HITACHI MEJ02C2016_M5M5J167KT

To all our customers
Regarding the change of names mentioned in the document, such as Mitsubishi
Electric and Mitsubishi XX, to Renesas Technology Corp.
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been
made to the contents of the document, and these changes do not constitute any alteration to the
contents of the document itself.
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices
and power devices.
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5J167KT is a f amily of low v oltage 16Mbit static RAMs
organized as 1048576-words by 16-bit / 2097152-words by 8-bit,
f abricated by
Mitsubishi's high-perf ormance 0.18µm CMOS
technology .
The M5M5J167KT is suitable f or memory applications where a
simple interf acing , battery operating and battery backup are
the important design objectiv es.
The M5M5J167KT is made by stacked-micro-package technology
and two chips of 8Mbits SRAMs are assembled in one package.
By using this package technology , small package size can be
achiev ed f or highdensity SRAM.
The M5M5J167KT is packaged in a 52pin-µTSOP with the outline
of 10.79mm x 10.49mm, and pin pitch of 0.40mm. It giv es the
best solution f or a compaction of m ounting area as well as
f lexibility of wiring pattern of printed circuit boards.
The operating temperature range is -40 ~ +85°C
FEATURES
-
Single 2.7~3.6V power supply
Small stand-by current: 0.2µA (2.0V, ty p.)
No clocks, No ref resh
Data retention supply v oltage =2.0~3.6V
All inputs and outputs are TTL compatible.
Easy memory expansion by S1#, S2, BC1# and BC2#
Common Data I/O
Three-state outputs: OR-tie capability
OE prev ents data contention in the I/O bus
By te f unction (x8 mode) av ailable by By te# & A-1.
Process technology : 0.18µm CMOS
Package: 52pin 10.79mm x 10.49mm µTSOP
[0.4mm pin pitch]
Stand-by c urrent
Operating
temperature
-40 ~ +85°C
Part name
Power Access time * Ty pical
Ratings (max.)
Supply
max.
25ºC 40ºC 25ºC 40ºC 70ºC 85ºC
M5M5J167KT -70HI 2.7 ~ 3.6V
70ns
2.0
2.4
10
PIN CONFIGURATION
16
40
Active
current
Icc1
(3.3V, Ty p.)
80
30mA
(10MHz)
5mA
(1MHz)
* Typical parameter indicates the value for the center
of distribution, and not 100% tested.
A15
1
52
A14
2
51
BYTE#
A13
3
50
BC2#
A12
4
49
GND
A11
5
48
A10
6
47
BC1#
DQ16/A-1
A9
7
46
A8
8
45
DQ8
DQ15
A19
9
44
DQ7
S1#
W#
10
43
DQ14
11
42
DQ6
NC
12
41
DQ13
A16
NC
13
40
DQ5
VCC
14
39
NC
S2
15
38
NC
16
37
DQ12
DQ4
NC
17
36
DQ11
A18
18
35
DQ3
A17
A7
19
34
DQ10
20
33
DQ2
A6
21
32
DQ9
A5
22
31
DQ1
A0 ~ A18
Function
Address input
Address input
A19
DQ1 ~ DQ16 Data input / output
Chip select input 1
S1#
S2
Chip select input 2
W#
Write control input
OE#
BC1#
Output enable input
Lower By te (DQ1 ~ 8)
BC2#
Upper By te (DQ9 ~ 16)
BYTE#
By te (x8 mode) enable input
OE#
Vcc
Power supply
GND
Ground supply
28
GND
NC
27
A0
A4
23
30
A3
24
29
A2
25
A1
26
10.49mm
Pin
Outline: 52PTG-A
N C : No Connection
1
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
FUNCTION
The M5M5J167KT is organized as 1048576-words by 16bit / 2097152-words by 8-bit. These dev ices operate on a
single +2.7~3.6V power supply , and are directly TTL
compatible to both input and output. Its f ully static circuit
needs no clocks and no ref resh, and makes it usef ul.
The operation mode are determined by a combination of
the dev ice control inputs BC1# , BC2# , S1#, S2 , W#,
OE# and BY TE#. Each mode is summarized in the f unction
table. The address select A19 can select either one
8MSRAM chip or another 8MSRAM chip.
A write operation is executed whenev er the low lev el W#
ov erlaps with the low lev el BC1# and/or BC2# and the low
lev el S1# and the high lev el S2. The address (A-1~A19 :
By te mode, A0~A19 : Word mode) must be set up bef ore
the write cy c le and must be stable during the entire cy cle.
A read operation is executed by s etting W# at a high
lev el and OE# at a low lev el while BC1# and/or BC2# and
S1#and S2 are in an activ e state (S1#=L, S2=H).
When setting BYTE# at a low lev el, the f unction will be
in the x8 mede, which is, DQ1-8 are av ailable and DQ9-16
are not av ailable. In the x8 mode, A-1 is used as the
additional address. During the activ e f unction f or x8 mode,
BC1# BC2# must be low lev el.
When setting BC1# and BC2# at a high lev el or S1# at
a high lev el or S2 at a low lev el, the chips are in a nonselectable mode in which both reading and writing are
disabled.
In this mode, the output stage is in a high-impedance state,
allowing OR-tie with other chips and memory expansion by
BC1#, BC2# and S1#, S2.
The power supply c urrent is reduced as low as 0.2µA
(25°C, ty pical), and the memory data can be held at +2.0V
power supply , enabling battery back-up operation during
power f ailure or power-down operation in the non-selected
mode.
FUNCTION TABLE
S1#
S2
BYTE# BC1# BC2#
W#
OE#
Mode
DQ1~8 DQ9~15
DQ16
Icc
H
H
X
X
X
L
X
X
X
X
X
X
X
X
Non selection
High-Z
High-Z
High-Z
Standby
Non selection
High-Z
High-Z
High-Z
Standby
X
X
H
H
H
X
X
Non selection
High-Z
High-Z
High-Z
Standby
L
H
H
L
H
L
X
Write
Din
High-Z
High-Z
Active
L
L
H
H
L
H
H
H
L
H
H
L
Read
Dout
High-Z
High-Z
Active
H
H
-------
High-Z
High-Z
High-Z
Active
L
H
H
H
L
L
X
Write
High-Z
Din
Din
Active
L
H
H
H
L
H
L
Read
High-Z
Dout
Dout
Active
L
H
L
H
H
H
L
H
H
-------
High-Z
High-Z
High-Z
Active
H
L
L
L
X
Write
Din
Din
Din
Active
L
H
H
L
L
H
L
Read
Dout
Dout
Dout
Active
L
H
H
L
L
H
H
-------
High-Z
High-Z
High-Z
Active
L
H
L
L
L
L
X
Write
Din
High-Z
A-1
Active
L
H
L
L
L
H
L
Read
Dout
High-Z
A-1
Active
L
H
L
L
L
H
H
-------
High-Z
High-Z
A-1
Active
Note1 : "H" and "L" in this table mean VIH and VIL, respectiv ely .
Note2 : "X" in this table should be "H" or "L".
2
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
BLOCK DIAGRAM
8MS(1)
DQ1
A0
A 18
524288WORDS X
16 BITS
or
1048576WORDS X
8 BITS
DQ 8
DQ 9
S2
S1#
CLOCK
GENERATOR
DQ 16 /
A-1
BC1#
BC2#
x8/x16
Switching
circuit
VCC
BYTE#
GND
W#
OE#
A 19
8MS(2)
3
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Vcc
VI
VO
Pd
Ta
T stg
Parameter
Conditions
Supply v oltage
Input v oltage
With respect to GND
Output v oltage
With respect to GND
Power dissipation
Ta = 25°C
With respect to GND
Operating temperature
Storage temperature
Units
Ratings
- 0.3 * ~ +4.6
- 0.3 * ~ Vcc + 0.3 (max. 4.6V)
0 ~ Vcc
700
-40 ~ +85
- 65 ~ +150
V
mW
ºC
ºC
* -3.0V in case of AC (Pulse<
=width
DC ELECTRICAL CHARACTERISTICS
Symbol
(Ta=-40~85ºC Vcc=2.7V~3.6V,unless otherwise noted)
Parameter
Limits
Conditions
Min
Ty p
High-lev el input v oltage
2.2
Vcc+0.2V
Low-lev el input v oltage
- 0.2 *
2.4
0.6
Icc 1
Activ e supply c urrent
( AC,MOS lev el )
BC1# and BC2# < 0.2V, S1# < 0.2V, S2 >Vcc-0.2V
other inputs < 0.2V or > Vcc-0.2V
f = 10MHz
Output - open (duty 100%)
f = 1MHz
BC1# and BC2#=V IL , S1#=V IL ,S2=V IH
other pins =V IH or V IL
Output - open (duty 100%)
f = 10MHz
Icc 2
Activ e supply c urrent
( AC,TTL lev el )
-
f = 1MHz
I OH= - 0.5mA
Low-lev el output v oltage I OL= 2.0mA
Input leakage current
V I =0 ~ Vcc
High-level output voltage
BYTE# > Vcc - 0.2V or < 0.2V,
other inputs = 0 ~ Vcc
(2) S2 < 0.2V,
Icc 3
Stand by s upply current
( AC,MOS lev el )
BYTE# > Vcc - 0.2V or < 0.2V,
other inputs = 0 ~ Vcc
(3) BC1# and BC2# > Vcc - 0.2V
S1# < 0.2V, S2 > Vcc - 0.2V
BYTE# > Vcc - 0.2V or < 0.2V,
A19 > Vcc - 0.2V or < 0.2V
other inputs = 0 ~ Vcc
Icc 4
Stand by s upply current
( AC,TTL lev el )
-
30
5
30
5
0.4
±1
±1
50
15
50
15
~ +25°C
-
2.0
10
~ +40°C
-
2.4
16
~ +70°C
-
-
40
~ +85°C
-
-
80
-
-
2.0
BC1# and BC2#=VIH or S1#=VIH or S2=VIL or OE#=VIH, VI/O=0 ~ Vcc
(1) S1# > Vcc - 0.2V and S2 > Vcc - 0.2V,
BC1# and BC2# =VIH or S1# =VIH or S2=VIL
BYTE# > Vcc - 0.2V or < 0.2V,
A19 =V IH or V IL
Other inputs= 0 ~ Vcc
Note 3: Direction for current flowing into IC is indicated as positive (no mark)
Note 4: Typical parameter indicates the value for the center of distribution at 3.0V, and not 100% tested.
Units
Max
V IH
V IL
V OH
V OL
II
IO
Output leakage current
30ns)
V
µA
mA
µA
mA
* -1.0V in case of AC (Pulse width
<
=
30ns)
CAPACITANCE (Ta=-40~+85ºC Vcc=2.7V~3.6V,unless otherwise noted)
Symbol
CI
CO
Parameter
Conditions
Min
Limits
Ty p
Max
Input capacitance
V I =GND, VI =25mVrms, f =1MHz
20
Output capacitance
V O = GND,VO =25mVrms, f =1MHz
20
Units
pF
4
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
AC ELECTRICAL CHARACTERISTICS (Ta=-40~+85ºC, Vcc=2.7V~3.6V,unless otherwise noted)
(1) TEST CONDITIONS
1TTL
2.7~3.6V
Input pulse
V IH=2.7V, V IL=0.2V
Input rise time and f all time 5ns
Supply v oltage
DQ
CL
Transition is measured ±200mV from
steady state voltage.(for ten,tdis)
Ref erence lev el
V OH=V OL=1.5V
Output loads
Fig.1,CL=30pF
CL=5pF (for ten,tdis)
Including scope and
jig capacitance
Fig.1 Output load
(2) READ CYCLE
t CR
t a(A)
t a(S1)
t a(S2)
t a(BC1)
t a(BC2)
t a(OE)
t dis (S1)
t dis (S2)
t dis (BC1)
t dis (BC2)
t dis (OE)
t en(S1)
t en(S2)
t en(BC1)
t en(BC2)
t en(OE)
t V(A)
Limits
70HI
Parameter
Symbol
Read cy cle time
Address access time
Chip select 1 access time
Chip select 2 access time
By te control 1 access time
By te control 2 access time
Output enable access time
Output disable time af t er S1# high
Output disable time af t er S2 low
Output disable time af t er BC1# high
Output disable time af t er BC2# high
Output disable time af t er OE# high
Output enable time af ter S1# low
Output enable time af ter S2 high
Output enable time af ter BC1# low
Output enable time af ter BC2# low
Output enable time af ter OE# low
Data v alid time after address
Min
70
Units
Max
70
70
70
70
70
35
25
25
25
25
25
10
10
5
5
5
10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(3) WRITE CYCLE
Symbol
t CW
t w(W)
t su(A)
t su(A-WH)
t su(BC1)
t su(BC2)
t su(S1)
t su(S2)
t su(D)
t h(D)
t rec (W)
t dis (W)
t dis (OE)
t en(W)
t en(OE)
Limits
70HI
Parameter
Write cy cle time
Write pulse width
Address setup time
Address setup time with respect to W#
By te control 1 setup time
By te control 2 setup time
Chip select 1 setup time
Chip select 2 setup time
Data setup time
Data hold time
Write recov ery time
Output disable time f rom W# low
Output disable time f rom OE# high
Output enable time f rom W# high
Output enable time f rom OE# low
Min
70
55
0
65
65
65
65
65
35
0
0
Max
25
25
5
5
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
(4) Byte# function
Limits
Symbol
tsu (BYTE)
trec (BYTE)
Parameter
Test conditions
Min
/ BYTE set up time
Ty p
Max
5
5
/ BYTE recov ery time
Units
ms
ms
(5) TIMING DIAGRAMS
BYTE#
S2
S1#
t su (BYTE)
t rec (BYTE)
BYTE#
Read cycle
t CR
A 0~19
(Word Mode)
A -1~19
t a(A)
(Byte Mode)
BC1#,
BC2#
t v (A)
t a(BC1) or t a(BC2)
(Note5)
t dis (BC1) or t dis (BC2)
(Note5)
t a(S1)
S1#
(Note5)
t dis (S1)
(Note5)
t dis (S2)
(Note5)
t a(S2)
S2
(Note5)
t a (OE)
OE#
(Note5)
W# = "H" lev el
DQ 1~16
(Word Mode)
DQ 1~8
(Byte Mode)
t en (OE)
t en (BC1)
t en (BC2)
t en (S1)
t en (S2)
t dis (OE)
(Note5)
VALID DATA
6
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
Write cycle( W# control mode )
A 0~19
t CW
(Word Mode)
A -1~19
(Byte Mode)
t su (BC1) or t su (BC2)
BC1#,
BC2#
(Note5)
(Note5)
t su (S1)
S1#
(Note5)
(Note5)
S2
t su (S2)
(Note5)
(Note5)
OE#
t su (A)
t su (A-WH)
t w (W)
t rec (W)
t dis (W)
W#
t en (OE)
t en (W)
t dis (OE)
DQ 1~16
(Word Mode)
DATA IN
STABLE
DQ 1~8
(Byte Mode)
t su (D)
Write cycle (BC# control mode)
A 0~19
(Word Mode)
t h (D)
t CW
A -1~19
(Byte Mode)
t su (A)
BC1#,
BC2#
t su (BC1) or
t su (BC2)
t rec (W)
S1#
(Note5)
(Note5)
S2
(Note5)
W#
DQ 1~16
(Note5)
(Note7)
(Note6)
(Note5)
t su (D)
t h (D)
(Note5)
(Word Mode)
DQ 1~8
DATA IN
STABLE
(Byte Mode)
Note 5: Hatching indicates the state is "don't care".
Note 6: A Write occurs during S1# low, S2 high ov erlaps BC1# and/or BC2# low and W# low.
Note 7: When the f alling edge of W# is simultaneously or prior to the f alling edge of BC1# and/or BC2# or the f alling edge of
S1# or rising edge of S2, the outputs are maintained in the high impedance state.
Note 8: Don't apply inv erted phase signal externally when DQ pin is in output mode.
7
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
Write cycle (S1# control mode)
t CW
A 0~19
(Word Mode)
A -1~19
(Byte Mode)
BC1#,
BC2#
(Note5)
t su (A)
t su (S1)
t rec (W)
(Note5)
S1#
S2
(Note5)
(Note5)
(Note7)
W#
(Note6)
(Note5)
t su (D)
DQ 1~16
t h (D)
(Note5)
(Word Mode)
DATA IN
STABLE
DQ 1~8
(Byte Mode)
Write cycle (S2 control mode)
A 0~19
t CW
(Word Mode)
A -1~19
(Byte Mode)
BC1#,
BC2#
(Note5)
t su (A)
t su (S2)
t rec (W)
(Note5)
S1#
(Note5)
(Note5)
S2
(Note7)
W#
(Note6)
(Note5)
DQ 1~16
(Word Mode)
t su (D)
t h (D)
(Note5)
DATA IN
STABLE
DQ 1~8
(Byte Mode)
8
MITSUBISHI LSIs
Jan.10,2003 Ver. 2.1
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
POWER DOWN CHARACTERISTICS
(1) ELECTRICAL CHARACTERISTICS (Ta=-40~85ºC, Vcc=2.7V~3.6V,unless otherwise noted)
Symbol
Vcc
Parameter
Test conditions
Min
(PD) Power down supply voltage
V
2.0
V I (S1#)
Chip select input S1#
2.0
V I (S2)
Chip select input S2
Vcc=2.0V
(1) S1# > Vcc - 0.2V, BYTE# > Vcc - 0.2V or < 0.2V
other inputs = 0 ~ Vcc
(2) S2 < 0.2V , BYTE# > Vcc - 0.2V or < 0.2V
other inputs = 0 ~ Vcc
(3) BC1# and BC2# > Vcc - 0.2V
S1# < 0.2V, S2 > Vcc - 0.2V
BYTE# > Vcc - 0.2V or < 0.2V
other inputs = 0 ~ Vcc
~ +25°C
-
0.2
3.0
~ +40°C
-
0.4
6.0
~ +70°C
-
-
30
60
~ +85°C
µA
Note 9: Typical parameter of Icc(PD) indicates the value for the
center of distribution at 2.0V, and not 100% tested.
(2) TIMING REQUIREMENTS
t su (PD)
t rec (PD)
V
0.2
Power down
supply c urrent
Symbol
Units
V
Byte control input
BC1# & BC2#
(PD)
Max
2.0
V I (BC)
Icc
Limits
Ty p
Parameter
Test conditions
Min
Limits
Ty p
Max
0
5
Power down set up time
Power down recov ery t ime
Units
ns
ms
(3) TIMING DIAGRAM
note10: On the BC# control mode, the lev el of S1# and S2 must be f ixed
BC# control mode
at S1#, S2, A19 > Vcc-0.2V or S2 <0.2V
Vcc
t su (PD)
2.7V
2.7V
t rec (PD)
2.2V
2.2V
BC1#
BC2#
BC1# , BC2# > Vcc - 0.2V
note11: On the S1# control mode, the lev el of S2 must be f ixed
S1# control mode
Vcc
at S2 > Vcc-0.2V or S2 <0.2V
t su (PD)
2.7V
2.7V
t rec (PD)
2.2V
2.2V
S1# > Vcc - 0.2V
S1#
S2 control mode
Vcc
S2
t su (PD)
2.7V
2.7V
t rec (PD)
0.2V
0.2V
S2 < 0.2V
9
Jan.10,2003 Ver. 2.1
MITSUBISHI LSIs
M5M5J167KT - 70HI
16777216-BIT (1048576-WORD BY 16-BIT / 2097152-WORD BY 8-BIT) CMOS STATIC RAM
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products betterand more
reliable, but there isalways the possibility that trouble may occur with them. Trouble with semiconductors may lead
to personal injury, fire or property damage. Remember to give due consideration to safety when making your
circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
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