TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com 2 1.2A High Voltage Boost Converter in 2x2mm QFN Package Check for Samples: TPS61170-Q1 FEATURES 1 • • • • • • • • • • • DESCRIPTION Qualified for Automotive Applications 3-V to 18-V Input Voltage Range High Output Voltage: Up to 38 V 1.2-A integrated Switch 1.2-MHz Fixed Switching Frequency 12 V at 300 mA and 24 V at 150 mA from 5-V Input (Typical) Up to 93% Efficiency On-The-Fly Output Voltage Reprogramming Skip-Switching Cycle for Output Regulation at Light Load Built-in Soft Start 6-Pin, 2 mm × 2 mm QFN Package The TPS61170-Q1 is a monolithic, high-voltage switching regulator with integrated 1.2-A, 40-V power MOSFET. It can be configured in several standard switching-regulator topologies, including boost and SEPIC. The device has a wide input-voltage range to support applications with input voltage from multi-cell batteries or regulated 5-V, 12-V power rails. The TPS61170-Q1 operates at a 1.2-MHz switching frequency, allowing the use of low-profile inductors and low-value ceramic input and output capacitors. External loop compensation components give the user flexibility to optimize loop compensation and transient response. The device has built-in protection features, such as pulse-by-pulse overcurrent limit, soft start and thermal shutdown. The reference voltage to which the FB pin regulates is 1.229V. The reference voltage can be lowered using a 1-wire digital interface (Easyscale™ protocol) through the CTRL pin. Alternatively, a pulse width-modulation (PWM) signal can be applied to the CTRL pin. The duty cycle of the signal reduces the feedback reference voltage proportionally. APPLICATIONS • • 5-V to 12-V and 24-V, 12-V to 24-V Boost Converter Buck Boost Regulation Using SEPIC Topology The TPS61170-Q1 is available in a 6-pin 2 mm × 2 mm QFN package, allowing a compact power-supply solution. L1 10 mH VIN 5 V C1 4.7 mF C2 4.7 mF TPS 61170 VIN R3 4.99 kW VOUT 12 V/ 300 mA D1 SW CTRL FB COMP GND C3 10 nF R1 87.6 kW R2 10 kW L1: TOKO#A915_Y-100M C1: Murata GRM188R61A475K C2: Murata GRM21BR61E475K D1: ONsemi MBR0540T1 *R3, C3: Compensation RC network Figure 1. Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) TA PACKAGE –40°C to 125°C (1) QFN - DRV Reel of 3000 ORDERABLE PART NUMBER TPS61170QDRVRQ1 TOP-SIDE MARKING RAP For the most current package and ordering information, see the TI Web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) Supply Voltages on VIN (2) (2) VALUE UNIT –0.3 to 20 V –0.3 to 20 V Voltage on FB and COMP (2) –0.3 to 3 V Voltage on SW (2) –0.3 to 40 V Voltages on CTRL VI (1) PD Continuous Power Dissipation TJ Operating Junction Temperature Range –40 to 150 °C TSTG Storage Temperature Range –65 to 150 °C (1) See Dissipation Ratings Table Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. (2) DISSIPATION RATINGS BOARD PACKAGE RθJC RθJA Low-K (1)DRV 20°C/W 140°C/W 20°C/W 65°C/W High-K (1) (2) (2) DRV DERATING FACTOR ABOVE TA = 25°C TA < 25°C TA = 70°C TA = 85°C 7.1 mW/°C 715 mW 395 mW 285 mW 15.4 mW/°C 1540 mW 845 mW 615 mW The JEDEC low-K (1s) board used to derive this data was a 3in×3in, two-layer board with 2-ounce copper traces on top of the board. The JEDEC high-K (2s2p) board used to derive this data was a 3in×3in, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. RECOMMENDED OPERATING CONDITIONS MIN VI Input voltage range, VIN VO Output voltage range (1) TYP MAX UNIT 3 18 V VIN 38 V 10 22 μH L Inductor CI Input capacitor 1 CO Output capacitor (1) 1 10 μF TA Operating ambient temperature –40 125 °C TJ Operating junction temperature –40 125 °C (1) 2 μF These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in other applications but should be fully tested by the user. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS VIN = 3.6 V, CTRL = VIN, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY CURRENT VI Input voltage range, VIN IQ Operating quiescent current into VIN Device PWM switching no load 3.0 ISD Shutdown current CRTL=GND, VIN = 4.2 V UVLO Under-voltage lockout threshold VIN falling Vhys Under-voltage lockout Hysteresis 2.2 18 V 2.3 mA 1 μA 2.5 V 70 mV ENABLE AND REFERENCE CONTROL V(CTRLh) CTRL logic high voltage VIN = 3 V to 18 V V(CTRL) CTRL logic low voltage VIN = 3 V to 18 V 1.2 V R(CTRL) CTRL pull down resistor toff CTRL pulse width to shutdown CTRL high to low 2.5 ms tes_det Easy Scale detection time (1) CTRL pin low 260 μs tes_delay Easy Scale detection delay tes_win Easy Scale detection window time 0.4 400 800 V 1600 kΩ 100 μs 1 ms VOLTAGE AND CURRENT CONTROL VREF Voltage feedback regulation voltage V(REF_PWM) Voltage feedback regulation voltage under reprogram VFB = 492 mV IFB Voltage feedback input bias current VFB = 1.229 V fS Oscillator frequency Dmax Maximum duty cycle tmin_on Minimum on pulse width 40 ns Isink Comp pin sink current 100 μA Isource Comp pin source current 100 μA Gea Error amplifier transconductance Rea Error amplifier output resistance 5 pF connected to COMP 6 MΩ fea Error amplifier crossover frequency 5 pF connected to COMP 500 kHz VIN = 3.6 V 0.3 VFB = 100 mV 1.204 1.229 1.254 477 492 507 1.0 1.2 90% 93% 240 320 V mV 200 nA 1.5 MHz 400 μmho POWER SWITCH 0.6 Ω RDS(on) N-channel MOSFET on-resistance ILN_NFET N-channel leakage current VSW = 35 V, TA = 25°C ILIM N-Channel MOSFET current limit D = Dmax ILIM_Start Start up current limit D = Dmax tHalf_LIM Time step for half current limit 5 ms tREF Vref filter time constant 180 μs tstep VREF ramp up time 213 μs VIN = 3.0 V 0.7 1 μA 1.44 A OC and SS (1) 0.96 1.2 0.7 A EasyScale communication is allowed immediately after the CTRL pin has been low for more than tes_det. To select EasyScale™ mode, the CTRL pin must be low for more than tes_det the end of tes_win. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 3 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) VIN = 3.6 V, CTRL = VIN, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT EasyScale TIMING μs tstart Start time of program stream 2 tEOS End time of program stream 2 360 μs tH_LB High time low bit Logic 0 2 180 μs tL_LB Low time low bit Logic 0 2 × tH_LB 360 μs tH_HB High time high bit Logic 1 2 × tL_HB 360 μs tL_HB Low time high bit Logic 1 2 180 μs VACKNL Acknowledge output voltage low Open drain, Rpullup =15 kΩ to Vin 0.4 V tvalACKN Acknowledge valid time See (2) 2 μs tACKN Duration of acknowledge condition See (2) 512 μs THERMAL SHUTDOWN Tshutdown Thermal shutdown threshold Thysteresis Thermal shutdown threshold hysteresis (2) 160 °C 15 °C Acknowledge condition active 0, this condition will only be applied if the RFA bit is set. Open drain output, line needs to be pulled high by the host with resistor load. PIN ASSIGNMENTS TOP VIEW FB COMP GND VIN Thermal Pad CTRL SW 6-PIN 2mm x 2mm x 0.8mm QFN TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION VIN 6 I The input supply pin for the IC. Connect VIN to a supply voltage between 3 V and 18 V. SW 4 I This is the switching node of the IC. Connect SW to the switched side of the inductor. GND 3 O Ground FB 1 I Feedback pin for current. Connect to the center tap of a resistor divider to program the output voltage. COMP 2 O Output of the transconductance error amplifier. Connect an external RC network to this pin to compensate the regulator. CTRL 5 I Control pin of the boost regulator. CTRL is a multi-functional pin which can be used to enable the device and control the feedback voltage with a PWM signal or for digital communications. Thermal Pad 4 The thermal pad should be soldered to the analog ground plane to avoid thermal issue. If possible, use thermal vias to connect to ground plane for ideal power dissipation. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM C2 D1 R1 1 R2 4 L1 FB SW Band Gap Error Amplifer Vin 6 COMP 2 C1 PWM Control R3 5 CTRL C3 Soft Start-up Ramp Generator + Current Sensor Oscillator GND 3 TYPICAL CHARACTERISTICS TABLE OF GRAPHS Circuit of Figure 1, L = TOKO A915_Y-100M, D1 = ONsemi MBR0540T1, unless otherwise noted. FIGURE Efficiency VIN = 5V; VOUT = 12V,18V,24V,30V Figure 2 Efficiency VIN = 5V, 8.5V, 12V; VOUT = 24V Figure 3 Output voltage accuracy ILOAD= 100 mA Figure 4 Switch current limit TA = 25°C Figure 5 Switch current limit Figure 6 Error amplifier transconductance Figure 7 Easyscale step Figure 8 PWM switching operation VIN = 5V; VOUT = 12V; ILOAD= 250mA Figure 9 Load transient response VIN = 5V; VOUT = 12V; ILOAD= 50mA to 150mA Figure 10 Start-up VIN = 5V; VOUT = 12V; ILOAD= 250mA Figure 11 Skip-cycle switching VIN = 9V ; VOUT = 12V, ILOAD= 100μA Figure 12 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 5 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com EFFICIENCY vs OUTPUT CURRENT EFFICIENCY vs OUTPUT CURRENT 100 100 VIN = 5 V VIN = 12 V VOUT = 24 V VOUT = 12 V 90 90 VOUT = 30 V VOUT = 24 V VIN = 5 V 80 Efficiency - % Efficiency - % 80 70 70 60 60 50 50 40 40 0 50 100 150 200 Output Current - mA 250 0 300 50 100 150 200 Output Current - mA 250 Figure 2. Figure 3. OUTPUT VOLTAGE vs INPUT VOLTAGE SWITCH CURRENT LIMIT vs DUTY CYCLE 300 1600 11.96 ILOAD = 100 mA 1500 1400 Switch Current Limit - A 11.94 VO - Output Voltage - V VIN = 8.5 V VOUT = 18 V TA = 25°C TA = 85°C 11.92 TA = -40°C 11.90 1300 1200 1100 1000 900 11.88 3 4 5 6 7 8 VI - Input Voltage - V 9 10 11 800 20 Figure 4. 6 30 40 50 60 Duty Cycle - % 70 80 90 Figure 5. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com ERROR AMPLIFIER TRANSCONDUCTANCE vs TEMPERATURE 1600 Switch Current Limit - mA 1500 1400 1300 1200 1100 1000 900 800 -40 -20 0 20 40 60 80 Temperature - °C 100 120 140 Error Amplifier Transconductance - mhos SWITCH CURRENT LIMIT vs TEMPERATURE 500 400 300 200 100 0 -40 -20 0 20 40 60 80 Temperature - °C 100 Figure 6. Figure 7. FB VOLTAGE vs EASY SCALE STEP PWM SWITCHING OPERATION 120 140 1.4 SW 5 V/div 1.2 FB Voltage - V 1 0.8 VOUT 100 mV/div AC 0.6 0.4 IL 500 mA/div 0.2 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 Easy Scale Step t - 400 ns/div Figure 8. Figure 9. LOAD TRANSIENT RESPONSE START-UP CTRL 5 V/div VOUT 200 mV/div AC VOUT 5 V/div COMP 500 mV/div IL 500 mA/div ILOAD 100 mA/div t - 1 ms/div t - 40 ms/div Figure 10. Figure 11. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 7 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com SKIP-CYCLE SWITCHING SW 5 V/div VOUT 20 mV/div AC IL 50 mA/div t - 400 ns/div Figure 12. 8 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com DETAILED DESCRIPTION OPERATION The TPS61170-Q1 integrates a 40-V low side FET for providing output voltages up to 38 V. The device regulates the output with current mode PWM (pulse width modulation) control. The switching frequency of the PWM is fixed at 1.2MHz (typical). The PWM control circuitry turns on the switch at the beginning of each switching cycle. The input voltage is applied across the inductor and stores the energy as the inductor current ramps up. During this portion of the switching cycle, the load current is provided by the output capacitor. When the inductor current rises to the threshold set by the error amplifier output, the power switch turns off and the external Schottky diode is forward biased. The inductor transfers stored energy to replenish the output capacitor and supply the load current. This operation repeats each switching cycle. As shown in the block diagram, the duty cycle of the converter is determined by the PWM control comparator which compares the error amplifier output and the current signal. A ramp signal from the oscillator is added to the current ramp. This slope compensation ramp is necessary to avoid sub-harmonic oscillations that are intrinsic to current mode control at duty cycles higher than 50%. The feedback loop regulates the FB pin to a reference voltage through an error amplifier. The output of the error amplifier must be connected to the COMP pin. An external RC compensation network must be connected to the COMP pin to optimize the feedback loop for stability and transient response. SOFT START-UP Soft-start circuitry is integrated into the IC to avoid a high inrush current during start-up. After the device is enabled by a logic high signal on the CTRL pin, the FB pin reference voltage ramps up in 32 steps, with each step taking 213μs. This ensures that the output voltage rises slowly to reduce inrush current. Additionally, for the first 5 msec after the COMP voltage ramps, the current limit of the PWM switch is set to half of the normal current limit specification or below 700mA (typical). See the start-up waveform for a typical example, Figure 11. OVERCURRENT PROTECTION TPS61170-Q1 has a cycle-by-cycle overcurrent limit feature that turns off the power switch once the inductor current reaches the overcurrent limit. The PWM circuitry resets itself at the beginning of the next switch cycle. During an over-current event, this results in a decrease of output voltage that is directly proportional to load current. The current limit threshold as well as input voltage, output voltage, switching frequency and inductor value determine the maximum available output current. Larger inductance values typically increase the current output capability because of the reduced current ripple. See the APPLICATION INFORMATION section for the output current calculation. UNDERVOLTAGE LOCKOUT (UVLO) An undervoltage lockout prevents mis-operation of the device at input voltages below 2.2V (typical). When the input voltage is below the undervoltage threshold, the device remains off and the internal switch FET is turned off. The undervoltage lockout threshold is set below minimum operating voltage of 3V to avoid any transient VIN dip triggering the UVLO and causing the device to reset. For the input voltages between UVLO threshold and 3V, the device attempts operation, but the specifications are not ensured. THERMAL SHUTDOWN An internal thermal shutdown turns off the device when the typical junction temperature of 160°C is exceeded. The IC restarts when the junction temperature drops by 15°C. ENABLE AND SHUTDOWN The TPS61170-Q1 enters shutdown when the CTRL voltage is less than 0.4V for more than 2.5ms. In shutdown, the input supply current for the device is less than 1μA (max). The CTRL pin has an internal 800kΩ (typical) pull down resistor to disable the device when the pin is left unconnected. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 9 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com FEEDBACK REFERENCE PROGRAM MODE SELECTION The CTRL pin is used for changing the FB pin reference voltage on-the-fly. There are two methods to program the reference voltage, PWM signal and 1 wire interface (EasyScale™). The programming mode is selected each time the device is enabled. The default mode is to use the duty cycle of the PWM signal on the CTRL pin to modulate the reference voltage. To enter the 1 wire interface mode, the following digital pattern on the CTRL pin must be recognized by the IC every time the IC starts from the shutdown mode. 1. Pull CTRL pin high to enable the TPS61170-Q1 and to start the 1 wire mode detection window. 2. After the EasyScale detection delay (tes_delay, 100μsec) expires, drive CTRL low for more than the EasyScale detection time (tes_detect, 260μsec). 3. The CTRL pin has to be low for more than EasyScale detection time before the EasyScale detection window (tes_win, 1msec) expires. EasyScale detection window starts from the first CTRL pin low to high transition. The IC immediately enters the 1 wire mode once the above 3 conditions are met. The EasyScale communication can start before the detection window expires. Once the mode is programmed, it can not be changed without another start up. In other words, the IC must be shutdown by pulling the CTRL low for 2.5ms and restarted in order to exit EasyScale Mode. See the Mode Detection of Feedback Reference Program figure (Figure 13) for a graphical explanation. Insert battery PWM signal high CTRL low PWM mode Startup delay FB ramp Shutdown delay 200mV x duty cycle FB t Insert battery Enter ES mode Enter ES mode Timing window Programming code Programming code high CTRL low ES detect time ES mode ES detect delay Shutdown delay IC Shutdown Programmed value (if not programmed, 200mV default ) FB FB ramp FB ramp Startup delay 50mV Startup delay 50mV Figure 13. Mode Detection of Feedback Reference Program PWM PROGRAM MODE When the CTRL pin is constantly high, the FB voltage is regulated to 1.229V typically. However, the CTRL pin allows a PWM signal to lower this regulation voltage. The relationship between the duty cycle and FB voltage is given in Equation 1: V FB + Duty 1.229 V (1) Where: Duty = duty cycle of the PWM signal 1.229 V = internal reference voltage As shown in Figure 14, the IC chops up the internal 1.229V reference voltage at the duty cycle of the PWM signal. The pulse signal is then filtered by an internal low pass filter. The output of the filter is connected to the error amplifier as the reference voltage for the FB pin regulation. The regulation voltage is independent of the PWM logic voltage level which often has large variations. 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com For optimum performance, use the PWM mode in the range of 5kHz to 100kHz. The requirement of minimum frequency comes from the EasyScale detection delay and detection time specification for the mode selection. The device can mistakenly enter 1 wire mode if the PWM signal frequency is less than 5kHz. Because there is an internal fixed ON-time error of 40nS, the FB voltage absolute value will be different than expected when the PWM frequency is above 100kHz. For example, the additional duty cycle of 3.2% due to the ON-time error increases the FB voltage when using an 800kHz PWM signal. A compromise between PWM frequency and FB voltage accuracy extends the frequency range. Adding an external RC filter to the pin serves no purpose. VBG 1.229 V CTRL Error Amplifier FB Figure 14. Block Diagram of Programmable FB Voltage Using PWM Signal 1 WIRE PROGRAM MODE The CTRL pin features a simple digital interface to control the feedback reference voltage. The 1 wire mode can save the processor power and battery life as it does not require a PWM signal all the time, and the processor can enter idle mode if available. The TPS61170-Q1 adopts the EasyScale™ protocol, which can program the FB voltage to any of the 32 steps with single command. See Table 1 for the FB pin voltage steps. The programmed reference voltage is stored in an internal register. The default value is full scale when the device is first enabled (VFB = 1.229V). A power reset clears the register value and reset it to default. EasyScale™ EasyScale is a simple but very flexible one pin interface to configure the FB voltage. The interface is based on a master-slave structure, where the master is typically a microcontroller or application processor. Figure 15 and Table 1 give an overview of the protocol. The protocol consists of a device specific address byte and a data byte. The device specific address byte is fixed to 72 hex. The data byte consists of five bits for information, two address bits, and the RFA bit. The RFA bit set to high indicates the Request for Acknowledge condition. The Acknowledge condition is only applied if the protocol was received correctly. The advantage of EasyScale compared with other on pin interfaces is that its bit detection is in a large extent independent from the bit transmission rate. It can automatically detect bit rates between 1.7kBit/sec and up to 160kBit/sec. Table 1. Selectable FB Voltage FB voltage (mV) D4 D3 D2 D1 D0 0 0.000 0 0 0 0 0 1 0.031 0 0 0 0 1 2 0.049 0 0 0 1 0 3 0.068 0 0 0 1 1 4 0.086 0 0 1 0 0 5 0.104 0 0 1 0 1 6 0.123 0 0 1 1 0 7 0.141 0 0 1 1 1 8 0.160 0 1 0 0 0 9 0.178 0 1 0 0 1 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 11 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com Table 1. Selectable FB Voltage (continued) FB voltage (mV) D4 D3 D2 D1 D0 10 0.197 0 1 0 1 0 11 0.215 0 1 0 1 1 12 0.234 0 1 1 0 0 13 0.270 0 1 1 0 1 14 0.307 0 1 1 1 0 15 0.344 0 1 1 1 1 16 0.381 1 0 0 0 0 17 0.418 1 0 0 0 1 18 0.455 1 0 0 1 0 19 0.492 1 0 0 1 1 20 0.528 1 0 1 0 0 21 0.565 1 0 1 0 1 22 0.602 1 0 1 1 0 23 0.639 1 0 1 1 1 24 0.713 1 1 0 0 0 25 0.787 1 1 0 0 1 26 0.860 1 1 0 1 0 27 0.934 1 1 0 1 1 28 1.008 1 1 1 0 0 29 1.082 1 1 1 0 1 30 1.155 1 1 1 1 0 31 1.229 1 1 1 1 1 DATA IN DATABYTE Device Address Start Start DA7 DA6 DA5 DA4 DA3 DA2 DA1 0 1 1 1 0 0 1 DA0 EOS Start RFA 0 A1 A0 D4 D3 D2 D1 D0 EOS DATA OUT ACK Figure 15. EasyScale™ Protocol Overview Table 2. EasyScale™ Bit Description BYTE Device Address Byte 72 hex 12 BIT NUMBER NAME TRANSMISSION DIRECTION 7 DA7 0 MSB device address 6 DA6 1 5 DA5 1 4 DA4 3 DA3 2 DA2 0 1 DA1 1 0 DA0 0 LSB device address IN DESCRIPTION 1 0 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com Table 2. EasyScale™ Bit Description (continued) BYTE Data byte BIT NUMBER NAME TRANSMISSION DIRECTION 7 (MSB) RFA 6 A1 0 Address bit 1 5 A0 0 Address bit 0 4 D4 3 D3 2 D2 Data bit 2 1 D1 Data bit 1 0 (LSB) D0 Data bit 0 DESCRIPTION Request for acknowledge. If high, acknowledge is applied by device Data bit 4 IN ACK Data bit 3 Acknowledge condition active 0, this condition will only be applied in case RFA bit is set. Open drain output, Line needs to be pulled high by the host with a pullup resistor. This feature can only be used if the master has an open drain output stage. In case of a push pull output stage Acknowledge condition may not be requested! OUT Easy Scale Timing, without acknowledge RFA = 0 t Start DATA IN t Start Address Byte DATA Byte Static High Static High DA7 0 DA0 0 D0 1 RFA 0 TEOS TEOS Easy Scale Timing, with acknowledge RFA = 1 t Start DATA IN t Start Address Byte DATA Byte Static High Static High DA7 0 DA0 0 TEOS RFA 1 D0 1 Controller needs to Pullup Data Line via a resistor to detect ACKN DATA OUT tLow Low Bit (Logic 0) t High tLOW t valACK ACKN t ACKN Acknowledge true, Data Line pulled down by device Acknowledge false, no pull down tHigh High Bit (Logic 1) Figure 16. EasyScale™— Bit Coding All bits are transmitted MSB first and LSB last. Figure 16 shows the protocol without acknowledge request (Bit RFA = 0), Figure 16 with acknowledge (Bit RFA = 1) request. Prior to both bytes, device address byte and data byte, a start condition must be applied. For this, the CTRL pin must be pulled high for at least tstart (2μs) before the bit transmission starts with the falling edge. If the CTRL pin is already at high level, no start condition is needed prior to the device address byte. The transmission of each byte is closed with an End of Stream condition for at least tEOS (2μs). Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 13 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com The bit detection is based on a Logic Detection scheme, where the criterion is the relation between tLOW and tHIGH. It can be simplified to: High Bit: tHIGH > tLOW, but with tHIGH at least 2x tLOW, see Figure 16. Low Bit: tHIGH < tLOW, but with tLOW at least 2x tHIGH, see Figure 16. The bit detection starts with a falling edge on the CTRL pin and ends with the next falling edge. Depending on the relation between tHIGH and tLOW, the logic 0 or 1 is detected. The acknowledge condition is only applied if: • Acknowledge is requested by a set RFA bit. • The transmitted device address matches with the device address of the device. • 16 bits is received correctly. If the device turns on the internal ACKN-MOSFET and pulls the CTRL pin low for the time tACKN, which is 512μs maximum then the Acknowledge condition is valid after an internal delay time tvalACK. This means that the internal ACKN-MOSFET is turned on after tvalACK, when the last falling edge of the protocol was detected. The master controller keeps the line low in this period. The master device can detect the acknowledge condition with its input by releasing the CTRL pin after tvalACK and read back a logic 0. The CTRL pin can be used again after the acknowledge condition ends. Note that the acknowledge condition may only be requested if the master device has an open drain output. For the push-pull output stage, the use a series resistor in the CRTL line to limit the current to 500μA is recommended for such cases as: • an accidentally requested acknowledge, or • to protect the internal ACKN-MOSFET. 14 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com APPLICATION INFORMATION PROGRAM OUTPUT VOLTAGE VOUT R1 TPS61170 FB R2 Figure 17. Program Output Voltage To program the output voltage, select the values of R1 and R2 (See Figure 17) according to Equation 2. æ R1 ö + 1÷ è R2 ø Vout = 1.229 V x ç æ Vout ö - 1÷ è 1.229 V ø R1 = R2 x ç (2) Considering the leakage current through the resistor divider and noise decoupling to FB pin, an optimum value for R2 is around 10k. The output voltage tolerance depends on the accuracy of the reference voltage and the tolerance of R1 and R2. MAXIMUM OUTPUT CURRENT The overcurrent limit in a boost converter limits the maximum input current, and thus the maximum input power for a given input voltage. The maximum output power is less than the maximum input power due to power conversion losses. Therefore, the current-limit setting, input voltage, output voltage and efficiency can all affect the maximum output current. The current limit clamps the peak inductor current; therefore, the ripple must be subtracted to derive the maximum DC current. The ripple current is a function of the switching frequency, inductor value and duty cycle. The following equations take into account of all the above factors for maximum output current calculation. 1 IP = é 1 1 ù + )ú êL ´ Fs ´ ( V + V V V out f in in û ë (3) where: IP = inductor peak to peak ripple current L = inductor value Vf = Schottky diode forward voltage Fs = switching frequency Vout = output voltage I Vin ´ (Ilim - P ) ´ h 2 Iout _ max = Vout (4) where: Iout_max = Maximum output current of the boost converter Ilim = overcurrent limit η = efficiency For instance, when Vin is 5 V, Vout is 12 V, the inductor is 10 μH, the Schottky forward voltage is 0.2 V; and then the maximum output current is 300 mA in a typical operation. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 15 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com SWITCH DUTY CYCLE The maximum switch duty cycle (D) of the TPS61170-Q1 is 90% (min). The duty cycle of a boost converter under continuous conduction mode (CCM) is given by: D + Vout * Vin Vout (5) For a 5V to 12V application, the duty cycle is 58.3%, and for a 5V to 24V application, the duty cycle is 79.2%. The duty cycle must be lower than the maximum specification of 90% in the application; otherwise, the output voltage can not be regulated. Once the PWM switch is turned on, the TPS61170-Q1 has minimum ON pulse width. This sets the limit of the minimum duty cycle. When operating at low duty cycles, the TPS61170-Q1 enters pulse-skipping mode. In this mode, the device turns the power switch off for several switching cycles to prevent the output voltage from rising above regulation. This operation typically occurs in light load condition when the PWM operates in discontinuous mode. See the Figure 12. INDUCTOR SELECTION The selection of the inductor affects steady state operation as well as transient behavior and loop stability. These factors make it the most important component in power regulator design. There are three important inductor specifications: inductor value, DC resistance (DCR) and saturation current. Considering inductor value alone is not enough. The inductance value of the inductor determines its ripple current. It is recommended that the peak-to-peak ripple current given by Equation 3 be set to 30–40% of the DC current. Inductance values shown in the Recommended Operating Conditions (ROC) table are recommended for most applications. Inductor DC current can be calculated as I in_DC + Vout Iout Vin h (6) Inductor values can have ±20% tolerance with no current bias. When the inductor current approaches saturation level, its inductance can decrease 20% to 35% from the 0A value depending on how the inductor vendor defines saturation current. Using an inductor with a smaller inductance value forces discontinuous PWM where the inductor current ramps down to zero before the end of each switching cycle. This reduces the boost converter’s maximum output current, causes large input voltage ripple and reduces efficiency. In general, inductors with large inductance and low DCR values provide much more output current and higher conversion efficiency. Inductors with smaller inductance values can give better load transient response. For these reasons, a 10μH to 22μH inductance value range is recommended. Table 3 lists some recommended inductors for the TPS61170-Q1. TPS61170-Q1 has built-in slope compensation to avoid sub-harmonic oscillation associated with current mode control. If the inductor value is lower than 10μH, the slope compensation may not be adequate, and the loop can become unstable. Therefore, customers need to verify operation in their application if the inductor is different from the recommended values. Table 3. Recommended Inductors for TPS61170-Q1 16 PART NUMBER L (μH) DCR MAX (mΩ) SATURATION CURRENT (A) SIZE (L × W × H mm) VENDOR A915_Y-100M 10 90 1.3 5.2×5.2×3.0 TOKO VLCF5020T-100M1R1-1 10 237 1.1 5×5×2.0 TDK CDRH4D22/HP 10 144 1.2 5×5×2.4 Sumida LQH43PN100MR0 10 247 0.84 4.5×3.2×2.0 Murata Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com SCHOTTKY DIODE SELECTION The high switching frequency of the TPS61170-Q1 demands a high-speed rectifying switch for optimum efficiency. Ensure that the diode’s average and peak current rating exceeds the average output current and peak inductor current. In addition, the diode’s reverse breakdown voltage must exceed the switch FET rating voltage of 40V. So, the ONSemi MBR0540 is recommended for TPS61170-Q1. However, Schottky diodes with lower rated voltages can be used for lower output voltages to save the solution size and cost. For example, a converter providing a 12V output with 20V diode is a good choice. COMPENSATION CAPACITOR SELECTION The TPS61170-Q1 has an external compensation, COMP pin, which allows the loop response to be optimized for each application. The COMP pin is the output of the internal error amplifier. An external resistor R3 and ceramic capacitor C3 are connected to COMP pin to provide a pole and a zero. This pole and zero, along with the inherent pole of a current mode control boost converter, determine the close loop frequency response. This is important to a converter stability and transient response. The following equations summarize the poles, zeros and DC gain of a TPS61170-Q1 boost converter with ceramic output capacitor (C2), as shown in the block diagram. They include the dominant pole (fP1), the output pole (fP2) of a boost converter, the right-half-plane zero (fRHPZ) of a boost converter, the zero (fZ) generated by R3 and C3, and the DC gain (A). fP1 = fP2 = 1 2p x 6 MW x C3 2p x Rout x C2 fRHPZ = fZ = (7) 2 Rout 2p x L (8) æ Vin ö ÷ è Vout ø 2 x ç (9) 1 2p x R3 x C3 1.229 (10) Vin 1 x Gea x 6 MW x x Rout x A= Vout x Rsense 2 Vout (11) where Rout is the load resistance, Gea is the error amplifier transconductance located in the ELECTRICAL CHARACTERISTICS table, Rsense (100mΩ typical) is a sense resistor in the current control loop. These equations helps generate a simple bode plot for TPS61170-Q1 loop analysis. Increasing R3 or reducing C3 increases the close loop bandwidth which improves the transient response. Adjusting R3 and C3 in opposite directions increase the phase, and help loop stability. For many of the applications, the recommended value of 10k and 680pF makes an ideal compromise between transient response and loop stability. To optimize the compensation, use C3 in the range of 100pF to 10nF, and R3 of 10k. See the TI application report SLVA319 for thorough analysis and description of the boost converter small signal model and compensation design. INPUT AND OUTPUT CAPACITOR SELECTION The output capacitor is mainly selected to meet the requirements for the output ripple and loop stability. The ripple voltage is related to the capacitor’s capacitance and its equivalent series resistance (ESR). Assuming a capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated using Equation 12. C out + ǒV out * V inǓ Iout Vout Fs V ripple (12) Where, Vripple = peak-to-peak output ripple. The additional output ripple component caused by ESR is calculated using: V ripple_ESR + I out RESR (13) Due to its low ESR, Vripple_ESR can be neglected for ceramic capacitors, but must be considered if tantalum or electrolytic capacitors are used. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 17 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com Care must be taken when evaluating a ceramic capacitor’s derating under dc bias, aging and AC signal. For example, larger form factor capacitors (in 1206 size) have a resonant frequencies in the range of the switching frequency. So, the effective capacitance is significantly lower. The DC bias can also significantly reduce capacitance. Ceramic capacitors can lose as much as 50% of its capacitance at its rated voltage. Therefore, choose a ceramic capacitor with a voltage rating at least 1.5X its expected dc bias voltage. The capacitor in the range of 1μF to 4.7μF is recommended for input side. The output typically requires a capacitor in the range of 1μF to 10μF. The output capacitor affects the loop stability of the boost regulator. If the output capacitor is below the range, the boost regulator can potentially become unstable. The popular vendors for high value ceramic capacitors are: TDK (http://www.component.tdk.com/components.php) Murata (http://www.murata.com/cap/index.html) LAYOUT CONSIDERATIONS As for all switching power supplies, especially those switching at high frequencies and/or providing high currents, layout is an important design step. If layout is not carefully done, the regulator could suffer from instability as well as noise problems. To maximize efficiency, switch rise and fall times should be as short as possible. To reduce radiation of high frequency switching noise and harmonics, proper layout of the high frequency switching path is essential. Minimize the length and area of all traces connected to the SW pin and always use a ground plane under the switching regulator to minimize interplane coupling. The high current path including the switch, Schottky diode, and output capacitor, contains nanosecond rise and fall times and should be kept as short as possible. The input capacitor needs not only to be close to the VIN pin, but also to the GND pin in order to reduce the IC supply ripple. Figure 18 shows a sample layout C1 R2 Vin R1 Vin FB L1 R3 CTRL COMP CTRL GND SW C3 GND Place enough VIAs around thermal pad to enhance thermal performance C2 Minimize the area of this trace Vout Note: minimize the trace area at FB pin and COMP pin Figure 18. PCB Layout Recommendation THERMAL CONSIDERATIONS The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation of the TPS61170-Q1. Calculate the maximum allowable dissipation, PD(max), and keep the actual dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 14: P D(max) + 18 125°C * T A RqJA (14) Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com where, TA is the maximum ambient temperature for the application. RθJA is the thermal resistance junction-to-ambient given in Power Dissipation Table. The TPS61170-Q1 comes in a thermally enhanced QFN package. This package includes a thermal pad that improves the thermal capabilities of the package. The RθJA of the QFN package greatly depends on the PCB layout and thermal pad connection. The thermal pad must be soldered to the analog ground on the PCB. Using thermal vias underneath the thermal pad as illustrated in the layout example. Also see the QFN/SON PCB Attachment application report (SLUA271). ADDITIONAL TYPICAL APPLICATIONS L1 10 mH VIN 12 V C1 4.7 mF D1 C2 4.7 mF TPS 61170 R3 10 kW VOUT 24 V/ 300 mA VIN SW CTRL FB COMP GND C3 680 pF R1 185.1 kW R2 10 kW L1: TOKO#A915_Y-100M C1: Murata GRM21BR61E475K C2: Murata GRM32ER71H475K D1: ONsemi MBR0540T1 Figure 19. 12V to 24V DCDC Power Conversion L1 10 mH VIN 5 V C1 4.7 mF D1 TPS 61170 VIN SW VOUT 12 V/ 300 mA C2 4.7 mF R1 87.6 kW ON/ OFF Program FB R3 10 kW CTRL FB COMP GND C3 680pF R2 10 kW L1: TOKO#A915_Y-100M C1: Murata GRM188R61A475K C2: Murata GRM21BR61E475K D1: ONsemi MBR0540T1 Figure 20. 5V to 12V DCDC Power Conversion With Programmable Feedback Reference Voltage Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 19 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com C4 1 mF L1 10 mH VIN 9 V to 15 V C1 4.7 mF L2 10 mH TPS 61170 VIN ON /OFF DIMMING CONTROL D1 C2 4.7 mF VOUT 12 V/ 300 mA R1 87.6 kW SW CTRL FB COMP GND R2 10 kW C3 220 nF L1: TOKO#A915_Y-100M C1: Murata GRM21BR61E475K C2: Murata GRM21BR61E475K D1: ONsemi MBR0540T1 *L1, L2 can be replaced by 1:1 transformer Figure 21. 12V SEPIC (Buck-Boost) Converter L1 22 mH VIN 4.5 V to 15 V C2 1 mF D2 C1 4.7 mF VO 48 V/60 mA D1 TPS61170 C4 4.7 mF D3 VIN SW CTRL FB COMP GND R1 380 kW C3 4.7 mF 10k 10 nF R2 10 kW L1: TOKO B1000AS-220M C1: Murata GRM21BR61E475K C2: Murata GRM21BR71H105K C3, C4: Murata GRM32ER71H475K D1 – D3: B140 Vo = 1.23 x (R1+R2)/ R2; Figure 22. 48V Phantom Power Application Circuit 20 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 TPS61170-Q1 SLVSAX2 – SEPTEMBER 2011 www.ti.com C3 1 mF VO1 -48 V/30 mA C4 4.7 mF VO2 -24 V/40 mA D2 L1 33 mH VIN 3.3 V D1 C2 1 mF D3 D4 C1 4.7 mF VIN R1 23.7 kW C5 4.7 mF TPS61170 SW VIN CTRL FB 1 kW 1 kW 10 kW COMP GND Q1 10 nF L1: TOKO B992AS-330M C1: Murata GRM188R61A475K C2, C3: Murata GRM21BR71H105K C4, C5: Murata GRM32ER71H475K R2 1.24 kW D1 – D4: B140 Q1: BCM62B Q2: MMBT3904TT1 Q2 Vo2 = 1.23 x (R1/ R2); Vo1 = 2Vo2 Figure 23. –24V / –48V Buck-Boost Converter from 3.3-V Input L1 15 mH pins 1-10 VIN 12 V 1 C1 4.7 mF 10 2 9 3 8 39 pF VO 48 V/75 mA D1 C2 4.7 mF TPS61170 5.6 W VIN SW CTRL FB R1 100 kW Vo = 1.23 x (R1+R2)/ R2; 60 kW COMP R2 2.61 kW GND 10 nF L1: EPCOS N97 C1: Murata GRM21BR61E475K C2: Murata GRM32ER71H475K D1: MURA160 Figure 24. 12V to 48V Flyback Topology Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS61170-Q1 21 PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2012 PACKAGING INFORMATION Orderable Device TPS61170QDRVRQ1 Status (1) Package Type Package Drawing ACTIVE SON DRV Pins Package Qty 6 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF TPS61170-Q1 : • Catalog: TPS61170 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jun-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS61170QDRVRQ1 Package Package Pins Type Drawing SON DRV 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 2.3 B0 (mm) K0 (mm) P1 (mm) 2.3 1.15 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jun-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS61170QDRVRQ1 SON DRV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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