Q1 - 2006

Product Reliability
2006 Q1 RELIABILITY REPORT
TABLE OF CONTENTS
1.0
OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM
2
2.0
DEVICE RELIABILITY
3
3.0
2.1
EARLY FAILURE RATE SUMMARY
3
2.2
LONG TERM FAILURE RATE SUMMARY
4
2.3
DATA RETENTION SUMMARY
5
PACKAGE RELIABILITY
6
3.1
PRESSURE COOKER TEST
7
3.2
HAST (HIGHLY ACCELERATED STRESS TEST)
8
3.3
TEMPERATURE CYCLE
9
3.4
HIGH TEMPERATURE STORAGE
10
APPENDIX A: FAILURE RATE CALCULATION
11
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
15
APPENDIX C: EQUIVALENCE OF STRESS TEST CONDITIONS
17
APPENDIX D: RELIABILITY DATA
18
Note: The results reported herein are for 1ST Quarter 2006.
2006 Q1 RELIABILITY REPORT
Page 1 of 78
Product Reliability
1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR, INC. TOTAL QUALITY MANAGEMENT SYSTEM
This report summarizes Cypress Semiconductor Product Reliability for the period of the 1st quarter of 2006. It
includes data from devices fabricated at the Round Rock, Texas; Minnesota and Fab foundry facilities and
packaged-device data from assembly sites at Cypress Philippines and sub-contractors.
Cypress Semiconductor has established aggressive reliability objectives to assure that all products exhibit
reliability, which exceeds customer reliability requirements for purchased components. The quality standard at
Cypress is zero defects resulting in a culture requiring continuous improvement in quality and reliability.
Product reliability is assured by a total quality management system. The quality management system is
described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number
90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review
and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4)
manufacturing identification of "Maverick Lot" yield limits; (5) formal training and certification of manufacturing
personnel; (6) qualification of new products and manufacturing processes; (7) continuous reliability monitoring;
(8) formal failure analysis and corrective action; and (9) competitive benchmarking.
Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress
Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress
Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard
production material. Sample selection is based on generic product families. These generic products are
designed with very similar design rules and manufactured from a core set of processes.
Reliability strategy requires that every failure that occurs during reliability testing be subjected to failure
analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism.
Corrective action is then implemented to prevent future failures, resulting in continuous improvement in product
reliability.
Copies of the Cypress Semiconductor documents referenced herein are available through your Cypress
Semiconductor sales representative. Questions about product reliability may be addressed to the undersigned.
Sabbas Daniel
Vice-President for Quality
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134-1599
Cypress Quality Fax: (408) 943-2165
2006 Q1 RELIABILITY REPORT
Page 2 of 78
Product Reliability
2.0
PRODUCT RELIABILITY
In product stress testing, the main emphasis is on the useful life section of the bathtub curve. The test
methodology used to predict the useful life period is a steady-state life test under a dynamic bias and at
temperatures 125°C or 150°C for the maximum specified use voltage of the product. The duration at these
temperatures is 1,000 and 500 hours, respectively.
In Cypress, product reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. Each fab site and technology family from each product line is being
sampled for product monitor. These reliability tests utilize the following stress factors to accelerate failure:
temperature, current and /or voltage. The product reliability tests currently employed at Cypress include Early
Failure Rate (EFR) and Long Term Failure Rate (LFR).
2.1
EARLY FAILURE RATE SUMMARY
Early Failure Rate Determination: High Temperature Operating Life testing (HTOL), for as long
as 96 hours, is used to estimate device early failure rate. This stress will typically correspond
to the first 2000 hours of device operation in a system environment. The remainder of the
device’s lifetime is characterized with extended LFR testing (See Section 3)
Test
:
Conditions :
Duration
:
Failure
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal + 15%, 150°C or 125°C.
48 hours HTOL at 150°C or 96 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Table 1. Early Failure Rate Summary
Technology
B53
C8
MAGNA 1.2
P20
P26
POW ER 0.6
R28
R42
R52
R7
Device Hours
31,587
97,796
48,768
19,200
255,824
41,710
18,000
279,914
717,997
2,487,903
# Failed
0
0
0
0
0
0
0
0
1
11
FIT Rate
Insufficient
Insufficient
Insufficient
Insufficient
21
Insufficient
Insufficient
19
8
15
PPM
0
0
0
0
0
0
0
0
60
202
R8
R9
540,008
3,738,512
1
6
11
6
70
69
S4
STARM
T013
TOW ER 165
TSMC 180
Grand Total
319,455
21,677
30,209
409,301
20,410
9,078,272
0
0
0
0
0
19
17
Insufficient
Insufficient
13
Insufficient
7
0
0
0
0
0
89
Failure M ode
None
None
None
None
None
None
None
None
No visual defect
No visual defect - 6
Em bedded particle -2
Poor salicidation -1
Metal stringer - 1
Poly protrusion - 1
AC/DC degradation
No visual defect -4
Abnormal poly contact - 1
Metal stringer - 1
None
None
None
None
None
See above
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%confidence
bound for a zero-fails sample.
2006 Q1 RELIABILITY REPORT
Page 3 of 78
Product Reliability
2.2
LONG TERM FAILURE RATE SUMMARY
A High Temperature Operating Life test (HTOL) is used to estimate long-term reliability. By
operating the devices at accelerated temperature and voltage, hundreds of thousands of use
hours can be compressed into hundreds of test hours.
Test
:
Conditions :
Duration
:
Failure
Fit Rate
:
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal +15% 150°C or 125°C.
A minimum of 80 hours at 150°C or 168 hours at 125°C
Generally 500 hours at 150°C or 1000 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Derated to 55° C ambient, with 60% upper confidence bound for 0 failures,
Ea =0.7ev (Refer to Appendix A)
Table 2. Long Term Failure Rate Summary
Technology
B53
C8
P20
P26
POWER 0.6
R28
R42
R52
R7
R8
R9
Device Hours
58,065
197,723
150,000
553,684
171,774
66,340
666,932
1,331,317
997,667
425,333
1,857,456
S4
STARM
T013
TSMC 130
TSMC 180
Grand Total
897,439
160,968
51,668
21,683
78,052
7,686,099
# Failed
0
0
0
0
0
0
0
0
2
0
2
FIT Rate
Insufficient
27
36
10
31
Insufficient
8
4
9
13
5
0
0
0
0
0
4
6
33
Insufficient
Insufficient
Insufficient
0
Failure Mode
None
None
None
None
None
None
None
None
No visual defect
None
Blocked Contact
No visual defect
None
None
None
None
None
See above
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample
2006 Q1 RELIABILITY REPORT
Page 4 of 78
Product Reliability
2.3
DATA RETENTION SUMMARY
A high-temperature, non-biased bake test ensures that data retention meets established
reliability goals. The devices are baked without bias at either 165oC for plastic-packaged
devices, or 250oC for hermetically-packaged devices. DRET is performed on programmed
devices to establish a failure rate for cell charge loss. The reliability at nominal system
ambient temperature is related to the failure rate at elevated temperatures through the
Arrhenius equation.
Test
:
Conditions :
Duration
:
Failure
:
Data Retention Testing (DRET)
High temperature non-biased bake
A minimum of 500 hours at 150°C or 168 hours at 165°C
Generally 1000 hours at 150°C or 500 hours at 165°C.
Devices are programmed with a worst case program pattern before being
subjected to data retention testing. The memory pattern is verified at each
readpoint and any device with altered bits is classified a failure.
Table 3. Data Retention Summary
Technology
P20
P26
S4
TSMC 500
Grand Total
2006 Q1 RELIABILITY REPORT
Sample Size
152
804
2003
152
3161
Device-Hours # Failed
76,000
0
291,099
0
1,001,500
0
76,000
0
1,469,599
0
PPM
0
0
0
0
0
Failure Mode
None
None
None
None
None
Page 5 of 78
Product Reliability
3.0
PACKAGE RELIABILITY
Package-level reliability testing refers to the assessment of the over-all reliability of the device in packaged
form. This consists of subjecting packaged samples to reliability tests that expose the various sample sets to
different stress conditions, after which the samples are tested for any degradation in quality after the stress.
In Cypress, package reliability tests are performed as part of the qualification processes and as part of the
standard reliability monitoring program. The reliability test employed is chosen based on the failure
mechanism, as different stress tests accelerate different failure mechanisms. These reliability tests utilize one
or more of the following stress factors to accelerate failure: temperature, moisture or humidity, current, voltage,
and pressure. The package reliability tests currently employed at Cypress include Pressure Cooker Test
(PCT, Highly Accelerated Stress Test (HAST), Temperature Cycle Test (TCT), and High Temperature Storage
(HTS). Figure 1 shows the Cypress package reliability stress flow.
Surface-mount samples are preconditioned per Jedec Std JESD22-A113 prior to package reliability testing.
This is required prior TCT, PCT and HAST testing. Preconditioning simulates the board mounting process of
the customer. It normally consists of a temperature cycle to simulate exposure to different temperatures during
shipping, a bake to drive away the moisture inside the packages of the samples, a soak to drive a controlled
amount of moisture into the package, and three cycles of convection reflow. Packages are soaked and
reflowed based on its shipping moisture sensitivity classification. The samples are tested (acoustic and
electrical) after preconditioning, failures from which are considered as preconditioning failures and not reliability
failures. Preconditioning failures should be taken seriously, since these imply that the samples are not robust
enough to even withstand the board mounting process.
Cypress conducts all major classes of package reliability tests on each of its package families. The package
characteristics and assembly locations are the primary considerations when grouping packages into package
families. A package family may consist of a group of 44-lead to 144-lead TQFP packages manufactured at a
particular manufacturing location.
Initital
Electrical Testing
Time Zero
Acoustic Analysis
(serialized 15 units)
Moisture
Pre-conditioning
Post Pre-Con
Electrical Testing
Post Pre-Con
Acoustic Analysis
(same serialized units)
Temperature Cycle Test
(TCT)
(300, 500, 1000 cycles))
Pressure Cooker Test
(PCT)
(168 hours)
Highly Accelerated
Stress Test (HAST)
(128 hours)
High Temperature
Storage (HTS)
(500, 1000 hours)
Post Stress
Electrical Testing
Figure 1. Cypress Package Reliability Stress Flow
2006 Q1 RELIABILITY REPORT
Page 6 of 78
Product Reliability
3.1
PRESSURE COOKER TEST (PCT)
The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure
environmental durability of epoxy-packaged parts. Passivation cracks, ionic contamination,
and corrosion susceptibility are all accelerated by this stress.
Conditions
Pre-Conditioning
:
:
Failure Modes
Failure Mechanism
:
:
15 PSIG, 121°C, No bias, for a minimum of 168 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 4. Pressure Cooker Test Failure Rate Summary
Package
CERDIP (Windowed)
FBGA (0.75-0.8)
FBGA (0.75-0.8, Pb-Free)
FBGA (1.0)
FLIPCHIP (Build-Up Substrate w/ HS)
FVBGA (0.75-0.8, 0.3mm)
PBGA (1.27)
PBGA (Cavity/Heatsink)
PBGA (Cavity/Heatsink, Pb-Free)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
PQFP
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
SSOP
SSOP (Pb-Free)
TQFP
TQFP (10x10)
TQFP (Pb-Free)
TQFP (Thermal)
TSOP (Pb-Free)
TSOP (Reverse)
TSOP (Reverse, Pb-Free)
TSOP I
TSOP II
TSOP II (Pb-Free)
TSOP/ TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
Grand Total
2006 Q1 RELIABILITY REPORT
Sample Size # Failed Defects %
100
0
0
198
0
0
50
0
0
243
0
0
139
0
0
480
0
0
140
0
0
107
0
0
95
0
0
475
0
0
335
0
0
250
0
0
100
0
0
97
0
0
150
0
0
549
0
0
49
0
0
392
0
0
145
0
0
230
0
0
586
0
0
440
0
0
195
0
0
670
0
0
345
0
0
389
0
0
100
0
0
1,330
0
0
150
0
0
98
0
0
140
0
0
50
0
0
100
0
0
418
40
9.57
199
0
0
396
0
0
448
0
0
240
0
0
10,618
40
0.38
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Die edge delamination
None
None
None
None
Die edge delamination
Page 7 of 78
Product Reliability
3.2
HIGHLY ACCELERATED STRESS TEST (HAST)
Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This
change was necessary because our package reliability had improved to the point where the
old 85°C/85% R.H. Temperature-humidity-bias testing would not induce failures. Failures are
necessary to judge progress and compare packaging changes. HAST testing has been shown
to be at least twenty times more accelerated then 85°C/85% R.H. temperature-humidity-bias
testing.
Conditions
:
Pre-Conditioning
:
Failure Modes
Failure Mechanism
:
:
Present Conditions: 130°C / 85% RH minimum power dissipation, for
a minimum of 128 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
Parametric shifts, high leakage, and/or catastrophic
Die corrosion or contaminants such as foreign material on or within
the package materials. Poor package sealing.
Table 5. Highly Accelerated Stress Test (HAST) Failure Rate Summary
Package
CERDIP (Windowed)
FBGA (0.75-0.8)
FBGA (1.0)
FLIPCHIP (Build-Up Substrate w/ HS)
FVBGA (0.75-0.8, 0.3mm)
PBGA (Cavity/Heatsink, Pb-Free)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
SSOP
SSOP (Pb-Free)
TQFP
TQFP (10x10)
TQFP (Pb-Free)
TQFP (Thermal)
TQFP (Thermal, Pb-Free)
TSOP (Pb-Free)
TSOP (Reverse)
TSOP (Reverse, Pb-Free)
TSOP I
TSOP II
TSOP II (Pb-Free)
TSOP/ TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
Grand Total
2006 Q1 RELIABILITY REPORT
Sample Size
47
167
47
128
291
196
241
378
199
41
172
373
44
380
141
296
630
383
246
279
166
128
96
290
35
46
147
107
47
94
367
379
331
300
238
7,450
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 8 of 78
Product Reliability
3.3
TEMPERATURE CYCLE TEST (TC)
Differences in thermal expansion coefficients are accentuated by cycling devices through
temperature extremes. If the materials do not expand and contract equally, large stresses can
develop. The Temperature Cycle test stresses mechanical integrity by exposing a device to
alternating temperature extremes. Weakness and thermal expansion mismatches in die
interconnections, die attach, and wire bonds are often detected with this acceleration test.
Condition
:
Pre-Condition
:
Duration
:
Failure Mode
Failure Mechanism
:
:
MIL-STD-883D, Method 1010, Condition B, -55°C to 125°C
MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C
(Refer to Appendix C for derating factor calculation)
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
300 cycles minimum at Condition C,
1000 cycles minimum at Condition B
Parametric shifts and catastrophic failures
Wire bond, cracked or lifted die and package failure.
Table 6. Temperature Cycling Failure Rate Summary
Package
CERDIP (Windowed)
Chip On Board (Pb-Free)
FBGA (0.75-0.8)
FBGA (0.75-0.8, Pb-Free)
FBGA (1.0)
FLIPCHIP (Build-Up Substrate w/ HS)
FVBGA (0.75-0.8, 0.3mm)
LCC
LCC (Windowed Plastic)
PBGA (1.27)
PBGA (Cavity/Heatsink)
PBGA (Cavity/Heatsink, Pb-Free)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
PQFP
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
SSOP
SSOP (Pb-Free)
TQFP
TQFP (10x10)
TQFP (Pb-Free)
TQFP (Thermal)
TQFP (Thermal, Pb-Free)
TSOP (Pb-Free)
TSOP (Reverse)
TSOP (Reverse, Pb-Free)
TSOP I
TSOP II
TSOP II (Pb-Free)
TSOP/ TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
Grand Total
2006 Q1 RELIABILITY REPORT
Sample Size
299
270
428
48
341
537
1,073
200
300
199
100
245
385
283
250
100
100
420
1,072
50
478
145
317
706
582
298
876
588
472
100
846
149
99
150
140
50
99
400
349
394
729
573
15,240
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
29
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
29
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Cut wedge
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Cut wedge
Page 9 of 78
Product Reliability
3.4 HIGH TEMPERATURE STORAGE (HTS)
A high-temperature, non-biased bake test is performed to determine the effect on devices of
long-term storage at elevated temperatures without any electrical stresses applied. The
devices are baked without bias at either or 150oC or 165oC for plastic-packaged devices. The
reliability at nominal system ambient temperature is related to the failure rate at elevated
temperatures through the Arrhenius equation.
Test
Conditions
Duration
Failure Mode
Failure Mechanism
:
:
:
:
:
High Temperature Storage (HTS)
High temperature non-biased bake
A minimum of 500 hours tested up to 1000 hours at 150°C
Parametric shifts and catastrophic failures
Lifted ball bonds due to gross intermetallic growth
Table 7. High Temperature Storage Failure Rate Summary
Package
CERDIP (Windowed)
Chip On Board (Pb-Free)
FBGA (0.75-0.8)
FBGA (0.75-0.8, Pb-Free)
FBGA (1.0)
FLIPCHIP (Build-Up Substrate w/ HS)
FVBGA (0.75-0.8, 0.3mm)
LCC
LCC (Windowed Plastic)
PBGA (1.27)
PBGA (Cavity/Heatsink)
PBGA (Cavity/Heatsink, Pb-Free)
PDIP
PDIP (Pb-Free)
PLCC
PLCC (Pb-Free)
PQFP
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing)
SOIC (GullWing, 450 footprint)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
SSOP
SSOP (Pb-Free)
TQFP
TQFP (10x10)
TQFP (Pb-Free)
TQFP (Thermal)
TSOP (Pb-Free)
TSOP (Reverse)
TSOP (Reverse, Pb-Free)
TSOP I
TSOP II
TSOP II (Pb-Free)
TSOP/ TSSOP
TSSOP (Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
Grand Total
2006 Q1 RELIABILITY REPORT
Sample Size
100
360
189
100
194
90
558
100
100
300
290
100
840
370
500
194
100
479
500
99
881
288
150
598
768
488
1,460
100
684
100
194
200
299
276
100
200
788
350
397
550
472
14,906
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 10 of 78
Product Reliability
APPENDIX A: FAILURE RATE CALCULATION
Thermal Acceleration Factors
Acceleration factors (AF) for thermal stresses (Early Failure Rate, Latent Failure Rate, Data Retention and
High Temperature Storage) are calculated from the Arrhenius equation)
AF = exp
Ea
k
1 - 1
Tu Tt
where :
Ea = Activation Energy of the defect mechanism
K = Boltzmann’s constant = 8.62 x 10 –5 eV/Kelvin
Tt is the junction temperature of the device under stress
Tu is the junction temperature of the device at use conditions
While there is no substitute for experimentally determining the activation energy, obtaining this information is
very difficult because few devices fail stress tests. In the absence of experimental data, the following literature
values are used.
Activation
Energy Ea
Failure Mechanism
Charge Gain
Charge Loss (defects)
Charge Loss (Ionic contamination, edge bits)
(eV)
0.3-0.6
0.6
0.9
Charge loss (intrinsic wear out)
0.3-0.6
Electromigration
0.6-1.0
Intermetallic Growth
1.0
Ionic Contamination
1.0-1.4
Silicon Bulk Defects
0.5
Oxide Defects
0.3
Unknown/Non-Visual Defect (NVD)
0.45
2006 Q1 RELIABILITY REPORT
Page 11 of 78
Product Reliability
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Temperature-Humidity Acceleration Factors
Cypress estimates acceleration factors for temperature-humidity stresses (Pressure Cooker Test and Highly
Accelerated Stress Test) from a model developed by Hallberg and Peck (“Quality and Reliability Engineering
International”. Vol. 7, 1991).
-3
where :
AF = RHt exp Ea
RHu
k
1 - 1
Tu Tt
Tu = use environment junction temperature (°K)
Tt = test environment junction temperature (°K)
Ea = failure mechanism activation energy (0.9 for corrosion)
k = Boltzman’s Constant (8.62 x 10 –5 eV/oKelvin)
RHu = use environment relative humidity
RHt = test environment relative humidity
AF = acceleration factor
The Hallberg and Peck model requires the stress junction temperature and relative humidity as well as the use
temperature and relative humidity. To estimate the use relative humidity, we assume that the device room
temperature is 35 oC (95 oF) and the room relative humidity is 100%. From any Handbook of Chemistry and
Physics, the vapor pressure of water VP (water) at 35 oC is 41.175 mm Hg. If we assume that the device will
operate with a junction temperature of 70 oC (VP (water) at 70 oC is 233.7 mm Hg), the junction relative
humidity (RHj) is
RHj
= 100%
41.175
233.7
= 17.6%
The operating conditions of the devices are then 70 oC and 17.6% relative humidity.
Our Pressure Cooker Test (PCT) submits the devices to a temperature of 121 oC and 100% relative humidity.
Using the Hallberg and Peck model, the acceleration factor for the PCT stress can be calculated:
AF =
2006 Q1 RELIABILITY REPORT
17.6
100
-3
exp 0.9
k
1_ - 1_
343 394
= 9, 433
Page 12 of 78
Product Reliability
APPENDIX A: FAILURE RATE CALCULATION (cont.)
The acceleration factor for HAST is calculated similarly, except that junction temperature heating effects must
be included when estimating the relative humidity at the die surface.
Assuming an average junction
temperature rise of 5 oC, the relative humidity at the die surface during 130 C HAST testing can be calculated.
VP (130 oC) = 2026.10 mm Hg
VP (135 oC) = 2347.26 mm Hg
RHj
AF =
= 85%
17.6
73.4
-3
2026.10
2347.26
exp 0.9
k
= 73.4%
1_ - 1_
343 408
= 9,261
Similarly, for 140 oC HAST testing,
VP (140 oC) = 2710.92 mm Hg
VP (145 oC) = 3116.76 mm Hg
RHj
AF =
2006 Q1 RELIABILITY REPORT
= 85%
17.6
73.9
-3
2710.92
3116.76
exp 0.9
k
= 73.9%
1_ - 1_
343 418
= 17,433
Page 13 of 78
Product Reliability
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Failure Rate Calculation
For all but LFR test, Cypress reports the failure rate in terms of ppm. Early life reliability is reported in terms of
ppm defective expected during the first year of use under typical use conditions. No upper confidence bound
will be used for this estimate. The ppm defective is the ratio of the number of rejects to the number of samples
and expressed in ppm.
PPM =
Total Rejects x 1,000,000
Total Samples
Intrinsic, or later life reliability, shall be reported using the exponential model, in terms of FITs, with a 60%
upper confidence bound for 0 failures or the demonstrated FIT estimate in the case there are failures.
FR (FIT) =χ2α, 2n +2 /(2 * AF * Device Hours) * 10 9
where:
χ2 α,2n +2 = Chi square factor for 2n +2 degrees of freedom at 60% confidence level.
n = number of failure.
AF = Thermal Acceleration factor and is calculated per Arrhenius equation assuming a 0.7eV activation energy.
Voltage acceleration factor is not included in failure rate calculation even though voltage acceleration may be
used during stress. Typical use conditions shall be considered to be 55°C ambient with a 15°C temperature
rise at the junction. Thus, use junction temperature is 70°C.
2006 Q1 RELIABILITY REPORT
Page 14 of 78
Product Reliability
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
Two acceleration factor (AF) models are used to model temperature cycle failures. The model proposed by
Zelenka [1] and others uses the epoxy molding temperature (Tmold = 170 °C) and the minimum temperature
reached during temperature cycling , (Tmin).
m
AFbrittle =
Tmold - Tmin,stress
Tmold - Tmin,stress
The model constant, m, is experimentally calculated for each failure mechanism. The acceleration factor is
labeled ‘brittle’ because the derivation of this equation assumes brittle fracture mechanics. Basically, the
model assumed that cracks advance a little every time the maximum stress is reached. The maximum stress
is assumed to be proportional to the difference in temperature between the minimum and maximum stress
temperatures. For plastic-encapsulated devices, the stress is minimum during molding, (Tmold), and a
maximum during the lowest temperature reached during temperature cycling, (Tmin).
The model constant, m, is a function of the failure mechanism.
Thin film cracking
Al/Au Intermetallic fractures
Chip-out (cratering) bond failures
m = 12 (Blish and Vaney [2])
m=4
m = 7 (Dunn and McPherson [3])
For ductile materials, dislocation movement dominates the fracture mechanics and a different model is used.
The second, and most widely accepted model, use the difference between the minimum and maximum
temperatures during temperature cycle testing (Tmin and Tmax) to calculate an acceleration factor.
m
AFductile =
Tmax, stress - Tmin,stress
Tmax,use - Tmin,use
The model constant, ‘m’, is again experimentally calculate for each failure mechanism.
Coffin and Manson [4] developed this model from empirical observations of metal fatigue. In ductile materials,
if the applied stress is high enough, dislocation are produced. At the high temperature condition of the
temperature cycling stress, dislocations are forced towards one metal surface. At the low temperature , the
dislocations try to glide back to their original position, but many cannot because they became entangled with
other dislocations. After many cyles, these tangles grow until cracking, and finally failure, occurs. Both
minimum and maximum temperatures are important, because both contribute to dislocation movement and
entanglement. This model is recommended for any failures involving ductile materials. Model constants for
ductile failure mechanism follow.
Wirebond breakage
Solder Fatigue
2006 Q1 RELIABILITY REPORT
m = 5.16 (Cypress experimentation)
m = 2 (Blish and Vaney [2])
Page 15 of 78
Product Reliability
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS (cont.)
Our commercial devices are specified to operate between 0°C and 70 °C. Using this information, the
acceleration factor, AF, between use and Military Condition C stress testing (-65°C to 150°C), for the brittle,
thin film cracking failure mechanism and ductile, wire bond breakage failure mechanism can be calculated.
12
AF brittle
=
170 - (-65)
170 - 0
AF ductile
=
150 - (-65)
70 - 0
=
49
5.16
=
327
References:
[1] R.L. Zelenka, IEEE/IRPS, pp. 30-34, 1991
[2] R.C. Blish and P.R. Vaney, IEEE/IRPS, pp 22-29, 1991
[3] C.F. Dunn and J.W. McPherson, IEEE/IRPS, pp 252-258, 1990
[4] S.S. Manson, thermal Stress and Low-Cycle Fatigue, (Robert Krieger : Malabar, Florida), 1981.
2006 Q1 RELIABILITY REPORT
Page 16 of 78
Product Reliability
APPENDIX C: EQUIVALENCE OF DIFFERENT STRESS TEST CONDITIONS
During stress testing, more than one set of test conditions were used. To account for this difference, stress
test hours or cycles at the lower stress condition were derated and then added to the total for the most severe
stress test condition.
Dynamic (HTOL)
HTOL (EFR/LFR) test is performed at 150 °C and 125 °C. Using the Arrhenius equation (Appendix A) and an
activation energy of 0.7 eV, the derating factor, DF, between 125°C and 150 °C can be calculated.
DF (between 125C and 150C) = exp
0.6 ____1 _______ - ______1______
k 150 + 15 + 273
125 + 15 + 273
= 0.326
Derating calculation assumes a 15 °C rise due to junction heating.
Temperature Cycling
Two different temperature cycling conditions were used to measure reliability, -65°C to 150°C and –55°C to
125°C. Using the brittle failure mechanism model with m = 12, the derating factor between -65°C to 150°C and
–55°C to 125°C is calculated.
12
DF
=
170 - (-55)
170 – (-65)
=
1.685
Using the ductile failure mechanism model with m = 5.16, the derating factor between -65°C to 150°C and –
55°C to 125°C is obtained.
5.16
DF
=
125 - (-55)
150 - (-65)
=
2.501
HAST
The derating factor between two HAST conditions, 140 °C / 85%RH and 130 °C / 85% RH is simply the ratio of
the acceleration factors (See Appendix A)
DF
2006 Q1 RELIABILITY REPORT
=
9,261_
17, 433
=
0.531
Page 17 of 78
Product Reliability
APPENDIX D: RELIABILITY DATA
Summary Detail -- EFR Performance Over Time
Technology
Div
EvalNum
TV
B53
CCD
052404
1
CCD
052404
1(1)
CCD
052404
1(2)
Device
Temp Volt
Duration
7B6936AC-LLYC
125C
3.8V
96
340
0
7B6936AC-LLYC
125C
3.8V
96
340
0
7B6936AC-LLYC
125C
3.8V
96
340
0
125C
2.35V
96
Summary for 'Technology' = B53 (3 detail records)
Sum
C8
7C87741A
0
89
0
1B
CCD
043004
3A
7C87742A
125C
2.35
96
134
0
CCD
043004
3C
7C87741A
125C
2.35V
96
276
0
CCD
043004
4
7C87740A
125C
2.35V
96
169
0
CCD
043004
5A
7C87741A
125C
2.35V
96
175
0
CCD
043004
6
7C87741A
125C
2.35V
96
304
0
CCD
043004
6A
7C87742A
125C
2.35V
96
406
0
CCD
043004
8
7C87742A
125C
2.35V
96
434
0
CCD
043004
8A
7C87741A
125C
2.35
96
671
0
CCD
043004
9
7C87741A
125C
2.35V
96
500
0
3158
0
CCD
054805
R1
CY7C651131
150C
5.75
48
506
0
CCD
054805
R2
CY7C651131
150C
5.75
48
510
0
1016
0
CY7C343-35JC
150C
5.75
96
200
0
DCD
MR051058
R1
Summary for 'Technology' = P20 (1 detail record)
Sum
P26
1020
043004
Summary for 'Technology' = MAGNA 1.2 (2 detail records)
Sum
P20
Rejects FA
CCD
Summary for 'Technology' = C8 (10 detail records)
Sum
MAGNA 1.2
SS
From: 4/5/2005
To: 3/31/2006
200
0
CCD
054604
3
7C634131CU-OPZC
150C
5.75V
48
667
0
CCD
054604
3(1)
7C634131CU-OPZC
150C
5.75V
48
484
0
CCD
054604
R2
CY7C65113C-SXC
150C
5.75
48
612
0
CCD
054604
R2(1)
CY7C65113C-SXC
150C
5.75
48
612
0
CCD
054604
R3
CY7C65113C-SXC
150C
5.75
48
612
0
CCD
054604
R3(1)
CY7C65113C-SXC
150C
5.75
48
204
0
CCD
054604
R5
CY7C65113C-SXC
150C
5.75
48
407
0
CCD
054604
R5(1)
CY7C65113C-SXC
150C
5.75
48
191
0
CCD
054604
R5(2)
CY7C65113C-SXC
150C
5.75
48
408
0
CCD
054605
1
7C637402AU-OPZC
150C
5.75V
64
335
0
2006 Q1 RELIABILITY REPORT
Page 18 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
P26
CCD
054605
2
7C637402AU-OPZC
Device
150C
5.75V
48
335
0
CCD
054605
3
7C637402AU-OPZC
150C
5.75V
48
351
0
Summary for 'Technology' = P26 (12 detail records)
Sum
POWER 0.6
5218
0
MR051083
R1
CYK128K16SCBU-55BVXI
125C
3.8
96
200
0
MID
MR052047
R1
CYK128K16MCCBU-55BVIT
150C
3.8
96
249
0
MID
MR054051
R1
CYK128K6C7BW-70BVI
125C
3.8
120
300
0
749
0
CY7C185-25VC
150C
5.75
60
300
0
300
0
388
0
MID
MR052086
R1
Summary for 'Technology' = R28 (1 detail record)
Sum
R42
DCD
053007
R2C
CY7C027V
150C
3.8
48
DCD
053007
R2D
CY7C027V
150C
3.8
48
366
0
DCD
053007
R3C
CY7C027V
150C
3.8
48
1059
0
DCD
MR052043
R1
CY7C09389V-9AC
150C
3.8
48
150
0
DCD
MR052043
R1A
CY7C09389V-9AC
150C
3.8
48
50
0
DCD
MR053011
R1
CY7C038V-25AC
150C
3.8
48
150
0
DCD
MR054046
R1
CY7C024AV-20AXI
125C
3.8
96
150
0
DCD
MR054046
R1A
CY7C024AV-20AXI
125C
3.8
96
150
0
MID
053407
R1
CY62256LL
150C
5.75
48
849
0
MID
053407
R2
CY62256LL
150C
5.75
48
846
0
MID
053407
R3
CY62256LL
150C
5.75
48
850
0
0
MID
MR052079
R1
CY62256LL-70SNC
125C
5.75
96
200
MID
MR053024
R1
CG6521M
125C
5.75
96
196
0
MID
MR053034
R1
CG6520AM
125C
5.25
144
299
0
MID
MR054031
R1
CY62256LL-55SNXI
125C
5.75
96
297
0
MID
MR054053
R1
CG6519AM
125C
5.75
96
300
0
6300
0
Summary for 'Technology' = R42 (16 detail records)
Sum
R52
Rejects FA
MID
Summary for 'Technology' = POWER 0.6 (3 detail records)
Sum
R28
SS
CCD
041303
1
7C89000AC-RAZZC
150C
2.875V 48
526
1 041303-1E1
CCD
041303
1(1)
7C89000AC-RAZZC
150C
2.875V 48
477
0
CCD
041303
1(2)
7C89000AC-RAZZC
150C
2.875V 48
520
0
CCD
041303
1(3)
7C89000AC-RAZZC
150C
2.875V 48
500
0
CCD
043801
1
7C823C09AC-MSZI
150C
3.8V
48
504
0
CCD
043801
1(1)
7C823C09AC-MSZI
150C
3.8V
48
496
0
CCD
050303
R4
CY7C68000-56PVXC
150C
3.8
48
429
0
CCD
050303
R4(1)
CY7C68000-56PVXC
150C
3.8
48
458
0
CCD
050303
R4(2)
CY7C68000-56PVXC
150C
3.8
48
457
2006 Q1 RELIABILITY REPORT
0
Page 19 of 78
Results
No visual defect
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
R52
CCD
050303
R4(3)
CY7C68000-56PVXC
Device
150C
3.8
48
SS
155
Rejects FA
0
CCD
050303
R5
CY7C68000-56PVXC
150C
3.8
48
187
0
CCD
050303
R6
CY7C68000-56PVXC
125C
3.8
96
453
0
CCD
050303
R6(1)
CY7C68000-56PVXC
125C
3.8
96
353
0
CCD
050303
R7
CY7C68000-56PVXC
125C
3.8
96
442
0
CCD
051903
R1
CY221R28-ZXC
150C
2.875
48
500
0
CCD
051903
R1(1)
CY221R28-ZXC
150C
2.875
48
500
0
CCD
051903
R2
CY221R28-ZXC
150C
2.875
48
499
0
CCD
051903
R2(1)
CY221R28-ZXC
150C
2.875
48
492
0
CCD
052805
R1
CY7C67300-100AXI
150C
3.8
24
50
0
CCD
052805
R1(1)
CY7C67300-100AXI
150C
3.8
24
405
0
CCD
052805
R1(2)
CY7C67300-100AXI
150C
3.8
24
441
0
CCD
052805
R2
CY7C67300-100AXI
150C
3.8
24
448
0
CCD
052805
R2(1)
CY7C67300-100AXI
150C
3.8
24
419
0
CCD
052805
R3
CY7C67300-100AXI
150C
3.8
24
449
0
CCD
052805
R3(1)
CY7C67300-100AXI
150C
3.8
24
409
0
DCD
045102
R1A
CYDC256A16-55AXI
150C
3.45
48
628
0
DCD
045102
R1B
CYDC256A16-55AXI
150C
3.45
48
358
0
DCD
045102
R1C
CYDC256A16-55AXI
150C
3.45
48
178
0
DCD
052103
1BA
7C02628AC-RAZI
150C
3.45V
48
330
0
DCD
052103
1BB
7C02628AC-RAZI
150C
3.45V
48
328
0
DCD
052103
1BC
7C02628AC-RAZI
150C
3.45V
48
332
0
DCD
052103
R1
CYD256B16-55AXI
150C
3.45
48
330
0
DCD
052103
R2
CYD256B16-55AXI
150C
3.45
48
328
0
DCD
052103
R3
CYD256B16-55AXI
150C
3.45
48
332
0
MID
MR044060
R1
CY62136VLL-55ZI
125C
3.8
120
149
0
MID
MR051030
R1
CY7C1009B-15VC
150C
3.8
48
200
0
MID
MR051042
R1
CY7C1399B-12VC
150C
3.8
48
196
0
MID
MR051054
R1
CY7C1399B-12VC
150C
3.8
48
200
0
MID
MR051055
R1
CY7C1009B-15VC
150C
3.8
48
200
0
MID
MR052024
R1
CY22392FC
150C
3.8
48
300
0
MID
MR052029
R1
CY62136VLL-70ZI
125C
3.8
96
299
0
MID
MR053007
R1
CG6513AM
150C
2.3
48
200
0
MID
MR053022
R1
CY62136VLL-70ZXI
150C
2.3
96
298
0
MID
MR053048
R1
CY7C1399B-12VC
150C
2.45
48
300
0
MID
MR054020
R1
CY62136VLL-55ZI
125C
3.8
96
300
0
2006 Q1 RELIABILITY REPORT
Page 20 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
R52
MID
MR054030
R1
Device
CY7C1399B-12VC
Temp Volt
Duration
150C
3.8
48
Summary for 'Technology' = R52 (46 detail records)
Sum
R7
SS
Rejects FA
300
16655
1
CCD
MR052042
R1
CY7C1018CV33-15VC
150C
3.8
48
300
0
DCD
044102
R2A
CY7C0832
125C
2.3
48
101
0
DCD
044102
R2A
CY7C0832
125C
2.3
48
101
0
DCD
044102
R2B
CY7C0832
125C
2.3
48
720
0
DCD
044102
R2B
CY7C0832
125C
2.3
48
720
0
DCD
044102
R2B(1) CY7C0832
125C
2.3
48
61
0
DCD
044102
R2B(1) CY7C0832
125C
2.3
48
61
0
DCD
044102
R2B(2) CY7C0832
125C
2.3
48
114
0
DCD
044102
R2B(2) CY7C0832
125C
2.3
48
114
0
DCD
060305
R1A
CY7C0832AV
125C
2.3
96
207
0
DCD
060305
R1B
CY7C0832AV
125C
2.3
96
206
0
DCD
060305
R1C
CY7C0832AV
125C
2.3
96
207
0
DCD
060305
R1D
CY7C0832AV
125C
2.3
96
207
0
DCD
060305
R1E
CY7C0832AV
125C
2.3
96
206
0
DCD
060305
R2A
CY7C0852V
125C
2.3
96
321
0
DCD
060305
R2B
CY7C0852V
125C
2.3
96
324
0
DCD
060305
R2C
CY7C0852V
125C
2.3
96
328
0
DCD
060305
R2D
CY7C0852V
125C
2.3
96
335
0
DCD
060305
R2E
CY7C0852V
125C
2.3
96
325
0
0
DCD
060305
R3
CY7C0852V
125C
2.3
96
784
MID
050505
R3A
CY7C1360B
150C
2.3
48
3486
0
MID
053206
R1
CY7C1313V18
125C
2.07
96
1774
0
MID
053206
R2
CY7C1313V18
125C
2.07
96
197
0
MID
053206
R3
CY7C1313V18
125C
2.07
96
295
0
MID
053703
R1B
CYC1021CV33
150C
2.3
48
3530
0
MID
053703
R2B
CYC1370CC
150C
2.3
48
1667
MID
MR043056
R1
CY7C1069AV33-10ZC
150C
2.45
120
149
0
MID
MR043064
R1
CY7C1347F-133AC
150C
2.3
32
150
0
MID
MR043064
R1
CY7C1347F-133AC
150C
2.3
48
299
0
MID
MR044074
R1
CY7C1061AV33-10ZC
125C
2.45
138
200
0
MID
MR051025
R1
CY7C1041CV33-10ZC
150C
2.3
48
500
0
MID
MR051025
R2
CY7C1041CV33-10ZC
150C
2.3
48
200
0
MID
MR051048
R1
CY7C1041CV33-10VC
150C
2.3
60
147
0
MID
MR051062
R1
CY7C1021CV33-15ZC
150C
2.3
48
337
0
2006 Q1 RELIABILITY REPORT
Results
0
4 053703-1E1
Page 21 of 78
No visual defect
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
MID
MR051071
R1
CY7C1021CV33-15ZC
Device
150C
2.3
48
SS
673
Rejects FA
1
MID
MR051084
R1
CY7C1021CV33-8VC
150C
2.3
48
60
0
MID
MR052048
R1
CY7C1049CV33-10VC
150C
2.3
48
330
0
MID
MR052049
R1
CY7C1021CV33-8VC
150C
2.3
48
316
0
Results
MR051071-1E1
Poly protrusion (60 nm particle control
implemented at Fab, May 1, 2005)
MID
MR052050
R1
CY7C1021CV33-8VC
150C
2.3
48
799
0
MID
MR052062
R1
CY7C1021CV33-10ZC
150C
2.3
48
380
0
MID
MR052063
R1
CY7C1041CV33-10ZC
150C
2.3
48
101
0
MID
MR052064
R1
CY7C1041CV33-10ZXC
150C
5.75
48
81
0
MID
MR052080
R1
CY7C1041CV33-10ZXCT
150C
2.3
60
399
0
MID
MR052081
R1
CY7C1049CV33-12ZCT
150C
2.3
48
615
0
MID
MR052087
R1
CY7C1021CV33-8VC
150C
2.3
60
598
2
MR052087-1E1
Metal stringer (60 nm particle control
implemented at Fab, May 1, 2005)
No visual defect
MID
MR052091
R1
CY7C1041CV33-15ZC
150C
2.3
48
493
0
MID
MR052092
R1
CY7C1041CV33-10ZC
150C
2.3
60
400
0
MID
MR052094
R1
CY7C1041CV33-20ZC
150C
2.3
60
270
0
MID
MR052095
R1
CY7C1049CV33-20VC
150C
2.3
60
246
0
MID
MR052097
R1
CY7C1021CV33-12ZC
150C
2.3
48
195
1
MR052097-1E1
Poor salicidation (60 nm particle control
implemented at Fab, May 1, 2005)
MID
MR052100
R1
CY7C1021CV33-15ZC
150C
2.3
48
500
0
MID
MR052101
R1
CY7C1041CV33-15ZC
150C
2.3
60
200
0
MID
MR052102
R1
CY7C1041CV33-10ZC
150C
2.3
48
598
0
MID
MR052104
R1
CY7C1049CV33-20VC
150C
2.3
60
200
0
MID
MR053025
R1
CY7C1021CV33-15VC
150C
2.3
48
200
0
MID
MR053026
R1
CY7C1021CV33-15VXC
150C
2.3
48
200
0
MID
MR053040
R1
CY7C1041CV33-10
150C
3.8
48
3097
MID
MR053053
R1
CY7C1021CV33-12ZXI
150C
2.3
48
831
0
MID
MR053062
R1
CG5978AT
150C
2.3
48
8997
0
MID
MR053063
R1
CG5978AT
150C
2.3
48
2000
0
MID
MR053064
R1
CG5978AT
150C
2.3
48
5985
0
MID
MR054045
R1
CY7C1041CV33-10ZC
150C
2.3
48
3000
0
MID
MR054073
R1
CY7C1041CV33
150C
2.3
48
3998
2 MR054073-1E1
Summary for 'Technology' = R7 (63 detail records)
Sum
R8
54435
1 MR053040-1E1
Embedded particle (8D in progress)
11
MID
050505
R1A
CY62157
125C
2.4
96
3800
1 050505-1E1
MID
050505
R1A
CY62157
125C
2.4
168
3796
0
R1
CY62167DV30
125C
2.4
96
1490
MID
054806
2006 Q1 RELIABILITY REPORT
No visual defect
0
Page 22 of 78
AC/DC Degradation
Product Reliability
Technology
Div
EvalNum
TV
Device
MID
054806
R2
CY62167DV30
Temp Volt
Duration
125C
96
1750
MID
054806
R3
CY62167DV30
125C
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
96
1627
0
2.4
120
300
0
MID
MR043074
R1
CY62157DV30L-45BVI
125
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
72
150
0
2.4
120
300
0
2.4
Rejects FA
0
MID
MR051032
R1
CY62147DV30LL-55BVI
125C
2.4
96
200
0
MID
MR051077
R1
CY62128DV30LL-70SI
150C
2.4
48
195
0
MID
MR052028
R1
CY62128DV30LL-55ZI
150C
2.4
48
300
0
MID
MR054032
R1
CY62167DV30LL-70BVI
125C
2.4
96
298
0
150C
2.25
48
Summary for 'Technology' = R8 (12 detail records)
Sum
R9
SS
14206
1
1490
0
ALL
053901
R1
CY7C1370D
ALL
053901
R2
CY7C1370D
150C
2.25
48
1954
0
MID
044201
R1
CY7C1413AV18-200BZC
125C
2.25
96
1752
0
MID
044201
R1(1)
CY7C1413AV18-200BZC
125C
2.25
96
144
0
MID
044201
R1(2)
CY7C1413AV18-200BZC
125C
2.25
96
265
0
MID
044201
R2
CY7C1413AV18-200BZC
125C
2.25
96
970
0
MID
045202
R1
CY62127EV
125C
1.85
96
3488
0
MID
050902
R1
CY7C1347G-166AXC
150C
2.25
48
4421
0
MID
050902
R2
CY7C1347G-166AXC
150C
2.25
48
1305
0
MID
050902
R3
CY7C1347G-166AXC
150C
2.25
48
1307
0
MID
051006
R1A
CY7C1470
150C
2.25
48
801
0
MID
051006
R2A
CY7C1347G
150C
2.25
48
3478
0
MID
051006
R2C
CY7C1347G
150C
2.25
48
1679
0
MID
051006
R2D
CY7C1347G
150C
2.25
48
1727
0
MID
051505
R1
CY7C1312BV18-250BZC
125C
2.25
96
764
0
MID
051505
R2
CY7C1312BV18-250BZC
125C
2.25
96
989
0
MID
051505
R3
CY7C1312BV18-250BZC
125C
2.25
96
912
0
MID
051901
R1
CY7C1512V18-250BZC
125C
2.25
96
1613
0
MID
052203
R1
CY7C1370
150C
2.25
48
1167
0
MID
052203
R2
CY7C1370
150C
2.25
48
1076
0
MID
052203
R3
CY7C1370
150C
2.25
48
1285
0
MID
052206
R1
CY7C1347G-166AXC
150C
2.25
48
1480
0
MID
052206
R2
CY7C1347G-166AXC
150C
2.25
48
1572
0
MID
052206
R3
CY7C1347G-166AXC
150C
2.25
48
1242
0
MID
052607
R1
CY7C1339G
150C
2.25
24
848
0
MID
052607
R2
CY7C1339G
150C
2.25
24
850
0
MID
052607
2006 Q1 RELIABILITY REPORT
R3
CY7C1339G
150C
2.25
24
847
0
Page 23 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
R9
MID
053405
R1
CY7C1360C
Device
150C
2.25
48
SS
2846
Rejects FA
0
MID
053405
R2
CY7C1360C
150C
2.25
48
2851
0
MID
053405
R3A
CY7C1360C
150C
2.25
48
1281
0
MID
053405
R3B
CY7C1360C
150C
2.25
48
1562
1
Results
053405-3BE1
Metal stringer (60 nm particle control
implemented at Fab, May 1, 2005)
MID
053704
R1A
CY7C1370
150C
2.25
48
2123
0
MID
053704
R2A1
CY7C1347
150C
2.25
48
800
0
MID
053704
R2A2
CY7C1347
150C
2.25
48
795
0
MID
054003
R1
CY7C1514AC
125C
2.25
96
600
0
MID
054003
R2
CYC15121AC
125C
2.25
96
1113
0
MID
054003
R3
CY7C1513AC
125C
2.25
96
273
0
MID
054302
R1A
CY62147EV30*
125C
1.85
96
679
0
MID
054302
R4
CY62147EV30*
125C
1.85
96
4031
0
MID
054302
R5
CY62147EV30*
125C
1.85
96
1711
0
MID
054302
R7
CY62147EV30*
125C
1.85
96
916
1 043306-2E1
MID
054801
R1
CY7C1470V33
150C
2.25
48
590
0
MID
054801
R2
CY7C1470V33
150C
2.25
48
1161
0
MID
054801
R3
CY7C1470V33
150C
2.25
48
705
0
MID
061206
R1
CY7C1460AV33
150C
2.5
48
497
0
MID
061206
R2
CY7C1460AV33
150C
2.25
48
1008
0
MID
MR052053
R1
CY7C1351G-100AXC
150C
2.25
48
142
0
MID
MR052054
R1
CY7C1347G-133AXC
150C
2.25
48
200
0
MID
MR052055
R1
CY7C1347G-166AXI
150C
2.25
48
144
0
MID
MR052056
R1
CY7C1347G-133AXC
150C
2.25
48
148
0
MID
MR052057
R1
CY7C1347G-133AXC
150C
2.25
48
200
0
MID
MR052058
R1
CY7C1347G-133AXC
150C
2.25
48
199
0
MID
MR052059
R1
CY7C1347G-200AXC
150C
2.3
48
200
0
MID
MR052060
R1
CY7C1327G-133AXC
150C
2.25
48
199
0
MID
MR052065
R1
CY7C1347G-133AXC
150C
2.25
48
400
0
MID
MR052066
R1
CY7C1347G-166AXC
150C
2.25
48
400
0
MID
MR052067
R1
CY7C1347G-133AXC
150C
2.25
48
199
0
Abnormal poly contact (8D in progress)
MID
MR052069
R1
CY7C1370D-167AXI
150C
2.25
48
200
0
MID
MR052070
R1
CY7C1347G-133AXC
150C
2.25
48H
200
0
MID
MR052071
R1
CY7C1347G-166AXC
150C
2.25
48
200
0
MID
MR052072
R1
CY7C1347G-166AXC
150C
2.25
48
200
0
MID
MR052105
R1
CY7C1347G-166AXC
150C
2.25
48
1674
1 MR052105-1E1
No visual defect
MID
MR052105
R1A
CY7C1347G-166AXC
150C
2.3
48
4309
2 MR052105-1E1
No visual defect
2006 Q1 RELIABILITY REPORT
Page 24 of 78
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
MID
MR053051
R1
CY7C1347G-166AXC
Device
150C
2.25
48
2393
0
MID
MR053052
R1
CY7C1347G-133AXI
150C
2.3
48
3512
0
MID
MR053065
R1
CY7C1370D-167AXI
150C
2.3
48
1846
0
MID
MR053066
R1
CY7C1370D-167AXI
150C
2.3
48
2732
0
MID
MR053067
R1
CY7C1370D-167AXI
150C
2.3
48
1070
0
MID
MR054070
R1
CY7C1347G-250AXC
150C
2.25
48
299
0
MID
MR054071
R1
CY7C13560CC-RAZC
150C
2.25
48
299
1 MR054071-1E1
125C
5.5
96
Summary for 'Technology' = R9 (70 detail records)
Sum
S4
CY8C24494-24PVXI
86333
6
1008
0
044602
R2
CCD
050507
1B
7C84980AT-TZZC
150C
3.8V
48
540
0
CCD
050507
1B(1)
7C84980AT-TZZC
150C
3.8V
48
496
0
CCD
052004
R1
CY8C21234-24SXI
125C
5.5
120
1002
0
CCD
053402
R2
CY8C27443-24PVXI
125C
5.5
96
1010
0
CCD
053403
R1
CY8C24423A-24PVXI
125C
5.5
96
999
0
CCD
053403
R1(1)
CY8C24423A-24PVXI
125C
5.5
96
1004
0
CCD
053603
R1
CY8C24794-24LFXI
125C
5.5
96
923
0
CCD
060401
2
8C21534AC-TSPI
125C
5.5V
120
1002
0
CCD
MR051040
R1
CY8C27443-24PXI
125C
5.5
96
185
0
CCD
MR051076
R1
CY22392ZC-366
150C
3.8
48
199
0
CCD
MR052082
R1
CY8C24223A-24PVXI
125C
2.3
96
200
0
CCD
MR052083
R1
CY8C26443-24PVI
125C
5.5
96
149
0
CCD
MR053020
R1
CY22392ZXI-353
150C
3.8
48
270
0
8987
0
CCD
MR054023
R1
CY7B991-5JC
125C
6.6
96
200
0
CCD
MR054023
R1A
CY7B991-5JC
125C
6.6
96
100
0
DCD
MR051034
R1
CY7B933-JC
125C
6.5
96
75
0
DCD
MR051034
R1A
CY7B933-JC
125C
6.5
96
75
0
DCD
MR051034
R1B
CY7B933-JC
125C
6.5
96
50
0
DCD
MR052076
R1
CY7B991-7JCT
125C
6.6
96
200
0
700
0
7C72250AJ-GQFGC
125C
1.8V
96
143
0
Summary for 'Technology' = STARM (6 detail records)
Sum
T013
Rejects FA
CCD
Summary for 'Technology' = S4 (14 detail records)
Sum
STARM
SS
DCD
034001
1B
DCD
034001
3B
7C72250BJ-GQFGC
125C
1.38V
96
129
0
DCD
034001
5
7C72250BJ-GQFGCB
125C
1.38V
96
181
0
DCD
034001
6
7C72220BJ-GQFGCB
125C
1.38V
96
127
0
DCD
041401
1
7C71050BJ-GQFGC
125C
1.35V
12
50
0
2006 Q1 RELIABILITY REPORT
Page 25 of 78
Results
No visual defect
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
DCD
041401
1
7C71050BJ-GQFGC
Device
125C
1.35V
48
49
0
DCD
041401
1
7C71050BJ-GQFGC
125C
1.35V
24
50
0
DCD
041401
1
7C71050BJ-GQFGC
125C
1.35V
12
50
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
48
20
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
12
20
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
12
20
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
24
20
0
DCD
041401
1(2)
7C71050BJ-GQFGC
125C
1.35V
96
28
0
DCD
041401
2
7C71050BJ-GQFGCB
125C
1.35V
96
176
0
DCD
044108
1B
7C71051CJ-GQFGCB
125C
1.35V
96
36
0
DCD
044108
1C
7C71051CJ-GQFGCB
125C
1.35V
96
27
0
DCD
044108
2B
7C71051CJ-GQFGCB
125C
1.35V
96
31
0
DCD
044108
2C
7C71051CJ-GQFGCB
125C
1.35V
96
28
0
Summary for 'Technology' = T013 (18 detail records)
Sum
TOWER 165
Rejects FA
1185
0
MID
051502
R1
CYK512K16SCCAU
125C
5.5
96
1912
0
MID
051502
R2
CYK512K16SCCAU
125C
5.5
96
1944
0
MID
051502
R3
CYK512K16SCCAU
125C
5.5
96
1865
0
MID
052102
R1
CYK128K16MCCBU-70BVIT
125C
3.8
96
1499
0
MID
052102
R2
CYK128K16MCCBU-70BVIT
125C
3.8
96
1498
0
MID
052102
R3
CYK128K16MCCBU-70BVIT
125C
3.8
96
1499
0
MID
052102
R4
CYK128K16MCCBU-70BVIT
125C
3.8
96
1000
0
MID
052102
R5
CYK128K16MCCBU-70BVIT
125C
3.8
96
1000
0
MID
052102
R6
CYK128K16MCCBU-70BVIT
125C
3.8
96
1000
0
125C
1.35
96
Summary for 'Technology' = TOWER 165 (9 detail records)
Sum
TSMC 180
SS
DCD
044108
R2
CYNSE10512A
13217
0
70
0
DCD
044108
R2(1)
CYNSE10512A
125C
1.35
120
2
0
DCD
044108
R3(1)A CYNSE10512A
125C
1.35
120
1
0
DCD
044108
R3(1)B CYNSE10512A
125C
1.35
96
85
0
DCD
044108
R3(2)B CYNSE10512A
125C
1.35
120
2
0
DCD
044108
R3A
CYNSE10512A
125C
1.35
96
144
0
DCD
044108
R3B
CYNSE10512A
125C
1.35
96
130
0
DCD
044108
R3C
CYNSE10512A
125C
1.35
96
32
0
MID
052003
2
7ISC305BF-IPQYC
150C
2.07V
48
55
0
MID
052003
3
7ISC305BF-IPQYC
150C
2.07V
60
55
0
576
0
Summary for 'Technology' = TSMC 180 (10 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 26 of 78
Results
Product Reliability
Technology
Div
EvalNum
Grand Total
2006 Q1 RELIABILITY REPORT
TV
Device
Temp Volt
Duration
SS
Rejects FA
214255
19
Page 27 of 78
Results
Product Reliability
Summary Detail -- LFR Performance Over Time
Device
From: 4/6/2005
To: 3/31/2006
Technology
Div
EvalNum
TV
Temp Volt
Duration
B53
CCD
052404
1
7B6936AC-LLYC
125C
3.8V
332
360
0
CCD
052404
1
7B6936AC-LLYC
125C
3.8V
168
360
0
Summary for 'Technology' = B53 (2 detail records)
Sum
C8
720
0
043004
1B
7C87741A
125C
2.35V
168
89
0
CCD
043004
3C
7C87741A
125C
2.35V
1000
253
0
CCD
043004
4
7C87740A
125C
2.35V
168
166
0
CCD
043004
5A
7C87741A
125C
2.35V
524
175
0
CCD
043004
5A
7C87741A
125C
2.35V
168
175
0
CCD
043004
6
7C87741A
125C
2.35V
1000
196
0
1054
0
DCD
MR051058
R1
CY7C343-35JC
150C
5.75
832
150
0
DCD
MR051058
R1
CY7C343-35JC
150C
5.75
168
150
0
300
0
150C
5.75V
80
117
0
Summary for 'Technology' = P20 (2 detail records)
Sum
P26
P26
Rejects FA
CCD
Summary for 'Technology' = C8 (6 detail records)
Sum
P20
SS
CCD
054604
3
7C634131CU-OPZC
CCD
054604
3
7C634131CU-OPZC
150C
5.75V
420
117
0
CCD
054604
R2
CY7C65113C-SXC
150C
5.75
420
130
0
CCD
054604
R2
CY7C65113C-SXC
150C
5.75
80
130
0
CCD
054604
R3
CY7C65113C-SXC
150C
5.75
420
130
0
CCD
054604
R3
CY7C65113C-SXC
150C
5.75
80
130
0
CCD
054605
1
7C637402AU-OPZC
150C
5.75V
169
240
0
CCD
054605
1
7C637402AU-OPZC
150C
5.75V
100
240
0
CCD
054605
2
7C637402AU-OPZC
150C
5.75V
256
239
0
CCD
054605
3
7C637402AU-OPZC
150C
5.75V
256
240
0
CCD
060304
R4
CY7C65113
150C
5.5
420
120
0
CCD
060304
R4
CY7C65113
150C
5.5
80
120
0
CCD
060304
R5
CY7C65113
150C
5.5
80
116
0
CCD
060304
R5
CY7C65113
150C
5.5
420
116
0
CCD
060304
R6
CY7C65113
150C
5.5
80
120
0
CCD
060304
R6
CY7C65113
150C
5.5
420
120
0
2425
0
Summary for 'Technology' = P26 (16 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 28 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
POWER 0.6
MID
MR051083
R1
CYK128K16SCBU-55BVXI
Device
125C
3.8
check
150
0
MID
MR052047
R1
CYK128K16MCCBU-55BVIT
150C
3.8
332
150
0
MID
MR052047
R1
CYK128K16MCCBU-55BVIT
150C
3.8
168
150
0
MID
MR054051
R1
CYK128K6C7BW-70BVI
125C
3.8
168
300
0
MID
MR054051
R1
CYK128K6C7BW-70BVI
125C
3.8
832
300
0
Summary for 'Technology' = POWER 0.6 (5 detail records)
Sum
R28
R42
1050
0
MR052086
R1
CY7C185-25VC
150C
5.75
412
145
0
MID
MR052086
R1
CY7C185-25VC
150C
5.75
44
150
0
295
0
DCD
MR052043
R1
CY7C09389V-9AC
150C
3.8
80
150
0
DCD
MR052043
R1
CY7C09389V-9AC
150C
3.8
420
150
0
DCD
MR053011
R1
CY7C038V-25AC
150C
3.8
80
150
0
DCD
MR053011
R1
CY7C038V-25AC
150C
3.8
420
150
0
DCD
MR054046
R1
CY7C024AV-20AXI
125C
3.8
168
297
0
DCD
MR054046
R1
CY7C024AV-20AXI
125C
3.8
832
297
0
MID
053407
R1
CY62256LL
150C
5.75
500
125
0
MID
053407
R2
CY62256LL
150C
5.75
500
125
0
MID
053407
R3
CY62256LL
150C
5.75
500
125
0
MID
MR052079
R1
CY62256LL-70SNC
125C
5.75
168
150
0
MID
MR052079
R1
CY62256LL-70SNC
125C
5.75
832
148
0
MID
MR053024
R1
CG6521M
125C
5.75
832
150
0
MID
MR053024
R1
CG6521M
125C
5.75
168
150
0
MID
MR053034
R1
CG6520AM
125C
5.25
168
150
0
MID
MR053034
R1
CG6520AM
125C
5.25
832
147
0
MID
MR054031
R1
CY62256LL-55SNXI
125C
5.75
832
150
0
MID
MR054031
R1
CY62256LL-55SNXI
125C
5.75
96
150
0
MID
MR054053
R1
CG6519AM
125C
5.75
832
150
0
MID
MR054053
R1
CG6519AM
125C
5.75
96
150
0
3064
0
Summary for 'Technology' = R42 (19 detail records)
Sum
R52
Rejects FA
MID
Summary for 'Technology' = R28 (2 detail records)
Sum
R42
SS
CCD
041303
1
7C89000AC-RAZZC
150C
2.875V 80
120
0
CCD
041303
1
7C89000AC-RAZZC
150C
2.875V 142
119
0
0
CCD
041303
1
7C89000AC-RAZZC
150C
2.875V 278
119
CCD
043801
1
7C823C09AC-MSZI
150C
3.8V
80
120
0
CCD
043801
1
7C823C09AC-MSZI
150C
3.8V
420
120
0
CCD
050303
R4
CY7C68000-56PVXC
150C
3.8
420
114
0
2006 Q1 RELIABILITY REPORT
Page 29 of 78
Results
Product Reliability
Technology
R52
Div
EvalNum
TV
Temp Volt
Duration
CCD
050303
R4
CY7C68000-56PVXC
Device
150C
3.8
80
SS
116
Rejects FA
0
CCD
050303
R5
CY7C68000-56PVXC
150C
3.8
420
114
0
CCD
050303
R5
CY7C68000-56PVXC
150C
3.8
80
116
0
CCD
051903
R1
CY221R28-ZXC
150C
2.875
80
116
0
CCD
051903
R1
CY221R28-ZXC
150C
2.875
420
116
0
CCD
051903
R2
CY221R28-ZXC
150C
2.875
80
116
0
CCD
051903
R2
CY221R28-ZXC
150C
2.875
420
116
0
CCD
052805
R1
CY7C67300-100AXI
150C
3.8
408
50
0
CCD
052805
R1
CY7C67300-100AXI
150C
3.8
500
49
0
DCD
045102
R1A
CYDC256A16-55AXI
150C
3.45
420
120
0
DCD
045102
R1A
CYDC256A16-55AXI
150C
3.45
80
120
0
DCD
052103
R1
CYD256B16-55AXI
150C
3.45
420
119
0
DCD
052103
R1
CYD256B16-55AXI
150C
3.45
80
120
0
MID
MR051030
R1
CY7C1009B-15VC
150C
3.8
420
150
0
MID
MR051030
R1
CY7C1009B-15VC
150C
3.8
80
150
0
MID
MR051042
R1
CY7C1399B-12VC
150C
3.8
404
150
0
MID
MR051042
R1
CY7C1399B-12VC
150C
3.8
96
150
0
MID
MR051054
R1
CY7C1399B-12VC
150C
3.8
420
150
0
MID
MR051054
R1
CY7C1399B-12VC
150C
3.8
80
150
0
MID
MR051055
R1
CY7C1009B-15VC
150C
3.8
420
150
0
MID
MR051055
R1
CY7C1009B-15VC
150C
3.8
80
150
0
MID
MR052024
R1
CY22392FC
150C
3.8
434
150
0
MID
MR052024
R1
CY22392FC
150C
3.8
90
150
0
MID
MR052029
R1
CY62136VLL-70ZI
125C
3.8
832
150
0
MID
MR052029
R1
CY62136VLL-70ZI
125C
3.8
168
150
0
MID
MR053007
R1
CG6513AM
150C
2.3
80
150
0
MID
MR053007
R1
CG6513AM
150C
2.3
432
150
0
MID
MR053022
R1
CY62136VLL-70ZXI
150C
2.3
832
150
0
MID
MR053022
R1
CY62136VLL-70ZXI
150C
2.3
168
150
0
MID
MR053048
R1
CY7C1399B-12VC
150C
2.45
468
150
0
MID
MR053048
R1
CY7C1399B-12VC
150C
2.45
80
150
0
MID
MR054020
R1
CY62136VLL-55ZI
125C
3.8
168
298
0
MID
MR054020
R1
CY62136VLL-55ZI
125C
3.8
check
298
0
MID
MR054030
R1
CY7C1399B-12VC
150C
3.8
408
150
0
MID
MR054030
R1
CY7C1399B-12VC
150C
3.8
80
MID
MR054030
R1
CY7C1399B-12VC
150C
3.8
12
300
0
2006 Q1 RELIABILITY REPORT
0
Page 30 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
Device
Temp Volt
Duration
Summary for 'Technology' = R52 (42 detail records)
Sum
R7
Rejects FA
5846
0
MR052042
R1
CY7C1018CV33-15VC
150C
3.8
98
150
0
CCD
MR052042
R1
CY7C1018CV33-15VC
150C
3.8
402
150
0
MID
MR043056
R1
CY7C1069AV33-10ZC
150C
2.45
168
148
1 MR043056-1L1
MID
MR043056
R1
CY7C1069AV33-10ZC
150C
2.45
664
148
0
MID
MR043056
R1
CY7C1069AV33-10ZC
150C
2.45
512
148
0
MID
MR043064
R1
CY7C1347F-133AC
150C
2.3
416
148
1 MR043064-1L2
MID
MR043064
R1
CY7C1347F-133AC
150C
2.3
80
150
0
MID
MR044074
R1
CY7C1061AV33-10ZC
125C
2.45
821
150
0
0
CCD
MID
MR044074
R1
CY7C1061AV33-10ZC
125C
2.45
179
150
MID
MR051025
R1
CY7C1041CV33-10ZC
150C
2.3
420
150
0
MID
MR051025
R1
CY7C1041CV33-10ZC
150C
2.3
80
150
0
MID
MR051025
R2
CY7C1041CV33-10ZC
150C
2.3
80
150
0
MID
MR051025
R2
CY7C1041CV33-10ZC
150C
2.3
420
150
0
MID
MR051062
R1
CY7C1021CV33-15ZC
150C
2.3
80
150
0
MID
MR051062
R1
CY7C1021CV33-15ZC
150C
2.3
420
150
0
MID
MR052048
R1
CY7C1049CV33-10VC
150C
2.3
432
150
0
MID
MR052048
R1
CY7C1049CV33-10VC
150C
2.3
80
150
0
MID
MR052049
R1
CY7C1021CV33-8VC
150C
2.3
89
150
0
MID
MR052049
R1
CY7C1021CV33-8VC
150C
2.3
411
150
0
MID
MR052050
R1
CY7C1021CV33-8VC
150C
2.3
89
150
0
MID
MR052050
R1
CY7C1021CV33-8VC
150C
2.3
411
150
0
MID
MR053025
R1
CY7C1021CV33-15VC
150C
2.3
80
150
0
MID
MR053025
R1
CY7C1021CV33-15VC
150C
2.3
420
150
0
MID
MR053026
R1
CY7C1021CV33-15VXC
150C
5.5
80
150
0
MID
MR053026
R1
CY7C1021CV33-15VXC
150C
5.5
420
150
0
Summary for 'Technology' = R7 (25 detail records)
Sum
R8
SS
3742
2
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
192
150
0
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
72
300
0
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
832
150
0
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
808
150
0
MID
MR043074
R1
CY62157DV30L-45BVI
125
2.4
168
150
0
MID
MR051032
R1
CY62147DV30LL-55BVI
125C
2.4
832
150
0
MID
MR051032
R1
CY62147DV30LL-55BVI
125C
2.4
168
150
0
MID
MR051077
R1
CY62128DV30LL-70SI
150C
2.4
420
150
0
MID
MR051077
R1
CY62128DV30LL-70SI
150C
2.4
80
150
0
2006 Q1 RELIABILITY REPORT
Page 31 of 78
Results
No visual defect
No visual defect
Product Reliability
Technology
Div
EvalNum
TV
MID
MR051080
R1
Temp Volt
Duration
CY62157DV30LL-70BV
Device
125C
2.4
524
149
0
R9
Rejects FA
MID
MR051080
R1
CY62157DV30LL-70BV
125C
2.4
168
150
0
MID
MR052028
R1
CY62128DV30LL-55ZI
150C
2.4
420
148
0
MID
MR052028
R1
CY62128DV30LL-55ZI
150C
2.4
44
150
0
MID
MR054032
R1
CY62167DV30LL-70BVI
125C
2.4
832
298
0
MID
MR054032
R1
CY62167DV30LL-70BVI
125C
2.4
168
298
0
Summary for 'Technology' = R8 (15 detail records)
Sum
R9
SS
2693
0
ALL
053901
R1
CY7C1370D
150C
2.25
80
120
0
ALL
053901
R1
CY7C1370D
150C
2.25
420
120
0
ALL
053901
R2
CY7C1370D
150C
2.25
420
119
0
ALL
053901
R2
CY7C1370D
150C
2.25
80
120
0
MID
045202
R1
CY62127EV
150C
1.85
80
399
0
MID
045202
R1
CY62127EV
150C
1.85
420
396
0
MID
052203
R3
CY7C1370
150C
2.25
500
398
0
MID
052607
R1
CY7C1339G
150C
2.25
408
50
0
MID
053704
R1A
CY7C1370
150C
2.25
80
390
0
MID
053704
R1A
CY7C1370
150C
2.25
420
390
0
MID
054302
R1A
CY62147EV30*
150C
1.85
80
400
0
MID
054302
R1A
CY62147EV30*
150C
1.85
420
399
1 043306-1L2
MID
054302
R5
CY62147EV30*
150C
1.85
80
400
0
MID
054302
R5
CY62147EV30*
150C
1.85
420
400
0
MID
054302
R7
CY62147EV30*
150C
1.85
80
400
0
MID
054302
R7
CY62147EV30*
150C
1.85
420
400
0
MID
054801
R3
CY7C1470V33
150C
2.25
80
394
0
MID
MR052054
R1
CY7C1347G-133AXC
150C
2.25
412
150
0
MID
MR052054
R1
CY7C1347G-133AXC
150C
2.25
40
150
0
MID
MR052056
R1
CY7C1347G-133AXC
150C
2.25
408
146
0
MID
MR052056
R1
CY7C1347G-133AXC
150C
2.25
44
150
0
MID
MR052058
R1
CY7C1347G-133AXC
150C
2.25
420
147
0
MID
MR052058
R1
CY7C1347G-133AXC
150C
2.25
44
147
0
MID
MR054070
R1
CY7C1347G-250AXC
150C
2.25
80
297
1 MR054070-1L1
MID
MR054070
R1
CY7C1347G-250AXC
150C
2.25
420
292
0
MID
MR054071
R1
CY7C13560CC-RAZC
150C
2.25
80
297
0
MID
MR054071
R1
CY7C13560CC-RAZC
150C
2.25
420
290
0
7361
2
Summary for 'Technology' = R9 (27 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 32 of 78
Results
Blocked contact (8D in-progress)
No visual defect
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
S4
CCD
050507
1B
7C84980AT-TZZC
150C
3.8V
80
120
0
CCD
050507
1B
7C84980AT-TZZC
150C
3.8V
420
120
0
CCD
052004
R1
CY8C21234-24SXI
125C
5.5
750
235
0
CCD
052004
R4
CY8C21234-24SXI
125C
5.5
630
235
0
CCD
052004
R4
CY8C21234-24SXI
125C
5.5
120
235
0
CCD
052004
R5
CY8C21234-24SXI
125C
5.5
630
235
0
S4
Device
Rejects FA
CCD
052004
R5
CY8C21234-24SXI
125C
5.5
120
235
0
CCD
052701
1
7C825701A
125C
3.8V
408
600
0
CCD
052701
1
7C825701A
125C
3.8V
500
600
0
CCD
052701
1
7C825701A
125C
3.8V
92
645
0
CCD
052701
1A
7C825701AT-ERLC
125C
3.8V
500
597
0
CCD
052701
1A
7C825701AT-ERLC
125C
3.8V
80
646
0
CCD
052701
1A
7C825701AT-ERLC
125C
3.8V
420
600
0
CCD
053603
R1
CY8C24794-24LFXI
125C
5.5
24
177
0
CCD
060401
2
8C21534AC-TSPI
125C
5.5V
750
235
0
CCD
MR051040
R1
CY8C27443-24PXI
125C
5.5
832
185
0
CCD
MR051040
R1
CY8C27443-24PXI
125C
5.5
168
185
0
CCD
MR051076
R1
CY22392ZC-366
150C
3.8
420
150
0
CCD
MR051076
R1
CY22392ZC-366
150C
3.8
80
150
0
CCD
MR052082
R1
CY8C24223A-24PVXI
125C
2.3
832
143
0
CCD
MR052082
R1
CY8C24223A-24PVXI
125C
2.3
168
143
0
CCD
MR052083
R1
CY8C26443-24PVI
125C
5.5
500
149
0
CCD
MR052083
R1
CY8C26443-24PVI
125C
5.5
168
149
0
CCD
MR053020
R1
CY22392ZXI-353
150C
3.8
44
150
0
Summary for 'Technology' = S4 (24 detail records)
Sum
STARM
SS
6919
0
CCD
MR054023
R1
CY7B991-5JC
125C
6.6
832
200
0
CCD
MR054023
R1
CY7B991-5JC
125C
6.6
168
200
0
DCD
MR051034
R1
CY7B933-JC
125C
6.5
168
75
0
DCD
MR051034
R1
CY7B933-JC
125C
6.5
832
75
0
DCD
MR051034
R1A
CY7B933-JC
125C
6.5
168
75
0
DCD
MR051034
R1A
CY7B933-JC
125C
6.5
832
75
0
DCD
MR052076
R1
CY7B991-7JCT
125C
6.6
832
149
0
DCD
MR052076
R1
CY7B991-7JCT
125C
6.6
168
149
0
998
0
Summary for 'Technology' = STARM (8 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 33 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
Temp Volt
Duration
T013
DCD
034001
1B
7C72250AJ-GQFGC
Device
125C
1.8V
487
141
0
DCD
034001
3B
7C72250BJ-GQFGC
125C
1.38V
332
43
0
DCD
034001
3B
7C72250BJ-GQFGC
125C
1.38V
500
43
0
DCD
034001
3B
7C72250BJ-GQFGC
125C
1.38V
168
46
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
168
20
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
200
20
0
DCD
041401
1(1)
7C71050BJ-GQFGC
125C
1.35V
632
20
0
DCD
041401
1(2)
7C71050BJ-GQFGC
125C
1.35V
792
28
0
DCD
041401
1(2)
7C71050BJ-GQFGC
125C
1.35V
40
28
0
DCD
041401
1(2)
7C71050BJ-GQFGC
125C
1.35V
168
28
0
Summary for 'Technology' = T013 (10 detail records)
Sum
TSMC 130
Rejects FA
417
0
DCD
044701
1
7C71050AJ-GQFGC
125C
1.35V
168
69
0
DCD
044701
1
7C71050AJ-GQFGC
125C
1.35V
356
68
0
DCD
044701
1
7C71050AJ-GQFGC
125C
1.35V
476
66
0
Summary for 'Technology' = TSMC 130 (3 detail records)
Sum
TSMC 180
SS
203
0
MID
052003
1
7ISC305BF-IPQYC
150C
2.07V
408
51
0
MID
052003
1
7ISC305BF-IPQYC
150C
2.07V
44
51
0
MID
052003
2
7ISC305BF-IPQYC
150C
2.07V
420
55
0
MID
052003
2
7ISC305BF-IPQYC
150C
2.07V
80
55
0
MID
052003
3
7ISC305BF-IPQYC
150C
2.07V
80
55
0
MID
052003
3
7ISC305BF-IPQYC
150C
2.07V
420
55
0
322
0
37409
4
Summary for 'Technology' = TSMC 180 (6 detail records)
Sum
Grand Total
2006 Q1 RELIABILITY REPORT
Page 34 of 78
Results
Product Reliability
Summary Detail -- DRET Performance Over Time
From: 4/19/2005
To: 3/26/2006
Technology
Div
EvalNum
TV
Device
P20
DCD
MR051057
R1
CY7C34335JC
Temp Readout Duration
150C
500
500
76
0
DCD
MR051057
R1
CY7C34335JC
150C
1000
500
76
0
Summary for 'Technology' = P20 (2 detail records)
Sum
P26
152
S4
0
054604
R1
CY7C64013C-SXC
150C
500
500
80
0
CCD
054604
R1
CY7C64013C-SXC
150C
1000
500
80
0
CCD
054604
R2
CY7C65113C-SXC
150C
500
500
80
0
CCD
054604
R2
CY7C65113C-SXC
150C
1000
500
80
0
CCD
054604
R4
CY7C63413
150C
1000
500
80
0
CCD
054604
R4
CY7C63413
150C
500
500
80
0
CCD
054605
1
7C637402AU-OPZC
165C
168
168
80
0
CCD
054605
1
7C637402AU-OPZC
165C
552
384
80
0
CCD
054605
2
7C637402AU-OPZC
165C
168
168
82
0
CCD
054605
2
7C637402AU-OPZC
165C
552
384
82
0
DCD
MR052031
R1
804
CY7C136-55NC
150C
500
500
50
Summary for 'Technology' = R28 (1 detail record)
Sum
S4
Rejects FA
CCD
Summary for 'Technology' = P26 (10 detail records)
Sum
R28
SS
50
0
0
0
CCD
044602
R2
CY8C24494-24PVXI
150C
500
500
80
0
CCD
052004
R1
CY8C21234-24SXI
150C
500
500
256
0
CCD
052004
R1
CY8C21234-24SXI
150C
1000
500
256
0
CCD
052004
R2
CY8C21234-24SXI
150C
1000
500
254
0
CCD
052004
R2
CY8C21234-24SXI
150C
500
500
256
0
CCD
052004
R3
CY8C21234-24SXI
150C
1000
500
252
0
CCD
052004
R3
CY8C21234-24SXI
150C
500
500
252
0
CCD
MR044062
R1
CY8C26233-24PVI
150C
500
500
50
0
CCD
MR051052
R1
CY23FP12OXC-003
150C
1000
500
48
0
CCD
MR051052
R1
CY23FP12OXC-003
150C
500
500
49
0
CCD
MR052027
R1
CY22392ZC-366
150C
1000
500
50
0
CCD
MR052027
R1
CY22392ZC-366
150C
500
500
50
0
CCD
MR053010
R1
CY8C24794-24LFXI
150C
500
500
50
0
CCD
MR053059
R1
CY26049ZC-36
150C
1000
500
50
0
CCD
MR053059
R1
CY26049ZC-36
150C
500
500
50
0
Summary for 'Technology' = S4 (15 detail records)
2006 Q1 RELIABILITY REPORT
Page 35 of 78
Results
Product Reliability
Technology
Div
EvalNum
TV
Device
Temp Readout Duration
DCD
MR054056
R1
CY37064P84-125JC
150C
1000
500
76
0
DCD
MR054056
R1
CY37064P84-125JC
150C
500
500
76
0
Sum
TSMC 500
Summary for 'Technology' = TSMC 500 (2 detail records)
Sum
Grand Total
2006 Q1 RELIABILITY REPORT
SS
Rejects FA
2003
0
152
0
3161
0
Page 36 of 78
Results
Product Reliability
Summary Detail, Package -- PCT Performance Over Time
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
From: 4/3/2005
To: 3/30/2006
Readout
SS
Rejects
FA
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
042114
R1
CY2291F
121C
100%RH
168
50
0
W129DF-TSC
T-TAIWAN
050701
R1
CY7C65640-LFXC
121C
100%RH
168
50
0
100
0
Summary for 'PkgFamily' = CERDIP (Windowed) (2 detail records)
Sum
FBGA (0.75-0.8)
BA48AUALE
RA-CML
MR052085
R1
CY7C1021BV33L-15BAI
121C
100%RH
176
23
0
BA48AVALE
RA-CML
MR043061
R1
CY62147CV30LL-70BAI
121C
100%RH
168
50
0
BA48DJALE
G-TAIWAN
045101
R2
7C62172DC-GBAI
121C
100%RH
168
33
0
BA48DJALE
G-TAIWAN
052502
R2
CY62177DV30L
121C
100%RH
168
42
0
BA48HVALE
RA-CML
MR051066
R1
CS5854AT
121C
100%RH
168
50
0
198
0
50
0
50
0
Summary for 'PkgFamily' = FBGA (0.75-0.8) (5 detail records)
Sum
FBGA (0.75-0.8, Pb-Free)
BK48CDALL
G-TAIWAN
MR053012
R1
CY7C1041CV33-10BAXC
121C
100%RH
176
Summary for 'PkgFamily' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
Sum
FBGA (1.0)
BB100EAGE
G-TAIWAN
MR052032
R1
CYP15G0101DXB-BBI
121C
100%RH
168
49
0
BB165AALE
G-TAIWAN
044201
1
7C1414BC-GBBC
121C/100% RH N/A
168
48
0
BB172AAGE
G-TAIWAN
MR051007
R1
CY7C057V-15BBI
121C
100%RH
168
48
0
BB172BALE
G-TAIWAN
044102
1
7C08523DC-GBBCB
121C/100% RH N/A
168
48
0
BB209BALE
G-TAIWAN
050702
1
7C1474AC-GBBC
121C/100% RH N/A
168
50
0
243
0
Summary for 'PkgFamily' = FBGA (1.0) (5 detail records)
Sum
FLIPCHIP (Build-Up Substrate w/ HS)
FG1152AGE
GQ-KOREA 034001
1A
7C72250AJ-GQFGC
121C/100% RH N/A
168
48
0
FG1152AGE
GQ-KOREA 034001
1C
7C72250AJ-GQFGC
121C/100% RH N/A
168
46
0
FG388AGAGE
GQ-KOREA 044701
1A
7C71050AJ-GQFGC
121C/100% RH N/A
168
45
0
139
0
Summary for 'PkgFamily' = FLIPCHIP (Build-Up Substrate w/ HS) (3 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 37 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
FA
FVBGA (0.75-0.8, 0.3mm)
BV48BTALN
RA-CML
054302
R2B
CY62147EV30*
121C
100%RH
168
50
0
BV48BTALN
RA-CML
054302
R5
CY62147EV30*
121C
100%RH
168
50
0
BV48BTLAN
RA-CML
054302
R3A
CY62147EV30*
121C
100%RH
168
50
0
BV48HAALE
G-TAIWAN
MR051014
R1
CY62147CV33LL-70BVI
121C
100%RH
176
50
0
BV48QAALE
G-TAIWAN
050505
R2
CY62147
121C
100%RH
168
46
0
BV48VAALE
G-TAIWAN
MR052084
R1
CY62137CV30LL-70BVIT
121C
100%RH
176
50
0
BV52BGAGE
G-TAIWAN
043004
3A
7C87742A
121C/100% RH N/A
168
46
0
BV52BGAGE
G-TAIWAN
043004
3C
7C87741A
121C/100% RH N/A
168
46
0
BV52BGAGE
G-TAIWAN
043004
6
7C87741A
121C/100% RH N/A
168
46
0
BV52BGAGE
G-TAIWAN
043004
8
7C87742A
121C/100% RH N/A
168
46
0
480
0
Summary for 'PkgFamily' = FVBGA (0.75-0.8, 0.3mm) (10 detail records)
Sum
PBGA (1.27)
BG119VALE
G-TAIWAN
052602
1
7C1330DC-GBGC
121C/100% RH N/A
168
50
0
BG272AAGE
G-TAIWAN
MR052034
R1
CY7C0430BV-100BGI
121C
100%RH
168
44
0
BG282BAGE
G-TAIWAN
MR052005
R1
CY37512P256-83BGC
121C
100%RH
168
46
0
140
0
Summary for 'PkgFamily' = PBGA (1.27) (3 detail records)
Sum
PBGA (Cavity/Heatsink)
BL256L2GE
G-TAIWAN
MR051006
R1
CYP15G0401DXB-BGI
121C
100%RH
168
31
0
BL256L2GE
G-TAIWAN
MR051006
R1A
CYP15G0401DXB-BGI
121C
100%RH
176
19
0
BL256L2GE
G-TAIWAN
MR054018
R1
CYP15G0401DXB-BGC
121C
100%RH
168
50
0
BL304ABGE
G-TAIWAN
MR044043
R1
CYNSE70129A-125BGC
121C
100%RH
176
7
0
107
0
Summary for 'PkgFamily' = PBGA (Cavity/Heatsink) (4 detail records)
Sum
PBGA (Cavity/Heatsink, Pb-Free)
BJ256L2GL
G-TAIWAN
044507
R3
CY28323BPVC
121C
100%RH
168
50
0
BJ256L2GL
G-TAIWN
044507
R1
CY28323BPVC
121C
100%RH
168
45
0
95
0
45
0
Summary for 'PkgFamily' = PBGA (Cavity/Heatsink, Pb-Free) (2 detail records)
Sum
PDIP
P203CGAGB
O-INDNS
2006 Q1 RELIABILITY REPORT
MR053013
R1
CY7C168A-35PC
121C
100%RH
168
Page 38 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
P243FGAGE
M-PHIL
MR052025
R1
CY7C194-25PC
121C
100%RH
168
50
0
P2839GAGB
X-THAI
MR052061
R1
CY7C466A-10PTC
121C
100%RH
168
50
0
P2869AAGE
O-INDNS
052406
R5
CY62256LL-70PC
121C
100%RH
168
45
0
P286BGAGB
O-INDNS
052406
R4
CY62256LL-70PC
121C
100%RH
168
45
0
P286EGAGB
O-INDNS
052406
R3
CY62256LL-70PC
121C
100%RH
168
50
0
P286EGAGB
O-INDNS
052406
R6
CY62256L-70PC
121C
100%RH
168
50
0
P286EGAGB
O-INDNS
MR054044
R1
CY62256LL-70PC
121C
100%RH
168
50
0
P406AGAGB
O-INDNS
052406
R1
CY7C634121C-PC
121C
100%RH
168
45
0
P406AGAGB
O-INDNS
052406
R2
CP5748AM
121C
100%RH
168
45
0
475
0
Summary for 'PkgFamily' = PDIP (10 detail records)
Sum
FA
PDIP (Pb-Free)
PZ06AAGN
O-INDNS
054604
R4
CY7C63413
121C
100%RH
168
50
0
PZ183AAGN
O-INDNS
MR051004
R1
CY7C63231A-PXC
121C
100%RH
168
45
0
PZ183AAGN
O-INDNS
MR052015
R1
CY7C63231A-PXC
121C
100%RH
168
45
0
PZ243AAGN
X-THAI
051206
R1
CY7C63743-PXC
121C
100%RH
168
50
0
PZ243DXGN
R-CML
054605
R1
CY7C63743-PXC
121C
100%RH
168
50
0
PZ243DXGN
R-CML
054605
R2
CY7C63743C-PXC
121C
100%RH
168
50
0
PZ2831GAN
O-INDNS
MR053014
R1
CY7C64013A-PXC
121C
100%RH
168
45
0
335
0
Summary for 'PkgFamily' = PDIP (Pb-Free) (7 detail records)
Sum
PLCC
J28SEGAGB
M-PHIL
MR054019
R1
CY7B923-JC
121C
100%RH
168
50
0
J32RBGAGB
X-THAI
MR052018
R1
CY7B991-5JC
121C
100%RH
168
50
0
J32RBGAGB
X-THAI
MR054059
R1
CY7B9911-5JC
121C
100%RH
168
50
0
J32RNGAGE
M-PHIL
MR053031
R1
CY7C4271V-25JC
121C
100%RH
168
50
0
J68SCGAGB
X-THAI
MR054061
R1
CY7C144-55JCT
121C
100%RH
168
50
0
250
0
Summary for 'PkgFamily' = PLCC (5 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 39 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
FA
PLCC (Pb-Free)
JZ32RBGAN
M-PHIL
MR051056
R1
CY7C421-20JXC
121C
100%RH
168
50
0
JZ32RBGAN
M-PHIL
MR053028
R1
CY7C419-15JXC
121C
100%RH
168
50
0
100
0
Summary for 'PkgFamily' = PLCC (Pb-Free) (2 detail records)
Sum
PQFP
N52DXGAGB
G-TAIWAN
MR052031
R1
CY7C136-55NC
121C
100%RH
168
47
0
N52DXGAGB
G-TAIWAN
MR054060
R1
CY7C131-55NC
121C
100%RH
168
50
0
97
0
Summary for 'PkgFamily' = PQFP (2 detail records)
Sum
QFN (Punch Type)
LF56AGAGE
L-SEOL
MR044081
R1
CY7C65640A-LFC
121C
100%RH
168
50
0
LF56AGAGE
L-SEOL
MR051075
R1
CY7C65640A-LFC
121C
100%RH
176
50
0
LF56EGAGE
AC-ASE
054207
R4
CY7C65640-LFC
121C
100%RH
176
50
0
150
0
Summary for 'PkgFamily' = QFN (Punch Type) (3 detail records)
Sum
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
R1
CY8C21434-24LFXI
121C
100%RH
168
50
0
LY48AGAGL
L-SEOL
052404
3
7B6934AC-LLYC
121C/100% RH N/A
168
50
0
LY48D1GAL
L-SEOL
044508
1A
7B6953AC-LLYC
121C/100% RH N/A
168
49
0
LY48EGAGL
L-SEOL
052401
1A
7B6953B-LLYC
121C/100% RH N/A
168
50
0
LY56AGAGL
L-SEOL
MR044065
R1
CY7C68300A-56LFXC
121C
100%RH
176
50
0
LY56DGAGL
L-SEOL
MR051046
R1
CP6241AM
121C
100%RH
176
50
0
LY56DGAGL
L-SEOL
MR053010
R1
CY8C24794-24LFXI
121C
100%RH
168
50
0
LY56FGALL
RA-CML
050303
R1
CY7C65640-LFXC
121C
100%RH
168
50
0
LY56FGALL
RA-CML
050303
R2
CY7C109B-20VCT
121C
100%RH
168
50
0
LY56FGALL
RA-CML
050303
R3
CY7C65640-LFXC
121C
100%RH
168
50
0
LY72AGAGL
L-SEOL
054206
R2
CY28447LF-XC
121C
100%RH
168
50
0
549
0
49
0
49
0
Summary for 'PkgFamily' = QFN (Punch Type, Pb-Free) (11 detail records)
Sum
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR044042
R1
CY7C63101A-QXC
Summary for 'PkgFamily' = QSOP (Pb-Free) (1 detail record)
Sum
2006 Q1 RELIABILITY REPORT
121C
100%RH
168
Page 40 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
FA
SOIC (GullWing)
S0815EAGB
SL-INDIA
MR043080
R1
CY27022SC
121C
100%RH
176
50
0
S1615AAGB
O-INDNS
MR054041
R1
CY2308SC-1H
121C
100%RH
168
48
0
S1615EAGB
M-PHIL
MR053002
R1
CY2309SC-1H
121C
100%RH
168
50
0
S24314AGL
RA-CML
MR044028
R1
CP6124AM
121C
100%RH
168
50
0
S283HGAGB
O-INDNS
MR051003
R1
CY2314ANZSC-1
121C
100%RH
168
45
0
S283HGAGB
O-INDNS
MR052073
R1
CY7B933-SC
121C
100%RH
168
49
0
S324513GB
R-CML
MR051078
R1
CY62128BLL-70SI
121C
100%RH
168
50
0
S324513GN
R-CML
MR053003
R1
CY6525AM
121C
100%RH
168
50
0
392
0
Summary for 'PkgFamily' = SOIC (GullWing) (8 detail records)
Sum
SOIC (GullWing, 450 footprint)
SN2831AHB
R-CML
MR044008
R1
CY62256LL-70SNC
121C
100%RH
168
45
0
SN2831AHN
R-CML
MR052013
R1
CY62256L-70SNC
121C
100%RH
168
50
0
SN2831AHN
R-CML
MR053037
R1
CY22313
121C
100%RH
168
50
0
145
0
Summary for 'PkgFamily' = SOIC (GullWing, 450 footprint) (3 detail records)
Sum
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN
R-CML
053407
R2
CY62256LL
121C
100%RH
168
90
0
SY2831AHN
R-CML
053407
R3
CY62256LL
121C
100%RH
168
90
0
SY2831AHN
R-CML
MR052010
R1
CY62256L-70SNXC
121C
100%RH
168
50
0
230
0
Summary for 'PkgFamily' = SOIC (GullWing, 450 footprint, Pb-Free) (3 detail records)
Sum
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
043801
1
7C823C09AC-MSZI
121C/100% RH N/A
168
48
0
SZ1615DGN
M-PHIL
043801
1(1)
7C823C09AC-MSZI
121C/100% RH N/A
168
48
0
SZ1615DGN
M-PHIL
052004
R2
CY8C21234-24SXI
121C
100%RH
168
45
0
SZ1615DGN
M-PHIL
052004
R3
CY8C21234-24SXI
121C
100%RH
168
45
0
SZ1615EGN
M-PHIL
MR051029
R1
CY2308SXC-1H
121C
100%RH
168
50
0
SZ1615EGN
M-PHIL
MR052046
R1
CY2309SXC-1H
121C
100%RH
168
50
0
SZ18
OP-PHIL
060304
R1
CY7C63723
121C
100%RH
168
50
0
SZ183AGAN
M-PHIL
044301
R1
CY7C63723-SXC
121C
100%RH
168
50
0
R1
CY7C63231A-SXC
121C
100%RH
168
50
SZ183BGAL
RA-CML
MR044082
2006 Q1 RELIABILITY REPORT
0
Page 41 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
SZ24315GN
RA-CML
MR053032
R1
CY7C63743-SXC
121C
100%RH
168
50
0
SZ28327GL
R-CML
054604
R1
CY7C64013C-SXC
121C
100%RH
168
50
0
SZ28327GL
R-CML
054604
R2
CY7C65113C-SXC
121C
100%RH
168
50
0
586
0
Summary for 'PkgFamily' = SOIC (GullWing, Pb-Free) (12 detail records)
Sum
FA
SOIC (J lead)
V2439GAGB
O-INDNS
MR054004
R1
CY7C128A-15VC
121C
100%RH
176
50
0
V28CGAGB
O-INDNS
MR044064
R1
CY7C106B-20VC
121C
100%RH
168
50
0
V3233GALN
R-CML
054502
R1
CY7C188
121C
100%RH
168
50
0
V324EGAGB
O-INDNS
MR051002
R1
CY7C1019B-12VC
121C
100%RH
168
45
0
V324FGAGB
O-INDNS
MR053015
R1
CY7C109B-20VC
121C
100%RH
168
45
0
V444WGALL
R-CML
MR052019
R1
CY7C1021B-12VI
121C
100%RH
168
50
0
V444YAALE
R-CML
MR051015
R1
CY7C1041CV33-12VC
121C
100%RH
168
50
0
V444ZGALL
R-CML
MR053004
R1
CY7C1021CV33
121C
100%RH
168
50
0
V444ZGALL
R-CML
MR054001
R1
CY7C1021CV33-15VC
121C
100%RH
168
50
0
440
0
Summary for 'PkgFamily' = SOIC (J lead) (9 detail records)
Sum
SOIC (J lead, Pb-Free)
VZ243GGBLL
O-INDNS
052801
R1
CY7C197
121C
100%RH
168
50
0
VZ3644GALL
R-CML
MR053038
R1
CY7C1049B-20VXI
121C
100%RH
168
46
0
VZ444WAGL
R-CML
MR052001
R1
CY7C1021B-15VXC
121C
100%RH
168
50
0
VZ444ZALL
R-CML
MR053005
R1
CY7C1021CV33-8VXC
121C
100%RH
168
49
0
195
0
Summary for 'PkgFamily' = SOIC (J lead, Pb-Free) (4 detail records)
Sum
SSOP
O2023GAGB
T-TAIWAN
MR044062
R1
CY8C26233-24PVI
121C
100%RH
168
50
0
O2024GAGE
M-PHIL
MR053001
R1
CY2DP3140I
121C
100%RH
168
50
0
O2026XAGB
T-TAIWAN
053205
R1
IMISM530AYB
121C
100%RH
168
45
0
O2026XAGB
T-TAIWAN
053205
R4
IMISM530AYB
121C
100%RH
168
45
0
O2028GAGE
T-TAIWAN
053205
R5
CY2CC810OI
121C
100%RH
176
50
0
2006 Q1 RELIABILITY REPORT
Page 42 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
O2028GAGE
T-TAIWAN
MR044066
R1
CY2CC810OI
Temp
Volt
Readout
SS
Rejects
176
50
0
121C 100%RH
O2824GAGB
T-TAIWAN
053205
R2
CY28506OC
121C
100%RH
168
45
0
O4816XAGB
T-TAIWAN
053205
R3
CY28342OC
121C
100%RH
168
45
0
O483AXAGN
R-CML
NR042002
R1
7C884053AC-ROC
121C
100%RH
168
50
0
O483AXAGN
R-CML
NR042002
R2
7C828000AT-ROC
121C
100%RH
168
50
0
O5615GAGB
T-TAIWAN
MR054039
R1
CY283410C-2
121C
100%RH
168
50
0
O563AXAGB
R-CML
MR053029
R1
CY28346OC
121C
100%RH
168
50
0
O563AXAGN
R-CML
MR052017
R1
CY28419OC
121C
100%RH
168
40
0
O563BXAGE
R-CML
MR051021
R1
CP6221BM
121C
100%RH
168
50
0
670
0
Summary for 'PkgFamily' = SSOP (14 detail records)
Sum
FA
SSOP (Pb-Free)
SP28214GL
T-TAIWAN
052004
R1
CY8C21234-24SXI
121C
100%RH
168
45
0
SP2824CAN
T-TAIWAN
053005
R1
CY28400OXC
121C
100%RH
176
50
0
SP2824GAN
T-TAIWAN
MR044076
R1
CY28353OXC-2
121C
100%RH
168
50
0
SP2824GAN
T-TAIWAN
MR051052
R1
CY23FP12OXC-003
121C
100%RH
176
50
0
SP2824GAN
T-TAIWAN
MR052008
R1
CY28508OXC
121C
100%RH
176
50
0
SP563AAGN
R-CML
MR053021
R1
CY28410OXC
121C
100%RH
168
50
0
SP563CAGE
T-TAIWAN
053502
R1
CY7C66113A-PVXC
121C
100%RH
168
50
0
345
0
50
0
Summary for 'PkgFamily' = SSOP (Pb-Free) (7 detail records)
Sum
TQFP
A100RKGAB
R-CML
MR043042
R1
CY7C68013-100AC
A100SEGAGL
R-CML
MR053027
R1
CY7C9689A-AC
121C
100%RH
168
50
0
A100SFAGE
R-CML
MR052002
R1
CY7C0241-25AC
121C
100%RH
168
50
0
A128SAGLL
R-CML
050801
R1
CY7C1019CV33-15VC
121C
100%RH
168
44
0
A144GGAGE
G-TAIWAN
MR052033
R1
CY7C057V-15AI
121C
100%RH
168
50
0
A52AEGAGE
Q-KOREA
MR052004
R1
CY29972AI
121C
100%RH
176
50
0
A52CXGAGE
SI-SIGNETI
MR051017
R1
CY29773AIT
121C
100%RH
168
50
0
A64FXGAGE
G-TAIWAN
MR054058
R1
CY7C144AV-25AC
121C
100%RH
168
45
0
Summary for 'PkgFamily' = TQFP (8 detail records)
Sum
2006 Q1 RELIABILITY REPORT
121C
100%RH
176
389
0
Page 43 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
FA
TQFP (10x10)
AS64CGAGB
Q-KOREA
MR053050
R1
CY7C4275V-15ASC
121C
100%RH
168
50
0
AS6513GAGB
G-TAIWAN
MR052089
R1
CY7C4215V-15ASC
121C
100%RH
168
50
0
100
0
Summary for 'PkgFamily' = TQFP (10x10) (2 detail records)
Sum
TQFP (Pb-Free)
AZ100RIALL
R-CML
053901
R1
CY7C1370D
121C
100%RH
168
50
0
AZ100RIALL
R-CML
053901
R2
CY7C1370D
121C
100RH
168
50
0
AZ100RIALL
R-CML
053901
R3
CY7C1370D
121C
100%RH
168
50
0
AZ100RRLL
RA-CML
051702
R1
CY7C1470V33
121C
100%RH
168
50
0
AZ100RRLL
RA-CML
051702
R4
CY7C1470V33
121C
100%RH
168
50
0
AZ100RRLL
R-CML
051006
R1A
CY7C1470
121C
100%RH
168
50
0
AZ100SEGL
R-CML
052805
121C
100%RH
168
50
0
AZ100SGAL
R-CML
053007
R1(1 CY7C67300-100AXI
)
R1A CY7C038V
121C
100%RH
168
315
0
AZ100SGAL
R-CML
053007
R1B
CY7C038V
121C
100%RH
168
347
0
AZ100SGAL
R-CML
053007
R2A
CY7C027V
121C
100%RH
168
50
0
AZ100SGAL
R-CML
053007
121C
100%RH
168
60
0
AZ100SGAL
R-CML
053007
R2A( CY7C027V
1)
R3A CY7C027V
121C
100%RH
168
50
0
AZ100SGAL
R-CML
053007
121C
100%RH
168
59
0
AZ144GGAL
G-TAIWAN
MR052074
R3A( CY7C027V
1)
R1
CY7C056V-12AXC
121C
100%RH
168
49
0
AZ52ASGAL
Q-KOREA
051902
R1
121C
100%RH
168
50
0
1330
0
CY7B9945V-5AXCT
Summary for 'PkgFamily' = TQFP (Pb-Free) (15 detail records)
Sum
TQFP (Thermal)
AT120AAAGE
L-SEOL
MR052023
R1
CYS25G0101DX-ATC
121C
100%RH
168
50
0
AT120AGAGE
L-SEOL
MR051082
R1
CYS25G0101DX-ATC
121C
100%RH
168
50
0
AT120AHAGE
L-SEOL
041701
R1
CYS25G0101DX-ATC
121C
100%RH
176
50
0
150
0
Summary for 'PkgFamily' = TQFP (Thermal) (3 detail records)
Sum
TSOP (Pb-Free)
ZT28R4AGL
R-CML
MR052011
R1
CY7C1399B-15ZXC
121C
100%RH
176
49
0
ZT32RKGGL
T-TAIWAN
MR052044
R1
CY7C109B-15ZXC
121C
100%RH
168
49
0
2006 Q1 RELIABILITY REPORT
Page 44 of 78
Results
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
Summary for 'PkgFamily' = TSOP (Pb-Free) (2 detail records)
Sum
SS
Rejects
98
0
FA
Results
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
R1
CY62256LL-70ZRI
121C
100%RH
168
45
0
ZR28R2AGN
R-CML
MR051013
R1
CY62256LL-70ZRI
121C
100%RH
168
50
0
ZR28R2AGN
R-CML
MR053049
R1
CY62256LL-70ZRI
121C
100%RH
168
45
0
140
0
50
0
50
0
Summary for 'PkgFamily' = TSOP (Reverse) (3 detail records)
Sum
TSOP (Reverse, Pb-Free)
ZY28R2AGN
R-CML
MR053057
R1
CY62256LL-70ZRXI
121C
100%RH
168
Summary for 'PkgFamily' = TSOP (Reverse, Pb-Free) (1 detail record)
Sum
TSOP I
ZA32RHAALB
R-CML
MR052020
R1
CY62128DV30LL-55ZAI
121C
100%RH
168
50
0
ZA32RHAALB
R-CML
MR053056
R1
CY62128DV30LL-55ZAI
121C
100%RH
168
50
0
100
0
Summary for 'PkgFamily' = TSOP I (2 detail records)
Sum
TSOP II
ZS324FAGE
T-TAIWAN
MR051037
R1
CY7C1019CV33-12ZC
121C
100%RH
168
50
0
ZS324FAGE
T-TAIWAN
MR052009
R1
CY7C1019CV33-12ZC
121C
100%RH
168
50
0
ZS324FAGE
T-TAIWAN
MR053055
R1
CY7C1019CV33-12ZC
121C
100%RH
168
50
0
ZS444ABALE
R-CML
MR053058
R1
CS6125AT
121C
100%RH
168
50
0
ZS444AJALN
R-CML
MR054008
R1
CY7C1021CV33-15ZC
121C
100%RH
168
49
0
ZS444AKALN
R-CML
MR052022
R1
CY7C1041CV33-15ZC
121C
100%RH
168
50
0
ZS444YAGL
R-CML
053007
R5
CY7C1041B-15ZC
121C
100%RH
168
60
0
ZS544AALE
G-TAIWAN
MR044031
R1
CY7C1069AV33-12ZC
121C
100%RH
168
46
0
ZS544AALE
G-TAIWAN
MR044031
R1A
CY7C1069AV33-12ZC
121C
100%RH
176
3
0
ZS544AALE
G-TAIWAN
MR052030
R1
CY7C1069AV33-12ZC
121C
100%RH
176
10
40 MR052030-1P1
Die edge delamination (Nitride Seal Mask
implemented , WW 45 2005)
Summary for 'PkgFamily' = TSOP II (10 detail records)
Sum
418
40
0
TSOP II (Pb-Free)
ZW324FAGL
T-TAIWAN
MR052021
R1
CY7C1019CV33-12ZXC
121C
100%RH
168
50
ZW444ADALL
R-CML
MR052003
R1
CY7C1041CV33-15ZXC
121C
100%RH
176
49
2006 Q1 RELIABILITY REPORT
0
Page 45 of 78
Product Reliability
BldKit
Assy Site
EvalNum
TV
Device
Temp
Volt
Readout
SS
Rejects
ZW444AHGLL
R-CML
045202
R1
CY62127EV
121C
100%RH
168
50
0
ZW444NAGN
R-CML
MR051047
R1
CY62126DV30LL-55ZXI
121C
100%RH
168
50
0
199
0
Summary for 'PkgFamily' = TSOP II (Pb-Free) (4 detail records)
Sum
FA
TSOP/ TSSOP
Z1611XAGB
M-PHIL
MR044012
R1
CY22392ZC-366
121C
100%RH
168
50
0
Z1619GAGN
RA-CML
MR052027
R1
CY22392ZC-366
121C
100%RH
168
50
0
Z1619GAGN
RA-CML
MR053059
R1
CY26049ZC-36
121C
100%RH
168
48
0
Z32RYAALE
T-TAIWAN
MR043017
R1
CY62128DV30LL-55ZI
121C
100%RH
168
49
0
Z32RYAALE
T-TAIWAN
MR043060
R1
CY62128DV30LL-70ZI
121C
100%RH
176
49
0
Z5624BAGN
R-CML
MR051050
R1
CY28346ZI-2T
121C
100%RH
168
50
0
Z5624BAGN
R-CML
MR052012
R1
CY28409ZC
121C
100%RH
168
50
0
Z5624BAGN
R-CML
MR053046
r1
CY28409ZC
121C
100%RH
168
50
0
396
0
Summary for 'PkgFamily' = TSOP/ TSSOP (8 detail records)
Sum
TSSOP (Pb-Free)
ZZ1613GAN
T-TAIWAN
MR052077
R1
CY2309ZXI-1H
121C
100%RH
168
50
0
ZZ2411AGN
T-TAIWAN
MR051051
R1
CY22313ZXC
121C
100%RH
168
50
0
ZZ2415GAL
RA-CML
MR052006
R1
CY22313ZXC
121C
100%RH
168
50
0
ZZ2813AGN
T-TAIWAN
053006
R1
CYI5002ZXC
121C
100%RH
168
49
0
ZZ2817AGL
RA-CML
051903
R1
CY221R28-ZXC
121C
100%RH
168
50
0
ZZ2817AGL
RA-CSPI
041303
1
7C89000AC-RAZZC
121C/100% RH N/A
168
50
0
ZZ5624BG
R-CML
052802
R1
CY28411ZXC
121C
168
49
0
ZZ5624BGN
R-CML
MR051026
R1
CY28442ZXC
121C
100%RH
176
50
0
ZZ5624BGN
R-CML
MR061008
R1
CY28441ZXC
121C
100%RH
168
50
0
448
0
100%RH
Summary for 'PkgFamily' = TSSOP (Pb-Free) (9 detail records)
Sum
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
050202
R1
CY7C015V18-35AC
121C
100%RH
168
50
0
BZ48BKALE
RA-CML
MR052088
R1
CYK128K16SCBU-55BVXI
121C
100%RH
176
50
0
BZ52BGAGL
G-TAIWAN
043004
1A
7C87740A
121C/100% RH N/A
168
47
0
BZ52BGAGL
G-TAIWAN
043004
2C
7C87742A
121C/100% RH N/A
168
46
0
BZ52BGAGL
G-TAIWAN 043004
2006 Q1 RELIABILITY REPORT
3B
7C87741A
121C/100% RH N/A
168
47
0
Page 46 of 78
Results
Product Reliability
Summary for 'PkgFamily' = VFBGA (0.75-0.8, Pb-Free) (5 detail records)
Sum
Grand Total
2006 Q1 RELIABILITY REPORT
240
0
10618
40
Page 47 of 78
Product Reliability
Summary Detail, Package -- TC Performance Over Time
From:
4/3/2005
To: 3/30/2006
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
CERDIP (Windowed)
W129DF-TSC
T-TAIWAN
042114
R1
CY2291F
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
042114
R2
CY2291F
150C
-65C
300
49
0
W129DF-TSC
T-TAIWAN
042114
R3
CY2291F
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
050701
R1
CY7C65640-LFXC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
050701
R2
CY7C65640-LFXC
150C
-65C
300
50
0
W129DF-TSC
T-TAIWAN
050701
R3
CY7C65640-LFXC
150C
-65C
300
50
0
299
0
Summary for 'PkgFamily' = CERDIP (Windowed) (6 detail records)
Sum
Chip On Board (Pb-Free)
DE001AAGL
EC-CHINA
052403
1A
7M6341AT-ECDEC
65C/-25C N/A
120
45
0
DE001AAGL
EC-CHINA
052403
1B
7M6341AT-ECDEC
65C/-25C N/A
120
45
0
DE001AAGL
EC-CHINA
052403
1C
7M6341AT-ECDEC
65C/-25C N/A
120
45
0
DE001AAGL
SV-CHINA
052405
1A
7M6341AT-SVDEC
65C/-25C N/A
120
45
0
DE001AAGL
SV-CHINA
052405
1B
7M6341AT-SVDEC
65C/-25C N/A
120
45
0
DE001AAGL
SV-CHINA
052405
1C
7M6341AT-SVDEC
65C/-25C N/A
120
45
0
270
0
Summary for 'PkgFamily' = Chip On Board (Pb-Free) (6 detail records)
Sum
FBGA (0.75-0.8)
BA48AUALE
RA-CML
MR052085
R1
CY7C1021BV33L-15BAI
150C
-65C
300
50
0
BA48AVALE
RA-CML
MR043061
R1
CY62147CV30LL-70BAI
150C
-65C
300
50
0
BA48DJALE
G-TAIWAN
045101
R1
7C62172DC-GBAI
150C
-65C
300
45
0
BA48DJALE
G-TAIWAN
045101
R2
7C62172DC-GBAI
150C
-65C
300
44
0
BA48DJALE
G-TAIWAN
045101
R3
7C62172DC-GBAI
150C
-65C
300
45
0
BA48DJALE
G-TAIWAN
052502
R1
CY62177DV30L
150C
-65C
300
45
0
2006 Q1 RELIABILITY REPORT
Page 48 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
BA48DJALE
G-TAIWAN
052502
R2
CY62177DV30L
150C
-65C
300
50
0
BA48DJALE
G-TAIWAN
052502
R3
CY62177DV30L
150C
-65C
300
50
0
BA48HVALE
RA-CML
MR051066
R1
CS5854AT
150C
-65C
300
49
0
428
0
48
0
48
0
300
50
0
Summary for 'PkgFamily' = FBGA (0.75-0.8) (9 detail records)
Sum
FBGA (0.75-0.8, Pb-Free)
BK48CDALL
G-TAIWAN
MR053012
R1
CY7C1041CV33-10BAXC
150C
-65C
300
Summary for 'PkgFamily' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
Sum
FBGA (1.0)
BB100EAGE
G-TAIWAN
MR052032
R1
CYP15G0101DXB-BBI
150C
-65C
BB165AALE
G-TAIWAN
044201
1
7C1414BC-GBBC
150C/-65CN/A
300
48
0
BB172AAGE
G-TAIWAN
MR051007
R1
CY7C057V-15BBI
150C
300
50
0
BB172BALE
G-TAIWAN
044102
1
7C08523DC-GBBCB
150C/-65CN/A
300
48
0
BB209BALE
G-TAIWAN
050702
1
7C1474AC-GBBC
150C/-65CN/A
300
49
0
BB209BALE
G-TAIWAN
050702
2
7C1474AC-GBBC
150C/-65CN/A
300
46
0
BB209BALE
G-TAIWAN
050702
3
7C1474AC-GBBC
150C/-65CN/A
300
50
0
341
0
-65C
Summary for 'PkgFamily' = FBGA (1.0) (7 detail records)
Sum
FLIPCHIP (Build-Up Substrate w/ HS)
FG1152AGE
GQ-KOREA 034001
1C
7C72250AJ-GQFGC
125C/-55CN/A
500
47
0
FG1152AGE
GQ-KOREA 034001
1C
7C72250AJ-GQFGC
125C/-55CN/A
1000
47
0
FG1152AGE
GQ-KOREA 034001
1D
7C72220AJ-GQFGC
125C/-55CN/A
1000
43
0
FG1152AGE
GQ-KOREA 034001
1D
7C72220AJ-GQFGC
125C/-55CN/A
500
46
0
FG1152AGE
GQ-KOREA 034001
4
7C72250BJ-GQFGCB
125C/-55CN/A
1000
48
0
FG1152AGE
GQ-KOREA 034001
4
7C72250BJ-GQFGCB
125C/-55CN/A
500
48
0
FG388AGAGE GQ-KOREA 044701
1A
7C71050AJ-GQFGC
125C/-55CN/A
500
45
0
FG388AGAGE GQ-KOREA 044701
1A
7C71050AJ-GQFGC
125C/-55CN/A
1000
44
0
2006 Q1 RELIABILITY REPORT
Page 49 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
FG388AGAGE GQ-KOREA 044701
1B
7C71050AJ-GQFGC
125C/-55CN/A
1000
36
0
FG388AGAGE GQ-KOREA 044701
1B
7C71050AJ-GQFGC
125C/-55CN/A
500
45
0
FG388AGAGE GQ-KOREA 044701
1C
7C71050AJ-GQFGC
125C/-55CN/A
500
45
0
FG388AGAGE GQ-KOREA 044701
1C
7C71050AJ-GQFGC
125C/-55CN/A
1000
43
0
537
0
Summary for 'PkgFamily' = FLIPCHIP (Build-Up Substrate w/ HS) (12 detail records)
Sum
SS
Reject FA
FVBGA (0.75-0.8, 0.3mm)
BV48BTALN
RA-CML
054302
R5
CY62147EV30*
150C
-65C
300
49
0
BV48HAALE
G-TAIWAN
MR051014
R1
CY62147CV33LL-70BVI
150C
-65C
300
50
0
BV48VAALE
G-TAIWAN
MR052084
R1
CY62137CV30LL-70BVIT
150C
-65C
300
50
0
BV52BGAGE
G-TAIWAN
043004
3A
7C87742A
150C/-65CN/A
300
46
0
BV52BGAGE
G-TAIWAN
043004
3C
7C87741A
150C/-65CN/A
300
46
0
BV52BGAGE
G-TAIWAN
043004
6
7C87741A
150C/-65CN/A
300
45
0
BV52BGAGE
G-TAIWAN
043004
6A
7C87742A
150C/-65CN/A
300
46
0
BV52BGAGE
G-TAIWAN
043004
8
7C87742A
150C/-65CN/A
300
46
0
BV52BGAGE
G-TAIWAN
043004
8A
7C87741A
150C/-65CN/A
300
347
0
BV52BGAGE
G-TAIWAN
043004
9
7C87741A
150C/-65CN/A
300
348
0
1073
0
Summary for 'PkgFamily' = FVBGA (0.75-0.8, 0.3mm) (10 detail records)
Sum
LCC
L04AA
052701
1
7C825701A
125C/-55CN/A
100
50
0
L04AA
052701
1
7C825701A
125C/-55CN/A
1000
50
0
L04AA
052701
1A
7C825701AT-ERLC
125C/-55CN/A
1000
50
0
L04AA
052701
1A
7C825701AT-ERLC
125C/-55CN/A
100
50
0
200
0
50
0
Summary for 'PkgFamily' = LCC (4 detail records)
Sum
LCC (Windowed Plastic)
QY48AAALL
IP-TAIWAN
052003
2006 Q1 RELIABILITY REPORT
1
7ISC305BF-IPQYC
125C/-40CN/A
1000
Page 50 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
QY48AAALL
IP-TAIWAN
052003
1
7ISC305BF-IPQYC
125C/-40CN/A
500
50
0
QY48AAALL
IP-TAIWAN
052003
2
7ISC305BF-IPQYC
125C/-40CN/A
500
50
0
QY48AAALL
IP-TAIWAN
052003
2
7ISC305BF-IPQYC
125C/-40CN/A
1000
50
0
QY48AAALL
IP-TAIWAN
052003
3
7ISC305BF-IPQYC
125C/-40CN/A
500
50
0
QY48AAALL
IP-TAIWAN
052003
3
7ISC305BF-IPQYC
125C/-40CN/A
1000
50
0
300
0
300
50
0
Summary for 'PkgFamily' = LCC (Windowed Plastic) (6 detail records)
Sum
PBGA (1.27)
BG119NALE
G-TAIWAN
MR053018
R1
CY7C1354B-166GBC
150C
-65C
BG119VALE
G-TAIWAN
052602
1
7C1330DC-GBGC
150C/-65CN/A
300
50
0
BG272AAGE
G-TAIWAN
MR052034
R1
CY7C0430BV-100BGI
150C
-65C
300
50
0
BG282BAGE
G-TAIWAN
MR052005
R1
CY37512P256-83BGC
150C
-65C
300
49
0
199
0
Summary for 'PkgFamily' = PBGA (1.27) (4 detail records)
Sum
PBGA (Cavity/Heatsink)
BL256L2GE
G-TAIWAN
MR051006
R1
CYP15G0401DXB-BGI
150C
-65C
300
50
0
BL256L2GE
G-TAIWAN
MR054018
R1
CYP15G0401DXB-BGC
150C
-65C
300
50
0
100
0
Summary for 'PkgFamily' = PBGA (Cavity/Heatsink) (2 detail records)
Sum
PBGA (Cavity/Heatsink, Pb-Free)
BJ256L2GL
G-TAIWAN
044507
R2
CY28323BPVC
150C
-65C
300
49
0
BJ256L2GL
G-TAIWAN
044507
R3
CY28323BPVC
150C
-65C
300
50
0
BJ256L2GL
G-TAIWN
044507
R1
CY28323BPVC
150C
-65C
300
47
0
BJ504AAGL
G-TAIWAN
044507
R4
CY7C9536B-BLXC
150C
-65C
300
49
0
BJ504AAGL
G-TAIWAN
044507
R5
CY7C9536B-BLXC
150C
-65C
300
50
0
245
0
45
0
Summary for 'PkgFamily' = PBGA (Cavity/Heatsink, Pb-Free) (5 detail records)
Sum
PDIP
P203CGAGB
O-INDNS
MR053013
2006 Q1 RELIABILITY REPORT
R1
CY7C168A-35PC
150C
-65C
300
Page 51 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
P243FGAGE
M-PHIL
MR052025
R1
CY7C194-25PC
150C
-65C
300
50
0
P2839GAGB
X-THAI
MR052061
R1
CY7C466A-10PTC
150C
-65C
300
50
0
P286BGAGB
O-INDNS
052406
R4
CY62256LL-70PC
150C
-65C
300
45
0
P286EGAGB
O-INDNS
052406
R3
CY62256LL-70PC
150C
-65C
300
50
0
P286EGAGB
O-INDNS
052406
R6
CY62256L-70PC
150C
-65C
300
50
0
P286EGAGB
O-INDNS
MR054044
R1
CY62256LL-70PC
150C
-65C
300
50
0
P406AGAGB
O-INDNS
052406
R2
CP5748AM
150C
-65C
300
45
0
385
0
Summary for 'PkgFamily' = PDIP (8 detail records)
Sum
PDIP (Pb-Free)
PZ183AAGN
O-INDNS
MR051004
R1
CY7C63231A-PXC
150C
-65C
300
45
0
PZ183AAGN
O-INDNS
MR052015
R1
CY7C63231A-PXC
150C
-65C
300
45
0
PZ243AAGN
X-THAI
051206
R1
CY7C63743-PXC
150C
-65C
300
50
0
PZ243AAGN
X-THAI
051206
R2
CY7C63743-PXC
150C
-65C
300
48
0
PZ243AAGN
X-THAI
051206
R3
CY7C63743-PXC
150C
-65C
300
50
0
PZ2831GAN
O-INDNS
MR053014
R1
CY7C64013A-PXC
150C
-65C
300
45
0
283
0
Summary for 'PkgFamily' = PDIP (Pb-Free) (6 detail records)
Sum
PLCC
J28SEGAGB
M-PHIL
MR054019
R1
CY7B923-JC
150C
-65C
300
50
0
J32RBGAGB
X-THAI
MR052018
R1
CY7B991-5JC
150C
-65C
300
50
0
J32RBGAGB
X-THAI
MR054059
R1
CY7B9911-5JC
150C
-65C
300
50
0
J32RNGAGE
M-PHIL
MR053031
R1
CY7C4271V-25JC
150C
-65C
300
50
0
J68SCGAGB
X-THAI
MR054061
R1
CY7C144-55JCT
150C
-65C
300
50
0
250
0
50
0
Summary for 'PkgFamily' = PLCC (5 detail records)
Sum
PLCC (Pb-Free)
JZ32RBGAN
M-PHIL
MR051056
2006 Q1 RELIABILITY REPORT
R1
CY7C421-20JXC
150C
-65C
300
Page 52 of 78
Results
Product Reliability
BldKit
JZ32RBGAN
Assy
M-PHIL
EvalNum
MR053028
TV
Device
Temp
R1
CY7C419-15JXC
150C
Temp
-65C
Cycles
300
Summary for 'PkgFamily' = PLCC (Pb-Free) (2 detail records)
Sum
SS
Reject FA
50
0
100
0
PQFP
N52DXGAGB
G-TAIWAN
MR052031
R1
CY7C136-55NC
150C
-65C
300
50
0
N52DXGAGB
G-TAIWAN
MR054060
R1
CY7C131-55NC
150C
-65C
300
50
0
100
0
Summary for 'PkgFamily' = PQFP (2 detail records)
Sum
QFN (Punch Type)
LF48AGAGE
L-SEOL
050404
1A
7B6934AC-LLFC
100C/-40CN/A
500
45
0
LF48AGAGE
L-SEOL
050404
1A
7B6934AC-LLFC
100C/-40CN/A
100
45
0
LF48AGAGE
L-SEOL
050404
1B
7B6934AC-LLFC
100C/-40CN/A
100
45
0
LF48AGAGE
L-SEOL
050404
1B
7B6934AC-LLFC
100C/-40CN/A
500
45
0
LF48AGAGE
L-SEOL
050404
1C
7B6934AC-LLFC
100C/-40CN/A
500
45
0
LF48AGAGE
L-SEOL
050404
1C
7B6934AC-LLFC
100C/-40CN/A
100
45
0
LF56AGAGE
L-SEOL
MR044081
R1
CY7C65640A-LFC
-65C
150C 300
50
0
LF56AGAGE
L-SEOL
MR051075
R1
CY7C65640A-LFC
150C
-65C
300
50
0
LF56AGAGE
L-SEOL
MR052016
R1
CY7C65640A-LFC
150C
-65C
300
50
0
420
0
Summary for 'PkgFamily' = QFN (Punch Type) (9 detail records)
Sum
QFN (Punch Type, Pb-Free)
LY32BGAGL
RA-CML
052610
R1
CY8C21434-24LFXI
150C
-65C
300
50
0
LY32BGAGL
RA-CML
052610
R2
CY8C21434-24LFXI
150C
-65C
300
50
0
LY32BGAGL
RA-CML
052610
R3
CY8C21434-24LFXI
150C
-65C
300
49
0
LY48D1GAL
L-SEOL
044508
1A
7B6953AC-LLYC
150C/-65CN/A
300
125
0
LY48D1GAL
L-SEOL
044508
1B
7B6953AC-LLYC
150C/-65CN/A
300
125
0
LY48D1GAL
L-SEOL
044508
1C
7B6953AC-LLYC
150C/-65CN/A
300
125
0
LY48EGAGL
L-SEOL
052401
1A
7B6953B-LLYC
150C/-65CN/A
300
50
0
2006 Q1 RELIABILITY REPORT
Page 53 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
LY48EGAGL
L-SEOL
052401
1B
7B6953B-LLYC
150C/-65CN/A
300
50
0
LY48EGAGL
L-SEOL
052401
1C
7B6953B-LLYC
150C/-65CN/A
300
50
0
LY56AGAGL
L-SEOL
MR044065
R1
CY7C68300A-56LFXC
150C
-65C
300
49
0
LY56DGAGL
L-SEOL
MR051046
R1
CP6241AM
150C
-65C
300
50
0
LY56FGALL
RA-CML
050303
R1
CY7C65640-LFXC
150C
-65C
300
50
0
LY56FGALL
RA-CML
050303
R2
CY7C109B-20VCT
150C
-65C
300
49
0
LY56FGALL
RA-CML
050303
R3
CY7C65640-LFXC
150C
-65C
300
50
0
LY72AGAGL
L-SEOL
054206
R1
CY28447LF-XC
150C
-65C
300
50
0
LY72AGAGL
L-SEOL
054206
R2
CY28447LF-XC
150C
-65C
300
50
0
LY72AGAGL
L-SEOL
054206
R3
CY28447LF-XC
150C
-65C
300
50
0
1072
0
50
0
50
0
Summary for 'PkgFamily' = QFN (Punch Type, Pb-Free) (17 detail records)
Sum
QSOP (Pb-Free)
SQ2414AGN
R-CML
MR044042
R1
CY7C63101A-QXC
150C
-65C
300
Summary for 'PkgFamily' = QSOP (Pb-Free) (1 detail record)
Sum
SOIC (GullWing)
S0815EAGB
SL-INDIA
MR043080
R1
CY27022SC
150C
-65C
300
48
0
S1615AAGB
O-INDNS
MR054041
R1
CY2308SC-1H
150C
-65C
300
45
0
S1615EAGB
M-PHIL
MR053002
R1
CY2309SC-1H
150C
-65C
300
48
0
S24314AGL
RA-CML
MR044028
R1
CP6124AM
150C
-65C
300
50
0
S2837GAGB
X-THAI
MR044029
R1
CY7C64013-SC
150C
-65C
300
50
0
S283HGAGB
O-INDNS
MR044063
R1
CY8C24423-24SI
150C
-65C
300
50
0
S283HGAGB
O-INDNS
MR051003
R1
CY2314ANZSC-1
150C
-65C
300
45
0
S283HGAGB
O-INDNS
MR052073
R1
CY7B933-SC
150C
-65C
300
50
0
S324513GB
R-CML
MR051078
R1
CY62128BLL-70SI
150C
-65C
300
42
0
S324513GN
R-CML
MR053003
R1
CY6525AM
150C
-65C
300
50
0
Summary for 'PkgFamily' = SOIC (GullWing) (10 detail records)
2006 Q1 RELIABILITY REPORT
Page 54 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
Sum
SS
Reject FA
478
0
Results
SOIC (GullWing, 450 footprint)
SN2831AHB
R-CML
MR044008
R1
CY62256LL-70SNC
150C
-65C
300
45
0
SN2831AHN
R-CML
MR052013
R1
CY62256L-70SNC
150C
-65C
300
50
0
SN2831AHN
R-CML
MR053037
R1
CY22313
150C
-65C
300
50
0
145
0
Summary for 'PkgFamily' = SOIC (GullWing, 450 footprint) (3 detail records)
Sum
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN
R-CML
053407
R1
CY62256LL
150C
-65C
300
90
0
SY2831AHN
R-CML
053407
R2
CY62256LL
150C
-65C
300
87
0
SY2831AHN
R-CML
053407
R3
CY62256LL
150C
-65C
300
90
0
SY2831AHN
R-CML
MR052010
R1
CY62256L-70SNXC
150C
-65C
300
50
0
317
0
Summary for 'PkgFamily' = SOIC (GullWing, 450 footprint, Pb-Free) (4 detail records)
Sum
SOIC (GullWing, Pb-Free)
SZ1615DGN
M-PHIL
043801
1(1)
7C823C09AC-MSZI
150C/-65CN/A
300
48
0
SZ1615DGN
M-PHIL
052004
R2
CY8C21234-24SXI
150C
-65C
300
45
0
SZ1615DGN
M-PHIL
052004
R3
CY8C21234-24SXI
150C
-65C
300
45
0
SZ1615EGN
M-PHIL
MR051029
R1
CY2308SXC-1H
150C
-65C
300
50
0
SZ1615EGN
M-PHIL
MR052046
R1
CY2309SXC-1H
150C
-65C
300
48
0
SZ163BGAN
M-PHIL
044301
R3
CYISM532ASXC
150C
-65C
300
49
0
SZ18
OP-PHIL
060304
R1
CY7C63723
150C
-65C
300
50
0
SZ18
OP-PHIL
060304
R2
CY7C63723
150C
-65C
300
50
0
SZ18
OP-PHIL
060304
R3
CY7C63723
150C
-65C
300
50
0
SZ183AGAN
M-PHIL
044301
R1
CY7C63723-SXC
150C
-65C
300
50
0
SZ183AGAN
M-PHIL
044301
R2
CY7C63723-SXC
150C
-65C
300
50
0
SZ183BGAL
RA-CML
MR044082
R1
CY7C63231A-SXC
-65C
150C 300
50
0
SZ24315GN
RA-CML
MR053032
R1
CY7C63743-SXC
150C
-65C
49
1 MR053032-1T1
2006 Q1 RELIABILITY REPORT
300
Page 55 of 78
Cut wedge (8D in progress)
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
Results
SZ28327GL
R-CML
054604
R1
CY7C64013C-SXC
150C
-65C
300
33
17 054604-1T1
Cut wedge (8D in progress)
SZ28327GL
R-CML
054604
R2
CY7C65113C-SXC
150C
-65C
300
39
11 054604-2T1
Cut wedge (8D in progress)
Summary for 'PkgFamily' = SOIC (GullWing, Pb-Free) (15 detail records)
Sum
706
29
SOIC (J lead)
V2439GAGB
O-INDNS
MR054004
R1
CY7C128A-15VC
150C
-65C
300
50
0
V28CGAGB
O-INDNS
MR044064
R1
CY7C106B-20VC
150C
-65C
300
48
0
V3233GALN
R-CML
054502
R1
CY7C188
150C
-65C
300
50
0
V3233GALN
R-CML
054502
R2
CY7C188
150C
-65C
300
50
0
V3233GALN
R-CML
054502
R3
CY7C188
150C
-65C
300
50
0
V32419GLL
R-CML
052803
R3
CY7C1019D
150C
-65C
300
45
0
V324EGAGB
O-INDNS
MR051002
R1
CY7C1019B-12VC
150C
-65C
300
45
0
V324FGAGB
O-INDNS
MR053015
R1
CY7C109B-20VC
150C
-65C
300
45
0
V444WGALL
R-CML
MR052019
R1
CY7C1021B-12VI
150C
-65C
300
49
0
V444YAALE
R-CML
MR051015
R1
CY7C1041CV33-12VC
150C
-65C
300
50
0
V444ZGALL
R-CML
MR053004
R1
CY7C1021CV33
150C
-65C
300
50
0
V444ZGALL
R-CML
MR054001
R1
CY7C1021CV33-15VC
150C
-65C
300
50
0
582
0
Summary for 'PkgFamily' = SOIC (J lead) (12 detail records)
Sum
SOIC (J lead, Pb-Free)
VZ243GGBLL
O-INDNS
052801
R1
CY7C197
150C
-65C
300
50
0
VZ243GGBLL
O-INDNS
052801
R2
CY7C197
150C
-65C
300
50
0
VZ243GGBLL
O-INDNS
052801
R3
CY7C197
150C
-65C
300
50
0
VZ3644GALL
R-CML
MR053038
R1
CY7C1049B-20VXI
150C
-65C
300
48
0
VZ444WAGL
R-CML
MR052001
R1
CY7C1021B-15VXC
150C
-65C
300
50
0
VZ444ZALL
R-CML
MR053005
R1
CY7C1021CV33-8VXC
150C
-65C
300
50
0
298
0
Summary for 'PkgFamily' = SOIC (J lead, Pb-Free) (6 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 56 of 78
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
SSOP
O2023GAGB
T-TAIWAN
MR044062
R1
CY8C26233-24PVI
150C
-65C
300
50
0
O2024GAGE
M-PHIL
MR044067
R1
CY2DP314OI
150C
-65C
300
50
0
O2024GAGE
M-PHIL
MR053001
R1
CY2DP3140I
150C
-65C
300
50
0
O2026XAGB
T-TAIWAN
053205
R1
IMISM530AYB
150C
-65C
300
45
0
O2026XAGB
T-TAIWAN
053205
R4
IMISM530AYB
150C
-65C
300
45
0
O2028GAGE
T-TAIWAN
053205
R5
CY2CC810OI
150C
-65C
300
50
0
O2028GAGE
T-TAIWAN
MR044066
R1
CY2CC810OI
150C
-65C
300
50
0
O2824GAGB
T-TAIWAN
053205
R2
CY28506OC
150C
-65C
300
45
0
O2824GAGB
T-TAIWAN
053205
R6
CY28508OC
150C
-65C
300
49
0
O4816XAGB
T-TAIWAN
053205
R3
CY28342OC
150C
-65C
300
45
0
O483AXAGN
R-CML
NR042002
R1
7C884053AC-ROC
150C
-65C
300
50
0
O483AXAGN
R-CML
NR042002
R2
7C828000AT-ROC
150C
-65C
300
50
0
O5615GAGB
T-TAIWAN
MR054039
R1
CY283410C-2
150C
-65C
300
50
0
O563AXAGB
R-CML
MR053029
R1
CY28346OC
150C
-65C
300
49
0
O563AXAGN
R-CML
MR052017
R1
CY28419OC
150C
-65C
300
49
0
O563BXAGE
R-CML
MR051021
R1
CP6221BM
150C
-65C
300
50
0
O563BXAGL
R-CML
NR042002
R7
7C66113GT-ROC
150C
-65C
300
50
0
O563BXAGL
R-CML
NR042002
R8
7C68003AC-ROC
150C
-65C
300
49
0
876
0
Summary for 'PkgFamily' = SSOP (18 detail records)
Sum
SSOP (Pb-Free)
SP2814GAL
T-TAIWAN
053402
R1
CY8C27443-24PVXI
150C
-65C
300
45
0
SP28214GL
T-TAIWAN
052004
R1
CY8C21234-24SXI
150C
-65C
300
50
0
SP2824CAN
T-TAIWAN
053005
R1
CY28400OXC
150C
-65C
300
50
0
SP2824CAN
T-TAIWAN
053005
R2
CY28400OXC
150C
-65C
300
49
0
SP2824CAN
T-TAIWAN
053005
2006 Q1 RELIABILITY REPORT
R3
CY28400OXC
150C
-65C
300
50
0
Page 57 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
SP2824GAN
T-TAIWAN
MR044076
R1
CY28353OXC-2
150C
-65C
300
49
0
SP2824GAN
T-TAIWAN
MR051052
R1
CY23FP12OXC-003
150C
-65C
300
45
0
SP2824GAN
T-TAIWAN
MR052008
R1
CY28508OXC
150C
-65C
300
50
0
SP563AAGN
R-CML
MR053021
R1
CY28410OXC
150C
-65C
300
50
0
SP563CAGE
T-TAIWAN
053502
R1
CY7C66113A-PVXC
150C
-65C
300
50
0
SP563CAGE
T-TAIWAN
053502
R2
CY7C66113A-PVXC
150C
-65C
300
50
0
SP563CAGE
T-TAIWAN
053502
R3
CY7C66113A-PVXC
150C
-65C
300
50
0
588
0
Summary for 'PkgFamily' = SSOP (Pb-Free) (12 detail records)
Sum
TQFP
A100RKGAB
R-CML
MR043042
R1
CY7C68013-100AC
150C
-65C
300
50
0
A100SEGAGL R-CML
MR053027
R1
CY7C9689A-AC
150C
-65C
300
50
0
A100SFAGE
R-CML
MR052002
R1
CY7C0241-25AC
150C
-65C
300
50
0
A128SAGLL
R-CML
050801
R1
CY7C1019CV33-15VC
150C
-65C
300
45
0
A128SAGLL
R-CML
050801
R2
CY7C1019CV33-15VC
150C
-65C
300
44
0
A128SAGLL
R-CML
050801
R3
CY7C1019CV33-15VC
150C
-65C
300
45
0
A144GGAGE
G-TAIWAN
MR052033
R1
CY7C057V-15AI
150C
-65C
300
50
0
A52AEGAGE
Q-KOREA
MR052004
R1
CY29972AI
150C
-65C
300
50
0
A52CXGAGE
SI-SIGNETI
MR051017
R1
CY29773AIT
150C
-65C
300
43
0
A64FXGAGE
G-TAIWAN
MR054058
R1
CY7C144AV-25AC
150C
-65C
300
45
0
472
0
Summary for 'PkgFamily' = TQFP (10 detail records)
Sum
TQFP (10x10)
AS64CGAGB
Q-KOREA
AS6513GAGB G-TAIWAN
MR053050
R1
CY7C4275V-15ASC
150C
-65C
300
50
0
MR052089
R1
CY7C4215V-15ASC
150C
-65C
300
50
0
100
0
Summary for 'PkgFamily' = TQFP (10x10) (2 detail records)
Sum
TQFP (Pb-Free)
2006 Q1 RELIABILITY REPORT
Page 58 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
AZ100RIALL
R-CML
053901
R1
CY7C1370D
150C
-65C
300
50
0
AZ100RIALL
R-CML
053901
R2
CY7C1370D
150C
-65C
300
49
0
AZ100RIALL
R-CML
053901
R3
CY7C1370D
150C
-65C
300
50
0
AZ100RRLL
RA-CML
051702
R1
CY7C1470V33
150C
-65C
300
49
0
AZ100RRLL
RA-CML
051702
R2
CY7C1470V33
150C
-65C
300
50
0
AZ100RRLL
RA-CML
051702
R3
CY7C1470V33
150C
-65C
300
50
0
AZ100SGAL
R-CML
053007
R2A
CY7C027V
150C
-65C
300
60
0
AZ100SGAL
R-CML
053007
150C
-65C
300
50
0
AZ100SGAL
R-CML
053007
R2A( CY7C027V
1)
R3A CY7C027V
150C
-65C
300
60
0
AZ100SGAL
R-CML
053007
150C
-65C
300
50
0
AZ144GGAL
G-TAIWAN
MR052074
R3A( CY7C027V
1)
R1
CY7C056V-12AXC
150C
-65C
300
49
0
AZ52ASGAL
Q-KOREA
051902
R1
CY7B9945V-5AXCT
150C
-65C
300
46
0
AZ52ASGAL
Q-KOREA
051902
R2
CY7B9945V-5AXCT
150C
-65C
300
50
0
AZ52ASGAL
Q-KOREA
051902
R3
CY7B9945V-5AXCT
150C
-65C
300
50
0
AZ52ASGAL
Q-KOREA
NR054002
R1
CY7B9945V-2AXI
150C
-65C
300
43
0
AZ52ASGAL
Q-KOREA
NR054002
R2
CY7B9945V-2AXI
150C
-65C
300
45
0
AZ52ASGAL
Q-KOREA
NR054002
R3
CY7B9973V-AXC
150C
-65C
300
45
0
846
0
Summary for 'PkgFamily' = TQFP (Pb-Free) (17 detail records)
Sum
TQFP (Thermal)
AT120AAAGE L-SEOL
MR052023
R1
CYS25G0101DX-ATC
150C
-65C
300
50
0
AT120AGAGE L-SEOL
MR051082
R1
CYS25G0101DX-ATC
150C
-65C
300
49
0
AT120AHAGE L-SEOL
041701
R1
CYS25G0101DX-ATC
150C
-65C
300
50
0
149
0
50
0
Summary for 'PkgFamily' = TQFP (Thermal) (3 detail records)
Sum
TQFP (Thermal, Pb-Free)
AG120AGAL
L-SEOL
041701
2006 Q1 RELIABILITY REPORT
R2
CYS25G0101DX-ATC
150C
-65C
300
Page 59 of 78
Results
Product Reliability
BldKit
Assy
AG120AGAL
L-SEOL
EvalNum
041701
TV
Device
Temp
R3
CYS25G0101DX-ATC
150C
Temp
-65C
Cycles
300
Summary for 'PkgFamily' = TQFP (Thermal, Pb-Free) (2 detail records)
Sum
SS
Reject FA
49
0
99
0
TSOP (Pb-Free)
ZT28R4AGL
R-CML
MR052011
R1
CY7C1399B-15ZXC
150C
-65C
300
50
0
ZT32RKGGL
T-TAIWAN
MR052044
R1
CY7C109B-15ZXC
150C
-65C
300
50
0
ZT32RYAGL
T-TAIWAN
MR051079
R1
CY2308SC-1
150C
-65C
300
50
0
150
0
Summary for 'PkgFamily' = TSOP (Pb-Free) (3 detail records)
Sum
TSOP (Reverse)
ZR28R2AGB
R-CML
MR044018
R1
CY62256LL-70ZRI
150C
-65C
300
45
0
ZR28R2AGN
R-CML
MR051013
R1
CY62256LL-70ZRI
150C
-65C
300
50
0
ZR28R2AGN
R-CML
MR053049
R1
CY62256LL-70ZRI
150C
-65C
300
45
0
140
0
50
0
50
0
Summary for 'PkgFamily' = TSOP (Reverse) (3 detail records)
Sum
TSOP (Reverse, Pb-Free)
ZY28R2AGN
R-CML
MR053057
R1
CY62256LL-70ZRXI
150C
-65C
300
Summary for 'PkgFamily' = TSOP (Reverse, Pb-Free) (1 detail record)
Sum
TSOP I
ZA32RHAALB R-CML
MR052020
R1
CY62128DV30LL-55ZAI
150C
-65C
300
49
0
ZA32RHAALB R-CML
MR053056
R1
CY62128DV30LL-55ZAI
150C
-65C
300
50
0
99
0
Summary for 'PkgFamily' = TSOP I (2 detail records)
Sum
TSOP II
ZS324FAGE
T-TAIWAN
MR052009
R1
CY7C1019CV33-12ZC
150C
-65C
300
50
0
ZS324FAGE
T-TAIWAN
MR053055
R1
CY7C1019CV33-12ZC
150C
-65C
300
50
0
ZS444ABALE
R-CML
MR053058
R1
CS6125AT
150C
-65C
300
50
0
ZS444AJALN
R-CML
MR054008
R1
CY7C1021CV33-15ZC
150C
-65C
300
50
0
ZS444AKALN
R-CML
MR052022
R1
CY7C1041CV33-15ZC
150C
-65C
300
50
0
2006 Q1 RELIABILITY REPORT
Page 60 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
ZS444YAGL
R-CML
053007
R5
CY7C1041B-15ZC
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR044031
R1
CY7C1069AV33-12ZC
150C
-65C
300
50
0
ZS544AALE
G-TAIWAN
MR052030
R1
CY7C1069AV33-12ZC
150C
-65C
300
50
0
400
0
Summary for 'PkgFamily' = TSOP II (8 detail records)
Sum
TSOP II (Pb-Free)
ZW324FAGL
T-TAIWAN
MR052021
R1
CY7C1019CV33-12ZXC
150C
-65C
300
50
0
ZW444ADALL R-CML
MR052003
R1
CY7C1041CV33-15ZXC
150C
-65C
300
50
0
ZW444AHGLL R-CML
045202
R1
CY62127EV
150C
-65C
300
49
0
ZW444NAGN
R-CML
MR051047
R1
CY62126DV30LL-55ZXI
150C
-65C
300
50
0
ZW444RAGN
R-CML
053102
R1
CY62137VLL-ZSXE
150C
-65C
300
50
0
ZW444RAGN
R-CML
053102
R2
CY62137VLL-ZSXE
150C
-65C
300
50
0
ZW444RAGN
R-CML
053102
R3
CY62137VLL-ZSXE
150C
-65C
300
50
0
349
0
Summary for 'PkgFamily' = TSOP II (Pb-Free) (7 detail records)
Sum
TSOP/ TSSOP
Z1611XAGB
M-PHIL
MR044012
R1
CY22392ZC-366
150C
-65C
300
50
0
Z1619GAGN
RA-CML
MR052027
R1
CY22392ZC-366
150C
-65C
300
48
0
Z1619GAGN
RA-CML
MR053059
R1
CY26049ZC-36
150C
-65C
300
47
0
Z32RYAALE
T-TAIWAN
MR043017
R1
CY62128DV30LL-55ZI
150C
-65C
300
49
0
Z32RYAALE
T-TAIWAN
MR043060
R1
CY62128DV30LL-70ZI
150C
-65C
300
50
0
Z5624BAGN
R-CML
MR051050
R1
CY28346ZI-2T
150C
-65C
300
50
0
Z5624BAGN
R-CML
MR052012
R1
CY28409ZC
150C
-65C
300
50
0
Z5624BAGN
R-CML
MR053046
r1
CY28409ZC
150C
-65C
300
50
0
394
0
50
0
Summary for 'PkgFamily' = TSOP/ TSSOP (8 detail records)
Sum
TSSOP (Pb-Free)
ZZ1613GAN
T-TAIWAN
MR052077
2006 Q1 RELIABILITY REPORT
R1
CY2309ZXI-1H
150C
-65C
300
Page 61 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
ZZ2411AGN
T-TAIWAN
MR051051
R1
CY22313ZXC
150C
-65C
300
48
0
ZZ2415GAL
RA-CML
MR052006
R1
CY22313ZXC
150C
-65C
300
49
0
ZZ2813AGN
T-TAIWAN
053006
R1
CYI5002ZXC
150C
-65C
300
50
0
ZZ2813AGN
T-TAIWAN
053006
R2
CYI5002ZXC
150C
-65C
300
50
0
ZZ2813AGN
T-TAIWAN
053006
R3
CYI5002ZXC
150C
-65C
300
49
0
ZZ2817AGL
RA-CML
051903
R1
CY221R28-ZXC
150C
-65C
300
50
0
ZZ2817AGL
RA-CML
051903
R2
CY221R28-ZXC
150C
-65C
300
50
0
ZZ2817AGL
RA-CSPI
041303
1
7C89000AC-RAZZC
150C/-65CN/A
300
50
0
ZZ5624BG
R-CML
052802
R1
CY28411ZXC
150C
-65C
300
46
0
ZZ5624BG
R-CML
052802
R2
CY28411ZXC
150C
-65C
300
47
0
ZZ5624BG
R-CML
052802
R3
CY28411ZXC
150C
-65C
300
45
0
ZZ5624BGN
R-CML
MR043046
R1
CY28442ZXC-2
150C
-65C
300
50
0
ZZ5624BGN
R-CML
MR051026
R1
CY28442ZXC
150C
-65C
300
50
0
ZZ5624BGN
R-CML
MR061008
R1
CY28441ZXC
150C
-65C
300
45
0
729
0
Summary for 'PkgFamily' = TSSOP (Pb-Free) (15 detail records)
Sum
VFBGA (0.75-0.8, Pb-Free)
BZ100AALE
G-TAIWAN
050202
R1
CY7C015V18-35AC
150C
-65C
300
50
0
BZ100AALE
G-TAIWAN
050202
R2
CYDM256A16-55BVXI
150C
-65C
300
50
0
BZ100AALE
G-TAIWAN
050202
R3
CYDM256A16-55BVXI
150C
-65C
300
50
0
BZ48BKALE
RA-CML
054906
R1
CYK128K16MCBLI-70BVXT
150C
-65C
300
47
0
BZ48BKALE
RA-CML
054906
R2
CYK128K16MCBLI-70BVXT
150C
-65C
300
50
0
BZ48BKALE
RA-CML
054906
R3
CYK128K16MCBLI-70BVXT
150C
-65C
300
50
0
BZ48BKALE
RA-CML
MR052088
R1
CYK128K16SCBU-55BVXI
150C
-65C
300
49
0
BZ48BTALN
RA-CML
054302
R1A
CY62147EV30*
150C
-65C
300
42
0
BZ48BTALN
R-CML
054302
R7
CY62147EV30*
150C
-65C
300
45
0
2006 Q1 RELIABILITY REPORT
Page 62 of 78
Results
Product Reliability
BldKit
Assy
EvalNum
TV
Device
Temp
Temp
Cycles
SS
Reject FA
BZ52BGAGL
G-TAIWAN
043004
1A
7C87740A
150C/-65CN/A
300
46
0
BZ52BGAGL
G-TAIWAN
043004
2C
7C87742A
150C/-65CN/A
300
47
0
BZ52BGAGL
G-TAIWAN
043004
3B
7C87741A
150C/-65CN/A
300
47
0
573
0
15240
29
Summary for 'PkgFamily' = VFBGA (0.75-0.8, Pb-Free) (12 detail records)
Sum
Grand Total
2006 Q1 RELIABILITY REPORT
Page 63 of 78
Results
Product Reliability
Summary Detail, Package -- HTS Performance Over Time
From: 4/3/2005
To: 3/30/2006
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
CERDIP (Windowed)
W129DF-TSC 042114
R1
T-TAIWAN
CY2291F
150C 1000
50
0
W129DF-TSC 042114
R1
T-TAIWAN
CY2291F
150C 500
50
0
100
0
Summary for 'PkgFamily' = CERDIP (Windowed) (2 detail records)
Sum
Chip On Board (Pb-Free)
DE001AAGL 052403
1A
EC-CHINA
7M6341AT-ECDEC
65C
120
45
0
DE001AAGL 052403
1A
EC-CHINA
7M6341AT-ECDEC
65C
240
45
0
DE001AAGL 052403
1B
EC-CHINA
7M6341AT-ECDEC
65C
120
45
0
DE001AAGL 052403
1B
EC-CHINA
7M6341AT-ECDEC
65C
240
45
0
DE001AAGL 052405
1A
SV-CHINA
7M6341AT-SVDEC
65C
120
45
0
DE001AAGL 052405
1A
SV-CHINA
7M6341AT-SVDEC
65C
240
45
0
DE001AAGL 052405
1B
SV-CHINA
7M6341AT-SVDEC
65C
120
45
0
DE001AAGL 052405
1B
SV-CHINA
7M6341AT-SVDEC
65C
240
45
0
360
0
Summary for 'PkgFamily' = Chip On Board (Pb-Free) (8 detail records)
Sum
FBGA (0.75-0.8)
BA48DJALE
045101
R1
G-TAIWAN
7C62172DC-GBAI
150C 1000
45
0
BA48DJALE
045101
R1
G-TAIWAN
7C62172DC-GBAI
150C 500
45
0
BA48AVALE MR043061
R1
RA-CML
CY62147CV30LL-70BAI
150C 1000
49
0
BA48AVALE MR043061
R1
RA-CML
CY62147CV30LL-70BAI
150C 500
50
0
189
0
Summary for 'PkgFamily' = FBGA (0.75-0.8) (4 detail records)
Sum
FBGA (0.75-0.8, Pb-Free)
BK48CDALL MR053012
R1
G-TAIWAN
CY7C1041CV33-10BAXC 150C 1000
50
0
BK48CDALL MR053012
R1
G-TAIWAN
CY7C1041CV33-10BAXC 150C 500
50
0
100
0
Summary for 'PkgFamily' = FBGA (0.75-0.8, Pb-Free) (2 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 64 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
Results
FBGA (1.0)
BB172AAGE MR051007
R1
G-TAIWAN
CY7C057V-15BBI
150C 1000
50
0
BB172AAGE MR051007
R1
G-TAIWAN
CY7C057V-15BBI
150C 500
50
0
BB100EAGE MR052032
R1
G-TAIWAN
CYP15G0101DXB-BBI
150C 1000
47
0
BB100EAGE MR052032
R1
G-TAIWAN
CYP15G0101DXB-BBI
150C 500
47
0
194
0
Summary for 'PkgFamily' = FBGA (1.0) (4 detail records)
Sum
FLIPCHIP (Build-Up Substrate w/ HS)
FG388AGAGE
0447011A
GQ-KOREA
7C71050AJ-GQFGC150C
1000
45
0
FG388AGAGE
0447011A
GQ-KOREA
7C71050AJ-GQFGC150C
500
45
0
Summary for 'PkgFamily' = FLIPCHIP (Build-Up Substrate w/ HS) (2 detail records)
Sum
90
0
FVBGA (0.75-0.8, 0.3mm)
BV52BGAGE 043004
3A
G-TAIWAN
7C87742A
150C 1000
46
0
BV52BGAGE 043004
3A
G-TAIWAN
7C87742A
150C 500
46
0
BV52BGAGE 043004
3C
G-TAIWAN
7C87741A
150C 1000
45
0
BV52BGAGE 043004
3C
G-TAIWAN
7C87741A
150C 500
45
0
BV52BGAGE 043004
6
G-TAIWAN
7C87741A
150C 1000
46
0
BV52BGAGE 043004
6
G-TAIWAN
7C87741A
150C 500
46
0
BV52BGAGE 043004
6A
G-TAIWAN
7C87742A
150C 1000
46
0
BV52BGAGE 043004
6A
G-TAIWAN
7C87742A
150C 500
46
0
BV52BGAGE 043004
8
G-TAIWAN
7C87742A
150C 1000
46
0
BV52BGAGE 043004
8
G-TAIWAN
7C87742A
150C 500
46
0
BV48HAALE MR051014
R1
G-TAIWAN
CY62147CV33LL-70BVI
150C 1000
50
0
BV48HAALE MR051014
R1
G-TAIWAN
CY62147CV33LL-70BVI
150C 500
50
0
558
0
Summary for 'PkgFamily' = FVBGA (0.75-0.8, 0.3mm) (12 detail records)
Sum
LCC
L04AA
052701
1
7C825701A
125C 1000
50
0
L04AA
052701
1
7C825701A
125C 500
50
0
Summary for 'PkgFamily' = LCC (2 detail records)
2006 Q1 RELIABILITY REPORT
Page 65 of 78
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
Sum
SS Rejects FA
100
0
LCC (Windowed Plastic)
QY48AAALL 052003
1
IP-TAIWAN
7ISC305BF-IPQYC
150C 1000
50
0
QY48AAALL 052003
1
IP-TAIWAN
7ISC305BF-IPQYC
150C 500
50
0
100
0
Summary for 'PkgFamily' = LCC (Windowed Plastic) (2 detail records)
Sum
PBGA (1.27)
BG282BAGE MR052005
R1
G-TAIWAN
CY37512P256-83BGC
150C 1000
50
0
BG282BAGE MR052005
R1
G-TAIWAN
CY37512P256-83BGC
150C 500
50
0
BG272AAGE MR052034
R1
G-TAIWAN
CY7C0430BV-100BGI
150C 1000
50
0
BG272AAGE MR052034
R1
G-TAIWAN
CY7C0430BV-100BGI
150C 500
50
0
BG119NALE MR053018
R1
G-TAIWAN
CY7C1354B-166GBC
150C 1000
50
0
BG119NALE MR053018
R1
G-TAIWAN
CY7C1354B-166GBC
150C 500
50
0
300
0
Summary for 'PkgFamily' = PBGA (1.27) (6 detail records)
Sum
PBGA (Cavity/Heatsink)
BL304ABGE MR044043
R1
G-TAIWAN
CYNSE70129A-125BGC 150C 1000
45
0
BL304ABGE MR044043
R1
G-TAIWAN
CYNSE70129A-125BGC 150C 500
45
0
BL256L2GE
MR051006
R1
G-TAIWAN
CYP15G0401DXB-BGI
150C 1000
50
0
BL256L2GE
MR051006
R1
G-TAIWAN
CYP15G0401DXB-BGI
150C 500
50
0
BL256L2GE
MR054018
R1
G-TAIWAN
CYP15G0401DXB-BGC
150C 1000
50
0
BL256L2GE
MR054018
R1
G-TAIWAN
CYP15G0401DXB-BGC
150C 500
50
0
290
0
Summary for 'PkgFamily' = PBGA (Cavity/Heatsink) (6 detail records)
Sum
PBGA (Cavity/Heatsink, Pb-Free)
BJ256L2GL
044507
R1
G-TAIWN
CY28323BPVC
150C 1000
50
0
BJ256L2GL
044507
R1
G-TAIWN
CY28323BPVC
150C 500
50
0
100
0
45
0
Summary for 'PkgFamily' = PBGA (Cavity/Heatsink, Pb-Free) (2 detail records)
Sum
PDIP
P406AGAGB 052406
R1
2006 Q1 RELIABILITY REPORT
O-INDNS
CY7C634121C-PC
150C 1000
Page 66 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
P406AGAGB 052406
R1
O-INDNS
CY7C634121C-PC
150C 500
45
0
P406AGAGB 052406
R2
O-INDNS
CP5748AM
150C 1000
45
0
P406AGAGB 052406
R2
O-INDNS
CP5748AM
150C 500
45
0
P286EGAGB 052406
R3
O-INDNS
CY62256LL-70PC
150C 1000
50
0
P286EGAGB 052406
R3
O-INDNS
CY62256LL-70PC
150C 500
50
0
P2869AAGE 052406
R5
O-INDNS
CY62256LL-70PC
150C 1000
45
0
P2869AAGE 052406
R5
O-INDNS
CY62256LL-70PC
150C 500
45
0
P286EGAGB 052406
R6
O-INDNS
CY62256L-70PC
150C 1000
45
0
P286EGAGB 052406
R6
O-INDNS
CY62256L-70PC
150C 500
45
0
P243FGAGE MR052025
R1
M-PHIL
CY7C194-25PC
150C 1000
45
0
P243FGAGE MR052025
R1
M-PHIL
CY7C194-25PC
150C 500
45
0
P2839GAGB MR052061
R1
X-THAI
CY7C466A-10PTC
150C 1000
50
0
P2839GAGB MR052061
R1
X-THAI
CY7C466A-10PTC
150C 500
50
0
P203CGAGB MR053013
R1
O-INDNS
CY7C168A-35PC
150C 1000
45
0
P203CGAGB MR053013
R1
O-INDNS
CY7C168A-35PC
150C 500
45
0
P286EGAGB MR054044
R1
O-INDNS
CY62256LL-70PC
150C 1000
50
0
P286EGAGB MR054044
R1
O-INDNS
CY62256LL-70PC
150C 500
50
0
840
0
Summary for 'PkgFamily' = PDIP (18 detail records)
Sum
PDIP (Pb-Free)
PZ243AAGN 051206
R1
X-THAI
CY7C63743-PXC
150C 1000
50
0
PZ243AAGN 051206
R1
X-THAI
CY7C63743-PXC
150C 500
50
0
PZ183AAGN MR051004
R1
O-INDNS
CY7C63231A-PXC
150C 1000
45
0
PZ183AAGN MR051004
R1
O-INDNS
CY7C63231A-PXC
150C 500
45
0
PZ183AAGN MR052015
R1
O-INDNS
CY7C63231A-PXC
150C 1000
45
0
PZ183AAGN MR052015
R1
O-INDNS
CY7C63231A-PXC
150C 500
45
0
PZ2831GAN MR053014
R1
O-INDNS
CY7C64013A-PXC
150C 1000
45
0
PZ2831GAN MR053014
R1
O-INDNS
CY7C64013A-PXC
150C 500
45
0
370
0
Summary for 'PkgFamily' = PDIP (Pb-Free) (8 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 67 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
PLCC
J32RBGAGB MR052018
R1
X-THAI
CY7B991-5JC
150C 1000
50
0
J32RBGAGB MR052018
R1
X-THAI
CY7B991-5JC
150C 500
50
0
J32RNGAGE MR053031
R1
M-PHIL
CY7C4271V-25JC
150C 1000
50
0
J32RNGAGE MR053031
R1
M-PHIL
CY7C4271V-25JC
150C 500
50
0
J28SEGAGB MR054019
R1
M-PHIL
CY7B923-JC
150C 1000
50
0
J28SEGAGB MR054019
R1
M-PHIL
CY7B923-JC
150C 500
50
0
J32RBGAGB MR054059
R1
X-THAI
CY7B9911-5JC
150C 1000
50
0
J32RBGAGB MR054059
R1
X-THAI
CY7B9911-5JC
150C 500
50
0
J68SCGAGB MR054061
R1
X-THAI
CY7C144-55JCT
150C 1000
50
0
J68SCGAGB MR054061
R1
X-THAI
CY7C144-55JCT
150C 500
50
0
500
0
Summary for 'PkgFamily' = PLCC (10 detail records)
Sum
PLCC (Pb-Free)
JZ32RBGAN MR051056
R1
M-PHIL
CY7C421-20JXC
150C 1000
47
0
JZ32RBGAN MR051056
R1
M-PHIL
CY7C421-20JXC
150C 500
47
0
JZ32RBGAN MR053028
R1
M-PHIL
CY7C419-15JXC
150C 1000
50
0
JZ32RBGAN MR053028
R1
M-PHIL
CY7C419-15JXC
150C 500
50
0
194
0
Summary for 'PkgFamily' = PLCC (Pb-Free) (4 detail records)
Sum
PQFP
N52DXGAGB MR054060
R1
G-TAIWAN
CY7C131-55NC
150C 1000
50
0
N52DXGAGB MR054060
R1
G-TAIWAN
CY7C131-55NC
150C 500
50
0
100
0
Summary for 'PkgFamily' = PQFP (2 detail records)
Sum
QFN (Punch Type)
LF48AGAGE 050404
1A
L-SEOL
7B6934AC-LLFC
125C 240
45
0
LF48AGAGE 050404
1A
L-SEOL
7B6934AC-LLFC
125C 96
45
0
LF48AGAGE 050404
1B
L-SEOL
7B6934AC-LLFC
125C 240
45
0
LF48AGAGE 050404
1B
L-SEOL
7B6934AC-LLFC
125C 96
45
0
LF56AGAGE MR044081
R1
L-SEOL
CY7C65640A-LFC
150C 1000
50
0
2006 Q1 RELIABILITY REPORT
Page 68 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
LF56AGAGE MR044081
R1
L-SEOL
CY7C65640A-LFC
150C 500
50
0
LF56AGAGE MR051075
R1
L-SEOL
CY7C65640A-LFC
150C 1000
50
0
LF56AGAGE MR051075
R1
L-SEOL
CY7C65640A-LFC
150C 500
50
0
LF56AGAGE MR052016
R1
L-SEOL
CY7C65640A-LFC
150C 1000
49
0
LF56AGAGE MR052016
R1
L-SEOL
CY7C65640A-LFC
150C 500
50
0
479
0
Summary for 'PkgFamily' = QFN (Punch Type) (10 detail records)
Sum
QFN (Punch Type, Pb-Free)
LY48D1GAL 044508
1A
L-SEOL
7B6953AC-LLYC
150C 1000
50
0
LY48D1GAL 044508
1A
L-SEOL
7B6953AC-LLYC
150C 500
50
0
LY56FGALL
050303
R1
RA-CML
CY7C65640-LFXC
150C 1000
50
0
LY56FGALL
050303
R1
RA-CML
CY7C65640-LFXC
150C 500
50
0
LY72AGAGL 054206
R2
L-SEOL
CY28447LF-XC
150C 1000
50
0
LY72AGAGL 054206
R2
L-SEOL
CY28447LF-XC
150C 500
50
0
LY56AGAGL MR044065
R1
L-SEOL
CY7C68300A-56LFXC
150C 1000
50
0
LY56AGAGL MR044065
R1
L-SEOL
CY7C68300A-56LFXC
150C 500
50
0
LY56DGAGL MR051046
R1
L-SEOL
CP6241AM
150C 1000
50
0
LY56DGAGL MR051046
R1
L-SEOL
CP6241AM
150C 500
50
0
500
0
Summary for 'PkgFamily' = QFN (Punch Type, Pb-Free) (10 detail records)
Sum
QSOP (Pb-Free)
SQ2414AGN MR044042
R1
R-CML
CY7C63101A-QXC
150C 1000
49
0
SQ2414AGN MR044042
R1
R-CML
CY7C63101A-QXC
150C 500
50
0
99
0
Summary for 'PkgFamily' = QSOP (Pb-Free) (2 detail records)
Sum
SOIC (GullWing)
S0815EAGB MR043080
R1
SL-INDIA
CY27022SC
150C 1000
50
0
S0815EAGB MR043080
R1
SL-INDIA
CY27022SC
150C 500
50
0
S24314AGL
MR044028
R1
RA-CML
CP6124AM
150C 1000
50
0
S24314AGL
MR044028
R1
RA-CML
CP6124AM
150C 500
50
0
S2837GAGB MR044029
R1
X-THAI
CY7C64013-SC
150C 1000
50
0
2006 Q1 RELIABILITY REPORT
Page 69 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
S2837GAGB MR044029
R1
X-THAI
CY7C64013-SC
150C 500
50
0
S283HGAGB MR051003
R1
O-INDNS
CY2314ANZSC-1
150C 1000
45
0
S283HGAGB MR051003
R1
O-INDNS
CY2314ANZSC-1
150C 500
45
0
S324513GB
MR051078
R1
R-CML
CY62128BLL-70SI
150C 1000
47
0
S324513GB
MR051078
R1
R-CML
CY62128BLL-70SI
150C 500
48
0
S283HGAGB MR052073
R1
O-INDNS
CY7B933-SC
150C 1000
50
0
S283HGAGB MR052073
R1
O-INDNS
CY7B933-SC
150C 500
50
0
S1615EAGB MR053002
R1
M-PHIL
CY2309SC-1H
150C 1000
50
0
S1615EAGB MR053002
R1
M-PHIL
CY2309SC-1H
150C 500
50
0
S324513GN
MR053003
R1
R-CML
CY6525AM
150C 1000
50
0
S324513GN
MR053003
R1
R-CML
CY6525AM
150C 500
50
0
S1615AAGB MR054041
R1
O-INDNS
CY2308SC-1H
150C 1000
46
0
S1615AAGB MR054041
R1
O-INDNS
CY2308SC-1H
150C 500
50
0
881
0
Summary for 'PkgFamily' = SOIC (GullWing) (18 detail records)
Sum
SOIC (GullWing, 450 footprint)
SN2831AHB MR044008
R1
R-CML
CY62256LL-70SNC
150C 1000
45
0
SN2831AHB MR044008
R1
R-CML
CY62256LL-70SNC
150C 500
45
0
SN2831AHN MR052013
R1
R-CML
CY62256L-70SNC
150C 1000
49
0
SN2831AHN MR052013
R1
R-CML
CY62256L-70SNC
150C 500
49
0
SN2831AHN MR053037
R1
R-CML
CY22313
150C 1000
50
0
SN2831AHN MR053037
R1
R-CML
CY22313
150C 500
50
0
288
0
Summary for 'PkgFamily' = SOIC (GullWing, 450 footprint) (6 detail records)
Sum
SOIC (GullWing, 450 footprint, Pb-Free)
SY2831AHN 053407
R1
R-CML
CY62256LL
150C 1000
50
0
SY2831AHN MR052010
R1
R-CML
CY62256L-70SNXC
150C 1000
50
0
SY2831AHN MR052010
R1
R-CML
CY62256L-70SNXC
150C 500
50
0
150
0
Summary for 'PkgFamily' = SOIC (GullWing, 450 footprint, Pb-Free) (3 detail records)
Sum
2006 Q1 RELIABILITY REPORT
Page 70 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
SOIC (GullWing, Pb-Free)
SZ28327GL
054604
R1
R-CML
CY7C64013C-SXC
150C 1000
50
0
SZ28327GL
054604
R1
R-CML
CY7C64013C-SXC
150C 500
50
0
SZ18
060304
R4
OP-PHIL
CY7C65113
150C 1000
50
0
SZ18
060304
R4
OP-PHIL
CY7C65113
150C 500
50
0
SZ183BGAL MR044082
R1
RA-CML
CY7C63231A-SXC
150C 1000
50
0
SZ183BGAL MR044082
R1
RA-CML
CY7C63231A-SXC
150C 500
50
0
SZ1615EGN MR051029
R1
M-PHIL
CY2308SXC-1H
150C 1000
49
0
SZ1615EGN MR051029
R1
M-PHIL
CY2308SXC-1H
150C 500
49
0
SZ1615EGN MR052046
R1
M-PHIL
CY2309SXC-1H
150C 1000
50
0
SZ1615EGN MR052046
R1
M-PHIL
CY2309SXC-1H
150C 500
50
0
SZ24315GN
MR053032
R1
RA-CML
CY7C63743-SXC
150C 1000
50
0
SZ24315GN
MR053032
R1
RA-CML
CY7C63743-SXC
150C 500
50
0
598
0
Summary for 'PkgFamily' = SOIC (GullWing, Pb-Free) (12 detail records)
Sum
SOIC (J lead)
V28CGAGB
MR044064
R1
O-INDNS
CY7C106B-20VC
150C 1000
50
0
V28CGAGB
MR044064
R1
O-INDNS
CY7C106B-20VC
150C 500
50
0
V324EGAGB MR051002
R1
O-INDNS
CY7C1019B-12VC
150C 1000
45
0
V324EGAGB MR051002
R1
O-INDNS
CY7C1019B-12VC
150C 500
45
0
V444YAALE
MR051015
R1
R-CML
CY7C1041CV33-12VC
150C 1000
47
0
V444YAALE
MR051015
R1
R-CML
CY7C1041CV33-12VC
150C 500
49
0
V444WGALL MR052019
R1
R-CML
CY7C1021B-12VI
150C 1000
50
0
V444WGALL MR052019
R1
R-CML
CY7C1021B-12VI
150C 500
50
0
V444ZGALL
MR053004
R1
R-CML
CY7C1021CV33
150C 1000
50
0
V444ZGALL
MR053004
R1
R-CML
CY7C1021CV33
150C 500
50
0
V324FGAGB MR053015
R1
O-INDNS
CY7C109B-20VC
150C 1000
45
0
V324FGAGB MR053015
R1
O-INDNS
CY7C109B-20VC
150C 500
45
0
V444ZGALL
MR054001
R1
R-CML
CY7C1021CV33-15VC
150C 1000
44
0
V444ZGALL
MR054001
R1
R-CML
CY7C1021CV33-15VC
150C 500
48
0
2006 Q1 RELIABILITY REPORT
Page 71 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
V2439GAGB MR054004
R1
O-INDNS
CY7C128A-15VC
150C 1000
50
0
V2439GAGB MR054004
R1
O-INDNS
CY7C128A-15VC
150C 500
50
0
768
0
Summary for 'PkgFamily' = SOIC (J lead) (16 detail records)
Sum
SOIC (J lead, Pb-Free)
VZ243GGBLL 052801
R1
O-INDNS
CY7C197
150C 1000
50
0
VZ243GGBLL 052801
R1
O-INDNS
CY7C197
150C 500
50
0
VZ32418
054502
R4
R-CML
CY7C109
150C 1000
45
0
VZ32418
054502
R4
R-CML
CY7C109
150C 500
45
0
VZ444WAGL MR052001
R1
R-CML
CY7C1021B-15VXC
150C 1000
50
0
VZ444WAGL MR052001
R1
R-CML
CY7C1021B-15VXC
150C 500
50
0
VZ444ZALL
MR053005
R1
R-CML
CY7C1021CV33-8VXC
150C 1000
50
0
VZ444ZALL
MR053005
R1
R-CML
CY7C1021CV33-8VXC
150C 500
50
0
VZ3644GALL MR053038
R1
R-CML
CY7C1049B-20VXI
150C 1000
48
0
VZ3644GALL MR053038
R1
R-CML
CY7C1049B-20VXI
150C 500
50
0
488
0
Summary for 'PkgFamily' = SOIC (J lead, Pb-Free) (10 detail records)
Sum
SSOP
O2026XAGB 053205
R1
T-TAIWAN
IMISM530AYB
150C 1000
45
0
O2026XAGB 053205
R1
T-TAIWAN
IMISM530AYB
150C 500
45
0
O2824GAGB 053205
R2
T-TAIWAN
CY28506OC
150C 1000
45
0
O2824GAGB 053205
R2
T-TAIWAN
CY28506OC
150C 500
45
0
O4816XAGB 053205
R3
T-TAIWAN
CY28342OC
150C 1000
45
0
O4816XAGB 053205
R3
T-TAIWAN
CY28342OC
150C 500
45
0
O2026XAGB 053205
R4
T-TAIWAN
IMISM530AYB
150C 1000
45
0
O2026XAGB 053205
R4
T-TAIWAN
IMISM530AYB
150C 500
45
0
O2028GAGE 053205
R5
T-TAIWAN
CY2CC810OI
150C 1000
50
0
O2028GAGE 053205
R5
T-TAIWAN
CY2CC810OI
150C 500
50
0
O2824GAGB 053205
R6
T-TAIWAN
CY28508OC
150C 1000
50
0
O2824GAGB 053205
R6
T-TAIWAN
CY28508OC
150C 500
50
0
O2028GAGE MR044066
R1
T-TAIWAN
CY2CC810OI
150C 1000
50
2006 Q1 RELIABILITY REPORT
0
Page 72 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
O2028GAGE MR044066
R1
T-TAIWAN
CY2CC810OI
150C 500
50
0
O2024GAGE MR044067
R1
M-PHIL
CY2DP314OI
150C 1000
50
0
O2024GAGE MR044067
R1
M-PHIL
CY2DP314OI
150C 500
50
0
O563BXAGE MR051021
R1
R-CML
CP6221BM
150C 1000
50
0
O563BXAGE MR051021
R1
R-CML
CP6221BM
150C 500
50
0
O563AXAGN MR052017
R1
R-CML
CY28419OC
150C 1000
50
0
O563AXAGN MR052017
R1
R-CML
CY28419OC
150C 500
50
0
O2024GAGE MR053001
R1
M-PHIL
CY2DP3140I
150C 1000
50
0
O2024GAGE MR053001
R1
M-PHIL
CY2DP3140I
150C 500
50
0
O563AXAGB MR053029
R1
R-CML
CY28346OC
150C 1000
50
0
O563AXAGB MR053029
R1
R-CML
CY28346OC
150C 500
50
0
O5615GAGB MR054039
R1
T-TAIWAN
CY283410C-2
150C 1000
50
0
O5615GAGB MR054039
R1
T-TAIWAN
CY283410C-2
150C 500
50
0
O483AXAGN NR042002
R1
R-CML
7C884053AC-ROC
150C 1000
50
0
O483AXAGN NR042002
R1
R-CML
7C884053AC-ROC
150C 500
50
0
O483AXAGN NR042002
R2
R-CML
7C828000AT-ROC
150C 1000
50
0
O483AXAGN NR042002
R2
R-CML
7C828000AT-ROC
150C 500
50
0
1460
0
Summary for 'PkgFamily' = SSOP (30 detail records)
Sum
SSOP (Pb-Free)
SP2824GAN MR044076
R1
T-TAIWAN
CY28353OXC-2
150C 1000
50
0
SP2824GAN MR044076
R1
T-TAIWAN
CY28353OXC-2
150C 500
50
0
100
0
Summary for 'PkgFamily' = SSOP (Pb-Free) (2 detail records)
Sum
TQFP
A100RKGAB MR043042
R1
R-CML
CY7C68013-100AC
150C 1000
50
0
A100RKGAB MR043042
R1
R-CML
CY7C68013-100AC
150C 500
50
0
A52CXGAGE MR051017
R1
SI-SIGNETI
CY29773AIT
150C 1000
45
0
A52CXGAGE MR051017
R1
SI-SIGNETI
CY29773AIT
150C 500
50
0
A100SFAGE MR052002
R1
R-CML
CY7C0241-25AC
150C 1000
50
0
A100SFAGE MR052002
R1
R-CML
CY7C0241-25AC
150C 500
50
2006 Q1 RELIABILITY REPORT
0
Page 73 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
A52AEGAGE MR052004
R1
Q-KOREA
CY29972AI
150C 1000
50
0
A52AEGAGE MR052004
R1
Q-KOREA
CY29972AI
150C 500
50
0
A144GGAGE MR052033
R1
G-TAIWAN
CY7C057V-15AI
150C 1000
50
0
A144GGAGE MR052033
R1
G-TAIWAN
CY7C057V-15AI
150C 500
50
0
A100SEGAGL MR053027
R1
R-CML
CY7C9689A-AC
150C 1000
49
0
A100SEGAGL MR053027
R1
R-CML
CY7C9689A-AC
150C 500
50
0
A64FXGAGE MR054058
R1
G-TAIWAN
CY7C144AV-25AC
150C 1000
45
0
A64FXGAGE MR054058
R1
G-TAIWAN
CY7C144AV-25AC
150C 500
45
0
684
0
Summary for 'PkgFamily' = TQFP (14 detail records)
Sum
TQFP (10x10)
AS64CGAGB MR053050
R1
Q-KOREA
CY7C4275V-15ASC
150C 1000
50
0
AS64CGAGB MR053050
R1
Q-KOREA
CY7C4275V-15ASC
150C 500
50
0
100
0
Summary for 'PkgFamily' = TQFP (10x10) (2 detail records)
Sum
TQFP (Pb-Free)
AZ100RSLL
052607
R1
R-CML
CY7C1339G
150C 1000
50
0
AZ100SEGL 052805
R1
R-CML
CY7C67300-100AXI
150C 1000
50
0
AZ144GGAL MR052074
R1
G-TAIWAN
CY7C056V-12AXC
150C 1000
47
0
AZ144GGAL MR052074
R1
G-TAIWAN
CY7C056V-12AXC
150C 500
47
0
194
0
Summary for 'PkgFamily' = TQFP (Pb-Free) (4 detail records)
Sum
TQFP (Thermal)
AT120AGAGEMR051082
R1
L-SEOL
CYS25G0101DX-ATC
165C 1000
50
0
AT120AGAGEMR051082
R1
L-SEOL
CYS25G0101DX-ATC
165C 500
50
0
AT120AAAGE MR052023
R1
L-SEOL
CYS25G0101DX-ATC
150C 1000
50
0
AT120AAAGE MR052023
R1
L-SEOL
CYS25G0101DX-ATC
150C 500
50
0
200
0
49
0
Summary for 'PkgFamily' = TQFP (Thermal) (4 detail records)
Sum
TSOP (Pb-Free)
ZT32RYAGL MR051079
R1
2006 Q1 RELIABILITY REPORT
T-TAIWAN
CY2308SC-1
150C 1000
Page 74 of 78
Results
Product Reliability
BldKit
ZT32RYAGL
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
MR051079
R1
T-TAIWAN
CY2308SC-1
150C 500
50
0
ZT28R4AGL MR052011
R1
R-CML
CY7C1399B-15ZXC
150C 1000
50
0
ZT28R4AGL MR052011
R1
R-CML
CY7C1399B-15ZXC
150C 500
50
0
ZT32RKGGL MR052044
R1
T-TAIWAN
CY7C109B-15ZXC
150C 1000
50
0
ZT32RKGGL MR052044
R1
T-TAIWAN
CY7C109B-15ZXC
150C 500
50
0
299
0
Summary for 'PkgFamily' = TSOP (Pb-Free) (6 detail records)
Sum
TSOP (Reverse)
ZR28R2AGB MR044018
R1
R-CML
CY62256LL-70ZRI
150C 1000
43
0
ZR28R2AGB MR044018
R1
R-CML
CY62256LL-70ZRI
150C 500
43
0
ZR28R2AGN MR051013
R1
R-CML
CY62256LL-70ZRI
150C 1000
50
0
ZR28R2AGN MR051013
R1
R-CML
CY62256LL-70ZRI
150C 500
50
0
ZR28R2AGN MR053049
R1
R-CML
CY62256LL-70ZRI
150C 1000
45
0
ZR28R2AGN MR053049
R1
R-CML
CY62256LL-70ZRI
150C 500
45
0
276
0
Summary for 'PkgFamily' = TSOP (Reverse) (6 detail records)
Sum
TSOP (Reverse, Pb-Free)
ZY28R2AGN MR053057
R1
R-CML
CY62256LL-70ZRXI
150C 1000
50
0
ZY28R2AGN MR053057
R1
R-CML
CY62256LL-70ZRXI
150C 500
50
0
100
0
Summary for 'PkgFamily' = TSOP (Reverse, Pb-Free) (2 detail records)
Sum
TSOP I
ZA32RHAALB MR052020
R1
R-CML
CY62128DV30LL-55ZAI
150C 1000
50
0
ZA32RHAALB MR052020
R1
R-CML
CY62128DV30LL-55ZAI
150C 500
50
0
ZA32RHAALB MR053056
R1
R-CML
CY62128DV30LL-55ZAI
150C 1000
50
0
ZA32RHAALB MR053056
R1
R-CML
CY62128DV30LL-55ZAI
150C 500
50
0
200
0
50
0
Summary for 'PkgFamily' = TSOP I (4 detail records)
Sum
TSOP II
ZS544AALE
MR044031
R1
2006 Q1 RELIABILITY REPORT
G-TAIWAN
CY7C1069AV33-12ZC
150C 1000
Page 75 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
ZS544AALE
MR044031
R1
ZS324FAGE MR051037
G-TAIWAN
CY7C1069AV33-12ZC
150C 500
50
0
R1
T-TAIWAN
CY7C1019CV33-12ZC
165C 1000
50
0
ZS324FAGE MR051037
R1
T-TAIWAN
CY7C1019CV33-12ZC
165C 500
50
0
ZS324FAGE MR052009
R1
T-TAIWAN
CY7C1019CV33-12ZC
150C 1000
50
0
ZS324FAGE MR052009
R1
T-TAIWAN
CY7C1019CV33-12ZC
150C 500
50
0
ZS444AKALN MR052022
R1
R-CML
CY7C1041CV33-15ZC
150C 1000
50
0
ZS444AKALN MR052022
R1
R-CML
CY7C1041CV33-15ZC
150C 500
50
0
ZS544AALE
MR052030
R1
G-TAIWAN
CY7C1069AV33-12ZC
150C 1000
45
0
ZS544AALE
MR052030
R1
G-TAIWAN
CY7C1069AV33-12ZC
150C 500
45
0
ZS324FAGE MR053055
R1
T-TAIWAN
CY7C1019CV33-12ZC
150C 1000
50
0
ZS324FAGE MR053055
R1
T-TAIWAN
CY7C1019CV33-12ZC
150C 500
50
0
ZS444ABALE MR053058
R1
R-CML
CS6125AT
150C 1000
50
0
ZS444ABALE MR053058
R1
R-CML
CS6125AT
150C 500
50
0
ZS444AJALN MR054008
R1
R-CML
CY7C1021CV33-15ZC
150C 1000
49
0
ZS444AJALN MR054008
R1
R-CML
CY7C1021CV33-15ZC
150C 500
49
0
788
0
Summary for 'PkgFamily' = TSOP II (16 detail records)
Sum
SS Rejects FA
TSOP II (Pb-Free)
ZW444RAGN 053102
R1
R-CML
CY62137VLL-ZSXE
150C 1000
50
0
ZW444NAGN MR051047
R1
R-CML
CY62126DV30LL-55ZXI
150C 1000
50
0
ZW444NAGN MR051047
R1
R-CML
CY62126DV30LL-55ZXI
150C 500
50
0
ZW444ADALL MR052003
R1
R-CML
CY7C1041CV33-15ZXC
150C 1000
50
0
ZW444ADALL MR052003
R1
R-CML
CY7C1041CV33-15ZXC
150C 500
50
0
ZW324FAGL MR052021
R1
T-TAIWAN
CY7C1019CV33-12ZXC
150C 1000
50
0
ZW324FAGL MR052021
R1
T-TAIWAN
CY7C1019CV33-12ZXC
150C 500
50
0
350
0
Summary for 'PkgFamily' = TSOP II (Pb-Free) (7 detail records)
Sum
TSOP/ TSSOP
Z1611XAGB MR044012
R1
M-PHIL
CY22392ZC-366
150C 1000
48
0
Z1611XAGB MR044012
R1
M-PHIL
CY22392ZC-366
150C 500
49
0
2006 Q1 RELIABILITY REPORT
Page 76 of 78
Results
Product Reliability
BldKit
EvalNum
TV AssyLoc
Device
Temp Readout
SS Rejects FA
Z5624BAGN MR051050
R1
R-CML
CY28346ZI-2T
150C 1000
50
0
Z5624BAGN MR051050
R1
R-CML
CY28346ZI-2T
150C 500
50
0
Z5624BAGN MR052012
R1
R-CML
CY28409ZC
150C 1000
50
0
Z5624BAGN MR052012
R1
R-CML
CY28409ZC
150C 500
50
0
Z5624BAGN MR053046
r1
R-CML
CY28409ZC
150C 1000
50
0
Z5624BAGN MR053046
r1
R-CML
CY28409ZC
150C 500
50
0
397
0
Summary for 'PkgFamily' = TSOP/ TSSOP (8 detail records)
Sum
TSSOP (Pb-Free)
ZZ5624BGN MR043046
R1
R-CML
CY28442ZXC-2
150C 500
50
0
ZZ5624BGN MR051026
R1
R-CML
CY28442ZXC
150C 1000
50
0
ZZ5624BGN MR051026
R1
R-CML
CY28442ZXC
150C 500
50
0
ZZ2411AGN MR051051
R1
T-TAIWAN
CY22313ZXC
150C 1000
50
0
ZZ2411AGN MR051051
R1
T-TAIWAN
CY22313ZXC
150C 500
50
0
ZZ2415GAL
MR052006
R1
RA-CML
CY22313ZXC
150C 1000
50
0
ZZ2415GAL
MR052006
R1
RA-CML
CY22313ZXC
150C 500
50
0
ZZ1613GAN MR052077
R1
T-TAIWAN
CY2309ZXI-1H
150C 1000
50
0
ZZ1613GAN MR052077
R1
T-TAIWAN
CY2309ZXI-1H
150C 500
50
0
ZZ5624BGN MR061008
R1
R-CML
CY28441ZXC
150C 1000
50
0
ZZ5624BGN MR061008
R1
R-CML
CY28441ZXC
150C 500
50
0
550
0
Summary for 'PkgFamily' = TSSOP (Pb-Free) (11 detail records)
Sum
VFBGA (0.75-0.8, Pb-Free)
BZ52BGAGL 043004
1A
G-TAIWAN
7C87740A
150C 1000
46
0
BZ52BGAGL 043004
1A
G-TAIWAN
7C87740A
150C 500
47
0
BZ52BGAGL 043004
2C
G-TAIWAN
7C87742A
150C 500
46
0
BZ52BGAGL 043004
3B
G-TAIWAN
7C87741A
150C 500
46
0
BZ100AALE
050202
R1
G-TAIWAN
CY7C015V18-35AC
150C 1000
50
0
BZ100AALE
050202
R1
G-TAIWAN
CY7C015V18-35AC
150C 500
50
0
BZ48BTALN 054302
R1A
RA-CML
CY62147EV30*
150C 1000
45
0
BZ48BTALN 054302
R1A
RA-CML
CY62147EV30*
150C 500
45
2006 Q1 RELIABILITY REPORT
0
Page 77 of 78
Results
Product Reliability
BldKit
BZ48BKALE
EvalNum
MR052088
TV AssyLoc
R1
Temp Readout
CYK128K16SCBU-55BV 150C 1000
XI
BZ48BKALE MR052088
R1
RA-CML
CYK128K16SCBU-55BV 150C 500
XI
Summary for 'PkgFamily' = VFBGA (0.75-0.8, Pb-Free) (10 detail records)
Sum
Grand Total
2006 Q1 RELIABILITY REPORT
RA-CML
Device
SS Rejects FA
47
0
50
0
472
0
14906
0
Page 78 of 78
Results