32L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

32L - SOIC
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
SZ
B1: 1,419.9997 mg
B2: 1,300.0302 mg
Body Size (mil/mm)
Package Weight – Site 2
450 mils
B1: 1,300.0302mg
B2: 1,298.2400 mg
SUMMARY
The 32L- SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 040804, 042402, 063604 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ32-CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 1 of 9
32L - SOIC
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. NiPdAu with Standard Molding Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Mold Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
Fused Silica
Solid Epoxy
Resin
Phenol Resin
Antimony
Trioxide
Crystalline Silica
Carbon Black
CAS Number
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
-----------------------------------------------------------------------------------------------7440-21-3
7440-57-5
60676-86-0
--------------------
401.4266
9.8904
0.2885
0.4945
0.1930
0.0035
0.0035
2.2898
0.3199
0.1799
0.0600
0.0600
0.0303
41.1000
2.6800
710.1641
96.0980
% weight of
substance per
Homogenous
material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
77.8900%
10.8800%
6.1200%
2.0400%
2.0400%
1.0300%
100.0000%
100.0000%
73.9000%
10.0000%
-------------------1309-64-4
105.7078
12.4927
11.0000%
1.3000%
28.8294
7.6878
3.0000%
0.8000%
14808-60-7
1333-86-4
Package Weight (mg):
1,419.9997
PPM
282,695
6,965
203
348
136
2
2
1,613
225
127
42
42
21
28,944
1,887
500,116
67,675
74,442
8,798
20,302
5,414
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 2 of 9
% weight of
substance
per
package
28.2695%
0.6965%
0.0203%
0.0348%
0.0136%
0.0002%
0.0002%
0.1613%
0.0225%
0.0127%
0.0042%
0.0042%
0.0021%
2.8944%
0.1887%
50.0116%
6.7675%
7.4442%
0.8798%
2.0302%
0.5414%
100.0000
32L - SOIC
Pb-Free Package
B2. NiPdAu with Green Molding Compound
Purpose of
Use
Material
Base Material
Leadframe
Lead Finish
External
Plating
Substance
Composition
Cu
CAS
Number
7440-50-8
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
-------------------------------------------------
7.3486
0.2143
0.3674
3.6872
0.0665
0.0665
1.4400
0.1620
0.0900
0.0360
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
-----------------
0.0360
2.0000%
Die
Circuit
Acrylate
ester
Organic
Peroxide
Si
Wire
Interconnect
Au
Die Attach
Mold Compound
Adhesive
Encapsulation
Weight by
mg
298.2597
% weight of
substance per
Homogeneou
s material
PPM
97.4100%
229425
5653
165
283
2836
51
51
1108
125
69
% weight of
substance
per package
22.9425%
0.5653%
0.0165%
0.0283%
0.2836%
0.0051%
0.0051%
0.1108%
0.0125%
0.0069%
0.0028%
28
0.0028%
28
-----------------
0.0360
2.0000%
0.0028%
28
7440-21-3
24.9900
100.0000%
19223
1.9223%
7440-57-5
1.1000
100.0000%
846
658674
0.0846%
Silica
Phenol Resin
60676-86-0
-----------------
856.2957
48.1065
89.0000%
5.0000%
Epoxy Resin
-----------------
57.7278
6.0000%
Package Weight (mg):
1,300.0302
37004
44405
% Total:
65.8674%
3.7004%
4.4405%
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Desiccant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 3 of 9
32L - SOIC
Pb-Free Package
ASSEMBLY Site 2 – Jiangsu Changjiang Electronics Technology (JCET)
Package Qualification Report # 110902, 111411, 143703 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ32-JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 4 of 9
32L - SOIC
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: USING GOLD WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Mold Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS
Number
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acrylate ester
Organic Peroxide
Si
Au
Silica
Phenol Resin
Epoxy Resin
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
-------------------------------------------------------------------------------7440-21-3
7440-57-5
60676-86-0
---------------------------------
Package Weight (mg):
Weight by
mg
298.2597
7.3486
0.2143
0.3674
3.6872
0.0665
0.0665
1.4400
0.1620
0.0900
0.0360
0.0360
0.0360
24.9900
1.1000
856.2957
48.1065
57.7278
1,300.0302
% weight of
substance per
Homogeneous
material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
PPM
229,425
5,653
165
283
2,836
51
51
1,108
125
69
28
28
28
19,223
846
658,674
37,004
44,405
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 5 of 9
% weight of
substance
per
package
22.9425%
0.5653%
0.0165%
0.0283%
0.2836%
0.0051%
0.0051%
0.1108%
0.0125%
0.0069%
0.0028%
0.0028%
0.0028%
1.9223%
0.0846%
65.8674%
3.7004%
4.4405%
100.0000
32L - SOIC
Pb-Free Package
B2: USING COPPER PALLADIUM WIRE
Material
Leadframe
Lead
Finish
Die Attach
Purpose of
Use
Base Material
External
Plating
Adhesive
Die
Circuit
Wire
Interconnect
Substance
Composition
Encapsulation
Weight by
mg
% weight of
substance per
Homogeneous
0.0220
0.0045
0.0015
7440-22-4
6.7320
1.3770
0.4590
7.0380
Copper
7440-50-8
290.3940
Tin
7440-31-5
Silver
Proprietary
Bismaleimide
Proprietary Polymer
Methacrylate
7440-22-4
Nickel
Silicon
Magnesium
7440-02-0
7440-21-3
7439-95-4
Silver
4.9400
PPM
%% Weight
of Substance
per package
0.0230
5,185
1,061
354
5,421
0.5185%
0.1061%
0.0354%
0.5421%
0.9490
223,683
22.3683%
3,805
0.3805%
1,109
0.1109%
125
0.0125%
1.4400
1.0000
0.8000
0.1620
0.0900
Proprietary
Proprietary
0.0900
0.0360
0.0500
0.0200
69
28
0.0069%
0.0028%
Proprietary
Proprietary
7440-21-3
7440-50-8
7440-05-3
Trade
Secret
Trade
Secret
Trade
Secret
60676-86-0
1333-86-4
0.0360
0.0200
0.0360
24.9900
0.5011
0.0089
0.0200
1.0000
0.9825
0.0175
28
28
19,249
386
7
0.0028%
0.0028%
1.9249%
0.0386%
0.0007%
22,184
2.2184%
22,184
2.2184%
36,973
3.6973%
851.5200
2.8800
655,903
2,218
65.5903%
0.2218%
Package Weight (mg):
1,298.2400
% Total:
100.0000
Acrylate Ester
Organic Peroxide
Silicon
Copper
Palladium
Epoxy Resin A
Mold
Compound
CAS
Number
Epoxy Resin B
Phenol Resin
Silica(Amorphous)
Carbon Black
Proprietary
28.8000
28.8000
48.0000
0.0300
0.0300
0.0500
0.8870
0.0030
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 6 of 9
32L - SOIC
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Plastic Tube
End Plug
End Pin
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Desiccant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
N/A
< 5.0
< 5.0
N/A
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
N/A
< 5.0
< 5.0
N/A
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
N/A
< 5.0
< 5.0
N/A
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
N/A
< 5.0
< 5.0
N/A
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
N/A
< 1.0
< 1.0
N/A
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
N/A
< 1.0
< 1.0
N/A
<5.0
<5.0
<5.0
-----------
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
N/A
CoA-PLTB-R
CoA-EPLG-R
N/A
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 7 of 9
32L - SOIC
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
32L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03053
Description of Change
**
*A
ECN No. Orig. of
Change
385598
GFJ
2117526 HLR
*B
2516935 MAHA
1. Changed the CAS numbers of the following in table B1:
a. Antimony trioxide
b. Carbon black
c. Fused silica
d. Crystalline Silica
2. Added the following:
a. B2: 1,300 mg
b. QTP reference 063604
c. CoA-SZ32-R1
d. Table B2. NiPdAu with Green Molding Compound
3. Changed “Dessicant” to “Desiccant” in II.
DECLARATION OF PACKAGING / INDIRECT
MATERIALS
*C
*D
*E
*F
*G
*H
2712138
3219028
3288359
3297855
3930112
4049953
Added Note 4 on Footer Section.
Added Assembly Site 2 – JCET
Sunset Due – No Change
Changed the reference QTP for Assembly Site 2.
Added reference QTP 111411 in Assembly Site 2.
Removed Tray and End Pin on Indirect Materials table.
Added Assembly Site Name on the Assembly Heading.
Changed Assembly Code on Banned Substances to
Assembly Site acronym.
Changed the values on material composition to reflect 4
decimal points in values.
HLR
REYD
HLR
HLR
NKZ
HLR
New document
Added QTP 042402 for Automotive
Updated Cypress Logo
Added % weight of substance per Homogenous Material
and % weight of substance per package on the Material
Composition.
Completed the RoHS Substances namely; Lead
Cadmium, Mercury, Chromium VI, PBB and PBDE on
Declaration of Packaging Indirect Materials table
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
Page 8 of 9
32L - SOIC
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
32L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03053
*I
ECN
Orig. of
No.
Change
4111286 YUM
*J
4433831 HLR
*K
4498524 REYD
Description of Change
Corrected total package weight in site 1:B1 from
“1,420.0000” to “1,419.9997”
Corrected total package weight in site 1:B2 from
“1300.0300” to 1300.0302”.
Corrected total package weight in site 2 from “1300.0300”
to 1300.0302”.
Changed the CAS Number of Palladium (Pd) on
Assembly Site 1. B2 Material Composition
Added B2 in Package Weight and QTP# 143703 Site 2.
Updated Material Composition Table under Assembly Site
2-B2.
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03053 Rev. *K
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