BB TMP275

TMP275
SBOS363A − JUNE 2006 − REVISED JUNE 2006
0.5°C Digital Out Temperature Sensor
FEATURES
D
D
D
D
DESCRIPTION
8 ADDRESSES
DIGITAL OUTPUT: Two-Wire Serial Interface
RESOLUTION: 9- to 12-Bits, User-Selectable
ACCURACY:
±0.5°C (max) from +10°C to +85°C
±0.75°C (max) from +0°C to +100°C
The TMP275 is a 0.5°C accurate, two-wire, serial output
temperature sensor available in the MSOP-8 package. The
TMP275 is capable of reading temperatures with a resolution
of 0.0625°C.
The TMP275 is SMBus-compatible and allows up to eight
devices on one bus. It is ideal for extended temperature
measurement in a variety of communication, computer,
consumer, environmental, industrial, and instrumentation
applications.
D LOW QUIESCENT CURRENT:
50µA, 0.1µA Standby
D WIDE SUPPLY RANGE: 2.7V to 5.5V
D SMALL MSOP-8 PACKAGE
The TMP275 is specified for operation over a temperature
range of −40°C to +125°C.
APPLICATIONS
Temperature
D POWER-SUPPLY TEMPERATURE
MONITORING
SDA
1
D COMPUTER PERIPHERAL THERMAL
PROTECTION
D
D
D
D
D
D
D
SCL
NOTEBOOK COMPUTERS
ALERT
8
Control
Logic
2
CELL PHONES
BATTERY MANAGEMENT
Diode
Temp.
Sensor
3
7
∆Σ
A/D
Converter
V+
A0
Serial
Interface
6
A1
OFFICE MACHINES
THERMOSTAT CONTROLS
GND
4
Config.
and Temp.
Register
OSC
ENVIRONMENTAL MONITORING AND HVAC
ELECTROMECHANICAL DEVICE
TEMPERATURE
5
A2
TMP275
TEMPERATURE ERROR AT 25_C
TEMPERATURE ERROR vs TEMPERATURE
0.500
Population
Temperature Error (_C)
0.375
0.250
0.125
0
−0.125
−0.250
−0.500
0.50
0.40
0.30
0.20
0.10
0.00
−0.10
−0.20
−0.30
−0.45
−0.50
−0.375
36 Units Shown
−55
−35
−15
5
25
45
65
85
105
125 130
Temperature (_ C)
Temperature Error (_C)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright  2006, Texas Instruments Incorporated
! ! www.ti.com
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply, V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
Input Voltage(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to 7.0V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +127°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +130°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . . . . +150°C
ESD Rating:
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . 4000V
Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . 1000V
Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input voltage rating applies to all TMP275 input voltages.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
TMP275
MSOP-8
DGK
PACKAGE MARKING
T275
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
PIN ASSIGNMENTS
Top View
1
SCL
2
ALERT
3
GND
4
T275
SDA
8
V+
7
A0
6
A1
5
A2
MSOP−8
NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram.
2
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
ELECTRICAL CHARACTERISTICS
At TA = −40°C to +125°C, and V+ = 2.7V to 5.5V, unless otherwise noted.
TMP275
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
TEMPERATURE INPUT
+125
°C
+10°C to +85°C, V+ = 3.3V
±0.0625
±0.5
°C
0°C to +100°C, V+ = 3.0V to 3.6V
±0.0625
±0.75
°C
−40°C to +125°C, V+ = 3.0V to 3.6V
±0.0625
±1
°C
+25°C to +100°C, V+ = 3.3V to 5.5V
0.2
±1.5
°C
Selectable
+0.0625
°C
3
pF
Range
−40
Accuracy (Temperature Error)
Resolution(1)
DIGITAL INPUT/OUTPUT
Input Capacitance
Input Logic Levels:
VIH
VIL
0.7(V+)
6.0
−0.5
0.3(V+)
V
1
µA
0V ≤ VIN ≤ 6V
Leakage Input Current, IIN
Input Voltage Hysteresis
SCL and SDA Pins
500
V
mV
Output Logic Levels:
VOL SDA
VOL ALERT
IOL = 3mA
IOL = 4mA
Resolution
Conversion Time
0
0
0.15
0.4
0.15
0.4
Selectable
9 to 12
V
V
Bits
9-Bit
27.5
37.5
ms
10-Bit
55
75
ms
11-Bit
110
150
ms
12-Bit
220
300
ms
54
74
ms
Timeout Time
25
POWER SUPPLY
Operating Range
Quiescent Current
Shutdown Current
2.7
IQ
ISD
Serial Bus Inactive
50
5.5
V
85
µA
µA
Serial Bus Active, SCL Freq = 400kHz
100
Serial Bus Active, SCL Freq = 3.4MHz
410
Serial Bus Inactive
0.1
Serial Bus Active, SCL Freq = 400kHz
60
µA
Serial Bus Active, SCL Freq = 3.4MHz
380
µA
µA
3
µA
TEMPERATURE RANGE
Specified Range
−40
+125
°C
Operating Range
−55
+127
°C
Thermal Resistance
MSOP-8
qJA
250
°C/W
(1) Specified for 12-bit resolution.
3
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
TYPICAL CHARACTERISTICS
At TA = +25°C and V+ = 5.0V, unless otherwise noted.
SHUTDOWN CURRENT vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
1.0
85
0.9
75
0.8
0.7
0.6
V+ = 5V
ISD (µA)
IQ (µA)
65
55
0.5
0.4
0.3
45
0.2
V+ = 2.7V
0.1
35
0.0
Serial Bus Inactive
−0.1
25
−55
−35
−15
5
25
45
65
85
105
−55
125 130
−35
−15
5
25
45
65
85
105
125 130
Temperature (_ C)
Temperature (_ C)
CONVERSION TIME vs TEMPERATURE
TEMPERATURE ERROR vs TEMPERATURE
300
0.500
200
Temperature Error (_C)
Conversion Time (ms)
0.375
V+ = 5V
250
V+ = 2.7V
150
−35
−15
5
25
45
65
85
105
0.125
0
−0.125
−0.250
−0.375
12−bit resolution.
100
−55
0.250
125 130
−0.500
36 Units Shown
−55
−35
−15
5
25
45
65
85
105
Temperature (_ C)
Temperature (_ C)
QUIESCENT CURRENT WITH
BUS ACTIVITY vs TEMPERATURE
TEMPERATURE ERROR AT 25_ C
125 130
500
Hs MODE
FAST MODE
450
400
Population
300
250
200
125_C
150
4
Temperature Error (_ C)
0.50
0.40
10M
0.30
1M
0.20
100k
Frequency (Hz)
0.10
10k
0.00
1k
−0.10
−55_C
0
−0.20
50
−0.30
100
−0.45
25_ C
−0.50
IQ (µA)
350
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
APPLICATIONS INFORMATION
Pointer
Register
The TMP275 is a digital temperature sensor that is optimal
for thermal management and thermal protection
applications. The TMP275 is Two-Wire and SMBus
interface-compatible, and is specified over a temperature
range of −40°C to +125°C.
Temperature
Register
The TMP275 requires no external components for
operation except for pull-up resistors on SCL, SDA, and
ALERT, although a 0.1µF bypass capacitor is
recommended, as shown in Figure 1.
2
SDA
1
7
A0
6
TMP275
SDA
THIGH
Register
0.1µF
8
SCL
I/O
Control
Interface
TLOW
Register
V+
To
Two−Wire
Controller
SCL
Configuration
Register
Figure 2. Internal Register Structure of the
TMP275
A1
5
A2
3
ALERT
(Output)
4
P1
P0
0
0
Temperature Register (READ Only)
0
1
Configuration Register (READ/WRITE)
1
0
1
1
TLOW Register (READ/WRITE)
THIGH Register (READ/WRITE)
NOTE: SCL, SDA, and ALERT
pins require pull−up resistors.
GND
Figure 1. Typical Connections of the TMP275
The sensing device of the TMP275 is the chip itself.
Thermal paths run through the package leads as well as
the plastic package. The lower thermal resistance of metal
causes the leads to provide the primary thermal path.
To maintain accuracy in applications requiring air or
surface temperature measurement, care should be taken
to isolate the package and leads from ambient air
temperature. A thermally-conductive adhesive will assist
in achieving accurate surface temperature measurement.
POINTER REGISTER
Figure 2 shows the internal register structure of the
TMP275. The 8-bit Pointer Register of the devices is used
to address a given data register. The Pointer Register uses
the two LSBs to identify which of the data registers should
respond to a read or write command. Table 1 identifies the
bits of the Pointer Register byte. Table 2 describes the
pointer address of the registers available in the TMP275.
Power-up reset value of P1/P0 is 00.
P7
P6
P5
P4
P3
P2
0
0
0
0
0
0
P1
P0
Register Bits
REGISTER
Table 2. Pointer Addresses of the TMP275
TEMPERATURE REGISTER
The Temperature Register of the TMP275 is a 12-bit,
read-only register that stores the output of the most recent
conversion. Two bytes must be read to obtain data, and are
described in Table 3 and Table 4. Note that byte 1 is the
most significant byte, followed by byte 2, the least
significant byte. The first 12 bits are used to indicate
temperature, with all remaining bits equal to zero. The
least significant byte does not have to be read if that
information is not needed. Data format for temperature is
summarized in Table 5. Following power-up or reset, the
Temperature Register will read 0°C until the first
conversion is complete.
D7
D6
D5
D4
D3
D2
D1
D0
T11
T10
T9
T8
T7
T6
T5
T4
Table 3. Byte 1 of Temperature Register
D7
D6
D5
D4
D3
D2
D1
D0
T3
T2
T1
T0
0
0
0
0
Table 4. Byte 2 of Temperature Register
Table 1. Pointer Register Byte
5
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
TEMPERATURE
(°C)
DIGITAL OUTPUT
(BINARY)
HEX
128
0111 1111 1111
7FF
127.9375
0111 1111 1111
7FF
100
0110 0100 0000
640
80
0101 0000 0000
500
75
0100 1011 0000
4B0
50
0011 0010 0000
320
25
0001 1001 0000
190
0.25
0000 0000 0100
004
0
0000 0000 0000
000
−0.25
1111 1111 1100
FFC
−25
1110 0111 0000
E70
−55
1100 1001 0000
C90
POLARITY (POL)
The Polarity Bit of the TMP275 allows the user to adjust the
polarity of the ALERT pin output. If POL = 0, the ALERT pin
will be active LOW, as shown in Figure 3. For POL = 1, the
ALERT pin will be active HIGH, and the state of the ALERT
pin is inverted.
TL O W
Table 5. Temperature Data Format
The user can obtain 9, 10, 11, or 12 bits of resolution by
addressing the Configuration Register and setting the
resolution bits accordingly. For 9-, 10-, or 11-bit resolution,
the most significant bits in the Temperature Register are
used with the unused LSBs set to zero.
CONFIGURATION REGISTER
The Configuration Register is an 8-bit read/write register
used to store bits that control the operational modes of the
temperature sensor. Read/write operations are performed
MSB first. The format of the Configuration Register for the
TMP275 is shown in Table 6, followed by a breakdown of
the register bits. The power-up/reset value of the
Configuration Register is all bits equal to 0.
BYTE
D7
D6
D5
D4
D3
D2
D1
D0
1
OS
R1
R0
F1
F0
POL
TM
SD
Table 6. Configuration Register Format
SHUTDOWN MODE (SD)
The Shutdown Mode of the TMP275 allows the user to
save maximum power by shutting down all device circuitry
other than the serial interface, which reduces current
consumption to typically less than 0.1µA. Shutdown Mode
is enabled when the SD bit is 1; the device will shut down
once the current conversion is completed. When SD is
equal to 0, the device will maintain a continuous
conversion state.
THERMOSTAT MODE (TM)
The Thermostat Mode bit of the TMP275 indicates to the
device whether to operate in Comparator Mode (TM = 0)
or Interrupt Mode (TM = 1). For more information on
comparator and interrupt modes, see the High and Low
Limit Registers section.
6
T HIG H
Measured
Temperature
TMP275 ALERT PIN
(Comparator Mode)
POL = 0
TMP275 ALERT PIN
(Interrupt Mode)
POL = 0
TMP275 ALERT PIN
(Comparator Mode)
POL = 1
TMP275 ALERT PIN
(Interrupt Mode)
POL = 1
Read
Read
Read
Time
Figure 3. Output Transfer Function Diagrams
FAULT QUEUE (F1/F0)
A fault condition is defined as when the measured
temperature exceeds the user-defined limits set in the
THIGH and TLOW Registers. Additionally, the number of
fault conditions required to generate an alert may be
programmed using the fault queue. The fault queue is
provided to prevent a false alert as a result of
environmental noise. The fault queue requires
consecutive fault measurements in order to trigger the
alert function. Table 7 defines the number of measured
faults that may be programmed to trigger an alert condition
in the device. For THIGH and TLOW register format and byte
order, see section High and Low Limit Registers.
F1
F0
CONSECUTIVE FAULTS
0
0
1
0
1
2
1
0
4
1
1
6
Table 7. Fault Settings of the TMP275
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
CONVERTER RESOLUTION (R1/R0)
The Converter Resolution Bits control the resolution of the
internal Analog-to-Digital (A/D) converter. This control
allows the user to maximize efficiency by programming for
higher resolution or faster conversion time. Table 8
identifies the Resolution Bits and the relationship between
resolution and conversion time.
Both operational modes are represented in Figure 3.
Table 9 and Table 10 describe the format for the THIGH and
TLOW registers. Note that the most significant byte is sent
first, followed by the least significant byte. Power-up reset
values for THIGH and TLOW are:
THIGH = 80°C and TLOW = 75°C
The format of the data for THIGH and TLOW is the same as
for the Temperature Register.
R1
R0
RESOLUTION
CONVERSION TIME
(typical)
0
0
9 Bits (0.5°C)
27.5ms
0
1
10 Bits (0.25°C)
55ms
1
0
11 Bits (0.125°C)
1
1
12 Bits (0.0625°C)
BYTE
D7
D6
D5
D4
D3
D2
D1
D0
1
H11
H10
H9
H8
H7
H6
H5
H4
110ms
BYTE
D7
D6
D5
D4
D3
D2
D1
D0
220ms
2
H3
H2
H1
H0
0
0
0
0
Table 8. Resolution of the TMP275
ONE-SHOT (OS)
The TMP275 features a One-Shot Temperature
Measurement Mode. When the device is in Shutdown
Mode, writing a ‘1’ to the OS bit starts a single temperature
conversion. The device returns to the shutdown state at
the completion of the single conversion. This mode is
useful for reducing power consumption in the TMP275
when continuous temperature monitoring is not required.
When the configuration register is read, the OS always
reads zero.
HIGH AND LOW LIMIT REGISTERS
In Comparator Mode (TM = 0), the ALERT pin of the
TMP275 becomes active when the temperature equals or
exceeds the value in THIGH and generates a consecutive
number of faults according to fault bits F1 and F0. The
ALERT pin remains active until the temperature falls below
the indicated TLOW value for the same number of faults.
In Interrupt Mode (TM = 1), the ALERT pin becomes active
when the temperature equals or exceeds THIGH for a
consecutive number of fault conditions. The ALERT pin
remains active until a read operation of any register
occurs, or the device successfully responds to the SMBus
Alert Response Address. The ALERT pin is also cleared
if the device is placed in Shutdown Mode. Once the ALERT
pin is cleared, it only becomes active again by the
temperature falling below TLOW. When the temperature
falls below TLOW, the ALERT pin becomes active and
remain active until cleared by a read operation of any
register or a successful response to the SMBus Alert
Response Address. Once the ALERT pin is cleared, the
above cycle repeats, with the ALERT pin becoming active
when the temperature equals or exceeds THIGH. The
ALERT pin can also be cleared by resetting the device with
the General Call Reset command. This command also
clears the state of the internal registers in the device,
returning the device to Comparator Mode (TM = 0).
Table 9. Bytes 1 and 2 of THIGH Register
BYTE
D7
D6
D5
D4
D3
D2
D1
D0
1
L11
L10
L9
L8
L7
L6
L5
L4
BYTE
D7
D6
D5
D4
D3
D2
D1
D0
2
L3
L2
L1
L0
0
0
0
0
Table 10. Bytes 1 and 2 of TLOW Register
All 12 bits for the Temperature, THIGH, and TLOW registers
are used in the comparisons for the ALERT function for all
converter resolutions. The three LSBs in THIGH and TLOW
can affect the ALERT output even if the converter is
configured for 9-bit resolution.
SERIAL INTERFACE
The TMP275 operates only as a slave device on the
Two-Wire bus and SMBus. Connections to the bus are
made via the open-drain I/O lines SDA and SCL. The SDA
and SCL pins feature integrated spike suppression filters
and Schmitt triggers to minimize the effects of input spikes
and bus noise. The TMP275 supports the transmission
protocol for fast (1kHz to 400kHz) and high-speed (1kHz
to 3.4MHz) modes. All data bytes are transmitted MSB
first.
SERIAL BUS ADDRESS
To communicate with the TMP275, the master must first
address slave devices via a slave address byte. The slave
address byte consists of seven address bits, and a
direction bit indicating the intent of executing a read or
write operation.
The TMP275 features three address pins allowing up to
eight devices to be connected per bus. Pin logic levels are
described in Table 11. The address pins of the TMP275 are
read after reset, at start of communication, or in response
to a Two-Wire address acquire request. Following reading
the state of the pins the address is latched to minimize
power dissipation associated with detection.
7
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
A2
A1
A0
SLAVE ADDRESS
0
0
0
1001000
0
0
1
1001001
0
1
0
1001010
0
1
1
1001011
1
0
0
1001100
1
0
1
1001101
1
1
0
1001110
1
1
1
1001111
Table 11. Address Pins and Slave Addresses for
the TMP275
Figure 6 for details of this sequence. If repeated reads
from the same register are desired, it is not necessary to
continually send the Pointer Register bytes, as the
TMP275 remembers the Pointer Register value until it is
changed by the next write operation.
Note that register bytes are sent most-significant byte first,
followed by the least significant byte.
SLAVE MODE OPERATIONS
The TMP275 can operate as a slave receiver or slave
transmitter.
Slave Receiver Mode:
BUS OVERVIEW
The device that initiates the transfer is called a master, and
the devices controlled by the master are slaves. The bus
must be controlled by a master device that generates the
serial clock (SCL), controls the bus access, and generates
the START and STOP conditions.
To address a specific device, a START condition is
initiated, indicated by pulling the data-line (SDA) from a
HIGH to LOW logic level while SCL is HIGH. All slaves on
the bus shift in the slave address byte, with the last bit
indicating whether a read or write operation is intended.
During the ninth clock pulse, the slave being addressed
responds to the master by generating an Acknowledge
and pulling SDA LOW.
Data transfer is then initiated and sent over eight clock
pulses followed by an Acknowledge Bit. During data
transfer SDA must remain stable while SCL is HIGH, as
any change in SDA while SCL is HIGH is interpreted as a
control signal.
Once all data has been transferred, the master generates
a STOP condition indicated by pulling SDA from LOW to
HIGH, while SCL is HIGH.
WRITING/READING TO THE TMP275
Accessing a particular register on the TMP275 is
accomplished by writing the appropriate value to the
Pointer Register. The value for the Pointer Register is the
first byte transferred after the slave address byte with the
R/W bit LOW. Every write operation to the TMP275
requires a value for the Pointer Register. (Refer to
Figure 5.)
When reading from the TMP275, the last value stored in
the Pointer Register by a write operation is used to
determine which register is read by a read operation. To
change the register pointer for a read operation, a new
value must be written to the Pointer Register. This is
accomplished by issuing a slave address byte with the
R/W bit LOW, followed by the Pointer Register Byte. No
additional data is required. The master can then generate
a START condition and send the slave address byte with
the R/W bit HIGH to initiate the read command. See
8
The first byte transmitted by the master is the slave
address, with the R/W bit LOW. The TMP275 then
acknowledges reception of a valid address. The next byte
transmitted by the master is the Pointer Register. The
TMP275 then acknowledges reception of the Pointer
Register byte. The next byte or bytes are written to the
register addressed by the Pointer Register. The TMP275
acknowledges reception of each data byte. The master
may terminate data transfer by generating a START or
STOP condition.
Slave Transmitter Mode:
The first byte is transmitted by the master and is the slave
address, with the R/W bit HIGH. The slave acknowledges
reception of a valid slave address. The next byte is
transmitted by the slave and is the most significant byte of
the register indicated by the Pointer Register. The master
acknowledges reception of the data byte. The next byte
transmitted by the slave is the least significant byte. The
master acknowledges reception of the data byte. The
master may terminate data transfer by generating a
Not-Acknowledge on reception of any data byte, or
generating a START or STOP condition.
SMBus ALERT FUNCTION
The TMP275 supports the SMBus Alert function. When
the TMP275 is operating in Interrupt Mode (TM = 1), the
ALERT pin of the TMP275 may be connected as an
SMBus Alert signal. When a master senses that an ALERT
condition is present on the ALERT line, the master sends
an SMBus Alert command (00011001) on the bus. If the
ALERT pin of the TMP275 is active, the device
acknowledges the SMBus Alert command and responds
by returning its slave address on the SDA line. The eighth
bit (LSB) of the slave address byte indicates if the
temperature exceeding THIGH or falling below TLOW
caused the ALERT condition. This bit will be HIGH if the
temperature is greater than or equal to THIGH. This bit will
be LOW if the temperature is less than TLOW. Refer to
Figure 7 for details of this sequence.
If multiple devices on the bus respond to the SMBus Alert
command, arbitration during the slave address portion of
the SMBus Alert command determines which device will
clear its ALERT status. If the TMP275 wins the arbitration,
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
TIMING DIAGRAMS
its ALERT pin will become inactive at the completion of the
SMBus Alert command. If the TMP275 loses the
arbitration, its ALERT pin will remain active.
The TMP275 is Two-Wire and SMBus-compatible.
Figure 4 to Figure 7 describe the various operations on the
TMP275. Bus definitions are given below. Parameters for
Figure 4 are defined in Table 12.
GENERAL CALL
The TMP275 responds to a Two-Wire General Call
address (0000000) if the eighth bit is 0. The device
acknowledges the General Call address and responds to
commands in the second byte. If the second byte is
00000100, the TMP275 latches the status of the address
pins, but does not reset. If the second byte is 00000110,
the TMP275 latches the status of the address pins and
resets the internal registers to the power-up values.
Bus Idle: Both SDA and SCL lines remain HIGH.
Start Data Transfer: A change in the state of the SDA line,
from HIGH to LOW, while the SCL line is HIGH, defines a
START condition. Each data transfer is initiated with a
START condition.
HIGH-SPEED MODE
In order for the Two-Wire bus to operate at frequencies
above 400kHz, the master device must issue an Hs-mode
master code (00001XXX) as the first byte after a START
condition to switch the bus to high-speed operation. The
TMP275 will not acknowledge this byte, but will switch its
input filters on SDA and SCL and its output filters on SDA
to operate in Hs-mode, allowing transfers at up to 3.4MHz.
After the Hs-mode master code has been issued, the
master transmits a Two-Wire slave address to initiate a
data transfer operation. The bus continues to operate in
Hs-mode until a STOP condition occurs on the bus. Upon
receiving the STOP condition, the TMP275 switches the
input and output filters back to fast-mode operation.
Stop Data Transfer: A change in the state of the SDA line
from LOW to HIGH while the SCL line is HIGH defines a
STOP condition. Each data transfer is terminated with a
repeated START or STOP condition.
Data Transfer: The number of data bytes transferred
between a START and a STOP condition is not limited and
is determined by the master device. The receiver
acknowledges the transfer of data.
Acknowledge: Each receiving device, when addressed,
is obliged to generate an Acknowledge bit. A device that
acknowledges must pull down the SDA line during the
Acknowledge clock pulse in such a way that the SDA line
is stable LOW during the HIGH period of the Acknowledge
clock pulse. Setup and hold times must be taken into
account. On a master receive, the termination of the data
transfer can be signaled by the master generating a
Not-Acknowledge on the last byte that has been
transmitted by the slave.
TIMEOUT FUNCTION
The TMP275 resets the serial interface if either SCL or
SDA is held LOW for 54ms (typ) between a START and
STOP condition. The TMP275 releases the bus if it is
pulled LOW and waits for a START condition. To avoid
activating the timeout function, it is necessary to maintain
a communication speed of at least 1kHz for SCL operating
frequency.
FAST MODE
PARAMETER
SCL Operating Frequency
Bus Free Time Between STOP and START Condition
Hold time after repeated START condition.
After this period, the first clock is generated.
Repeated START Condition Setup Time
STOP Condition Setup Time
Data Hold Time
Data Setup Time
SCL Clock LOW Period
SCL Clock HIGH Period
Clock/Data Fall Time
Clock/Data Rise Time
for SCLK ≤ 100kHz
HIGH-SPEED MODE
UNITS
MIN
MAX
MIN
MAX
f(SCL)
t(BUF)
0.001
0.4
0.001
3.4
600
160
ns
t(HDSTA)
100
100
ns
t(SUSTA)
t(SUSTO)
t(HDDAT)
100
100
ns
100
100
ns
0
0
ns
t(SUDAT)
t(LOW)
t(HIGH)
tF
tR
tR
MHz
100
10
ns
1300
160
ns
600
60
ns
300
160
ns
300
1000
160
ns
ns
Table 12. Timing Diagram Definitions for the TMP275
9
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
TWO-WIRE TIMING DIAGRAMS
t(LOW)
tF
tR
t(HDSTA)
SCL
t(HDSTA)
t(HIGH)
t(SUSTO)
t(SUSTA)
t(HDDAT)
t(SUDAT)
SDA
t(BU F )
P
S
S
P
Figure 4. Two-Wire Timing Diagram
1
9
9
1
…
SCL
SDA
1
0
0
1
A2
A1
A0
R/W
Start By
Master
0
0
0
0
0
0
P1
…
P0
ACK By
TMP275
ACK By
TMP275
Frame 2 Pointer Register Byte
Frame 1 Two−Wire Slave Address Byte
1
9
1
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
ACK By
TMP275
Frame 3 Data Byte 1
ACK By
TMP275
Frame 4 Data Byte 2
Figure 5. Two-Wire Timing Diagram for TMP275 Write Word Format
10
D0
Stop By
Master
"#$%
www.ti.com
SBOS363A − JUNE 2006 − REVISED JUNE 2006
1
9
1
9
…
SCL
SDA
1
0
0
1
0
0
0
R/W
Start By
Master
0
0
0
0
0
0
P1
…
P0
ACK By
TMP275
ACK By
TMP275
Frame 1 Two−Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
…
SCL
(Continued)
SDA
(Continued)
1
0
0
0
1
0
0
D7
R/W
Start By
Master
D6
D5
D4
D3
D2
ACK By
TMP275
…
D0
From
TMP275
Frame 3 Two−Wire Slave Address Byte
1
D1
ACK By
Master
Frame 4 Data Byte 1 Read Register
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
From
TMP275
ACK By
Master
Stop By
Master
Frame 5 Data Byte 2 Read Register
NOTE: Address Pins A0, A1, A2 = 0
Figure 6. Two-Wire Timing Diagram for Read Word Format
ALERT
1
9
1
9
SCL
SDA
0
Start By
Master
0
0
1
1
0
0
R/W
1
0
0
1
0
ACK By
TMP275
Frame 1 SMBus ALERT Response Address Byte
0
0
From
TMP275
S ta tu s
NACK By
Master
Stop By
Master
Frame 2 Slave Address Byte
NOTE: Address Pins A0, A1, A2 = 0
Figure 7. Timing Diagram for SMBus ALERT
11
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TMP275AIDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TMP275AIDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TMP275AIDGKT
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TMP275AIDGKTG4
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated