MITSUBISHI M5M5W816TP-70HI

2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
Those are summarized in the part name table below.
FEATURES
DESCRIPTION
The M5M5W816TP is a f amily of low v oltage 8-Mbit static
RAMs organized as 524288-words by 16-bit, f abricated by
Mitsubishi's high-perf ormance 0.18µm CMOS technology .
The M5M5W816TP is suitable f or memory applications
where a simple interf acing , battery operating and battery
backup are the important design objectiv es.
The M5M5W816TP is packaged in a 44pin thin small
outline mount dev ice, with the outline of 400mil TSOP
TY PE(II). It giv es the best solution f or a compaction of
mounting area as well as f lexibility of wiring pattern of
printed circuit boards.
The operating temperature range is -40~+85°C
Version,
Power
Supply
Operating
temperature
Part name
I-version
M5M5W816TP -70HI
-40~+85°C
M5M5W816TP -85HI
Access time
max.
-
Single 2.7~3.0V power supply
Small stand-by current: 0.2µA (3.0V, ty p.)
No clocks, No ref resh
Data retention supply v oltage =2.0V
All inputs and outputs are TTL compatible.
Easy memory expansion by S#, BC1# and BC2#
Common Data I/O
Three-state outputs: OR-tie capability
OE# prev ents data contention in the I/O bus
Process technology : 0.18µm CMOS
Package: 44pin 400mil TSOP TYPE(II)
Stand-by c urrent
Ratings (max.)
* Ty pical
25°C 40°C 25°C 40°C 70°C 85°C
70ns
2.7~3.0V
0.5
1.0
2
85ns
4
20
40
Activ e
current
Icc1
*(ty p.)
40mA
(10MHz)
5mA
(1MHz)
* Typical parameter indicates the value for the
center of distribution, and not 100% tested.
PIN CONFIGURATION
A4
A3
A2
A1
A0
S#
DQ1
DQ2
DQ3
DQ4
1
44
2
43
3
42
4
41
5
40
6
39
7
38
8
37
9
36
10
35
A5
A6
A7
OE#
BC2#
BC1#
DQ16
DQ15
DQ14
DQ13
V CC
11
34
GND
GND
DQ5
DQ6
DQ7
DQ8
W#
A15
A14
A13
A12
A16
12
33
V CC
13
32
DQ12
DQ11
DQ10
DQ9
A18
A8
A9
A10
A11
A17
14
31
15
30
16
29
17
28
18
27
19
26
20
25
21
24
22
23
Pin
A0 ~ A18
Function
Address input
DQ1 ~ DQ16 Data input / output
44Pin 400mil TSOP
S#
W#
OE#
Chip select input
BC1#
Lower By te (DQ1 ~ 8)
BC2#
Upper By te (DQ9 ~ 16)
Vcc
Power supply
GND
Ground supply
Write control input
Output enable input
Outline: 44P3W
NC: No Connection
MITSUBISHI ELECTRIC
1
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
FUNCTION
The M5M5W816TP is organized as 524288-words by 16bit. These dev ices operate on a single +2.7~3.0V power
supply , and are directly TTL compatible to both input and
output. Its f ully s t atic circuit needs no clocks and no
ref resh, and makes it usef ul.
The operation mode are determined by a combination of
the dev ice control inputs BC1# , BC2# , S# , W# and
OE#. Each mode is summarized in the f unction table.
A write operation is executed whenev er the low lev el W#
ov erlaps with the low lev el BC1# and/or BC2# and the low
lev el S#. The address(A0~A18) must be set up bef ore the
write cy c le and must be stable during the entire cy c le.
A read operation is executed by s etting W# at a high
lev el and OE# at a low lev el while BC1# and/or BC2# and
S# are in an activ e state(S#=L).
When setting BC1# at the high lev el and other pins are
in an activ e stage , upper-by t e are in a selectable mode in
which both reading and writing are enabled, and lower-by t e
are in a non-selectable mode. And when setting BC2# at a
high lev el and other pins are in an activ e stage, lowerby t e are in a selectable mode and upper-by te are in a
non-selectable mode.
The operating temperature range is -40 ~ +85°C
When setting BC1# and BC2# at a high lev el or S# at a high
lev el, the chips are in a non-selectable mode in which both
reading and writing are disabled. In this mode, the output
stage is in a high-impedance state, allowing OR-tie with other
chips and memory expansion by BC1#, BC2# and S#.
The power supply c urrent is reduced as low as 0.1µA(25°C,
ty pical), and the memory data can be held at +2.0V power
supply , enabling battery back-up operation during power
f ailure or power-down operation in the non-selected mode.
FUNCTION TABLE
S# BC1# BC2# W# OE#
H
X
L
L
L
L
L
L
L
L
L
X
H
L
L
L
H
H
H
L
L
L
X
H
H
H
H
L
L
L
L
L
L
X
X
L
H
H
L
H
H
L
H
H
X
X
X
L
H
X
L
H
X
L
H
Mode
Non selection
Non selection
Write
Read
Write
Read
Write
Read
DQ1~8
High-Z
High-Z
Din
Dout
High-Z
High-Z
High-Z
High-Z
Din
Dout
High-Z
DQ9~16
Icc
High-Z Standby
High-Z Standby
High-Z Activ e
High-Z Activ e
High-Z Activ e
Din
Activ e
Dout
Activ e
High-Z Activ e
Din
Activ e
Dout
Activ e
High-Z Activ e
BLOCK DIAGRAM
A0
DQ
1
A1
MEMORY ARRAY
DQ
8
524288 WORDS
x 16 BITS
A 17
-
DQ
9
A 18
CLOCK
GENERATOR
S#
DQ
16
BC1#
Vcc
BC2#
W#
GND
OE#
MITSUBISHI ELECTRIC
2
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Vcc
VI
VO
Pd
Power dissipation
Ta
Operating
temperature
T stg
Conditions
Supply v oltage
Input v oltage
With respect to GND
Output v oltage
With respect to GND
-0.3 * ~ +4.6
-0.3 * ~ Vcc + 0.3 (max. 4.6V)
0 ~ Vcc
700
With respect to GND
Ta=
Units
Ratings
25°C
Storage temperature
V
mW
- 40 ~ +85
°C
- 65 ~ +150
°C
* -3.0V in case of AC (Pulse width <
= 30ns)
( Vcc=2.7 ~ 3.0V, unless otherwise noted)
DC ELECTRICAL CHARACTERISTICS
Symbol
V IH
V IL
V OH
V OL
II
IO
Parameter
Limits
Conditions
Min
High-lev el input v oltage
Low-lev el input v oltage
High-level output voltage
Low-lev el output v oltage
Input leakage current
Output leakage current
I OH= - 0.5mA
I OL=2mA
V I =0 ~ Vcc
0.6
f = 10MHz
f = 1MHz
-
5
10
~ +25°C
0.5
2
~ +40°C
-
1.0
4
~ +70°C
-
-
20
~ +85°C
-
-
40
-
-
2
BC1# and BC2#=V IL , S#=V IL
other pins =V IH or V IL
Output - open (duty 100%)
(1) S# =
> Vcc - 0.2V,
other inputs = 0 ~ Vcc
Stand by s upply current
( AC,TTL lev el )
-0.2 *
2.4
30
5
30
Activ e supply c urrent
Icc 2
( AC,TTL lev el )
Icc 4
Vcc+0.2V
-
f = 10MHz
( AC,MOS lev el )
2.2
BC1# and BC2#=VIH or S#=VIH or OE#=VIH, VI/O=0 ~ Vcc
< 0.2V, S# < 0.2V
BC1# and BC2# =
=
>
other inputs <
= 0.2V or = Vcc-0.2V
Output - open (duty 100%)
Icc 3 Stand by s upply current
(2) BC1# and BC2# =
> Vcc - 0.2V
S# <= 0.2V
other inputs = 0 ~ Vcc
f = 1MHz
BC1# and BC2#=VIH or S#=VIH
Other inputs= 0 ~ Vcc
Note 1: Direction for current flowing into IC is indicated as positive (no mark)
Max
0.4
±1
±1
40
10
40
Icc 1 Activ e supply c urrent
( AC,MOS lev el )
Ty p
Units
V
µA
mA
µA
mA
* -3.0V in case of AC (Pulse width <
= 30ns)
Note 2: Typical parameter indicates the value for the center of distribution at 3.0V, and not 100% tested.
CAPACITANCE
Symbol
CI
CO
Parameter
(Vcc=2.7 ~3.0V, unless otherwise noted)
Conditions
Min
Input capacitance
V I =GND, VI =25mVrms, f =1MHz
Output capacitance
V O = GND,VO =25mVrms, f =1MHz
MITSUBISHI ELECTRIC
Limits
Ty p
Max
10
10
Units
pF
3
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
AC ELECTRICAL CHARACTERISTICS
(1) TEST CONDITIONS
(Vcc=2.7 ~3.0V, unless otherwise noted)
1TTL
2.7~3.0V
Input pulse
V IH=2.4V, V IL=0.4V
Input rise time and f all time 5ns
Supply v oltage
Ref erence lev el
V OH=V OL=1.5V
DQ
CL
Transition is measured ±200mV from
steady state voltage.(for ten,tdis)
Including scope and
jig capacitance
Fig.1,CL=30pF
CL=5pF (for ten,tdis)
Output loads
Fig.1 Output load
(2) READ CYCLE
Limits
Parameter
Symbol
t CR
t a(A)
t a(S)
t a(BC1)
t a(BC2)
t a(OE)
t dis (S)
t dis (BC1)
t dis (BC2)
t dis (OE)
t en(S)
t en(BC1,2)
t en(OE)
t V(A)
85HI
70HI
Read cy cle time
Address access time
Chip select 1 access time
By te control 1 access time
By te control 2 access time
Output enable access time
Output disable time af t er S# high
Output disable time af t er BC1# high
Output disable time af t er BC2# high
Output disable time af t er OE# high
Output enable time af ter S# low
Output enable time af ter BC1#,BC2# low
Output enable time af ter OE# low
Data v alid time after address
Min
70
Max
Min
85
Units
Max
70
70
70
70
35
25
25
25
25
85
85
85
85
45
30
30
30
30
10
5
5
10
10
5
5
10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
*5ns in case of using either BC1# or BC2#
(3) WRITE CYCLE
Limits
Symbol
t CW
t w(W)
t su(A)
t su(A-WH)
t su(BC1)
t su(BC2)
t su(S)
t su(D)
t h(D)
t rec (W)
t dis (W)
t dis (OE)
t en(W)
t en(OE)
70HI
Parameter
Write cy cle time
Write pulse width
Address setup time
Address setup time with respect to W#
By te control 1 setup time
By te control 2 setup time
Chip select setup time
Data setup time
Data hold time
Write recov ery time
Output disable time f rom W# low
Output disable time f rom OE# high
Output enable time f rom W# high
Output enable time f rom OE# low
Min
70
55
0
65
65
65
65
35
0
0
85HI
Max
Min
85
60
0
70
70
70
70
45
0
0
30
30
25
25
5
5
5
5
MITSUBISHI ELECTRIC
Units
Max
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
4
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
(4)TIMING DIAGRAMS
Read cycle
t CR
A 0~18
t v (A)
t a(A)
t a(BC1) or t a(BC2)
BC1#,BC2#
(Note3)
t dis (BC1) or t dis (BC2)
(Note3)
t dis (S)
(Note3)
t dis (OE)
(Note3)
t a(S)
S#
(Note3)
t a (OE)
OE#
(Note3)
t en (OE)
W# = "H" lev el
t en (BC1)
t en (BC2)
t en (S)
DQ 1~16
Write cycle ( W# control mode )
VALID DATA
t CW
A 0~18
t su (BC1) or t su (BC2)
BC1#,BC2#
(Note3)
(Note3)
t su (S)
S#
(Note3)
(Note3)
OE#
t su (A)
t su (A-WH)
t w (W)
t rec (W)
t dis (W)
W#
t en (OE)
t en (W)
t dis (OE)
DQ 1~16
DATA IN
STABLE
t su (D)
t h (D)
MITSUBISHI ELECTRIC
5
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
Write cycle (BC# control mode)
t CW
A 0~18
t su (A)
t su (BC1) or
t su (BC2)
t rec (W)
BC1#,BC2#
S#
(Note3)
(Note3)
(Note5)
W#
(Note4)
(Note3)
(Note3)
t su (D)
DQ 1~16
t h (D)
DATA IN
STABLE
Note 3: Hatching indicates the state is "don't care".
Note 4: A Write occurs during S# low ov erlaps BC1# and/or BC2# low and W# low.
Note 5: When the f alling edge of W# is simultaneously or prior to the f alling edge of BC1# and/or BC2# or the f alling edge of
S#, the outputs are maintained in the high impedance state.
Note 6: Don't apply inv erted phase signal externally when DQ pin is in output mode.
MITSUBISHI ELECTRIC
6
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
Write cycle (S# control mode)
t CW
A 0~18
BC1#, BC2#
(Note3)
t su (A)
t su (S)
t rec (W)
(Note3)
S#
(Note5)
W#
(Note4)
(Note3)
DQ 1~16
t su (D)
t h (D)
(Note3)
DATA IN
STABLE
MITSUBISHI ELECTRIC
7
2001.4.11
Ver. 2.0
MITSUBISHI LSIs
M5M5W816TP-70HI, 85HI
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
POWER DOWN CHARACTERISTICS
(1) ELECTRICAL CHARACTERISTICS
Symbol
Vcc
Parameter
Min
(PD) Power down supply voltage
V I (BC)
Byte control input BC1# & BC2#
V I (S)
Icc
Test conditions
(PD)
Chip select input S#
Power down
supply c urrent
Limits
Ty p
Max
2.0
V
2.0
V
2.0
V
Vcc=2.0V
~ +25°C
1.5
~ +40°C
-
0.1
(1) S# => Vcc - 0.2V,
0.2
3
(2) BC1# and BC2#=> Vcc - 0.2V
~ +70°C
-
-
15
~ +85°C
-
-
30
other inputs = 0 ~ Vcc
S# <
= 0.2V
other inputs = 0 ~ Vcc
Units
µA
Note 2: Typical parameter of Icc(PD) indicates the value for the
center of distribution at 2.0V, and not 100% tested.
(2) TIMING REQUIREMENTS
Symbol
t su (PD)
t rec (PD)
Limits
Parameter
Test conditions
Min
Ty p
0
5
Power down set up time
Power down recov ery t ime
Max
Units
ns
ms
(3) TIMING DIAGRAM
BC# control mode
Vcc
t su (PD)
2.7V
2.7V
t rec (PD)
2.2V
2.2V
BC1#
BC2#
BC1# , BC2# >
= Vcc-0.2V
S# control mode
Vcc
t su (PD)
2.7V
2.7V
t rec (PD)
2.2V
2.2V
S#
S# >
= Vcc-0.2V
MITSUBISHI ELECTRIC
8
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage. Remember to give due
consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
Notes regarding these materials
These materials are intended as a reference to assist our customers in the selection of the
Mitsubishi semiconductor product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric
Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs,
algorithms, or circuit application examples contained in these materials.
All information contained in these materials, including product data, diagrams, charts, programs
and algorithms represents information on products at the time of publication of these materials, and
are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or
an authorized Mitsubishi Semiconductor product distributor for the latest product information before
purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by various
means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com).
When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Mitsubishi
Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from
the information contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a
device or system that is used under circumstances in which human life is potentially at stake. Please
contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or
reproduce in whole or in part these materials.
If these products or technologies are subject to the Japanese export control restrictions, they
must be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for further details on these materials or the products contained therein.
9
MITSUBISHI ELECTRIC