CMS11 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS11 Switching Mode Power Supply Applications Portable Equipment Battery Applications · · · · Unit: mm Forward voltage: VFM = 0.55 V (max) Average forward current: IF (AV) = 2.0 A Repetitive peak reverse voltage: VRRM = 40 V Suitable for compact assembly due to small surface-mount package “M−FLATTM” (Toshiba package name) Maximum Ratings (Ta = 25°C) Characteristics Repetitive peak reverse voltage Symbol Rating Unit VRRM 40 V IF (AV) Note Average forward current IF (AV) Peak one cycle surge forward current (non-repetitive) 2.0 (Ta = 34°C) 2.0 A (Tℓ = 119°C) IFSM 30 (50 Hz) A Junction temperature Tj -40~150 °C Storage temperature Tstg -40~150 °C Note: Device mounted on a ceramic board (board size: 50 mm ´ 50 mm, soldering land: 2 mm ´ 2 mm) 1 JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2003-02-17 CMS11 Electrical Characteristics (Ta = 25°C) Characteristics Symbol Peak forward voltage Repetitive peak reverse current Typ. Max IFM = 0.5 A ¾ 0.38 ¾ VFM (2) IFM = 1.0 A ¾ 0.42 ¾ VFM (3) IFM = 2.0 A ¾ 0.49 0.55 Cj Rth (j-a) Thermal resistance Min VFM (1) IRRM Junction capacitance Test Condition VRRM = 5.0 V ¾ 2.0 ¾ VRRM = 40 V ¾ 20.0 500 VR = 10 V, f = 1.0 MHz ¾ 95 ¾ Device mounted on a ceramic board (soldering land: 2 mm ´ 2 mm) ¾ ¾ 60 Device mounted on a glass-epoxy board (soldering land: 6 mm ´ 6 mm) ¾ ¾ 135 ¾ ¾ 16 ¾ Rth (j-ℓ) Marking Unit V mA pF °C/W Following Indicates the Data of Manufacture Type code Lot No. SA Cathode mark Month of manufacture January to December are denoted by letter A to L respectively. Year of manufacture Last decimal digit of the year of manufacture 0 1 2 3 4 5 6 7 8 9 Standard Soldering Pad 2.1 Unit: mm 1.4 3.0 1.4 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2 2003-02-17 CMS11 iF – vF PF (AV) – IF (AV) 100 1.6 Instantaneous forward current iF Average forward power dissipation PF (AV) (W) (A) DC 10 Tj = 150°C 125°C 75°C 1 25°C 0.1 0 0.2 0.4 0.6 0.8 1.0 Instantaneous forward voltage 1.2 1.4 vF (V) 1.4 a = 180° 1.2 a = 120° 1.0 a = 60° 0.8 Rectangular waveform 0.6 0.4 0° a 0.2 0.0 0.0 1.6 0.4 0.8 100 360° Conduction angle: a VR = 20 V a = 180° a = 120° 80 60 40 a = 60° 20 0.4 0.8 1.2 1.6 Average forward current 2.0 2.4 IF (AV) 2.8 2.4 IF (AV) 2.8 3.2 (A) 3.2 140 DC 120 a = 120° 100 a = 180° a = 60° 80 Rectangular waveform 60 40 0° a 360° IF(AV) 20 Conduction angle: a VR = 20 V 0 0 0.4 0.8 1.2 (A) 1.6 2.0 Average forward current 2.4 IF (AV) 2.8 3.2 (A) (°C/W) rth (j-a) – t rth (j-a) 0 0 Maximum allowable lead temperature Tℓ max (°C) 0° a 2.0 Tℓ max – IF (AV) IF(AV) 120 Transient thermal impedance Maximum allowable ambient temperature Tℓ max (°C) DC 1.6 160 Rectangular waveform 140 1.2 Average forward current Ta max – IF (AV) Device mounted on a ceramic board (board size: 50 mm ´ 50 mm) 160 360° Conduction angle: a 1000 Device mounted on a glass-epoxy board Soldering land: 2.1 mm ´ 1.4 mm 100 Device mounted on a glass-epoxy board Soldering land: 6.0 mm ´ 6.0 mm 10 Device mounted on a ceramic board Soldering land: 2.0 mm ´ 2.0 mm 1 0.001 0.01 0.1 1 10 100 1000 Time t (s) 3 2003-02-17 CMS11 I R – Tj Surge forward current (non-repetitive) f = 1 MHz f = 50 Hz Ta = 25°C 30 Cj 40 (pF) Ta = 25°C Junction capacitance (A) Peak surge forward current IFSM (typ.) 1000 50 20 10 0 1 10 100 100 10 1 Number of cycles 10 100 Reverse voltage VR I R – Tj (typ.) PR (AV) – VR 100 (mA) 10 Average reverse power dissipation PR (AV) (W) Repetitive peak reverse current IR (typ.) 1.6 Pulse test VR = 40 V 1 0.1 VR = 30 V VR = 20 V 0.01 VR = 10 V VR = 5 V 0.001 (V) 0 20 40 60 80 100 Junction temperature Tj 120 140 0° (°C) 360° 1.2 1.0 0.8 DC VR a 300° Conduction angle: a Tj = 150°C 240° 180° 0.6 120° 0.4 0.2 0.0 0 160 Rectangular waveform 1.4 a = 60° 10 20 Reverse voltage VR 4 30 40 (V) 2003-02-17 CMS11 RESTRICTIONS ON PRODUCT USE 000707EAA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 5 2003-02-17