100 – FBGA (11 x 11 x 1.4 mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Cypress Package Code Package Weight – Site 1 BB 298 mg Body Size (mil/mm) Package Weight – Site 2 11 x 11 x 1.4 mm N/A SUMMARY The 100-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1 – Package Qualification Report # 011707, 013702 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 14.87 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 49,945 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05594 Rev. *B Page 1 of 4 100 – FBGA (11 x 11 x 1.4 mm) Non Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use SiO2 60676-86-0 10.91 % Weight of Substance per Homogeneous Material 11.00% 36,644 3.66% Acrylic Proprietary, 29690-82-2 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 Proprietary Proprietary 9.92 10.00% 33,319 3.33% 7.93 8.00% 26,635 2.66% 14.88 17.35 36.09 1.49 0.55 0.05 25.31 14.87 14.27 1.03 1.03 15.00% 17.50% 36.39% 1.50% 0.55% 0.05% 62.99% 37.01% 76.47% 5.52% 5.52% 49,978 58,274 121,230 5,005 1,847 168 85,010 49,945 47,929 3,460 3,460 5.00% 5.83% 12.12% 0.50% 0.18% 0.02% 8.50% 4.99% 4.79% 0.35% 0.35% Proprietary 7440-21-3 7440-57-5 60676-86-0 Proprietary Proprietary 7631-86-9 13149-60-9 2.33 15.81 3.36 81.02 12.06 6.03 18.08 0.66 12.49% 100.00% 100.00% 67.21% 10.00% 5.00% 15.00% 0.55% 7,826 53,102 11,272 272,126 40,506 20,253 60,726 2,217 0.78% 5.31% 1.13% 27.21% 4.05% 2.03% 6.07% 0.22% Proprietary 0.66 0.55% 2,217 0.22% 14808-60-7 1333-86-4 0.60 0.60 0.50% 0.50% 2,015 2,015 0.20% 0.20% 14464-46-1 0.60 0.50% 2,015 0.20% 1309-64-4 0.24 0.20% 806 0.08% Substance Composition Epoxy Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Bisphenol Triazol Cu Ni Au Br Sn Pb Silver Epoxy Resin Functionalized Ester Diester Si Au Silica (fused) Epoxy resin Phenolic resin Silica Antimony Pentoxide Brominated compound Silica (quartz) Carbon black pigment Silica (Cristobalite) Antimony Trioxide CAS Number Package Weight (mg): Weight by mg 298 PPM % Total: % Weight of Substance per Package 100 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05594 Rev. *B Page 2 of 4 100 – FBGA (11 x 11 x 1.4 mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape < 5.0 < 5.0 < 5.0 Carrier tape Plastic Reel Tray Plastic Tube End Plug End Pin Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 N/A N/A N/A < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 N/A N/A N/A < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 N/A N/A N/A < 5.0 < 5.0 < 5.0 < 5.0 Material PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R < 5.0 < 5.0 < 5.0 N/A N/A N/A < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 N/A N/A N/A < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 N/A N/A N/A < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-R CoA-PLRL-R CoA-TRAY-R N/A N/A N/A CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05594 Rev. *B Page 3 of 4 100 – FBGA (11 x 11 x 1.4 mm) Non Pb-Free Package Document History Page Document Title: Document Number: 100 - FBGA (11x11x1.4mm) Non Pb-Free PMDD 001-05594 Rev ECN No. . ** 405951 *A 2583782 Orig. of Change YXP MAHA Description of Change *B DCON MAHA Changed CML to WEB in distribution list. Added the weight of Lead on Table A. 3052606 New specification 1. Updated Cypress logo. 2. Added percent weight per homogeneous material and weight of substance per package in the material composition table for Assembly site 1. 3. Deleted ion impurities on the material composition table of assembly site 1. 4. Added the CAS number of bromine. 5. Changed the CAS number of gold. 6. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table for assembly site 1. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05594 Rev. *B Page 4 of 4