INTEGRATED CIRCUITS DATA SHEET TZA1048 4-channel BTL driver for CD/DVD drives Product specification 2004 Mar 09 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives CONTENTS 12Soldering 12.1Introduction to soldering surface mount packages 12.2Reflow soldering 12.3Wave soldering 12.4Manual soldering 12.5Suitability of surface mount IC packages for wave and reflow soldering methods 13Data sheet status 14Definitions 15Disclaimers 1Features 2Applications 3General description 4Ordering information 5Block diagram 6Pinning 7Functional data 7.1General notes 8Limiting values 9Characteristics 10Test and application information 11Package outline 2004 Mar 09 TZA1048 2 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives 1 FEATURES 2 • Two Bridge-Tied Load (BTL) driver channels for sled and spindle motors and actuators APPLICATIONS • BTL driver for CD and DVD players. • Pulse Width Modulation (PWM) input 3 • Integral thermal shut-down circuit GENERAL DESCRIPTION The TZA1048 is a four-channel BTL driver IC for driving motors and actuators in CD and DVD players. Two reference voltage outputs are also available for peripheral ICs such as servo and pick-up head drivers. The spindle motor control inputs to the IC can be either differential or single-ended. • Integral mute control • Two regulated reference voltage outputs for other chips in system; 3.3 V and 1.8 V respectively • HSOP28 package. 4 TZA1048 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TZA1048TH 2004 Mar 09 HSOP28 DESCRIPTION plastic, heatsink small outline package; 28 leads 3 VERSION SOP007 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives 5 TZA1048 BLOCK DIAGRAM VOUT3.3 VFBIN3.3 VOUT1.8 VFBIN1.8 MUTE RADIN FOCIN 1.8 V GENERATOR 3.3 V GENERATOR 28 1 x1 27 x1 26 25 24 23 2 3 4 x1 MUTE 32.3 kΩ x1 24 kΩ 22 24 kΩ 5 6 VCC RADOUTN FOCOUTP GND FOCOUTN RADOUTP 32.3 kΩ 7 VCC 8 VCC TZA1048 32.3 kΩ SLIN VBIASIN 21 24 kΩ x1 20 32.3 kΩ GND VBIASOUT MOTBIAS MOTIN1 MOTIN2 x1 19 18 9 10 11 x0.5 17 32.3 kΩ 16 24 kΩ 15 24 kΩ x0.5 12 13 14 SLOUTP SLOUTN GND MOTOUTP MOTOUTN VCC mce470 Fig.1 Block diagram. 2004 Mar 09 4 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives 6 TZA1048 PINNING SYMBOL PIN DESCRIPTION VCC 1 supply voltage RADOUTN 2 radial coil driver negative output FOCOUTP 3 focus coil driver positive output GND 4 ground FOCOUTN 5 focus coil driver negative output RADOUTP 6 radial coil driver positive output VCC 7 supply voltage VCC 8 supply voltage SLOUTP 9 sled motor driver positive output SLOUTN 10 sled motor driver negative output GND 11 ground MOTOUTP 12 spindle motor driver positive output MOTOUTN 13 spindle motor driver negative output VCC 14 supply voltage MOTIN2 15 spindle motor driver input 2 MOTIN1 16 spindle motor driver input 1 MOTBIAS 17 spindle motor bias input VBIASOUT 18 1.65 V bias voltage output GND 19 ground VBIASIN 20 bias voltage input SLIN 21 sled motor driver input FOCIN 22 focus coil driver input RADIN 23 radial coil driver input MUTE 24 mute control input VFBIN1.8 25 1.8 V generator/regulator feedback voltage input VOUT1.8 26 1.8 V generator/regulator output VFBIN3.3 27 3.3 V generator/regulator feedback voltage input VOUT3.3 28 3.3 V generator/regulator output 2004 Mar 09 5 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives 7 7.1 VCC 1 28 VOUT3.3 RADOUTN 2 27 VFBIN3.3 FOCOUTP 3 26 VOUT1.8 GND 4 25 VFBIN1.8 FOCOUTN 5 24 MUTE RADOUTP 6 23 RADIN VCC 7 22 FOCIN General notes 2. Mute mode is activated when the voltage at pin MUTE is below 0.5 V, and deactivated when the voltage at pin MUTE is above 1.2 V. In mute mode, both positive and negative output terminals will be at high-impedance state. However, the 3.3 V and 1.8 V outputs are not affected. 3. It is recommended that a 220 µF decoupling capacitor is connected between pins VCC and pin GND and physically located as close as possible to these supply pins. VCC 8 21 SLIN SLOUTP 9 20 VBIASIN 4. The positive outputs of the focus, radial and sled driver channels are in phase with their respective input signals. The positive output of the spindle driver channel is in phase with the input signal on pin MOTIN1. 19 GND 18 VBIASOUT GND 11 FUNCTIONAL DESCRIPTION 1. The integral thermal shut-down circuit mutes the output current when the chip temperature reaches 175 °C (typical). The hysteresis is set to 25 °C (typical), so the circuit will restart when the chip temperature falls to 150 °C (typical). TZA1048TH SLOUTN 10 TZA1048 MOTOUTP 12 17 MOTBIAS MOTOUTN 13 16 MOTIN1 VCC 14 15 MOTIN2 5. The values of the resistors connected to each input channel must be equal to, or larger than, 4.7 kΩ to ensure that the gain of each input stage is less than, or equal to 1. mce471 6. The GND pins are internally connected to heat dissipation fins within the package. You must ensure that these pins are connected to an external ground. 7. The 1.65 V bias voltage output from pin VBIASOUT is derived from the internal 3.3 V generator/regulator, and will be affected by any variation in the 3.3 V generator/regulator voltage. Fig.2 Pin configuration. 2004 Mar 09 6 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage − 13.5 V P power dissipation − 1.7 W Toper operating temperature 0 70 °C Tstg storage temperature −55 +150 °C 9 CHARACTERISTICS Tamb = 25 °C; VCC = 9 V; RL = 8 Ω; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT B bandwidth 20 25 100 kHz VCC power supply 6 9 13 V PSRR power supply rejection ratio at VCC = 5 V 30 38 − dB Iq quiescent current unloaded − 20.3 36 mA Istb standby current mute mode active; unloaded − 2.1 10 mA VMUTE(L) low level voltage on pin MUTE; mute mode active 0 − 0.8 V VMUTE(H) high level voltage on pin MUTE; mute mode inactive 2 − 5 V − ± 20 ± 50 mV 250 300 − mA Radial coil driver VOO(rad) output offset voltage Icon(rad) maximum constant current Ip(max)(rad) maximum peak current RL = 8 Ω 250 430 − mA Grad gain VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 kΩ; note 1 6 7 8 dB − ± 20 ± 50 mV RL = 8 Ω Focus coil driver VOO(foc) output offset voltage Icon(foc) maximum constant current RL = 8 Ω 250 300 − mA Ip(max)(foc) maximum peak current RL = 8 Ω 370 430 − mA Gfoc gain VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 kΩ; note 1 6 7 8 dB Sled motor driver VOO(sle) output offset voltage − ± 20 ± 50 mV Icon(sle) maximum constant current RL = 8 Ω 200 300 − mA Ip(sle) maximum peak current RL = 8 Ω 370 430 − mA Gsle gain VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 kΩ; note 1 6 7 8 V/V 2004 Mar 09 7 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives SYMBOL PARAMETER TZA1048 CONDITIONS MIN. TYP. MAX. UNIT Spindle motor driver VOO(spin) output offset voltage − ±10 ±50 mV Icon(spin) maximum constant current RL = 4 Ω 400 430 − mA Ip(spin) maximum peak current RL = 4 Ω 560 600 − mA Gspin gain VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 kΩ; note 1 1 1.12 1.26 V/V 3.3 V generator Vfb(3.3) feedback voltage 3.1 3.3 3.5 V IO(3.3) output current 3 4.4 5 mA 1.8 V generator Vfb(1.8) feedback voltage 1.7 1.8 1.9 V IO(1.8) output current 3 4.2 5 mA Note 1. For gain measurements, only the channel being tested is active, the others are inactive; see Fig.4. 2004 Mar 09 8 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 10 TEST AND APPLICATION INFORMATION MCE472 3 handbook, halfpage P (W) 2 1 0 0 50 100 150 200 Tamb (˚C) 70 × 70 × 1.6 mm glass epoxy board. At temperatures above Tamb = 25 °C, power dissipation is de-rated at 13.6 mW/°C. Fig.3 Power dissipation as a function of ambient temperature. 2004 Mar 09 9 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 Q1 3.3 V GENERATOR VOUT3.3 28 1.8 V GENERATOR 3.3 V x1 VFBIN3.3 27 47 µF 1 Q2 x1 VOUT1.8 26 VCC 12 V 220 µF 2 RADOUTN 3 FOCOUTP 1.8 V VFBIN1.8 25 47 µF MUTE 24 4.7 kΩ RADIN 23 4 MUTE x1 32.3 kΩ GND 8Ω 8Ω 5 FOCOUTN x1 24 kΩ 6 RADOUTP 4.7 kΩ FOCIN 22 24 kΩ 32.3 kΩ 7 VCC 12 V VCC 12 V TZA1048 32.3 kΩ 4.7 kΩ SLIN 21 24 kΩ 8 x1 VBIASIN 20 32.3 kΩ GND x1 19 8Ω 10 SLOUTN VBIASOUT 18 11 MOTBIAS 17 MOTIN1 16 9 SLOUTP 32.3 kΩ x0.5 x0.5 24 kΩ 12 MOTOUTP 8Ω 13 MOTOUTN 4.7 kΩ Vs MOTIN2 15 24 kΩ 14 4.7 kΩ VCC mce473 Fig.4 Gain test configuration. 2004 Mar 09 GND 10 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 handbook, full pagewidth 12 V 1 28 2 27 3 26 4 25 5 24 6 23 7 22 Q1 3.3 V 220 µF radial coil focus coil 12 V 47 µF Q2 1.8 V 47 µF TZA1048 12 V sled motor 12 V spindle motor 8 21 9 20 10 19 11 18 12 17 13 16 14 15 M SLED COIL SERVO/COIL DRIVER M FORWARD M SPINDLE MOTOR1 SPINDLE MOTOR2 MUTE MICROCONTROLLER loading motor REVERSE MCE474 Fig.5 Spindle motor differential control application. 2004 Mar 09 FOCUS RADIAL COIL COIL 11 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 handbook, full pagewidth 12 V 1 28 2 27 3 26 4 25 5 24 6 23 7 22 Q1 3.3 V 220 µF radial coil focus coil 12 V 47 µF Q2 1.8 V 47 µF TZA1048 12 V sled motor 12 V spindle motor 8 21 9 20 10 19 11 18 12 17 13 16 14 15 M SLED COIL SERVO/COIL DRIVER M M FORWARD loading motor REVERSE SPINDLE MOTOR1 MUTE MICROCONTROLLER MCE475 Fig.6 Spindle motor single-ended application. 2004 Mar 09 FOCUS RADIAL COIL COIL 12 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 11 PACKAGE OUTLINE HSOP28: plastic, heatsink small outline package; 28 leads SOP007 D E c X y HE 28 15 A A2 A1 Lp 1 detail X 14 b L b1 e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 max b b1 c D (1) E (1) e HE L Lp y mm 2.31 0.20 0.05 2.2 5.25 5.05 0.45 0.30 0.30 0.23 18.67 18.41 7.75 7.49 0.8 10.02 9.62 1.1 1.0 0.4 0.089 Note 1. Plastic or metal protrusions are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 03-07-28 SOP007 2004 Mar 09 EUROPEAN PROJECTION 13 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives To overcome these problems the double-wave soldering method was specifically developed. 12 SOLDERING 12.1 Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 12.2 TZA1048 – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. – for all BGA, HTSSON-T and SSOP-T packages 12.4 – for packages with a thickness ≥ 2.5 mm Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 12.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. 2004 Mar 09 Manual soldering 14 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives 12.5 TZA1048 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable PLCC(5), SO, SOJ suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages. 2004 Mar 09 15 Philips Semiconductors Product specification 4-channel BTL driver for CD/DVD drives TZA1048 13 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 14 DEFINITIONS 15 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Mar 09 16 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R04/01/pp17 Date of release: 2004 Mar 09 Document order number: 9397 750 11572