32L - SOIC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 SZ B1: 1,419.9997 mg B2: 1,300.0302 mg Body Size (mil/mm) Package Weight – Site 2 450 mils B1: 1,300.0302mg B2: 1,298.2400 mg SUMMARY The 32L- SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 040804, 042402, 063604 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ32-CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 1 of 9 32L - SOIC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. NiPdAu with Standard Molding Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Phenol Resin Antimony Trioxide Crystalline Silica Carbon Black CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 -------------------- 401.4266 9.8904 0.2885 0.4945 0.1930 0.0035 0.0035 2.2898 0.3199 0.1799 0.0600 0.0600 0.0303 41.1000 2.6800 710.1641 96.0980 % weight of substance per Homogenous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 77.8900% 10.8800% 6.1200% 2.0400% 2.0400% 1.0300% 100.0000% 100.0000% 73.9000% 10.0000% -------------------1309-64-4 105.7078 12.4927 11.0000% 1.3000% 28.8294 7.6878 3.0000% 0.8000% 14808-60-7 1333-86-4 Package Weight (mg): 1,419.9997 PPM 282,695 6,965 203 348 136 2 2 1,613 225 127 42 42 21 28,944 1,887 500,116 67,675 74,442 8,798 20,302 5,414 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 2 of 9 % weight of substance per package 28.2695% 0.6965% 0.0203% 0.0348% 0.0136% 0.0002% 0.0002% 0.1613% 0.0225% 0.0127% 0.0042% 0.0042% 0.0021% 2.8944% 0.1887% 50.0116% 6.7675% 7.4442% 0.8798% 2.0302% 0.5414% 100.0000 32L - SOIC Pb-Free Package B2. NiPdAu with Green Molding Compound Purpose of Use Material Base Material Leadframe Lead Finish External Plating Substance Composition Cu CAS Number 7440-50-8 Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 ------------------------------------------------- 7.3486 0.2143 0.3674 3.6872 0.0665 0.0665 1.4400 0.1620 0.0900 0.0360 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% ----------------- 0.0360 2.0000% Die Circuit Acrylate ester Organic Peroxide Si Wire Interconnect Au Die Attach Mold Compound Adhesive Encapsulation Weight by mg 298.2597 % weight of substance per Homogeneou s material PPM 97.4100% 229425 5653 165 283 2836 51 51 1108 125 69 % weight of substance per package 22.9425% 0.5653% 0.0165% 0.0283% 0.2836% 0.0051% 0.0051% 0.1108% 0.0125% 0.0069% 0.0028% 28 0.0028% 28 ----------------- 0.0360 2.0000% 0.0028% 28 7440-21-3 24.9900 100.0000% 19223 1.9223% 7440-57-5 1.1000 100.0000% 846 658674 0.0846% Silica Phenol Resin 60676-86-0 ----------------- 856.2957 48.1065 89.0000% 5.0000% Epoxy Resin ----------------- 57.7278 6.0000% Package Weight (mg): 1,300.0302 37004 44405 % Total: 65.8674% 3.7004% 4.4405% 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 3 of 9 32L - SOIC Pb-Free Package ASSEMBLY Site 2 – Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 110902, 111411, 143703 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ32-JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 4 of 9 32L - SOIC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: USING GOLD WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition CAS Number Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acrylate ester Organic Peroxide Si Au Silica Phenol Resin Epoxy Resin 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -------------------------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------------- Package Weight (mg): Weight by mg 298.2597 7.3486 0.2143 0.3674 3.6872 0.0665 0.0665 1.4400 0.1620 0.0900 0.0360 0.0360 0.0360 24.9900 1.1000 856.2957 48.1065 57.7278 1,300.0302 % weight of substance per Homogeneous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% PPM 229,425 5,653 165 283 2,836 51 51 1,108 125 69 28 28 28 19,223 846 658,674 37,004 44,405 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 5 of 9 % weight of substance per package 22.9425% 0.5653% 0.0165% 0.0283% 0.2836% 0.0051% 0.0051% 0.1108% 0.0125% 0.0069% 0.0028% 0.0028% 0.0028% 1.9223% 0.0846% 65.8674% 3.7004% 4.4405% 100.0000 32L - SOIC Pb-Free Package B2: USING COPPER PALLADIUM WIRE Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Substance Composition Encapsulation Weight by mg % weight of substance per Homogeneous 0.0220 0.0045 0.0015 7440-22-4 6.7320 1.3770 0.4590 7.0380 Copper 7440-50-8 290.3940 Tin 7440-31-5 Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate 7440-22-4 Nickel Silicon Magnesium 7440-02-0 7440-21-3 7439-95-4 Silver 4.9400 PPM %% Weight of Substance per package 0.0230 5,185 1,061 354 5,421 0.5185% 0.1061% 0.0354% 0.5421% 0.9490 223,683 22.3683% 3,805 0.3805% 1,109 0.1109% 125 0.0125% 1.4400 1.0000 0.8000 0.1620 0.0900 Proprietary Proprietary 0.0900 0.0360 0.0500 0.0200 69 28 0.0069% 0.0028% Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 0.0360 0.0200 0.0360 24.9900 0.5011 0.0089 0.0200 1.0000 0.9825 0.0175 28 28 19,249 386 7 0.0028% 0.0028% 1.9249% 0.0386% 0.0007% 22,184 2.2184% 22,184 2.2184% 36,973 3.6973% 851.5200 2.8800 655,903 2,218 65.5903% 0.2218% Package Weight (mg): 1,298.2400 % Total: 100.0000 Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Mold Compound CAS Number Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black Proprietary 28.8000 28.8000 48.0000 0.0300 0.0300 0.0500 0.8870 0.0030 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 6 of 9 32L - SOIC Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Cover tape Carrier tape Plastic Reel Tray Plastic Tube End Plug End Pin Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 N/A < 5.0 < 5.0 N/A < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 N/A < 5.0 < 5.0 N/A < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 N/A < 5.0 < 5.0 N/A < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 N/A < 5.0 < 5.0 N/A < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 N/A < 1.0 < 1.0 N/A <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 N/A < 1.0 < 1.0 N/A <5.0 <5.0 <5.0 ----------- Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R N/A CoA-PLTB-R CoA-EPLG-R N/A CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 7 of 9 32L - SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03053 Description of Change ** *A ECN No. Orig. of Change 385598 GFJ 2117526 HLR *B 2516935 MAHA 1. Changed the CAS numbers of the following in table B1: a. Antimony trioxide b. Carbon black c. Fused silica d. Crystalline Silica 2. Added the following: a. B2: 1,300 mg b. QTP reference 063604 c. CoA-SZ32-R1 d. Table B2. NiPdAu with Green Molding Compound 3. Changed “Dessicant” to “Desiccant” in II. DECLARATION OF PACKAGING / INDIRECT MATERIALS *C *D *E *F *G *H 2712138 3219028 3288359 3297855 3930112 4049953 Added Note 4 on Footer Section. Added Assembly Site 2 – JCET Sunset Due – No Change Changed the reference QTP for Assembly Site 2. Added reference QTP 111411 in Assembly Site 2. Removed Tray and End Pin on Indirect Materials table. Added Assembly Site Name on the Assembly Heading. Changed Assembly Code on Banned Substances to Assembly Site acronym. Changed the values on material composition to reflect 4 decimal points in values. HLR REYD HLR HLR NKZ HLR New document Added QTP 042402 for Automotive Updated Cypress Logo Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 8 of 9 32L - SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03053 *I ECN Orig. of No. Change 4111286 YUM *J 4433831 HLR *K 4498524 REYD Description of Change Corrected total package weight in site 1:B1 from “1,420.0000” to “1,419.9997” Corrected total package weight in site 1:B2 from “1300.0300” to 1300.0302”. Corrected total package weight in site 2 from “1300.0300” to 1300.0302”. Changed the CAS Number of Palladium (Pd) on Assembly Site 1. B2 Material Composition Added B2 in Package Weight and QTP# 143703 Site 2. Updated Material Composition Table under Assembly Site 2-B2. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03053 Rev. *K Page 9 of 9