Product Reliability Cypress 2005 Q4 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM 2 2.0 DEVICE RELIABILITY 3 3.0 2.1 EARLY FAILURE RATE SUMMARY 3 2.2 LONG TERM FAILURE RATE SUMMARY 4 PACKAGE RELIABILITY 5 3.1 PRESSURE COOKER TEST 6 3.2 HAST (HIGHLY ACCELERATED STRESS TEST) 7 3.3 TEMPERATURE CYCLE 8 APPENDIX A: FAILURE RATE CALCULATION 9 APPENDIX B: TEMPERATURE CYCLING STRESS MODELS 13 APPENDIX C: EQUIVALENCE OF STRESS TEST CONDITIONS 15 APPENDIX D: RELIABILITY DATA 16 Note: The results reported herein are for 4th Quarter 2005. 2005 Q4 RELIABILITY REPORT Page 1 of 48 Product Reliability Cypress 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR, INC. TOTAL QUALITY MANAGEMENT SYSTEM This report summarizes Cypress Semiconductor Product Reliability for the period of the 4th quarter of 2005. It includes data from devices fabricated at the Round Rock, Texas; Minnesota and Fab foundry facilities and packaged-device data from assembly sites at Cypress Philippines and sub-contractors. Cypress Semiconductor has established aggressive reliability objectives to assure that all products exhibit reliability, which exceeds customer reliability requirements for purchased components. The quality standard at Cypress is zero defects resulting in a culture requiring continuous improvement in quality and reliability. Product reliability is assured by a total quality management system. The quality management system is described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number 90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4) manufacturing identification of "Maverick Lot" yield limits; (5) formal training and certification of manufacturing personnel; (6) qualification of new products and manufacturing processes; (7) continuous reliability monitoring; (8) formal failure analysis and corrective action; and (9) competitive benchmarking. Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard production material. Sample selection is based on generic product families. These generic products are designed with very similar design rules and manufactured from a core set of processes. Reliability strategy requires that every failure that occurs during reliability testing be subjected to failure analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism. Corrective action is then implemented to prevent future failures, resulting in continuous improvement in product reliability. Copies of the Cypress Semiconductor documents referenced herein are available through your Cypress Semiconductor sales representative. Questions about product reliability may be addressed to the undersigned. Sabbas Daniel Vice-President for Quality Cypress Semiconductor Corporation 3901 North First Street San Jose, CA 95134-1599 Cypress Quality Fax: (408) 943-2165 2005 Q4 RELIABILITY REPORT Page 2 of 48 Product Reliability Cypress 2.0 PRODUCT RELIABILITY In product stress testing, the main emphasis is on the useful life section of the bathtub curve. The test methodology used to predict the useful life period is a steady-state life test under a dynamic bias and at temperatures 125°C or 150°C for the maximum specified use voltage of the product. The duration at these temperatures is 1,000 and 500 hours, respectively. In Cypress, product reliability tests are performed as part of the qualification processes and as part of the standard reliability monitoring program. Each fab site and technology family from each product line are being sampled for product monitor. These reliability tests utilize the following stress factors to accelerate failure: temperature, current and /or voltage. The product reliability tests currently employed at Cypress include Early Failure Rate (EFR) and Long Term Failure Rate (LFR) . 2.1 EARLY FAILURE RATE SUMMARY Early Failure Rate Determination: High Temperature Operating Life testing (HTOL), for as long as 96 hours, is used to estimate device early failure rate. This stress will typically correspond to the first 2000 hours of device operation in a system environment. The remainder of the device’s lifetime is characterized with extended LFR testing (See Section 3) Test : Conditions : Duration : Failure : High Temperature Operating Life Test (HTOL) Dynamic Operating Conditions, VCC nominal + 15%, 150°C or 125°C. 48 hours HTOL at 150°C or 96 hours at 125°C. (Refer to Appendix C for derating factor calculation) A failure is any device that fails to meet data sheet electrical requirements. Table 1. Early Failure Rate Summary Technology B53 C8 FL28 P20 POWER165 PROMOS .17 R42 R5 R7 R8 R9 S4 STARM T013 TOWER 165 TSMC 150 TSMC 180 Grand Total Device Hours 6,194 215,607 9,600 6,194 28,955 89,853 244,456 575,941 1,834,119 385,943 2,968,528 340,653 103,151 30,178 409,301 34,126 72,186 7,354,984 # Failed 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FIT Rate Insufficient 25 Insufficient Insufficient Insufficient Insufficient 22 9 3 14 2 16 Insufficient Insufficient 13 Insufficient Insufficient 1 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Failure Mode None None None None None None None None None None None None None None None None None None Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60% confidence bound for a zero-fails sample. 2005 Q4 RELIABILITY REPORT Page 3 of 48 Product Reliability Cypress 2.2 LONG TERM FAILURE RATE SUMMARY A High Temperature Operating Life test (HTOL) is used to estimate long-term reliability. By operating the devices at accelerated temperature and voltage, hundreds of thousands of use hours can be compressed into hundreds of test hours. Test : Conditions : Duration : Failure Fit Rate : : High Temperature Operating Life Test (HTOL) Dynamic Operating Conditions, VCC nominal +15% 150°C or 125°C. A minimum of 80 hours at 150°C or 168 hours at 125°C Generally 500 hours at 150°C or 1000 hours at 125°C. (Refer to Appendix C for derating factor calculation) A failure is any device that fails to meet data sheet electrical requirements. Derated to 55° C ambient, with 60% upper confidence bound for 0 failures, Ea =0.7ev (Refer to Appendix A) Table 2. Long Term Failure Rate Summary Technology B53 C8 FL28 P20 POWER165 PROMOS .17 R42 R5 R7 R8 R9 S4 STARM T013 TSMC 180 Grand Total Device Hours 64,516 240,290 84,000 48,387 24,194 48,387 428,094 852,273 727,967 298,579 1,552,064 536,671 232,336 109,093 22,151 5,269,002 # Failed 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FIT Rate Insufficient 22 Insufficient Insufficient Insufficient Insufficient 13 6 7 18 3 10 23 Insufficient Insufficient 0 Failure Mode None None None None None None None None None None None None None None None None Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60% confidence bound for a zero-fails sample 2005 Q4 RELIABILITY REPORT Page 4 of 48 Product Reliability Cypress 3.0 PACKAGE RELIABILITY Package-level reliability testing refers to the assessment of the over-all reliability of the device in packaged form. This consists of subjecting packaged samples to reliability tests that expose the various sample sets to different stress conditions, after which the samples are tested for any degradation in quality after the stress. In Cypress, package reliability tests are performed as part of the qualification processes and as part of the standard reliability monitoring program. The reliability test employed is chosen based on the failure mechanism, as different stress tests accelerate different failure mechanisms. These reliability tests utilize one or more of the following stress factors to accelerate failure: temperature, moisture or humidity, current, voltage, and pressure. The package reliability tests currently employed at Cypress include Pressure Cooker Test (PCT, Highly Accelerated Stress Test (HAST), Temperature Cycle Test (TCT), and High Temperature Storage (HTS). Figure 1 shows the Cypress package reliability stress flow. Surface-mount samples are preconditioned per Jedec Std JESD22-A113 prior to package reliability testing. This is required prior TCT, PCT and HAST testing. Preconditioning simulates the board mounting process of the customer. It normally consists of a temperature cycle to simulate exposure to different temperatures during shipping, a bake to drive away the moisture inside the packages of the samples, a soak to drive a controlled amount of moisture into the package, and three cycles of convection reflow. Packages are soaked and reflowed based on its shipping moisture sensitivity classification. The samples are tested (acoustic and electrical) after preconditioning, failures from which are considered as preconditioning failures and not reliability failures. Preconditioning failures should be taken seriously, since these imply that the samples are not robust enough to even withstand the board mounting process. Cypress conducts all major classes of package reliability tests on each of its package families. The package characteristics and assembly locations are the primary considerations when grouping packages into package families. A package family may consist of a group of 44-lead to 144-lead TQFP packages manufactured at a particular manufacturing location. Initital Electrical Testing Time Zero Acoustic Analysis (serialized 15 units) Moisture Pre-conditioning Post Pre-Con Electrical Testing Post Pre-Con Acoustic Analysis (same serialized units) Temperature Cycle Test (TCT) (300, 500, 1000 cycles)) Pressure Cooker Test (PCT) (168 hours) Highly Accelerated Stress Test (HAST) (128 hours) High Temperature Storage (HTS) (500, 1000 hours) Post Stress Electrical Testing Figure 1. Cypress Package Reliability Stress Flow 2005 Q4 RELIABILITY REPORT Page 5 of 48 Product Reliability Cypress 3.1 PRESSURE COOKER TEST (PCT) The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure environmental durability of epoxy-packaged parts. Passivation cracks, ionic contamination, and corrosion susceptibility are all accelerated by this stress. Conditions Pre-Conditioning : : Failure Modes Failure Mechanism : : 15 PSIG, 121°C, No bias, for a minimum of 168 hours. 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading to qualified MSL level Parametric shifts, high leakage, and/or catastrophic Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing. Table 3. Pressure Cooker Test Failure Rate Summary Package TQFP TQFP (10x10) TQFP (Thermal) TQFP (Pb-Free) FBGA (0.75-0.8) FBGA (1.0) PBGA (1.27) PBGA (Heat Spreader) PBGA (Cavity/Heatsink, Pb-Free) FBGA (0.75-0.8, Pb-Free) PBGA (Cavity/Heatsink) FVBGA (0.75-0.8, 0.3mm) FBGA (1.0, Pb-Free) VFBGA (0.75-0.8, Pb-Free) PLCC PLCC (Pb-Free) QFN (Punch Type) QFN (Punch Type, Pb-Free) PQFP SSOP PDIP PDIP (Pb-Free) SOIC (GullWing) SOIC (GullWing, 450 footprint) SSOP (Pb-Free) SOIC (GullWing, 450 footprint, Pb-Free) SOIC (GullWing, Pb-Free) SOIC (J lead) SOIC (J lead, Pb-Free) CERDIP (Windowed) TSOP/ TSSOP TSOP I TSOP (Reverse) TSOP II TSOP (Pb-Free) TSOP II (Pb-Free) TSOP (Reverse, Pb-Free) TSSOP (Pb-Free) Grand Total 2005 Q4 RELIABILITY REPORT Sample Size 554 100 195 1,277 215 146 140 47 95 50 100 501 95 144 448 50 200 645 147 438 235 235 487 150 630 280 535 435 245 50 439 150 95 453 99 199 50 639 10,993 # Failed Defects % 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Failure Mode None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None Page 6 of 48 Product Reliability Cypress 3.2 HIGHLY ACCELERATED STRESS TEST (HAST) Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This change was necessary because our package reliability had improved to the point where the old 85°C/85% R.H. Temperature-humidity-bias testing would not induce failures. Failures are necessary to judge progress and compare packaging changes. HAST testing has been shown to be at least twenty times more accelerated then 85°C/85% R.H. temperature-humidity-bias testing. Conditions : Pre-Conditioning : Failure Modes Failure Mechanism : : Present Conditions: 130°C / 85% RH minimum power dissipation, for a minimum of 128 hours. 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading to qualified MSL level Parametric shifts, high leakage, and/or catastrophic Die corrosion or contaminants such as foreign material on or within the package materials. Poor package sealing. Table 4. Highly Accelerated Stress Test (HAST) Failure Rate Summary Package TQFP TQFP (10x10) TQFP (Thermal) TQFP (Pb-Free) FBGA (0.75-0.8) PBGA (Cavity/Heatsink, Pb-Free) FVBGA (0.75-0.8, 0.3mm) PLCC QFN (Punch Type) QFN (Punch Type, Pb-Free) SSOP PDIP PDIP (Pb-Free) SOIC (GullWing) SOIC (GullWing, 450 footprint) SSOP (Pb-Free) SOIC (GullWing, 450 footprint, Pb-Free) SOIC (GullWing, Pb-Free) SOIC (J lead) SOIC (J lead, Pb-Free) TSOP/ TSSOP TSOP I TSOP (Reverse) TSOP II TSOP (Pb-Free) TSOP II (Pb-Free) TSOP (Reverse, Pb-Free) TSSOP (Pb-Free) Grand Total 2005 Q4 RELIABILITY REPORT Sample Size 316 96 31 291 147 98 65 250 132 274 196 235 137 569 191 290 391 453 567 291 449 144 69 406 97 372 47 474 7,078 # Failed 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Defects % 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Failure Mode None None None None None None None None None None None None None None None None None None None None None None None None None None None None None Page 7 of 48 Product Reliability Cypress 3.3 TEMPERATURE CYCLE TEST (TC) Differences in thermal expansion coefficients are accentuated by cycling devices through temperature extremes. If the materials do not expand and contract equally, large stresses can develop. The Temperature Cycle test stresses mechanical integrity by exposing a device to alternating temperature extremes. Weakness and thermal expansion mismatches in die interconnections, die attach, and wire bonds are often detected with this acceleration test. Condition : Pre-Condition : Duration : Failure Mode Failure Mechanism : : MIL-STD-883D, Method 1010, Condition B, -55°C to 125°C MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C (Refer to Appendix C for derating factor calculation) 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading to qualified MSL level 300 cycles minimum at Condition C, 1000 cycles minimum at Condition B Parametric shifts and catatrophic failures Wire bond, cracked or lifted die and package failure. Table 5. Temperature Cycling Failure Rate Summary Package TQFP TQFP (Thermal, Pb-Free) TQFP (10x10) TQFP (Thermal) TQFP (Pb-Free) FBGA (0.75-0.8) FBGA (1.0) PBGA (1.27) PBGA (Heat Spreader) PBGA (Cavity/Heatsink, Pb-Free) FBGA (0.75-0.8, Pb-Free) PBGA (Cavity/Heatsink) FVBGA (0.75-0.8, 0.3mm) FBGA (1.0, Pb-Free) VFBGA (0.75-0.8, Pb-Free) PLCC PLCC (Pb-Free) QFN (Punch Type) QFN (Punch Type, Pb-Free) PQFP SSOP PDIP PDIP (Pb-Free) SOIC (GullWing) SOIC (GullWing, 450 footprint) SSOP (Pb-Free) QSOP (Pb-Free) SOIC (GullWing, 450 footprint, Pb-Free) SOIC (GullWing, Pb-Free) SOIC (J lead) SOIC (J lead, Pb-Free) CERDIP (Windowed) TSOP/ TSSOP TSOP I TSOP (Reverse) TSOP II TSOP (Pb-Free) TSOP II (Pb-Free) TSOP (Reverse, Pb-Free) TSSOP (Pb-Free) Grand Total 2005 Q4 RELIABILITY REPORT Sample Size 837 50 196 194 614 476 100 242 50 245 60 100 702 50 373 350 100 150 1,045 150 396 235 283 823 195 732 100 98 440 427 495 150 441 194 190 438 150 345 50 1,011 13,277 # Failed 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Defects % 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Failure Mode None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None Page 8 of 48 Product Reliability Cypress APPENDIX A: FAILURE RATE CALCULATION Thermal Acceleration Factors Acceleration factors (AF) for thermal stresses (Early Failure Rate, Latent Failure Rate, Data Retention and High Temperature Storage) are calculated from the Arrhenius equation) AF = exp Ea k 1 - 1 Tu Tt where : Ea = Activation Energy of the defect mechanism K = Boltzmann’s constant = 8.62 x 10 –5 eV/Kelvin Tt is the junction temperature of the device under stress Tu is the junction temperature of the device at use conditions While there is no substitute for experimentally determining the activation energy, obtaining this information is very difficult because few devices fail stress tests. In the absence of experimental data, the following literature values are used. Activation Energy Ea Failure Mechanism Charge Gain (eV) 0.3-0.6 Charge Loss (defects) 0.6 Charge Loss (Ionic contamination, edge bits) 0.9 Charge loss (intrinsic wear out) 0.3-0.6 Electromigration 0.6-1.0 Intermetallic Growth 1.0 Ionic Contamination 1.0-1.4 Silicon Bulk Defects 0.5 Oxide Defects 0.3 Unknown/Non-Visual Defect (NVD) 0.45 2005 Q4 RELIABILITY REPORT Page 9 of 48 Product Reliability Cypress APPENDIX A: FAILURE RATE CALCULATION (cont.) Temperature-Humidity Acceleration Factors Cypress estimates acceleration factors for temperature-humidity stresses (Pressure Cooker Test and Highly Accelerated Stress Test) from a model developed by Hallberg and Peck (“Quality and Reliability Engineering International”. Vol. 7, 1991). -3 AF = RHt RHu exp Ea k 1 - 1 Tu Tt where : Tu = use environment junction temperature (°K) Tt = test environment junction temperature (°K) Ea = failure mechanism activation energy (0.9 for corrosion) o k = Boltzman’s Constant (8.62 x 10 –5 eV/ Kelvin) RHu = use environment relative humidity RHt = test environment relative humidity AF = acceleration factor The Hallberg and Peck model requires the stress junction temperature and relative humidity as well as the use temperature and relative humidity. To estimate the use relative humidity, we assume that the device room o o temperature is 35 C (95 F) and the room relative humidity is 100%. From any Handbook of Chemistry and o Physics, the vapor pressure of water VP (water) at 35 C is 41.175 mm Hg. If we assume that the device will o o operate with a junction temperature of 70 C (VP (water) at 70 C is 233.7 mm Hg), the junction relative humidity (RHj) is RHj = 100% 41.175 233.7 = 17.6% o The operating conditions of the devices are then 70 C and 17.6% relative humidity. o Our Pressure Cooker Test (PCT) submits the devices to a temperature of 121 C and 100% relative humidity. Using the Hallberg and Peck model, the acceleration factor for the PCT stress can be calculated: -3 AF = 2005 Q4 RELIABILITY REPORT 17.6 100 exp 0.9 k 1_ - 1_ 343 394 = 9, 433 Page 10 of 48 Product Reliability Cypress APPENDIX A: FAILURE RATE CALCULATION (cont.) The acceleration factor for HAST is calculated similarly, except that junction temperature heating effects must be included when estimating the relative humidity at the die surface. Assuming an average junction o temperature rise of 5 C, the relative humidity at the die surface during 130 C HAST testing can be calculated. o VP (130 C) = 2026.10 mm Hg o VP (135 C) = 2347.26 mm Hg RHj = 85% 2026.10 2347.26 = 73.4% -3 AF = 17.6 73.4 exp 0.9 k 1_ - 1_ 343 408 = 9,261 o Similarly, for 140 C HAST testing, o VP (140 C) = 2710.92 mm Hg o VP (145 C) = 3116.76 mm Hg RHj = 85% 2710.92 3116.76 = 73.9% -3 AF = 2005 Q4 RELIABILITY REPORT 17.6 73.9 exp 0.9 k 1_ - 1_ 343 418 = 17,433 Page 11 of 48 Product Reliability Cypress APPENDIX A: FAILURE RATE CALCULATION (cont.) Failure Rate Calculation For all but LFR test, Cypress reports the failure rate in terms of ppm. Early life reliability is reported in terms of ppm defective expected during the first year of use under typical use conditions. No upper confidence bound will be used for this estimate. The ppm defective is the ratio of the number of rejects to the number of samples and expressed in ppm. PPM = Total Rejects x 1,000,000 Total Samples Intrinsic, or later life reliability, shall be reported using the exponential model, in terms of FITs, with a 60% upper confidence bound for 0 failures or the demonstrated FIT estimate in the case there are failures. FR (FIT) =? 2? , 2n +2 /(2 * AF * Device Hours) * 10 9 where: ? 2 ? ,2n +2 = Chi square factor for 2n +2 degrees of freedom at 60% confidence level. n = number of failure. AF = Thermal Acceleration factor and is calculated per Arrhenius equation assuming a 0.7eV activation energy. Voltage acceleration factor is not included in failure rate calculation even though voltage acceleration may be used during stress. Typical use conditions shall be considered to be 55°C ambient with a 15°C temperature rise at the junction. Thus, use junction temperature is 70°C. 2005 Q4 RELIABILITY REPORT Page 12 of 48 Product Reliability Cypress APPENDIX B: TEMPERATURE CYCLING STRESS MODELS Two acceleration factor (AF) models are used to model temperature cycle failures. The model proposed by Zelenka [1] and others uses the epoxy molding temperature (Tmold = 170 °C) and the minimum temperature reached during temperature cycling , (Tmin). m AFbrittle = Tmold - Tmin,stress Tmold - Tmin,stress The model constant, m, is experimentally calculated for each failure mechanism. The acceleration factor is labeled ‘brittle’ because the derivation of this equation assumes brittle fracture mechanics. Basically, the model assumed that cracks advance a little every time the maximum stress is reached. The maximum stress is assumed to be proportional to the difference in temperature between the minimum and maximum stress temperatures. For plastic-encapsulated devices, the stress is minimum during molding, (Tmold), and a maximum during the lowest temperature reached during temperature cycling, (Tmin). The model constant, m, is a function of the failure mechanism. Thin film cracking Al/Au Intermetallic fractures Chip-out (cratering) bond failures m = 12 (Blish and Vaney [2]) m=4 m = 7 (Dunn and McPherson [3]) For ductile materials, dislocation movement dominates the fracture mechanics and a different model is used. The second, and most widely accepted model, use the difference between the minimum and maximum temperatures during temperature cycle testing (Tmin and Tmax) to calculate an acceleration factor. m AFductile = Tmax, stress - Tmin,stress Tmax,use - Tmin,use The model constant, ‘m’, is again experimentally calculate for each failure mechanism. Coffin and Manson [4] developed this model from empirical observations of metal fatigue. In ductile materials, if the applied stress is high enough, dislocation are produced. At the high temperature condition of the temperature cycling stress, dislocations are forced towards one metal surface. At the low temperature , the dislocations try to glide back to their original position, but many cannot because they became entangled with other dislocations. After many cyles, these tangles grow until cracking, and finally failure, occurs. Both minimum and maximum temperatures are important, because both contribute to dislocation movement and entanglement. This model is recommended for any failures involving ductile materials. Model constants for ductile failure mechanism follow. Wirebond breakage Solder Fatigue 2005 Q4 RELIABILITY REPORT m = 5.16 (Cypress experimentation) m = 2 (Blish and Vaney [2]) Page 13 of 48 Product Reliability Cypress APPENDIX B: TEMPERATURE CYCLING STRESS MODELS (cont.) Our commercial devices are specified to operate between 0°C and 70 °C. Using this information, the acceleration factor, AF, between use and Military Condition C stress testing (-65°C to 150°C), for the brittle, thin film cracking failure mechanism and ductile, wire bond breakage failure mechanism can be calculated. 12 AF brittle = 170 - (-65) 170 - 0 AF ductile = 150 - (-65) 70 - 0 = 49 5.16 = 327 References: [1] R.L. Zelenka, IEEE/IRPS, pp. 30-34, 1991 [2] R.C. Blish and P.R. Vaney, IEEE/IRPS, pp 22-29, 1991 [3] C.F. Dunn and J.W. McPherson, IEEE/IRPS, pp 252-258, 1990 [4] S.S. Manson, thermal Stress and Low-Cycle Fatigue, (Robert Krieger : Malabar, Florida), 1981. 2005 Q4 RELIABILITY REPORT Page 14 of 48 Product Reliability Cypress APPENDIX C: EQUIVALENCE OF DIFFERENT STRESS TEST CONDITIONS During stress testing, more than one set of test conditions were used. To account for this difference, stress test hours or cycles at the lower stress condition were derated and then added to the total for the most severe stress test condition. Dynamic (HTOL) HTOL (EFR/LFR) test is performed at 150 °C and 125 °C. Using the Arrhenius equation (Appendix A) and an activation energy of 0.7 eV, the derating factor, DF, between 125°C and 150 °C can be calculated. DF (between 125C and 150C) = exp 0.6 ____1 _______ - ______1______ k 150 + 15 + 273 125 + 15 + 273 = 0.326 Derating calculation assumes a 15 °C rise due to junction heating. Temperature Cycling Two different temperature cycling conditions were used to measure reliability, -65°C to 150°C and –55°C to 125°C. Using the brittle failure mechanism model with m = 12, the derating factor between -65°C to 150°C and –55°C to 125°C is calculated. 12 DF = 170 - (-55) 170 – (-65) = 1.685 Using the ductile failure mechanism model with m = 5.16, the derating factor between -65°C to 150°C and – 55°C to 125°C is obtained. 5.16 DF = 125 - (-55) 150 - (-65) = 2.501 HAST The derating factor between two HAST conditions, 140 °C / 85%RH and 130 °C / 85% RH is simply the ratio of the acceleration factors (See Appendix A) DF 2005 Q4 RELIABILITY REPORT = 9,261_ 17, 433 = 0.531 Page 15 of 48 Product Reliability Cypress APPENDIX D: RELIABILITY DATA Summary Detail -- EFR Performance Technology Temp Eval Num 125C MR044075 Division Device Volt SS Rej Hours 4.0V 200 0 200 0 FA Results B53 DCD CY7B993V-5AC Summary for 'Technology' = B53 (1 detail record) 96 C8 125C 033805 CCD 7C682005AC-RSPC 3.8V 514 0 96 125C 042106 CCD 7C82877A 2.35V 505 0 96 125C 042106 CCD 7C87741A 2.35V 276 0 96 125C 042106 CCD 7C82877A 2.35V 126 0 96 125C 044503 CCD CY7C68013 3.8V 645 0 96 125C 044503 CCD CY7C68013 3.8V 645 0 96 125C 050305 CCD 7C828771BC-GBZI 2.35V 508 0 96 125C 050305 CCD 7C828771BC-GBZI 2.35V 510 0 96 150C 042105 CCD 7C83864AC-GBPC 2.35V 391 0 48 150C 042105 CCD 7C83864AC-GBPC 2.35V 296 0 48 150C 042105 CCD 7C83864AC-GBPC 2.35V 391 0 48 150C 042507 CCD CY284KOTP 3.8V 130 0 48 150C 042507 CCD CY284KOTP 3.8V 135 0 48 150C 042507 CCD CY284KOTP 3.8V 135 0 48 150C 042507 CCD CY284KOTP 3.8V 135 0 48 150C 042507 CCD CY284KOTP 3.8v 68 0 48 150C 042507 CCD CY284KOTP 3.8V 135 0 48 150C 150C 042507 042507 CCD CCD CY284KOTP CY284KOTP 3.8V 3.8V 135 135 0 0 48 48 5815 0 200 0 200 0 200 0 200 0 Summary for 'Technology' = C8 (19 detail records) FL28 150C MR044053 CCD CY22392FC 3.8V Summary for 'Technology' = FL28 (1 detail record) 48 P20 125C MR051058 DCD CY7C343-35JC 5.75V Summary for 'Technology' = P20 (1 detail record) 96 POWER165 125°C MR043088 MID CYK256K16MCCBU-70BVI 3.8V 288 0 96 125C MR044059 MID CYK512K16SCCAU-70BAI 4.5V 198 0 96 125C MR051083 MID K128K6C9BW 3.8 200 0 96 125C MR052047 MID CYK128K16MCCBU-55BVIT 3.8V 249 0 96 935 0 Summary for 'Technology' = POWER165 (4 detail records) PROMOS .17 125C 045001 MID U0166TFF7AZ-GBVI 2.1V 1238 0 96 125C 045001 MID U0166TFF7AZ-GBVI 2.1V 1251 0 96 125C MR044080 MID U01766TFF7AZ 2.36 300 0 96 125C MR044080 MID U01766TFF7AZ 2.36 150 0 72 2939 0 Summary for 'Technology' = PROMOS .17 (4 detail records) 2005 Q4 RELIABILITY REPORT Page 16 of 48 Product Reliability Cypress Technology Temp Eval Num Division Device Volt SS 125C 125C MR043076 MR043076 MID MID 125C MR052043 125C 125C Rej Hours CY62256LL-70SNI CY62256LL-70SNI 5.75V 5.75V 150 298 0 0 72 96 DCD CY7C09389V-9AC 3.8V 150 0 48 MR052043 DCD CY7C09389V-9AC 3.8V 50 0 48 MR052079 MID CY62256LL-70SNC 5.75V 200 0 96 125C MR053024 MID CG6521M 5.75V 196 0 96 150C 053007 DCD CY7C027V 3.8V 388 0 48 150C 053007 DCD CY7C027V 3.8V 1059 0 48 150C 053007 DCD CY7C027V 3.8V 366 0 48 150C 053407 MID CY62256LL 5.75V 849 0 48 150C 053407 MID CY62256LL 5.75V 850 0 48 150C 053407 MID CY62256LL 5.75V 846 0 48 150C MR053011 DCD CY7C038V-25AC 3.8V 150 0 48 150C MR053011 DCD CY7C038V-25AC 3.8V 0 48 FA Results R42 Summary for 'Technology' = R42 (14 detail records) 5552 0 R5 125C 040903 CCD 7C828437AC-RSPC 3.8V 260 0 96 125C 040903 CCD 7C828437AC-RSPC 3.8V 260 0 110 125C 040903 CCD 7C828437AC-RSPC 3.8V 182 0 96 125C 040903 CCD 7C828437AC-RSPC 3.8V 260 0 110 125C 040903 CCD 7C828437AC-RSPC 3.8V 38 0 96 125C 050303 CCD CY7C68000-56PVXC 3.8V 442 0 96 125C MR044060 MID CY62136VLL-55ZI 3.8V 50 0 96 125C MR044060 MID CY62136VLL-55ZI 3.8V 0 96 125C MR051054 MID CY7C1399B-12VC 3.8V 200 0 48 125C 125C MR051055 MR052024 MID MID CY7C1009B-15VC CY22392FC 3.8V 3.8V 200 300 0 0 48 48 125C MR052029 MID CY62136VLL-70ZI 3.8V 299 0 96 125C MR053007 MID CG6513AM 2.3V 200 0 48 125C MR053022 MID CY62136VLL-70ZXI 2.3V 298 0 96 125C MR053048 MID CY7C1399B-12VC 2.45 300 0 48 150C 041303 CCD 7C89000AC-RAZZC 2.875V 500 0 48 150C 041303 CCD 7C89000AC-RAZZC 2.875V 477 0 48 150C 041303 CCD 7C89000AC-RAZZC 2.875V 520 0 48 150C 043801 CCD 7C823C09AC-MSZI 3.8V 496 0 48 150C 043801 CCD 7C823C09AC-MSZI 3.8V 504 0 48 150C 045102 DCD CYDC256A16-55AXI 3.45V 178 0 48 150C 045102 DCD CYDC256A16-55AXI 3.45V 358 0 48 150C 045102 DCD CYDC256A16-55AXI 3.45V 628 0 48 150C 050303 CCD CY7C68000-56PVXC 3.8V 155 0 48 150C 050303 CCD CY7C68000-56PVXC 3.8V 429 0 48 150C 050303 CCD CY7C68000-56PVXC 3.8V 187 0 48 150C 050303 CCD CY7C68000-56PVXC 3.8V 458 0 48 150C 050303 CCD CY7C68000-56PVXC 3.8V 457 0 48 150C 051903 CCD CY221R28-ZXC 2.875V 500 0 48 150C 051903 CCD CY221R28-ZXC 2.875V 492 0 48 150C 051903 CCD CY221R28-ZXC 2.875V 500 0 48 2005 Q4 RELIABILITY REPORT Page 17 of 48 Product Reliability Cypress Technology Temp Eval Num Volt SS 150C 052103 Division Device DCD 7C02628AC-RAZI 3.45V 328 0 48 150C 052103 DCD 7C02628AC-RAZI 3.45V 330 0 48 150C 052103 DCD CYD256B16-55AXI 3.45V 330 0 48 150C 052103 DCD CYD256B16-55AXI 3.45V 328 0 48 150C 150C 052103 052103 DCD DCD 7C02628AC-RAZI CYD256B16-55AXI 3.45V 3.45V 332 332 0 0 48 48 150C MR044048 MID CY7C1329-100AC 3.8 200 0 48 150C MR044048 MID CY7C1329-100AC 3.8 200 0 48 150C MR044050 MID CY7C1021B-15ZI 3.8V 150 0 48 150C MR044050 MID CY7C1021B-15ZI 3.8V 50 0 48 150C MR044071 MID CY7C1021BV33L-10ZC 3.8V 200 0 48 150C MR044073 MID CY7C1021B-15ZC 3.8V 200 0 48 150C MR051030 MID CY7C1009B-15VC 3.8V 200 0 48 150C MR051042 MID CY7C1399B-12VC 3.8V 196 0 48 13504 0 114 0 48 Summary for 'Technology' = R5 (45 detail records) Rej Hours FA Results R7 125C 044102 DCD CY7C0832 2.3V 125C 044102 DCD CY7C0832 2.3V 61 0 48 125C 044102 DCD CY7C0832 2.3V 720 0 48 125C 044102 DCD CY7C0832 2.3V 101 0 48 125C 044102 DCD CY7C0832 2.3V 101 0 48 125C 044102 DCD CY7C0832 2.3V 114 0 48 125C 044102 DCD CY7C0832 2.3V 61 0 48 125C 044102 DCD CY7C0832 2.3V 720 0 48 125C 053206 MID CY7C1313V18 2.07V 295 0 96 125C 053206 MID CY7C1313V18 2.07V 1774 0 96 125C 053206 MID CY7C1313V18 2.07V 197 0 96 125C MR043078 MID CY62147CV30LL-70BAI 3.45V 300 0 96 125C MR044074 MID CY7C1061AV33-10ZC 2.45V 0 116 125C 125C MR044074 MR051060 MID MID CY7C1061AV33-10ZC CY7C1041CV33-12ZC 2.45V 2.3V 200 538 0 0 22 48 125C MR051061 MID CY7C1021CV33-12ZC 2.3V 673 0 48 125C MR051062 MID CY7C1021CV33-15ZC 2.3V 337 0 48 125C MR051063 MID CY7C1041CV33-15ZC 2.3V 269 0 48 125C MR051067 MID CY7C1021CV33-12ZC 2.3V 673 0 48 125C MR051074 MID CY62137CV30LL-55BVI 3.45V 999 0 96 125C MR051081 MID CY7C1041CV33-15ZC 2.3V 270 0 96 150C 050505 MID CY7C1360B 2.3V 3486 0 48 150C MR043064 MID CY7C1347F-133AC 2.3V 299 0 48 150C MR043064 MID CY7C1347F-133AC 2.3V 150 0 32 150C MR044049 MID CY7C1041CV33-12ZI 2.3V 150 0 32 150C MR044049 MID CY7C1041CV33-12ZI 2.3V 198 0 48 150C MR044049 MID CY7C1041CV33-12ZI 2.3V 150 0 420 150C MR044049 MID CY7C1041CV33-12ZI 2.3V 0 48 150C MR044072 MID CY7C1372CV25-167AC 2.3V 200 0 48 150C MR051025 MID CY7C1041CV33-10ZC 2.3V 200 0 48 150C MR051025 MID CY7C1041CV33-10ZC 2.3V 500 0 48 150C MR051048 MID CY7C1041CV33-10VC 2.3V 0 48 2005 Q4 RELIABILITY REPORT Page 18 of 48 Product Reliability Cypress Technology Temp Eval Num Volt SS 150C MR051048 Division Device MID CY7C1041CV33-10VC 2.3V 147 0 12 150C MR051053 MID CY7C1041CV33-15ZI 2.3V 400 0 48 150C MR051064 MID CY7C1021CV33-8ZC 2.3V 296 0 48 150C MR051068 MID CY7C1041CV33-15ZC 2.3V 269 0 48 150C MR051069 MID CY7C1021CV33-15ZC 2.3V 675 0 48 150C MR051070 MID CY7C1021CV33-15ZC 2.3V 675 0 48 150C MR051072 MID CY7C1021CV33-15Z 2.3V 675 0 48 150C 150C MR051073 MR051084 MID MID CY7C1021CV33-15ZXC CY7C1021CV33-8VC 2.3V 2.3V 645 60 0 0 48 48 150C MR052048 MID CY7C1049CV33-10VC 2.3V 330 0 48 150C MR052049 MID CY7C1021CV33-8VC 2.3V 316 0 48 150C MR052050 MID CY7C1021CV33-8VC 2.3V 799 0 48 150C MR052063 MID CY7C1041CV33-10ZC 2.3V 101 0 48 150C MR052081 MID CY7C1049CV33-12ZCT 2.3V 615 0 48 150C MR052091 MID CY7C1041CV33-15ZC 2.3V 493 0 48 150C MR052100 MID CY7C1021CV33-15ZC 2.3V 500 0 48 150C MR052102 MID CY7C1041CV33-10ZC 2.3V 598 0 48 150C MR053025 MID CY7C1021CV33-15VC 2.3V 200 0 48 150C MR053026 MID CY7C1021CV33-15VXC 2.3V 200 0 48 150C MR053062 MID CG5978AT 2.3V 8997 0 48 150C MR053063 MID CG5978AT 2.3V 2000 0 48 150C MR053064 MID CG5978AT 2.3V 5985 0 48 150C MR054045 MID CY7C1041CV33-10ZC 2.3V 3000 0 48 41826 0 Summary for 'Technology' = R7 (55 detail records) Rej Hours FA Results R8 125C 044304 MID CY62147DV30L 2.4V 683 0 96 125C 045103 MID 7C62157DC-RABVI 2.4V 2194 0 96 125C 045103 MID 7C62157DC-RABVI 2.4V 1510 0 96 125C 045103 MID 7C62157DC-RABVI 2.4V 254 0 96 125C 045103 MID 7C62157DC-RABVI 2.4V 1677 0 96 125C 054806 MID CY62167DV30 2.4V 1627 0 96 125C 054806 MID CY62167DV30 2.4V 1750 0 96 125C 125C 054806 MR043074 MID MID CY62167DV30 CY62157DV30L-45BVI 2.4V 2.4V 1490 150 0 0 96 72 125C MR051032 MID CY62147DV30LL-55BVI 2.4V 200 0 96 125C MR051044 MID CY62146DV30LL-70ZSXI 2.4V 198 0 96 150C MR051077 MID CY62128DV30LL-70SI 2.4V 195 0 48 150C MR052028 MID CY62128DV30LL-55ZI 2.4V 300 0 48 12228 0 Summary for 'Technology' = R8 (13 detail records) R9 125C 044201 MID CY7C1413AV18-200BZC 2.25V 265 0 96 125C 044201 MID CY7C1413AV18-200BZC 2.25V 1752 0 96 125C 044201 MID CY7C1413AV18-200BZC 2.25V 144 0 96 125C 044201 MID CY7C1413AV18-200BZC 2.25V 970 0 96 125C 051505 MID CY7C1312BV18-250BZC 2.25V 764 0 96 125C 051505 MID CY7C1312BV18-250BZC 2.25V 912 0 96 125C 051505 MID CY7C1312BV18-250BZC 2.25V 989 0 96 125C 051901 MID CY7C1512V18-250BZC 2.25V 1613 0 96 2005 Q4 RELIABILITY REPORT Page 19 of 48 Product Reliability Cypress Technology Temp Eval Num Volt SS 125C 054003 Division Device MID CY7C1514AC 2.25V 600 0 96 125C 054003 MID CY7C1513AC 2.25V 273 0 96 125C 054003 MID CYC15121AC 2.25V 1113 0 96 125C 054302 MID CY62147EV30* 1.85V 679 0 96 125C 054302 MID CY62147EV30* 1.85V 1711 0 96 125C 054302 MID CY62147EV30* 1.85V 4031 0 96 125C MR052054 MID CY7C1347G-133AXC 2.25V 200 0 48 125C MR052056 MID CY7C1347G-133AXC 2.25V 148 0 48 125C MR052057 MID CY7C1347G-133AXC 2.25V 200 0 48 125C 150C MR052058 044911 MID MID CY7C1347G-133AXC CY7C1360 2.25V 2.25V 199 2227 0 0 48 48 150C 044911 MID CY7C1360 2.25V 2369 0 48 150C 045003 MID 7C1370EC-RAZC 2.25V 1893 0 36 150C 045003 MID 7C1370EC-RAZC 2.25V 1618 0 48 150C 045003 MID 7C1370EC-RAZC 2.25V 1909 0 12 150C 045003 MID 7C1370EC-RAZC 2.25V 1576 0 48 150C 050902 MID CY7C1347G-166AXC 2.25V 1307 0 48 150C 050902 MID CY7C1347G-166AXC 2.25V 1305 0 48 150C 050902 MID CY7C1347G-166AXC 2.25V 4421 0 48 150C 051006 MID CY7C1347G 2.25V 1679 0 48 150C 051006 MID CY7C1470 2.25V 801 0 48 150C 051006 MID CY7C1347G 2.25V 1727 0 48 150C 051006 MID CY7C1347G 2.25V 3478 0 48 150C 051103 MID 7C1460BC-RAZCB 2.25V 442 0 48 150C 051103 MID 7C1460BC-RAZCB 2.25V 1903 0 48 150C 051103 MID 7C1460BC-RAZCB 2.25V 274 0 48 150C 052203 MID CY7C1370 2.25V 1285 0 48 150C 052203 MID CY7C1370 2.25V 1167 0 48 150C 052203 MID CY7C1370 2.25V 1076 0 48 150C 052206 MID CY7C1347G-166AXC 2.25V 1242 0 48 150C 052206 MID CY7C1347G-166AXC 2.25V 1480 0 48 150C 052206 MID CY7C1347G-166AXC 2.25V 1572 0 48 150C 052607 MID CY7C1339G 850 0 24 150C 052607 MID CY7C1339G 847 0 24 150C 052607 MID CY7C1339G 848 0 24 150C 150C 053405 053405 MID MID CY7C1360C CY7C1360C 2.25V 2.25V 2846 2851 0 0 48 48 150C 053405 MID CY7C1360C 2.25V 1281 0 48 150C 054801 MID CY7C1470V33 2.25 V 590 0 48 150C 054801 MID CY7C1470V33 2.25 V 1161 0 48 150C 054801 MID CY7C1470V33 2.25 V 705 0 48 150C MR052060 MID CY7C1327G-133AXC 0 199 0 48 150C MR053065 MID CY7C1370D-167AXI 2.3V 1846 0 48 150C MR053066 MID CY7C1370D-167AXI 2.3V 2732 0 48 150C MR053067 MID CY7C1370D-167AXI 2.3V 1070 0 48 71140 0 Summary for 'Technology' = R9 (53 detail records) 2005 Q4 RELIABILITY REPORT Rej Hours FA Results Page 20 of 48 Product Reliability Cypress Technology Temp Eval Num Division Device Volt SS 125C 042501 CCD 125C 044602 CCD 125C 044703 125C 125C Rej Hours CY8C21323-24PVXI 5.5V 1024 0 96 CY8C24494-24PVXI 5.5V 1008 0 96 CCD CY8C24423A-12PVXE 5.5V 653 0 12 044703 CCD CY8C24423A-12PVXE 5.5V 576 0 12 044703 CCD CY8C24423A-12PVXE 5.5V 852 0 12 125C 044703 CCD CY8C24423A-12PVXE 5.5V 859 0 12 125C 052004 CCD CY8C21234-24SXI 5.5V 1002 0 120 125C 053402 CCD CY8C27443-24PVXI 5.5V 1010 0 96 125C 053403 CCD CY8C24423A-24PVXI 5.5V 1004 0 96 125C 053603 CCD CY8C24794-24LFXI 5.5V 923 0 96 125C MR043075 CCD CY8C27443-24PVXI 5.5V 150 0 72 125C MR051040 CCD CY8C27443-24PXI 5.5V 185 0 96 125C MR052042 CCD CY22393ZXC-541 3.8V 300 0 48 125C 125C MR052082 MR052083 CCD CCD CY8C24223A-24PVXI CY8C26443-24PVI 5.5V 5.5V 200 149 0 0 96 96 125C MR053020 CCD CY22392ZXI-353 2.3V 270 0 48 150C 042806 CCD 7C80330AT-MSZC 3.8V 1010 0 48 150C 050507 CCD 7C84980AT-TZZC 3.8V 540 0 48 150C 050507 CCD 7C84980AT-TZZC 3.8V 496 0 48 150C MR051076 CCD CY22392ZC-366 3.8V 199 0 48 12410 0 FA Results S4 Summary for 'Technology' = S4 (20 detail records) STARM 110C MR044046 DCD CY7B923-400JC 5.75V 150 0 832 110C MR044046 DCD CY7B923-400JC 5.75V 150 0 72 110C MR044046 DCD CY7B923-400JC 5.75V 200 0 96 125C MR051034 DCD CY7B933-JC 6.5V 75 0 96 125C MR051034 DCD CY7B933-JC 6.5V 50 0 96 125C MR051034 DCD CY7B933-JC 6.5V 75 0 96 125C MR052076 DCD CY7B991-7JCT 6.6V 200 0 96 125C MR054023 CCD CY7B991-5JC 2.4V 100 0 96 125C MR054023 CCD CY7B991-5JC 2.4V 200 0 96 1200 0 Summary for 'Technology' = STARM (9 detail records) T013 125C 025107 DCD 7C71050AJ-GQFGC 1.38V 57 0 96 125C 025107 DCD 7C71050AJ-GQFGC 1.38V 5 0 48 125C 025107 DCD 7C71050AJ-GQFGC 1.38V 6 0 48 125C 025107 DCD 7C71050AJ-GQFGC 1.38V 17 0 48 125C 125C 025107 025107 DCD DCD 7C71050AJ-GQFGC 7C71050AJ-GQFGC 1.38V 1.38V 33 6 0 0 96 48 125C 025107 DCD 7C71050AJ-GQFGC 1.38V 17 0 48 125C 025107 DCD 7C71050AJ-GQFGCB 1.35V 144 0 96 125C 025107 DCD 7C71050AJ-GQFGCB 1.35V 72 0 96 125C 025107 DCD 7C71050AJ-GQFGCB 1.35V 135 0 96 125C 025107 DCD 7C71050AJ-GQFGCB 1.35V 62 0 96 125C 025107 DCD 7C71050BJ-GQFGC 1.35V 48 0 96 125C 025107 DCD 7C71050AJ-GQFGC 1.38V 5 0 48 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 50 0 12 2005 Q4 RELIABILITY REPORT Page 21 of 48 Product Reliability Cypress Technology Temp Eval Num Volt SS 125C 041401 Division Device DCD 7C71050BJ-GQFGC 1.35V 20 0 12 125C 041401 DCD 7C71050BJ-GQFGCB 1.35V 176 0 96 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 49 0 48 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 50 0 12 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 20 0 24 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 50 0 24 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 28 0 96 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 20 0 48 125C 041401 DCD 7C71050BJ-GQFGC 1.35V 20 0 12 125C 044108 DCD 7C71051CJ-GQFGCB 1.35V 31 0 96 125C 044108 DCD 7C71051CJ-GQFGCB 1.35V 27 0 96 125C 044108 DCD 7C71051CJ-GQFGCB 1.35V 28 0 96 125C 044108 DCD 7C71051CJ-GQFGCB 1.35V 36 0 96 1212 0 1912 1865 0 0 96 96 Summary for 'Technology' = T013 (27 detail records) Rej Hours FA Results TOWER 165 125C 125C 051502 051502 MID MID CYK512K16SCCAU CYK512K16SCCAU 125C 051502 MID CYK512K16SCCAU 1944 0 96 125C 052102 MID CYK128K16MCCBU-70BVIT 3.8V 1499 0 96 125C 052102 MID CYK128K16MCCBU-70BVIT 3.8V 1498 0 96 125C 052102 MID CYK128K16MCCBU-70BVIT 3.8V 1499 0 96 125C 052102 MID CYK128K16MCCBU-70BVIT 3.8V 1000 0 96 125C 052102 MID CYK128K16MCCBU-70BVIT 3.8V 1000 0 96 125C 052102 MID CYK128K16MCCBU-70BVIT 3.8V 1000 0 96 13217 0 Summary for 'Technology' = TOWER 165 (9 detail records) TSMC 150 125C 044101 DCD CYNSE70129D 2.1V 551 0 96 125C 044101 DCD CYNSE70129D 2.1V 551 0 96 1102 0 Summary for 'Technology' = TSMC 150 (2 detail records) TSMC 180 125C 034001 DCD 7C72250BJ-GQFGCB 1.38V 181 0 96 125C 034001 DCD 7C72250BJ-GQFGC 1.38V 129 0 96 125C 034001 DCD 7C72220BJ-GQFGCB 1.38V 127 0 96 125C 034001 DCD 7C72250AJ-GQFGC 1.8V 143 0 96 125C 034002 DCD 7C72220AJ-GQFGC 1.8V 0 96 125C 043305 DCD CYNSE70128 1.725 395 0 96 125C 043305 DCD CYNSE70128 1.725 549 0 96 125C 043305 DCD CYNSE70128 1.725 346 0 96 125C 044108 DCD CYNSE10512A 1.35V 70 0 96 125C 125C 044108 044108 DCD DCD CYNSE10512A CYNSE10512A 1.35V 1.35V 85 144 0 0 96 96 125C 044108 DCD CYNSE10512A 1.35V 32 0 96 125C 044108 DCD CYNSE10512A 1.35V 130 0 96 2331 0 186011 0 Summary for 'Technology' = TSMC 180 (13 detail records) Grand Total 2005 Q4 RELIABILITY REPORT Page 22 of 48 Product Reliability Cypress Summary Detail -- LFR Performance Technology B53 Temp Eval Num 125C MR044075 Division Family DCD TDP CY7B993V-5AC 4.0V 200 0 832 TDP CY7B993V-5AC 4.0V 200 400 0 0 168 125C MR044075 DCD Summary for 'Technology' = B53 (2 detail records) Device Volt SS Reject Duration FA Results C8 125C 033805 CCD USB 7C682001AC-RAC 3.8V 200 0 168 125C 033805 CCD USB 7C682005AC-RSP 3.8V 208 0 928 125C 033805 CCD USB 7C682005AC-RSP 3.8V 208 0 72 125C 042106 CCD 7C87740A 2.35 150 0 832 125C 042106 CCD 7C682001AC-RAC 3.8V 200 0 168 125C 042106 CCD 7C87741A 2.35 253 0 1000 125C 042106 CCD 7C82877A 2.35 123 0 168 125C 042106 CCD 7C87740A 2.35 150 0 168 CY284KOTP 3.8V 135 1627 0 0 110 CY22392FC 3.8V 200 200 0 0 420 CY7C343-35JC 5.75 150 0 168 CY7C343-35JC 5.75 150 300 0 0 832 SPDRM CYK128K16MCCB 0 150 0 332 125C MR052047 MID SPDRM Summary for 'Technology' = POWER165 (2 detail records) CYK128K16MCCB 0 150 300 0 0 168 SPDRM U01766TFF7AZ 2.36 150 0 832 125 MR044080 MID SPDRM Summary for 'Technology' = PROMOS .17 (2 detail records) U01766TFF7AZ 2.36 150 300 0 0 168 USB TDP 150C 042507 CCD Summary for 'Technology' = C8 (9 detail records) FL28 150C MR044053 CCD Summary for 'Technology' = FL28 (1 detail record) CPLD P20 125C MR051058 DCD 125C MR051058 DCD Summary for 'Technology' = P20 (2 detail records) POWER165 125C MR052047 MID PROMOS .17 125 MR044080 MID R42 125 MR043076 MID MPWR CY62256LL-70SNI 5.75 150 0 168 125 MR043076 MID MPWR CY62256LL-70SNI 5.75 150 0 832 125 MR053034 MID MPWR CG6520AM 5.25 147 0 832 125 MR053034 MID MPWR CG6520AM 5.25 150 0 168 125C MR052043 DCD - CY7C09389V-9AC 3.8V 150 0 420 125C MR052043 DCD - CY7C09389V-9AC 3.8V 150 0 80 125C MR052079 MID MPWR CY62256LL-70SNC 5.75 150 0 168 125C MR052079 MID MPWR CY62256LL-70SNC 5.75 148 0 832 125C MR053011 DCD SPCM CY7C038V-25AC 3.8V 150 0 80 125C MR053011 DCD SPCM CY7C038V-25AC 3.8V 150 0 420 125C MR053024 MID MPWR CG6521M 5.75 150 0 168 125C MR053024 MID MPWR CG6521M 5.75 150 0 832 2005 Q4 RELIABILITY REPORT Page 23 of 48 Product Reliability Cypress Technology Temp Division Family 150C 053407 Eval Num MID MPWR CY62256LL 5.75 125 0 500 150C 053407 MID MPWR CY62256LL 5.75 125 0 500 MPWR CY62256LL 5.75 125 2170 0 0 500 150C 053407 MID Summary for 'Technology' = R42 (15 detail records) Device Volt SS Reject Duration FA Results R5 125C MR044048 MID SYNC CY7C1329-100AC 3.8V 200 0 48 125C MR044048 MID SYNC CY7C1329-100AC 3.8V 200 0 48 125C MR051054 MID FAST CY7C1399B-12VC 3.8V 150 0 80 125C MR051054 MID FAST CY7C1399B-12VC 3.8V 150 0 420 125C MR051055 MID FAST CY7C1009B-15VC 3.8V 150 0 80 125C MR051055 MID FAST CY7C1009B-15VC 3.8V 150 0 420 125C MR052024 MID FAST CY22392FC 3.8V 150 0 90 125C MR052029 MID MPWR CY62136VLL-70ZI 3.8V 150 0 832 125C MR052029 MID MPWR CY62136VLL-70ZI 3.8V 150 0 168 125C MR053007 MID FAST CG6513AM 2.3V 150 0 80 125C MR053022 MID MPWR CY62136VLL-70ZXI 2.3V 150 0 168 125C MR053048 MID FAST CY7C1399B-12VC 2.45 150 0 32 150 MR044050 MID FAST CY7C1021B-15ZI 3.8V 149 0 420 150 MR044050 MID FAST CY7C1021B-15ZI 3.8V 150 0 80 150C 041303 CCD PTG 7C89000AC-RAZZ 2.87 119 0 278 150C 041303 CCD PTG 7C89000AC-RAZZ 2.87 120 0 80 150C 043801 CCD TDP 7C823C09AC-MSZI 3.8V 120 0 80 150C 043801 CCD TDP 7C823C09AC-MSZI 3.8V 120 0 420 150C 045102 DCD SPCM CYDC256A16-55A 3.45 120 0 420 150C 045102 DCD SPCM CYDC256A16-55A 3.45 120 0 80 150C 050303 CCD PCD CY7C68000-56PVX 3.8V 116 0 80 150C 050303 CCD PCD CY7C68000-56PVX 3.8V 116 0 80 150C 051903 CCD GPCLK CY221R28-ZXC 2.87 116 0 80 150C 051903 CCD GPCLK CY221R28-ZXC 2.87 116 0 420 150C 051903 CCD GPCLK CY221R28-ZXC 2.87 116 0 420 150C 051903 CCD GPCLK CY221R28-ZXC 2.87 116 0 80 150C 052103 DCD DCD CYD256B16-55AXI 3.45 119 0 420 150C 052103 DCD DCD CYD256B16-55AXI 3.45 120 0 80 150C MR044071 MID FAST CY7C1021BV33L-1 3.8V 150 0 80 150C MR044071 MID FAST CY7C1021BV33L-1 3.8V 150 0 420 150C MR044073 MID FAST CY7C1021B-15ZC 3.8V 150 0 420 150C MR044073 MID FAST CY7C1021B-15ZC 3.8V 150 0 80 150C MR051030 MID FAST CY7C1009B-15VC 3.8V 150 0 420 150C MR051030 MID FAST CY7C1009B-15VC 3.8V 150 0 80 150C MR051042 MID FAST CY7C1399B-12VC 3.8V 150 0 404 FAST CY7C1399B-12VC 3.8V 150 5053 0 0 96 150C MR051042 MID Summary for 'Technology' = R5 (36 detail records) R7 MR044072 MID SYNC CY7C1372CV25-16 2.3V 200 0 80 125C MR043078 MID MPWR CY62147CV30LL-7 3.45 150 0 181 125C MR043078 MID MPWR CY62147CV30LL-7 3.45 150 0 819 2005 Q4 RELIABILITY REPORT Page 24 of 48 Product Reliability Cypress Technology Temp Division Family 125C MR044074 Eval Num MID FAST 125C MR051061 MID 125C MR051061 MID 150 MR043064 MID 150 MR051025 MID 150 SYNC Device Volt SS Reject Duration CY7C1061AV33-10 2.45 150 0 179 CY7C1021CV33-12 2.3V 150 0 420 CY7C1021CV33-12 2.3V 150 0 80 CY7C1347F-133A 2.3V 150 0 80 CY7C1041CV33-10 2.3V 150 0 420 80 MR051025 MID CY7C1041CV33-10 2.3V 150 0 150C MR044049 MID FAST CY7C1041CV33-12 2.3V 150 0 32 150C MR044049 MID FAST CY7C1041CV33-12 2.3V 150 0 420 150C MR044049 MID FAST CY7C1041CV33-12 2.3V 198 0 48 150C MR051025 MID CY7C1041CV33-10 2.3V 150 0 80 150C MR051025 MID CY7C1041CV33-10 2.3V 150 0 420 150C MR051062 MID CY7C1021CV33-15 2.3V 150 0 420 150C MR051062 MID CY7C1021CV33-15 2.3V 150 0 80 150C MR051067 MID FAST CY7C1021CV33-12 2.3V 150 0 80 150C MR052048 MID FAST CY7C1049CV33-10 2.3V 150 0 80 150C MR052049 MID - CY7C1021CV33-8 2.3V 150 0 411 150C MR052049 MID - CY7C1021CV33-8 2.3V 150 0 89 150C MR052050 MID CY7C1021CV33-8 2.3V 150 0 411 150C MR052050 MID CY7C1021CV33-8 2.3V 150 0 89 150C MR053025 MID FAST CY7C1021CV33-15 2.3V 150 0 80 150C MR053025 MID FAST CY7C1021CV33-15 2.3V 150 0 420 150C MR053026 MID FAST CY7C1021CV33-15 2.3V 150 0 420 FAST CY7C1021CV33-15 2.3V 150 3998 0 0 80 150C MR053026 MID Summary for 'Technology' = R7 (26 detail records) FA Results R8 125 MR043074 MID MPWR CY62157DV30L-45 2.4V 150 0 808 125 MR043074 MID MPWR CY62157DV30L-45 2.4V 150 0 192 125 MR043074 MID MPWR CY62157DV30L-45 2.4V 150 0 168 125 MR043074 MID MPWR CY62157DV30L-45 2.4V 150 0 832 125 MR051080 MID - CY62157DV30LL-7 2.4V 150 0 168 125C MR051032 MID MPWR CY62147DV30LL-5 2.4V 150 0 832 125C MR051032 MID MPWR CY62147DV30LL-5 2.4V 150 0 168 125C MR051044 MID MPWR CY62146DV30LL-7 2.4V 150 0 168 150 MR051077 MID - CY62128DV30LL-7 2.4V 150 0 420 150 MR051077 MID - CY62128DV30LL-7 2.4V 150 0 80 MPWR CY62128DV30LL-5 2.4V 148 1648 0 0 420 150C MR052028 MID Summary for 'Technology' = R8 (11 detail records) R9 125C MR052056 MID SYNC CY7C1347G-133AX 2.3V 146 0 408 125C MR052058 MID SYNC CY7C1347G-133AX 2.45 147 0 420 150C 051103 MID SYNC 7C1460BC-RAZCB 2.25 272 0 332 150C 051103 MID SYNC 7C1460BC-RAZCB 2.25 437 0 332 150C 051103 MID SYNC 7C1460BC-RAZCB 2.25 442 0 168 150C 051103 MID SYNC 7C1460BC-RAZCB 2.25 400 0 168 150C 051103 MID SYNC 7C1460BC-RAZCB 2.25 398 0 332 150C 051103 MID SYNC 7C1460BC-RAZCB 2.25 274 0 168 2005 Q4 RELIABILITY REPORT Page 25 of 48 Product Reliability Cypress Technology Temp Division Family 150C 052203 Eval Num MID SYNC CY7C1370 150C 052607 MID SYNC CY7C1339G 150C 054302 MID MPWR CY62147 150C 054302 MID MPWR CY62147EV30* 150C 054302 MID MPWR 150C 054302 MID 150C 054302 MID 150C 054801 MID Summary for 'Technology' = R9 (16 detail records) Device Volt 2.25 SS Reject Duration 948 0 500 50 0 408 1.85 400 0 420 1.85 400 0 80 CY62147EV30* 1.85 400 0 80 MPWR CY62147 1.85 400 0 80 MPWR CY62147EV30* 1.85 400 0 420 SYNC CY7C1470V33 2.25 394 5908 0 0 80 FA Results S4 CCD CMS CY8C27443-24PVX 5.5V 150 0 168 125C 052004 125 MR043075 CCD PSOC CY8C21234-24SXI 5.5V 235 0 630 125C 052004 CCD PSOC CY8C21234-24SXI 5.5V 235 0 120 125C 052004 CCD PSOC CY8C21234-24SXI 5.5V 235 0 630 125C 052004 CCD PSOC CY8C21234-24SXI 5.5V 235 0 120 125C 052004 CCD PSOC CY8C21234-24SXI 5.5V 235 0 750 125C MR051040 CCD PSOC CY8C27443-24PXI 5.5V 185 0 168 125C MR051040 CCD PSOC CY8C27443-24PXI 5.5V 185 0 832 125C MR052042 CCD - CY22393ZXC-541 3.8V 150 0 402 125C MR052042 CCD - CY22393ZXC-541 3.8V 150 0 98 125C MR052082 CCD PSOC CY8C24223A-24PV 5.5V 143 0 168 125C MR052082 CCD PSOC CY8C24223A-24PV 5.5V 143 0 832 125C MR052083 CCD PSOC CY8C26443-24PVI 5.5V 149 0 168 125C MR053020 CCD GPCLK CY22392ZXI-353 2.3V 150 0 420 150 MR051076 CCD - CY22392ZC-366 3.8V 150 0 420 150 MR051076 CCD - CY22392ZC-366 3.8V 150 0 80 150C 042806 CCD PTG 7C80330AT-MSZC 3.8V 130 0 80 150C 042806 CCD PTG 7C80330AT-MSZC 3.8V 129 0 420 150C 050507 CCD GPCLK 7C84980AT-TZZC 3.8V 120 0 420 GPCLK 7C84980AT-TZZC 3.8V 120 3379 0 0 80 150C 050507 CCD Summary for 'Technology' = S4 (20 detail records) STARM 110 MR044046 DCD COM CY7B923-400JC 5.75 150 0 72 110 COM CY7B923-400JC 5.75 150 0 832 CY7B933-JC 6.5V 75 0 832 MR044046 DCD 125C MR051034 DCD 125C MR051034 DCD COM CY7B933-JC 6.5V 75 0 832 125C MR051034 DCD COM CY7B933-JC 6.5V 75 0 168 125C MR051034 DCD CY7B933-JC 6.5V 75 0 168 125C MR052076 DCD CY7B991-7JCT 6.6V 149 0 832 125C MR052076 DCD 125C MR054023 CCD CY7B991-7JCT 6.6V 149 0 168 GPCLK CY7B991-5JC 2.4V 200 0 168 125C MR054023 CCD GPCLK Summary for 'Technology' = STARM (10 detail records) CY7B991-5JC 2.4V 200 1298 0 0 832 T013 125C 025107 DCD NPS 7C71050AJ-GQFG 1.35 52 0 632 125C 025107 DCD NPS 7C71050AJ-GQFG 1.35 165 0 168 125C 025107 DCD NPS 7C71050AJ-GQFG 1.35 52 0 200 2005 Q4 RELIABILITY REPORT Page 26 of 48 Product Reliability Cypress Technology Temp Division Family 125C 025107 Eval Num DCD NPS 7C71050AJ-GQFG 1.38 23 0 168 125C 025107 DCD NPS 7C71050BJ-GQFG 1.35 122 0 168 125C 025107 DCD NPS 7C71050BJ-GQFG 1.35 119 0 832 125C 025107 DCD NPS 7C71050AJ-GQFG 1.38 23 0 168 125C 025107 DCD NPS 7C71050AJ-GQFG 1.35 52 0 168 125C 025107 DCD NPS 7C71050AJ-GQFG 1.38 22 0 500 125C 034001 DCD NPS 7C72250BJ-GQFG 1.38 46 0 168 125C 034001 DCD NPS 7C72250BJ-GQFG 1.38 43 0 500 125C 041401 DCD NPS 7C71050BJ-GQFG 1.35 20 0 168 125C 041401 DCD NPS 7C71050BJ-GQFG 1.35 28 0 168 125C 041401 DCD NPS 7C71050BJ-GQFG 1.35 20 0 632 125C 041401 DCD NPS 7C71050BJ-GQFG 1.35 28 0 40 125C 041401 DCD NPS 7C71050BJ-GQFG 1.35 20 0 200 125C 041401 DCD NPS 7C71050BJ-GQFG 1.35 28 0 792 125C 044701 DCD NPS 7C71050AJ-GQFG 1.35 66 0 476 NPS 7C71050AJ-GQFG 1.35 69 998 0 0 168 125C 034001 DCD NPS Summary for 'Technology' = TSMC 180 (1 detail record) 7C72250AJ-GQFG 1.8V 141 141 0 0 487 27720 0 125C 044701 DCD Summary for 'Technology' = T013 (19 detail records) Device Volt SS Reject Duration FA Results TSMC 180 Grand Total 2005 Q4 RELIABILITY REPORT Page 27 of 48 Product Reliability Cypress Summary Detail, Package -- HAST Performance BldKit Loc EvalNum A100RKGAB R-CML 044603 A100SEGAGL R-CML MR053027 A100SFAGE R-CML A100SGAGE A128SAGLL Device SS Rej CY7C1339B-133AI 44 0 CY7C9689A-AC 41 0 MR052002 CY7C0241-25AC 48 0 R-CML MR044045 CS6247AS 48 0 R-CML 050801 CY7C1019CV33-15VC 39 0 A32AXGAGE SI-SIGNETI MR043085 CY29947AC 46 0 A52ASGAGE Q-KOREA MR044009 CY7B9973V-AC FA Results TQFP Summary for 'Family' = A (7 detail records) 50 0 316 0 TQFP (10x10) AS64CGAGB Q-KOREA MR053050 CY7C4275V-15ASC 50 0 AS6513GAGB G-TAIWAN MR052089 CY7C4215V-15ASC 46 0 96 0 28 0 Summary for 'Family' = AS (2 detail records) TQFP (Thermal) AT120AHAGE L-SEOL 041701 CYS25G0101DX-ATC AT120AHAGE L-SEOL 041701 CYS25G0101DX-ATC Summary for 'Family' = AT (2 detail records) 3 0 31 0 TQFP (Pb-Free) AZ100RIALL R-CML 053103 CY7C1370 49 0 AZ100RSLL AZ100RSLL R-CML R-CML 053103 053103 CY7C1360C CY7C1470A 48 49 0 0 AZ100SEGL R-CML MR051024 CY8C29866-24AXI 46 0 AZ100SGAL R-CML 053007 CY7C027V 49 0 AZ52ASGAL Q-KOREA 051902 CY7B9945V-5AXCT Summary for 'Family' = AZ (6 detail records) 50 0 291 0 FBGA (0.75-0.8) BA48AUALE RA-CML MR052085 CY7C1021BV33L-15BAI 12 0 BA48DCALE G-TAIWAN 045109 CY7C1061AV33-10BGI 45 0 BA48DJALE G-TAIWAN 045101 7C62172DC-GBAI 45 0 BA48DJALE G-TAIWAN 052502 CY62177DV30L 45 0 147 0 Summary for 'Family' = BA (4 detail records) PBGA (Cavity/Heatsink, Pb-Free) BJ504AAGL G-TAIWAN 044507 CY7C9536B-BLXC 11 0 BJ504AAGL G-TAIWAN 044507 CY7C9536B-BLXC 39 0 BJ504AAGL G-TAIWAN 044507 CY7C9536B-BLXC 20 0 BJ504AAGL G-TAIWAN 044507 CY7C9536B-BLXC 28 0 98 0 Summary for 'Family' = BJ (4 detail records) 2005 Q4 RELIABILITY REPORT Page 28 of 48 Product Reliability Cypress BldKit Loc EvalNum Device SS Rej FA Results FVBGA (0.75-0.8, 0.3mm) BV48HAALE G-TAIWAN MR051014 CY62147CV33LL-70BVI 45 0 BV48VAALE G-TAIWAN MR052084 CY62137CV30LL-70BVIT 20 0 65 0 Summary for 'Family' = BV (2 detail records) PLCC J32RBGAGB X-THALND MR051031 CY7B991-2JC 50 0 J32RBGAGB X-THALND MR052018 CY7B991-5JC 50 0 J32RBGAGB X-THALND MR053042 CY7B991-5JI 50 0 J32RNGAGE M-PHIL MR053031 CY7C4271V-25JC 50 0 J52SFGAGB M-PHIL MR051036 CY7C136-25JC 50 0 250 0 Summary for 'Family' = J (5 detail records) QFN (Punch Type) LF56AGAGE L-SEOL MR044081 CY7C65640A-LFC 44 0 LF56AGAGE L-SEOL MR051075 CY7C65640A-LFC 43 0 LF56EGAGE AC-ASE 054207 CY7C65640-LFC 45 0 132 0 Summary for 'Family' = LF (3 detail records) QFN (Punch Type, Pb-Free) LY32BGAGL RA-CML 052610 CY8C21434-24LFXI 47 0 LY56DGAGL L-SEOL MR051046 CP6241AM 45 0 LY56DGAGL L-SEOL MR053010 CY8C24794-24LFXI 49 0 LY56FGALL RA-CML 050303 CY7C109B-20VCT 40 0 LY56FGALL RA-CML 050303 CY7C65640-LFXC 17 0 LY56FGALL RA-CML 050303 CY7C65640-LFXC 28 0 LY72AGAGL L-SEOL 054206 CY28447LF-XC 48 0 274 0 Summary for 'Family' = LY (7 detail records) SSOP O2023GAGB T-TAIWAN MR044062 CY8C26233-24PVI 49 0 O2824GAGB O5615GAGB T-TAIWAN T-TAIWAN MR043059 MR053016 CY28400OC CY28419OC 49 26 0 0 O563AXAGB R-CML MR053029 CY28346OC 32 0 O563BXAGE R-CML MR051021 CP6221BM Summary for 'Family' = O (5 detail records) 40 0 196 0 PDIP P203CGAGB O-INDNS MR053013 CY7C168A-35PC 45 0 P243FGAGE M-PHIL MR052025 CY7C194-25PC 46 0 P2839GAGB X-THALND MR052061 CY7C466A-10PTC 50 0 P283EGAGE O-INDNS MR051001 CY8C26443-24PI 44 0 P286EGAGB O-INDNS MR054044 CY62256LL-70PC Summary for 'Family' = P (5 detail records) 50 0 235 0 PDIP (Pb-Free) PZ183AAGN O-INDNS MR052015 CY7C63231A-PXC 44 0 PZ243AAGN X-THALND 051206 CY7C63743-PXC 48 0 2005 Q4 RELIABILITY REPORT Page 29 of 48 Product Reliability Cypress BldKit Loc EvalNum PZ2831GAN O-INDNS MR053014 Device CY7C64013A-PXC Summary for 'Family' = PZ (3 detail records) SS Rej 45 0 137 0 FA Results SOIC (GullWing) S0815PAGN RA-CML MR044055 CY2410SC-1 42 0 S0815PAGN RA-CML MR051018 CY2305SC-1H 46 0 S1615DAAGB M-PHIL MR051027 CY2292F 48 0 S1615EAGB M-PHIL MR052037 CY2309SC-1H 48 0 S1615EAGB M-PHIL MR053002 CY2309SC-1H 41 0 S183CGAGN RA-CML NR051009 CY7C63723-SC 49 S24314AGL RA-CML MR044028 S283HGAGB O-INDNS MR052073 CY7B933-SC 50 0 S283HGAGB O-INDNS MR053043 CY8C24423-24SI 50 0 S324513GN R-CML MR052036 CY62128BLL-70SC 50 0 S324513GN R-CML MR053003 CY6525AM 50 0 S324513GN R-CML MR054036 CY62128BLL-55SC 45 0 569 0 CP6124AM Summary for 'Family' = S (12 detail records) 50 0 0 SOIC (GullWing, 450 footprint) SN2831AHB R-CML MR044008 CY62256LL-70SNC 45 0 SN2831AHN R-CML MR051008 CY62256LL-70SNC 50 0 SN2831AHN R-CML MR052013 CY62256L-70SNC 50 0 SN2831AHN R-CML MR053037 CY62256L-70SNC Summary for 'Family' = SN (4 detail records) 46 0 191 0 SSOP (Pb-Free) SP2824CAN T-TAIWAN 053005 CY28400OXC 48 0 SP483FAGN RA-CML MR044007 CY28405OXC 44 0 SP563AAGN R-CML MR053021 CY28410OXC 13 0 SP563AAGN R-CML MR053021 CY28410OXC 35 0 SP563BAGL R-CML 042101 CY7C68300B-56PVXC 50 0 SP563BAGL R-CML 042101 CY7C68300B-56PVXC 50 0 SP563CAGE T-TAIWAN 053502 CY7C66113A-PVXC Summary for 'Family' = SP (7 detail records) 50 0 290 0 SOIC (GullWing, 450 footprint, Pb-Free) SY2831AHN R-CML MR044002 CY62256LL-70SNXC 50 0 SY2831AHN R-CML MR052010 CY62256L-70SNXC 49 0 SY2831AHN R-CML MR053036 CY62256LL-70SNXI 45 0 SY2831AHN R-CML 053407 CY62256LL 52 0 SY2831AHN R-CML 053407 CY62256LL 45 0 SY2831AHN R-CML 053407 CY62256LL 33 0 SY2831AHN R-CML 053407 CY62256LL 85 0 SY2831AHN R-CML 053407 CY62256LL 32 0 391 0 Summary for 'Family' = SY (8 detail records) 2005 Q4 RELIABILITY REPORT Page 30 of 48 Product Reliability Cypress BldKit Loc EvalNum Device SS Rej FA Results SOIC (GullWing, Pb-Free) SZ1615DGN M-PHIL 052004 CY8C21234-24SXI 44 0 SZ1615DGN M-PHIL 052004 CY8C21234-24SXI 44 0 SZ1615EGN M-PHIL MR051029 CY2308SXC-1H 48 0 SZ1615EGN M-PHIL MR052046 CY2309SXC-1H 47 0 SZ1615KGN RA-CML MR051016 CY2309SXC-1H 47 0 SZ183AGAN M-PHIL 044301 CY7C63723-SXC 50 0 SZ183AGAN M-PHIL 044301 CY7C63723-SXC 49 0 SZ28327GL R-CML 054604 CY7C65113C-SXC 49 0 SZ324510GL R-CML MR051022 CY62128BLL-70SXI 50 0 SZ324514L R-CML MR044005 CY62148DV30LL-70SXI 25 0 453 0 Summary for 'Family' = SZ (10 detail records) SOIC (J lead) V284CGAGB O-INDNS MR043030 CY7C107B-20VC 45 0 V28CGAGB V3233GALN O-INDNS R-CML MR044064 054809 CY7C106B-20VC CY7C188 50 48 0 0 V32419GLL R-CML MR043012 CY7C1019CV33-10VC 50 0 V324EGAGB O-INDNS MR052014 CY7C1019B-10VC 44 0 V324FGAGB O-INDNS MR053015 CY7C109B-20VC 44 0 V3646GALE R-CML MR043065 CY7C1049CV33-12VC 49 0 V444WGALE R-CML MR044022 CY7C1021B-15VC 19 0 V444WGALE R-CML MR044022 CY7C1021B-15VC 24 0 V444WGALL R-CML MR052019 CY7C1021B-12VI 50 0 V444YAALE R-CML MR051015 CY7C1041CV33-12VC 49 0 V444ZGALL R-CML MR053004 CY7C1021CV33 50 0 V444ZGALL R-CML MR054001 CY7C1021CV33-15VC 45 0 567 0 Summary for 'Family' = V (13 detail records) SOIC (J lead, Pb-Free) VZ243GGBLL O-INDNS 052801 CY7C197 50 0 VZ243GGBLL O-INDNS 052801 CY7C197 50 0 VZ32418LL R-CML 054008 CY7C109B 45 0 VZ3644GALL R-CML MR053038 CY7C1049B-20VXI 46 0 VZ444WAGL R-CML MR052001 CY7C1021B-15VXC 50 0 VZ444ZAGL R-CML MR043067 CY7C1021CV33-12VXC 50 0 291 0 Summary for 'Family' = VZ (6 detail records) TSOP/ TSSOP Z1613GAGB T-TAIWAN MR051011 CY2309ZI-1H 45 0 Z1613GAGB T-TAIWAN MR052039 CY2308ZC-1H 45 0 Z1619GAGN Z1619GAGN RA-CML R-CML MR052027 MR054006 CY22392ZC-366 CY2308ZC-1H 47 50 0 0 Z4824BGAN R-CML MR043087 CY28339ZC 50 0 Z5624BAGN R-CML MR043004 CY28409ZC 22 0 Z5624BAGN R-CML MR044015 CY28346ZC 45 0 Z5624BAGN R-CML MR051050 CY28346ZI-2T 49 0 2005 Q4 RELIABILITY REPORT Page 31 of 48 Product Reliability Cypress BldKit Loc EvalNum SS Rej Z5624BAGN R-CML MR052012 Device CY28409ZC 48 0 Z5624BAGN R-CML MR053046 CY28409ZC 48 0 449 0 Summary for 'Family' = Z (10 detail records) FA Results TSOP I ZA32RHAALB R-CML MR051012 CY62128DV30LL-55ZAI 50 0 ZA32RHAALB R-CML MR052020 CY62128DV30LL-55ZAI 48 0 ZA32RHAALB R-CML MR053056 CY62128DV30LL-55ZAI Summary for 'Family' = ZA (3 detail records) 46 0 144 0 TSOP (Reverse) ZR28R2AGB R-CML MR044018 CY62256LL-70ZRI 30 0 ZR28R2AGN R-CML MR053049 CY62256LL-70ZRI 39 0 69 0 Summary for 'Family' = ZR (2 detail records) TSOP II ZS324CA3E T-TAIWAN MR044070 CY7C1019B-12ZC 44 0 ZS324FAGE T-TAIWAN MR051037 CY7C1019CV33-12ZC 50 0 ZS324FAGE T-TAIWAN MR052009 CY7C1019CV33-12ZC 48 0 ZS324FAGE T-TAIWAN MR053055 CY7C1019CV33-12ZC 48 0 ZS444ABALE R-CML MR053058 CS6125AT 44 ZS444ABALL R-CML MR051010 ZS444AJALN R-CML MR054008 CY7C1021CV33-15ZC 45 0 ZS444YAGL R-CML 053007 CY7C1041B-15ZC 50 0 ZS544AALE G-TAIWAN MR044031 CY7C1069AV33-12ZC CY7C1021CV33-15ZC Summary for 'Family' = ZS (9 detail records) 45 0 0 32 0 406 0 TSOP (Pb-Free) ZT32RKGGL T-TAIWAN MR052044 CY7C109B-15ZXC 48 0 ZT32RYAGL T-TAIWAN MR051079 CY2308SC-1 49 0 97 0 Summary for 'Family' = ZT (2 detail records) TSOP II (Pb-Free) ZW444ADALL R-CML MR052003 CY7C1041CV33-15ZXC 45 0 ZW444AFLL R-CML 054302 CY62137EV30* 45 0 ZW444AFLL R-CML 054302 CY62147EV30* 45 0 ZW444NAGN R-CML MR051047 CY62126DV30LL-55ZXI 45 0 ZW444RAGN R-CML 053102 CY62137VLL-ZSXE 49 0 ZW444VAGL R-CML MR053033 CY7C1021B-15ZXI 47 0 ZW444VAGL R-CML MR054003 CY7C1021B-15ZXC 50 0 ZW544AALL G-TAIWAN MR054015 CY7C1061AV33-12ZXC Summary for 'Family' = ZW (8 detail records) 46 0 372 0 47 0 47 0 TSOP (Reverse, Pb-Free) ZY28R2AGN R-CML Summary for 'Family' = ZY (1 detail record) 2005 Q4 RELIABILITY REPORT MR053057 CY62256LL-70ZRXI Page 32 of 48 Product Reliability Cypress BldKit Loc EvalNum ZZ0812AGL T-TAIWAN MR043048 ZZ1613GAN T-TAIWAN MR052077 ZZ2411AGN T-TAIWAN ZZ2411AGN ZZ2415GAL Device SS Rej CY25104ZXC-2 44 0 CY2309ZXI-1H 48 0 MR043066 CY22313ZXC 50 0 T-TAIWAN MR051051 CY22313ZXC 49 0 RA-CML MR051028 CY22313ZXC 50 0 ZZ2415GAL RA-CML MR052006 CY22313ZXC 49 0 ZZ2415GAL RA-CML MR052038 CY22313ZXC 48 0 ZZ2813AGN T-TAIWAN 053006 CYI5002ZXC 48 0 ZZ2817AGL RA-CML 042701 7C89000AC-RAZZC 41 0 ZZ5624BGN R-CML MR053047 CY28442ZXCT FA Results TSSOP (Pb-Free) 47 0 Summary for 'Family' = ZZ (10 detail records) 474 0 Grand Total 7078 2005 Q4 RELIABILITY REPORT 0 Page 33 of 48 Product Reliability Cypress Summary Detail, Package -- PCT Performance BldKit TQFP A100AGAGE A100RKGAB Loc EvalNum Device Readout G-TAIWAN NR053003 7C0283BC-GACB 168 50 0 R-CML 044603 CY7C1339B-133AI 168 65 0 A100SFAGE R-CML MR052002 CY7C0241-25AC 168 50 0 A128SAGLL R-CML 050801 CY7C1019CV33-15VC 168 44 0 A144GGAGE G-TAIWAN MR051009 CY7C057V-12AC 168 50 0 A144GGAGE G-TAIWAN MR052033 CY7C057V-15AI 168 50 0 A52AEGAGE Q-KOREA MR052004 CY29972AI 176 50 0 A52ASGAGE Q-KOREA MR051035 CY7B9973V-AC 168 50 0 A52CXGAGE S-AMT MR044057 CY29774AI 168 50 0 A52CXGAGE SI-SIGNETI MR051017 CY29773AIT 168 50 0 A64FXGAGE G-TAIWAN MR054058 CY7C144AV-25AC 168 45 0 554 0 Summary for 'Family' = TQFP (11 detail records) SS Rejects TQFP (10x10) AS64CGAGB Q-KOREA MR053050 CY7C4275V-15ASC 168 50 0 AS6513GAGB G-TAIWAN MR052089 CY7C4215V-15ASC 168 50 0 100 0 Summary for 'Family' = TQFP (10x10) (2 detail records) TQFP (Thermal) AT120AAAGE L-SEOL MR052023 CYS25G0101DX-ATC 168 50 0 AT120AGAGE L-SEOL MR044077 CYS25G0101DX-ATC 168 45 0 AT120AGAGE L-SEOL MR051082 CYS25G0101DX-ATC 168 50 0 AT120AHAGE L-SEOL 041701 CYS25G0101DX-ATC Summary for 'Family' = TQFP (Thermal) (4 detail records) 176 50 195 0 0 TQFP (Pb-Free) AZ100RIALL R-CML 053103 CY7C1370 168 50 0 AZ100RRLL 051702 CY7C1470V33 168 50 0 AZ100RRLL 051006 CY7C1470 168 50 0 AZ100RSLL R-CML 053103 CY7C1360C 168 50 0 AZ100RSLL R-CML 053103 CY7C1360C 168 49 0 AZ100SEGL R-CML MR051024 CY8C29866-24AXI 176 48 0 AZ100SGAL R-CML 053007 CY7C027V 168 50 0 AZ100SGAL R-CML 053007 CY7C027V 168 50 0 AZ100SGAL R-CML 053007 CY7C027V 168 59 0 AZ100SGAL R-CML 053007 CY7C038V 168 347 0 AZ100SGAL R-CML 053007 CY7C027V 168 60 0 AZ100SGAL R-CML 053007 CY7C038V 168 315 0 AZ144GGAL G-TAIWAN MR052074 CY7C056V-12AXC 168 49 0 AZ52ASGAL Q-KOREA 051902 CY7B9945V-5AXCT 168 50 0 1277 0 Summary for 'Family' = TQFP (Pb-Free) (14 detail records) FBGA (0.75-0.8) BA48AUALE RA-CML MR052085 CY7C1021BV33L-15B 176 23 0 BA48BVALE G-TAIWAN MR053008 CY62137CVSL-70BAI 168 42 0 BA48DCALE G-TAIWAN 045109 CY7C1061AV33-10BG 168 50 0 BA48DDALE RA-CML 053101 CY512K6C9A-70BAI 176 50 0 BA48HVALE RA-CML MR051066 CS5854AT 168 50 0 215 0 Summary for 'Family' = FBGA (0.75-0.8) (5 detail records) 2005 Q4 RELIABILITY REPORT FA Results Page 34 of 48 Product Reliability Cypress BldKit FBGA (1.0) BB100EAGE Loc EvalNum Device Readout G-TAIWAN MR052032 CYP15G0101DXB-BBI 168 49 0 BB165GALE G-TAIWAN 045107 7R1371CC-GBBCB 168 49 0 BB172AAGE G-TAIWAN MR051007 CY7C057V-15BBI 168 48 0 146 0 Summary for 'Family' = FBGA (1.0) (3 detail records) SS Rejects PBGA (1.27) BG119MALE G-TAIWAN MR043086 CY7C1373CV25-100B 168 50 0 BG272AAGE G-TAIWAN MR052034 CY7C0430BV-100BGI 168 44 0 BG282BAGE G-TAIWAN MR052005 CY37512P256-83BGC 168 46 0 140 0 47 0 47 0 Summary for 'Family' = PBGA (1.27) (3 detail records) PBGA (Heat Spreader) BH388AAGE G-TAIWAN MR043082 CYNSE70128-66BGC 168 Summary for 'Family' = PBGA (Heat Spreader) (1 detail record) PBGA (Cavity/Heatsink, Pb-Free) BJ256L2GL G-TAIWAN 044507 CY28323BPVC 168 45 0 BJ256L2GL 044507 CY28323BPVC 168 50 0 95 0 50 0 50 0 G-TAIWAN Summary for 'Family' = PBGA (Cavity/Heatsink, Pb-Free) (2 detail FBGA (0.75-0.8, Pb-Free) BK48CDALL T-TAIWAN 053702 CY7C1041CV33-20BA 168 Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record) PBGA (Cavity/Heatsink) BL256L2GE G-TAIWAN MR051006 CYP15G0401DXB-BGI 176 19 0 BL256L2GE BL256L2GE MR051006 MR054018 CYP15G0401DXB-BGI CYP15G0401DXB-BG 168 168 31 50 0 0 100 0 G-TAIWAN G-TAIWAN Summary for 'Family' = PBGA (Cavity/Heatsink) (3 detail records) FVBGA (0.75-0.8, 0.3mm) BV48BKALE RA-CML MR053023 CYK128K6C7BW-70B 176 49 0 BV48BLAGE G-TAIWAN MR053035 CYK256K16MCBU-70 168 49 0 BV48BTALN RA-CML 054302 CY62147EV30* 168 50 0 BV48BTALN RA-CML 054302 CY62147EV30* 168 50 0 BV48BTLAN RA-CML 054302 CY62147EV30* 168 50 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 168 76 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 168 77 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 168 50 0 BV48HAALE G-TAIWAN MR051014 CY62147CV33LL-70B 176 50 0 501 0 Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (9 detail records) FBGA (1.0, Pb-Free) BW100EAGL G-TAIWAN MR051023 CYP15G0101DXB-BB 168 48 0 BW484SDLL 050309 CY22313ZXCT 176 47 0 95 0 G-TAIWAN Summary for 'Family' = FBGA (1.0, Pb-Free) (2 detail records) VFBGA (0.75-0.8, Pb-Free) BZ100AALE G-TAIWAN 050202 CY7C015V18-35AC 168 50 0 BZ48BKALE MR052088 CYK128K16SCBU-55B 176 50 0 043306 CY62147 168 44 0 144 0 RA-CML BZ48BTALN Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (3 detail records) 2005 Q4 RELIABILITY REPORT FA Results Page 35 of 48 Product Reliability Cypress BldKit Loc EvalNum Device Readout SS Rejects PLCC J28SEGAGB M-PHIL MR054019 CY7B923-JC 168 50 0 J32RBGAGB X-ALPHA MR051031 CY7B991-2JC 168 50 0 J32RBGAGB X-ALPHA MR052018 CY7B991-5JC 168 50 0 J32RBGAGB X-ALPHA MR053042 CY7B991-5JI 168 50 0 J32RBGAGB X-ALPHA MR054059 CY7B9911-5JC 168 50 0 J32RNGAGE M-PHIL MR053031 CY7C4271V-25JC 168 50 0 J52SFGAGB M-PHIL MR051036 CY7C136-25JC 168 50 0 J68SCGAGB X-ALPHA MR054061 CY7C144-55JCT 168 50 0 J84SFGACB M-PHIL MR044035 CY7C346B-35JC 176 48 0 448 0 50 0 50 0 Summary for 'Family' = PLCC (9 detail records) PLCC (Pb-Free) JZ32RBGAN M-PHIL MR053028 CY7C419-15JXC 168 Summary for 'Family' = PLCC (Pb-Free) (1 detail record) QFN (Punch Type) LF56AGAGE L-SEOL MR044081 CY7C65640A-LFC 168 50 0 LF56AGAGE L-SEOL MR051075 CY7C65640A-LFC 176 50 0 LF56CGAGL T-TAIWAN MR044040 CY7C65640-LFC 168 50 0 LF56EGAGE AC-ASE 054207 CY7C65640-LFC 176 50 0 200 0 Summary for 'Family' = QFN (Punch Type) (4 detail records) QFN (Punch Type, Pb-Free) LY32BGAGL RA-CML 052610 CY8C21434-24LFXI 168 50 0 LY56AGAGL MR044065 CY7C68300A-56LFXC 176 50 0 044504 CY7C65630-56LFXC 168 45 0 L-SEOL LY56AGAL LY56DGAGL LY56DGAGL L-SEOL L-SEOL MR051046 MR053010 CP6241AM CY8C24794-24LFXI 176 168 50 50 0 0 LY56FGALL RA-CML 050302 CY7C65640-LFXC 168 50 0 LY56FGALL RA-CML 050302 CY7C65640-LFXC 168 50 0 LY56FGALL RA-CML 053008 CY7C65640-LFXC 168 50 0 LY56FGALL RA-CML 050303 CY7C65640-LFXC 168 50 0 LY56FGALL RA-CML 050303 CY7C65640-LFXC 168 50 0 LY56FGALL RA-CML 050303 CY7C109B-20VCT 168 50 0 LY56FGALL RA-CML NR051005 CY7C65640-LFXC 168 50 0 LY72AGAGL L-SEOL 054206 CY28447LF-XC 168 50 0 645 0 Summary for 'Family' = QFN (Punch Type, Pb-Free) (13 detail records) PQFP N52DXGAGB G-TAIWAN MR051005 CY7C136-55NC 168 50 0 N52DXGAGB G-TAIWAN MR052031 CY7C136-55NC 168 47 0 N52DXGAGB G-TAIWAN MR054060 CY7C131-55NC 168 50 0 147 0 Summary for 'Family' = PQFP (3 detail records) SSOP O2024GAGE M-PHIL MR052007 CY2DP314OI 168 48 0 O2024GAGE M-PHIL MR053001 CY2DP3140I 168 50 0 O2028GAGE T-TAIWAN MR044066 CY2CC810OI 176 50 0 O2824GAGB T-TAIWAN MR051038 CY28508OC 168 50 0 O2824GAGB T-TAIWAN MR052035 CY28352OC 168 50 0 O5615GAGB T-TAIWAN MR053016 CY28419OC 168 50 0 O563AXAGB R-CML MR053029 CY28346OC 168 50 0 2005 Q4 RELIABILITY REPORT FA Results Page 36 of 48 Product Reliability Cypress BldKit O563AXAGN O563BXAGE Loc R-CML R-CML EvalNum Device MR052017 MR051021 CY28419OC CP6221BM Readout 168 168 Summary for 'Family' = SSOP (9 detail records) SS Rejects 40 50 0 0 438 0 PDIP P203CGAGB O-INDNS MR053013 CY7C168A-35PC 168 45 0 P2406AAGN O-INDNS 043805 CY7C63913-PXC 168 45 0 P243FGAGE M-PHIL MR052025 CY7C194-25PC 168 50 0 P2839GAGB X-ALPHA MR052061 CY7C466A-10PTC 168 50 0 P283EGAGE O-INDNS MR051001 CY8C26443-24PI 168 45 0 235 0 Summary for 'Family' = PDIP (5 detail records) PDIP (Pb-Free) PZ06AAGN O-INDNS 054604 CY7C63413 168 50 0 PZ183AAGN O-INDNS MR051004 CY7C63231A-PXC 168 45 0 PZ183AAGN O-INDNS MR052015 CY7C63231A-PXC 168 45 0 PZ243AAGN X-ALPHA 051206 CY7C63743-PXC 168 50 0 PZ2831GAN O-INDNS MR053014 CY7C64013A-PXC 168 45 0 235 0 Summary for 'Family' = PDIP (Pb-Free) (5 detail records) SOIC (GullWing) S0815PAGN RA-CML MR044055 CY2410SC-1 176 48 0 S0815PAGN RA-CML MR051018 CY2305SC-1H 168 50 0 S1615DAAGB M-PHIL MR051027 CY2292F 168 50 0 S1615EAGB M-PHIL MR053002 CY2309SC-1H 168 50 0 S283HGAGB O-INDNS MR051003 CY2314ANZSC-1 168 45 0 S283HGAGB O-INDNS MR052073 CY7B933-SC 168 49 0 S283HGAGB S324513GB O-INDNS R-CML MR053043 MR051078 CY8C24423-24SI CY62128BLL-70SI 168 168 50 50 0 0 S324513GN R-CML MR053003 CY6525AM 168 50 0 S324513GN R-CML MR054036 CY62128BLL-55SC 168 Summary for 'Family' = SOIC (GullWing) (10 detail records) 45 0 487 0 SOIC (GullWing, 450 footprint) SN2831AHN R-CML MR051008 CY62256LL-70SNC 168 50 0 SN2831AHN R-CML MR052013 CY62256L-70SNC 168 50 0 SN2831AHN R-CML MR053037 CY62256L-70SNC 168 Summary for 'Family' = SOIC (GullWing, 450 footprint) (3 detail records) 50 0 150 0 SSOP (Pb-Free) SP2023GAL T-TAIWAN 042501 CY8C21323-24PVXI 168 50 0 SP28214GL T-TAIWAN 052004 CY8C21234-24SXI 168 45 0 SP2824CAN T-TAIWAN 053005 CY28400OXC 176 50 0 SP2824GAN T-TAIWAN MR044076 CY28353OXC-2 168 50 0 SP2824GAN T-TAIWAN MR052008 CY28508OXC 176 50 0 SP563AAGN R-CML MR051019 CY28410OXC 168 50 0 SP563AAGN R-CML MR052040 CY28410OXC 168 50 0 SP563AAGN R-CML MR053021 CY28410OXC 168 50 0 SP563BAGL R-CML 042101 CY7C68300B-56PVXC 176 63 0 SP563BAGL R-CML 042101 CY7C68300B-56PVXC 176 65 0 SP563BAGL R-CML 042101 CY7C68300B-56PVXC 176 57 0 SP563CAGE T-TAIWAN 053502 CY7C66113A-PVXC 168 50 0 630 0 Summary for 'Family' = SSOP (Pb-Free) (12 detail records) 2005 Q4 RELIABILITY REPORT FA Results Page 37 of 48 Product Reliability Cypress BldKit Loc EvalNum Device Readout SS Rejects SOIC (GullWing, 450 footprint, Pb-Free) SY2831AHN R-CML MR052010 CY62256L-70SNXC 168 50 0 SY2831AHN R-CML MR053036 CY62256LL-70SNXI 168 50 0 SY2831AHN R-CML 053407 CY62256LL 168 90 0 SY2831AHN R-CML 053407 CY62256LL 168 90 0 280 0 Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (4 detail SOIC (GullWing, Pb-Free) SZ1615DGN M-PHIL 052004 CY8C21234-24SXI 168 45 0 SZ1615DGN M-PHIL 052004 CY8C21234-24SXI 168 45 0 SZ1615EGN M-PHIL MR051029 CY2308SXC-1H 168 50 0 SZ1615EGN M-PHIL MR052046 CY2309SXC-1H 168 50 0 SZ1615KGN RA-CML MR051016 CY2309SXC-1H 168 50 0 SZ24315GN RA-CML 054501 CY7C63743 168 50 0 SZ24315GN RA-CML MR053032 CY7C63743-SXC 168 50 0 SZ28327GL R-CML 054604 CY7C64013C-SXC 168 50 0 SZ28327GL R-CML 054604 CY7C65113C-SXC 168 50 0 SZ324510GL R-CML MR051022 CY62128BLL-70SXI 168 50 0 SZ324514L R-CML MR044005 CY62148DV30LL-70S 176 45 0 535 0 Summary for 'Family' = SOIC (GullWing, Pb-Free) (11 detail records) SOIC (J lead) V28CGAGB O-INDNS MR044064 CY7C106B-20VC 168 50 0 V3233GALN R-CML 054502 CY7C188 168 50 0 V3233GALN R-CML 054809 CY7C188 168 50 0 V324EGAGB O-INDNS MR051002 CY7C1019B-12VC 168 45 0 V324EGAGB V324FGAGB O-INDNS O-INDNS MR052014 MR053015 CY7C1019B-10VC CY7C109B-20VC 168 168 45 45 0 0 V444WGALL R-CML MR052019 CY7C1021B-12VI 168 50 0 V444YAALE R-CML MR051015 CY7C1041CV33-12VC 168 50 0 V444ZGALL R-CML MR053004 CY7C1021CV33 168 50 0 435 0 Summary for 'Family' = SOIC (J lead) (9 detail records) SOIC (J lead, Pb-Free) VZ243GGBLL O-INDNS 052801 CY7C197 168 50 0 VZ32418LL R-CML 054008 CY7C109B 168 50 0 VZ3644GALL R-CML MR053038 CY7C1049B-20VXI 168 46 0 VZ444WAGL R-CML MR052001 CY7C1021B-15VXC 168 50 0 VZ444ZALL R-CML MR053005 CY7C1021CV33-8VXC 168 Summary for 'Family' = SOIC (J lead, Pb-Free) (5 detail records) CERDIP (Windowed) W129DF-TSC T-TAIWAN 050701 CY7C65640-LFXC 168 Summary for 'Family' = CERDIP (Windowed) (1 detail record) 49 0 245 0 50 0 50 0 TSOP/ TSSOP Z1613GAGB T-TAIWAN MR051011 CY2309ZI-1H 168 45 0 Z1613GAGB T-TAIWAN MR052039 CY2308ZC-1H 168 46 0 Z1619GAGN RA-CML MR052027 CY22392ZC-366 168 50 0 Z1619GAGN RA-CML MR053059 CY26049ZC-36 168 48 0 2005 Q4 RELIABILITY REPORT FA Results Page 38 of 48 Product Reliability Cypress EvalNum Device Z32RKGBGE BldKit T-TAIWAN Loc MR054005 CY7C109B-12ZC Readout 176 50 0 Z5624BAGN R-CML MR051050 CY28346ZI-2T 168 50 0 Z5624BAGN R-CML MR052012 CY28409ZC 168 50 0 Z5624BAGN Z5624BAGN R-CML R-CML MR053046 044903 CY28409ZC CY28346ZC-2 168 176 50 50 0 0 439 0 Summary for 'Family' = TSOP/ TSSOP (9 detail records) SS Rejects TSOP I ZA32RHAALB R-CML MR051012 CY62128DV30LL-55Z 168 50 0 ZA32RHAALB R-CML MR052020 CY62128DV30LL-55Z 168 50 0 ZA32RHAALB R-CML MR053056 CY62128DV30LL-55Z 168 50 0 150 0 Summary for 'Family' = TSOP I (3 detail records) TSOP (Reverse) ZR28R2AGN R-CML MR051013 CY62256LL-70ZRI 168 50 0 ZR28R2AGN R-CML MR053049 CY62256LL-70ZRI 168 45 0 95 0 Summary for 'Family' = TSOP (Reverse) (2 detail records) TSOP II ZS324CA3E T-TAIWAN MR044070 CY7C1019B-12ZC 176 44 0 ZS324FAGE T-TAIWAN MR051037 CY7C1019CV33-12ZC 168 50 0 ZS324FAGE T-TAIWAN MR052009 CY7C1019CV33-12ZC 168 50 0 ZS324FAGE T-TAIWAN MR053055 CY7C1019CV33-12ZC 168 50 0 ZS444ABALE R-CML MR053058 CS6125AT 168 50 0 ZS444ABALL R-CML MR051010 CY7C1021CV33-15ZC 168 50 0 ZS444AJALN R-CML MR054008 CY7C1021CV33-15ZC 168 49 0 ZS444AKALN R-CML MR052022 CY7C1041CV33-15ZC 168 50 0 ZS444YAGL R-CML 053007 CY7C1041B-15ZC 168 60 0 453 0 Summary for 'Family' = TSOP II (9 detail records) TSOP (Pb-Free) ZT32RKGGL T-TAIWAN MR052044 CY7C109B-15ZXC 168 49 0 ZT32RKGGL T-TAIWAN MR054050 CY7C109B-15ZXC 168 50 0 99 0 Summary for 'Family' = TSOP (Pb-Free) (2 detail records) TSOP II (Pb-Free) ZW444ADALL R-CML MR052003 CY7C1041CV33-15ZX 176 49 0 ZW444NAGN R-CML MR051047 CY62126DV30LL-55Z 168 50 0 ZW444VAGL R-CML MR053033 CY7C1021B-15ZXI 168 50 0 ZW444VAGL R-CML MR054003 CY7C1021B-15ZXC 168 50 0 199 0 50 0 50 0 Summary for 'Family' = TSOP II (Pb-Free) (4 detail records) TSOP (Reverse, Pb-Free) ZY28R2AGN R-CML MR053057 CY62256LL-70ZRXI 168 Summary for 'Family' = TSOP (Reverse, Pb-Free) (1 detail record) TSSOP (Pb-Free) ZZ1613GAN T-TAIWAN MR052077 CY2309ZXI-1H 168 50 0 ZZ2411AGN T-TAIWAN MR051020 CY7C68300A-56LFXC 168 45 0 ZZ2411AGN T-TAIWAN MR051051 CY22313ZXC 168 50 0 ZZ2415GAL RA-CML MR051028 CY22313ZXC 168 50 0 ZZ2415GAL RA-CML MR052006 CY22313ZXC 168 50 0 ZZ2415GAL RA-CML MR052038 CY22313ZXC 168 50 0 ZZ2813AGN T-TAIWAN 053006 CYI5002ZXC 168 49 0 ZZ2817AGL RA-CML 051903 CY221R28-ZXC 168 50 0 2005 Q4 RELIABILITY REPORT FA Results Page 39 of 48 Product Reliability Cypress EvalNum Device ZZ5624BGN BldKit R-CML Loc MR044054 CY28411ZXC Readout 176 SS 48 Rejects 0 ZZ5624BGN R-CML MR051026 CY28442ZXC 176 50 0 ZZ5624BGN ZZ5624BGN R-CML R-CML 050504 050504 CY28411ZXCT CY28411ZXCT 168 168 49 48 0 0 ZZ5624BGN R-CML 050504 CY28411ZXCT 168 50 0 Summary for 'Family' = TSSOP (Pb-Free) (13 detail records) 639 0 Grand Total 10993 2005 Q4 RELIABILITY REPORT FA Results 0 Page 40 of 48 Product Reliability Cypress Summary Detail, Package -- TC Performance BldKit Loc EvalNum Device Readout SS Rejects A100 R-CML 045002 C9TC 150C -65C 300 30 0 A100 R-CML 045002 C9TC 150C -65C 300 40 0 A100RKGAB R-CML MR044020 CY7C1329-100AC 150C -65C 300 48 0 A100RKGAB R-CML 044603 CY7C1339B-133AI 150C -65C 300 45 0 A100RKGAB R-CML 044603 CY7C1339B-133AI 150C -65C 300 50 0 A100RKGAB R-CML 044603 CY7C1339B-133AI 150C -65C 300 50 0 A100SEGAGL R-CML MR053027 CY7C9689A-AC 150C -65C 300 50 0 A100SFAGE R-CML MR052002 CY7C0241-25AC 150C -65C 300 50 0 A100SGAGE R-CML MR044045 CS6247AS 150C -65C 300 50 0 A128SAGLL R-CML 050801 CY7C1019CV33-15V 150C -65C 300 45 0 A128SAGLL R-CML 050801 CY7C1019CV33-15V 150C -65C 300 44 0 A128SAGLL R-CML 050801 CY7C1019CV33-15V 150C -65C 300 45 0 A144GGAGE G-TAIWAN MR051009 CY7C057V-12AC 150C -65C 300 47 0 A144GGAGE G-TAIWAN MR052033 CY7C057V-15AI 150C -65C 300 50 0 A52AEGAGE Q-KOREA MR052004 CY29972AI 150C -65C 300 50 0 A52CXGAGE S-AMT MR044057 CY29774AI 150C -65C 300 50 0 A52CXGAGE SI-SIGNETI MR051017 CY29773AIT 150C -65C 300 43 0 CYS25G0101DX-AT 150C -65C 300 50 837 0 0 AG120AGAL L-SEOL 041701 CYS25G0101DX-AT Summary for 'Family' = TQFP (Thermal, Pb-Free) (1 detail record) 150C -65C 300 50 50 0 0 FA Results TQFP A64FXGAGE G-TAIWAN MR044078 Summary for 'Family' = TQFP (18 detail records) TQFP (Thermal, Pb-Free) TQFP (10x10) AS64BGAGB G-TAIWAN MR044039 CY7C4245V-15ASC 150C -65C 300 46 0 AS64CGAGB Q-KOREA MR044044 CY7C4265V-15ASC 150C -65C 300 50 0 AS64CGAGB Q-KOREA MR053050 CY7C4275V-15ASC 150C -65C 300 50 0 CY7C4215V-15ASC 150C -65C 300 50 196 0 0 AS6513GAGB G-TAIWAN MR052089 Summary for 'Family' = TQFP (10x10) (4 detail records) TQFP (Thermal) AT120AAAGE L-SEOL MR052023 CYS25G0101DX-AT 150C -65C 300 50 0 AT120AGAGE L-SEOL MR044077 CYS25G0101DX-AT 150C -65C 300 45 0 AT120AGAGE L-SEOL MR051082 CYS25G0101DX-AT -65C 300 49 0 AT120AHAGE L-SEOL 041701 Summary for 'Family' = TQFP (Thermal) (4 detail records) CYS25G0101DX-AT 150C -65C 300 50 194 0 0 TQFP (Pb-Free) AZ100RRLL R-CML 051702 CY7C1470V33 150C -65C 300 50 0 AZ100RRLL R-CML 051702 CY7C1470V33 150C -65C 300 50 0 AZ100RRLL R-CML 051702 CY7C1470V33 150C -65C 300 49 0 AZ100RRLL R-CML MR052096 CY7C1471V25-133A 150C -65C 300 50 0 AZ100RSLL R-CML 053103 CY7C1470A 150C -65C 300 50 0 AZ100RSLL R-CML 053103 CY7C1360C 150C -65C 300 50 0 AZ100SGAL R-CML 053007 CY7C027V 150C -65C 300 60 0 AZ100SGAL R-CML 053007 CY7C027V 150C -65C 300 60 0 2005 Q4 RELIABILITY REPORT Page 41 of 48 Product Reliability Cypress BldKit Loc EvalNum Device AZ144GGAL G-TAIWAN MR052074 CY7C056V-12AXC 150C -65C Readout 300 SS 49 Rejects 0 AZ52ASGAL Q-KOREA 051902 CY7B9945V-5AXCT 150C -65C 300 50 0 AZ52ASGAL Q-KOREA 051902 CY7B9945V-5AXCT 150C -65C 300 50 0 AZ52ASGAL Q-KOREA 051902 CY7B9945V-5AXCT Summary for 'Family' = TQFP (Pb-Free) (12 detail records) 150C -65C 300 46 614 0 0 FA Results FBGA (0.75-0.8) BA48AUALE RA-CML MR052085 CY7C1021BV33L-15 150C -65C 300 50 0 BA48AVALE RA-CML MR043061 CY62147CV30LL-70 150C -65C 300 50 0 BA48BQAALE RA-CML MR044068 CY62137CV30LL-70 150C -65C 300 47 0 BA48BVALE G-TAIWAN MR044025 CY62137CVSL-70BA 150C -65C 300 40 0 BA48BVALE G-TAIWAN MR053008 CY62137CVSL-70BA 150C -65C 300 49 0 BA48BWALE G-TAIWAN MR043025 CY7C1021CV33-15B 150C -65C 300 48 0 BA48CRALE T-TAIWAN MR044056 CY62137CVSL-70BA 150C -65C 300 48 0 BA48DJALE G-TAIWAN 045101 7C62172DC-GBAI 150C -65C 300 45 0 BA48DJALE G-TAIWAN 052502 CY62177DV30L 150C -65C 300 50 0 150C -65C 300 49 476 0 0 CYP15G0101DXB-B 150C -65C 300 50 0 CY7C057V-15BBI 150C -65C 300 50 100 0 0 BA48HVALE RA-CML MR051066 CS5854AT Summary for 'Family' = FBGA (0.75-0.8) (10 detail records) FBGA (1.0) BB100EAGE G-TAIWAN MR052032 BB172AAGE G-TAIWAN MR051007 Summary for 'Family' = FBGA (1.0) (2 detail records) PBGA (1.27) BG119 G-TAIWAN 052104 CY7C1072 150C -65C 300 47 0 BG119 G-TAIWAN 052104 CY7C1072 150C -65C 300 46 0 BG119MALE G-TAIWAN MR043086 CY7C1373CV25-100 150C -65C 300 50 0 BG272AAGE G-TAIWAN MR052034 CY7C0430BV-100BG 150C -65C 300 50 0 CY37512P256-83BG 150C -65C 300 49 242 0 0 150C -65C 300 50 50 0 0 BG282BAGE G-TAIWAN MR052005 Summary for 'Family' = PBGA (1.27) (5 detail records) PBGA (Heat Spreader) BH388AAGE G-TAIWAN MR043082 CYNSE70128-66BGC Summary for 'Family' = PBGA (Heat Spreader) (1 detail record) PBGA (Cavity/Heatsink, BJ256L2GL G-TAIWAN 044507 CY28323BPVC 150C -65C 300 47 0 BJ256L2GL G-TAIWAN 044507 CY28323BPVC 150C -65C 300 50 0 BJ256L2GL G-TAIWAN 044507 CY28323BPVC 150C -65C 300 49 0 BJ504AAGL G-TAIWAN 044507 CY7C9536B-BLXC 150C -65C 300 49 0 BJ504AAGL G-TAIWAN 044507 CY7C9536B-BLXC Summary for 'Family' = PBGA (Cavity/Heatsink, Pb-Free) (5 detail records) 150C -65C 300 50 245 0 0 150C -65C 300 60 60 0 0 150C -65C 300 50 0 150C -65C 300 50 100 0 0 FBGA (0.75-0.8, Pb-Free) BK48CDALL T-TAIWAN 053702 CY7C1041CV33-20B Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record) PBGA (Cavity/Heatsink) BL256L2GE G-TAIWAN MR051006 CYP15G0401DXB-B BL3304ABGE G-TAIWAN MR043083 CYNSE70129A-125B Summary for 'Family' = PBGA (Cavity/Heatsink) (2 detail records) 2005 Q4 RELIABILITY REPORT Page 42 of 48 Product Reliability Cypress BldKit Loc EvalNum Device Readout SS Rejects FA Results FVBGA (0.75-0.8, 0.3mm) BV48ATALE RA-CML MR044026 CY62157DV30L-45B 150C -65C 300 46 0 BV48BEALE G-TAIWAN MR044030 CY62147DV30LL-70 150C -65C 300 39 0 BV48BKALE RA-CML MR053023 CYK128K6C7BW-70 150C -65C 300 45 0 BV48BNALE G-TAIWAN 050301 C762167DV30LL-BVI 150C -65C 300 50 0 BV48BNALE G-TAIWAN 050301 C762167DV30LL-BVI 150C -65C 300 50 0 BV48BNALE G-TAIWAN 050301 C762167DV30LL-BVI 150C -65C 300 48 0 BV48BTALN RA-CML 054302 CY62147EV30* 150C -65C 300 49 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 150C -65C 300 49 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 150C -65C 300 77 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 150C -65C 300 27 0 BV48BZALL RA-CML 051104 CYU01M6TF53CZ 150C -65C 300 77 0 BV48HAALE G-TAIWAN MR051014 CY62147CV33LL-70 150C -65C 300 50 0 BV48NAALE RA-CML 042801 7R62357DC-RABVI 150C -65C 300 45 0 150C -65C 300 50 702 0 0 150C -65C 300 50 50 0 0 BV48VAALE G-TAIWAN MR052084 CY62137CV30LL-70 Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (14 detail records) FBGA (1.0, Pb-Free) BW100EAGL G-TAIWAN MR051023 CYP15G0101DXB-B Summary for 'Family' = FBGA (1.0, Pb-Free) (1 detail record) VFBGA (0.75-0.8, Pb-Free) BZ100AALE G-TAIWAN 050202 CY7C015V18-35AC 150C -65C 300 50 0 BZ100AALE G-TAIWAN 050202 CYDM256A16-55BV 150C -65C 300 50 0 BZ100AALE G-TAIWAN 050202 CYDM256A16-55BV 150C -65C 300 50 0 BZ48BKALE RA-CML MR052088 CYK128K16SCBU-55 150C -65C 300 49 0 BZ48BTALN RA-CML 054302 CY62147EV30* 150C -65C 300 42 0 BZ48BTALN R-CML 054302 CY62147 150C -65C 300 45 0 BZ48BTALN R-CML 043306 CY62147 150C -65C 300 42 0 BZ48BTALN RA-CML 043306 CY62147 Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (8 detail records) 150C -65C 300 45 373 0 0 PLCC J32RBGAGB X-THALND MR051031 CY7B991-2JC 150C -65C 300 50 0 J32RBGAGB X-THALND MR052018 CY7B991-5JC 150C -65C 300 50 0 J32RBGAGB X-THALND MR053042 CY7B991-5JI 150C -65C 300 50 0 J32RNGAGE M-PHIL MR053031 CY7C4271V-25JC 150C -65C 300 50 0 J52SFGAGB M-PHIL MR051036 CY7C136-25JC -65C 300 50 0 J84SBGAGB X-THALND MR044036 CY7C024-55JC 150C -65C 300 50 0 CY7C346B-35JC 150C -65C 300 50 350 0 0 CY7C421-20JXC 150C -65C 300 50 0 CY7C419-15JXC 150C -65C 300 50 100 0 0 J84SFGACB M-PHIL MR044035 Summary for 'Family' = PLCC (7 detail records) PLCC (Pb-Free) JZ32RBGAN M-PHIL MR051056 JZ32RBGAN M-PHIL MR053028 Summary for 'Family' = PLCC (Pb-Free) (2 detail records) 2005 Q4 RELIABILITY REPORT Page 43 of 48 Product Reliability Cypress BldKit Loc EvalNum Device Readout SS Rejects LF56AGAGE L-SEOL MR044081 CY7C65640A-LFC 150C -65C 300 50 0 LF56AGAGE L-SEOL MR051075 CY7C65640A-LFC 150C -65C 300 50 0 LF56AGAGE L-SEOL MR052016 CY7C65640A-LFC Summary for 'Family' = QFN (Punch Type) (3 detail records) 150C -65C 300 50 150 0 0 FA Results QFN (Punch Type) QFN (Punch Type, Pb-Free) LY32BGAGL RA-CML 052610 CY8C21434-24LFXI 150C -65C 300 49 0 LY32BGAGL RA-CML 052610 CY8C21434-24LFXI 150C -65C 300 50 0 LY48AGAGL L-SEOL 044307 CYWUSB6934 150C -65C 300 50 0 LY48AGAGL L-SEOL 044307 CYWUSB6934 150C -65C 300 50 0 LY48AGAGL L-SEOL 044307 CYWUSB6934 150C -65C 300 50 0 LY56AGAGL L-SEOL MR044065 CY7C68300A-56LFX 150C -65C 300 49 0 LY56DGAGL L-SEOL MR051046 CP6241AM 150C -65C 300 50 0 LY56FGALL RA-CML 050302 CY7C65640-LFXC 150C -65C 300 49 0 LY56FGALL RA-CML 050302 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL RA-CML 050302 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL RA-CML 053008 CY7C65640-LFXC 150C -65C 300 49 0 LY56FGALL RA-CML 053008 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL RA-CML 053008 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL RA-CML 050303 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL RA-CML 050303 CY7C109B-20VCT 150C -65C 300 49 0 LY56FGALL RA-CML 050303 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL RA-CML NR051005 CY7C65640-LFXC 150C -65C 300 50 0 LY56FGALL R-CML NR051008 CY7C65640-LFXC 150C -65C 300 50 0 LY72AGAGL L-SEOL 054206 CY28447LF-XC 150C -65C 300 50 0 LY72AGAGL L-SEOL 054206 CY28447LF-XC 150C -65C 300 50 0 LY72AGAGL L-SEOL 054206 CY28447LF-XC Summary for 'Family' = QFN (Punch Type, Pb-Free) (21 detail records) 150C -65C 300 50 1045 0 0 PQFP N52DXGAGB G-TAIWAN MR044038 CY7C136-55NC 150C -65C 300 50 0 N52DXGAGB G-TAIWAN MR051005 CY7C136-55NC 150C -65C 300 50 0 N52DXGAGB G-TAIWAN MR052031 Summary for 'Family' = PQFP (3 detail records) CY7C136-55NC 150C -65C 300 50 150 0 0 SSOP O2023GAGB T-TAIWAN MR044062 CY8C26233-24PVI 150C -65C 300 50 0 O2024GAGE M-PHIL MR044067 CY2DP314OI 150C -65C 300 50 0 O2024GAGE M-PHIL MR052007 CY2DP314OI 150C -65C 300 48 0 O2024GAGE M-PHIL MR053001 CY2DP3140I 150C -65C 300 50 0 O2028GAGE T-TAIWAN MR044066 CY2CC810OI 150C -65C 300 50 0 O2824GAGB T-TAIWAN MR051038 CY28508OC 150C -65C 300 49 0 O563AXAGN R-CML MR052017 CY28419OC 150C -65C 300 49 0 CP6221BM 150C -65C 300 50 396 0 0 O563BXAGE R-CML MR051021 Summary for 'Family' = SSOP (8 detail records) PDIP P203CGAGB O-INDNS MR053013 CY7C168A-35PC 150C -65C 300 45 0 P2406AAGN O-INDNS 043805 CY7C63913-PXC 150C -65C 300 45 0 P243FGAGE M-PHIL MR052025 CY7C194-25PC 150C -65C 300 50 0 2005 Q4 RELIABILITY REPORT Page 44 of 48 Product Reliability Cypress BldKit Loc EvalNum Device P2839GAGB X-THALND MR052061 CY7C466A-10PTC 150C -65C 300 50 0 CY8C26443-24PI 150C -65C 300 45 235 0 0 P283EGAGE O-INDNS MR051001 Summary for 'Family' = PDIP (5 detail records) Readout SS Rejects FA Results PDIP (Pb-Free) PZ183AAGN O-INDNS MR051004 CY7C63231A-PXC 150C -65C 300 45 0 PZ183AAGN O-INDNS MR052015 CY7C63231A-PXC 150C -65C 300 45 0 PZ243AAGN X-THALND 051206 CY7C63743-PXC 150C -65C 300 48 0 PZ243AAGN X-THALND 051206 CY7C63743-PXC 150C -65C 300 50 0 PZ243AAGN X-THALND 051206 CY7C63743-PXC 150C -65C 300 50 0 CY7C64013A-PXC 150C -65C 300 45 283 0 0 PZ2831GAN O-INDNS MR053014 Summary for 'Family' = PDIP (Pb-Free) (6 detail records) SOIC (GullWing) S0815EAGB SL-INDIA MR043080 CY27022SC 150C -65C 300 48 0 S0815PAGN RA-CML MR044055 CY2410SC-1 150C -65C 300 50 0 S0815PAGN RA-CML MR051018 CY2305SC-1H 150C -65C 300 50 0 S1615DAAGB M-PHIL MR051027 CY2292F 150C -65C 300 50 0 S1615EAGB M-PHIL MR044011 CY2309SC-1H 150C -65C 300 48 0 S1615EAGB M-PHIL MR052037 CY2309SC-1H 150C -65C 300 49 0 S1615EAGB M-PHIL MR053002 CY2309SC-1H 150C -65C 300 48 0 S183CGAGC RA-CML NR051009 CY7C63723-SC 150C -65C 300 44 0 S183CGAGN RA-CML NR051009 CY7C63723-SC 150C -65C 300 50 0 S24314AGL RA-CML MR044028 CP6124AM 150C -65C 300 50 0 S2837GAGB X-THALND MR044029 CY7C64013-SC 150C -65C 300 50 0 S283HGAGB O-INDNS MR044063 CY8C24423-24SI 150C -65C 300 50 0 S283HGAGB O-INDNS MR051003 CY2314ANZSC-1 150C -65C 300 45 0 S283HGAGB O-NDNS MR052073 CY7B933-SC 150C -65C 300 50 0 S324513GB R-CML MR051078 CY62128BLL-70SI 150C -65C 300 42 0 S324513GN R-CML MR052036 CY62128BLL-70SC 150C -65C 300 49 0 150C -65C 300 50 823 0 0 S324513GN R-CSPI MR053003 CY6525AM Summary for 'Family' = SOIC (GullWing) (17 detail records) SOIC (GullWing, 450 SN2831AHB R-CML MR044008 CY62256LL-70SNC 150C -65C 300 45 0 SN2831AHN R-CML MR051008 CY62256LL-70SNC 150C -65C 300 50 0 SN2831AHN R-CML MR052013 CY62256L-70SNC 150C -65C 300 50 0 SN2831AHN R-CML MR053037 CY62256L-70SNC Summary for 'Family' = SOIC (GullWing, 450 footprint) (4 detail records) 150C -65C 300 50 195 0 0 SSOP (Pb-Free) SP2023GAL T-TAIWAN 042501 CY8C21323-24PVXI 150C -65C 300 50 0 SP28214GL T-TAIWAN 052004 CY8C21234-24SXI 150C -65C 300 50 0 SP2824CAN T-TAIWAN 053005 CY28400OXC 150C -65C 300 50 0 SP2824CAN T-TAIWAN 053005 CY28400OXC 150C -65C 300 50 0 SP2824CAN T-TAIWAN 053005 CY28400OXC 150C -65C 300 49 0 SP2824GAN T-TAIWAN MR044076 CY28353OXC-2 150C -65C 300 49 0 SP2824GAN T-TAIWAN MR051052 CY23FP12OXC-003 150C -65C 300 45 0 SP2824GAN T-TAIWAN MR052008 CY28508OXC 150C -65C 300 50 0 SP563AAGN R-CML MR043047 CY28RS480OXC 150C -65C 300 48 0 SP563AAGN R-CML MR044010 CY28410OXC 150C -65C 300 43 0 2005 Q4 RELIABILITY REPORT Page 45 of 48 Product Reliability Cypress BldKit Loc EvalNum Device R-CML MR051019 CY28410OXC 150C -65C 300 50 0 SP563AAGN R-CML MR052040 CY28410OXC 150C -65C 300 48 0 SP563AAGN R-CML MR053021 CY28410OXC 150C -65C 300 50 0 SP563BAGL R-CML 042101 CY7C68300B-56PVX 150C -65C 300 50 0 150C -65C 300 50 732 0 0 CY7C63743-QXC 150C -65C 300 50 0 CY7C63101A-QXC 150C -65C 300 50 100 0 0 CY62256L-70SNXC 150C -65C 300 50 0 SY2831AHN R-CML MR053036 CY62256LL-70SNXI Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (2 detail 150C -65C 300 48 98 0 0 SP563AAGN SP563CAGE T-TAIWAN 053502 CY7C66113A-PVXC Summary for 'Family' = SSOP (Pb-Free) (15 detail records) Readout SS Rejects FA Results QSOP (Pb-Free) SQ2414AGN R-CML MR043016 SQ2414AGN R-CML MR044042 Summary for 'Family' = QSOP (Pb-Free) (2 detail records) SOIC (GullWing, 450 SY2831AHN R-CML MR052010 SOIC (GullWing, Pb-Free) SZ1615DGN M-PHIL 052004 CY8C21234-24SXI 150C -65C 300 45 0 SZ1615EGN M-PHIL MR044014 CY2309NZSXC-1H 150C -65C 300 50 0 SZ1615EGN M-PHIL MR051029 CY2308SXC-1H 150C -65C 300 50 0 SZ1615EGN M-PHIL MR052046 CY2309SXC-1H 150C -65C 300 48 0 SZ1615KGN RA-CML MR051016 CY2309SXC-1H 150C -65C 300 49 0 SZ183AGAN M-PHIL 044301 CY7C63723-SXC 150C -65C 300 50 0 SZ183AGAN M-PHIL 044301 CY7C63723-SXC 150C -65C 300 50 0 SZ324510GL R-CML MR051022 CY62128BLL-70SXI 150C -65C 300 48 0 -65C 300 50 440 0 0 SZ324514L R-CML MR044005 CY62148DV30LL-70 Summary for 'Family' = SOIC (GullWing, Pb-Free) (9 detail records) SOIC (J lead) V28CGAGB O-INDNS MR044064 CY7C106B-20VC 150C -65C 300 48 0 V324EGAGB O-INDNS MR051002 CY7C1019B-12VC 150C -65C 300 45 0 V324EGAGB O-INDNS MR052014 CY7C1019B-10VC 150C -65C 300 45 0 V324FGAGB O-INDNS MR053015 CY7C109B-20VC 150C -65C 300 45 0 V444WGALE R-CML MR044022 CY7C1021B-15VC 150C -65C 300 45 0 V444WGALL R-CML MR052019 CY7C1021B-12VI 150C -65C 300 49 0 V444YAALE R-CML MR051015 CY7C1041CV33-12V 150C -65C 300 50 0 V444ZGALL R-CML MR053004 CY7C1021CV33 150C -65C 300 50 0 CY7C1021CV33-15V 150C -65C 300 50 427 0 0 V444ZGALL R-CML MR054001 Summary for 'Family' = SOIC (J lead) (9 detail records) SOIC (J lead, Pb-Free) VZ243GGBLL O-INDNS 052801 CY7C197 150C -65C 300 50 0 VZ243GGBLL O-INDNS 052801 CY7C197 150C -65C 300 50 0 VZ243GGBLL O-INDNS 052801 CY7C197 150C -65C 300 50 0 VZ28311GL R-CML NR053002 CY7C199CL-15VXC 150C -65C 300 50 0 VZ28311GL R-CML NR053002 CY7C199CL-15VXC 150C -65C 300 50 0 VZ28311GL R-CML NR053002 CY7C199CL-15VXC 150C -65C 300 50 0 VZ3644GALL R-CML MR053038 CY7C1049B-20VXI 150C -65C 300 48 0 VZ444WAGL R-CML MR052001 CY7C1021B-15VXC 150C -65C 300 50 0 VZ444ZALL R-CML MR053005 CY7C1021CV33-8VX 150C -65C 300 50 0 2005 Q4 RELIABILITY REPORT Page 46 of 48 Product Reliability Cypress BldKit Loc EvalNum Device VZ444ZALL R-CML MR054002 CY7C1021CV33-12V Summary for 'Family' = SOIC (J lead, Pb-Free) (10 detail records) Readout SS Rejects 150C -65C 300 47 495 0 0 FA Results CERDIP (Windowed) W129DF-TSC T-TAIWAN 050701 CY7C65640-LFXC 150C -65C 300 50 0 W129DF-TSC T-TAIWAN 050701 CY7C65640-LFXC 150C -65C 300 50 0 W129DF-TSC T-TAIWAN 050701 CY7C65640-LFXC Summary for 'Family' = CERDIP (Windowed) (3 detail records) 150C -65C 300 50 150 0 0 TSOP/ TSSOP Z1613GAGB T-TAIWAN MR051011 CY2309ZI-1H 150C -65C 300 45 0 Z1613GAGB T-TAIWAN MR052039 CY2308ZC-1H 150C -65C 300 50 0 Z1619GAGN RA-CML MR052027 CY22392ZC-366 150C -65C 300 48 0 R-CML MR051050 CY28346ZI-2T 150C -65C 300 50 0 Z5624BAGN R-CML MR052012 CY28409ZC 150C -65C 300 50 0 Z5624BAGN R-CML MR053046 CY28409ZC 150C -65C 300 50 0 Z5624BAGN R-CML 044903 CY28346ZC-2T 150C -65C 300 50 0 Z5624BAGN R-CML 044903 CY28346ZC-2 150C -65C 300 49 0 CY28346ZC-2T 150C -65C 300 49 441 0 0 Z5624BAGN Z5624BAGN R-CML 044903 Summary for 'Family' = TSOP/ TSSOP (9 detail records) TSOP I ZA32RHAALB R-CML MR044017 CY62128DV30LL-70 150C -65C 300 45 0 ZA32RHAALB R-CML MR051012 CY62128DV30LL-55 150C -65C 300 50 0 ZA32RHAALB R-CML MR052020 CY62128DV30LL-55 150C -65C 300 49 0 ZA32RHAALB R-CML MR053056 Summary for 'Family' = TSOP I (4 detail records) CY62128DV30LL-55 150C -65C 300 50 194 0 0 TSOP (Reverse) ZR28R2AGB R-CML MR044018 CY62256LL-70ZRI 150C -65C 300 45 0 ZR28R2AGN R-CML MR051013 CY62256LL-70ZRI 150C -65C 300 50 0 ZR28R2AGN R-CML MR053049 CY62256LL-70ZRI 150C -65C 300 45 0 CY62128BLL-55ZRI 150C -65C 300 50 190 0 0 ZR32RKAGB T-TAIWAN MR044023 Summary for 'Family' = TSOP (Reverse) (4 detail records) TSOP II ZS324CA3E T-TAIWAN MR044070 CY7C1019B-12ZC 150C -65C 300 44 0 ZS324FAGE T-TAIWAN MR052009 CY7C1019CV33-12Z 150C -65C 300 50 0 ZS324FAGE T-TAIWAN MR053055 CY7C1019CV33-12Z 150C -65C 300 50 0 ZS444ABALE R-CML MR044021 CY7C1021CV33-15Z 150C -65C 300 44 0 ZS444ABALE R-CML MR053058 CS6125AT 150C -65C 300 50 0 ZS444ABALL R-CML MR051010 CY7C1021CV33-15Z 150C -65C 300 50 0 ZS444AKALN R-CML MR052022 CY7C1041CV33-15Z 150C -65C 300 50 0 ZS544AALE G-TAIWAN MR044031 CY7C1069AV33-12Z 150C -65C 300 50 0 ZS544AALE G-TAIWAN MR052030 Summary for 'Family' = TSOP II (9 detail records) CY7C1069AV33-12Z 150C -65C 300 50 438 0 0 TSOP (Pb-Free) ZT28R4AGL R-CML MR052011 CY7C1399B-15ZXC 150C -65C 300 50 0 ZT32RKGGL T-TAIWAN MR052044 CY7C109B-15ZXC 150C -65C 300 50 0 CY2308SC-1 150C -65C 300 50 150 0 0 ZT32RYAGL T-TAIWAN MR051079 Summary for 'Family' = TSOP (Pb-Free) (3 detail records) 2005 Q4 RELIABILITY REPORT Page 47 of 48 Product Reliability Cypress BldKit Loc EvalNum Device Readout SS Rejects ZW324FAGL T-TAIWAN MR052021 CY7C1019CV33-12Z 150C -65C 300 50 0 ZW444ADALL R-CML MR052003 CY7C1041CV33-15Z 150C -65C 300 50 0 ZW444ADGL R-CML MR044032 CY7C1041CV33-12Z 150C -65C 300 50 0 ZW444AFLL R-CML MR044004 CY62146DV30LL-70 150C -65C 300 50 0 ZW444NAGN R-CML MR051047 CY62126DV30LL-55 150C -65C 300 50 0 ZW444VAGL R-CML MR053033 CY7C1021B-15ZXI 150C -65C 300 50 0 ZW544AALL G-TAIWAN NR052007 7C1069AC-GZWC Summary for 'Family' = TSOP II (Pb-Free) (7 detail records) 150C -65C 300 45 345 0 0 150C -65C 300 50 50 0 0 FA Results TSOP II (Pb-Free) TSOP (Reverse, Pb-Free) ZY28R2AGN R-CML MR053057 CY62256LL-70ZRXI Summary for 'Family' = TSOP (Reverse, Pb-Free) (1 detail record) TSSOP (Pb-Free) ZZ0812AGL T-TAIWAN MR043048 CY25104ZXC-2 150C -65C 300 50 0 ZZ1613GAN T-TAIWAN MR052077 CY2309ZXI-1H 150C -65C 300 50 0 ZZ2411AGN T-TAIWAN MR051020 CY7C68300A-56LFX 150C -65C 300 45 0 ZZ2411AGN T-TAIWAN MR051051 CY22313ZXC 150C -65C 300 48 0 ZZ2415GAL RA-CML MR051028 CY22313ZXC 150C -65C 300 46 0 ZZ2415GAL RA-CML MR052006 CY22313ZXC 150C -65C 300 49 0 ZZ2415GAL RA-CML MR052038 CY22313ZXC 150C -65C 300 50 0 ZZ2813AGN T-TAIWAN 053006 CYI5002ZXC 150C -65C 300 50 0 ZZ2817AGL RA-CML 042701 7C89000AC-RAZZC 150C -65C 300 46 0 ZZ2817AGL RA-CML 042701 7C89000AC-RAZZC 150C -65C 300 45 0 ZZ2817AGL RA-CML 042701 7C89000AC-RAZZC 150C -65C 300 45 0 ZZ2817AGL RA-CML 051903 CY221R28-ZXC 150C -65C 300 50 0 ZZ2817AGL RA-CML 051903 CY221R28-ZXC 150C -65C 300 50 0 ZZ5624BG R-CML 052802 CY28411ZXC 150C -65C 300 47 0 ZZ5624BG R-CML 052802 CY28411ZXC 150C -65C 300 45 0 ZZ5624BGN R-CML MR043046 CY28442ZXC-2 150C -65C 300 50 0 CY28411ZXC 150C -65C 300 46 0 ZZ5624BGN R-CML MR044054 ZZ5624BGN R-CML MR051026 CY28442ZXC 150C -65C 300 50 0 ZZ5624BGN R-CML 050504 CY28411ZXCT 150C -65C 300 49 0 ZZ5624BGN R-CML 050504 CY28411ZXCT 150C -65C 300 50 0 ZZ5624BGN R-CML 050504 CY28411ZXCT Summary for 'Family' = TSSOP (Pb-Free) (21 detail records) 150C -65C 300 50 1011 0 0 Grand Total 2005 Q4 RELIABILITY REPORT 13277 0 Page 48 of 48