS444YAGL
R-CML
053007
CY7C1041B-15ZC
168
60
0
453
0
Summary for 'Family' = TSOP II (9 detail records)
TSOP (Pb-Free)
ZT32RKGGL
T-TAIWAN
MR052044
CY7C109B-15ZXC
168
49
0
ZT32RKGGL
T-TAIWAN
MR054050
CY7C109B-15ZXC
168
50
0
99
0
Summary for 'Family' = TSOP (Pb-Free) (2 detail records)
TSOP II (Pb-Free)
ZW444ADALL
R-CML
MR052003
CY7C1041CV33-15ZX
176
49
0
ZW444NAGN
R-CML
MR051047
CY62126DV30LL-55Z
168
50
0
ZW444VAGL
R-CML
MR053033
CY7C1021B-15ZXI
168
50
0
ZW444VAGL
R-CML
MR054003
CY7C1021B-15ZXC
168
50
0
199
0
50
0
50
0
Summary for 'Family' = TSOP II (Pb-Free) (4 detail records)
TSOP (Reverse, Pb-Free)
ZY28R2AGN
R-CML
MR053057
CY62256LL-70ZRXI
168
Summary for 'Family' = TSOP (Reverse, Pb-Free) (1 detail record)
TSSOP (Pb-Free)
ZZ1613GAN
T-TAIWAN
MR052077
CY2309ZXI-1H
168
50
0
ZZ2411AGN
T-TAIWAN
MR051020
CY7C68300A-56LFXC
168
45
0
ZZ2411AGN
T-TAIWAN
MR051051
CY22313ZXC
168
50
0
ZZ2415GAL
RA-CML
MR051028
CY22313ZXC
168
50
0
ZZ2415GAL
RA-CML
MR052006
CY22313ZXC
168
50
0
ZZ2415GAL
RA-CML
MR052038
CY22313ZXC
168
50
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
168
49
0
ZZ2817AGL
RA-CML
051903
CY221R28-ZXC
168
50
0
2005 Q4 RELIABILITY REPORT
FA Results
Page 39 of 48
Product Reliability
Cypress
EvalNum
Device
ZZ5624BGN
BldKit
R-CML
Loc
MR044054
CY28411ZXC
Readout
176
SS
48
Rejects
0
ZZ5624BGN
R-CML
MR051026
CY28442ZXC
176
50
0
ZZ5624BGN
ZZ5624BGN
R-CML
R-CML
050504
050504
CY28411ZXCT
CY28411ZXCT
168
168
49
48
0
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
168
50
0
Summary for 'Family' = TSSOP (Pb-Free) (13 detail records)
639
0
Grand Total
10993
2005 Q4 RELIABILITY REPORT
FA Results
0
Page 40 of 48
Product Reliability
Cypress
Summary Detail, Package -- TC Performance
BldKit
Loc
EvalNum
Device
Readout
SS
Rejects
A100
R-CML
045002
C9TC
150C
-65C
300
30
0
A100
R-CML
045002
C9TC
150C
-65C
300
40
0
A100RKGAB
R-CML
MR044020
CY7C1329-100AC
150C
-65C
300
48
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
150C
-65C
300
45
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
150C
-65C
300
50
0
A100RKGAB
R-CML
044603
CY7C1339B-133AI
150C
-65C
300
50
0
A100SEGAGL
R-CML
MR053027
CY7C9689A-AC
150C
-65C
300
50
0
A100SFAGE
R-CML
MR052002
CY7C0241-25AC
150C
-65C
300
50
0
A100SGAGE
R-CML
MR044045
CS6247AS
150C
-65C
300
50
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15V
150C
-65C
300
45
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15V
150C
-65C
300
44
0
A128SAGLL
R-CML
050801
CY7C1019CV33-15V
150C
-65C
300
45
0
A144GGAGE
G-TAIWAN
MR051009
CY7C057V-12AC
150C
-65C
300
47
0
A144GGAGE
G-TAIWAN
MR052033
CY7C057V-15AI
150C
-65C
300
50
0
A52AEGAGE
Q-KOREA
MR052004
CY29972AI
150C
-65C
300
50
0
A52CXGAGE
S-AMT
MR044057
CY29774AI
150C
-65C
300
50
0
A52CXGAGE
SI-SIGNETI
MR051017
CY29773AIT
150C
-65C
300
43
0
CYS25G0101DX-AT
150C
-65C
300
50
837
0
0
AG120AGAL
L-SEOL
041701
CYS25G0101DX-AT
Summary for 'Family' = TQFP (Thermal, Pb-Free) (1 detail record)
150C
-65C
300
50
50
0
0
FA Results
TQFP
A64FXGAGE
G-TAIWAN
MR044078
Summary for 'Family' = TQFP (18 detail records)
TQFP (Thermal, Pb-Free)
TQFP (10x10)
AS64BGAGB
G-TAIWAN
MR044039
CY7C4245V-15ASC
150C
-65C
300
46
0
AS64CGAGB
Q-KOREA
MR044044
CY7C4265V-15ASC
150C
-65C
300
50
0
AS64CGAGB
Q-KOREA
MR053050
CY7C4275V-15ASC
150C
-65C
300
50
0
CY7C4215V-15ASC
150C
-65C
300
50
196
0
0
AS6513GAGB
G-TAIWAN
MR052089
Summary for 'Family' = TQFP (10x10) (4 detail records)
TQFP (Thermal)
AT120AAAGE
L-SEOL
MR052023
CYS25G0101DX-AT
150C
-65C
300
50
0
AT120AGAGE
L-SEOL
MR044077
CYS25G0101DX-AT
150C
-65C
300
45
0
AT120AGAGE
L-SEOL
MR051082
CYS25G0101DX-AT
-65C
300
49
0
AT120AHAGE
L-SEOL
041701
Summary for 'Family' = TQFP (Thermal) (4 detail records)
CYS25G0101DX-AT
150C
-65C
300
50
194
0
0
TQFP (Pb-Free)
AZ100RRLL
R-CML
051702
CY7C1470V33
150C
-65C
300
50
0
AZ100RRLL
R-CML
051702
CY7C1470V33
150C
-65C
300
50
0
AZ100RRLL
R-CML
051702
CY7C1470V33
150C
-65C
300
49
0
AZ100RRLL
R-CML
MR052096
CY7C1471V25-133A
150C
-65C
300
50
0
AZ100RSLL
R-CML
053103
CY7C1470A
150C
-65C
300
50
0
AZ100RSLL
R-CML
053103
CY7C1360C
150C
-65C
300
50
0
AZ100SGAL
R-CML
053007
CY7C027V
150C
-65C
300
60
0
AZ100SGAL
R-CML
053007
CY7C027V
150C
-65C
300
60
0
2005 Q4 RELIABILITY REPORT
Page 41 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
AZ144GGAL
G-TAIWAN
MR052074
CY7C056V-12AXC
150C
-65C
Readout
300
SS
49
Rejects
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
150C
-65C
300
50
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
150C
-65C
300
50
0
AZ52ASGAL
Q-KOREA
051902
CY7B9945V-5AXCT
Summary for 'Family' = TQFP (Pb-Free) (12 detail records)
150C
-65C
300
46
614
0
0
FA Results
FBGA (0.75-0.8)
BA48AUALE
RA-CML
MR052085
CY7C1021BV33L-15
150C
-65C
300
50
0
BA48AVALE
RA-CML
MR043061
CY62147CV30LL-70
150C
-65C
300
50
0
BA48BQAALE
RA-CML
MR044068
CY62137CV30LL-70
150C
-65C
300
47
0
BA48BVALE
G-TAIWAN
MR044025
CY62137CVSL-70BA
150C
-65C
300
40
0
BA48BVALE
G-TAIWAN
MR053008
CY62137CVSL-70BA
150C
-65C
300
49
0
BA48BWALE
G-TAIWAN
MR043025
CY7C1021CV33-15B
150C
-65C
300
48
0
BA48CRALE
T-TAIWAN
MR044056
CY62137CVSL-70BA
150C
-65C
300
48
0
BA48DJALE
G-TAIWAN
045101
7C62172DC-GBAI
150C
-65C
300
45
0
BA48DJALE
G-TAIWAN
052502
CY62177DV30L
150C
-65C
300
50
0
150C
-65C
300
49
476
0
0
CYP15G0101DXB-B
150C
-65C
300
50
0
CY7C057V-15BBI
150C
-65C
300
50
100
0
0
BA48HVALE
RA-CML
MR051066
CS5854AT
Summary for 'Family' = FBGA (0.75-0.8) (10 detail records)
FBGA (1.0)
BB100EAGE
G-TAIWAN
MR052032
BB172AAGE
G-TAIWAN
MR051007
Summary for 'Family' = FBGA (1.0) (2 detail records)
PBGA (1.27)
BG119
G-TAIWAN
052104
CY7C1072
150C
-65C
300
47
0
BG119
G-TAIWAN
052104
CY7C1072
150C
-65C
300
46
0
BG119MALE
G-TAIWAN
MR043086
CY7C1373CV25-100
150C
-65C
300
50
0
BG272AAGE
G-TAIWAN
MR052034
CY7C0430BV-100BG
150C
-65C
300
50
0
CY37512P256-83BG
150C
-65C
300
49
242
0
0
150C
-65C
300
50
50
0
0
BG282BAGE
G-TAIWAN
MR052005
Summary for 'Family' = PBGA (1.27) (5 detail records)
PBGA (Heat Spreader)
BH388AAGE
G-TAIWAN
MR043082
CYNSE70128-66BGC
Summary for 'Family' = PBGA (Heat Spreader) (1 detail record)
PBGA (Cavity/Heatsink,
BJ256L2GL
G-TAIWAN
044507
CY28323BPVC
150C
-65C
300
47
0
BJ256L2GL
G-TAIWAN
044507
CY28323BPVC
150C
-65C
300
50
0
BJ256L2GL
G-TAIWAN
044507
CY28323BPVC
150C
-65C
300
49
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
150C
-65C
300
49
0
BJ504AAGL
G-TAIWAN
044507
CY7C9536B-BLXC
Summary for 'Family' = PBGA (Cavity/Heatsink, Pb-Free) (5 detail records)
150C
-65C
300
50
245
0
0
150C
-65C
300
60
60
0
0
150C
-65C
300
50
0
150C
-65C
300
50
100
0
0
FBGA (0.75-0.8, Pb-Free)
BK48CDALL
T-TAIWAN
053702
CY7C1041CV33-20B
Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
PBGA (Cavity/Heatsink)
BL256L2GE
G-TAIWAN
MR051006
CYP15G0401DXB-B
BL3304ABGE
G-TAIWAN
MR043083
CYNSE70129A-125B
Summary for 'Family' = PBGA (Cavity/Heatsink) (2 detail records)
2005 Q4 RELIABILITY REPORT
Page 42 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
Readout
SS
Rejects
FA Results
FVBGA (0.75-0.8, 0.3mm)
BV48ATALE
RA-CML
MR044026
CY62157DV30L-45B
150C
-65C
300
46
0
BV48BEALE
G-TAIWAN
MR044030
CY62147DV30LL-70
150C
-65C
300
39
0
BV48BKALE
RA-CML
MR053023
CYK128K6C7BW-70
150C
-65C
300
45
0
BV48BNALE
G-TAIWAN
050301
C762167DV30LL-BVI
150C
-65C
300
50
0
BV48BNALE
G-TAIWAN
050301
C762167DV30LL-BVI
150C
-65C
300
50
0
BV48BNALE
G-TAIWAN
050301
C762167DV30LL-BVI
150C
-65C
300
48
0
BV48BTALN
RA-CML
054302
CY62147EV30*
150C
-65C
300
49
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
150C
-65C
300
49
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
150C
-65C
300
77
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
150C
-65C
300
27
0
BV48BZALL
RA-CML
051104
CYU01M6TF53CZ
150C
-65C
300
77
0
BV48HAALE
G-TAIWAN
MR051014
CY62147CV33LL-70
150C
-65C
300
50
0
BV48NAALE
RA-CML
042801
7R62357DC-RABVI
150C
-65C
300
45
0
150C
-65C
300
50
702
0
0
150C
-65C
300
50
50
0
0
BV48VAALE
G-TAIWAN
MR052084
CY62137CV30LL-70
Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (14 detail records)
FBGA (1.0, Pb-Free)
BW100EAGL
G-TAIWAN
MR051023
CYP15G0101DXB-B
Summary for 'Family' = FBGA (1.0, Pb-Free) (1 detail record)
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
050202
CY7C015V18-35AC
150C
-65C
300
50
0
BZ100AALE
G-TAIWAN
050202
CYDM256A16-55BV
150C
-65C
300
50
0
BZ100AALE
G-TAIWAN
050202
CYDM256A16-55BV
150C
-65C
300
50
0
BZ48BKALE
RA-CML
MR052088
CYK128K16SCBU-55
150C
-65C
300
49
0
BZ48BTALN
RA-CML
054302
CY62147EV30*
150C
-65C
300
42
0
BZ48BTALN
R-CML
054302
CY62147
150C
-65C
300
45
0
BZ48BTALN
R-CML
043306
CY62147
150C
-65C
300
42
0
BZ48BTALN
RA-CML
043306
CY62147
Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (8 detail records)
150C
-65C
300
45
373
0
0
PLCC
J32RBGAGB
X-THALND
MR051031
CY7B991-2JC
150C
-65C
300
50
0
J32RBGAGB
X-THALND
MR052018
CY7B991-5JC
150C
-65C
300
50
0
J32RBGAGB
X-THALND
MR053042
CY7B991-5JI
150C
-65C
300
50
0
J32RNGAGE
M-PHIL
MR053031
CY7C4271V-25JC
150C
-65C
300
50
0
J52SFGAGB
M-PHIL
MR051036
CY7C136-25JC
-65C
300
50
0
J84SBGAGB
X-THALND
MR044036
CY7C024-55JC
150C
-65C
300
50
0
CY7C346B-35JC
150C
-65C
300
50
350
0
0
CY7C421-20JXC
150C
-65C
300
50
0
CY7C419-15JXC
150C
-65C
300
50
100
0
0
J84SFGACB
M-PHIL
MR044035
Summary for 'Family' = PLCC (7 detail records)
PLCC (Pb-Free)
JZ32RBGAN
M-PHIL
MR051056
JZ32RBGAN
M-PHIL
MR053028
Summary for 'Family' = PLCC (Pb-Free) (2 detail records)
2005 Q4 RELIABILITY REPORT
Page 43 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
Readout
SS
Rejects
LF56AGAGE
L-SEOL
MR044081
CY7C65640A-LFC
150C
-65C
300
50
0
LF56AGAGE
L-SEOL
MR051075
CY7C65640A-LFC
150C
-65C
300
50
0
LF56AGAGE
L-SEOL
MR052016
CY7C65640A-LFC
Summary for 'Family' = QFN (Punch Type) (3 detail records)
150C
-65C
300
50
150
0
0
FA Results
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
150C
-65C
300
49
0
LY32BGAGL
RA-CML
052610
CY8C21434-24LFXI
150C
-65C
300
50
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
150C
-65C
300
50
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
150C
-65C
300
50
0
LY48AGAGL
L-SEOL
044307
CYWUSB6934
150C
-65C
300
50
0
LY56AGAGL
L-SEOL
MR044065
CY7C68300A-56LFX
150C
-65C
300
49
0
LY56DGAGL
L-SEOL
MR051046
CP6241AM
150C
-65C
300
50
0
LY56FGALL
RA-CML
050302
CY7C65640-LFXC
150C
-65C
300
49
0
LY56FGALL
RA-CML
050302
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
050302
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
053008
CY7C65640-LFXC
150C
-65C
300
49
0
LY56FGALL
RA-CML
053008
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
053008
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
050303
CY7C109B-20VCT
150C
-65C
300
49
0
LY56FGALL
RA-CML
050303
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
NR051005
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
R-CML
NR051008
CY7C65640-LFXC
150C
-65C
300
50
0
LY72AGAGL
L-SEOL
054206
CY28447LF-XC
150C
-65C
300
50
0
LY72AGAGL
L-SEOL
054206
CY28447LF-XC
150C
-65C
300
50
0
LY72AGAGL
L-SEOL
054206
CY28447LF-XC
Summary for 'Family' = QFN (Punch Type, Pb-Free) (21 detail records)
150C
-65C
300
50
1045
0
0
PQFP
N52DXGAGB
G-TAIWAN
MR044038
CY7C136-55NC
150C
-65C
300
50
0
N52DXGAGB
G-TAIWAN
MR051005
CY7C136-55NC
150C
-65C
300
50
0
N52DXGAGB
G-TAIWAN
MR052031
Summary for 'Family' = PQFP (3 detail records)
CY7C136-55NC
150C
-65C
300
50
150
0
0
SSOP
O2023GAGB
T-TAIWAN
MR044062
CY8C26233-24PVI
150C
-65C
300
50
0
O2024GAGE
M-PHIL
MR044067
CY2DP314OI
150C
-65C
300
50
0
O2024GAGE
M-PHIL
MR052007
CY2DP314OI
150C
-65C
300
48
0
O2024GAGE
M-PHIL
MR053001
CY2DP3140I
150C
-65C
300
50
0
O2028GAGE
T-TAIWAN
MR044066
CY2CC810OI
150C
-65C
300
50
0
O2824GAGB
T-TAIWAN
MR051038
CY28508OC
150C
-65C
300
49
0
O563AXAGN
R-CML
MR052017
CY28419OC
150C
-65C
300
49
0
CP6221BM
150C
-65C
300
50
396
0
0
O563BXAGE
R-CML
MR051021
Summary for 'Family' = SSOP (8 detail records)
PDIP
P203CGAGB
O-INDNS
MR053013
CY7C168A-35PC
150C
-65C
300
45
0
P2406AAGN
O-INDNS
043805
CY7C63913-PXC
150C
-65C
300
45
0
P243FGAGE
M-PHIL
MR052025
CY7C194-25PC
150C
-65C
300
50
0
2005 Q4 RELIABILITY REPORT
Page 44 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
P2839GAGB
X-THALND
MR052061
CY7C466A-10PTC
150C
-65C
300
50
0
CY8C26443-24PI
150C
-65C
300
45
235
0
0
P283EGAGE
O-INDNS
MR051001
Summary for 'Family' = PDIP (5 detail records)
Readout
SS
Rejects
FA Results
PDIP (Pb-Free)
PZ183AAGN
O-INDNS
MR051004
CY7C63231A-PXC
150C
-65C
300
45
0
PZ183AAGN
O-INDNS
MR052015
CY7C63231A-PXC
150C
-65C
300
45
0
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
150C
-65C
300
48
0
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
150C
-65C
300
50
0
PZ243AAGN
X-THALND
051206
CY7C63743-PXC
150C
-65C
300
50
0
CY7C64013A-PXC
150C
-65C
300
45
283
0
0
PZ2831GAN
O-INDNS
MR053014
Summary for 'Family' = PDIP (Pb-Free) (6 detail records)
SOIC (GullWing)
S0815EAGB
SL-INDIA
MR043080
CY27022SC
150C
-65C
300
48
0
S0815PAGN
RA-CML
MR044055
CY2410SC-1
150C
-65C
300
50
0
S0815PAGN
RA-CML
MR051018
CY2305SC-1H
150C
-65C
300
50
0
S1615DAAGB
M-PHIL
MR051027
CY2292F
150C
-65C
300
50
0
S1615EAGB
M-PHIL
MR044011
CY2309SC-1H
150C
-65C
300
48
0
S1615EAGB
M-PHIL
MR052037
CY2309SC-1H
150C
-65C
300
49
0
S1615EAGB
M-PHIL
MR053002
CY2309SC-1H
150C
-65C
300
48
0
S183CGAGC
RA-CML
NR051009
CY7C63723-SC
150C
-65C
300
44
0
S183CGAGN
RA-CML
NR051009
CY7C63723-SC
150C
-65C
300
50
0
S24314AGL
RA-CML
MR044028
CP6124AM
150C
-65C
300
50
0
S2837GAGB
X-THALND
MR044029
CY7C64013-SC
150C
-65C
300
50
0
S283HGAGB
O-INDNS
MR044063
CY8C24423-24SI
150C
-65C
300
50
0
S283HGAGB
O-INDNS
MR051003
CY2314ANZSC-1
150C
-65C
300
45
0
S283HGAGB
O-NDNS
MR052073
CY7B933-SC
150C
-65C
300
50
0
S324513GB
R-CML
MR051078
CY62128BLL-70SI
150C
-65C
300
42
0
S324513GN
R-CML
MR052036
CY62128BLL-70SC
150C
-65C
300
49
0
150C
-65C
300
50
823
0
0
S324513GN
R-CSPI
MR053003
CY6525AM
Summary for 'Family' = SOIC (GullWing) (17 detail records)
SOIC (GullWing, 450
SN2831AHB
R-CML
MR044008
CY62256LL-70SNC
150C
-65C
300
45
0
SN2831AHN
R-CML
MR051008
CY62256LL-70SNC
150C
-65C
300
50
0
SN2831AHN
R-CML
MR052013
CY62256L-70SNC
150C
-65C
300
50
0
SN2831AHN
R-CML
MR053037
CY62256L-70SNC
Summary for 'Family' = SOIC (GullWing, 450 footprint) (4 detail records)
150C
-65C
300
50
195
0
0
SSOP (Pb-Free)
SP2023GAL
T-TAIWAN
042501
CY8C21323-24PVXI
150C
-65C
300
50
0
SP28214GL
T-TAIWAN
052004
CY8C21234-24SXI
150C
-65C
300
50
0
SP2824CAN
T-TAIWAN
053005
CY28400OXC
150C
-65C
300
50
0
SP2824CAN
T-TAIWAN
053005
CY28400OXC
150C
-65C
300
50
0
SP2824CAN
T-TAIWAN
053005
CY28400OXC
150C
-65C
300
49
0
SP2824GAN
T-TAIWAN
MR044076
CY28353OXC-2
150C
-65C
300
49
0
SP2824GAN
T-TAIWAN
MR051052
CY23FP12OXC-003
150C
-65C
300
45
0
SP2824GAN
T-TAIWAN
MR052008
CY28508OXC
150C
-65C
300
50
0
SP563AAGN
R-CML
MR043047
CY28RS480OXC
150C
-65C
300
48
0
SP563AAGN
R-CML
MR044010
CY28410OXC
150C
-65C
300
43
0
2005 Q4 RELIABILITY REPORT
Page 45 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
R-CML
MR051019
CY28410OXC
150C
-65C
300
50
0
SP563AAGN
R-CML
MR052040
CY28410OXC
150C
-65C
300
48
0
SP563AAGN
R-CML
MR053021
CY28410OXC
150C
-65C
300
50
0
SP563BAGL
R-CML
042101
CY7C68300B-56PVX
150C
-65C
300
50
0
150C
-65C
300
50
732
0
0
CY7C63743-QXC
150C
-65C
300
50
0
CY7C63101A-QXC
150C
-65C
300
50
100
0
0
CY62256L-70SNXC
150C
-65C
300
50
0
SY2831AHN
R-CML
MR053036
CY62256LL-70SNXI
Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (2 detail
150C
-65C
300
48
98
0
0
SP563AAGN
SP563CAGE
T-TAIWAN
053502
CY7C66113A-PVXC
Summary for 'Family' = SSOP (Pb-Free) (15 detail records)
Readout
SS
Rejects
FA Results
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR043016
SQ2414AGN
R-CML
MR044042
Summary for 'Family' = QSOP (Pb-Free) (2 detail records)
SOIC (GullWing, 450
SY2831AHN
R-CML
MR052010
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
052004
CY8C21234-24SXI
150C
-65C
300
45
0
SZ1615EGN
M-PHIL
MR044014
CY2309NZSXC-1H
150C
-65C
300
50
0
SZ1615EGN
M-PHIL
MR051029
CY2308SXC-1H
150C
-65C
300
50
0
SZ1615EGN
M-PHIL
MR052046
CY2309SXC-1H
150C
-65C
300
48
0
SZ1615KGN
RA-CML
MR051016
CY2309SXC-1H
150C
-65C
300
49
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
150C
-65C
300
50
0
SZ183AGAN
M-PHIL
044301
CY7C63723-SXC
150C
-65C
300
50
0
SZ324510GL
R-CML
MR051022
CY62128BLL-70SXI
150C
-65C
300
48
0
-65C
300
50
440
0
0
SZ324514L
R-CML
MR044005
CY62148DV30LL-70
Summary for 'Family' = SOIC (GullWing, Pb-Free) (9 detail records)
SOIC (J lead)
V28CGAGB
O-INDNS
MR044064
CY7C106B-20VC
150C
-65C
300
48
0
V324EGAGB
O-INDNS
MR051002
CY7C1019B-12VC
150C
-65C
300
45
0
V324EGAGB
O-INDNS
MR052014
CY7C1019B-10VC
150C
-65C
300
45
0
V324FGAGB
O-INDNS
MR053015
CY7C109B-20VC
150C
-65C
300
45
0
V444WGALE
R-CML
MR044022
CY7C1021B-15VC
150C
-65C
300
45
0
V444WGALL
R-CML
MR052019
CY7C1021B-12VI
150C
-65C
300
49
0
V444YAALE
R-CML
MR051015
CY7C1041CV33-12V
150C
-65C
300
50
0
V444ZGALL
R-CML
MR053004
CY7C1021CV33
150C
-65C
300
50
0
CY7C1021CV33-15V
150C
-65C
300
50
427
0
0
V444ZGALL
R-CML
MR054001
Summary for 'Family' = SOIC (J lead) (9 detail records)
SOIC (J lead, Pb-Free)
VZ243GGBLL
O-INDNS
052801
CY7C197
150C
-65C
300
50
0
VZ243GGBLL
O-INDNS
052801
CY7C197
150C
-65C
300
50
0
VZ243GGBLL
O-INDNS
052801
CY7C197
150C
-65C
300
50
0
VZ28311GL
R-CML
NR053002
CY7C199CL-15VXC
150C
-65C
300
50
0
VZ28311GL
R-CML
NR053002
CY7C199CL-15VXC
150C
-65C
300
50
0
VZ28311GL
R-CML
NR053002
CY7C199CL-15VXC
150C
-65C
300
50
0
VZ3644GALL
R-CML
MR053038
CY7C1049B-20VXI
150C
-65C
300
48
0
VZ444WAGL
R-CML
MR052001
CY7C1021B-15VXC
150C
-65C
300
50
0
VZ444ZALL
R-CML
MR053005
CY7C1021CV33-8VX
150C
-65C
300
50
0
2005 Q4 RELIABILITY REPORT
Page 46 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
VZ444ZALL
R-CML
MR054002
CY7C1021CV33-12V
Summary for 'Family' = SOIC (J lead, Pb-Free) (10 detail records)
Readout
SS
Rejects
150C
-65C
300
47
495
0
0
FA Results
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
050701
CY7C65640-LFXC
Summary for 'Family' = CERDIP (Windowed) (3 detail records)
150C
-65C
300
50
150
0
0
TSOP/ TSSOP
Z1613GAGB
T-TAIWAN
MR051011
CY2309ZI-1H
150C
-65C
300
45
0
Z1613GAGB
T-TAIWAN
MR052039
CY2308ZC-1H
150C
-65C
300
50
0
Z1619GAGN
RA-CML
MR052027
CY22392ZC-366
150C
-65C
300
48
0
R-CML
MR051050
CY28346ZI-2T
150C
-65C
300
50
0
Z5624BAGN
R-CML
MR052012
CY28409ZC
150C
-65C
300
50
0
Z5624BAGN
R-CML
MR053046
CY28409ZC
150C
-65C
300
50
0
Z5624BAGN
R-CML
044903
CY28346ZC-2T
150C
-65C
300
50
0
Z5624BAGN
R-CML
044903
CY28346ZC-2
150C
-65C
300
49
0
CY28346ZC-2T
150C
-65C
300
49
441
0
0
Z5624BAGN
Z5624BAGN
R-CML
044903
Summary for 'Family' = TSOP/ TSSOP (9 detail records)
TSOP I
ZA32RHAALB
R-CML
MR044017
CY62128DV30LL-70
150C
-65C
300
45
0
ZA32RHAALB
R-CML
MR051012
CY62128DV30LL-55
150C
-65C
300
50
0
ZA32RHAALB
R-CML
MR052020
CY62128DV30LL-55
150C
-65C
300
49
0
ZA32RHAALB
R-CML
MR053056
Summary for 'Family' = TSOP I (4 detail records)
CY62128DV30LL-55
150C
-65C
300
50
194
0
0
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
CY62256LL-70ZRI
150C
-65C
300
45
0
ZR28R2AGN
R-CML
MR051013
CY62256LL-70ZRI
150C
-65C
300
50
0
ZR28R2AGN
R-CML
MR053049
CY62256LL-70ZRI
150C
-65C
300
45
0
CY62128BLL-55ZRI
150C
-65C
300
50
190
0
0
ZR32RKAGB
T-TAIWAN
MR044023
Summary for 'Family' = TSOP (Reverse) (4 detail records)
TSOP II
ZS324CA3E
T-TAIWAN
MR044070
CY7C1019B-12ZC
150C
-65C
300
44
0
ZS324FAGE
T-TAIWAN
MR052009
CY7C1019CV33-12Z
150C
-65C
300
50
0
ZS324FAGE
T-TAIWAN
MR053055
CY7C1019CV33-12Z
150C
-65C
300
50
0
ZS444ABALE
R-CML
MR044021
CY7C1021CV33-15Z
150C
-65C
300
44
0
ZS444ABALE
R-CML
MR053058
CS6125AT
150C
-65C
300
50
0
ZS444ABALL
R-CML
MR051010
CY7C1021CV33-15Z
150C
-65C
300
50
0
ZS444AKALN
R-CML
MR052022
CY7C1041CV33-15Z
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR044031
CY7C1069AV33-12Z
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR052030
Summary for 'Family' = TSOP II (9 detail records)
CY7C1069AV33-12Z
150C
-65C
300
50
438
0
0
TSOP (Pb-Free)
ZT28R4AGL
R-CML
MR052011
CY7C1399B-15ZXC
150C
-65C
300
50
0
ZT32RKGGL
T-TAIWAN
MR052044
CY7C109B-15ZXC
150C
-65C
300
50
0
CY2308SC-1
150C
-65C
300
50
150
0
0
ZT32RYAGL
T-TAIWAN
MR051079
Summary for 'Family' = TSOP (Pb-Free) (3 detail records)
2005 Q4 RELIABILITY REPORT
Page 47 of 48
Product Reliability
Cypress
BldKit
Loc
EvalNum
Device
Readout
SS
Rejects
ZW324FAGL
T-TAIWAN
MR052021
CY7C1019CV33-12Z
150C
-65C
300
50
0
ZW444ADALL
R-CML
MR052003
CY7C1041CV33-15Z
150C
-65C
300
50
0
ZW444ADGL
R-CML
MR044032
CY7C1041CV33-12Z
150C
-65C
300
50
0
ZW444AFLL
R-CML
MR044004
CY62146DV30LL-70
150C
-65C
300
50
0
ZW444NAGN
R-CML
MR051047
CY62126DV30LL-55
150C
-65C
300
50
0
ZW444VAGL
R-CML
MR053033
CY7C1021B-15ZXI
150C
-65C
300
50
0
ZW544AALL
G-TAIWAN
NR052007
7C1069AC-GZWC
Summary for 'Family' = TSOP II (Pb-Free) (7 detail records)
150C
-65C
300
45
345
0
0
150C
-65C
300
50
50
0
0
FA Results
TSOP II (Pb-Free)
TSOP (Reverse, Pb-Free)
ZY28R2AGN
R-CML
MR053057
CY62256LL-70ZRXI
Summary for 'Family' = TSOP (Reverse, Pb-Free) (1 detail record)
TSSOP (Pb-Free)
ZZ0812AGL
T-TAIWAN
MR043048
CY25104ZXC-2
150C
-65C
300
50
0
ZZ1613GAN
T-TAIWAN
MR052077
CY2309ZXI-1H
150C
-65C
300
50
0
ZZ2411AGN
T-TAIWAN
MR051020
CY7C68300A-56LFX
150C
-65C
300
45
0
ZZ2411AGN
T-TAIWAN
MR051051
CY22313ZXC
150C
-65C
300
48
0
ZZ2415GAL
RA-CML
MR051028
CY22313ZXC
150C
-65C
300
46
0
ZZ2415GAL
RA-CML
MR052006
CY22313ZXC
150C
-65C
300
49
0
ZZ2415GAL
RA-CML
MR052038
CY22313ZXC
150C
-65C
300
50
0
ZZ2813AGN
T-TAIWAN
053006
CYI5002ZXC
150C
-65C
300
50
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
150C
-65C
300
46
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
150C
-65C
300
45
0
ZZ2817AGL
RA-CML
042701
7C89000AC-RAZZC
150C
-65C
300
45
0
ZZ2817AGL
RA-CML
051903
CY221R28-ZXC
150C
-65C
300
50
0
ZZ2817AGL
RA-CML
051903
CY221R28-ZXC
150C
-65C
300
50
0
ZZ5624BG
R-CML
052802
CY28411ZXC
150C
-65C
300
47
0
ZZ5624BG
R-CML
052802
CY28411ZXC
150C
-65C
300
45
0
ZZ5624BGN
R-CML
MR043046
CY28442ZXC-2
150C
-65C
300
50
0
CY28411ZXC
150C
-65C
300
46
0
ZZ5624BGN
R-CML
MR044054
ZZ5624BGN
R-CML
MR051026
CY28442ZXC
150C
-65C
300
50
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
150C
-65C
300
49
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
150C
-65C
300
50
0
ZZ5624BGN
R-CML
050504
CY28411ZXCT
Summary for 'Family' = TSSOP (Pb-Free) (21 detail records)
150C
-65C
300
50
1011
0
0
Grand Total
2005 Q4 RELIABILITY REPORT
13277
0
Page 48 of 48