TOSHIBA CMS11

CMS11
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS11
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
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Unit: mm
Forward voltage: VFM = 0.55 V (max)
Average forward current: IF (AV) = 2.0 A
Repetitive peak reverse voltage: VRRM = 40 V
Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Symbol
Rating
Unit
VRRM
40
V
IF (AV)
Note
Average forward current
IF (AV)
Peak one cycle surge forward current
(non-repetitive)
2.0
(Ta = 34°C)
2.0
A
(Tℓ = 119°C)
IFSM
30 (50 Hz)
A
Junction temperature
Tj
-40~150
°C
Storage temperature
Tstg
-40~150
°C
Note: Device mounted on a ceramic board
(board size: 50 mm ´ 50 mm, soldering land: 2 mm ´ 2 mm)
1
JEDEC
―
JEITA
―
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
2003-02-17
CMS11
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Peak forward voltage
Repetitive peak reverse current
Typ.
Max
IFM = 0.5 A
¾
0.38
¾
VFM (2)
IFM = 1.0 A
¾
0.42
¾
VFM (3)
IFM = 2.0 A
¾
0.49
0.55
Cj
Rth (j-a)
Thermal resistance
Min
VFM (1)
IRRM
Junction capacitance
Test Condition
VRRM = 5.0 V
¾
2.0
¾
VRRM = 40 V
¾
20.0
500
VR = 10 V, f = 1.0 MHz
¾
95
¾
Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)
¾
¾
60
Device mounted on a glass-epoxy
board
(soldering land: 6 mm ´ 6 mm)
¾
¾
135
¾
¾
16
¾
Rth (j-ℓ)
Marking
Unit
V
mA
pF
°C/W
Following Indicates the Data
of Manufacture
Type code
Lot No.
SA
Cathode mark
Month of
manufacture
January to December
are denoted by letter A
to L respectively.
Year of
manufacture
Last decimal digit of
the year of
manufacture
0
1
2
3
4
5
6
7
8
9
Standard Soldering Pad
2.1
Unit: mm
1.4
3.0
1.4
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier
products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
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CMS11
iF – vF
PF (AV) – IF (AV)
100
1.6
Instantaneous forward current
iF
Average forward power dissipation
PF (AV) (W)
(A)
DC
10
Tj = 150°C
125°C
75°C
1
25°C
0.1
0
0.2
0.4
0.6
0.8
1.0
Instantaneous forward voltage
1.2
1.4
vF
(V)
1.4
a = 180°
1.2
a = 120°
1.0
a = 60°
0.8
Rectangular
waveform
0.6
0.4
0° a
0.2
0.0
0.0
1.6
0.4
0.8
100
360°
Conduction angle: a
VR = 20 V
a = 180°
a = 120°
80
60
40
a = 60°
20
0.4
0.8
1.2
1.6
Average forward current
2.0
2.4
IF (AV)
2.8
2.4
IF (AV)
2.8
3.2
(A)
3.2
140
DC
120
a = 120°
100
a = 180°
a = 60°
80
Rectangular
waveform
60
40
0° a
360°
IF(AV)
20 Conduction
angle: a
VR = 20 V
0
0
0.4
0.8
1.2
(A)
1.6
2.0
Average forward current
2.4
IF (AV)
2.8
3.2
(A)
(°C/W)
rth (j-a) – t
rth (j-a)
0
0
Maximum allowable lead temperature
Tℓ max (°C)
0° a
2.0
Tℓ max – IF (AV)
IF(AV)
120
Transient thermal impedance
Maximum allowable ambient temperature
Tℓ max (°C)
DC
1.6
160
Rectangular waveform
140
1.2
Average forward current
Ta max – IF (AV)
Device mounted on a ceramic board
(board size: 50 mm ´ 50 mm)
160
360°
Conduction angle: a
1000
Device mounted on a glass-epoxy board
Soldering land: 2.1 mm ´ 1.4 mm
100
Device mounted on a glass-epoxy board
Soldering land: 6.0 mm ´ 6.0 mm
10
Device mounted on a ceramic board
Soldering land: 2.0 mm ´ 2.0 mm
1
0.001
0.01
0.1
1
10
100
1000
Time t (s)
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2003-02-17
CMS11
I R – Tj
Surge forward current (non-repetitive)
f = 1 MHz
f = 50 Hz
Ta = 25°C
30
Cj
40
(pF)
Ta = 25°C
Junction capacitance
(A)
Peak surge forward current IFSM
(typ.)
1000
50
20
10
0
1
10
100
100
10
1
Number of cycles
10
100
Reverse voltage VR
I R – Tj
(typ.)
PR (AV) – VR
100
(mA)
10
Average reverse power dissipation
PR (AV) (W)
Repetitive peak reverse current IR
(typ.)
1.6
Pulse test
VR = 40 V
1
0.1
VR = 30 V
VR = 20 V
0.01
VR = 10 V
VR = 5 V
0.001
(V)
0
20
40
60
80
100
Junction temperature Tj
120
140
0°
(°C)
360°
1.2
1.0
0.8
DC
VR
a
300°
Conduction angle: a
Tj = 150°C
240°
180°
0.6
120°
0.4
0.2
0.0
0
160
Rectangular
waveform
1.4
a = 60°
10
20
Reverse voltage VR
4
30
40
(V)
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CMS11
RESTRICTIONS ON PRODUCT USE
000707EAA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
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