AUIRFB8407 AUIRFS8407 AUIRFSL8407 AUTOMOTIVE GRADE Features HEXFET® Power MOSFET Advanced Process Technology l New Ultra Low On-Resistance l 175°C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free, RoHS Compliant l Automotive Qualified * l D G Description Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and wide variety of other applications. Applications Electric Power Steering (EPS) Battery Switch l Start/Stop Micro Hybrid l Heavy Loads l DC-DC Applications Ordering Information Base part number Package Type S G c ID (Package Limited) 195A D S S G G D S TO-262 AUIRFSL8407 D2Pak AUIRFS8407 G D S Gate Drain Source Standard Pack Form Tube Tube Tube Tape and Reel Left TO-220 TO-262 D2Pak D2Pak D TO-220AB AUIRFB8407 l AUIRFB8407 AUIRFSL8407 AUIRFS8407 AUIRFS8407 40V typ. 1.4mΩ (SMD version) max 1.8mΩ ID (Silicon Limited) 250A D D l VDSS RDS(on) Complete Part Number AUIRFB8407 AUIRFSL8407 AUIRFS8407 AUIRFS8407TRL Quantity 50 50 50 800 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified. Symbol Parameter Max. Units c 250 ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 180 ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Wire Bond Limited) 195 IDM Pulsed Drain Current PD @TC = 25°C Maximum Power Dissipation 230 W Linear Derating Factor 1.5 W/°C V A l d 1000 VGS Gate-to-Source Voltage ± 20 TJ Operating Junction and -55 to + 175 TSTG Storage Temperature Range °C Soldering Temperature, for 10 seconds (1.6mm from case) Avalanche Characteristics e Single Pulse Avalanche Energy EAS (tested) IAR Single Pulse Avalanche Energy Tested Value Avalanche Current EAR Repetitive Avalanche Energy d d x 10lbf in (1.1N m) Mounting torque, 6-32 or M3 screw EAS (Thermally limited) x 300 e 350 500 mJ See Fig. 14, 15, 22a, 22b A mJ HEXFET® is a registered trademark of International Rectifier. *Qualification standards can be found at http://www.irf.com/ 1 www.irf.com © 2013 International Rectifier April 25, 2013 AUIRFB/S/SL8407 Static @ TJ = 25°C (unless otherwise specified) Symbol V(BR)DSS ΔV(BR)DSS /ΔTJ Parameter Min. Typ. Max. Units 40 ––– ––– ––– 2.0 ––– ––– ––– ––– ––– ––– 0.029 1.4 1.6 3.0 ––– ––– ––– ––– 2.2 ––– ––– 1.8 2.0 4.0 1.0 150 100 -100 ––– V V/°C Min. Typ. Max. Units 160 ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– 150 41 51 99 19 70 78 53 7330 1095 745 1310 1735 ––– 225 ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– S nC Max. Units Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient RDS(on) SMD RDS(on) TO-220 VGS(th) IDSS IGSS Static Drain-to-Source On-Resistance Gate Threshold Voltage Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Internal Gate Resistance RG mΩ V μA nA Conditions VGS = 0V, ID = 250μA Reference to 25°C, ID = 1mA VGS = 10V, ID = 100A VGS = 10V, ID = 100A VDS = VGS, ID = 150μA VDS = 40V, VGS = 0V VDS = 40V, VGS = 0V, TJ = 125°C VGS = 20V VGS = -20V d Ω Dynamic @ TJ = 25°C (unless otherwise specified) Symbol gfs Qg Qgs Qgd Qsync td(on) tr td(off) tf Ciss Coss Crss Coss eff. (ER) Coss eff. (TR) Parameter Forward Transconductance Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Total Gate Charge Sync. (Qg - Qgd) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Effective Output Capacitance (Energy Related) Effective Output Capacitance (Time Related) h i Conditions VDS = 10V, ID = 100A ID = 100A VDS =20V VGS = 10V ID = 100A, VDS =20V, VGS = 10V VDD = 20V ID = 30A RG = 2.7Ω VGS = 10V VGS = 0V VDS = 25V ƒ = 1.0 MHz, See Fig. 5 VGS = 0V, VDS = 0V to 32V , See Fig. 11 VGS = 0V, VDS = 0V to 32V g ns pF g i h Diode Characteristics Min. Typ. IS Symbol Continuous Source Current Parameter ––– ––– 250 ISM (Body Diode) Pulsed Source Current ––– ––– 1000 VSD dv/dt trr (Body Diode) Diode Forward Voltage Peak Diode Recovery Reverse Recovery Time Qrr Reverse Recovery Charge d ––– ––– ––– ––– ––– ––– ––– f Reverse Recovery Current IRRM 1.0 3.0 30 30 24 25 1.3 c l 1.3 ––– ––– ––– ––– ––– ––– Conditions A MOSFET symbol A showing the integral reverse V V/ns ns nC A D G p-n junction diode. TJ = 25°C, IS = 100A, VGS = 0V TJ = 175°C, IS = 100A, VDS = 40V TJ = 25°C VR = 34V, TJ = 125°C IF = 100A di/dt = 100A/μs TJ = 25°C g S g g TJ = 125°C TJ = 25°C Thermal Resistance Typ. Max. R θJC R θCS Symbol Junction-to-Case Case-to-Sink, Flat Greased Surface, TO-220 Parameter ––– 0.50 0.65 ––– R θJA R θJA Junction-to-Ambient, TO-220 ––– ––– 62 40 k k Junction-to-Ambient (PCB Mount) , D2Pak 2 www.irf.com © 2013 International Rectifier j Units °C/W April 25, 2013 AUIRFB/S/SL8407 † Qualification Information Automotive (per AEC-Q101) Qualification Level Comments: This part number(s) passed Automotive qualification. IR’s Industrial and Consumer qualification level is granted by extension of the higher Automotive level. Moisture Sensitivity Level MSL1 D2 PAK TO-220 N/A TO-262 ESD †† Machine Model Class M4 (+/- 800V) AEC-Q101-002 Human Body Model Class H2 (+/- 4000V) AEC-Q101-001 Charged Device Model Class C5 (+/- 2000V) AEC-Q101-005 †† †† Yes RoHS Compliant Qualification standards can be found at International Rectifiers web site: http//www.irf.com/ Highest passing voltage Notes: Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 195A by source bonding technology . Note that current limitations arising from heating of the device leads may occur with some lead mounting arrangements. (Refer to AN-1140) Repetitive rating; pulse width limited by max. junction temperature. Limited by TJmax, starting TJ = 25°C, L = 0.069mH RG = 25Ω, IAS = 100A, VGS =10V. ISD ≤ 100A, di/dt ≤ 1166A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. 3 www.irf.com © 2013 International Rectifier Pulse width ≤ 400μs; duty cycle ≤ 2%. Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS . Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. Rθ is measured at TJ approximately 90°C. Pulse drain current is limited by source bonding technology. April 25, 2013 AUIRFB/S/SL8407 1000 1000 100 BOTTOM TOP ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) TOP VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V 10 4.5V BOTTOM 100 4.5V ≤60μs PULSE WIDTH ≤60μs PULSE WIDTH Tj = 25°C 1 1 10 100 0.1 10 100 VDS, Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 2.0 RDS(on) , Drain-to-Source On Resistance (Normalized) ID, Drain-to-Source Current(A) 1 VDS, Drain-to-Source Voltage (V) 1000 TJ = 175°C 100 TJ = 25°C 10 VDS = 10V ≤60μs PULSE WIDTH 3 4 5 6 7 1.4 1.2 1.0 0.8 -60 -40 -20 0 20 40 60 80 100120140160180 Fig 4. Normalized On-Resistance vs. Temperature 14 VGS, Gate-to-Source Voltage (V) VGS = 0V, f = 1 MHZ Ciss = Cgs + Cgd, Cds SHORTED Crss = Cgd Coss = Cds + Cgd Ciss Coss Crss 1000 1.6 TJ , Junction Temperature (°C) Fig 3. Typical Transfer Characteristics 10000 VGS = 10V 1.8 8 VGS, Gate-to-Source Voltage (V) 100000 ID = 100A 0.6 1.0 C, Capacitance (pF) Tj = 175°C 10 0.1 VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V ID= 100A 12 VDS = 32V VDS = 20V 10 8 6 4 2 0 100 0 1 10 100 VDS, Drain-to-Source Voltage (V) Fig 5. Typical Capacitance vs. Drain-to-Source Voltage 4 www.irf.com © 2013 International Rectifier 40 80 120 160 200 QG Total Gate Charge (nC) Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage April 25, 2013 AUIRFB/S/SL8407 1000 ID, Drain-to-Source Current (A) ISD , Reverse Drain Current (A) 1000 TJ = 175°C 100 TJ = 25°C 10 1 100μsec 100 1msec Limited by Package 10 10msec OPERATION IN THIS AREA LIMITED BY R DS(on) 1 VGS = 0V 0.1 0.1 0.0 0.5 1.0 1.5 2.0 0.1 2.5 1 Fig 8. Maximum Safe Operating Area V(BR)DSS, Drain-to-Source Breakdown Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage 250 LIMITED BY PACKAGE ID , Drain Current (A) 200 150 100 50 0 25 50 75 100 125 150 175 50 Id = 1.0mA 48 46 44 42 40 -60 -40 -20 0 20 40 60 80 100120140160180 TC , Case Temperature (°C) Fig 9. Maximum Drain Current vs. Case Temperature TJ , Temperature ( °C ) Fig 10. Drain-to-Source Breakdown Voltage EAS , Single Pulse Avalanche Energy (mJ) 1.2 1.0 Energy (μJ) 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40 50 VDS, Drain-to-Source Voltage (V) Fig 11. Typical COSS Stored Energy www.irf.com 10 VDS , Drain-toSource Voltage (V) VSD , Source-to-Drain Voltage (V) 5 DC Tc = 25°C Tj = 175°C Single Pulse © 2013 International Rectifier 1400 ID 22A 46A BOTTOM 100A 1200 TOP 1000 800 600 400 200 0 25 50 75 100 125 150 175 Starting TJ , Junction Temperature (°C) Fig 12. Maximum Avalanche Energy vs. DrainCurrent April 25, 2013 AUIRFB/S/SL8407 1 Thermal Response ( ZthJC ) D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01 0.01 0.001 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.0001 1E-006 1E-005 0.0001 0.001 0.01 0.1 t1 , Rectangular Pulse Duration (sec) Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case Avalanche Current (A) 1000 Allowed avalanche Current vs avalanche pulsewidth, tav, assuming ΔTj = 150°C and Tstart =25°C (Single Pulse) 100 10 Allowed avalanche Current vs avalanche pulsewidth, tav, assuming ΔΤ j = 25°C and Tstart = 150°C. (Single Pulse) 1 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 tav (sec) Fig 14. Typical Avalanche Current vs.Pulsewidth Notes on Repetitive Avalanche Curves , Figures 14, 15: (For further info, see AN-1005 at www.irf.com) 1. Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 24a, 24b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. ΔT = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 14, 15). tav = Average time in avalanche. D = Duty cycle in avalanche = tav ·f ZthJC(D, tav ) = Transient thermal resistance, see Figures 13) EAR , Avalanche Energy (mJ) 350 TOP Single Pulse BOTTOM 1% Duty Cycle ID = 100A 300 250 200 150 100 50 0 25 50 75 100 125 150 175 Starting TJ , Junction Temperature (°C) PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC Iav = 2DT/ [1.3·BV·Zth] EAS (AR) = PD (ave)·tav Fig 15. Maximum Avalanche Energy vs. Temperature 6 www.irf.com © 2013 International Rectifier April 25, 2013 ( Ω) RDS (on), Drain-to -Source On Resistance m AUIRFB/S/SL8407 6 4.5 VGS(th), Gate threshold Voltage (V) ID = 100A 5 4 TJ = 125°C 3 2 TJ = 25°C 1 4.0 3.5 3.0 ID = 150μA ID = 1.0mA ID = 1.0A 2.5 2.0 1.5 0 4.0 6.0 8.0 10.0 1.0 -75 -50 -25 VGS, Gate-to-Source Voltage (V) 0 25 50 75 100 125 150 175 TJ , Temperature ( °C ) Fig 16. Typical On-Resistance vs. Gate Voltage Fig 17. Threshold Voltage vs. Temperature 140 10 120 IF = 60A VR = 34V TJ = 25°C TJ = 125°C 100 TJ = 25°C TJ = 125°C 6 QRR (A) IRR (A) 8 IF = 60A VR = 34V 4 80 60 40 2 20 0 0 0 200 400 600 800 0 1000 200 600 800 1000 Fig. 19 - Typical Stored Charge vs. dif/dt Fig. 18 - Typical Recovery Current vs. dif/dt 140 10 8 IF = 100A VR = 34V 120 IF = 100A VR = 34V TJ = 25°C TJ = 125°C 100 TJ = 25°C TJ = 125°C 6 QRR (A) IRR (A) 400 diF /dt (A/μs) diF /dt (A/μs) 4 80 60 40 2 20 0 0 0 200 400 600 800 1000 diF /dt (A/μs) 7 Fig. 20 - Typical Recovery Current vs. dif/dt www.irf.com © 2013 International Rectifier 0 200 400 600 800 1000 diF /dt (A/μs) Fig. 21 - Typical Stored Charge vs. dif/dt April 25, 2013 RDS (on) , Drain-to-Source On Resistance (mΩ) AUIRFB/S/SL8407 8 VGS = 5.5V 7 VGS = 6.0V 6 5 VGS = 7.0V VGS = 8.0V VGS = 10V 4 3 2 1 0 100 200 300 400 500 ID , Drain Current (A) Fig 22. Typical On-Resistance vs. Drain Current 8 www.irf.com © 2013 International Rectifier April 25, 2013 AUIRFB/S/SL8407 Driver Gate Drive D.U.T + - - * D.U.T. ISD Waveform Reverse Recovery Current + RG • • • • dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test VDD P.W. Period VGS=10V Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer - D= Period P.W. + + - Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage Body Diode VDD Forward Drop Inductor Current Inductor Curent ISD Ripple ≤ 5% * VGS = 5V for Logic Level Devices Fig 23. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs V(BR)DSS 15V DRIVER L VDS tp D.U.T RG 20V VGS + V - DD IAS A 0.01Ω tp I AS Fig 24a. Unclamped Inductive Test Circuit RD VDS Fig 24b. Unclamped Inductive Waveforms VDS 90% VGS D.U.T. RG + - VDD V10V GS 10% VGS Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % td(on) Fig 25a. Switching Time Test Circuit tr t d(off) Fig 25b. Switching Time Waveforms Id Current Regulator Same Type as D.U.T. Vds Vgs 50KΩ 12V tf .2μF .3μF D.U.T. + V - DS Vgs(th) VGS 3mA IG ID Current Sampling Resistors Fig 26a. Gate Charge Test Circuit 9 www.irf.com © 2013 International Rectifier Qgs1 Qgs2 Qgd Qgodr Fig 26b. Gate Charge Waveform April 25, 2013 AUIRFB/S/SL8407 TO-220AB Package Outline Dimensions are shown in millimeters (inches) TO-220AB Part Marking Information Part Number AUIRFB8407 YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code TO-220AB packages are not recommended for Surface Mount Application. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10 www.irf.com © 2013 International Rectifier April 25, 2013 AUIRFB/S/SL8407 TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information Part Number AUIRFSL8407 YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 11 www.irf.com © 2013 International Rectifier April 25, 2013 AUIRFB/S/SL8407 D2Pak (TO-263AB) Package Outline Dimensions are shown in millimeters (inches) D2Pak (TO-263AB) Part Marking Information Part Number AUIRFS8407 YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, Lead Free XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 12 www.irf.com © 2013 International Rectifier April 25, 2013 AUIRFB/S/SL8407 D2Pak (TO-263AB) Tape & Reel Information Dimensions are shown in millimeters (inches) TRR 1.60 (.063) 1.50 (.059) 4.10 (.161) 3.90 (.153) FEED DIRECTION 1.85 (.073) 1.65 (.065) 1.60 (.063) 1.50 (.059) 11.60 (.457) 11.40 (.449) 0.368 (.0145) 0.342 (.0135) 15.42 (.609) 15.22 (.601) 24.30 (.957) 23.90 (.941) TRL 10.90 (.429) 10.70 (.421) 1.75 (.069) 1.25 (.049) 4.72 (.136) 4.52 (.178) 16.10 (.634) 15.90 (.626) FEED DIRECTION 13.50 (.532) 12.80 (.504) 27.40 (1.079) 23.90 (.941) 4 330.00 (14.173) MAX. NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ HUB. 4. INCLUDES FLANGE DISTORTION @ OUTER EDGE. 60.00 (2.362) MIN. 26.40 (1.039) 24.40 (.961) 3 30.40 (1.197) MAX. 4 Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/ 13 www.irf.com © 2013 International Rectifier April 25, 2013 AUIRFB/S/SL8407 IMPORTANT NOTICE Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and process change notification. 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