56LW (WETTABLE FLANK) – QFN Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LW (WETTABLE FLANK) 172.9788 mg Body Size (mil/mm) Package Weight – Site 2 8x8x1 mm 172.9788 mg SUMMARY The 56LW (WETTABLE FLANK ) – QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Seoul Korea Package Qualification Report # 121304 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LW56-Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 1 of 7 56LW (WETTABLE FLANK) – QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Lead Frame Lead frame Plating Lead Finish Substance Composition Die Wire Mold Adhesive Circuit Interconnect Encapsulation %weight of substance per Homogeneous material PPM % weight of substance per package Copper 7440-50-8 85.9169 97.5000% 496,690 49.6690% Zinc Iron Phosphorus Nickel Palladium Gold-Silver 7440-66-6 7439-89-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 0.1057 2.0708 0.0264 1.4430 0.0311 0.0059 0.1200% 2.3500% 0.0300% 97.5000% 2.1000% 0.4000% 611 11,972 152.8277 8,342 180 34 0.0611% 1.1972% 0.0153% 0.8342% 0.0180% 0.0034% Nickel Palladium Gold-Silver 7440-22-4 7440-02-0 7440-05-3 7440-57-5 0.0520 0.0030 0.0040 88.1400% 5.0800% 6.7800% 301 17 23 0.0301% 0.0017% 0.0023% 7440-22-4 96-48-0 0.0632 4.0000% 365 0.0365% 7440-22-4 1.2166 77.0000% 7,033 0.7033% 2,6-diglycidyl phenyl alkyl ether oilgomer 417-470-1 0.0632 4.0000% 365 0.0365% Fatty acids, C18unsatd., dimers, oligomeric reaction products with 1chloro-2,3epoxypropane Epoxy Resin 68475-94-5 0.0632 4.0000% 365 0.0365% 9003-36-5 0.1106 7.0000% 639 0.0639% Poly[oxy(methyl- 1,2ethanediyl)], .alpha.(2aminomethylethyl)-. omega.-(2aminomethylethoxy Silicon Au Silica fused 9046-10-0 0.0632 4.0000% 365 0.0365% 7440-21-3 7440-57-5 60676-86-0 7.5900 1.3400 61.1604 100.0000% 100.0000% 84.0000% 43,878 7,747 353,572 4.3878% 0.7747% 35.3572% GammaButyrolactone Silver Die Attach CAS Number Weight by mg Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 2 of 7 56LW (WETTABLE FLANK) – QFN Pb-Free Package Compound Carbon Black Epoxy Resin Phenol Resin 1333-86-4 Trade Secret Trade Secret Package Weight (mg): 0.2184 6.5529 4.8783 0.3000% 9.0000% 6.7000% 172.9788 1,263 37,883 28,202 % Total: 0.1263% 3.7883% 2.8202% 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 3 of 7 56LW (WETTABLE FLANK) – QFN Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines Package Qualification Report # 151401 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LW56-Amkor Phils As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 4 of 7 56LW (WETTABLE FLANK) – QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Lead Frame Lead frame Plating Lead Finish Substance Composition Die Wire Adhesive Circuit Interconnect Weight by mg PPM % weight of substance per package Copper 7440-50-8 85.9169 97.5000% 496,690 49.6690% Zinc Iron Phosphorus Nickel Palladium Gold-Silver 7440-66-6 7439-89-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 0.1057 2.0708 0.0264 1.4430 0.0311 0.0059 0.1200% 2.3500% 0.0300% 97.5000% 2.1000% 0.4000% 611 11,972 152.8277 8,342 180 34 0.0611% 1.1972% 0.0153% 0.8342% 0.0180% 0.0034% Nickel Palladium Gold-Silver 7440-22-4 7440-02-0 7440-05-3 7440-57-5 0.0520 0.0030 0.0040 88.1400% 5.0800% 6.7800% 301 17 23 0.0301% 0.0017% 0.0023% 7440-22-4 96-48-0 0.0632 4.0000% 365 0.0365% 7440-22-4 1.2166 77.0000% 7,033 0.7033% 2,6-diglycidyl phenyl alkyl ether oilgomer 417-470-1 0.0632 4.0000% 365 0.0365% Fatty acids, C18unsatd., immers, oligomeric reaction products with 1chloro-2,3epoxypropane Epoxy Resin 68475-94-5 0.0632 4.0000% 365 0.0365% 9003-36-5 0.1106 7.0000% 639 0.0639% Poly[oxy(methyl- 1,2ethanediyl)], .alpha.(2aminomethylethyl)-. Omega.-(2aminomethylethoxy Silicon Au 9046-10-0 0.0632 4.0000% 365 0.0365% 7440-21-3 7440-57-5 7.5900 1.3400 100.0000% 100.0000% 43,878 7,747 4.3878% 0.7747% GammaButyrolactone Silver Die Attach CAS Number %weight of substance per Homogeneous material Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 5 of 7 56LW (WETTABLE FLANK) – QFN Pb-Free Package Mold Compound Encapsulation Silica fused Carbon Black Epoxy Resin Phenol Resin 60676-86-0 1333-86-4 Trade Secret Trade Secret Package Weight (mg): 61.1604 0.2184 6.5529 4.8783 84.0000% 0.3000% 9.0000% 6.7000% 172.9788 353,572 1,263 37,883 28,202 % Total: 35.3572% 0.1263% 3.7883% 2.8202% 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 6 of 7 56LW (WETTABLE FLANK) – QFN Pb-Free Package Document History Page Document Title: Document Number: Rev. 56LW (WETTABLE FLANK) - QFN PB FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-78152 ** *A ECN No. Orig. of Change 3629344 MDY 3643183 MDY *B 4064282 YUM *C 4791987 HLR *D 4889607 VFR DCON *E 5310673 HLR Description of Change New specification. Added word “WETTABLE FLANK” beside LW on the header and on the summary to match on the specification/document title. Added assembly site name in the assembly heading. Changed assembly code to assembly site name. Corrected the CAS number of Palladium. Corrected the total package weight from 172.9789 mg. to 172.9788 mg. Added PMDD for Site 2 – Amkor Technology Philippines under QTP # 151401 Removed Distribution and Posting in the document history page. Changed Cypress Logo. Changed Proprietary CAS Number to Trade Secret. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78152 Rev. *E Page 7 of 7