60L – FN60A WLCSP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FN 15.3862 mg Body Size (mm) Package Weight – Site 2 3.79x3.88x0.55mm 13.7584 mg SUMMARY The 49ball-WLCSP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Hsin-chu Taiwan (T5) Package Qualification Report # 112212 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-FN60Amkor Taiwan (T5) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 1 of 7 60L – FN60A WLCSP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Polyimide1 Polyimide2 RDL Seed Layer Copper Under Bump Metallizatio n Solder Ball Die Laminate Tape(22um) Purpose Dielectric Dielectric Seed Layer Seed Layer Seed Layer Interconnec t UBM UBM UBM UBM UBM Interconnec t Interconnec t Interconnec t Circuit Mark Surface Substance Compositio n 1-Methyl-2Pyrrolidinone Methanol Methacrylate compounds Polyimide Resin 1-Methyl-2Pyrrolidinone Methanol Methacrylate compounds Polyimide Resin Ti W Cu CAS Number Weight by mg % weight of substance per Homogenou s material PPM % weight of substanc e per package 872-50-4 0.0065 3.9301% 425 0.0425% 67-56-1 0.0036 2.1834% 236 0.0236% Trade Secret 0.0109 6.5502% 708 0.0708% Trade Secret 0.1455 87.3364% 9,442 0.94412% 872-50-4 0.0062 3.9301% 402 0.0402% 67-56-1 0.0034 2.1834% 223 0.0223% Trade Secret 0.0103 6.5502% 670 0.0670% Trade Secret 0.1374 87.3362% 8,933 0.8933% 7440-32-6 7440-33-7 7440-50-8 0.0007 0.0063 0.0060 5.4094% 48.6040% 45.9866% 46 412 390 0.0046% 0.0412% 0.0390% Cu 7440-50-8 0.2001 100.0000% 13,003 1.3003% Ti W Cu Ni Au 7440-32-6 7440-33-7 7440-50-8 7440-02-0 7440-57-5 0.0003 0.0028 0.0027 0.0388 0.0210 0.4816% 4.3275% 4.0945% 59.0903% 32.0061% 0.0021% 0.0185% 0.0175% 0.2522% 0.1366% Sn 7440-31-5 3.4702 95.5000% 21 185 175 2,522 1,366 225,53 8 Ag 7440-22-4 0.1417 3.9000% 9,210 0.9210% Cu 7440-50-8 0.0218 0.6000% 1,417 0.1417% Si 7440-21-3 10.6000 100.0000% 688,93 0 68.8930% Acrylic polymer Trade Secret 0.5500 100.0000% 35,746 3.5746% % Total: 100.000 0 Package Weight (mg): 15.386 2 22.5538% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 2 of 7 60L – FN60A WLCSP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Others Material Cover tape Carrier tape Plastic Reel Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 3 of 7 60L – FN60A WLCSP Pb-Free Package ASSEMBLY Site 2: Deca Technologies Inc. Philippines (Decatech) Package Qualification Report # 120808 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-FN60Decatech As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 4 of 7 60L – FN60A WLCSP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose Polyimide1 Polyimide2 Dielectric Dielectric Seed Layer Seed Layer Seed Layer Interconnec t UBM UBM UBM UBM Interconnec t Interconnec t Interconnec t RDL Seed Layer Copper Under Bump Metallizatio n Solder Ball Die Laminate Tape(22um) Circuit Mark Surface Proprietary Proprietary Ti W Cu Trade Secret Trade Secret 7440-32-6 7440-33-7 7440-50-8 0.1338 0.1339 0.0007 0.0108 0.0103 % weight of substance per Homogenou s material 100.0000 100.0000 3.0300 49.6700 47.3000 9,726 9,730 48 788 750 % weight of substanc e per package 0.9726 0.9730 0.0048 0.0788 0.0750 Cu 7440-50-8 0.3441 100.0000 25,009 2.5009 Ti W Cu Cu 7440-32-6 7440-33-7 7440-50-8 7440-02-0 0.0006 0.0105 0.0100 0.1634 0.3500 5.6794 5.4095 88.5611 0.0047 0.0761 0.0725 1.1873 7440-31-5 3.1197 93.9100 47 761 725 11,873 226,74 8 Sn Ag 7440-22-4 0.1820 5.4800 13,232 1.3232 Cu 7440-50-8 0.0203 0.6100 1,473 0.1473 Si 7440-21-3 8.8746 100.0000 645,03 7 64.5037 Acrylic polymer Trade Secret 0.7437 100.0000 54,053 5.4053 % Total: 100.000 0 Substance Compositio n CAS Number Package Weight (mg): Weight by mg 13.758 4 PPM 22.6748 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 5 of 7 60L – FN60A WLCSP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Others Material Cover tape Carrier tape Plastic Reel Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 6 of 7 60L – FN60A WLCSP Pb-Free Package Document History Page Document Title: Document Number: 60L - FN60A WLCSP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-78053 Rev. ECN No. ** *A *B 3563905 3610577 4064282 Orig. of Change JSO JSO YUM *C *D 4743012 5261331 HLR HLR MEL Description of Change New Specification Added data for assembly site 2 Added assembly site name in the assembly heading in site 1 and 2. Changed Assembly code to assembly site name in site 1 and 2. Removed Tray and Tube materials in the Indirect Materials section. Sunset Due – No Change Changed the substances with “------------- “ and Proprietary to “Trade Secret Removed distribution and posting from the document history page. Changed Cypress Logo. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78053 Rev. *D Page 7 of 7